JP2009222729A - Current sensor - Google Patents

Current sensor Download PDF

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Publication number
JP2009222729A
JP2009222729A JP2009162831A JP2009162831A JP2009222729A JP 2009222729 A JP2009222729 A JP 2009222729A JP 2009162831 A JP2009162831 A JP 2009162831A JP 2009162831 A JP2009162831 A JP 2009162831A JP 2009222729 A JP2009222729 A JP 2009222729A
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JP
Japan
Prior art keywords
core
current sensor
hall element
substrate
shown
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009162831A
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Japanese (ja)
Inventor
Shinichi Tamura
真一 田村
Original Assignee
Yazaki Corp
矢崎総業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Yazaki Corp, 矢崎総業株式会社 filed Critical Yazaki Corp
Priority to JP2009162831A priority Critical patent/JP2009222729A/en
Publication of JP2009222729A publication Critical patent/JP2009222729A/en
Application status is Pending legal-status Critical

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a current sensor capable of preventing to the utmost a relative misalignment with a magnetoelectric transducer caused by the misalignment of a core, and reducing dispersion in the characteristics. <P>SOLUTION: The current sensor houses a core 10, with a gap 10a and a Hall element 15 disposed in the gap 10a of the core 10 in a part housing chamber 3 of a case body 4, and the part housing chamber 3 is filled with a molding material. The Hall element 15 is provided as the current sensor 1A, mounted on a circuit board 13B housed in the part housing the chamber 3, and a hole 20 disposed on the circuit board 13B is arranged near the Hall element 15. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a current sensor that detects the magnitude of a current passing through a current detector using a magnetoelectric conversion element such as a Hall element.

  Such conventional current sensors include those shown in FIGS.

  As shown in FIGS. 8 and 9, the case 101 of the current sensor 100 includes a case main body 103 in which a component housing chamber 102 is formed, and a lid (not shown) that is fixed to the upper surface and closes the component housing chamber 102. Z)). A through hole 104 through which the bus bar 110 as a current detector passes is formed in the center of the case main body 103 and the lid (not shown), and the bus bar 110 is fixed in the through hole 104. A detection current is applied to the bus bar 110.

  The component storage chamber 102 stores a core 105 and a substrate 106. The core 105 has a substantially rectangular frame shape, and a gap 105a is formed at one location. A Hall element 107 that is a magnetoelectric conversion element is mounted on the substrate 106, and the Hall element 107 is disposed in the gap 105 a of the core 105. The inside of the component storage chamber 102 is filled with a molding agent (not shown) that is injected after the core 105 and the substrate 106 are arranged at predetermined positions. By filling the molding agent, the core 105 and the hall element 107 can be prevented from being displaced and protected.

  In the above configuration, when a detection current is passed through the bus bar 110, a magnetic field proportional to the current is generated in the core 105, and the Hall element 107 outputs a voltage value proportional to the magnitude of the generated magnetic field. As described above, the magnitude of the detection current is detected.

  A technique similar to the conventional example is disclosed in, for example, Patent Document 1.

JP-A-6-235735

  Incidentally, as shown in FIG. 9, the inner wall surface 103 a and the outer wall surface 103 b that partition the core housing region of the component housing chamber 102 are set so as to have predetermined gaps d <b> 1 and d <b> 2 with respect to the inner and outer peripheral surfaces of the core 105. This is to prevent the molding agent from flowing through the molding agent (not shown) to create a space, or to prevent the formation of bubbles due to the small amount of the molding agent to be spread. This is for securing by d1 and d2.

  However, since there are predetermined gaps d1 and d2 between the inner wall surface 103a and outer wall surface 103b of the case 103 and the core 105, when a molding agent (not shown) is injected, the core receives the fluid pressure of the molding agent. 105 causes misalignment. When the position of the core 105 is shifted, a relative position shift with respect to the core 105 hall element 107 occurs, and there is a problem that the characteristics of the hall element 107 vary.

  Therefore, the present invention has been made to solve the above-described problems, and provides a current sensor that can prevent relative displacement from the magnetoelectric conversion element due to displacement of the core as much as possible, and can reduce variation in characteristics. The purpose is to do.

