JP2009501442A - MEMS package using flexible substrate and method thereof - Google Patents

MEMS package using flexible substrate and method thereof Download PDF

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JP2009501442A
JP2009501442A JP2008520981A JP2008520981A JP2009501442A JP 2009501442 A JP2009501442 A JP 2009501442A JP 2008520981 A JP2008520981 A JP 2008520981A JP 2008520981 A JP2008520981 A JP 2008520981A JP 2009501442 A JP2009501442 A JP 2009501442A
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metal
flexible substrate
package
mems device
layer
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JP4853975B2 (en
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ユーボ ミャオ,
ジェー ワン,
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シリコン マトリックス ピーティーイー. エルティーディーSilicon Matrix Pte. Ltd.
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Priority to US11/182,254 priority patent/US7202552B2/en
Application filed by シリコン マトリックス ピーティーイー. エルティーディーSilicon Matrix Pte. Ltd. filed Critical シリコン マトリックス ピーティーイー. エルティーディーSilicon Matrix Pte. Ltd.
Priority to PCT/IB2006/001966 priority patent/WO2007010361A2/en
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    • HELECTRICITY
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023Packaging together an electronic processing unit die and a micromechanical structure die
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261Processes for packaging MEMS devices
    • B81C1/00309Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
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Abstract

  A MEMS package and a method for forming the same will be described. The MEMS package has at least one MEMS device disposed on a flexible substrate. The metal structure surrounds at least one MEMS device, the bottom surface of the metal structure is attached to a flexible substrate, and a portion of the flexible substrate is folded over the top surface of the metal structure and attached to the top surface of the metal structure. Thereby, the MEMS package is configured.

Description

Background of the Invention

(1) Field of the Invention The present invention relates to a process for packaging a MEMS device, a MEMS package manufactured using the method, and more particularly, packaging a MEMS device using a flexible and foldable substrate. It relates to the method.

(2) Description of Prior Art Microelectromechanical system (MEMS) devices are known for converting physical phenomena such as pressure, acceleration, sound, or light into electrical signals. Various MEMS devices interact with the outside world in different ways and require custom or at least semi-custom packaging solutions. So-called system-in-package technology seeks to construct an entire micro-system that can include a microprocessor, communication components, actuators and sensors in a single package. However, packaging MEMS devices is quite different from packaging integrated circuits. MEMS devices are distinctly different from ICs in spite of sharing some basic processing technology. Packaging is the biggest challenge for the commercialization of most MEMS devices. The term “MEMS package” is used herein to mean a package that includes at least one MEMS device.

  The MEMS device could function perfectly well within the configured control environment. However, this device can only be a viable product after packaging with proven performance in the package. For example, packaging stress can distort the sensitivity and performance of a MEMS device. MEMS devices have delicate movable structures that are easily damaged during the manufacturing and assembly process. Therefore, adapting to the assembly yield of MEMS devices is often a difficult goal.

  Because MEMS devices interact with physical phenomena and need to be protected from the surrounding environment, their packaging requirements are complex. Therefore, the MEMS device uses a peculiar packaging structure using a special assembly technique and a specific packaging material. Packaging typically accounts for at least 60% and sometimes as much as 85% of the cost of MEMS devices. Therefore, it has been considered that low cost solutions using robust assemblies are needed to facilitate the use of MEMS devices.

  Various packages are known for packaging various MEMS products. C. T.A. Hsieh et al. "Introduction of MEMS packaging technology", Processeds of the 4th International Symposium on Electronic Materials and Packaging, 4-6 December 2002, pages 300-306 (eg see FIG. 3). Round) headers, and various metal packages such as butterfly and platform packages are described. The metal package provides good heat dissipation performance and electromagnetic shielding. The TO8 header is typically manufactured from Kovar alloy and reduces thermal mismatch between the packaging material and the silicon etched device.

