JP2009076848A - Semiconductor device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device that prevents the generation of cracks or steps and falling-off of element forming regions while having an element isolation structure. <P>SOLUTION: After forming a desired element, a thermally-oxidized film 8, electrodes 9, 11, an interlayer insulating film 10 or the like from the surface side of a wafer substrate 2, the rear-face side of the wafer substrate 2 is polished so as to reduce the thickness of the wafer substrate 2. Then, each trench 3, reaching the surface of the wafer substrate 2, is formed from the rear-face side of the wafer substrate 2 so as to form an insulating layer 4 inside each trench 3. In a film-thinning process, polishing for film-thinning can be merely applied to the face made of the wafer substrate. Thus, it is possible to uniformly reduce the thickness of the rear face of the wafer substrate 2 while preventing the generation of cracks or steps. Further, even if each trench 3 is formed, regions of the wafer substrate 2 maintain a state of being connected with each other via the thermally-oxidized film 8 or the like formed on the surface of the wafer substrate 2. Consequently, it is also possible to prevent the problem of falling-off of element forming regions 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor device having an element isolation structure for insulatingly isolating a plurality of element formation regions, and a method for manufacturing the same.

For example, according to the method for manufacturing a semiconductor device described in Patent Document 1, first, a wafer for element formation is prepared, and a trench having a predetermined depth is formed from the surface side of the wafer. After the trench is filled with an insulating layer, the wafer is thinned by CMP from the back side of the wafer until the insulating layer is exposed. As a result, since the insulating layer is disposed through the wafer, the element formation region can be separated by the insulating layer.
JP 2001-144173 A

  However, in the manufacturing method described in Patent Document 1, after an insulating layer is buried in a trench formed at a predetermined depth from the front surface side of the wafer, the wafer is thinned by CMP polishing from the back surface side. For this reason, it is necessary to polish the surface where the silicon substrate constituting the wafer and the insulating layer made of an oxide film or the like are mixed. As a result, the stress due to polishing concentrates on the interface between the silicon substrate and the insulating layer, and there is a risk that, for example, cracks may occur in the silicon substrate. Even when the wafer is thinned by etching instead of polishing, a difference in etching rate between the silicon substrate and the insulating layer may cause a step on the back surface of the wafer.

  Furthermore, if the insulating layer is not sufficiently filled in the trench, the element formation region may fall off the wafer due to a force applied to the element formation region in the wafer thinning process.

  The present invention has been made in view of the above points, and provides a method for manufacturing a semiconductor device having an element isolation structure and a method for manufacturing the same, which can prevent generation of cracks and steps and dropout of an element formation region. It is an object to provide a manufactured semiconductor device.

In order to achieve the above object, a method of manufacturing a semiconductor device according to claim 1 comprises:
A method of manufacturing a semiconductor device, wherein at least one of an active element and a passive element using a semiconductor substrate is formed in each of a plurality of element formation regions isolated and separated in one semiconductor substrate,
Preparing a semiconductor substrate having a front surface and a back surface;
Forming at least one active element or passive element in each of a plurality of element formation regions of the semiconductor substrate on the surface side of the semiconductor substrate, and forming an insulating film on the surface of the semiconductor substrate;
From the back side of the semiconductor substrate, the step of reducing the thickness of the semiconductor substrate;
Forming a trench reaching the insulating film formed on the surface of the semiconductor substrate from the back side of the semiconductor substrate so as to surround each of the plurality of element formation regions after reducing the thickness of the semiconductor substrate;
A step of forming an insulating layer in the trench by depositing an insulating material on the inner surface of the trench to insulate and isolate the element formation region.

  Thus, according to the method for manufacturing a semiconductor device of the first aspect, first, the processing for reducing the thickness of the semiconductor substrate is performed from the back surface side of the semiconductor substrate. After that, a trench reaching the insulating film formed on the surface of the semiconductor substrate is formed from the back surface side of the thinned semiconductor substrate, and an insulating material is deposited on the inner surface of the trench, whereby the insulating layer is formed in the trench. Form. Therefore, it is only necessary to perform processing for thinning the surface made of the semiconductor substrate, and there is no need to perform processing for thinning the surface where the substrate and the insulating layer are mixed as in the conventional case. . For this reason, generation | occurrence | production of a crack and a level | step difference can be prevented and the back surface of a semiconductor substrate can be thinned uniformly. Furthermore, even if trenches that penetrate the semiconductor substrate are formed so as to surround each of the plurality of element formation regions, each region of the semiconductor substrate including the plurality of element formation regions has an insulating film formed on the surface of the semiconductor substrate. To maintain a connected state. Accordingly, it is possible to prevent the problem of the element formation region from falling off as in the conventional case.

  As described above, since each region of the semiconductor device can be maintained in a state of being connected by the insulating film formed on the surface of the semiconductor substrate, the connection of each region of the semiconductor device is maintained by the insulating layer filled in the trench. Is not necessarily required. Therefore, as described in claim 2, as a result of depositing an insulating material on the inner surface of the trench, a gap may remain in the vicinity of the central axis inside the trench.

  As described in claim 3, the insulating material deposited on the inner surface of the trench is also deposited on the back surface of the semiconductor substrate, and the deposited insulating material may be left as it is on the back surface of the semiconductor substrate. . This is because by leaving the insulating material as it is, the step of removing the insulating material can be made unnecessary, and insulation of the back surface of the semiconductor substrate can be secured.

  According to a fourth aspect of the present invention, the insulating film formed on the surface of the semiconductor substrate includes a LOCOS film or an STI film formed on a surface layer portion on the surface side of the semiconductor substrate, and the trench includes the LOCOS film or the STI film. The stop film is preferably formed by etching. The stop film serving as an etching stopper may be an interlayer insulating film such as a BPSG film, but it is desirable to use the above-described LOCOS film or STI film in order to increase the selection ratio with the semiconductor substrate.