  According to the first aspect of the present invention, a core having a gap and a magnetoelectric conversion element disposed in the gap of the core are accommodated in a component accommodating chamber in a case, the component accommodating chamber is filled with a molding agent, The magnetoelectric conversion element is a current sensor mounted on a substrate accommodated in the component housing chamber, and an opening provided in the substrate is provided in the vicinity of the magnetoelectric conversion element. .

  In this current sensor, by injecting the molding agent from the opening of the substrate, it is possible to prevent bubbles from being generated in the lower region of the substrate, that is, around the magnetoelectric transducer. Further, even if a molding agent is injected into the component housing chamber from other than the opening of the substrate and bubbles are generated in the lower region of the substrate, that is, around the magnetoelectric conversion element, the generated bubbles escape through the opening.

  In addition, bubbles generated in the vicinity of the magnetoelectric conversion element surely come out from the opening.

  The invention according to claim 2 is the current sensor according to claim 1, wherein the case is provided with a through-hole penetrating the center of the core, and a detection current is passed through the through-hole. Is fixed.

  In this current sensor, the relative position between the current detector and the core does not vary due to vibration or the like.

  According to the first aspect of the present invention, by injecting the molding agent from the opening of the substrate, bubbles can be prevented from being generated in the lower region of the substrate, that is, around the magnetoelectric transducer. Further, even if a molding agent is injected into the component housing chamber from other than the opening of the substrate and bubbles are generated in the lower region of the substrate, that is, around the magnetoelectric conversion element, the generated bubbles escape through the opening. Therefore, it is possible to prevent the bubbles generated around the magnetoelectric conversion element from expanding due to the temperature rise, and the magnetoelectric conversion element from being displaced by the expanded bubbles, thereby improving the output stability and reliability.

  In addition, bubbles generated in the vicinity of the magnetoelectric conversion element surely come out from the opening. Therefore, the displacement of the magnetoelectric transducer due to the expanded bubbles can be reliably prevented, and the output stability and reliability are further improved.

  According to the invention of claim 2, in addition to the effect of the invention of claim 1, the relative position between the current detector and the core does not fluctuate due to vibration or the like. Therefore, a predetermined output characteristic is always obtained from the magnetoelectric conversion element, and the reliability of the detection output is improved.

1 is an exploded perspective view of a current sensor according to a first embodiment of the present invention. It is a partial perspective view which shows the 1st and 2nd position control protrusion of the current sensor which concerns on 1st Embodiment of this invention. It is a partial cross section figure which shows the 1st and 2nd position control protrusion of the current sensor which concerns on 1st Embodiment of this invention. It is an expanded sectional view which shows the control range of the 1st position control protrusion which concerns on 1st Embodiment of this invention. It is a perspective view of the current sensor which concerns on 2nd Embodiment of this invention. It is a perspective view of the board | substrate in the current sensor which concerns on 2nd Embodiment of this invention. It is sectional drawing which shows the state from which the bubble generate | occur | produced under the board | substrate in the electric current sensor which concerns on 2nd Embodiment of this invention escapes. It is a disassembled perspective view of the conventional current sensor. It is principal part sectional drawing of the conventional current sensor.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
1 to 4 show a first embodiment of the present invention, FIG. 1 is an exploded perspective view of a current sensor 1A, and FIG. 2 is a first and second position regulating protrusion 11a, 11b, 12a, 12b of the current sensor 1A. FIG. 3 is a cross-sectional view of the main part showing the first and second position restricting protrusions 11a, 11b, 12a and 12b of the current sensor 1A, and FIG. 4 is the restricting range of the first position restricting protrusions 11a and 11b. FIG.

  As shown in FIG. 1, the case 2 of the current sensor 1 </ b> A includes a case main body 4 in which a component housing chamber 3 is formed, and a lid (not shown) that is fixed to the upper surface and closes the component housing chamber 3. It is composed of A through hole 5 is formed in the center of the case body 4 and the lid (not shown). The bus bar 6 that is a current detection body is integrally fixed to the through hole 5 in a state of passing therethrough. In the bus bar 6, a detection current is applied to the bus bar 6 disposed so as to penetrate the center of the core 10 described later.

  As shown in FIG. 1, the component housing chamber 3 is formed by being surrounded by an inner wall portion 4a and an outer wall portion 4b. The inner peripheral side of the bottom surface of the component housing chamber 3 is formed on the low step surface 7, and a part of the outside of the low step surface 7 is formed on the high step surface 8 higher than the low step surface 7. A step wall surface 4 c is formed between the low step surface 7 and the high step surface 8.