  R. Keusseyan et al., “New Method for Optoelectronic / MEMS Packaging”, Proceedings of the 52th Electronic Components and Technology Conference, 28-31, May 2002, pages 259-262 (see, for example, FIG. 3) Or the LTCC package is described. These are low cost, high reliability, airtight and multi-layer packaging architectures. An example of a ceramic package is an IR bolometer manufactured at high processing temperatures in a vacuum-sealed environment.

  C. B. O'Neal et al., “MEMS Packaging Problems”, Processes of the International Symposium on Advanced Packaging Materials: Process, Properties and Interfaces, 14-17 March 1999, see pages 41-47, for example. ) Compares the IC package with the MEMS pressure sensor package. Plastic / lead frame packages are commonly used for IC packaging and are classified as pre-molded and post-molded packages. The difference between pre-molded and post-molded packages is that the pre-molded package has a package body that includes a hollow cavity, and the IC is placed in the cavity and then covered with a hermetic cap, whereas the post-molded package does not contain the IC. After installation, the package body is molded on the assembly. Both of these alternative methods are compatible with MEMS devices. For example, post-molded packages are used for IC or wafer cap accelerometers, and pre-molded packages are used for pressure sensors or microphone packaging. Plastic packaging offers a low cost packaging option. However, the required molding tools are often expensive and time consuming, and are not flexible to adapt to the applications required by fast-changing end users. Another major problem is that the thermal expansion compatibility between plastic and silicon is very low and that moisture can easily enter.

  Wafer level packaging (WLP) is a suitable method for MEMS packaging. It includes an extra fabrication step that joins a micromachined wafer to a second wafer, said second wafer having a suitable cavity etched into it. Once bonded, the second wafer constitutes a protective silicon cap on the micromachined structure. In this method, the microstructure is freely movable in a vacuum or an inert gas atmosphere. The joint is sealed, thus preventing moisture contamination and microstructure failure. WLP is the “Way of MEMS packaging” by Bye Wang, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and 30th of a month. , And H. Reichl et al., “Summary and Development Trends in MEMS Packaging Field”, The 14th IEEE International Conference on Micro Electro Mechanical Systems, 21-25, January 2001, pages 1-5.

  U.S. Patent No. 6,781,281 to Minervini and U.S. Patent Application No. 2002/0102004 A1 to Minervini disclose a MEMS microphone package within the first multilayer FR4 printed circuit board (PCB). A MEMS transducer member, an IC die and other capacitor components. The second multilayer FR4 PCB is used as a cover. The two FR4 substrates are arranged with a gap by the third FR4 substrate, and the third FR4 substrate is cut to include windows arranged around the components on the first PCB. Thus, the three PCBs cooperate to house and shield the transducer member, IC die and other capacitor components. Compared to plastic / leadframe packages, such packages allow for larger batch operations, require minimal metal molds, and have good compatibility with the thermal expansion of the end user's PCB. Nevertheless, mixing transducer members, IC dies and other electronic components on the same FR4 PCB substrate still presents difficulties in the operation of high yield assembly processes. Furthermore, multilayer FR4 PCB is not an inexpensive packaging material.

  PCT patent application PCT / SG2005 / 000034, filing date February 8, 2005, mounts at least one MEMS device on a first flex substrate and mounts one or more electronic components on a second substrate. Provide methods and packages. Then, the two substrates are mechanically joined via a spacer member between them and electrically connected by an electrical connection member. The substrate sandwiches the spacer member, electrical connection member, MEMS device, and one or more electronic components therebetween. The advantage of this method is that the assembly process of the MEMS device is handled and executed separately from the mounting process for other ICs and electronic components, so that the assembly can be performed more easily and with a high yield. However, interconnecting two substrates is a difficult task.

SUMMARY OF THE INVENTION It is a primary object of the present invention to provide an efficient and highly manufacturable method of manufacturing a MEMS package that includes a MEMS device and one or more other electronic circuits.

  Another object of the present invention is to provide a MEMS package.

  Still another object of the present invention is to provide a method of manufacturing a MEMS package using a flexible and foldable substrate.

  Another object of the present invention is to provide a MEMS package comprising a flexible and foldable substrate.

