JP2009509813A - 機能要素を含む物品のインモールド製造方法 - Google Patents
機能要素を含む物品のインモールド製造方法 Download PDFInfo
- Publication number
- JP2009509813A JP2009509813A JP2008533531A JP2008533531A JP2009509813A JP 2009509813 A JP2009509813 A JP 2009509813A JP 2008533531 A JP2008533531 A JP 2008533531A JP 2008533531 A JP2008533531 A JP 2008533531A JP 2009509813 A JP2009509813 A JP 2009509813A
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- JP
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- Prior art keywords
- mold
- article
- foil
- layer
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Images
Classifications
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- H—ELECTRICITY
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- H—ELECTRICITY
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Abstract
Description
本発明の第一の要旨は、頂部表面に埋設されている少なくとも一つの機能要素を有する物品を対象とする。この物品はまた、装飾デザイン(例えば、文字またはグラフィックス)、ディスプレイパネル、またはその双方を物品上に有してよい。
本願全体を通して用いられる「機能要素」の用語は、ある機能を実施することのできるいかなる電気的または機械的要素をも広く包含する。そのような機能要素の例には、非限定的な例として、光学部材、光学デバイス、ウエーブガイド、導体または半導体電気配線のような電子デザイン、集積回路、プリント電気回路、トランジスター、ダイオード、抵抗器、誘電子、コンデンサー、アンテナ、RFID応答装置(transponder)、バッテリー、太陽電池、発光ダイオード(LED)、およびLEDに限られない他のダイオードなどのような電子部材、有機発光ダイオード(OLED)、ディスプレイ部材、バックライト部材、スピーカー、マイクロホン、押しボタン、タッチパネル、タッチパッド、コネクタなどが含まれる。
一つの処方では、機能要素を含んで成るインモールド転写フィルムまたはホイルを最初に作成する。
図2bはインモールド挿入フィルムまたはホイルの模式的断面図である。この場合、担体層(21a)は、スタンピング、ラミネーション、または成形工程の後に、最終物品の一部となる。機能要素(24)を担体フィルム(21a)(必要に応じて接着剤層(図には示されていない)を有する)に適用することができ、そして、機能要素の反対側でホットメルトまたは熱活性化接着剤(25)によってラミネートされ得る。機能要素はそれ自体で担体フィルムに接着することもあるから、担体フィルムに適用される接着剤層は常に必要とされるわけではない。
典型的なインモールド転写方法を図3aに示す。成形方法においては、インモールド転写フィルムまたはホイルを、ロールまたはウエブで連続的に成形機に供給する。型(30)は物品(36b)用の射出成形用型または圧縮成形用型であってよい。成形プロセス中は、型は閉じられ、物品形成のための溶融プラスチックが射出ノズルおよび湯道を通して型の空洞(36a)に注入される。成形が終わると、機能要素と、存在する場合には耐久層とが成形される物品上に転写されている。成形される物品を型から外す。担体層(31)と剥離層(32)とが同時に外れ、存在する場合には耐久層(33)が物品表面の最外層として残り、機能要素(34)を物品の一体の部分として下に埋設している。層(35)は接着剤層である。
使用に当たっては、機能要素をユーザーが眺めることができたり、あるいはできなかったりするような具合に物品は保持される。
文字および/またはグラフィックデザインもまた物品の表面に表示することができる。最も一般的なデザインにはブランド名、ロゴもしくはシンボル、または他の装飾デザインが含まれる。
物品上にディスプレイパネルが表れていることもある。本発明はあらゆるタイプのディスプレイパネルをカバーしているが、プラスチックベースのディスプレイパネル、例えばポリマー分散型液晶ディスプレイ(PDLC)、コレステリック液晶ディスプレイ(ChLCD)、有機発光デバイス(OLED)、電気泳動ディスプレイ(EPD)、プラスチックベースLCD、または他の粒子ベースのディスプレイを用いるのが有利である。
Claims (27)
- 頂部表面に埋設されている機能要素を有する物品。
- 成形、スタンピング、ラミネーションまたはそれらの組み合わせによって形成されるものである請求項1に記載の物品。