  The low step surface 7 of the component housing chamber 3 has a rectangular frame shape, and the core 10 is accommodated in the rectangular frame shape region. The core 10 is formed of a rectangular frame-shaped ferromagnetic material having a gap 10 a, and forms a magnetic path by an energization current to the bus bar 6. Further, as shown in FIG. 3, the inner wall portion 4 a, a part of the outer wall portion 4 b and the stepped wall surface 4 c forming the core housing area of the component housing chamber 3 are respectively separated from the core 10 by predetermined gaps d 1, d 2 ( It is set to a dimension capable of being shown in FIG. That is, the flow path of the molding agent (not shown) is secured by the gaps d1 and d2.

  As shown in detail in FIGS. 2 and 3, first position restricting protrusions 11a and 11b and second position restricting protrusions 12a and 12b are provided at substantially opposite positions of the inner wall portion 4a, the outer wall portion 4b and the stepped wall surface 4c. It has been. The first position restricting protrusions 11 a and 11 b of the inner wall portion 4 a and the stepped wall surface 4 c are arranged at positions protruding into the gap 10 a of the core 10. As shown in detail in FIG. 4, the first position restricting protrusion 11 a of the inner wall portion 4 a and the first position restricting protrusion 11 b of the stepped wall surface 4 c are orthogonal to the end surface 10 b forming the gap 10 a of the core 10. It is arranged at a position shifted in the direction). This restricts the movement of the core 10 in the Y direction, as indicated by the phantom line in FIG. That is, the range E between the inner and outer first position restricting projections 11a and 11b is a region where the end face 10b of the core 10 cannot enter, and this region is secured as an arrangement space for the hall element 15 described later.

  2nd position control protrusion 12a, 12b of the inner wall part 4a and the outer wall part 4b is arrange | positioned in the position which mutually opposes and protrudes to the internal peripheral surface and outer peripheral surface of the core 10, as shown in FIG.2 and FIG.3. ing. That is, the second position restricting protrusions 12a and 12b restrict movement in the same direction X (hereinafter, X direction) as the end face 10b forming the gap 10a of the core 10. Further, the upper surfaces of the second position restricting protrusions 12a and 12b are formed in a tapered shape so that the core 10 can be easily inserted.

  As shown in FIG. 1, a substrate 13 </ b> A is accommodated on the high step surface 8 of the component accommodating chamber 3. A positioning hole 13a is formed in the substrate 13A, and the substrate 13 is accommodated at a predetermined position by inserting the positioning pins 14 of the high step surface 4b into the positioning hole 13a. A Hall element 15 as a magnetoelectric conversion element is mounted on the substrate 13A. The hall element 15 is disposed in the gap 10 a of the core 10.

  Further, the inside of the component storage chamber 3 is filled with a molding agent (not shown) that is injected after the core 10 and the substrate 13A are arranged at predetermined positions.

  As shown in FIG. 1, a connector portion 16 is provided integrally with the case body 4, and terminals (not shown) of the connector portion 16 extend to the substrate 13A. A power supply is received from the outside via the connector portion 16 and a detection output of the Hall element 15 is output.

  In the above configuration, when the detection current is passed through the bus bar 6, a magnetic field proportional to the current is generated in the core 10, and a voltage proportional to the magnitude of the magnetic field generated in the core 10 is output from the Hall element 15.

  Next, the assembly work of the current sensor 1 will be briefly described. A bus bar 6 is passed through the case body 4 by insert molding or press fitting. The core 10 and the board 13 </ b> A are housed in predetermined positions in the component housing chamber 3 of the case body 4. The Hall element 15 mounted on the substrate 13A is disposed in the gap 10a of the core 10. Next, a molding agent (not shown) is injected into the component storage chamber 3. Finally, a lid (not shown) is fixed to the upper surface of the case body 4 to complete the process.

  When a molding agent (not shown) is injected during the assembly operation, an external force acts on the core 10 due to the fluid pressure of the molding agent (not shown). However, the movement of the core 10 in the component storage chamber 3 is blocked by the first and second position restricting projections 11a, 11b, 12a, 12b. Therefore, relative positional deviation with respect to the Hall element 15 due to positional deviation of the core 10 can be prevented, and variation in characteristics can be reduced.

