JP2009193679A - Method for manufacturing flat panel display member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a flat panel display member in which there is no residue generated. <P>SOLUTION: This is the method for manufacturing a flat panel display member which includes a pattern of insulating layer on a substrate and includes a light shielding layer inside the pattern. After a pattern of light shielding layer is formed on the substrate, a photosensitive paste layer having inorganic powder of average particle size of 0.1-5 μm and a photosensitive organic component is formed on the substrate having the pattern of the light shielding layer, and only the photosensitive paste layer on the shielding layer is removed by a photo-lithography method and by calcining, the flat panel display member is obtained. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a member used for a flat panel display or the like.

  As an image display device replacing a cathode ray tube, an image display device using an electron-emitting device which is a self-luminous discharge type display has been proposed. Compared to liquid crystal displays and plasma displays, this image display device has a bright and dark contrast, low power consumption, excellent video performance, and can meet the demands for high definition. The needs are growing. Moreover, the use as a fluorescent light-emitting device used as a light source instead of an image display device has been proposed and developed. Among such electron emission type flat image display devices and fluorescent light emitting devices, a CNT-field emission display (FED) using carbon nanotubes (CNT) as an electron emission element is easy to increase electron emission characteristics and area. There is active development for some reason.

  Such an electron emission type flat image display device and a fluorescent light emitting device include a front glass substrate and a back glass substrate having respective functions. The back glass substrate is provided with a plurality of electron-emitting devices and matrix wiring for connecting these devices. These wirings are installed in the X direction and the Y direction, and intersect at the electrode portion of the electron-emitting device. In order to insulate both at the intersecting portion, a patterned insulating layer is necessary.

  Regarding the production of this insulating layer, a method of forming a silicon oxide film by vacuum deposition, printing, sputtering, or the like, a method of forming a pattern by ultraviolet exposure after applying a photosensitive paste on the entire surface by screen printing, etc. are disclosed. (For example, refer to Patent Document 1). In addition, as a method for producing a patterned insulating layer, a polyimide negative photoresist or a Si negative resist layer is formed on a substrate having a light shielding layer pattern, and then back exposure is performed using the light shielding layer as a photomask. In addition, there is a method of forming by developing (see, for example, Patent Documents 2 and 3). However, in this case, there is a problem that insulation withstand voltage is insufficient.

  On the other hand, as a photosensitive paste for forming a member such as an insulating layer for a flat panel display having excellent insulation resistance, a photosensitive organic component including a photosensitive monomer, a binder polymer and a photopolymerization initiator and an inorganic component are used. Various proposals have been made such as photosensitive pastes (for example, see Patent Document 4) and photosensitive pastes made of an alkali-soluble polyorganosiloxane resin and an acid generator and an inorganic component (for example, see Patent Document 5). . Among these, a photosensitive paste composed of a photosensitive organic component and an inorganic component containing a photosensitive monomer and a photopolymerization initiator is preferably used because of many variations in material selection and easy control of its performance.

In order to obtain a member such as an insulating layer of an image display device and a fluorescent light emitting device from such a photosensitive paste, the photosensitive paste is applied as a thin film on a substrate, a pattern is formed by a photolithography method, and then baking is performed. Do. However, this method has a problem that a residue is generated in the development process. On the other hand, a method of performing water washing and air treatment twice after development has been proposed (see, for example, Patent Document 6). However, in the case of a narrow pattern, there is a problem that a sufficient developer does not easily enter the pattern, and a residue is generated even after washing with water and air treatment. In addition, a method of providing sufficient water solubility by introducing a water-soluble substituent such as a hydroxyl group or a carboxyl group in the side chain portion instead of the skeleton of the binder polymer has been proposed (see Patent Document 7). However, even in this method, when the particle size of the inorganic component is small, the adhesion with the base substrate may increase and a residue may be generated, which is not used as an insulating layer of an image display device and a fluorescent light emitting device. .
JP 2002-245928 A (paragraph 29-30) JP-A-7-320629 (Claims 1 and 7) Japanese Patent Laid-Open No. 7-320636 (Claim 1) JP-A-11-185601 (Claim 4) JP-A-2005-300633 (Claims 1 and 11) JP 2005-275272 A (paragraph 16) JP 2006-128092 A (paragraph 29)

  This invention solves the said subject and provides the manufacturing method of the flat panel display member which a residue does not generate | occur | produce.

  The present invention is a method for producing a flat panel display member having a pattern of an insulating layer on a substrate and having a light shielding layer inside the pattern, and after forming the pattern of the light shielding layer on the substrate, A photosensitive paste layer having an inorganic powder having an average particle size of 0.1 to 5 μm and a photosensitive organic component is formed on a substrate having the pattern of the light shielding layer, and only the photosensitive paste layer on the light shielding layer is formed by photolithography. A method for producing a flat panel display member, which is obtained by firing after removal.

  According to the present invention, even when an insulating layer pattern is formed using a photosensitive paste containing inorganic particles having a small particle size, residues can be suppressed and a flat panel display member having no residue can be produced. .

  FIG. 1 shows a method for manufacturing a flat panel display member of the present invention. Normally, when used as a flat panel display member, a thin film conductive metal for forming electrical wiring is formed on the substrate 10. Since such a metal is preferably an ITO film, a flat panel display member with an ITO film will be described below.

  First, the pattern of the light shielding layer 14 is formed on the substrate 10 having the ITO film 16 (FIG. 1B), and the photosensitive paste layer 13 is formed thereon (FIG. 1C). Subsequently, only the photosensitive paste on the light shielding layer 14 is removed by photolithography (FIG. 1D). Furthermore, by baking this, the photosensitive organic component in the photosensitive paste layer burns, and the insulating layer 12 is obtained (FIG. 1 (e)).

  According to the photolithography method, only the photosensitive paste on the light shielding layer 14 is removed by dissolving it in the developer. At this time, in the case where the flat panel display member does not have the light shielding layer 14, a residue due to development is directly attached onto the substrate or the ITO film, and it is difficult to remove it. This tendency becomes more prominent as the size (particle size) of what remains as a residue is smaller. In addition, when the inorganic powder contained in the photosensitive paste is a glass powder, the adhesive strength with the substrate, particularly the glass substrate or ITO film, is strong. Removal is very difficult. However, in the present invention, since the flat panel display member has the light shielding layer 14 and the development residue remains on the light shielding layer 14, even a small residue can be easily removed by washing. Examples of the cleaning method include water cleaning, air cleaning, and ultrasonic cleaning. Ultrasonic cleaning is particularly preferable.

