JP2010021473A5 - - Google Patents
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- Publication number
- JP2010021473A5 JP2010021473A5 JP2008182750A JP2008182750A JP2010021473A5 JP 2010021473 A5 JP2010021473 A5 JP 2010021473A5 JP 2008182750 A JP2008182750 A JP 2008182750A JP 2008182750 A JP2008182750 A JP 2008182750A JP 2010021473 A5 JP2010021473 A5 JP 2010021473A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating member
- wiring layer
- forming
- forming step
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008182750A JP5295669B2 (ja) | 2008-07-14 | 2008-07-14 | 配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008182750A JP5295669B2 (ja) | 2008-07-14 | 2008-07-14 | 配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010021473A JP2010021473A (ja) | 2010-01-28 |
| JP2010021473A5 true JP2010021473A5 (https=) | 2011-07-21 |
| JP5295669B2 JP5295669B2 (ja) | 2013-09-18 |
Family
ID=41706045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008182750A Active JP5295669B2 (ja) | 2008-07-14 | 2008-07-14 | 配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5295669B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011253911A (ja) * | 2010-06-01 | 2011-12-15 | Shinko Electric Ind Co Ltd | 配線基板 |
| JP2013081327A (ja) * | 2011-10-05 | 2013-05-02 | Jtekt Corp | 電動機用のステータおよびステータの製造方法 |
| US9606430B2 (en) * | 2014-08-28 | 2017-03-28 | Xerox Corporation | Method of aerosol printing a solder mask ink composition |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3587884B2 (ja) * | 1994-07-21 | 2004-11-10 | 富士通株式会社 | 多層回路基板の製造方法 |
| JP3852387B2 (ja) * | 2002-08-30 | 2006-11-29 | 東陶機器株式会社 | 複合構造物の形成方法 |
| JP2005183792A (ja) * | 2003-12-22 | 2005-07-07 | Mitsubishi Gas Chem Co Inc | フリップチップ搭載用プリント配線板の製造方法 |
| JP2006257501A (ja) * | 2005-03-17 | 2006-09-28 | Hitachi Cable Ltd | 誘電体薄膜の製造方法 |
| JP2006289683A (ja) * | 2005-04-07 | 2006-10-26 | Toto Ltd | 複合構造物及び複合構造物の製造方法 |
| JP2006326523A (ja) * | 2005-05-27 | 2006-12-07 | Canon Inc | 成膜方法、該成膜方法により形成された圧電膜、および該圧電膜を備えた圧電素子、ならびに該圧電素子を用いたインクジェット装置 |
-
2008
- 2008-07-14 JP JP2008182750A patent/JP5295669B2/ja active Active
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