  Yet another object is to provide a method of manufacturing a MEMS package that includes a combination of a flexible and foldable substrate and a rigid substrate.

  Yet another object is to provide a MEMS package that includes a combination of a flexible and foldable substrate and a rigid substrate.

  Yet another object is to provide a method of manufacturing a MEMS package that includes a flexible substrate folded multiple times.

  Yet another object is to provide a MEMS package that includes a flexible substrate folded multiple times.

  In accordance with the objects of the present invention, a MEMS package is realized. The MEMS package has at least one MEMS device disposed on a flexible substrate. A metal structure surrounds at least one MEMS device, the bottom surface of the metal structure is attached to a flexible substrate, the flexible substrate is folded over the top surface of the metal structure, and attached to the top surface of the metal structure, thereby forming a MEMS package To do. The metal structure may be in the form of a metal cap or a metal ring.

  Furthermore, according to the object of the present invention, a method for manufacturing a MEMS package is realized. At least one MEMS device is mounted on the flexible substrate. The bottom surface of the metal structure is attached to a flexible substrate that surrounds at least one MEMS device. The flexible substrate is folded over the top surface of the metal structure and attached to the top surface of the metal structure, thereby forming a MEMS package.

  Optionally, the rigid portion of the rigid-flex substrate can be placed on or under the flexible substrate at the top and bottom of the package. Optionally, the flexible substrate can be folded from more than one side.

Embodiments The present invention proposes a method for packaging a MEMS device and one or more electronic components (generally an application specific IC (ASIC) and one or more passive components). The MEMS device and the IC element are first assembled on a flexible substrate with an elongated portion. MEMS devices are wire bonded directly to IC elements to minimize parasitic effects. A metal cap is attached to accommodate the element, or alternatively the element is surrounded by a metal ring. The elongated portion of the flexible substrate is folded onto a metal cap or ring and attached onto the metal cap or ring to complete the package. The metal cap or ring on the flexible substrate and the metal layer are electrically connected to form a Faraday box for electromigration (EMI) and radio frequency (RF) shielding.

  A preferred first embodiment of the invention is shown in FIGS. A second preferred embodiment of the present invention is shown in FIGS. A preferred third embodiment of the invention is shown in FIGS. A fourth preferred embodiment of the present invention is shown in FIGS. As will be apparent to those skilled in the art, the present invention is not limited to the MEMS microphone elements shown in the drawings, but other types of MEMS devices such as pressure sensors, accelerometers, gyroscopes, or potential future proposals It can be applied to many other applications for packaging certain other MEMS devices.

  A first embodiment of the present invention will now be described with reference to FIGS. Referring now in more detail to FIG. 1, the double metal layer (2ML) flexible substrate of the present invention is shown. The flexible substrate 10 includes a core film layer 24 and copper metal layers 22 and 26 on both sides. The core film layer may be polyimide, polyethylene polyimide (PEI), polytetrafluoroethylene (PTFE), or liquid crystal polymer (LCP). Although not shown in FIG. 1, a solder resist layer, such as a coverlay or photosensitive epoxy, is patterned to provide exposed portions in the wire bonding and electrical bonding areas. This layer is shown in the plan view of FIGS. 7A and 7B. The thickness of the polyimide layer 24 is about 12.5 to 100 μm. Such a core film of the flexible substrate 10 has a much lower elastic modulus (generally 5 GPa) than the FR-4 printed circuit board (PCB) (generally 25 GPa), so that the stress is relieved and the MEMS device mounted thereon Minimize packaging stress or ambient induced stress. The flexible substrate 10 has an opening 11 known as a peripheral hole. This may be a circular or square opening, and external fluid, acoustic energy or pressure can interact with the MEMS device mounted thereon. The opening 11 also functions as a via hole that connects the metal on both sides. The flexible base material 10 has an elongated portion 12.