  In the photolithography method of the present invention, depending on the type of photosensitive paste used, for example, a negative type mask 17 as shown in FIG. 2A is used, and a positive type is shown in FIG. 2B. A mask 18 as shown can be used. Furthermore, in the present invention, when the photosensitive paste to be used is a negative type, the light shielding layer 14 can be used as a mask. That is, as shown in FIG. 3, when the photosensitive paste layer 13 is exposed from the side opposite to the surface on which the light shielding layer 14 is provided (hereinafter referred to as “backside exposure”), the photosensitivity on the light shielding layer 14 is detected. Since light does not reach the paste, only a portion of the photosensitive paste layer 13 where the light shielding layer is not present is insolubilized, and a desired insulating layer pattern can be obtained by development. In this way, the process can be simplified because a mask is unnecessary. In the case of backside exposure, since the negative photosensitive paste on the side close to the substrate is sufficiently cured, the photosensitive paste does not swell or peel off from that portion. Therefore, the residue on the light shielding layer can be reduced.

  In order to perform backside exposure, the substrate is preferably transparent, and a glass substrate is preferable. For example, soda lime glass or heat resistant glass (PD200 manufactured by Asahi Glass Co., Ltd., PP8 manufactured by Nippon Electric Glass Co., Ltd., CS25 manufactured by Saint-Gobain Co., Ltd., CP600V manufactured by Central Glass Co., Ltd., etc.) can be used. When the glass substrate contains an alkali metal or an alkaline earth metal such as Na (sodium), Li (lithium), K (potassium), Ba (barium), Ca (calcium), etc., the glass substrate at or after firing Alkali glass is desirable because ion exchange is likely to occur with the glass component in the electrode and electrode, and electrical characteristics may be degraded and thermal expansion coefficients may be mismatched.

  In the present invention, the light shielding layer means a material having a light shielding property with respect to an exposure wavelength. Here, the light shielding property means that the transmittance is 15% or less, preferably 10% or less. More preferably, it is 5% or less. If the transmittance is greater than 15% with respect to the exposure wavelength, a pattern may be formed on the light shielding layer when the back surface exposure is performed.

  Further, the material of the light shielding layer is not particularly limited as long as it has such properties. The residue is derived from the material forming the insulating layer, and in the present invention, a photosensitive paste having an inorganic powder having an average particle size of 0.1 to 5 μm and a photosensitive organic component is used as the material for the insulating layer. The light shielding layer is preferably made of a material that does not easily adhere to the light shielding layer. Specifically, it is preferably a metal, and examples thereof include Cr, Ni, Mo, and a-Si. Alternatively, it may be obtained by baking after applying a photosensitive paste containing metal powder and a non-photosensitive paste containing metal powder. When such a material is used, no residue is formed on the light shielding layer, or even if it is generated, it can be easily removed by washing.

  In particular, when the average particle diameter of the inorganic powder contained in the photosensitive paste is 2 μm or less, it is very difficult to remove the light-shielding layer if it is a residue without the light-shielding layer. In this case, removal by washing is possible. In particular, when the material of the light shielding layer is a metal, the residue can be easily removed by washing even if the average particle size of the inorganic powder contained in the photosensitive paste is 1 μm or less. As a method for forming such a light shielding layer pattern, a method of obtaining a desired pattern by vapor deposition or sputtering using a metal mask, a pattern processing of a metal powder-containing photosensitive paste using a photolithography method, and baking. And a method of obtaining a non-photosensitive paste containing metal powder by patterning using a method such as screen printing and baking. Furthermore, after performing the resist patterning after metal deposition and sputtering, using the lift-off formulation, after performing the resist patterning after performing the method of performing metal patterning and vapor deposition and sputtering, A method of stripping the resist by performing metal etching is also conceivable.

  The thickness of the light shielding layer is preferably 30 nm or more. If the thickness is less than 30 nm, the transmittance with respect to the exposure wavelength increases, which may cause the light shielding layer not to function. Moreover, less than 300 nm is preferable. If it is 300 nm or more, the stress of the metal becomes large, and there is a possibility that film peeling of the light shielding layer occurs.

  The insulating layer used for the flat panel display member of the present invention is obtained by baking a photosensitive paste. The photosensitive paste is composed of an inorganic powder having an average particle size of 0.1 to 5 μm and a photosensitive organic component, and a pattern can be formed by using a photolithography method. Thereafter, firing is performed, and the photosensitive organic component is burned to obtain an insulating layer.

The inorganic powder is preferably a glass powder made of low softening point glass in order to enable firing at a low temperature. The low softening point glass contains SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , ZnO, PbO, Bi ₂ O ₃ , ZrO ₂ , alkaline earth metal oxide, alkali metal oxide, and the like. Examples thereof include borosilicate glass, alkali silicate glass, lead glass, and bismuth glass. Among these, non-lead oxide or low lead oxide is preferable from the viewpoint of the environment. Further, since a thin insulating layer is required, bismuth-based glass that can be atomized is preferable.

  In addition to cost reduction and productivity improvement by low-temperature firing, if the firing temperature is 500 ° C. or lower, there is an advantage that an inexpensive substrate can be used. The low softening point in the present invention means that the heat softening temperature of glass is 350 ° C to 600 ° C, more preferably 400 ° C to 580 ° C, and further preferably 450 ° C to 500 ° C.

The glass powder used in the present invention is 70 to 91% by weight of Bi ₂ O ₃ , ₃ to 15% by weight of SiO ₂ , 5 to 20% by weight of B ₂ O ₃ and 0 to 0 to ZrO ₂ in terms of oxide. Bismuth-based glass containing 5% by weight and 1 to 10% by weight of ZnO is preferable. Furthermore, other components may be included.

By including Bi ₂ O _{3 in an amount} of 70% by weight or more, an inexpensive substrate can be used by lowering the firing temperature. More preferably, it is 73 weight% or more, More preferably, it is 76 weight% or more. On the other hand, by containing 91% by weight or less, baking onto the glass substrate can be facilitated.

