JP2009248455A - High gas-barrier laminate and packaging container - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a gas-barrier laminated film which is excellent in gas-barrier properties, transparency, and pinhole resistance. <P>SOLUTION: A high gas-barrier laminated film includes a heat sealing layer and at least two gas-barrier laminated films. The heat sealing layer is made of a linear low density polyethylene film. In at least one of the gas-barrier laminated films, a vapor deposition film made of a CVD-organosilicon compound and a gas-barrier coated film by a gas-barrier composition are formed on a polyamide film. The heat sealing layer is adhered to the polyamide film of the gas-barrier laminated film (I) to face each other. The gas-barrier laminated film is excellent in mechanical strength and pinhole resistance and keeps high gas-barrier properties when used practically. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a high gas barrier laminate, and more particularly, a high gas barrier laminate film comprising a heat seal layer and two or more gas barrier laminate films, wherein the gas barrier laminate film has at least a polyamide film as a base film. The present invention relates to a high gas barrier laminated film excellent in pinhole resistance and gas barrier properties, and a packaging container, in which a heat seal layer and a heat seal layer are bonded together.

  Conventionally, there is a transparent gas barrier film in which a vapor deposition film such as aluminum oxide is laminated. As a gas barrier film used as a packaging material for electronic parts, an inorganic oxide vapor deposition layer and a metal vapor deposition layer are laminated on a base material. There is a gas barrier transparent conductive laminated film (Patent Document 1). In the same film forming process, an inorganic oxide vapor deposition layer is formed on a substrate, and a metal vapor deposition layer is formed immediately thereafter, so that it can be manufactured at low cost.

  In addition, a metal oxide vapor-deposited thin film layer, a gas barrier film layer, and an aluminum vapor-deposited thin film layer having a thickness of 2 to 15 nm are sequentially laminated on one side of the printed layer and a base layer made of a polymer film where the print layer is not provided. There is also a laminated packaging material comprising a barrier laminated film and a sealant layer (Patent Document 2). It was made in view of insufficient gas barrier properties such as oxygen and water vapor only by depositing a single layer of a metal oxide vapor deposition thin film layer such as aluminum oxide or silicon oxide, forming a plurality of vapor deposition films, In order to improve the gas barrier property, the thickness of the metal oxide vapor-deposited thin film layer is specified to a certain level or more.

Furthermore, the transparent gas barrier laminate is obtained by sequentially laminating at least an anchor coat layer, a transparent gas barrier vapor deposition layer made of an inorganic oxide, a gas barrier coating layer, and a heat sealable resin film on a specific polyester film substrate. The specific polyester film has a storage elastic modulus (E ′) at −20 to + 40 ° C. in the range of 9 × 10 ⁸ to 1 × 10 ¹⁰ Pa, and a β transition tan δ peak temperature of + 10 ° C. or less. There is also a transparent gas barrier laminate characterized by having the dynamic viscoelasticity recognized in (Patent Document 3). A film obtained by depositing silicon oxide on a polyamide film is inferior in gas barrier property. Further, a deposited film obtained by depositing a metal or a metal compound lacks flexibility and is weak against bending and bending, and a vacuum such as a vacuum deposition method is used as a forming method. It is made in view of problems such as pinholes and the like that may occur in the inorganic thin film when formed using a process. With the above configuration, it has a high gas barrier property against oxygen, water vapor, and the like, and has excellent resistance. It is said to have impact resistance and pinhole resistance.

Further, a thickness obtained by applying a coating agent mainly composed of a first vapor-deposited thin film layer, an aqueous solution containing a water-soluble polymer and at least one metal alkoxide or a hydrolyzate thereof, or a water / alcohol mixed solution, followed by drying by heating. The main agent is an aqueous solution or water / alcohol mixed solution containing a gas barrier intermediate coating layer having a thickness of 0.01 to 1 μm, a second vapor-deposited thin film layer, a water-soluble polymer and one or more metal alkoxides or hydrolysates thereof. A gas barrier layer formed by sequentially laminating each layer of a gas barrier coating layer having a film hardness of 3.0 to 20.0 GPa formed by applying a coating agent and drying by heating is laminated on at least one side of a base material made of a plastic material. There is also a laminate having a high gas barrier property, which is characterized by the above (Patent Document 4). Vapor deposition films are put to practical use as packaging materials through various post-processes, such as printing letters and designs on the surface of vapor-deposited films, and bonding sealant films. In view of the above, the above structure has been made in view of the fact that it has a gas barrier property as high as that of a metal foil that could not be obtained with a conventional laminate having a gas barrier thin film layer such as a vapor-deposited thin film layer. In addition, the high gas barrier property will continue to be maintained stably even during use.
Japanese Patent Laid-Open No. 2003-340956 JP 2004-174998 A Japanese Patent Laid-Open No. 2006-7566 JP 2007-168085 A

  However, electronic components are often required to have a high barrier level in order to maintain their functions, and at the same time, pinhole resistance of packaging materials due to transportation and drop impact is often required. The gas barrier films described in Patent Documents 1 to 4 are transparent films formed by vapor-depositing aluminum oxide or the like in order to ensure visibility. However, since the vapor-deposited film is inferior in flexibility, a pinhole is caused by transportation or a drop impact. Etc. are likely to occur. For this reason, even if the gas barrier property of the film itself is high, the actual gas barrier property during use may be reduced due to the occurrence of pinholes.

  Then, an object of this invention is to provide the high gas barrier laminated film excellent in gas barrier property and pinhole resistance.

  As a result of examining the high gas barrier laminated film in detail, the present invention, etc., comprises a heat-seal layer of a linear low-density polyethylene film, and supplies the organosilicon compound to the heat-seal layer using a polyamide film as a base film. When a predetermined gas barrier laminate film having a deposited film is laminated, the pinhole resistance is excellent due to the flexibility of the linear low density polyethylene film, the mechanical strength of the polyamide film, and the flexibility of the deposited film. Furthermore, a vapor deposition film formed by vapor deposition comprising an organic silicon compound, a metal or a metal oxide, a predetermined gas barrier coating film, a vapor deposition comprising an organic silicon compound and a metal or a metal oxide on the base film. A gas barrier laminate film that is formed by sequentially laminating a vapor deposition film and a predetermined gas barrier coating film. In addition, it is possible to avoid the deposition layer surface from being laminated with other films, so it is excellent in maintaining gas barrier properties, and by stacking two or more such gas barrier laminate films, high gas barrier properties are ensured. As a result, the present invention has been completed.

That is, the present invention is a high gas barrier laminate film having a heat seal layer and two or more gas barrier laminate films, wherein the heat seal layer comprises a linear low density polyethylene film, and the gas barrier laminate film At least one of the above films is provided with a vapor deposition film obtained by supplying an organosilicon compound by a chemical vapor deposition method on a polyamide film, and the general formula R ¹ _n M (OR ² ) _m (wherein In the formula, R ¹ and R ² represent an organic group having 1 to 8 carbon atoms, M represents a metal atom, n represents an integer of 0 or more, m represents an integer of 1 or more, and n + m Represents at least one alkoxide represented by M)), a polyvinyl alcohol-based resin and / or an ethylene / vinyl alcohol copolymer, and further degenerate by a sol-gel method. A gas barrier laminate film (I) provided with a gas barrier coating film made of a gas barrier composition obtained by combining the heat seal layer and the polyamide film of the gas barrier laminate film (I) facing each other. A high gas barrier laminated film is provided.

  Moreover, the packaging container which consists of the said high gas barrier laminated | multilayer film is provided.

  Since the high gas barrier laminated film of the present invention has excellent pinhole resistance, it maintains a high gas barrier property in actual use such as when transporting products and displaying products when preparing packaging containers from the high gas barrier laminated film. can do.

Since the high gas barrier laminate film of the present invention is transparent, it can be suitably used in fields where the visibility of the contents is required.
Since the gas barrier laminate film used in the high gas barrier laminate film of the present invention can be produced by laminating two layers each of a predetermined vapor deposition film and a gas barrier coating film, a new gas barrier laminate film manufacturing apparatus No introduction is required and manufacturing is easy.

The first of the present invention is a high gas barrier laminate film having a heat seal layer and two or more gas barrier laminate films, wherein the heat seal layer is composed of a linear low density polyethylene film, and the gas barrier laminate At least one of the films is provided with a vapor deposition film obtained by supplying an organosilicon compound by a chemical vapor deposition method on a polyamide film, and a general formula R ¹ _n M (OR ² ) _m (provided that In the formula, R ¹ and R ² represent an organic group having 1 to 8 carbon atoms, M represents a metal atom, n represents an integer of 0 or more, m represents an integer of 1 or more, n + m represents at least one alkoxide represented by M), and a polyvinyl alcohol resin and / or an ethylene / vinyl alcohol copolymer. A gas barrier laminate film (I) provided with a gas barrier coating film made of a gas barrier composition obtained by combining the heat seal layer and the polyamide film of the gas barrier laminate film (I) facing each other. It is a high gas barrier laminated film characterized by the above-mentioned. The second of the present invention is a packaging container comprising the above high gas barrier laminated film. Hereinafter, the gas barrier laminate and the packaging container of the present invention will be described in detail.

(1) Configuration of High Gas Barrier Laminate Film The high gas barrier laminate film of the present invention includes a gas barrier laminate film and a heat seal layer, and the gas barrier laminate film is formed of organic silicon by chemical vapor deposition at least on a polyamide film. A vapor deposition film formed by supplying a compound is provided, and a general formula R ¹ _n M (OR ² ) _m (wherein R ¹ and R ² are organic groups having 1 to 8 carbon atoms) on the surface of the vapor deposition film. M represents a metal atom, n represents an integer of 0 or more, m represents an integer of 1 or more, and n + m represents the valence of M. Gas barrier coating with a gas barrier composition obtained by polycondensation by a sol-gel method, which contains an alkoxide of the above and a polyvinyl alcohol resin and / or an ethylene / vinyl alcohol copolymer A the provided gas barrier laminate film (I), wherein the polyamide film and the heat-sealing film is characterized in that it is laminated to face. FIG. 1 shows an example of a preferred embodiment of the layer structure of the gas barrier laminate film of the present invention.

  In FIG. 1, the heat seal layer (10) is bonded to the gas barrier laminate film (I) (30) with a laminating adhesive (20). The gas barrier laminated film (I) (30) comprises a polyamide film (31), a vapor deposition film (33) formed by supplying an organic silicon compound by a chemical vapor deposition method, and a gas barrier coating film (35). Thus, the polyamide film (31) is laminated against the heat seal layer (10). In FIG. 1, a vapor deposition film (43) obtained by vapor-depositing an organic silicon compound, metal or metal oxide on a base film (41), a gas barrier coating film (45), an organic silicon compound, metal or metal oxide. A mode in which a gas barrier laminated film (II) (40) obtained by laminating a vapor-deposited film (47) obtained by vapor-depositing and a gas barrier coating film (49) is shown. By laminating two gas barrier laminated films of the gas barrier laminated film (I) (30) and the gas barrier laminated film (II) (40), high gas barrier properties can be secured.