  As described in claim 5, in the step of reducing the thickness of the semiconductor substrate, the thickness of the semiconductor substrate is preferably reduced until it becomes 150 μm or less. This makes it possible to easily form a trench and deposit an insulating material inside the trench. However, if the thickness of the semiconductor substrate is reduced to such a thickness, the mechanical strength of the semiconductor substrate may be reduced, and the semiconductor substrate may be cracked or the semiconductor substrate may be difficult to handle.

  Therefore, as described in claim 6, in the step of reducing the thickness of the semiconductor substrate, only the central region surrounded by the outer peripheral portion is reduced in thickness, and the outer peripheral portion is left without being reduced in thickness. It is preferable. Thereby, even if it makes a semiconductor substrate thin, the fall of mechanical strength can be suppressed as much as possible. For the purpose of suppressing the decrease in mechanical strength, the thickness of the outer peripheral portion is preferably 250 μm or more as described in claim 7. However, as described in claim 8, the outer peripheral portion is separated from the chip in the separation step of separating the semiconductor substrate into a plurality of chips.

A semiconductor device according to a ninth aspect is obtained by the manufacturing method described above, particularly, the manufacturing method according to the third aspect. That is, the semiconductor device of claim 9 is:
A semiconductor substrate having a front surface and a back surface;
Each surrounding a plurality of element formation regions in the semiconductor substrate, and a trench penetrating the semiconductor substrate;
An insulating layer made of an insulating material formed on the inner surface of the trench to insulate and isolate a plurality of element forming regions;
At least one active element or passive element formed on each of the plurality of element formation regions on the surface side of the semiconductor substrate;
The insulating material forming the insulating layer is deposited on the back surface of the semiconductor substrate continuously from the inside of the trench.

  As in the prior art, when a trench is first formed and an insulating layer is buried in the trench and then the substrate is thinned from the back side of the substrate, the insulating layer exists only in the trench. On the other hand, when the manufacturing method according to claim 3 described above is employed, the insulating material forming the insulating layer is not limited to the inside of the trench but continuously from the inside of the trench as described in claim 9. Also deposited on the back side. As described above, the insulating layer is also formed on the back surface of the semiconductor substrate, so that the insulating property can be secured while protecting the semiconductor substrate.

  Since claims 10 and 11 have the same contents as claims 2 and 5 described above, the description thereof will be omitted.

A method for manufacturing a semiconductor device according to claim 12 comprises:
A method of manufacturing a semiconductor device, wherein at least one of an active element and a passive element using a semiconductor substrate is formed in each of a plurality of element formation regions isolated and separated in one semiconductor substrate,
Preparing a semiconductor substrate having a front surface and a back surface;
On the surface side of the semiconductor substrate, at least one active element or passive element is formed in each of a plurality of element formation regions of the semiconductor substrate, an insulating film is formed on the surface of the semiconductor substrate, and a conductor is formed on the insulating film. Forming a step;
From the back side of the semiconductor substrate, the step of reducing the thickness of the semiconductor substrate;
Forming a trench reaching the insulating film formed on the surface of the semiconductor substrate from the back side of the semiconductor substrate after reducing the thickness of the semiconductor substrate;
Insulating and isolating the element formation region by forming an insulating layer in the trench by depositing an insulating material on the surface of the sidewall of the trench while leaving a cavity at least near the central axis of the trench, and also insulating the back surface of the semiconductor substrate Depositing material; and
Removing the insulating film at the bottom of the trench on the surface side of the semiconductor substrate to expose the conductor in the trench facing the conductor formed on the surface side of the semiconductor substrate via the insulating film;
And a step of depositing a conductive material in a cavity near the central axis of the trench including a trench in which the conductor is exposed, and depositing a conductive material on the back surface of the semiconductor substrate.

  According to such a manufacturing method, in addition to the same effects as those of the manufacturing method of claim 1, the conductive material on the front surface side and the conductive material on the back surface side of the semiconductor substrate are further connected to the conductive material in the trench. The structure which can be electrically conducted through can be obtained.

  Here, if an insulating layer is formed between the element formation regions, the DC component of the electric signal can be blocked, but the AC component cannot be completely blocked, and the AC component may cause a malfunction. Sex remains. However, by using the above-described configuration and fixing the potential of the conductive material in the trench surrounding the element formation region, it is possible to suppress potential interference due to the AC component between adjacent element formation regions.

A semiconductor device according to a fourteenth aspect is obtained by the manufacturing method according to the twelfth aspect described above. That is, the semiconductor device of claim 14 is:
A semiconductor substrate having a front surface and a back surface;
Each surrounding a plurality of element formation regions in the semiconductor substrate, and a trench penetrating the semiconductor substrate;
An insulating layer formed on at least the side wall surface inside the trench to insulate and isolate the plurality of element forming regions, and also formed on the back surface of the semiconductor substrate;
A conductive material formed so as to fill a space surrounded by the insulating layer inside the trench;
At least one active element or passive element formed in each of a plurality of element formation regions on the surface side of the semiconductor substrate;
A conductor formed on the surface of the semiconductor substrate,
A conductive material is deposited on the back surface of the semiconductor substrate continuously from the inside of the trench, and in at least one trench, the conductive material inside the trench is in contact with a conductor formed on the surface of the semiconductor substrate. Thus, the conductive material on the front surface side of the semiconductor substrate and the conductive material on the back surface side can be electrically conducted through the conductive material inside the trench.

  Since the semiconductor device has such a configuration, it is possible to achieve the same effect as described in the twelfth aspect.

  As the conductive material deposited inside the trench, polysilicon or metal can be used as described in claims 13 and 15.