By containing 5% by weight or more of B ₂ O ₃ , it is possible to easily adjust electrical, mechanical and thermal characteristics such as electrical insulation, strength, thermal expansion coefficient, and denseness. More preferably, it is 7% by weight or more. On the other hand, by containing 20% by weight or less, the stability of the glass to acid and water can be maintained. More preferably, it is 15 weight% or less.

By including ZrO ₂ , the acid resistance of the glass can be improved. Preferably it is 0.01 weight% or more. On the other hand, the uniformity of glass can be maintained by including 5 weight% or less. More preferably, it is 2.5 weight% or less, More preferably, it is 1 weight% or less.

  By containing 1% by weight or more of ZnO, the denseness can be improved. More preferably, it is 2% by weight or more. On the other hand, the inclusion of 10% by weight or less facilitates the control of the baking temperature and maintains the insulation resistance. More preferably, it is 5% by weight or less.

  The average particle size of the glass powder used in the present invention is preferably 0.1 μm or more because a photosensitive paste with good dispersion stability can be obtained. Further, in order to enable fine photolithography processing with a thin film, the thickness is preferably 5 μm or less, more preferably 2 μm or less, and even more preferably 1 μm or less. Here, the average particle diameter of the glass powder refers to the number average value of the particle diameters obtained from the specific surface area by measuring nitrogen to adsorb nitrogen gas and measuring the specific surface area by the BET method and assuming that the particles are spheres.

  In the present invention, the content of the glass powder in the photosensitive paste excluding the solvent is preferably 50% by weight or more, more preferably 70% by weight or more, and still more preferably 80% by weight or more from the viewpoint of the pattern shape after firing. . On the other hand, it is preferably 95% by weight or less, more preferably 90% by weight or less from the viewpoint of photosensitive characteristics.

The inorganic powder used in the present invention may contain a filler other than the glass powder. Specific _{fillers, SiO 2, Al 2 O 3} , ZrO 2, mullite, spinel, magnesia, ZnO, include ceramic powders such as titanium oxide. You may use these in combination of multiple types. In order to prevent cracking during sintering and insufficient sintering, the filler content is preferably less than 20% by volume with respect to the total amount of inorganic components in the photosensitive paste, that is, glass powder and filler. The photosensitive paste used in the present invention contains a photosensitive organic component. The photosensitive organic component may be a negative type that is cured by light or a positive type that is solubilized by light. In the present invention, a) a composition comprising an ethylenically unsaturated group-containing compound and a photopolymerization initiator, b) one or more cationic polymerizations selected from the group of glycidyl ether compounds, alicyclic epoxy compounds, and oxetane compounds. And a composition containing one or more compounds selected from a quinonediazide compound, a diazonium compound, and an azide compound. A composition containing a) an ethylenically unsaturated group-containing compound and a radical photopolymerization initiator is preferred because of many variations in material selection and ease of control of performance based thereon.

  In the following description of the content of each component in the photosensitive organic component, when it is in the photosensitive organic component, the organic solvent is not included in the photosensitive organic component.

  In general, the refractive index of the photosensitive organic component is in the range of 1.4 to 1.7, and the refractive index difference from the glass powder is as large as 0.3 or more. Here, in the present invention, the average refractive index of the photosensitive organic component is determined by applying a high-speed spectroscopic ellipsometer M-2000 (manufactured by JA Woollam) ellipsometer after coating and drying the photosensitive organic component on glass. It means what was measured using. Measuring the refractive index at the exposure wavelength is accurate in confirming the effect. In particular, it is preferable to measure with light in the wavelength range of 350 to 650 nm. Furthermore, refractive index measurement with i-line (365 nm) or g-line (436 nm) is preferable.

  Conventionally known photosensitive pastes have not been able to obtain sufficient resolution when the difference in refractive index between the glass powder and the photosensitive organic component is large. In the present invention, the photosensitive organic component absorbs light having an exposure wavelength to emit light having a wavelength longer than the exposure wavelength, and the emitted light cures or solubilizes the photosensitive organic component (hereinafter referred to as compound ( A)) is preferred. By containing such a compound, the compound (A) absorbs ultraviolet rays to suppress scattering, and further, the compound (A) emits fluorescent light having a longer wavelength than the exposure light and having a high transmittance. It is possible to cure a portion far from the surface. For this reason, it is possible to obtain the same resolution as when the refractive index difference is small. The photosensitive organic component is cured or solubilized by the action of both the exposure light and the light emitted from the compound (A).

  The absorption wavelength range of the compound (A) is preferably a wavelength range of 320 to 410 nm, more preferably a wavelength range of 350 nm to 380 nm, and still more preferably a wavelength range of 360 nm to 375 nm. In addition, the fluorescence emission wavelength range of the compound (A) is preferably a wavelength range of 400 to 500 nm, more preferably a wavelength range of 400 nm to 450 nm, and still more preferably a wavelength range of 430 nm to 445 nm. If it is within this range, it effectively absorbs ultraviolet rays during exposure to suppress scattering, and emits fluorescence in the above-mentioned wavelength range, which is more transmissive than ultraviolet rays to irradiate. The organic component can be cured. The absorption wavelength of ultraviolet rays and the emission wavelength of fluorescence can be measured with a spectrofluorometer (F-2500, manufactured by Hitachi, Ltd.) and an ultraviolet-visible spectrophotometer (MultiSpec 1500, manufactured by Shimadzu Corporation).

  The compound (A) used in the present invention is preferably a compound that absorbs ultraviolet rays and emits blue fluorescence. As the compound (A), a fluorescent whitening agent such as a coumarin type fluorescent whitening agent, an oxazole type fluorescent whitening agent, a stilbene type fluorescent whitening agent, an imidazole type fluorescent whitening agent, a triazole type fluorescent whitening agent, an imidazolone type And oxacyanine-based, methine-based, pyridine-based, anthrapyridazine-based, and carbostyryl-based fluorescent brighteners. In the present invention, the content of the compound (A) is preferably 0.1% by weight or more, more preferably 2% by weight or more, and further preferably 5% by weight or more in the photosensitive organic component. Moreover, 30 weight% or less is preferable, 20 weight% or less is more preferable, and 15 weight% or less is further more preferable. Within this range, fine pattern processing is possible.

  a) A composition containing an ethylenically unsaturated group-containing compound and a photopolymerization initiator will be described. The ethylenically unsaturated group-containing compound is preferably a (meth) acrylic compound because of its abundance of variations. The content of the ethylenically unsaturated group-containing compound is preferably 50 to 99% by weight, more preferably 60 to 90% by weight in the photosensitive organic component. By making it 50% by weight or more, fine pattern processing becomes possible, and by making it 99% by weight or less, the pattern shape after firing can be kept good. Moreover, it is preferable to use what has a sensitivity to visible light with a wavelength of 400-450 nm especially in a photoinitiator, and can use these 1 type (s) or 2 or more types in this invention. The content of the photopolymerization initiator is preferably 0.05 to 50% by weight, more preferably 1 to 35% by weight in the photosensitive organic component. Within this range, the sensitivity is good and the remaining ratio of the exposed portion can be increased.