- 前記成形が射出成形、圧縮成形、熱成形またはブロー成形である請求項2に記載の物品。
- 熱可塑性材料、熱可塑性エラストマー、熱硬化性材料、およびそれらのブレンド、プリプレグまたは複合材料からなる群から選ばれる材料から形成されるものである請求項1に記載の物品。
- 前記機能要素が光学部材、光学デバイス、ウエーブガイド、電子デザイン、電子部材、ディスプレイ部材、バックライト部材、スピーカー、マイクロホン、押しボタン、タッチパネル、タッチパッドまたはコネクタである請求項1に記載の物品。
- 前記電子デザインが導体または半導体電気配線である請求項5に記載の物品。
- 前記電子部材が集積回路、プリント電気回路、トランジスター、ダイオード、抵抗器、誘電子、コンデンサー、アンテナ、RFID応答装置、バッテリー、太陽電池、発光ダイオードまたは有機発光ダイオードである請求項5に記載の物品。
- 装飾デザイン、ディスプレイパネルまたはその双方を更に含んで成る請求項1に記載の物品。
- 前記機能要素および前記装飾デザインが重なり合い、部分的に重なり合いまたは重なり合わないものである請求項8に記載の物品。
- 前記装飾デザインまたはディスプレイパネルが成形後に適用される請求項8に記載の物品。
- 前記装飾デザインまたはディスプレイパネルがインモールド法で適用される請求項8に記載の物品。
- 一時的な担体フィルム、剥離層、機能要素、接着剤層またはタイレイヤー、および必要に応じて耐久層を含んで成るインモールドディスプレイ転写フィルムまたはホイル。
- 前記一時的な担体層がPET,PENまたはPCの薄層フィルムである、請求項12に記載のインモールドディスプレイ転写フィルムまたはホイル。
- 前記剥離層がワックス、パラフィンもしくはシリコーン、または放射線硬化可能な多官能性アクリレート、シリコーンアクリレート、エポキシド、ビニルエステル、ビニルエーテル、アリルもしくはビニル不飽和ポリエステル、またはそれらのブレンドから製造される高度に平坦且つ非透過性被覆である請求項12に記載のインモールドディスプレイ転写フィルムまたはホイル。
- 前記剥離層が、エポキシ、ポリウレタン、ポリイミド、ポリアミド、メラミンホルムアルデヒド、尿素ホルムアルデヒド、およびフェノールホルムアルデヒドからなる群から選ばれる縮合ポリマー、コポリマー、そのブレンドまたは複合体を含んで成る請求項12に記載のインモールドディスプレイ転写フィルムまたはホイル。
- 前記必要に応じて存在する耐久層が放射線硬化可能な多官能性アクリレート、エポキシド、ビニルエステル、ジアリルフタレート、ビニルエーテルまたはそれらのブレンドから形成されるものである請求項12に記載のインモールドディスプレイ転写フィルムまたはホイル。
- 前記必要に応じて存在する耐久層が縮合ポリマーまたはコポリマーを含んで成る請求項12に記載のインモールドディスプレイ転写フィルムまたはホイル。
- 前記縮合ポリマーまたはコポリマーがエポキシ、ポリウレタン、ポリアミド、ポリイミド、メラミンホルムアルデヒド、尿素ホルムアルデヒド、及びフェノールホルムアルデヒドからなる群から選ばれるものである請求項17記載のインモールドディスプレイ転写フィルムまたはホイル。
- 前記必要に応じて存在する耐久層がゾル−ゲル法シリケートまたはチタン酸エステルを含んで成る請求項12に記載のインモールドディスプレイ転写フィルムまたはホイル。
- 前記放射線硬化可能な多官能性アクリレートが、エポキシアクリレート、ポリウレタンアクリレート、ポリエステルアクリレート、シリコーンアクリレートまたはグリシジルアクリレートである請求項16に記載のインモールドディスプレイ転写フィルムまたはホイル。
- 前記接着剤層がポリアクリレート、ポリメタクリレート、ポリスチレン、ポリカーボネート、ポリウレタン、ポリエステル、ポリアミド、エポキシ樹脂、エチレン酢酸ビニルコポリマー、熱可塑性エラストマー、これらのコポリマー、これらのブレンドまたはこれらの複合体から形成される請求項12に記載のインモールドディスプレイ転写フィルムまたはホイル。
- 前記接着剤層がホットメルトまたは熱活性化接着剤である請求項12に記載のインモールドディスプレイ転写フィルムまたはホイル。
- ロールの形状にある請求項12に記載のインモールドディスプレイ転写フィルムまたはホイル。
- 担体層、機能要素、および接着剤層を含んで成るインモールドディスプレイ挿入フィルムまたはホイル。
- ロールの形状にある請求項24に記載のインモールドディスプレイ挿入フィルムまたはホイル。
- 頂部表面に埋設されている機能要素を有する物品の製造方法であって、
a)一時的な担体層、剥離層、機能要素、接着剤層、および必要に応じて存在する耐久層を有して成るインモールドディスプレイ転写フィルムまたはホイルを形成し、
b)前記インモールドディスプレイ転写フィルムまたはホイルを、一時的な担体フィルムが型の内側表面に接触するように型へ供給し、
c)前記物品を形成するためにプラスチック材料を型内に射出するか、または前記型内でプラスチック材料を熱成形、ブロー成形、または圧縮成形することにより前記物品を形成し、
d)形成される物品を型から取り出し、そして
e)一時的な担体層および剥離層の双方を同時に剥がすこと、