A method for manufacturing a semiconductor device according to claim 16 comprises:
A method of manufacturing a semiconductor device, wherein at least one of an active element and a passive element using a semiconductor substrate is formed in each of a plurality of element formation regions isolated and separated in one semiconductor substrate,
Preparing a semiconductor substrate having a front surface and a back surface;
Forming at least one active element or passive element in each of a plurality of element formation regions of the semiconductor substrate on the surface side of the semiconductor substrate, and forming an insulating film on the surface of the semiconductor substrate;
From the back side of the semiconductor substrate, the step of reducing the thickness of the semiconductor substrate;
Forming a trench reaching the insulating film formed on the surface of the semiconductor substrate from the back side of the semiconductor substrate after reducing the thickness of the semiconductor substrate;
Insulating and isolating the element formation region by forming an insulating layer in the trench by depositing an insulating material on the surface of the sidewall of the trench while leaving a cavity at least near the central axis of the trench, and also insulating the back surface of the semiconductor substrate Depositing material; and
Depositing a conductive material in a cavity near the central axis of the trench, and depositing a conductive material also on the back surface of the semiconductor substrate,
The element formation region can be electrically shielded by fixing the potential between the conductive material inside the trench and the conductive material on the back surface of the semiconductor substrate.

  According to such a manufacturing method, in addition to the same effects as those of the manufacturing method of claim 1, the conductive material inside the trench and the conductive material on the back surface of the semiconductor substrate are used as in the case of claim 12. Thus, the element formation region can be electrically shielded. As a result, potential interference due to the AC component between adjacent element formation regions can be suppressed.

  According to claim 17, in the step of forming a conductor on the insulating film on the surface of the semiconductor substrate, and the trench facing the conductor formed on the surface side of the semiconductor substrate via the insulating film, It is preferable to further include a step of removing the insulating film at the bottom of the trench on the surface side of the semiconductor substrate to expose the conductor. Thereby, in the step of depositing the conductive material, the conductive material deposited in the trench and the conductor formed on the surface side of the semiconductor substrate can be electrically connected. For this reason, it becomes possible to fix the electric potential between the conductive material inside the trench and the conductive material on the back surface of the semiconductor substrate via the conductor.

The element formation region includes a vertical element formation region in which an electrode is formed on the back side of the semiconductor substrate, and electrically shields the element formation region in the step of depositing the conductive material. The conductive material for forming the conductive layer and the conductive material to be the back electrode of the vertical element forming region are deposited on the back surface of the semiconductor substrate, and the conductive material for electrically shielding the element forming region and the vertical element forming An insulating layer may be formed between the conductive material to be the back electrode of the region.
Thus, even when the back surface electrode of the vertical element formation region is formed on the back surface side of the semiconductor substrate, the conductive material for electrically shielding each element formation region for the other element formation regions Can be formed.

  The conductive material deposited on the back surface of the semiconductor substrate is further bonded to the conductive plate, and the conductive material to be the back electrode of the vertical element forming region is the element forming region. It is preferably formed thicker than a conductive material for electrically shielding. Thereby, since a conductor plate is electrically connected only to the electrically-conductive material used as the back surface electrode of a vertical element formation area, a conductor plate can be utilized as a connection terminal of a back surface electrode.

  21. The method according to claim 20, further comprising a step of bonding the conductive material deposited on the back surface of the semiconductor substrate onto the conductor plate, wherein the conductive material is separated into two layers via an insulating layer on the back surface of the semiconductor substrate. The conductive material that is laminated on the surface and electrically shields the element formation region is insulated from the layer of the conductive material formed on the surface opposite to the surface in contact with the semiconductor substrate by the insulating layer. The conductive material to be the back electrode in the formation region may be electrically connected to a layer of conductive material formed on the surface opposite to the surface in contact with the semiconductor substrate through the insulating layer. Even in this case, the conductor plate is electrically connected only to the conductive material to be the back electrode of the vertical element forming region, and the conductor plate can be used as the connection terminal of the back electrode.

  The conductive material deposited on the back surface of the semiconductor substrate according to claim 21 further comprising the step of joining the conductive material on the conductive plate, and the conductive material inside the trench and the back surface of the semiconductor substrate are connected via the conductive plate. The potential with the conductive material may be fixed. That is, it is also possible to fix the potential between the conductive material inside the trench and the conductive material on the back surface of the semiconductor substrate by using a conductor plate disposed on the back surface side of the semiconductor substrate.

  The element forming region includes a vertical element forming region in which an electrode is formed on the back side of the semiconductor substrate, and the conductor plate is a conductive material for electrically shielding the element forming region. Insulating material is inserted between the region to be bonded and the region to which the conductive material to be the back electrode of the vertical element forming region is bonded, and the divided plate is electrically divided by the insulating material. preferable. Thereby, the role as a connection terminal of the back surface electrode of the vertical element forming region can be exhibited while fixing the potential between the conductive material inside the trench and the conductive material on the back surface of the semiconductor substrate using the conductor plate. .

  According to a twenty-third aspect of the present invention, the potential at which the conductive material inside the trench and the conductive material on the back surface of the semiconductor substrate are fixed is preferably a ground potential. As a result, potential interference in adjacent element formation regions can be prevented while suppressing power consumption.

  According to a twenty-fourth aspect, the melting point of the conductive material may be 1100 ° C. or lower. In other words, in the present invention, after the element is formed on the semiconductor substrate, the conductive material can be deposited inside the trench and on the back surface of the semiconductor substrate, so that the conductive material is not exposed to high-temperature heat treatment when forming the semiconductor element. . For this reason, a relatively low melting point material can be used as the conductive material.