  Next, the composition containing 1 or more types of cationically polymerizable compounds selected from the group of b) glycidyl ether compound, an alicyclic epoxy compound, and an oxetane compound and a photocationic polymerization initiator is demonstrated. The content of the cationic polymerizable compound is preferably 1 to 75% by weight, more preferably 5 to 35% by weight in the photosensitive organic component. By making it within this range, the pattern shape can be kept good. The content of the cationic photopolymerization initiator is preferably in the range of 0.01 to 15% by weight in the photosensitive organic component.

  Next, c) a composition containing one or more compounds selected from a diazonium compound and an azide compound will be described. Among diazonium compounds and azide compounds, quinonediazide compounds are particularly preferable. When mixed with an alkali-soluble resin such as a quinonediazide compound and novolak phenol and irradiated with light, the exposed portion becomes alkali-soluble and an image can be obtained by alkali development. When the quinonediazide compound is contained, the content thereof is preferably 1% by weight to 96% by weight in the photosensitive organic component, and more preferably 3% by weight to 80% by weight. By containing 1% by weight or more of the quinonediazide compound, the pattern forming property is improved, and by containing 96% by weight or less, the dispersibility of the glass powder can be kept good. When the diazonium compound is contained, the content thereof is preferably 5 to 80% by weight, more preferably 10 to 50% by weight in the photosensitive organic component. By setting it within this range, it is possible to maintain good curability and storage stability. When the azide compound other than the quinonediazide compound is contained, the content thereof is preferably 5 to 70% by weight, more preferably 10 to 50% by weight in the photosensitive organic component. By setting it within this range, it is possible to maintain good curability and storage stability.

  In the present invention, the photosensitive organic component preferably further has a binder polymer, and can contain an ultraviolet absorber, a sensitizer, a polymerization inhibitor, a plasticizer, a dispersant, an antioxidant, and the like.

  As the binder polymer, various polymers such as acrylic resin, epoxy resin, polyurethane resin, polyester resin, polyamide resin, polyimide resin, silicone resin, melamine resin, phenol resin, cellulose derivative, and polyvinyl alcohol can be used. Methacrylate, polyvinyl butyral, polyvinyl alcohol, ethyl cellulose, (meth) acrylic acid ester copolymer and the like are preferable. Furthermore, from the viewpoint of the dispersibility and developability of the glass powder, and the pattern formation by photosensitivity, the binder polymer preferably has a reactive functional group such as a carboxyl group, a hydroxyl group, or an ethylenically unsaturated double bond.

  The Tg (glass transition temperature) of the binder polymer is preferably 30 to 100 ° C, more preferably 40 to 95 ° C, and further preferably 60 to 90 ° C. The adhesiveness of the photosensitive paste can be reduced by setting Tg to 30 ° C. or higher, and the adhesiveness of the photosensitive paste to the glass substrate can be maintained by setting Tg to 100 ° C. or lower. On the other hand, if Tg exceeds 100 ° C., the pattern is likely to crack after the photosensitive paste film is exposed and developed.

  In the present invention, the Tg of the binder polymer is increased by using a DSC-50 type measuring device manufactured by Shimadzu Corporation with a sample weight of 10 mg under a nitrogen stream at a heating rate of 20 ° C./min. Is the temperature at which begins.

  The weight average molecular weight of the binder polymer is preferably 100,000 or less. More preferably, it is 5,000 to 80,000. When the weight average molecular weight is 100,000 or less, the developer solubility is maintained, and as a result, a finer pattern can be obtained. Furthermore, considering that the viscosity of the binder polymer increases in proportion to the weight average molecular weight, it is preferable to reduce the weight average molecular weight of the binder polymer in order to improve workability in filtration, degassing and coating processes. . In the present invention, the weight average molecular weight of the binder polymer is measured by size exclusion chromatography using tetrahydrofuran as a mobile phase. The column uses Shodex KF-803, and the weight average molecular weight is calculated in terms of polystyrene.

  The content of the binder polymer in the photosensitive organic component is preferably 1 to 50% by weight. More preferably, it is 5 to 40% by weight. By setting the content in the range of 1 to 50% by weight, it is possible to achieve both pattern processability and characteristics such as shrinkage during firing.

  It is also effective that the photosensitive paste of the present invention contains an ultraviolet absorber. High aspect ratio, high definition, and high resolution can be obtained by containing an absorbent having a high ultraviolet absorption effect. As the ultraviolet absorber, an organic dye, particularly an organic dye having a high UV absorption coefficient in a wavelength range of 350 to 450 nm is preferably used. Organic dyes are preferred because they do not remain in the glass film after firing, and the deterioration of the insulating film properties due to the ultraviolet absorber can be reduced. As such a compound, an azo dye or a benzophenone dye is preferable because the absorption wavelength can be easily controlled in a desired wavelength region. The content of the organic dye in the photosensitive organic component is preferably 0.05 to 5% by weight. More preferably, it is 0.1 to 1 weight%. Within this range, the effect of the ultraviolet absorber can be exhibited while maintaining the insulation after firing. Therefore, a high-definition pattern is possible.

  A sensitizer is a component which improves a sensitivity, and can use these 1 type (s) or 2 or more types in this invention. Some sensitizers can also be used as photopolymerization initiators. When it contains a sensitizer, the content thereof is preferably 0.05 to 30% by weight, more preferably 0.1 to 20% by weight in the photosensitive organic component. If the amount of the sensitizer is too small, the effect of improving the photosensitivity is not exhibited, and if the amount of the sensitizer is too large, the residual ratio of the exposed portion may be too small.