  FIG. 2 shows an embodiment in which the gas barrier laminate film (II) (40) is further laminated on the high gas barrier laminate film of FIG. The two gas barrier laminate films (II) (40) are laminated with the gas barrier coating film (49) facing each other, and are adhered by a laminating adhesive. Furthermore, the base film (41) of the gas barrier laminate film (II) is bonded to the gas barrier laminate film (I) (30) through the adhesive layer (20), and further the gas barrier laminate film (I The heat seal layer (10) is bonded to the base film (31) of (30) via the adhesive layer (20). Both of the gas barrier laminate film (I) (30) and the gas barrier laminate film (II) (40) are adjacent to the vapor deposition films (33) and (47), and the gas barrier coating film (35) is the outermost layer. Since (49) is included, these vapor-deposited films are laminated without being in direct contact with other layers, preventing damage to the vapor-deposited films and preventing gas barrier properties from being lowered.

  As shown in FIG. 1 and FIG. 2, the high gas barrier laminate film of the present invention has a heat seal layer (10) and the gas barrier laminate film (I) (30) bonded together by a laminating adhesive (20). It is preferable. Combined with the mechanical strength of the polyamide film (31) constituting the base film of the gas barrier laminate film (I) (30), the mechanical strength and pinhole resistance of the resulting high gas barrier laminate film are improved. Can be made.

(2) Heat seal layer The heat seal layer used in the present invention is a linear low-density polyethylene film.
As the linear low density polyethylene film used in the present invention, for example, the density is 0.900 to 0.930 g / cm ³ , preferably the density is 0.900 to 0.915 g / cm ³ It is a film of low density polyethylene. Using linear low-density polyethylene with a density in the above range can create soft, low-waist films, thereby creating effects such as laminate hardness, waist texture, and flexibility. This is because the pinhole resistance is excellent.

  In the present invention, the linear low-density polyethylene is a copolymer of ethylene and an α-olefin having 3 to 20 carbon atoms, which can be obtained from a single-site catalyst such as a metallocene catalyst or a multi-site catalyst. . Here, the α-olefin having 3 to 20 carbon atoms is preferably one having 3 to 12, and specifically, propylene, 1-butene, 1-pentene, 4-methyl-1-pentene, 1- Examples include hexene, 1-octene, 1-nonene, 1-decene, 1-dodecene, and the like. These monomers may be polymerized using, for example, a low-pressure method, a slurry method, a solution method, a gas phase method, and other polymerization methods to form a homopolymer of ethylene having no long-chain branches or a copolymer of ethylene and another olefin. Polymerizes into coalescence. In this invention, the linear low density polyethylene film prepared with the metallocene catalyst can be used conveniently at the point which is excellent in structural uniformity.

The resin film has a thickness of 30 to 100 μm, preferably 40 to 60 μm.
In the present invention, for example, an antiblocking agent, a lubricant (fatty acid amide, etc.), a flame retardant, an inorganic or organic filler, a dye, a pigment, etc. are optionally added to the above-mentioned linear low density polyethylene. Can be used. For example, a known compound such as an inorganic compound such as silicon oxide can be used as the antiblocking agent. By blending an anti-blocking agent, it is possible to prevent adhesion between the films by physically providing irregularities on the film surface.

(3) Gas barrier film In the present invention, two or more gas barrier laminated films are laminated. The gas barrier laminate film (I) laminated against the heat seal layer is provided with a vapor deposition film obtained by supplying an organosilicon compound to a polyamide film by a chemical vapor deposition method. Formula R ¹ _n M (OR ² ) _m (wherein R ¹ and R ² represent an organic group having 1 to 8 carbon atoms, M represents a metal atom, and n represents an integer of 0 or more. M represents an integer of 1 or more, and n + m represents a valence of M.), and a polyvinyl alcohol resin and / or an ethylene / vinyl alcohol copolymer. And a gas barrier laminate film (I) provided with a gas barrier coating film made of a gas barrier composition obtained by polycondensation by a sol-gel method.

Further, a vapor deposition film (I) formed by vapor-depositing an organosilicon compound, a metal, or a metal oxide is provided on one surface of the base film, and the general formula R ¹ _n M (OR ² ) _m (however, In the formula, R ¹ and R ² represent an organic group having 1 to 8 carbon atoms, M represents a metal atom, n represents an integer of 0 or more, m represents an integer of 1 or more, n + m represents the valence of M.) and contains a polyvinyl alcohol resin and / or an ethylene / vinyl alcohol copolymer, and further polycondensed by a sol-gel method. A gas barrier coating film (I) made of a gas barrier composition obtained by the above method is provided, and a vapor deposition film (II) formed by vapor-depositing an organosilicon compound, metal or metal oxide is provided on the gas barrier coating film (I), On the deposited film (II), the general formula R ¹ _n M (OR ² ) _m (In the formula, R ¹ and R ² represent an organic group having 1 to 8 carbon atoms, M represents a metal atom, n represents an integer of 0 or more, and m represents an integer of 1 or more. N + m represents the valence of M.) and contains at least one alkoxide represented by the formula (1) and a polyvinyl alcohol resin and / or an ethylene / vinyl alcohol copolymer. It is preferable to include at least one gas barrier laminate film (II) provided with a gas barrier coating film (II) made of a gas barrier composition obtained by condensation.

  The gas barrier coating film (I) and the gas barrier coating film (II) have a base film, a vapor deposition layer, and a gas barrier coating film, and the base film of the gas barrier coating film (I) is limited to a polyamide film. Others are common. Therefore, the following description will be divided into elements constituting the gas barrier coating films (I) and (II).

(I) Base film As the base film constituting the gas barrier laminate films (I) and (II), a vapor deposition film or a gas barrier coating film formed by vapor-depositing an organic silicon compound, metal or metal oxide is provided. It is preferable to use a resin film that has sufficient mechanical, physical, and chemical strength, can withstand the conditions for forming the deposited film, and can be favorably retained without impairing the characteristics of the deposited film. Among these, the base film constituting the gas barrier laminate film (I) is preferably a polyamide film. It is because it is excellent in mechanical strength and pinhole resistance.

  In the polyamide film used in the present invention, preferred homopolyamides include polycaproamide (nylon 6), poly-ω-aminoheptanoic acid (nylon 7), poly-9-aminononanoic acid (nylon 9), polyundecanamide ( Nylon 11), polylaurin lactam (nylon 12), polyethylene diamine adipamide (nylon 2, 6), polytetramethylene adipamide (nylon 4, 6), polyhexamethylene didipamide (nylon 6, 6), Polyhexamethylene sebacamide (nylon 6,10), polyhexamethylene dodecamide (nylon 6,12), polyoctamethylene adipamide (nylon 8,6), polydecamethylene adipamide (nylon 10,6) , Polydecamethylene sebacamide (nylon 10, 10), poly Decamethylene dodecamide (nylon 12,12), meta-xylene diamine -6 nylon (MXD6) and the like.

  Copolyamides include caprolactam / laurin lactam copolymer, caprolactam / hexamethylene diammonium adipate copolymer, laurin lactam / hexamethylene diammonium adipate copolymer, hexamethylene diammonium adipate / hexamethylene diammonium sebacate Examples include copolymers, ethylene diammonium adipate / hexamethylene diammonium adipate copolymer, caprolactam / hexamethylene diammonium adipate / hexamethylene diammonium sebacate copolymer, and the like.

  These polyamide films may be blended with plasticizers such as aromatic sulfonamides, p-hydroxybenzoic acid, esters, etc. to give flexibility, and may be blended with low elastic modulus elastomer components or lactams. . Examples of the elastomer component include ionomer resin, modified polyolefin resin, thermoplastic polyurethane, polyether block amide, polyester block amide, polyether ester amide elastomer, polyester elastomer, modified styrene thermoplastic elastomer, modified acrylic rubber, and modified acrylic rubber. Examples include ethylene propylene rubber.

  For the above polyamide film, other additives such as plasticizers, heat stabilizers, ultraviolet absorbers, antioxidants, colorants, fillers, antistatic agents, antibacterial agents, lubricants, anti-blocking agents, An appropriate amount of other resins may be blended. Moreover, the surface used as the lamination surface of this polyamide film can be corona-treated, etc., and adhesiveness with the base material to laminate | stack can be improved.

  The polyamide film uses one or more of the above resins, and is formed into a single layer using a film forming method such as an extrusion method, a cast molding method, a T-die method, a cutting method, an inflation method, or the like. Or two or more types of resins that are co-extruded to form a multilayer film, or two or more types of resins are mixed to form a film, and a tenter method or a tubular method or the like Various resin films formed by stretching in the biaxial direction can be used. In addition, as a film thickness of a polyamide film, about 15-25 micrometers is preferable.

  In addition to the polyamide film, the base film constituting the gas barrier laminate film (II) includes polyethylene resin, polypropylene resin, cyclic polyolefin resin, fluorine resin, polystyrene resin, and acrylonitrile-styrene. Polymer (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin), polyvinyl chloride resin, fluorine resin, poly (meth) acrylic resin, polycarbonate resin, polyethylene terephthalate, polyethylene naphthalate, etc. Polyester resin, polyimide resin, polyamideimide resin, polyarylphthalate resin, silicone resin, polysulfone resin, polyphenylene sulfide resin, polyethersulfone resin, polyurethane resin, Acetal resins may be used a film made of a cellulose resin, other various kinds of resins. In particular, a film of a polypropylene resin, a polyester resin, or a polyamide resin is preferable.

  One or more of the above resins are used, and the resin is formed into a single layer using a film forming method such as an extrusion method, a cast molding method, a T-die method, a cutting method, an inflation method, or the like. Or two or more types of resin formed into a multilayer film by co-extrusion or the like, or a mixture of two or more types of resin to form a film, and a tenter method or a tubular method, etc. Various resin films formed by stretching in the axial direction can be used.

In this invention, as a film thickness of a base film, about 6-100 micrometers, More preferably, about 9-50 micrometers is preferable.
(Ii) Surface treatment In the present invention, a deposited film is formed by vapor-depositing an organosilicon compound, a metal or a metal oxide on one surface of the above-mentioned base film. Also good. Thereby, the adhesiveness with the vapor deposition film or the gas barrier coating film can be improved.

  Such surface treatments include corona discharge treatment, ozone treatment, low temperature plasma treatment using oxygen gas or nitrogen gas, glow discharge treatment, oxidation treatment using chemicals, etc., and other pretreatments, etc. is there.