  As described in claim 25, as a result of depositing a conductive material inside the trench, a gap may remain in the vicinity of the central axis inside the trench. If an attempt is made to completely fill the inside of the trench with a conductive material, it takes a long time to deposit the conductive material and the cost increases. Here, since the conductive material in the trench is for preventing potential interference between adjacent element formation regions as described above, even if some gaps remain, the function is not hindered.

  The semiconductor device described in the twenty-sixth to thirty-fifth aspects is a semiconductor device manufactured according to the manufacturing direction of the above-described sixteenth to twenty-fifth aspects. Accordingly, the operational effects obtained by them are substantially the same as the operational effects described in claims 16 to 25, and therefore the description thereof is omitted.

(First embodiment)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing a configuration of a main part of a semiconductor device having an element isolation structure according to the first embodiment of the present invention.

  As shown in FIG. 1, a semiconductor device 1 includes a plurality of element formation regions 5 that are isolated from each other on a wafer substrate 2 for element formation made of a silicon substrate. In each of the element molding regions 5, at least one of an active element (a transistor, a diode, etc.) and a passive element (a resistor, a capacitor, etc.) using a silicon substrate as a semiconductor substrate (wafer substrate) is formed. For example, in the case of a transistor, it has an impurity region 7 formed by appropriately introducing an impurity having a conductivity type opposite to that of the silicon substrate from the surface side of the silicon substrate. The impurity region 7 becomes a source region and a drain region. When a voltage is applied to the gate electrode 9 to form a channel in the region therebetween, a current flows between the source region and the drain region.

  A trench 3 is formed so as to surround the periphery of the plurality of element formation regions 5. An insulating layer 4 is formed in the trench 3 and on the back surface of the wafer substrate 2 by depositing an insulating material such as silicon oxide. The plurality of element formation regions 5 are insulated and separated from each other by the insulating layer 4.

  The trench 3 in which the insulating layer 4 is embedded is formed by etching from the back side of the wafer substrate 2 as will be described later. In the etching process, the LOCOS film 6 that is an insulating film formed on the surface of the wafer substrate 2 is used as an etching stopper. For this reason, the bottom part (tip part on the silicon substrate surface side) of the trench 3 terminates in contact with the LOCOS film 6. As an etching stopper, an STI film may be used instead of the LOCOS film. Although it is possible to use an interlayer insulating film such as a BPSG film as an etching stopper, in order to increase the etching selectivity with the silicon substrate, an oxidation having a thickness of submicron or more such as the LOCOS film or the STI film described above. It is preferable to use an insulating film.

  A thermal oxide film 8 is formed on the surface of the wafer substrate 2 after the above-described active elements and passive elements are formed. On the thermal oxide film 8, the gate electrode 9 described above is formed. The gate electrode 9 is made of a conductor such as polysilicon, tungsten, or aluminum. Thereafter, an interlayer insulating film 10 made of a BPSG film or an NSG film is deposited on the thermal oxide film 8 and the gate electrode 9. Further, the active element and passive element electrodes 11 and the pads 12 formed in the element formation region 5 are formed in a portion where the interlayer insulating film 10 and the thermal oxide film 8 are removed by etching.

  Next, with reference to FIGS. 2A to 2E, a method for manufacturing the semiconductor device 1 having the above configuration will be described.

  First, as shown in FIG. 2A, an element forming wafer substrate 2 made of a silicon substrate is prepared. Then, desired elements are formed in each element formation region 5 from the front surface side of the wafer substrate 2. Thereafter, a thermal oxide film 8, a gate electrode 9, an interlayer insulating film 10, an electrode 11, a passivation film 13 and the like are formed. In the manufacturing method according to the present embodiment, first, semiconductor elements having such a configuration are formed at a plurality of locations on the wafer substrate 2.

  Next, as shown in FIG. 2B, mechanical polishing is performed from the back side of the wafer substrate 2 to reduce the thickness of the wafer substrate 2 (thinning step). In this case, it is only necessary to polish the surface consisting only of the semiconductor substrate instead of polishing the surface in which the semiconductor substrate and the insulating layer are mixed as in the prior art. The back surface can be evenly polished without generating cracks or steps on the back surface. However, the polishing method is not limited to mechanical polishing, and techniques such as chemical mechanical polishing, wet etching, and dry etching may be used.

  Further, in the thinning process, for example, the wafer substrate 2 is polished until the thickness of the wafer substrate 2 becomes 150 μm or less. By reducing the thickness of the wafer substrate 2 to such a thickness, it becomes possible to easily form the trench 3 and deposit the insulating material in the trench 3. However, the mechanical strength of the wafer substrate 2 decreases as the thickness of the wafer substrate 2 decreases. Therefore, the wafer substrate 2 may be cracked or the wafer substrate 2 may be difficult to handle.

  For this reason, when the wafer substrate 2 is thinned by polishing the back surface, it is common to attach a support base to the surface of the wafer substrate 2 to maintain the mechanical strength and to reduce the film thickness. . However, it is not necessary to attach the support base. In this case, it is preferable not to polish the entire surface of the wafer substrate 2, but to polish only the central region 2a surrounded by the outer peripheral portion 2b. As a result, only the thickness of the central region 2a is reduced, and the outer peripheral portion 2b is left without being reduced in thickness. As a result, even if the wafer substrate 2 is thinned, a decrease in mechanical strength can be suppressed as much as possible.

  Further, in the process of attaching the support substrate, it is difficult to apply a temperature of 200 ° C. or higher to the wafer due to the restriction of the holding temperature of the adhesive used for bonding. However, as described above, by leaving the outer peripheral portion 2b of the wafer substrate 2 thick, it is possible to omit the support base, and thus it is possible to perform processing at a temperature higher than 200 ° C. In order to suppress a decrease in mechanical strength, the thickness of the outer peripheral portion 2b is preferably 250 μm or more.