  Metal layers 22 and 26 are bonded to the top and bottom of flexible core film layer 24 using an adhesive or non-adhesive lamination technique. The metal layers 22 and 26 are preferably copper and have a metal surface for wire bonding such as soft gold. The thickness of the copper layer is generally 25 μm, but may be thicker or thinner depending on the application. The surface finish metal may be Ni / Au, where the thickness of the nickel layer is about 3 μm and the thickness of the gold layer to cover is a minimum of about 0.35 μm.

  FIG. 6A is a plan view of the upper side of the flexible base material 10. The upper metal layer 22 is formed and patterned on the polyimide material 24 as shown. The upper metal layer 22 has copper plated thereon with Ni / Au. FIG. 6B shows a plan view of the bottom side of the flexible substrate 10, and the bottom metal layer 26 also has copper plated with Ni / Au. The cross-sectional view follows the line F-F ′ shown in FIGS. 6B and 8.

  Here, a solder mask or solder resist 28 is formed on the metal surfaces 22 and 26. The patterned solder resist prevents soldering on this area. The solder resist may be a coverlay or a photosensitive epoxy and has a thickness of about 10-40 μm. The patterned solder resist is shown on the top side of FIG. 7A and on the bottom side of FIG. 7B. The patterned solder resist is not shown in the cross-sectional view, but is present as shown in FIGS. 7A and 7B.

  Referring again to FIG. 1, vias 30 are formed on the flexible substrate extensions 12 and are plated and embedded as intermediate layer interconnects as shown in FIG. 6B. Vias connect to surface mount pads, for example, later connected to an external printed circuit board as described below. An opening 32 in the metal layer is also shown in FIGS. 1 and 6B. What is important to the present invention is that surface mount pads are placed on the opposite side of the package from the perimeter holes 11. The hole 11 also functions as a via to the interconnect layer 22 and the layer 26.

  Referring now to FIG. 2, passive components, MEMS devices, and IC elements are mounted on the flexible substrate 10. One MEMS device 40, one integrated circuit element 42, and one passive element 48 are shown. It will be appreciated that the MEMS package of the present invention has at least one MEMS device, but can have more than one MEMS device. The package may also have one or more electronic components, such as IC 42, generally an application specific IC (ASIC), and one or more passive components, such as capacitors, resistors, inductors, or other passive components. FIG. 8 shows a plan view of the flexible base material in which the components are assembled.

  The MEMS device 40 is attached to the flexible substrate 10 via the adhesive 36. A low modulus adhesive such as a silicon based adhesive is desirable for stress relief. The optional IC element 42 is attached to the flexible substrate 10 using a die attachment adhesive. Optional passive element 48 is attached to the flexible substrate by surface mount technology (SMT). Then, the IC element 42 is wire-bonded to the bonding pad 45 and the pad 47 on the MEMS device 40 with wires 44 and 46, respectively. For example, the pad 47 may be for connecting an IC to VDD or OUT.

  Here, as shown to FIG. 3A, the contact bonding layer 52 is arrange | positioned on the expansion | extension part 12 of a flexible base material. The adhesive 52 may be a film, a tape, or a liquid paste. The metal cap 54 is attached to the flexible substrate by a conductive adhesive or solder 50. Alternatively, as shown in FIG. 3B, the metal cap 54 is attached to the flexible substrate by a conductive adhesive or solder 50. The adhesive layer 52 is disposed on the top of the metal cap 54. Metal caps can be copper, copper alloys, aluminum alloys, iron alloys with solderable metal finishes, plastics with metal finishes formed by either electroless plating or painting, or injection molded or transfer molded. It can have a conductive composite formed by either. The metal cap 54 is attached to the flexible substrate using a conductive adhesive, solder (eutectic PbSn or any lead-free SnAg, SnAgCu), or a combination of solders with conductive or non-conductive adhesive It is done. Solder attachment is performed by a solder reflow or hot bar method. The metal cap houses all the elements on the flexible substrate. The metal cap 54 and the metal layer 26 on the flexible substrate 10 are electrically connected to form a Faraday box for EMI / RF shielding.