  Furthermore, it is preferable to contain a polymerization inhibitor. When the polymerization inhibitor is contained, the content thereof is preferably 0.001 to 1% by weight with respect to the photosensitive paste excluding the solvent.

  Moreover, you may contain a plasticizer and antioxidant. When it contains a plasticizer, its content is preferably 0.5 to 10% by weight based on the photosensitive paste excluding the solvent. When the antioxidant is contained, the content thereof is preferably 0.001 to 1% by weight with respect to the photosensitive paste excluding the solvent.

  Moreover, you may contain the cage silsesquioxane. The cage silsesquioxane may be added to the photosensitive paste as it is, or may be added after reacting with other compounds in advance. In the case of reacting with another compound in advance, it is preferable to react with the compound constituting the photosensitive organic component from the viewpoint of increasing the compatibility.

  The photosensitive paste of the present invention can be produced as follows. A binder polymer, any component of a) to c), a compound (A), various additives, and the like are mixed as a photosensitive organic component as necessary, followed by filtration to prepare an organic vehicle. To this, pretreated glass powder is added as necessary, and homogeneously mixed and dispersed with a kneader such as a ball mill to produce a photosensitive paste.

  The viscosity of the photosensitive paste is appropriately adjusted depending on the contents of glass powder, thickener, organic solvent, plasticizer, precipitation inhibitor, etc., but the range is generally 2 to 200 Pa · s (Pascal · second). is there. For example, when applying to a glass substrate by a spin coat method, 2-5 Pa.s is preferable. In order to obtain a film thickness of 10 to 20 μm by applying it once by the screen printing method, 5 to 200 Pa · s is preferable. In the case of using a blade coater method or a die coater method, 2 to 20 Pa · s is preferable.

  Examples of the organic solvent used for adjusting the viscosity of the solution include methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, and 3-methoxy-3-methyl-1. -Butanol, tetrahydrofuran, dimethyl sulfoxide, γ-butyrolactone, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid, etc., and organic solvent mixtures containing one or more of these are used .

  Next, the manufacturing method of the flat panel display member of this invention is demonstrated in detail. After the pattern of the light shielding layer is formed on the substrate on which the ITO film is formed, a photosensitive paste is applied from above. As a coating method, general methods such as screen printing, bar coater, roll coater, slit die coater, and spinner can be used. The coating thickness can be adjusted by selecting the number of coatings, the screen mesh, and the viscosity of the photosensitive paste. In consideration of shrinkage due to drying or baking, the thickness after drying is preferably 5 to 100 μm, more preferably 5 to 60 μm, and further preferably 5 to 40 μm.

  Usually, the applied photosensitive paste is heat-treated (baked). The baking temperature and time vary depending on the composition of the photosensitive paste, but are preferably 50 to 150 ° C. and about 5 to 30 minutes. Further, it is desirable to perform the baking in a convection baking furnace or an IR baking furnace.

A pattern can be formed by exposing and developing the coated and heat-treated photosensitive paste. As an exposure apparatus in this case, a stepper exposure machine, a proximity exposure machine, or the like can be used. Examples of the active light source used include visible light, near ultraviolet light, ultraviolet light, near infrared light, electron beam, X-ray, and laser light. Among these, ultraviolet light is preferable, and as the light source, for example, Low pressure mercury lamp, high pressure mercury lamp, super high pressure mercury lamp, halogen lamp, germicidal lamp, etc. can be used. Among these, an ultrahigh pressure mercury lamp is suitable. Although exposure conditions vary depending on the coating thickness, exposure is usually performed for 0.01 to 30 minutes using an ultrahigh pressure mercury lamp with an output of 5 to 1000 W / m ² . In particular, it is preferable to perform exposure with an exposure amount of about 0.02 to 1 J / cm ² . Further, as described above, it is preferable to perform backside exposure using the light shielding layer as a mask.

  Examples of the developing method include a dipping method, a spray method, a shower method, a brush method, and the like. Among these, the shower method is preferable in that uniform development can be realized. The flow rate and pressure of the developing solution when developing by the shower method vary depending on the type and concentration of the developing solution, but the flow rate is preferably 50 ml / min to 200 ml / min, more preferably 100 ml / min to 170 ml / min. The pressure is preferably 0.05 MPa to 0.2 MPa, more preferably 1 kg / min to 1.6 kg / min.

  As the developer, an organic solvent or an aqueous solution in which an organic component in the photosensitive paste can be dissolved or dispersed is used. An organic solvent-containing aqueous solution may be used. When the photosensitive paste contains a compound having a functional group such as a carboxyl group, a phenolic hydroxyl group, or a silanol group, it can be developed even with an alkaline aqueous solution. A metal alkali aqueous solution such as sodium hydroxide, calcium hydroxide, sodium carbonate aqueous solution or the like can be used as the alkali aqueous solution. However, it is preferable to use an organic alkali aqueous solution because an alkaline component can be easily removed during firing. As the organic alkali, a general amine compound can be used. Specific examples include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, and diethanolamine. The concentration of the alkali component in the aqueous alkali solution is preferably 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. If the alkali concentration is too low, the unexposed portion is not removed, and if the alkali concentration is too high, the pattern portion may be peeled off and the exposed portion may be corroded. It is preferable in terms of process control that the temperature of the developer during development is 20 to 50 ° C.

  It is also possible to perform ultrasonic treatment in a developer at the time of development. By doing so, residue can be reduced. In the case with a light shielding layer, the residue can be removed almost completely.

  In addition, the developer preferably contains a surfactant for improving the paintability of the photosensitive paste on the coating film, uniformity of development and reduction of residues. As the surfactant, nonionic, anionic, cationic, and amphoteric surfactants can be used. The content of the surfactant is preferably 0.01 to 20% by weight, more preferably 0.05 to 10% by weight, and still more preferably 0.1 to 5% by weight.

  By the method as described above, a light shielding layer pattern having a thickness of 5 to 100 μm can be formed on the substrate from the photosensitive paste of the present invention.

  Thereafter, firing is performed in a firing furnace. The firing atmosphere, temperature, and time can be appropriately selected depending on the type of photosensitive paste and substrate, and are generally held at a temperature of 400 to 600 ° C. for 10 to 60 minutes. Baking in an atmosphere of nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace or a belt-type continuous firing furnace can be used. Moreover, you may heat at 50-300 degreeC in the above each process for the purpose of drying and a preliminary reaction. In the middle of firing, the organic components of the photosensitive paste are fired to become only glass powder, and the softening of the glass powder begins. However, in order to obtain the desired insulating layer shape, the degree of shrinkage and softening during firing is considered. There is a need.