  Specifically, since the first position restricting protrusions 11a and 11b are provided at positions protruding into the gap 10a of the core 10, the position of the gap 10a of the core 10 is set within a predetermined range as shown in FIG. Can be regulated. That is, the movement of the end surface 10b of the core 10 in the orthogonal direction Y can be restricted. Therefore, the Hall element 15 can be reliably arranged at a predetermined position in the gap 10a of the core 10, and the variation in characteristics can be further reduced.

  The second position restricting projections 12a and 12b are provided at positions that restrict movement in the same direction X as the end face 10b that forms the gap 10a of the core 10, and therefore the end face 10b that forms the gap 10a of the core 10 and Movement in the same direction X can be restricted, which contributes to a reduction in characteristic variation.

(Second Embodiment)
5 to 7 show a second embodiment of the present invention, FIG. 5 is a perspective view of a current sensor 1B, FIG. 6 is a perspective view of a substrate 13B, and FIG. 7 is a drawing of bubbles 22 generated below the substrate 13B. It is sectional drawing which shows a state.

  In FIG. 5, the current sensor 1 </ b> B of the second embodiment is integrally provided in the case 2 with a bus bar (not shown) penetrating in the same manner as in the first embodiment. . The component housing chamber 3 in the case 2 accommodates the core 10 and the substrate 13B, and a Hall element 15 which is a magnetoelectric conversion element mounted on the substrate 13B is disposed in the gap 10a of the core 10. The case 2 is provided with first and second position restricting protrusions that restrict the movement of the core 10 in the component housing chamber 3. The structure of the first and second position restricting protrusions is the same as that of the first embodiment.

  The current sensor 1B according to the second embodiment is characterized in that a hole 20 as an opening is formed in the vicinity of the Hall element 15 of the substrate 13B, as shown in detail in FIG.

  Also in the second embodiment, similarly to the first embodiment, the movement of the core 10 in the component housing chamber 3 is performed when the molding agent 21 is injected, and the first and second position restricting protrusions (not shown) are shown. 1), (not shown). Therefore, a relative displacement with respect to the Hall element 15 due to the displacement of the core 10 can be prevented as much as possible, and variations in characteristics can be reduced.

  Further, in the second embodiment, by injecting the molding agent 21 from the hole 20 of the substrate 13B, the bubbles 22 can be prevented from being generated in the lower region of the substrate 13B, that is, around the Hall element 15. Further, even if the molding agent 21 is injected into the component housing chamber 3 from other than the holes 20 of the substrate 13B and bubbles 22 are generated in the lower region of the substrate 13B, that is, around the Hall element 15, as shown in FIG. In addition, the generated air bubble 22 escapes from the hole 20. Therefore, it is possible to prevent the bubbles generated around the Hall element 15 from expanding due to the temperature rise, and the Hall element 15 from being displaced by the expanded bubbles 22, thereby improving the output stability and reliability.

  In the second embodiment, since the hole 20 is provided in the vicinity of the Hall element 15, the bubbles 22 generated below the substrate 13 </ b> B surely come out from the hole 20. Therefore, the displacement of the Hall element 15 due to the expanded bubble 22 can be reliably prevented, and the output stability and reliability are further improved.

  In the second embodiment, the opening is formed by the hole 20, but may be formed by notching the substrate 13B.

  In the first and second embodiments described above, the case 2 is provided with the through hole 5 penetrating the center of the core 10, and the bus bar 6 (not shown) through which the detection current is passed in the through hole 5. ) Is fixed, the relative position between the bus bar 6 and the core 10 does not fluctuate due to vibration or the like. Therefore, a predetermined output characteristic is always obtained from the Hall element 15, and the reliability of the detection output is improved.

  In the first and second embodiments described above, the detection current is supplied to the bus bar 6, but the detection current body may be a wire harness or the like.

  Furthermore, in the first and second embodiments described above, the magnetoelectric conversion element is the Hall element 15, but any element that can convert the intensity of the magnetic field into an electric quantity may be used.