  Referring now to FIG. 4, the elongated portion of the flexible substrate 10 is folded onto the metal cap 54 and attached to the metal cap with an adhesive 52. As a matter of course, the OUT pad 60, the VDD pad 62, and the GND pad 64 are disposed on the opposite side of the package from the peripheral hole 11. This is important, for example, in the next step of surface mounting the packaged MEMS device to the application PCB.

  FIG. 5 shows a packaged MEMS device 70. The application PCB 80 is shown having a pad 82 for connection to the MEMS package 70. The MEMS package 70 is surface-mounted on the PCB 80 by solder bumps 72, for example. The flux generated by the solder reflow process is detrimental to the MEMS device. Since the peripheral holes are located on the opposite side of the package 70 from the pads 60, 62, and 64, it is much less likely that the flux will penetrate the peripheral holes and damage the MEMS device.

  A second embodiment of the present invention will be described with reference to FIGS. The second embodiment begins in the same way as shown in FIGS. The MEMS device and other electronic elements are mounted on the flexible substrate 10.

  Here, instead of the metal cap of FIG. 3, a metal ring 56 is disposed on the flexible substrate 10 and surrounds the elements 40, 42 and 48. The metal ring 56 is attached to the flexible substrate using a conductive adhesive, solder (eutectic PbSn or any lead-free SnAg, SnAgCu), or a combination of solders with conductive or non-conductive adhesive It is done. Solder attachment is performed by a solder reflow or hot bar method.

  Referring now to FIG. 10, the elongated portion 12 of the flexible substrate 10 is folded onto the metal ring 56 and attached to the metal ring with an adhesive 55. Here, all vias are formed in the sidewalls and interconnect the electrical leads on the front side metal 22 to the VDD and OUT pads on the back side metal layer 56. Only one via 36 and an opening are shown on the metal layers 34 and 35 to simplify the drawing.

  As a matter of course, the OUT pad 60, the GND pad 62, and the VDD pad 64 are disposed on the opposite side of the package from the peripheral hole 11. This is important, for example, in the next step of surface mounting the packaged MEMS device to the application PCB. The metal ring 56 is electrically connected together with the metal layers 22 and 26 at the top and bottom of the flexible substrate to form a Faraday box for EMI / RF shielding.

  FIG. 11 shows a packaged MEMS device 71. The application PCB 80 is shown having a pad 82 for connection with the MEMS package 71. The MEMS package 71 is surface-mounted on the PCB 80 by solder bumps 72, for example. The flux generated by the solder reflow process is detrimental to the MEMS device. Since the peripheral holes are located on the opposite side of the package 71 from the pads 60, 62, and 64, the possibility of flux entering the peripheral holes and damaging the MEMS device is much less.

  The package structure 70 or 71 of the present invention also provides the possibility of further miniaturization. This is because the thickness in the z-axis (that is, the vertical direction in FIGS. 4 and 10) is reduced by the use of the flexible substrate 10. The base material thickness of the flexible base material 10 is generally about 0.1 mm or less.

  A third embodiment of the present invention will be described with reference to FIGS. In this example, the rigid substrate of the present invention and a flexible substrate are combined. For example, a rigid FR4 base material is used. “FR” means a flame retardant, and type “4” indicates a glass woven reinforced epoxy resin. FIG. 12 shows the portion of the flexible base material 10 that is the base of the component, and shows the FR-4 layer 100 that is folded and laminated on the portion of the base material that is on the component. FIG. 13 shows the package after folding. A metal ring 56 is shown. In this embodiment, a metal cap can alternatively be used.

  A fourth embodiment of the present invention is illustrated in the cross-sectional views of FIGS. 14 and 17 and the front views of FIGS. FIG. 15 shows a plan view of the upper side of the substrate, and FIG. 16 shows a plan view of the bottom side of the substrate. In this example, the flexible substrate is folded on both sides. In this embodiment, a metal cap or metal ring is used. FIG. 17 shows the package after folding.

  The present invention provides MEMS packages using flexible substrates and methods for manufacturing these packages.