  Among such surface treatments, it is particularly preferable to perform corona treatment or plasma treatment. For example, as plasma processing, there is plasma processing in which surface modification is performed using a plasma gas generated by ionizing a gas by arc discharge. In addition to the above, an inorganic gas such as oxygen gas, nitrogen gas, argon gas, helium gas can be used as the plasma gas. That is, by performing in-line plasma treatment immediately before forming a deposited film formed by depositing an organosilicon compound, metal, or metal oxide by physical vapor deposition or chemical vapor deposition described later, It is possible to remove moisture and dust from the surface of the film and to perform surface treatment such as smoothing, activating, etc. the surface. Furthermore, in the present invention, it is preferable to perform the plasma discharge treatment in consideration of the plasma output, the kind of plasma gas, the supply amount of the plasma gas, the treatment time, and other conditions. Moreover, as a method for generating plasma, DC glow discharge, high frequency discharge, microwave discharge, and other devices can be used. In addition, plasma treatment can be performed by an atmospheric pressure plasma treatment method.

(Iii) Deposition film formed by vapor-depositing organosilicon compound, metal or metal oxide Examples of the vapor deposition film in the gas barrier laminate film (II) used in the present invention include chemical vapor deposition and physical vapor deposition Alternatively, it is a deposited film obtained by combining these and depositing an organic silicon compound, a metal, or a metal oxide. On the other hand, the gas barrier laminate film (I) is a vapor deposition film obtained by supplying an organic silicon compound by chemical vapor deposition among the above vapor deposition films. As will be described later, a deposited film obtained by supplying an organosilicon compound by a chemical vapor deposition method is excellent in flexibility. Therefore, the deposited film is laminated on a polyamide film having high mechanical strength to provide flexibility and resistance. The pinhole property can be improved.

  Examples of the chemical vapor deposition method include chemical vapor deposition methods such as plasma chemical vapor deposition method, low temperature plasma chemical vapor deposition method, thermal chemical vapor deposition method, and photochemical vapor deposition method (Chemical Vapor Deposition method), CVD method). Specifically, a vapor deposition monomer gas such as an organosilicon compound is used as a raw material on one surface of a base film, and an inert gas such as argon gas or helium gas is used as a carrier gas. As described above, a vapor deposition film such as silicon oxide can be formed by using a low temperature plasma chemical vapor deposition method using an oxygen gas or the like and using a low temperature plasma generator or the like.

  In the above, as a low temperature plasma generator, generators, such as high frequency plasma, pulse wave plasma, and microwave plasma, can be used, for example. In view of obtaining highly active and stable plasma, it is preferable to use a high-frequency plasma generator.

An example of a method for forming a deposited film by the low temperature plasma chemical vapor deposition method will be described with reference to FIG. 3 which is a schematic configuration diagram of a low temperature plasma chemical vapor deposition apparatus.
In the present invention, the base film 201 is fed out from the unwinding roll 223 disposed in the vacuum chamber 222 of the plasma chemical vapor deposition apparatus 221, and the base film 201 is further fed at a predetermined speed via the auxiliary roll 224. Then, it is conveyed onto the circumferential surface of the cooling / electrode drum 225. On the other hand, a gas mixture for vapor deposition is prepared by supplying vapor deposition monomer gas such as oxygen gas, inert gas, organosilicon compound, etc. from the gas supply devices 226, 227 and the raw material volatilization supply device 228, etc. Is introduced into the vacuum chamber 222 through the raw material supply nozzle 229. The mixed gas composition for vapor deposition is supplied onto the substrate film 201 conveyed on the circumferential surface of the cooling / electrode drum 225, and plasma is generated and irradiated by glow discharge plasma 230 to form a vapor deposited film. . Next, when the base film 201 on which the vapor deposition film is formed as described above is wound around the winding roll 234 via the auxiliary roll 233, a vapor deposition film formed by vapor-depositing an organosilicon compound by plasma chemical vapor deposition is formed. Can do. A predetermined power is applied to the cooling / electrode drum 225 from a power source 231 disposed outside the vacuum chamber 222, and a magnet 232 is disposed in the vicinity of the cooling / electrode drum 225 to promote plasma generation. Has been. Since a predetermined voltage is applied from the power source to the cooling / electrode drum in this way, glow discharge plasma is generated in the vicinity of the opening of the raw material supply nozzle in the vacuum chamber and the cooling / electrode drum. The glow discharge plasma is derived from one or more gas components in the mixed gas. When the base film is conveyed at a constant speed in this state, the glow discharge plasma causes the cooling / electrode drum surface to be A deposited film formed by depositing an organosilicon compound can be formed on the base film. In FIG. 3, reference numeral 235 represents a vacuum pump.

In the present invention, the vacuum chamber is depressurized by a vacuum pump and adjusted to a vacuum degree of 1 × 10 ⁻¹ to 1 × 10 ⁻⁸ Torr, preferably a vacuum degree of 1 × 10 ⁻³ to 1 × 10 ⁻⁷ Torr. It is preferable to do.

The raw material volatilization supply device volatilizes the organic silicon compound as the raw material, mixes it with oxygen gas, inert gas, etc. supplied from the gas supply device, and introduces this mixed gas into the vacuum chamber through the raw material supply nozzle. . At this time, the content of the organosilicon compound in the mixed gas is preferably 1 to 40%, the oxygen gas content is 10 to 70%, and the inert gas content is preferably 10 to 60%. For example, the mixing ratio of organosilicon compound: oxygen gas: inert gas can be about 1: 6: 5 to 1:17:14. Note that the degree of vacuum in the vacuum chamber when supplying the organosilicon compound, the inert gas, the oxygen gas, and the like is 1 × 10 ⁻¹ to 1 × 10 ⁻⁴ Torr, preferably 1 × 10 ⁻¹ to 1 × 10 ⁻² Torr is preferable, and the conveying speed of the base film is 10 to 300 m / min, preferably 50 to 150 m / min. Formation of the vapor deposition film formed by vapor-depositing the organosilicon compound obtained in this way is formed on the base film in the form of a thin film in the form of SiO _x while oxidizing the plasma-formed source gas with oxygen gas. Therefore, the deposited film is a dense continuous layer having a small gap and a high flexibility. Therefore, the barrier property of the deposited film is an inorganic oxide such as silicon oxide formed by a conventional vacuum deposition method or the like. Compared with a deposited film of a product, it is much higher, and a sufficient barrier property can be obtained with a thin film thickness. Moreover, since the surface of the base film is cleaned by SiO _X plasma and polar groups and free radicals are generated on the surface of the base film, the adhesion between the deposited film to be formed and the base film is high. It will be a thing. Further, the degree of vacuum at the time of forming the deposited film is 1 × 10 ⁻¹ to 1 × 10 ⁻⁴ Torr, preferably 1 × 10 ⁻¹ to 1 × 10 ⁻² Torr. Since the degree of vacuum when forming a vapor-deposited film of inorganic oxide such as silicon oxide is lower than 1 × 10 ⁻⁴ to 1 × 10 ⁻⁵ Torr, The vacuum state setting time can be shortened, the degree of vacuum is easily stabilized, and the film forming process is also stabilized.

In the present invention, a vapor deposition film formed using a vapor deposition monomer gas such as an organosilicon compound chemically reacts with a vapor deposition monomer gas such as an organosilicon compound and oxygen gas, and the reaction product is a base film. Is formed into a dense and flexible thin film, and is usually an oxidation represented by the general formula SiO _x (where X represents a number from 0 to 2). It is a continuous thin film mainly composed of silicon. The silicon oxide vapor deposition film is a silicon oxide vapor deposition represented by the general formula SiO _x (where X represents a number from 1.3 to 1.9) in terms of transparency and barrier properties. A thin film mainly composed of a film is preferable. The value of X varies depending on the molar ratio of vapor deposition monomer gas and oxygen gas, plasma energy, etc. Generally, the gas permeability decreases as the value of X decreases, but the film itself is yellow. The transparency becomes worse.

In the present invention, the silicon oxide vapor-deposited film is mainly composed of silicon oxide, and further contains at least one compound of carbon, hydrogen, silicon or oxygen, or a compound composed of two or more elements by chemical bonding or the like. It consists of a vapor-deposited film. For example, when a compound having a C—H bond, a compound having a Si—H bond, or a carbon unit is in the form of graphite, diamond, fullerene, or the like, the raw material organosilicon compound or a derivative thereof is further added. It may be contained by a chemical bond or the like. Examples thereof include hydrocarbons having a CH ₃ site, hydrosilica such as SiH ₃ silyl and SiH ₂ silylene, and hydroxyl derivatives such as SiH ₂ OH silanol. In this invention, it is preferable that it is a vapor deposition film containing an organosilicate compound as said vapor deposition film. In addition to the above, the type, amount, etc. of the compound contained in the deposited film can be changed by changing the conditions of the deposition process. Under the present circumstances, as content which said compound contains in a vapor deposition film, it is 0.1 to 50%, Preferably it is 5 to 20%. If the content is less than 0.1%, the impact resistance, spreadability, flexibility, etc. of the vapor-deposited film will be insufficient, and scratches, cracks, etc. will easily occur due to bending, etc., and high barrier properties will be stabilized. On the other hand, it may be difficult to maintain, and if it exceeds 50%, the barrier property may be lowered.

  Furthermore, in the present invention, in the vapor deposition film obtained by vapor-depositing an organosilicon compound, it is preferable that the content of the compound decreases from the surface of the vapor deposition film in the depth direction. As a result, the impact resistance and the like are enhanced by the above compound on the surface of the vapor deposition film, and on the other hand, at the interface with the base film, the content of the above compound is small, and thus the close adhesion between the base film and the vapor deposition film. Will be strong.

  In the present invention, the deposited film is formed in the depth direction using a surface analyzer such as an X-ray photoelectron spectrometer (XPS), a secondary ion mass spectrometer (Secondary Ion Mass Spectroscopy, SIMS), or the like. The above physical properties can be confirmed by analyzing by ion etching or the like and conducting elemental analysis of the deposited film.

  In the present invention, the thickness of the deposited film is preferably about 50 to 4000 mm, more preferably 100 to 1000 mm. If it is thicker than 4000 mm, cracks or the like may occur in the film. On the other hand, if it is less than 50 mm, it may be difficult to achieve a barrier effect. The film thickness can be measured by a fundamental parameter method using, for example, a fluorescent X-ray analyzer (model name, RIX2000 type) manufactured by Rigaku Corporation. As a means for changing the film thickness of the vapor deposition film, it can be performed by a method of increasing the volume velocity of the vapor deposition film, that is, a method of increasing the amount of monomer gas and oxygen gas or a method of slowing the vapor deposition rate. .

