JP2009164507A5 - - Google Patents

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Publication number
JP2009164507A5
JP2009164507A5 JP2008002923A JP2008002923A JP2009164507A5 JP 2009164507 A5 JP2009164507 A5 JP 2009164507A5 JP 2008002923 A JP2008002923 A JP 2008002923A JP 2008002923 A JP2008002923 A JP 2008002923A JP 2009164507 A5 JP2009164507 A5 JP 2009164507A5
Authority
JP
Japan
Prior art keywords
fine particles
via hole
pattern
multilayer substrate
ceramic multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008002923A
Other languages
English (en)
Japanese (ja)
Other versions
JP4998274B2 (ja
JP2009164507A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008002923A priority Critical patent/JP4998274B2/ja
Priority claimed from JP2008002923A external-priority patent/JP4998274B2/ja
Publication of JP2009164507A publication Critical patent/JP2009164507A/ja
Publication of JP2009164507A5 publication Critical patent/JP2009164507A5/ja
Application granted granted Critical
Publication of JP4998274B2 publication Critical patent/JP4998274B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008002923A 2008-01-10 2008-01-10 セラミック多層基板の製造方法 Expired - Fee Related JP4998274B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008002923A JP4998274B2 (ja) 2008-01-10 2008-01-10 セラミック多層基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008002923A JP4998274B2 (ja) 2008-01-10 2008-01-10 セラミック多層基板の製造方法

Publications (3)

Publication Number Publication Date
JP2009164507A JP2009164507A (ja) 2009-07-23
JP2009164507A5 true JP2009164507A5 (https=) 2011-02-10
JP4998274B2 JP4998274B2 (ja) 2012-08-15

Family

ID=40966740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008002923A Expired - Fee Related JP4998274B2 (ja) 2008-01-10 2008-01-10 セラミック多層基板の製造方法

Country Status (1)

Country Link
JP (1) JP4998274B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5574038B2 (ja) * 2011-03-07 2014-08-20 株式会社村田製作所 セラミック多層基板およびその製造方法
JP7579051B2 (ja) * 2019-07-18 2024-11-07 日本特殊陶業株式会社 中空構造部材の作製方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04116892A (ja) * 1990-09-06 1992-04-17 Fujitsu Ltd 多層セラミック基板およびその製造方法
JPH04219993A (ja) * 1990-12-20 1992-08-11 Fujitsu Ltd 多層セラミック基板およびその製造方法
JPH0521958A (ja) * 1991-07-17 1993-01-29 Nec Corp 多層配線基板の積層体及びその製造方法
JP3762095B2 (ja) * 1998-03-31 2006-03-29 京セラ株式会社 多層回路基板
JP3973402B2 (ja) * 2001-10-25 2007-09-12 株式会社日立製作所 高周波回路モジュール
JP2003304064A (ja) * 2002-04-08 2003-10-24 Sumitomo Metal Ind Ltd 空気層を内蔵したセラミック多層回路基板及びその製造方法
JP2005057140A (ja) * 2003-08-06 2005-03-03 Seiko Epson Corp 多層配線基板とその製造方法
JP4874644B2 (ja) * 2005-12-22 2012-02-15 京セラ株式会社 セラミック構造体の製造方法

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