  Although the invention has been particularly shown and described with reference to preferred embodiments thereof, it will be apparent to those skilled in the art that various changes can be made in form and detail without departing from the spirit and scope of the invention. it can.

The following content is shown in the accompanying drawings, which form an important part of this description.
1 and 2 are cross-sectional views schematically showing the steps of a preferred first embodiment of the present invention. 3A and 3B are cross-sectional views schematically illustrating two alternative forms of the preferred first embodiment of the present invention. FIG. 4 is a sectional view schematically showing another step of the first preferred embodiment of the present invention. FIG. 5 is a cross-sectional view schematically illustrating surface mounting of a MEMS device packaged in accordance with a first preferred embodiment of the present invention. 6A, 7A, and 8 are plan views schematically showing the front surface of the flexible substrate of the present invention. Further, in FIGS. 6B and 8, a cross-sectional cutting line FF ′ is shown based on the depiction of FIGS. 6B and 7B are plan views schematically showing the back surface of the flexible base material of the present invention. 9 and 10 are sectional views schematically showing a second preferred embodiment of the present invention. FIG. 11 is a cross-sectional view schematically illustrating surface mounting of a MEMS device packaged in accordance with a second preferred embodiment of the present invention. 12 and 13 are sectional views schematically showing a third preferred embodiment of the present invention. FIG. 14 is a sectional view schematically showing a fourth preferred embodiment of the present invention. 15 and 16 are plan views showing a fourth preferred embodiment of the present invention. Further, FIGS. 15 and 16 show a section cut line FF ′ based on the depiction of FIGS. 14 and 17. FIG. 17 is a sectional view schematically showing a fourth preferred embodiment of the present invention.

Claims (31)