  Thereafter, the light shielding layer may be removed although it may be used for a flat panel display member. Examples of the method for removing the light shielding layer include an etching method, but are not limited thereto. In the case of the etching method, a solution that etches only the light shielding layer without damaging the insulating layer is preferable. When the light shielding layer is removed, even if a residue remains on the light shielding layer, the residue can be completely removed, and no residue remains on the ITO film or the substrate. Thus, what removed the light shielding layer can also be utilized for a flat panel display member.

  Hereinafter, the present invention will be described specifically by way of examples. However, the present invention is not limited to this. The concentration in Examples and Comparative Examples is% by weight unless otherwise specified. The measuring method of each characteristic is as follows.

  The weight average molecular weight of the binder polymer was measured by size exclusion chromatography using tetrahydrofuran as a mobile phase. The column was Shodex KF-803, and the weight average molecular weight was calculated in terms of polystyrene.

  The acid value of the binder polymer was obtained by dissolving 1 g of the binder polymer in 100 mL of ethanol and then titrating with a 0.1N aqueous potassium hydroxide solution.

  The viscosity of the binder polymer was measured 5 minutes after the start of measurement using a rotational viscometer (RVDVII +, manufactured by Brookfield) under the conditions of a temperature of 25 ± 0.1 ° C. and a rotational speed of 10 rpm.

  The thermal decomposition temperature of the binder polymer was measured by the following method. A sample of about 20 mg was set in a TG measuring device (TGA-50, manufactured by Shimadzu Corporation), and the temperature was raised to 700 ° C. at an air flow rate of 20 ml / min and a heating rate of 0.6 to 20 ° C./min. . The relationship between temperature (vertical axis) and weight change (horizontal axis) was plotted, the tangent line between the part before decomposition and the part during decomposition was drawn, and the temperature at the intersection was taken as the thermal decomposition temperature.

  The glass transition temperature (Tg) of the binder polymer was measured using a DSC-50 type measuring device manufactured by Shimadzu Corporation. The sample was heated at a rate of 20 ° C./min under a nitrogen stream and the temperature at which the baseline began to be biased was Tg.

  The glass softening point of the glass powder was measured by the following method. Glass powder is put into a platinum cell, and differential thermal analysis is performed at a temperature increase rate of 20 ° C./min from room temperature to 700 ° C. using a differential thermal analyzer (TG8120, manufactured by Rigaku Corporation). The temperature at which the endotherm ends through the local minimum point was defined as the softening point (Ts).

  The average particle diameter of the glass powder was measured using a laser diffraction / scattering measurement apparatus (Microtrac particle size distribution analyzer HRA, manufactured by Nikkiso Co., Ltd.). The specific gravity was measured by processing the glass into a size of about 5 × 5 × 5 mm and using the Archimedes method. The refractive index was measured for light having a wavelength of 436 nm at 25 ° C. by ellipsometry using an ellipsometer after a glass film was formed on quartz glass.

    The refractive index of the photosensitive organic component was measured with respect to light having a wavelength of 436 nm at 25 ° C. by ellipsometry using an ellipsometer after coating and drying the organic vehicle.

  The materials used for the photosensitive paste are as follows.

<Binder polymer I>
Weight obtained by addition reaction of 0.4 equivalent of glycidyl methacrylate (GMA) to a carboxyl group of a copolymer obtained from 40 parts by weight of methyl methacrylate, 30 parts by weight of ethyl acrylate, and 30 parts by weight of methacrylic acid It is a polymer having an average molecular weight of 18000, an acid value of 111 mgKOH / g, a double bond density of 1.4 mmol / g, and a viscosity of 13.4 Pa · s. The thermal decomposition temperature was 422 ° C. and Tg was 38 ° C.

<Binder polymer II>
Weight obtained by addition reaction of 0.4 equivalent of glycidyl methacrylate (GMA) to a carboxyl group of a copolymer obtained from 40 parts by weight of methyl methacrylate, 20 parts by weight of ethyl acrylate, and 40 parts by weight of methacrylic acid It is a polymer having an average molecular weight of 16000, an acid value of 105 mgKOH / g, a double bond density of 2.5 mmol / g, and a viscosity of 11.2 Pa · s. The thermal decomposition temperature was 430 ° C. and Tg was 74 ° C.

<Binder polymer III>
Weight average molecular weight obtained by addition reaction of 0.4 equivalent of glycidyl methacrylate (GMA) to a carboxyl group of a copolymer obtained from 50 parts by weight of methyl methacrylate, 30 parts by weight of styrene, and 20 parts by weight of methacrylic acid. 31,000, acid value 58 mgKOH / g, double bond density 1.4 mmol / g, viscosity 7.7 Pa · s. The thermal decomposition temperature was 421 ° C and Tg was 94 ° C.

<Glass powder I>
Bi ₂ O ₃ (85 wt%), SiO ₂ (3.7 wt%), B ₂ O ₃ (5.3 wt%), ZnO (1.3 wt%), ZrO ₂ (1.2 wt%) A bismuth-based glass powder having a composition of Al ₂ O ₃ (2.5% by weight) was used. The glass softening point of this glass powder was 452 ° C., the average particle diameter was 0.5 μm, and the specific gravity was 5.86 g / cm ³ .

<Glass powder II>
Bi ₂ O ₃ (82 wt%), SiO ₂ (4.9 wt%), B ₂ O ₃ (8.1 wt%), ZnO (1.5 wt%), ZrO ₂ (0.15 wt%) A bismuth-based glass powder having a composition of Al ₂ O ₃ (2.2% by weight) was used. The glass softening point of this glass powder was 462 ° C., the average particle diameter was 0.5 μm, and the specific gravity was 6 g / cm ³ .

<Glass powder III>
Bi ₂ O ₃ (77.2 wt%), SiO ₂ (6.9 wt%), B ₂ O ₃ (10.2 wt%), ZnO (2.5 wt%), ZrO ₂ (0 wt%) A bismuth glass powder having a composition of Al ₂ O ₃ (2.7% by weight) was used. The glass softening point of this glass powder was 493 ° C., the average particle diameter was 0.5 μm, and the specific gravity was 6.1 g / cm ³ .