  Next, as shown in FIG. 2C, the thinned wafer substrate 2 is dry-etched from the back side to form the trenches 3. The trench 3 is formed so as to surround each element formation region 5. When the trench 3 reaches the insulating film (LOCOS film 6) on the surface side of the wafer substrate 2, the etching is almost stopped by the insulating film.

  Here, in the present embodiment, the thermal oxide film 8 and the interlayer insulating film 10 are already formed on the surface of the wafer substrate 2 at the time of forming the trench 3. For this reason, even if the trench 3 penetrating the wafer substrate 2 is formed so as to surround each of the plurality of element formation regions 5, each region of the wafer substrate 2 including the plurality of element formation regions 5 has a surface of the wafer substrate 2. The connected state is maintained through the thermal oxide film 8 and the like formed thereon. Therefore, the problem of falling off of the element formation region 5 can be prevented as in the prior art.

  Next, as shown in FIG. 2D, an insulating material such as silicon oxide is deposited from the back side of the wafer substrate 2 by direct oxidation, chemical vapor deposition (CVD), or the like. As a result, the insulating layer 4 is formed inside the trench 3 by filling the inside of the trench 3 with an insulating material. For this reason, the insulating layer 4 is disposed between the plurality of element formation regions 5 of the wafer substrate 2, and the adjacent element formation regions 5 are separated from each other. Further, an insulating material continuous from the inside of the trench 3 is also deposited on the back surface of the wafer substrate 2 to form an insulating layer 4. Thereby, while protecting the back surface of the wafer substrate 2, insulation can also be ensured.

  In the present embodiment, as described above, each region of the wafer substrate 2 can be maintained connected by the thermal oxide film 8 or the like formed on the surface of the wafer substrate 2, so that the trench 3 is filled. It is not always necessary to maintain the connection between the regions of the wafer substrate 2 by the insulating layer 4. Therefore, it is not necessary to densely fill the trench 3 with the insulating material. For example, as a result of depositing the insulating material on the inner surface of the trench 3, a gap may remain in the vicinity of the central axis inside the trench 3.

  Finally, as shown in FIG. 2E, a separation process is performed for separating the wafer substrate 2 into a plurality of chips 20 by dicing. In this separation step, the outer peripheral portion 2 b that is left thick is separated from the chip 20. Through the steps as described above, the semiconductor chip 20 having the element isolation structure according to the present embodiment is completed.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. FIG. 3 is a cross-sectional view illustrating a configuration of a main part of a semiconductor device having an element isolation structure according to the second embodiment.

  The difference between the first embodiment and the second embodiment is that the semiconductor device according to the second embodiment deposits an insulating material on the sidewall surface of the trench 3 and has a relatively low melting point in the cavity near the central axis. For example, a conductive material 14 made of a metal (such as copper or aluminum) having a melting point of 1100 ° C. or less is filled, and the conductive material 14 in a part of the trench 3 is electrically connected to the electrode 9 a provided on the surface of the wafer substrate 2. That is. However, polysilicon having a relatively high melting point may be used as the conductive material 14. Other than that, the structure of the semiconductor device according to the second embodiment and the manufacturing direction thereof are not different from those of the first embodiment.

  Here, if the insulating layer 4 is formed between the element forming regions 5, the DC component of the electric signal generated in each element forming region 5 can be blocked. However, since the AC component of the electrical signal cannot be completely cut off, there is a possibility of causing a malfunction due to propagation of the AC component. However, by fixing the potential of the conductive material 14 in the trench 3 surrounding the element formation region 5 using the above-described configuration, potential interference due to an AC component between adjacent element formation regions 5 can be suppressed. It becomes possible.

  Conventionally, as shown in, for example, Japanese Patent Laid-Open No. 4-154147, a structure for obtaining an electrical shield between separated element forming regions has been proposed. Specifically, a plurality of element formation regions are formed on an SOI substrate, and a polysilicon layer is embedded in a trench formed between element formation regions covered with an oxide film.

  However, in such an element isolation structure, a conductor layer is already formed below and on the side of the element formation region in the element formation process for forming a semiconductor element. For this reason, in order to withstand high-temperature heat treatment in the element formation process, it is necessary to use a refractory metal such as polysilicon or tungsten as the conductor layer, which increases the specific resistance of the conductor layer. Further, in the conventional element isolation structure, the SOI substrate is used to dispose the conductor layer below the element formation region, and this increases the manufacturing cost in combination with the use of the high melting point conductor layer. .

  On the other hand, in this embodiment, the conductive material 14 can be filled in the trench 3 after forming the element in the element forming region 5. Therefore, a metal having a relatively low melting point such as aluminum or copper can be used as the conductive material 14. Further, since the element forming region 5 can be surrounded by the conductive material 14 simply by depositing the conductive material 14, the manufacturing cost can be reduced.

  In order to fill the trench 3 with the conductive material 14, first, the insulating layer 4 is formed on the inner surface of the trench 3 by depositing an insulating material on the side wall surface of the trench 3 while leaving a cavity near the central axis of the trench 3. To do. At this time, an insulating material is also deposited on the back surface of the wafer substrate 2 to form the insulating layer 4.

  Next, in the trench 3 facing the electrode 9a formed on the surface side of the wafer substrate 2 via the thermal oxide film 8, an insulating material is deposited on the bottom of the trench 3 on the surface side of the wafer substrate 2. For example, the thermal oxide film 8 together with the insulating material is removed by anisotropic etching such as ion beam etching to expose the electrode 9 a at the bottom of the trench 3. Then, the conductive material 14 is filled in the cavity near the central axis of the trench 3 including the trench 3 where the electrode 9a is exposed, and the conductive material 14 is also deposited on the back surface of the wafer substrate 2. Thereby, the electrode 9a on the front surface side of the wafer substrate 2 and the conductive material 14 on the back surface side can be electrically conducted through the conductive material 14 in the trench 3, and as a result, the conductive material on the back surface side of the wafer substrate 2 can be obtained. The conductive material 14 connected to 14 and terminating inside the trench 3 can also be obtained to be electrically connected to the electrode 9a on the surface side of the wafer substrate 2.