1A, 1B Current sensor 2 Case 4 Case body 10 Core 10a Gap 10b End face 11a, 11b First position restricting protrusion (position restricting protrusion)
12a, 12b Second position restricting protrusion (position restricting protrusion)
13B substrate 15 Hall element (magnetoelectric conversion element)
21 Molding agent X The same direction of the end face of the core Y The orthogonal direction of the end face of the core

Claims (2)

  1. A core having a gap and a magnetoelectric conversion element disposed in the gap of the core are accommodated in a component accommodating chamber in a case, and the component accommodating chamber is filled with a molding agent. A current sensor mounted on a substrate housed in a housing chamber,
    The opening provided in the said board | substrate is provided in the vicinity of the said magnetoelectric conversion element, The current sensor characterized by the above-mentioned.
  2. A current sensor according to claim 1,
    The case is provided with a through-hole penetrating the center of the core, and a current detector to which a detection current is passed is fixed in the through-hole.
JP2009162831A 2009-07-09 2009-07-09 Current sensor Pending JP2009222729A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009162831A JP2009222729A (en) 2009-07-09 2009-07-09 Current sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009162831A JP2009222729A (en) 2009-07-09 2009-07-09 Current sensor

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011080348A1 (en) 2010-08-05 2012-02-09 Yazaki Corporation Structure for a current sensor
JP2013120177A (en) * 2011-12-09 2013-06-17 Sumitomo Wiring Syst Ltd Current detector
JP2013148499A (en) * 2012-01-20 2013-08-01 Auto Network Gijutsu Kenkyusho:Kk Current detection device
JP2013162003A (en) * 2012-02-07 2013-08-19 Tokai Rika Co Ltd Core holder and current sensor
KR20160001765A (en) * 2014-06-26 2016-01-07 순천향대학교 산학협력단 Hall sensor assembly
KR200480159Y1 (en) 2011-12-28 2016-04-20 한국단자공업 주식회사 Current sensor

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6292622U (en) * 1985-12-02 1987-06-13
JPH04282461A (en) * 1991-03-12 1992-10-07 Mitsubishi Electric Corp Current detector
JPH11103178A (en) * 1997-09-26 1999-04-13 Keihin Corp Board holding structure in vehicle mounted electronic controller
JP2000324667A (en) * 1999-05-13 2000-11-24 Yazaki Corp Current detector for electric joint box
JP2002243768A (en) * 2001-02-21 2002-08-28 Stanley Electric Co Ltd Electric current detector
JP2002296305A (en) * 2001-04-02 2002-10-09 Jeco Co Ltd Core for current sensor
JP2006078255A (en) * 2004-09-08 2006-03-23 Yazaki Corp Current sensor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6292622U (en) * 1985-12-02 1987-06-13
JPH04282461A (en) * 1991-03-12 1992-10-07 Mitsubishi Electric Corp Current detector
JPH11103178A (en) * 1997-09-26 1999-04-13 Keihin Corp Board holding structure in vehicle mounted electronic controller
JP2000324667A (en) * 1999-05-13 2000-11-24 Yazaki Corp Current detector for electric joint box
JP2002243768A (en) * 2001-02-21 2002-08-28 Stanley Electric Co Ltd Electric current detector
JP2002296305A (en) * 2001-04-02 2002-10-09 Jeco Co Ltd Core for current sensor
JP2006078255A (en) * 2004-09-08 2006-03-23 Yazaki Corp Current sensor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011080348A1 (en) 2010-08-05 2012-02-09 Yazaki Corporation Structure for a current sensor
US8723505B2 (en) 2010-08-05 2014-05-13 Yazaki Corporation Current sensor structure
JP2013120177A (en) * 2011-12-09 2013-06-17 Sumitomo Wiring Syst Ltd Current detector
KR200480159Y1 (en) 2011-12-28 2016-04-20 한국단자공업 주식회사 Current sensor
JP2013148499A (en) * 2012-01-20 2013-08-01 Auto Network Gijutsu Kenkyusho:Kk Current detection device
JP2013162003A (en) * 2012-02-07 2013-08-19 Tokai Rika Co Ltd Core holder and current sensor
KR20160001765A (en) * 2014-06-26 2016-01-07 순천향대학교 산학협력단 Hall sensor assembly
KR101586203B1 (en) * 2014-06-26 2016-01-20 순천향대학교 산학협력단 Hall sensor assembly

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