  In the present invention, examples of the vapor deposition monomer gas such as an organosilicon compound include 1,1,3,3-tetramethyldisiloxane, hexamethyldisiloxane, vinyltrimethylsilane, methyltrimethylsilane, hexamethyldisilane, methylsilane, Dimethylsilane, trimethylsilane, diethylsilane, propylsilane, phenylsilane, vinyltriethoxysilane, vinyltrimethoxysilane, tetramethoxysilane, tetraethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, octamethylcyclotetrasiloxane, etc. Etc. can be used. Among these, it is particularly preferable to use 1,1,3,3-tetramethyldisiloxane or hexamethyldisiloxane as a raw material because of its handleability and the characteristics of the formed continuous film. In the above, as the inert gas, for example, argon gas, helium gas, or the like can be used.

  On the other hand, in the present invention, a vapor deposition film formed by vapor-depositing an organosilicon compound, a metal, or a metal oxide can also be formed by physical vapor deposition. As such a physical vapor deposition method, for example, an organic silicon compound by a physical vapor deposition method (Physical Vapor Deposition method, PVD method) such as a vacuum deposition method, a sputtering method, an ion plating method, or an ion cluster beam method, A vapor deposition film formed by vapor deposition of metal or metal oxide can be formed.

  Specifically, an organic silicon compound, a metal or a metal oxide is used as a raw material, this is heated and vaporized, and this is vapor-deposited on one of the substrate films, or a raw material is a metal or metal Using an oxidation reaction vapor deposition method in which oxygen is introduced and oxidized to be deposited on one side of the base film, and further, a plasma assisted oxidation reaction vapor deposition method in which the oxidation reaction is supported by plasma is used. A vapor deposition film can be formed. In addition, as a heating method of the vapor deposition material, for example, a resistance heating method, a high frequency induction heating method, an electron beam heating method (EB), or the like can be used. A method of forming a vapor deposition film by physical vapor deposition will be described with reference to FIG. 4 showing a schematic configuration diagram showing an example of a winding type vacuum vapor deposition apparatus.

  First, the base film 201 fed out from the unwinding roll 243 is guided to the cooled coating drum 246 through the guide rolls 244 and 245 in the vacuum chamber 242 of the wind-up type vacuum evaporation apparatus 241. The evaporation source 248 heated by the crucible 247, for example, metal aluminum or aluminum oxide is evaporated on the substrate film 201 guided on the cooled coating drum 246, and if necessary, An oxygen gas or the like is ejected from the oxygen gas outlet 249 and a vapor deposition film formed by depositing, for example, aluminum oxide is formed through the masks 250 and 250 while supplying the oxygen gas. When the base film 201 on which the deposited film is formed is sent out through the guide rolls 251 and 252 and wound around the take-up roll 253, a deposited film can be formed by physical vapor deposition. First, a first-layer deposited film is formed by using the above-described winding-type vacuum deposition apparatus, and then a deposition film is further formed thereon, or the above-described winding-type vacuum deposition apparatus is connected in series. Then, the vapor deposition film may be continuously formed to form the vapor deposition film composed of two or more multilayer films.

The deposited film formed by depositing a metal or a metal oxide may basically be a thin film deposited with a metal oxide, such as silicon (Si), aluminum (Al), magnesium (Mg), Metal oxides such as calcium (Ca), potassium (K), tin (Sn), sodium (Na), boron (B), titanium (Ti), lead (Pb), zirconium (Zr), yttrium (Y) The deposited film can be used. Preferably, a vapor-deposited film of a metal oxide such as silicon (Si) or aluminum (Al) can be used. Therefore, the metal oxide vapor deposition film can be referred to as a metal oxide such as silicon oxide, aluminum oxide, magnesium oxide, and the like, for example, SiO _x , AlO _x , MgO. MO _X (in the formula, M represents a metal element, the value of X is in the range respectively of a metal element different.) as _X, etc. represented by.

  In addition, as the range of the value of X, silicon (Si) exceeds 0 and 2 or less, aluminum (Al) exceeds 0 and 1.5 or less, magnesium (Mg) exceeds 0 and 1 or less, calcium (Ca ) Is greater than 0 and less than or equal to 1, potassium (K) is greater than 0 and less than or equal to 0.5, tin (Sn) is greater than 0 and less than or equal to 2, sodium (Na) is greater than 0 and less than or equal to 0.5, and boron (B) is 0 to 1, 5 or less, Titanium (Ti) is more than 0 to 2 or less, Lead (Pb) is more than 0 to 1 or less, Zirconium (Zr) is more than 0 to 2 or less, Yttrium (Y) is more than 0 to 1 .5 or less. In the above, when X = 0, it is a complete metal, and the upper limit of the range of X is a completely oxidized value. Generally, examples other than silicon (Si) and aluminum (Al) are poor. Therefore, in the present invention, silicon or aluminum is preferable as M. In this case, the value of X is 1.0 to 2.0 for silicon (Si) and 0.5 to 1.5 for aluminum (Al). It is a range. In addition, although the film thickness of the said vapor deposition film changes with kinds etc. of the metal to be used or a metal oxide, it can be arbitrarily selected within the range of 50 to 2000 mm, preferably 100 to 1000 mm, for example. Moreover, the vapor deposition film formed by vapor-depositing a metal or metal oxide is used as a metal or metal oxide to be used in one kind or a mixture of two or more kinds to constitute a vapor deposition film mixed with different materials. You can also.

Furthermore, in the present invention, for example, a composite film composed of two or more layers of different kinds of vapor-deposited films can be formed by using both physical vapor deposition and chemical vapor deposition.
As a composite film composed of two or more layers of the above-mentioned different kinds of vapor-deposited films, first, a chemical vapor deposition method is used on a base film, and it is dense and flexible and can relatively prevent the occurrence of cracks. A composite film comprising two or more layers is provided by providing a vapor deposition film obtained by vapor-depositing an organosilicon compound, and then providing a vapor deposition film obtained by vapor-depositing a metal or metal oxide by physical vapor deposition on the vapor deposition film. It is preferable to constitute a vapor deposition film composed of a film. Contrary to the above, on the base film, a vapor deposition film formed by vapor-depositing a metal or a metal oxide is first provided by a physical vapor deposition method, and then a dense film is formed by a chemical vapor deposition method. It is also possible to provide a vapor-deposited film made of a composite film composed of two or more layers by providing a vapor-deposited film formed by vapor-depositing an organosilicon compound that is rich in flexibility and can relatively prevent the occurrence of cracks.

(Iv) Gas barrier coating film The gas barrier coating film used in the present invention has a general formula R ¹ _n M (OR ² ) _m (wherein R ¹ and R ² are organic having 1 to 8 carbon atoms). Represents a group, M represents a metal atom, n represents an integer of 0 or more, m represents an integer of 1 or more, and n + m represents a valence of M. It contains the above alkoxide, a polyvinyl alcohol resin and / or an ethylene / vinyl alcohol copolymer, and further polycondensed by a sol-gel method in the presence of a sol-gel method catalyst, acid, water, and an organic solvent. A coating film made of a gas barrier composition, which is coated on the vapor deposition film on the base film to provide a coating film, and has a melting point of 20 to 180 ° C. and the base film. Heat treatment at the following temperature for 10 seconds to 10 minutes It can be formed.

  In addition, the gas barrier composition is applied onto the deposited film on the base film, and two or more coating films are stacked, at a temperature of 20 ° C. to 180 ° C. and below the melting point of the base film. You may heat-process for 10 seconds-10 minutes, and may form the composite polymer layer which laminated | stacked two or more gas barrier coating films.

As the alkoxide represented by the above general formula R ¹ _n M (OR ² ) _m , at least one of alkoxide partial hydrolyzate and alkoxide hydrolysis condensate can be used. The partial hydrolyzate is not limited to the one in which all of the alkoxy groups are hydrolyzed, and may be one in which one or more are hydrolyzed, or a mixture thereof, and further a hydrolysis condensate. As a dimer or more of a partially hydrolyzed alkoxide, specifically, a dimer or hexamer may be used.

In the general formula R ¹ _n M (OR ² ) _m , R ¹ is an alkyl group having 1 to 8, preferably 1 to 5, more preferably 1 to 4 carbon atoms which may have a branch. For example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, sec-butyl group, t-butyl group, n-hexyl group, n-octyl group, etc. Can be mentioned.

In the general formula R ¹ _n M (OR ² ) _m , R ² is an alkyl group having 1 to 8 carbon atoms, more preferably 1 to 5, and particularly preferably 1 to 4 which may have a branch. Yes, for example, a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, a sec-butyl group, and the like. When a plurality of (OR ² ) are present in the same molecule, (OR ² ) may be the same or different.

Examples of the metal atom represented by M in the general formula R ¹ _n M (OR ² ) _m include silicon, zirconium, titanium, aluminum, and the like.
In the present invention, silicon is preferable. In this case, as an alkoxide that can be preferably used in the present invention, when n = 0 in the general formula R ¹ _n M (OR ² ) _m , the general formula Si (ORa) ₄ (wherein Ra is Represents an alkyl group having 1 to 5 carbon atoms). In the above, Ra includes a methyl group, an ethyl group, an n-propyl group, an n-butyl group, and the like. Specific examples of such an alkoxysilane include tetramethoxysilane Si (OCH ₃ ) ₄ , tetraethoxysilane Si (OC ₂ H ₅ ) ₄ , tetrapropoxysilane Si (OC ₃ H ₇ ) ₄ , tetrabutoxysilane Si ( OC ₄ H ₉₎ can be exemplified ₄ like.

In the case where n is 1 or more, the general formula RbnSi (ORc) _4-m (wherein m represents an integer of 1, 2, 3 and Rb and Rc are a methyl group, an ethyl group, An alkylalkoxysilane represented by n-propyl group, n-butyl group, etc.) can be used. Examples of such an alkylalkoxysilane include methyltrimethoxysilane CH ₃ Si (OCH ₃ ) ₃ , methyltriethoxysilane CH ₃ Si (OC ₂ H ₅ ) ₃ , dimethyldimethoxysilane (CH ₃ ) ₂ Si (OCH). _{3) 2,} dimethyl diethoxy silane _{(CH 3) 2 Si (OC} 2 H 5) 2, may use other like. In the present invention, the above alkoxysilane, alkylalkoxysilane and the like may be used alone or in combination of two or more.

  In the present invention, a polycondensation product of the above alkoxysilane can also be used, and specifically, for example, polytetramethoxysilane, polytetraemethoxysilane, and the like can be used.

In the present invention, a zirconium alkoxide in which M is Zr can also be suitably used as the alkoxide represented by the general formula R ¹ _n M (OR ² ) _m . For example, tetramethoxyzirconium Zr (OCH ₃ ) ₄ , tetraethoxyzirconium Zr (OC ₂ H ₅ ) ₄ , tetra ipropoxyzirconium Zr (iso-OC ₃ H ₇ ) ₄ , tetra n butoxyzirconium Zr (OC ₄ H ₉ ) ₄ , etc. can be exemplified.