<Glass powder IV>
Bi ₂ O ₃ (82 wt%), SiO ₂ (4.9 wt%), B ₂ O ₃ (8.1 wt%), ZnO (1.5 wt%), ZrO ₂ (0.15 wt%) A bismuth-based glass powder having a composition of Al ₂ O ₃ (2.2% by weight) was used. The glass softening point of this glass powder was 462 ° C., the average particle diameter was 1.4 μm, and the specific gravity was 5.9 g / cm ³ .

<Glass powder V>
Bi ₂ O ₃ (82 wt%), SiO ₂ (4.9 wt%), B ₂ O ₃ (8.1 wt%), ZnO (1.5 wt%), ZrO ₂ (0.15 wt%) A bismuth-based glass powder having a composition of Al ₂ O ₃ (2.2% by weight) was used. The glass softening point of this glass powder was 462 ° C., the average particle diameter was 2.6 μm, and the specific gravity was 6 g / cm ³ .
<Glass powder VI>
Bi ₂ O ₃ (82 wt%), SiO ₂ (4.9 wt%), B ₂ O ₃ (8.1 wt%), ZnO (1.5 wt%), ZrO ₂ (0.15 wt%) A bismuth-based glass powder having a composition of Al ₂ O ₃ (2.2% by weight) was used. The glass softening point of this glass powder was 463 ° C., the average particle diameter was 4.6 μm, and the specific gravity was 5.9 g / cm ³ .
<Glass powder VII>
Bi ₂ O ₃ (82 wt%), SiO ₂ (4.9 wt%), B ₂ O ₃ (8.1 wt%), ZnO (1.5 wt%), ZrO ₂ (0.15 wt%) A bismuth-based glass powder having a composition of Al ₂ O ₃ (2.2% by weight) was used. The glass softening point of this glass powder was 464 ° C., the average particle diameter was 6.2 μm, and the specific gravity was 6 g / cm ³ .

<Compound (A) I>
Coumarin derivative (trade name Kaylight B, manufactured by Nippon Kayaku Co., Ltd.): The maximum absorption wavelength of ultraviolet light in a 3-methoxy-3-methyl-1-butanol solution was 370 nm, and the maximum emission wavelength of fluorescence was 441 nm. It was.

<Compound (A) II>
Oxazole derivative (trade name Kayright O, manufactured by Nippon Kayaku Co., Ltd.): the maximum absorption wavelength of ultraviolet light in a 3-methoxy-3-methyl-1-butanol solution was 374 nm, and the maximum emission wavelength of fluorescence was 436 nm. .

  In Tables 1 and 2, the compound that absorbs the exposure wavelength to the photosensitive organic component to emit light having a wavelength longer than the exposure wavelength, and the emitted light cures or solubilizes the photosensitive organic component is compound (A). It was written.

Example 1
As a photosensitive organic component, 21 g of acrylic monomer (Nippon Kayaku Co., Ltd. Kayrad TPA-330) which is an ethylenically unsaturated group-containing compound and 21 g of the above binder polymer II (solvent (3-methyl-3-methoxybutanol) 30 g), a photopolymerization initiator (manufactured by Nippon Kayaku Co., Ltd., 2,4-dimethyloxanthone and Ciba Specialty Chemicals Co., Ltd., trade name Irgacure 369 is used at a weight ratio of 1: 2), 6 g, 9 g of compound (A) I, 0.6 g of ultraviolet light absorber (azo organic dye 4-aminoazobenzene: manufactured by Wako Pure Chemical Industries, Ltd.), and 0 of dispersant (trade name Nop Cospar 092 manufactured by San Nopco) An organic vehicle was prepared using 0.9 g and 1.5 g of a polymerization inhibitor (p-methoxyphenol). The refractive index ( _ng ) of the obtained photosensitive organic component was 1.52.

  Next, 240 g of glass powder II was mixed with the photosensitive organic component. This was passed 5 times with 3 rolls to produce a photosensitive paste. The photosensitive paste was further filtered using a 400 mesh filter.

Next, a Cr film was sputtered onto a glass substrate with an entire ITO film, and a positive resist (trade name AZ1500, manufactured by AZ Electronic Materials Co., Ltd.) was applied thereon using a spinner. The thickness of the Cr film was 150 nm. The thickness of the positive resist was 2 μm. Thereafter, a chromium mask having 100 patterns with a φ20 μm pattern / 60 μm pitch was brought into direct contact with the positive resist film, and was exposed to ultraviolet rays from an upper surface with an ultrahigh pressure mercury lamp having a power of 0.5 kW. The exposure amount was 0.05 J / cm ² . Next, it was immersed for 60 seconds in a resist developer (manufactured by AZ Electronic Materials Co., Ltd., trade name AZ400K diluted 4 times) maintained at 25 ° C., and then washed with water. Then, after removing the Cr film using an acidic etching solution (cerium nitrate cerium nitrate: 9 wt% + perchloric acid: 6 wt%, etc.), the positive resist film was removed with acetone, and the φ 20 μm Cr film was removed. A circular pattern was formed as a light shielding layer.

The photosensitive paste was uniformly applied onto a substrate with a light-shielding layer using a spinner, held at 100 ° C. for 15 minutes, and dried. Thereafter, UV exposure was performed with an ultra-high pressure mercury lamp of 0.5 kW output from the side opposite to the surface provided with the light shielding layer. The exposure amount was 0.25 J / cm ² .

  Next, a 0.1% by weight aqueous solution of sodium carbonate maintained at 25 ° C. is developed for 40 seconds by showering, and then washed with water using a shower spray to remove the photosensitive paste on the light shielding layer and onto the glass substrate. A hole pattern of φ20 μm was formed. The thickness of the photosensitive paste was 20 μm. Thereafter, ultrasonic cleaning was performed at 90 W for 3 minutes.

  Of 100 via patterns, the rate of pattern formation was evaluated as the via processing rate (%). The pattern formed here indicates a state in which the Cr film of the light shielding layer is observed in the via pattern when the microscope is observed at a magnification of 500 times. As a result, 100 via patterns were formed, and the via processing rate was 100%.