  In such a configuration, by applying a predetermined potential to the electrode 9a on the front surface side of the wafer substrate 2, the conductive material 14 inside the trench 3 and on the back surface side of the wafer substrate 2 electrically connected to the electrode 9a is obtained. All are fixed at the predetermined potential. Therefore, potential interference due to an AC component between adjacent element formation regions 5 can also be suppressed. Note that the predetermined potential is preferably fixed to the ground potential. As a result, potential interference in adjacent element formation regions can be prevented while suppressing power consumption.

(Third embodiment)
Next, a third embodiment of the present invention will be described. FIG. 4 is a cross-sectional view showing a configuration of a main part of a semiconductor device having an element isolation structure in the third embodiment.

  In the present embodiment, one of the element formation regions 5 is a vertical element formation region 16, the surface electrode 9 b is formed on the front surface side of the wafer substrate 2, and the back electrode 15 is formed on the back surface side. . Further, the back electrode 15 is bonded to the conductor plate 19 via a conductive bonding member 18. Other configurations are not shown, but include a configuration in which the conductive material 14 deposited inside the trench 3 and on the back surface of the wafer substrate 2 is fixed to a predetermined potential by the electrode 9a formed on the front surface side of the wafer substrate 2. This is the same as the semiconductor device according to the second embodiment.

  The back electrode 15 deposited on the back side of the wafer substrate 2 is formed of, for example, the same material as the conductive material 14, and an insulating layer 17 is provided between the back electrode 15 and the conductive material 14 to ensure insulation. Is formed. In order to obtain such a back electrode structure, first, the conductive material 14 is deposited and formed on the entire back surface of the wafer substrate 2 to a predetermined thickness. Thereafter, the conductive material 14 is removed by etching at the formation position of the back surface electrode 15 in the vertical element formation region and the surrounding region. Next, an insulating layer 17 is formed by depositing an insulating material such as silicon oxide by chemical vapor deposition (CVD) or the like. Then, after the insulating layer 17 at the position where the back electrode 15 is formed is removed by etching, a conductive material is again deposited on the back surface of the wafer substrate 2 to form the back electrode 15. When the insulating layer 17 at the position where the back electrode 15 is formed is removed, the previously formed insulating layer 4 is also removed.

  Thereafter, the back electrode 15 is joined to the conductor plate 19 by a joining member 18 made of, for example, solder, silver paste, or metal nanoparticles. The conductor plate 19 is a metal frame that supports the semiconductor chip 20 when the semiconductor chip 20 is packaged, or is provided on the surface of the mother substrate when the semiconductor chip 20 is mounted on the mother substrate. For example, copper foil.

  That is, in the semiconductor device of the third embodiment, the conductive material 14 is laminated on the back surface of the wafer substrate 2 via the insulating layer 17 and the conductive material 14 that electrically shields the element formation region 5 is The insulating layer 17 is insulated from the conductive material layer formed on the surface opposite to the surface in contact with the wafer substrate 2, while the conductive material to be the back electrode 15 of the vertical element forming region 16 is the insulating layer 17. Is electrically connected to a layer of a conductive material formed on the surface opposite to the surface in contact with the wafer substrate 2. Therefore, the conductive material formed on the surface opposite to the surface in contact with the wafer substrate 2 becomes a part of the back electrode 15.

  According to the semiconductor device of the third embodiment configured as described above, even when the back surface electrode 15 of the vertical element forming region 16 is formed on the back surface side of the wafer substrate 2, other element formation is performed. With respect to the region 5, a conductive material 14 for electrically shielding each element formation region 5 can be formed on the back surface of the wafer substrate 2. The conductor plate 19 can be used as a connection terminal for the back electrode 15 by bonding the conductor plate 19 to the back electrode 15. Furthermore, since the heat radiation of the element formation regions 5 and 16 is promoted by the conductor plate 19, the heat dissipation can be improved.

  Next, a modification of the third embodiment will be described. FIG. 5 is a cross-sectional view showing a configuration of a main part of a semiconductor device according to a modification of the third embodiment. In the third embodiment described above, the conductive material is formed in two layers with the insulating layer 17 interposed therebetween. However, in the modification shown in FIG. 5, the conductive material 14 that electrically shields the element formation region 5. Is a single layer structure, and the back surface electrode 15 a of the vertical element formation region 16 is formed thicker than the conductive material 14. The insulating layer 17a is formed on the conductive material 14 by the difference in thickness between the back electrode 15a and the conductive material 14. Accordingly, the back electrode 15a and the insulating layer 17a form the same surface on the surface opposite to the surface in contact with the wafer substrate 2. A surface composed of the back electrode 15 a and the insulating layer 17 a is bonded to the conductor plate 19 via the bonding member 18.