Further, as the alkoxide represented by the general formula R ¹ _n M (OR ² ) _m , a titanium alkoxide in which M is Ti can be preferably used. For example, tetramethoxytitanium Ti (OCH ₃ ) ₄ , tetra Examples include ethoxytitanium Ti (OC ₂ H ₅ ) ₄ , tetraisopropoxytitanium Ti (iso-OC ₃ H ₇ ) ₄ , tetra-n-butoxytitanium Ti (OC ₄ H ₉ ) ₄ , and others.

As the alkoxide represented by the general formula R ¹ _n M (OR ² ) _m , an aluminum alkoxide in which M is Al can be used. For example, tetramethoxyaluminum Al (OCH ₃ ) ₄ , tetraethoxyaluminum _{Al (OC 2 H 5) 4} , tetraisopropoxy aluminum _{Al (is0-OC 3 H 7} ) 4, tetra-n-butoxy aluminum _{Al (OC 4 H 9) 4} , may use other like.

  In the present invention, two or more of the alkoxides may be used in combination. For example, when alkoxysilane and zirconium alkoxide are mixed and used, the toughness, heat resistance and the like of the resulting gas barrier laminate film can be improved, and a decrease in the retort resistance of the film during stretching can be avoided. Under the present circumstances, the usage-amount of a zirconium alkoxide is the range of 10 mass parts or less with respect to 100 mass parts of said alkoxysilanes. When the amount exceeds 10 parts by mass, the formed gas barrier coating film tends to gel, and the brittleness of the film increases, and the gas barrier coating film tends to peel off when the base film is coated. This is not desirable.

  In addition, when alkoxysilane and titanium alkoxide are mixed and used, the thermal conductivity of the resulting gas barrier coating film is lowered, and the heat resistance is remarkably improved. Under the present circumstances, the usage-amount of a titanium alkoxide is the range of 5 mass parts or less with respect to 100 mass parts of said alkoxysilane. When the amount exceeds 5 parts by mass, the brittleness of the formed gas barrier coating film increases, and the gas barrier coating film may be easily peeled off when the base film is coated.

  As the polyvinyl alcohol resin and / or ethylene / vinyl alcohol copolymer used in the present invention, a polyvinyl alcohol resin or an ethylene / vinyl alcohol copolymer can be used alone, respectively, or polyvinyl alcohol A single resin and an ethylene / vinyl alcohol copolymer can be used in combination. In the present invention, physical properties such as gas barrier properties, water resistance, weather resistance, and the like can be remarkably improved by using a polyvinyl alcohol resin and / or an ethylene / vinyl alcohol copolymer.

  When the polyvinyl alcohol resin and the ethylene / vinyl alcohol copolymer are used in combination, the blending ratio of each is polyvinyl alcohol resin: ethylene / vinyl alcohol copolymer = 10: 0. It is preferable that the position is from 05 to 10: 6.

  The content of the polyvinyl alcohol resin and / or the ethylene / vinyl alcohol copolymer is in the range of 5 to 500 parts by mass, preferably 20 to 200 parts by mass with respect to 100 parts by mass of the total amount of the alkoxide. The blending ratio of When it exceeds 500 parts by mass, the brittleness of the gas barrier coating film becomes large, and the water resistance and weather resistance of the resulting barrier film may be lowered. On the other hand, if it is less than 5 parts by mass, the gas barrier property may be lowered.

  In the polyvinyl alcohol resin and / or ethylene / vinyl alcohol copolymer, as the polyvinyl alcohol resin, one obtained by saponifying polyvinyl acetate can be generally used. Polyvinyl alcohol resins include partially saponified polyvinyl alcohol resins in which several tens of percent of acetate groups remain, completely saponified polyvinyl alcohols in which no acetate groups remain, and modified polyvinyl alcohol resins in which OH groups have been modified. Well, not particularly limited. Examples of such a polyvinyl alcohol resin include “RS-110 (degree of saponification = 99%, degree of polymerization = 1,000)” manufactured by Kuraray Co., Ltd., and “Kuraray Poval LM-20SO ( “Saponification degree = 40%, polymerization degree = 2,000)”, “GOHSENOL NM-14 (degree of saponification = 99%, polymerization degree = 1,400)” manufactured by Nippon Synthetic Chemical Industry Co., Ltd. Can do.

  As the ethylene / vinyl alcohol copolymer, a saponified product of a copolymer of ethylene and vinyl acetate, that is, a product obtained by saponifying an ethylene-vinyl acetate random copolymer can be used. For example, it is not particularly limited, and includes a partially saponified product in which several tens mol% of acetic acid groups remain to a complete saponified product in which only several mol% of acetic acid groups remain or no acetic acid groups remain. However, it is preferable to use a saponification degree that is preferably 80 mol% or more, more preferably 90 mol% or more, and still more preferably 95 mol% or more from the viewpoint of gas barrier properties. In addition, the content of the repeating unit derived from ethylene in the ethylene / vinyl alcohol copolymer (hereinafter also referred to as “ethylene content”) is usually 0 to 50 mol%, preferably 20 to 45 mol%. It is preferable. Examples of such an ethylene / vinyl alcohol copolymer include “Eval EP-F101 (ethylene content; 32 mol%)” manufactured by Kuraray Co., Ltd., “Soarnol D2908 (ethylene content; 29 mol) manufactured by Nippon Synthetic Chemical Industry Co., Ltd.” %) "And the like.

The gas barrier composition used in the present invention has the general formula R ¹ _n M (OR ² ) _m (wherein R ¹ and R ² represent an organic group having 1 to 8 carbon atoms, M is Represents a metal atom, n represents an integer of 0 or more, m represents an integer of 1 or more, and n + m represents a valence of M.) And a gas barrier obtained by polycondensation by the sol-gel method in the presence of a sol-gel method catalyst, acid, water, and an organic solvent. Composition. In preparing the gas barrier composition, a silane coupling agent or the like may be added.

  As the silane coupling agent that can be suitably used in the present invention, known organic reactive group-containing organoalkoxysilanes can be widely used. For example, an organoalkoxysilane having an epoxy group is suitable. For example, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, or β- (3,4-epoxy). (Cyclohexyl) ethyltrimethoxysilane or the like can be used. Such silane coupling agents may be used alone or in combination of two or more. In addition, the usage-amount of a silane coupling agent exists in the range of 1-20 mass parts with respect to 100 mass parts of said alkoxysilanes. If 20 parts by mass or more is used, the gas barrier coating film to be formed has increased rigidity and brittleness, and the insulation and workability of the gas barrier coating film may be lowered.

  The sol-gel catalyst is a catalyst mainly used as a polycondensation catalyst, and a basic substance such as tertiary amine that is substantially insoluble in water and soluble in an organic solvent is used. For example, N, N-dimethylbenzylamine, tripropylamine, tributylamine, tripentylamine, etc. can be used. In the present invention, N, N-dimethylbenzylamine is particularly preferred. The usage-amount is 0.01-1.0 mass part per 100 mass parts of total amounts of an alkoxide and a silane coupling agent.

  The “acid” used in the gas barrier composition is mainly used as a catalyst for hydrolysis of an alkoxide, a silane coupling agent or the like in the sol-gel method. For example, mineral acids such as sulfuric acid, hydrochloric acid, and nitric acid, organic acids such as acetic acid and tartaric acid, and the like can be used. The amount of the acid used is preferably 0.001 to 0.05 mol based on the total molar amount of the alkoxide and the alkoxide content of the silane coupling agent (for example, silicate moiety).

  Furthermore, in the gas barrier composition, water can be used in a proportion of 0.1 to 100 mol, preferably 0.8 to 2 mol, relative to 1 mol of the total molar amount of the alkoxide. When the amount of water exceeds 2 mol, the polymer obtained from the alkoxysilane and the metal alkoxide becomes spherical particles, and the spherical particles are three-dimensionally crosslinked to form a porous polymer having a low density, Such a porous polymer cannot improve the gas barrier property of the gas barrier laminate film. Moreover, when the amount of the water is less than 0.8 mol, the hydrolysis reaction may hardly proceed.

  Furthermore, as an organic solvent used in said gas-barrier composition, methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butanol, etc. can be used, for example. The polyvinyl alcohol-based resin and / or the ethylene / vinyl alcohol copolymer is preferably handled in a state of being dissolved in a coating solution containing the alkoxide, silane coupling agent, or the like. It can be selected appropriately. For example, when a polyvinyl alcohol resin and an ethylene / vinyl alcohol copolymer are used in combination, it is preferable to use n-butanol. An ethylene / vinyl alcohol copolymer solubilized in a solvent can also be used. For example, trade name “Soarnol” manufactured by Nippon Synthetic Chemical Industry Co., Ltd. can be preferably used. The amount of the organic solvent used is usually 30 to 500 with respect to 100 mass of the total amount of the alkoxide, silane coupling agent, polyvinyl alcohol resin and / or ethylene / vinyl alcohol copolymer, acid and sol-gel catalyst. Part by mass.

In the present invention, the gas barrier laminate film can be produced by the following method.
First, an alkoxide such as alkoxysilane, a silane coupling agent, a polyvinyl alcohol resin and / or an ethylene / vinyl alcohol copolymer, a sol-gel catalyst, an acid, water, an organic solvent, and, if necessary, a metal alkoxide Etc. are mixed to prepare a gas barrier composition. By mixing, the gas barrier composition (coating liquid) starts and proceeds with a polycondensation reaction.

  Next, the gas barrier composition is applied onto the deposited film on the base film by a conventional method and dried. By this drying step, polycondensation of the alkoxide such as alkoxysilane, metal alkoxide, silane coupling agent, polyvinyl alcohol resin and / or ethylene / vinyl alcohol copolymer further proceeds, and a coating film is formed. . On the first coating film, the above coating operation may be further repeated to form a plurality of coating films composed of two or more layers.

  Next, the base film coated with the gas barrier composition is heated at 20 ° C. to 180 ° C. and below the melting point of the base film, preferably at a temperature in the range of 50 ° C. to 160 ° C. for 10 seconds to 10 minutes. To process. Thereby, a barrier film in which one or two or more gas barrier coating films of the gas barrier composition are formed on the vapor deposition film can be produced.

  A barrier film obtained by using an ethylene / vinyl alcohol copolymer alone or both a polyvinyl alcohol-based resin and an ethylene / vinyl alcohol copolymer is excellent in gas barrier properties after hydrothermal treatment. On the other hand, when a barrier film is produced using only a polyvinyl alcohol-based resin, a first coating film is formed by previously applying a gas barrier composition using a polyvinyl alcohol-based resin, On the coating film, a gas barrier composition containing an ethylene / vinyl alcohol copolymer is applied to form a second coating film, and when these composite layers are formed, the gas barrier properties after hydrothermal treatment It is possible to produce a barrier film with improved resistance.