を含んで成る製造方法。 - 頂部表面に埋設されている機能要素を有する物品の製造方法であって、
a)担体層、機能要素、および接着剤層を含んで成るインモールドディスプレイ挿入フィルムまたはホイルを形成し;
b)前記インモールドディスプレイ挿入フィルムまたはホイルを、担体フィルムが型の内側表面に接触するように型へ供給し、
c)前記物品を形成するためにプラスチック材料を型内に射出するか、または前記型内でプラスチック材料を熱成形、ブロー成形、または圧縮成形することにより前記物品を形成し、そして、
d)形成される物品を型から取り出すこと、
を含んで成る製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72186105P | 2005-09-28 | 2005-09-28 | |
US11/513,333 US20070069418A1 (en) | 2005-09-28 | 2006-08-29 | In mold manufacturing of an object comprising a functional element |
PCT/US2006/037531 WO2007038536A2 (en) | 2005-09-28 | 2006-09-25 | In mold manufacturing of an object comprising a functional element |
Publications (1)
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JP2009509813A true JP2009509813A (ja) | 2009-03-12 |
Family
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Family Applications (1)
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JP2008533531A Pending JP2009509813A (ja) | 2005-09-28 | 2006-09-25 | 機能要素を含む物品のインモールド製造方法 |
Country Status (5)
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---|---|
US (1) | US20070069418A1 (ja) |
EP (1) | EP1928639A2 (ja) |
JP (1) | JP2009509813A (ja) |
KR (1) | KR20080048051A (ja) |
WO (1) | WO2007038536A2 (ja) |
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2006
- 2006-08-29 US US11/513,333 patent/US20070069418A1/en not_active Abandoned
- 2006-09-25 EP EP06825138A patent/EP1928639A2/en not_active Withdrawn
- 2006-09-25 WO PCT/US2006/037531 patent/WO2007038536A2/en active Application Filing
- 2006-09-25 JP JP2008533531A patent/JP2009509813A/ja active Pending
- 2006-09-25 KR KR1020087007732A patent/KR20080048051A/ko not_active Application Discontinuation
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011115403A2 (ko) * | 2010-03-15 | 2011-09-22 | (주)탑나노시스 | 터치센서 조립체 및 그 제조방법 |
WO2011115403A3 (ko) * | 2010-03-15 | 2011-12-29 | (주)탑나노시스 | 터치센서 조립체 및 그 제조방법 |
KR101410767B1 (ko) * | 2014-04-07 | 2014-06-24 | 주식회사 다이나트론 | 파이버 필름을 이용한 안테나가 내장된 플라스틱 구조체 제조방법 |
JP2017076215A (ja) * | 2015-10-14 | 2017-04-20 | アルプス電気株式会社 | 入力装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2007038536A2 (en) | 2007-04-05 |
KR20080048051A (ko) | 2008-05-30 |
US20070069418A1 (en) | 2007-03-29 |
WO2007038536A3 (en) | 2007-12-27 |
EP1928639A2 (en) | 2008-06-11 |
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