  Even in such a configuration, the back electrode 15 a is insulated from the conductive material 14 by the insulating layer 17 a, and the back electrode 15 a of the vertical element formation region 16 electrically shields the element formation region 5. Therefore, the conductor plate 19 is electrically connected only to the back surface electrode 15 a of the vertical element formation region 16. Therefore, the conductor plate 19 can be used as a connection terminal for the back electrode 15a.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described. In the second and third embodiments described above, the conductive material 14 in the trench 3 and the back surface of the wafer substrate 2 are made conductive by making the electrode 9a provided on the front surface side of the wafer substrate 2 and the conductive material 14 in the trench 3 conductive. The potential of the conductive material 14 on the side was fixed to a predetermined potential. However, since it is necessary to form electrode wiring of each element on the front surface side of the wafer substrate 2, the arrangement place of the electrode 9a is limited. Then, since the diameter of the conductive material 14 in the trench 3 is small and the impedance is relatively high, in particular, the potential of the conductive material 14 in the trench 3 that is not directly connected to the electrode 9a is stably at a predetermined potential. Sometimes it cannot be fixed.

  In view of this point, in the semiconductor device according to the present embodiment, the conductive material 19 bonded to the back surface side of the wafer substrate 2 is used to fix the conductive material 14 inside the trench 3 and the back surface of the wafer substrate 2 to a predetermined potential. Is.

  FIG. 6 is a cross-sectional view showing a configuration of a main part of a semiconductor device having an element isolation structure in the fourth embodiment. As shown in FIG. 6, a conductive material 14 is deposited on the inside of the trench 3 and the back surface of the wafer substrate 2. In the present embodiment, the conductor plate 19 is bonded to the conductive material 14 on the back surface of the wafer substrate 2 deposited and formed in this way via the bonding member 18. For example, a ground potential is applied to the conductor plate 19 as a predetermined potential. As a result, the potential of the conductive material 14 inside the trench 3 and the back surface of the wafer substrate 2 is fixed to a predetermined potential via the conductor plate 19.

  In particular, in the present embodiment, the potential of the conductive material 14 is fixed on the back surface of the wafer substrate 2 by the conductor plate 19 joined so as to cover at least the formation position of the trench 3. In other words, it is not necessary to fix the potential of the conductive material 14 in the other trench 3 via the small-diameter conductive material 14 in the trench 3, so that electrical connection with low impedance is possible. Therefore, the potential of the conductive material 14 inside the trench 3 and the back surface of the wafer substrate 2 can be stably maintained at a predetermined potential.

  Next, a modification of the fourth embodiment will be described. FIG. 7 is a cross-sectional view showing a configuration of a main part of a semiconductor device according to a modification of the fourth embodiment. In the modification shown in FIG. 7, a part of the element formation region 5 is a vertical element formation region 16. While providing the back surface electrode 15 of the vertical element forming region 16 on the back surface of the wafer substrate 2, the conductive material 19 on the back surface side of the wafer substrate 2 is used at the same time, and the conductive material inside the trench 3 and the back surface of the wafer substrate 2 is used. The conductor plate 19 is divided into an electrode plate 19 a connected to the back electrode 15 and a conductive plate 19 b connected to the conductive material 14 in order to give a predetermined potential to 14. An insulating portion 19c is provided between the electrode plate 19a and the conductive plate 19b, and the electrode plate 19a and the conductive plate 19b are insulated and separated.

  By adopting such a configuration, the conductor plate 19 is used to fix the potential of the conductive material 14 inside the trench 3 and the back surface of the wafer substrate 2, and as a connection terminal for the back surface electrode 15 in the vertical element formation region 16. The role of can also be demonstrated.

  The conductor plate 19 may be prepared in advance with a configuration in which the electrode plate 19a and the conductive plate 19b are connected via the insulating portion 19c, and may be bonded to the wafer substrate 2 or the conductor plate 19 may be bonded to the wafer. After bonding to the substrate 2, the region corresponding to the insulating portion 19c may be removed, and an insulating material may be inserted into the removed portion.

  The preferred embodiments according to the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. .

  For example, as shown in FIG. 8, as a result of depositing the conductive material 14 inside the trench 3, a gap may remain in the vicinity of the central axis inside the trench 3. If the inside of the trench 3 is to be completely filled with the conductive material 14, a long time is required for the deposition process of the conductive material 14, and the cost increases. Further, since the conductive material 14 in the trench 14 is for preventing potential interference between the adjacent element formation regions 5 as described above, even if some gaps remain, the function is not hindered.

  As shown in FIG. 9, when the trench 3 is formed in the wafer substrate 2, the trench 3 may intersect with the impurity diffusion layer 7 a in the element formation region 5. Thereby, since an element area can be made small, the cost of the semiconductor chip 20 can be reduced.

  Further, for example, even when the trench 3 is formed so as to surround the element formation region 5 and the insulating layer 4 is formed inside the trench 3 to separate the elements, various arrangement examples of the element formation regions are considered. It is done.

  For example, in FIG. 10, the element formation region 21 is surrounded by a single trench 22 having an insulating layer formed around it, but is not adjacent to other element formation regions, and an isolation region ( Field region) 23 is provided. In this case, it is possible to perform a test for confirming the insulation of the trench 22 by applying a voltage between the field region 23 and the element formation region 21. Further, by fixing the potential of the field region 23, it is possible to suppress potential interference of the element formation region 21.

  Further, like the element formation region 24, a plurality of element formation regions 24 may be arranged adjacent to each other while being partitioned by a single trench 25. In this case, the element formation regions 24 are arranged at a high density. Thus, more semiconductor chips can be obtained from one wafer substrate 2.

  Further, element isolation may be performed by surrounding the element formation region 26 with a plurality of trenches 27 and 28 as in the element formation region 26. In this case, since the voltage can be shared by the plurality of trenches 27 and 28, an element to which a high voltage is applied can be arranged in the element forming region 26.