  Further, a coating film is formed by the gas barrier composition containing the ethylene / vinyl alcohol copolymer, or the gas barrier composition containing a combination of the polyvinyl alcohol resin and the ethylene / vinyl alcohol copolymer is applied. Even if a film is formed and a plurality of these films are laminated, it becomes an effective means for improving the gas barrier property of the barrier film.

The production method of the gas barrier laminate film used in the present invention will be described in more detail using alkoxysilane as the alkoxide.
The alkoxysilane and metal alkoxide blended as the gas barrier composition are hydrolyzed by the added water. During the hydrolysis, the acid acts as a hydrolysis catalyst. Next, protons are taken from the hydroxyl groups generated by the hydrolysis by the action of the sol-gel catalyst, and the hydrolysis products are dehydrated and polycondensed. At this time, the silane coupling agent is simultaneously hydrolyzed by the acid catalyst, and the alkoxy group becomes a hydroxyl group.

  In addition, the opening of the epoxy group also occurs due to the action of the base catalyst, generating a hydroxyl group. In addition, a polycondensation reaction between the hydrolyzed silane coupling agent and the hydrolyzed alkoxide also proceeds. In the reaction system, polyvinyl alcohol resin, ethylene / vinyl alcohol copolymer, or polyvinyl alcohol resin and / or ethylene / vinyl alcohol copolymer are present, so polyvinyl alcohol resin and ethylene / vinyl alcohol copolymer are present. Reaction with the hydroxyl group of the polymer also occurs. In addition, the polycondensate to be generated includes, for example, an inorganic part composed of a bond such as Si—O—Si, Si—O—Zr, Si—O—Ti, and the like, and an organic part resulting from the silane coupling agent. It is a composite polymer containing.

  In the above reaction, for example, a linear polymer having a partial structural formula represented by the following formula (III) and further having a portion derived from a silane coupling agent is first formed.

このポリマーは、ＯＲ基（エトキシ基などのアルコキシ基）が、直鎖状のポリマーから分岐した形で有する。このＯＲ基は、存在する酸が触媒となって加水分解されてＯＨ基となり、ゾルゲル法触媒（塩基触媒）の働きにより、まず、ＯＨ基が、脱プロトン化し、次いで、重縮合が進行する。すなわち、このＯＨ基が、下記の式（Ｉ）に示されるポリビニルアルコール系樹脂、または、下記の式（ＩＩ）に示されるエチレン・ビニルアルコール共重合体と重縮合反応し、Ｓｉ−Ｏ−Ｓｉ結合を有する、例えば、下記の式（ＩＶ）に示される複合ポリマー、あるいは、下記の式（Ｖ）及び（ＶＩ）に示される共重合した複合ポリマーを生じると考えられる。

This polymer has an OR group (an alkoxy group such as an ethoxy group) branched from a linear polymer. The OR group is hydrolyzed to become an OH group using an existing acid as a catalyst, and the OH group is first deprotonated by the action of a sol-gel catalyst (base catalyst), and then polycondensation proceeds. That is, this OH group undergoes a polycondensation reaction with a polyvinyl alcohol-based resin represented by the following formula (I) or an ethylene / vinyl alcohol copolymer represented by the following formula (II) to form Si—O—Si. For example, it is considered that a composite polymer represented by the following formula (IV) or a copolymerized composite polymer represented by the following formulas (V) and (VI) is formed.

上記の反応は常温で進行し、ガスバリア性組成物は、調製中に粘度が増加する。このガスバリア性組成物を、基材フィルム上の前記蒸着膜の上に塗布し、加熱して溶媒および重縮合反応により生成したアルコールを除去すると重縮合反応が完結し、基材フィルム上の前記蒸着膜の上に透明な塗布膜が形成される。なお、上記の塗布膜を複数層積層する場合には、層間の塗布膜中の複合ポリマー同士も縮合し、層と層との間が強固に結合する。

The above reaction proceeds at room temperature, and the viscosity of the gas barrier composition increases during preparation. When this gas barrier composition is applied onto the vapor deposition film on the base film and heated to remove the solvent and the alcohol produced by the polycondensation reaction, the polycondensation reaction is completed, and the vapor deposition on the base film is completed. A transparent coating film is formed on the film. In addition, when laminating | stacking two or more said coating films, the composite polymer in the coating film of an interlayer is also condensed, and a layer couple | bonds firmly between layers.

  Furthermore, the surface of the vapor deposition film in which the organic reactive group of the silane coupling agent or the hydroxyl group generated by hydrolysis deposits the organic silicon compound, metal or metal oxide on the base film. Since it bonds to the hydroxyl group of the base film, the adhesion between the substrate film or the surface of the vapor deposition film and the coating film is also good. Thus, in the present invention, the vapor deposition film formed by vapor-depositing an organosilicon compound, a metal or a metal oxide and the gas barrier coating film are, for example, a chemical bond, a hydrogen bond, or a hydrolytic or co-condensation reaction. Since a coordination bond or the like is formed, the adhesion between the deposited film and the gas barrier coating film is improved, and a better gas barrier effect can be exhibited by the synergistic effect of the two layers.

In the present invention, when the amount of water added is adjusted to 0.8 to 2 mol, preferably 1.0 to 1.7 mol, relative to 1 mol of alkoxides, the above linear polymer is used. Is formed. Such a linear polymer has crystallinity and has a structure in which a large number of minute crystals are embedded in an amorphous part. Such a crystal structure is the same as that of a crystalline organic polymer (for example, vinylidene chloride or polyvinyl alcohol), and a polar group (OH group) is partially present in the molecule, and the molecular aggregation energy is high. Since the rigidity is also high, it is particularly excellent in gas barrier properties (blocking and blocking permeation of O ₂ , N ₂ , H ₂ O, CO ₂ , etc.). Further, the hydroxyl group can be chemically bonded to the adhesive resin layer to form a strong laminated structure.

  Examples of the method for applying the gas barrier composition of the present invention include, for example, once by a roll coater such as a gravure roll coater, spray coat, spin coat, dipping, brush, bar code, applicator or the like. A coating film having a dry film thickness of 0.01 to 30 μm, preferably about 0.1 to 10 μm, can be formed by applying a plurality of times. Further, under a normal environment, 50 to 300 ° C., preferably The gas barrier coating film of the present invention is formed by performing condensation at a temperature of 70 to 200 ° C. by heating and drying for 0.005 to 60 minutes, preferably 0.01 to 10 minutes. Can do.

  The gas barrier laminated film (II) used in the present invention forms the vapor deposition film (I) on the base film as described above, and then forms the gas barrier coating film (I), and further the vapor deposition film (II) by the above method. And a gas barrier coating film (II) formed by the above method and laminated. However, the vapor deposition films (I) and (II) may be the same or different. Similarly, the gas barrier coating films (I) and (II) may be the same or different. By alternately laminating the deposited film and the gas barrier coating film by two layers, the gas barrier property can be further improved. In addition, since the outermost layer of the obtained gas barrier laminate film is a gas barrier coating film (II), there is little risk of damaging the deposited films (I) and (II) when laminating to other films, A decrease in gas barrier properties can be prevented.

(5) Surface base film and intermediate base film In the present invention, the surface base film or the intermediate film between the outside of the gas barrier laminate film (II) or between the gas barrier laminate films (I) and (II) Other films such as an intermediate substrate film may be included.

  As such a film, the thing similar to the film which consists of resin which comprises the said base film can be used. More specifically, for example, a film made of a tough resin such as a polyester resin, a polyamide resin, a polyaramid resin, a polypropylene resin, a polycarbonate resin, a polyacetal resin, a fluorine resin, or the like may be used. it can. As the film, any of an unstretched film or a stretched film stretched in a uniaxial direction or a biaxial direction can be used. In the present invention, it is particularly preferable to use a stretched nylon film, a biaxially stretched polyethylene terephthalate film or a biaxially stretched polypropylene film. It is because it is excellent in pinhole resistance, rigidity, etc.

  Further, the thickness of the film may be a thickness that can be kept to the minimum necessary for strength, puncture resistance, rigidity, etc., and if it is too thick, there is a disadvantage of increasing the cost, If it is too thin, the strength, puncture resistance, rigidity, etc. will be undesirably lowered. In the present invention, 10 to 100 μm, preferably 12 to 50 μm is most desirable for the reasons described above.

(6) Print layer In this invention, you may form a print layer in any layer which comprises a high gas barrier laminated | multilayer film. It is preferable to perform back printing on the gas barrier coating films of the gas barrier laminated films (I) and (II) and the surface-treated surfaces thereof.

  The printing layer is composed of one or more ordinary ink vehicles as the main component, and if necessary, a plasticizer, a stabilizer, an antioxidant, a light stabilizer, an ultraviolet absorber, a curing agent, and a crosslinking agent. Add one or more additives such as additives, lubricants, antistatic agents, fillers, etc., add colorants such as dyes and pigments, and use solvents, diluents, etc. An ink composition obtained by kneading to prepare an ink composition can be used. As such an ink vehicle, known ones such as sesame oil, drill oil, soybean oil, hydrocarbon oil, rosin, rosin ester, rosin modified resin, shellac, alkyd resin, phenolic resin, maleic resin, Natural resin, hydrocarbon resin, polyvinyl chloride resin, polyacetic acid resin, polystyrene resin, polyvinyl butyral resin, acrylic or methacrylic resin, polyamide resin, polyester resin, polyurethane resin, epoxy resin, urea resin , Melamine resin, amino alkyd resin, nitrocellulose, ethyl cellulose, chlorinated rubber, cyclized rubber, etc. can be used alone or in combination.

The printing method may be a printing method such as relief printing, screen printing, transfer printing, flexographic printing, or the like in addition to gravure printing.
(7) Laminating adhesive In the present invention, a primer is applied to the surface of the gas barrier coating film to form a primer layer, and then a base such as a heat seal layer is applied to the surface of the primer layer via a laminating adhesive. The materials can be laminated using a dry laminate lamination method. In addition, when any two layers are laminated, they can be adhered by a dry laminate lamination method via a laminating adhesive.

  The adhesive for laminating comprises a polyvinyl acetate adhesive, a homopolymer such as ethyl acrylate, butyl, 2-ethylhexyl ester or a copolymer of these with methyl methacrylate, acrylonitrile, styrene, etc. Polyacrylate adhesives, cyanoacrylate adhesives, ethylene copolymer adhesives made of copolymers of ethylene and monomers such as vinyl acetate, ethyl acrylate, acrylic acid, methacrylic acid, etc., cellulose adhesives Polyester adhesive, polyamide adhesive, polyimide adhesive, amino resin adhesive made of urea resin or melamine resin, phenol resin adhesive, epoxy adhesive, polyurethane adhesive, reactive type (meta ) Acrylic acid adhesive, chloroprene rubber, nitrile Beam, styrene - inorganic adhesive made of butadiene rubber, a silicone-based adhesive, an alkali metal silicate, inorganic adhesive made of low-melting glass, it is possible to use other adhesives. In the present invention, an adhesive for polyurethane-based laminate can be preferably used. It is because it is excellent in adhesiveness and flexibility.