  1. At least one MEMS device disposed on a flexible substrate;
    A metal structure surrounding the at least one MEMS device, the bottom surface of the metal structure being attached to the flexible substrate, the flexible substrate being folded over the top surface of the metal structure, and the top surface of the metal structure A metal structure that is attached to form a MEMS package;
    A MEMS package comprising:
  2.   The metal structure is copper, copper alloy, aluminum alloy, iron alloy with solderable metal finish, plastic with metal finish formed by either electroless plating or painting, or injection molding or transfer molding The package according to claim 1, comprising a conductive composite material formed by any of the above.
  3.   The flexible substrate has a core film having a copper layer and a solder resist layer on both sides thereof, and the core film has polyimide, polyethylene polyimide, polytetrafluoroethylene, or liquid crystal polymer, and the solder resist The package of claim 1, wherein the layer comprises a coverlay or a photosensitive epoxy.
  4.   The metal structure has a metal ring surrounding the at least one MEMS device, the metal ring being made of copper, copper alloy, aluminum alloy, iron alloy with solderable metal finish, electroless plating or painting. The package of claim 1 having a plastic with a metal finish formed by either, or a conductive composite formed by either injection molding or transfer molding.
  5.   The flexible substrate further comprises a metal layer thereon, and the metal layers above and below the at least one MEMS device and the metal ring together provide an EMI shield for the at least one MEMS device. 4. The package according to 4.
  6.   The metal ring on the flexible substrate by a conductive adhesive or a solder material comprising eutectic PbSn, optional lead-free SnAg or SnAgCu, or by a combination of solders with conductive or non-conductive adhesive The package of claim 4 to which is attached.
  7.   The metal structure has a metal cap that houses the at least one MEMS device, the metal cap being copper, copper alloy, aluminum alloy, iron alloy with solderable metal finish, electroless plating or painting The package of claim 1 having a plastic with a metal finish formed by any of the above, or a conductive composite formed by either injection molding or transfer molding.
  8.   The flexible substrate further comprises a metal layer thereon, and the metal layer and the metal cap under the at least one MEMS device together provide an EMI shield for the at least one MEMS device. Package as stated.
  9.   The bottom surface of the metal cap by a conductive adhesive, or solder, or by a combination of conductive adhesive or solder and non-conductive adhesive material, or by a combination of conductive adhesive or solder with non-conductive adhesive The package according to claim 7, wherein the metal cap is attached to a part of the flexible base material.
  10.   The package according to claim 7, wherein the cap is attached to the flexible base material on the upper surface of the metal cap by an adhesive.
  11.   The package of claim 1 further comprising one or more electronic components disposed on the flexible substrate and within the metal structure.
  12.   The package of claim 11, further comprising a wire bonding connection between the one or more electronic components and the at least one MEMS device.
  13.   The flexible substrate has an opening that allows interaction between the MEMS device and the environment outside the package, the opening serving as a via connection for the metal layer on the flexible substrate. The package of claim 1 which also functions.
  14.   Furthermore, the package which has a surface mounting pad on the outer surface of the said flexible base material, and the said surface mounting pad is arrange | positioned on the side surface of the said flexible base material on the opposite side to the said opening part.
  15.   The package according to claim 1, wherein the flexible substrate further includes a rigid layer laminated on a flexible layer, the folding portion is flexible, and the other portion is rigid.
  16.   The package of claim 15, wherein the rigid layer comprises an FR-4 layer.
  17.   The package of claim 1, wherein the flexible substrate can be folded from at least one side so as to be attached to the metal structure.
  18. A method for manufacturing a MEMS package, comprising:
    Mounting at least one MEMS device on a flexible substrate;
    Attaching a bottom surface of a metal structure to the flexible substrate surrounding the at least one MEMS device;
    Folding the flexible substrate over the top surface of the metal structure, attaching the flexible substrate to the top surface of the metal structure, thereby forming the MEMS package;
    Including methods.
  19.   The metal structure has a metal ring surrounding the at least one MEMS device, the metal ring being either copper, copper alloy, aluminum alloy, iron alloy with solderable metal finish, electroless plating or painting 19. A method according to claim 18, comprising a metal-finished plastic formed by or a conductive composite formed by either injection molding or transfer molding.
  20.   20. The flexible substrate comprises a core film and a metal layer, and the metal layer and the metal ring above and below the at least one MEMS device together provide an EMI shield for the at least one MEMS device. Method.
  21.   The metal structure has a metal cap that houses the at least one MEMS device, the metal cap being made of copper, copper alloy, aluminum alloy, iron alloy with solderable metal finish, electroless plating or painting. 19. The method of claim 18, comprising a plastic with a metal finish formed by either, or a conductive composite formed by either injection molding or transfer molding.
  22.   24. The flexible substrate comprises a core film and a metal layer, and the metal layer and the metal cap under the at least one MEMS device together provide an EMI shield for the at least one MEMS device. Method.
  23.   The method of claim 18, wherein the flexible substrate has a top metal layer on a top surface of a flexible material and a bottom metal layer on a bottom surface of the flexible material.
  24.   24. The method of claim 23, wherein the flexible material comprises polyimide, polyethylene polyimide, liquid crystal polymer, or polytetrafluoroethylene.
  25.   24. The method of claim 23, wherein the top and bottom metal layers comprise copper plated with nickel and gold.
  26.   24. The method of claim 23, further comprising forming a solder resist layer on each surface of the top and bottom metal layers and patterning the solder resist layer, wherein the solder resist material comprises a coverlay or a photosensitive epoxy. Method.
  27.   The method of claim 18, further comprising mounting one or more electronic components on the flexible substrate and in the metal structure.
  28. After the step of folding the flexible substrate,
    Providing a surface mount pad on an outer surface of the flexible substrate opposite the at least one MEMS device;
    Attaching an application printed circuit board to the package in the surface mount pad;
    The method of claim 18 comprising:
  29.   19. The method of claim 18, further comprising the step of laminating a rigid layer on the flexible layer of the flexible substrate, wherein the fold is flexible and the other portion is rigid.
  30.   30. The method of claim 29, wherein the rigid layer comprises FR-4 material.
  31.   19. The method of claim 18, wherein the step of folding the flexible substrate is performed from at least one side of the metal structure upward.
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