  Next, vias are observed using a scanning electron microscope (SEM), and the number of lumps having a size of 0.3 μm or more in the area of 5 μm square in the central portion on the light shielding layer in the hole is obtained at 15,000 magnifications. The residue was evaluated by visually counting and changing the observation location and repeating the test 10 times as the average value. The case where the number of residues was less than 10 was good, and the case where less than 5 was excellent. Other than that, it was regarded as defective. As a result, the number of residues was 2, which was excellent.

  Next, the substrate after pattern formation was heated to a softening point of the glass powder at a heating rate of 12 ° C./min, and held at the softening point for 10 minutes for firing. Thereafter, the Cr film was etched using an acidic etching solution (cerium nitrate cerium nitrate: 9 wt% + perchloric acid: 6 wt%, etc.). Then, the observation on the glass substrate in the via | veer after an etching was performed using SEM, and the residue was evaluated like the above. As a result, the number of residues was 0, which was excellent. In Table 1, “Amount (% by weight)” represents the percentage by weight in the entire solid content excluding the organic solvent.

Example 2
Based on the composition described in Table 1, the same evaluation as in Example 1 was performed except that the compound (A) was not used, and the same evaluation was performed. The results are shown in Table 1.

Example 3
Based on the composition described in Table 1, the same evaluation as in Example 1 was performed except that the compound (A) was different. The results are shown in Table 1.

Examples 4 and 5
Based on the composition described in Table 1, the same operation as in Example 1 was performed except that the kind of glass powder was different, and the same evaluation was performed. The results are shown in Table 1.

Example 6
Based on the composition described in Table 1, the same evaluation as in Example 1 was performed except that a Mo film was used as the light shielding layer. The results are shown in Table 1. In the evaluation of the via processing rate, when the same observation as in Example 1 was performed, the state in which the Mo film of the light shielding layer was observed in the via pattern was determined as the state in which the pattern was formed.

Examples 7 and 8
Based on the composition described in Table 1, the same operation as in Example 1 was performed except that the kind of the binder polymer in Example 1 was different, and the same evaluation was performed. The results are shown in Table 1.

Example 9
Based on the composition described in Table 1, the same evaluation as in Example 1 was performed except that exposure was performed using a photomask from the same direction as the surface provided with the light shielding layer. Alignment is performed so that the light-shielding part of the chrome mask with φ20μm pattern / 60μm pitch is directly above the light-shielding layer, and the chrome mask is directly in contact with the photosensitive paste. UV exposure. The exposure amount was 0.25 J / cm ² . The results are shown in Table 1.

Examples 10 and 11
Based on the composition described in Table 2, the same operation as in Example 1 was performed except that the content of each component was different, and the same evaluation was performed. The results are shown in Table 2. In Table 2, “amount (% by weight)” represents the percentage by weight in the entire solid content excluding the organic solvent.

Examples 12-14
Based on the composition described in Table 2, the same evaluation as in Example 1 was performed except that the particle size of the glass was different. The results are shown in Table 2.

Example 15
Based on the composition described in Table 2, the same evaluation as in Example 1 was performed except that the thickness of the light shielding layer was 25 nm. The results are shown in Table 2.

Example 16
Based on the composition described in Table 2, the same evaluation as in Example 1 was performed except that the thickness of the light shielding layer was changed to 320 nm. The results are shown in Table 2. In this case, film peeling occurred in the light shielding layer.

Comparative Example 1
Based on the composition described in Table 3, a photosensitive paste was prepared, and the photosensitive paste was uniformly applied onto a substrate with an ITO film using a spinner, and held at 100 ° C. for 15 minutes to dry. . Thereafter, a chromium mask having a φ20 μm pattern / 60 μm pitch was brought into direct contact with the photosensitive paste, and was exposed to ultraviolet rays from an upper surface with an ultrahigh pressure mercury lamp having a 0.5 kW output. The exposure amount was 0.25 J / cm ² .

  Next, a 0.1% by weight aqueous solution of sodium carbonate maintained at 25 ° C. is developed for 40 seconds by showering, and then washed with water using a shower spray to remove the photosensitive paste on the light shielding layer and onto the glass substrate. A hole pattern of φ20 μm was formed. The thickness of the photosensitive paste was 20 μm. Thereafter, ultrasonic cleaning was performed at 90 W for 3 minutes.

  The via processing rate and residue were evaluated for the via pattern thus obtained. The results are shown in Table 3. In Table 3, “Amount (% by weight)” represents the percentage by weight in the entire solid content excluding the organic solvent.

Comparative Examples 2-4
Based on the composition described in Table 3, the same evaluation as in Comparative Example 1 was performed except that the glass particle diameter was different. The results are shown in Table 3. In the case of Comparative Example 4, via processing could not be performed at all, and residue evaluation was impossible.

  A method for producing a flat panel display member, comprising: a pattern comprising an insulating layer on a substrate; and a light shielding layer inside the pattern.

The manufacturing method of the flat panel display member which has a light shielding layer inside the insulating layer pattern on a board | substrate with an ITO film | membrane is represented. (A) represents the exposure method of the photosensitive paste layer at the time of using a negative photosensitive paste. (B) represents the exposure method of the photosensitive paste layer at the time of using a positive photosensitive paste. The mode of the patterning of the photosensitive paste layer by back surface exposure is represented.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Board | substrate 12 Insulating layer 13 Photosensitive paste layer 14 Light-shielding layer 16 ITO film | membrane 17, 18 Mask

Claims (5)

A method of manufacturing a flat panel display member having a pattern of an insulating layer on a substrate and having a light shielding layer inside the pattern, wherein after the pattern of the light shielding layer is formed on the substrate, the light shielding layer After forming a photosensitive paste layer having an inorganic powder having an average particle diameter of 0.1 to 5 μm and a photosensitive organic component on a substrate having a pattern, and removing only the photosensitive paste layer on the light shielding layer by a photolithography method, A method for producing a flat panel display member obtained by firing. The method for producing a flat panel display member according to claim 1, wherein an average particle diameter of the inorganic powder is 0.1 to 1 μm. The method for manufacturing a flat panel display member according to claim 1, wherein the inorganic powder is a glass powder. 4. The flat panel according to claim 1, wherein the photosensitive paste is negative photosensitive, and the photosensitive paste layer is exposed from the side opposite to the surface on which the light shielding layer is provided. Manufacturing method of display member. After baking, the light-shielding layer is removed from the flat panel display member in any one of Claims 1-4, The manufacturing method of the flat panel display member characterized by the above-mentioned.

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