  The composition system of these adhesives may be any composition form such as an aqueous type, a solution type, an emulsion type, and a dispersion type, and the property may be any of a film, a sheet, a powder, a solid, and the like. Furthermore, the reaction mechanism may be any of a chemical reaction type, a solvent volatilization type, a heat welding type, a hot pressure type, and the like.

Although there is no limitation in the usage-amount of the adhesive agent for lamination, Generally, it is 0.1-10 g / m < ² > (dry state). The laminating adhesive can be applied by roll coating, gravure coating, kiss coating or other coating methods or printing methods.

(8) Anchor coat agent In the present invention, for example, a heat seal layer may be formed by extrusion, and in that case, the heat seal layer can be formed via the anchor coat agent. Examples of the anchor coating agent to be used include isocyanate (urethane), polyethyleneimine, polybutadiene, organic titanium, and other anchor coating agents. More preferably, for example, aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, polymethylene polyphenylene polyisocyanate, or aliphatic polyisocyanates such as hexamethylene diisocyanate, xylylene diisocyanate, etc. Mainly used are polyether polyurethane resins, polyester polyurethane resins, and polyacrylate polyurethane resins obtained by reacting polyfunctional isocyanates with polyether polyols, polyester polyols, polyacrylate polyols, and other hydroxyl group-containing compounds. Ingredients. According to these, a thin film rich in flexibility and flexibility can be formed, its tensile elongation is improved, and it acts as a film having flexibility, flexibility, etc. on the above-mentioned thin film, and laminating , Improving processability such as printing, avoiding the occurrence of cracks in the thin film layer, improving the tight adhesion between the gas barrier laminate film (I) and the heat seal layer, and the above thin film Generation of cracks can be prevented, and the laminate strength can be improved.

Although there is no limitation in particular in the usage-amount of an anchor coating agent, generally it is 0.1-5 g / m < ² > (dry state).
(9) Manufacturing method of high gas barrier laminate film The high gas barrier laminate film of the present invention is prepared by preparing gas barrier laminate films (I) and (II) in advance, and the polyamide film and heat seal layer of the gas barrier laminate film (I) The gas barrier laminate film (II) is laminated in advance on the gas barrier laminate film (I), and the gas barrier laminate film (II) / adhesive layer. / Gas barrier laminate film (I) / Adhesive layer / Heat seal layer may be configured, and further includes gas barrier laminate film (II), Gas barrier laminate film (II) / Adhesive layer / Gas barrier laminate film (II) / Adhesive layer / Gas barrier laminate film (I) / Adhesive layer / Heat seal layer. In addition, when the said gas-barrier laminated | multilayer film (I) and (II) are marketed, a commercial item can also be used.

In the present invention, when any film or layer is laminated, if necessary, pretreatment such as corona treatment or ozone treatment can be applied to the film as described above. Vinyl adhesives, homopolymers such as ethyl acrylate, butyl, 2-ethylhexyl ester, etc., or polyacrylate adhesives composed of copolymers of these with methyl methacrylate, acrylonitrile, styrene, etc., cyano Acrylate adhesive, ethylene copolymer adhesive consisting of copolymer of ethylene and monomers such as vinyl acetate, ethyl acrylate, acrylic acid, methacrylic acid, cellulose adhesive, polyester adhesive, polyamide adhesive Agent, polyimide adhesive, amino resin adhesive made of urea resin or melamine resin, etc. Knoll resin adhesive, epoxy adhesive, polyurethane adhesive, reactive (meth) acrylic adhesive, chloroprene rubber, nitrile rubber, styrene-butadiene rubber rubber adhesive, silicone adhesive, alkali An inorganic adhesive made of metal silicate, low-melting glass, or the like, or other adhesives can be used. The composition system of the adhesive may be in the form of any composition such as aqueous type, solution type, emulsion type, and dispersion type, and the property may be any form such as film / sheet form, powder form, solid form, etc. In addition, the bonding mechanism may be any form such as a chemical reaction type, a solvent volatilization type, a heat melting type, and a hot pressure type. The adhesive can be applied by a coating method such as a roll coating method, a gravure roll coating method, a kiss coating method, or the like, or a printing method. The film thickness of the adhesive layer for dry lamination is desirably thin so as to obtain a so-called hardness, waist texture, softness, etc. as a laminate, and is 0.1 to 5 g / m ^2. (Dry state), preferably 0.1-3 g / m ² (dry state).

(10) Manufacturing method of packaging container The packaging container of the present invention can be manufactured by bag-making the high gas barrier laminated film. The bag body can be manufactured by using the above-mentioned high gas barrier laminated film and superimposing the surfaces of the heat seal layer facing each other, and then heat sealing the peripheral end portion to form a seal portion. As the bag making method, the high gas barrier laminated film according to the present invention as described above is folded or overlapped so that the inner layer faces each other, and the peripheral edge thereof is, for example, a side seal type, two Heat seal forms such as side seal type, three side seal type, four side seal type, envelope sticker seal type, joint seal seal type (pillow seal type), pleated seal type, flat bottom seal type, square bottom seal type, gusset type, etc. The packaging container according to the present invention can be manufactured by heat sealing. In addition, for example, a self-supporting packaging bag (standing pouch) is also possible.

  In the above, as a heat sealing method, for example, a known method such as a bar seal, a rotary roll seal, a belt seal, an impulse seal, a high frequency seal, and an ultrasonic seal can be used.

  In the present invention, if, for example, the contents are filled from the opening of the bag body and then vacuum-packed while degassing and depressurizing the air in the container, it remains in the packaging container. Oxidation due to oxygen or the like can be efficiently prevented.

  The high gas barrier laminate film according to the present invention has strength and the like, is excellent in durability, and is excellent in heat resistance, moisture resistance, heat sealability, pinhole resistance, puncture resistance, transparency, and the like. It has excellent barrier properties to prevent permeation of oxygen gas, water vapor, etc., its contents are suitable for packaging and storage, storage, etc. Furthermore, after use, packaging containers are hazardous substances when incinerated and discarded. And the like, and has the advantage of being extremely excellent in disposal processing suitability, environmental suitability, and the like.

EXAMPLES Next, although an Example is given and this invention is demonstrated concretely, these Examples do not restrict | limit this invention at all.
Production Example 1
(1) A biaxially stretched polyethylene terephthalate film having a thickness of 12 μm, which has been corona-treated on one side, is mounted on a feed roll of a take-up vacuum deposition apparatus, and then fed, and then corona treatment of the above biaxially stretched polyethylene terephthalate film Aluminum oxide was supplied to the surface, an aluminum oxide vapor deposition film having a thickness of 200 mm was formed, and plasma treatment was performed on the aluminum oxide vapor deposition film surface. Then, according to the composition shown in Table 1 below, the composition a. Composition prepared in advance in an EVOH solution prepared by dissolving an ethylene-vinyl alcohol copolymer (EVOH, ethylene copolymerization ratio 29%) in a mixed solvent of isopropyl alcohol and ion-exchanged water b. A hydrolyzate composed of ethyl silicate 40, isopropyl alcohol, acetylacetone aluminum, and ion-exchanged water, followed by stirring, and a composition prepared in advance c. A liquid mixture composed of polyvinyl alcohol, acetic acid, isopropyl alcohol and ion-exchanged water was added and stirred to obtain a colorless and transparent gas barrier composition.

前記プラズマ処理層の上に、上記で製造したガスバリア性組成物をコーティングして厚さ０．４ｇ／ｍ²（乾操状態）のガスバリア性塗布膜を形成した。

On the plasma treatment layer, the gas barrier composition produced above was coated to form a gas barrier coating film having a thickness of 0.4 g / m ² (in the dry operation state).

  (2) Next, aluminum oxide is supplied to the surface of the gas barrier coating film of the gas barrier laminate film formed above using the vacuum deposition apparatus to form an aluminum oxide vapor deposition film having a thickness of 200 mm, A gas barrier coating film was formed on the aluminum oxide deposition film in the same manner as described above to produce a gas barrier laminated film (I).

Production Example 2
A biaxially stretched polyamide film having a thickness of 15 μm, which is corona-treated on one side, is mounted on a feeding roll of a plasma chemical vapor deposition apparatus, and then an organic silicon is coated on the corona-treated surface of the biaxially stretched polyamide film. Hexamethyldisiloxane (hereinafter referred to as HMDSO) as a compound was supplied to form a vapor-deposited film having a thickness of 200 mm, and plasma treatment was performed on the surface of the vapor-deposited film. Then, according to the composition shown in Table 2 below, the composition a. Composition prepared in advance in EVOH solution in which EVOH (ethylene copolymerization ratio 29%) was dissolved in a mixed solvent of isopropyl alcohol and ion-exchanged water b. A hydrolyzed solution composed of ethyl silicate 40, isopropyl alcohol, acetylacetone aluminum, and ion-exchanged water, and stirred, and further prepared in advance c. A mixture of polyvinyl alcohol aqueous solution, silane coupling agent (epoxysilica SH6040), acetic acid, isopropyl alcohol and ion-exchanged water was added and stirred to obtain a colorless and transparent barrier coating solution.

前記プラズマ処理面に、上記で製造したガスバリア性組成物をコーティングして厚さ０．４ｇ／ｍ²（乾操状態）のガスバリア性塗布膜を形成し、ガスバリア性積層フィルム（ＩＩ）を製造した。

The plasma-treated surface was coated with the gas barrier composition produced above to form a gas barrier coating film having a thickness of 0.4 g / m ² (in the dry operation state) to produce a gas barrier laminated film (II). .

Production Example 3
On the surface of the gas barrier coating film of the gas barrier laminate (II) produced in Production Example 2, hexamethyldisiloxane (hereinafter referred to as HMDSO) which is an organosilicon compound is supplied using the plasma chemical vapor deposition apparatus. Then, a vapor-deposited film having a thickness of 200 mm was formed, and a gas-barrier coating film was further formed on the vapor-deposited film in the same manner as described above to produce a gas-barrier laminated film (III).

Example 1
An adhesive for dry lamination is applied to the sol-gel barrier coat of the gas barrier laminate film (I) produced in Production Example 1, and the sol-gel barrier coat of the gas barrier laminate film (I) prepared separately is laminated, and then PET An adhesive for dry lamination was applied to the film side. The sol-gel barrier coat side of the gas barrier laminate film (II) produced in Production Example 2 was laminated on this adhesive layer. Thereafter, an adhesive for dry lamination was applied to the polyamide film side of the gas barrier laminate film (II), and LLDPE (product name “TUX-VCS” manufactured by Tosero Co., Ltd.) having a thickness of 40 μm was laminated. A high gas barrier laminate film (I) was produced. The layer structure of this high gas barrier laminate film is PET ¹² / aluminum oxide deposition film / sol-gel barrier coating / aluminum oxide deposition film / sol-gel barrier coating / adhesive / sol-gel barrier coating / aluminum oxide deposition film / sol-gel barrier coating / Aluminum oxide vapor deposition film / PET ¹² / adhesive / sol-gel barrier coating / CVD-silicon oxide vapor deposition film / ON ¹⁵ / adhesive / LLDPE film ⁴⁰ .

  The oxygen permeability and water vapor permeability of the high gas barrier laminate film (I) were measured. Moreover, using this high gas barrier laminated film (I), the number of pinholes after a bending test by a gelbo flex tester was evaluated as an evaluation of pinhole resistance. The results are shown in Table 3.

Example 2
An adhesive for dry lamination is applied to the sol-gel barrier coat of the gas barrier laminate film (III) produced in Production Example 3, and the sol-gel barrier coat of the gas barrier laminate film (I) prepared separately is laminated, and then PET An adhesive for dry lamination was applied to the film side. The sol-gel barrier coat side of the gas barrier laminate film (II) produced in Production Example 2 was laminated on this adhesive layer. Thereafter, an adhesive for dry lamination was applied to the polyamide film side of the gas barrier laminate film (II), and LLDPE (product name “TUX-VCS” manufactured by Tosero Co., Ltd.) having a thickness of 40 μm was laminated. A high gas barrier laminate film (II) was produced. The layer structure of this high gas barrier laminate film is PET ¹² / CVD-silicon oxide vapor deposition film / sol-gel barrier film / CVD-silicon oxide vapor deposition film / sol-gel barrier coat / adhesive / sol-gel barrier coat / CVD-silicon oxide vapor deposition Film / sol-gel-based barrier coat / CVD-silicon oxide deposited film / PET ¹² / adhesive / sol-gel-based barrier coat / CVD-silicon oxide deposited film / ON ¹⁵ / adhesive / LLDPE film ⁴⁰ .

About this high gas barrier laminated film (II), it operated similarly to Example 1 and evaluated oxygen permeability, water vapor permeability, and pinhole resistance. The results are shown in Table 3.
Example 3
Applying an adhesive for dry lamination to the sol-gel barrier coat of the gas barrier laminate film (I) produced in Production Example 1, laminating the sol-gel barrier coat of the gas barrier laminate film (II) produced in Production Example 2, Next, an adhesive for laminating was applied to the polyamide film side, and then a 40 μm thick LLDPE (manufactured by Tosero Co., Ltd., trade name “TUX-VCS”) was laminated to produce a high gas barrier laminated film (III). . The layer structure of this high gas barrier laminated film is PET ¹² / aluminum oxide vapor deposition film / sol-gel-based barrier coat / aluminum oxide vapor-deposited film / sol-gel-based barrier coat / adhesive / sol-gel-based barrier coat / CVD-silicon oxide vapor-deposited film / ON ¹⁵ / Adhesive / LLDPE film ⁴⁰ .

About this high gas barrier laminated film (III), it operated similarly to Example 1 and evaluated oxygen permeability, water vapor permeability, and pinhole resistance. The results are shown in Table 3.
Comparative Example 1
The adhesive for dry lamination is applied to the sol-gel barrier coat of the gas barrier laminate film (I) produced in Production Example 1, and the sol-gel barrier coat of the gas barrier laminate film (I) prepared separately is laminated, and then PET A dry laminating adhesive was applied to the film side, and then a 40 μm thick LLDPE (manufactured by Tosero Co., Ltd., trade name “TUX-VCS”) was laminated to produce a comparative high gas barrier laminated film (I). The layer structure of this comparative high gas barrier laminate film is PET ¹² / aluminum oxide vapor deposition film / sol-gel barrier coating / aluminum oxide vapor deposition film / sol-gel barrier coat / adhesive / sol-gel barrier coat / aluminum oxide vapor deposition film / sol-gel barrier Coat / aluminum oxide vapor deposition film / PET ¹² / adhesive / LLDPE film ⁴⁰ .

About this comparative high gas barrier laminated film (I), it carried out similarly to Example 1, and evaluated oxygen permeability, water vapor permeability, and pinhole resistance. The results are shown in Table 3.
Comparative Example 2
An adhesive for dry lamination is applied to the sol-gel barrier coat of the gas barrier laminate film (I) produced in Production Example 1, and the sol-gel barrier coat of the gas barrier laminate film (I) prepared separately is laminated, and then PET An adhesive for dry lamination was applied to the film side. The sol-gel barrier coat side of the gas barrier laminate film (II) produced in Production Example 2 was laminated on this adhesive layer. After that, an adhesive for dry lamination was applied to the polyamide film side of the gas barrier laminate film (II), and a 40 μm thick CPP (product name “TAF502C” manufactured by Tosero Co., Ltd.) was laminated. (II) was produced. The layer structure of this comparative high gas barrier laminate film is PET ¹² / aluminum oxide vapor deposition film / sol-gel barrier coating / aluminum oxide vapor deposition film / sol-gel barrier coat / adhesive / sol-gel barrier coat / aluminum oxide vapor deposition film / sol-gel barrier Coat / aluminum oxide vapor deposition film / PET ¹² / adhesive / sol-gel type barrier coat / CVD-silicon oxide vapor deposition film / ON ¹⁵ / adhesive / CPP film ⁴⁰ .

  About this comparative high gas barrier laminated film (II), it operated similarly to Example 1 and evaluated oxygen permeability, water vapor permeability, and pinhole resistance. The results are shown in Table 3.

（１） 酸素透過度の測定
温度２３℃、湿度９０％ＲＨの条件で、米国、モコン（ＭＯＣＯＮ）社製の測定機〔機種名、オクストラン（ＯＸＴＲＡＮ）〕にて測定した。

(1) Measurement of oxygen permeability Measurement was carried out with a measuring instrument (model name, OXTRAN) manufactured by MOCON, USA under the conditions of a temperature of 23 ° C. and a humidity of 90% RH.

(2) Measurement of water vapor permeability Measurement was performed with a measuring instrument (model name, Permatran 3/31) manufactured by MOCON, USA, under conditions of a temperature of 40 ° C. and a humidity of 90% RH.

(3) Pinhole Resistance Evaluation The number of pinholes after bending 2000 times with a gelbo flex tester (manufactured by Toyo Seiki Seisakusho) was evaluated.

  The high gas barrier laminate film of the present invention is excellent in gas barrier properties and transparency, excellent in mechanical strength and pinhole resistance, and can maintain high gas barrier properties in actual use.

FIG. 1 is a diagram illustrating the layer structure of the high gas barrier laminate film of the present invention. FIG. 2 is a diagram for explaining the layer structure of the high gas barrier laminate film of the present invention, in which two gas barrier laminate films (II) and (40) are laminated to face each other, and further, the gas barrier laminate film (I) ( It is a figure which shows the aspect which laminates | stacks 30) and the gas-barrier coating film (35) and base film (10) of gas-barrier laminated film (I) (30) facing each other. It is a schematic block diagram which shows an example of a low temperature plasma chemical vapor deposition apparatus. It is a schematic block diagram which shows an example of a winding-type vacuum deposition apparatus.

Explanation of symbols

10 ... heat seal layer,
20: Adhesive resin layer,
30 ... Gas barrier laminate film (I),
31 ... Polyamide film,
33 ... Vapor deposition layer formed by vapor-depositing an organosilicon compound,
35 ... gas barrier coating film,
40 ... gas barrier laminate film (II),
41 ... base film 43 ... vapor deposition layer formed by vapor-depositing an organosilicon compound, metal or metal oxide,
45 ... Gas barrier coating film,
47 ... Vapor deposition layer formed by vapor-depositing an organosilicon compound, metal or metal oxide,
49 ... Gas barrier coating film

Claims (6)

A high gas barrier laminate film having a heat seal layer and two or more gas barrier laminate films,
The heat seal layer is composed of a linear low density polyethylene film,
At least one of the gas barrier laminate films is provided with a vapor deposition film obtained by supplying an organosilicon compound by a chemical vapor deposition method on a polyamide film, and a general formula R ¹ _n M (OR ²⁾ is formed on the surface of the vapor deposition film. ) _m (where in the formula, R ^1, R ² represents an organic group having 1 to 8 carbon atoms, M represents a metal atom, n is an integer of 0 or more, m is 1 or more Represents an integer, and n + m represents the valence of M.) and contains a polyvinyl alcohol resin and / or an ethylene / vinyl alcohol copolymer, and further includes a sol-gel method. A gas barrier laminate film (I) provided with a gas barrier coating film of a gas barrier composition obtained by polycondensation by
The high gas barrier laminate film, wherein the heat seal layer and the polyamide film of the gas barrier laminate film (I) are bonded to face each other. The two or more gas barrier laminate films include the gas barrier laminate film (I) and the gas barrier laminate film (II),
The gas barrier laminate film (II) is provided with a vapor deposition film (I) formed by vapor-depositing an organosilicon compound, a metal or a metal oxide on one surface of a base film, and the general formula R ¹ _n is formed on the vapor deposition film. M (OR ² ) _m (wherein R ¹ and R ² represent an organic group having 1 to 8 carbon atoms, M represents a metal atom, n represents an integer of 0 or more, and m represents 1 or an integer greater than or equal to 1 and n + m represents the valence of M.) and contains at least one alkoxide represented by: a polyvinyl alcohol-based resin and / or an ethylene / vinyl alcohol copolymer; Further, a gas barrier coating film (I) made of a gas barrier composition obtained by polycondensation by a sol-gel method is provided, and vapor deposition is performed by depositing an organosilicon compound, metal or metal oxide on the gas barrier coating film (I). A film (II) is provided, and the deposited film (I ) General formula R ¹ _n M (OR ² on) _m (where in the formula, R ^1, R ² represents an organic group having 1 to 8 carbon atoms, M represents a metal atom, n is 0 And m represents an integer of 1 or more, and n + m represents a valence of M.), at least one alkoxide represented by the following formula: polyvinyl alcohol resin and / or ethylene / vinyl alcohol 2. A gas barrier laminate film comprising a copolymer and further provided with a gas barrier coating film (II) made of a gas barrier composition obtained by polycondensation by a sol-gel method. High gas barrier laminated film.   The high gas barrier laminate film according to claim 1 or 2, wherein at least one of the gas barrier laminate film (I) and the gas barrier laminate film (II) is laminated two or more.   The high gas barrier laminate film according to any one of claims 1 to 3, wherein the heat seal layer and the gas barrier laminate film (I) are laminated by a dry laminate method.   A packaging container comprising the high gas barrier laminated film according to claim 1.   The packaging container according to claim 5, which is used for an electronic component.

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