It is sectional drawing which shows the structure of the principal part of the semiconductor device which has element isolation structure in 1st Embodiment. (A)-(e) is sectional drawing according to process which shows the manufacturing method of the semiconductor device of 1st Embodiment. It is sectional drawing which shows the structure of the principal part of the semiconductor device which has element isolation structure in 2nd Embodiment. It is sectional drawing which shows the structure of the principal part of the semiconductor device which has element isolation structure in 3rd Embodiment. It is sectional drawing which shows the structure of the principal part of the semiconductor device by the modification of 3rd Embodiment. It is sectional drawing which shows the structure of the principal part of the semiconductor device which has element isolation structure in 4th Embodiment. It is sectional drawing which shows the structure of the principal part of the semiconductor device by the modification of 4th Embodiment. It is explanatory drawing which showed the state in which the space | gap remained in the electrically-conductive material in a trench. It is explanatory drawing which showed the state which a trench and the diffusion layer of an element formation area cross | intersect. It is explanatory drawing for demonstrating the example of various arrangement | positioning of the element formation area which element-separates by a trench.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Wafer substrate 3 Trench 4 Insulating layer 5 Element formation area 6 LOCOS film 7 Impurity area 8 Thermal oxide film 9 Gate electrode 10 Interlayer insulating film 11 Electrode

Claims (35)

A method of manufacturing a semiconductor device, wherein at least one of an active element and a passive element using a semiconductor substrate is formed in each of a plurality of element formation regions isolated and separated in one semiconductor substrate,
Preparing a semiconductor substrate having a front surface and a back surface;
Forming at least one active element or passive element in each of a plurality of element formation regions of the semiconductor substrate on the surface side of the semiconductor substrate, and forming an insulating film on the surface of the semiconductor substrate;
Reducing the thickness of the semiconductor substrate from the back side of the semiconductor substrate;
Forming a trench reaching the insulating film formed on the surface of the semiconductor substrate from the back side of the semiconductor substrate so as to surround each of the plurality of element formation regions after reducing the thickness of the semiconductor substrate;
And a step of forming an insulating layer in the trench by depositing an insulating material on the inner surface of the trench to insulate and isolate the element formation region.   2. The method of manufacturing a semiconductor device according to claim 1, wherein as a result of depositing an insulating material on the inner surface of the trench, a gap remains in the vicinity of the central axis inside the trench.   3. The method of manufacturing a semiconductor device according to claim 1, wherein the insulating material deposited on the inner surface of the trench is deposited on the back surface of the semiconductor substrate and is left as it is.   The insulating film formed on the surface of the semiconductor substrate includes a LOCOS film or an STI film formed on a surface layer portion on the surface side of the semiconductor substrate, and the trench is etched using the LOCOS film or the STI film as a stop film. The method of manufacturing a semiconductor device according to claim 1, wherein the semiconductor device is formed by:   5. The method of manufacturing a semiconductor device according to claim 1, wherein in the step of reducing the thickness of the semiconductor substrate, the thickness of the semiconductor substrate is reduced until it becomes 150 μm or less.   6. In the step of reducing the thickness of the semiconductor substrate, only the central region surrounded by the outer peripheral portion is reduced in thickness, and the outer peripheral portion is left without being reduced in thickness. A method for manufacturing a semiconductor device according to any one of the above.   The method of manufacturing a semiconductor device according to claim 6, wherein a thickness of an outer peripheral portion of the semiconductor substrate is 250 μm or more.   8. The method of manufacturing a semiconductor device according to claim 6, further comprising a separation step of separating the semiconductor substrate into a plurality of chips, wherein the outer peripheral portion is separated from the chips in the separation step. . A semiconductor substrate having a front surface and a back surface;
Each surrounding a plurality of element formation regions in the semiconductor substrate, and a trench penetrating the semiconductor substrate;
An insulating layer made of an insulating material formed on the inner surface of the trench to insulate and isolate the plurality of element formation regions;
At least one active element or passive element formed in each of the plurality of element forming regions on the surface side of the semiconductor substrate;
An insulating material for forming the insulating layer is also deposited on the back surface of the semiconductor substrate continuously from the inside of the trench.   The semiconductor device according to claim 9, wherein the trench has a gap near a central axis inside the trench.   The semiconductor device according to claim 9, wherein the semiconductor substrate has a thickness of 150 μm or less. A method of manufacturing a semiconductor device, wherein at least one of an active element and a passive element using a semiconductor substrate is formed in each of a plurality of element formation regions isolated and separated in one semiconductor substrate,
Preparing a semiconductor substrate having a front surface and a back surface;
On the surface side of the semiconductor substrate, at least one active element or passive element is formed in each of a plurality of element formation regions of the semiconductor substrate, an insulating film is formed on the surface of the semiconductor substrate, and further on the insulating film Forming a conductor on the substrate,
Reducing the thickness of the semiconductor substrate from the back side of the semiconductor substrate;
Forming a trench reaching the insulating film formed on the surface of the semiconductor substrate from the back side of the semiconductor substrate after reducing the thickness of the semiconductor substrate;
While leaving a cavity at least near the central axis of the trench, an insulating material is deposited on the sidewall surface of the trench to form an insulating layer in the trench to insulate and isolate the element formation region, and to backside the semiconductor substrate Depositing the insulating material on the substrate;
In the trench facing the conductor formed on the surface side of the semiconductor substrate through the insulating film, the insulating film at the bottom of the trench on the surface side of the semiconductor substrate is removed to expose the conductor A process of
Depositing a conductive material in a cavity near the central axis of the trench, including a trench in which the conductor is exposed, and depositing the conductive material also on a back surface of the semiconductor substrate,
A method of manufacturing a semiconductor device, wherein a conductor on a front surface side and a conductive material on a back surface side of the semiconductor substrate can be electrically conducted through a conductive material in the trench.   13. The method of manufacturing a semiconductor device according to claim 12, wherein the conductive material deposited in the cavity of the trench contains at least one of polysilicon and metal. A semiconductor substrate having a front surface and a back surface;
Each surrounding a plurality of element formation regions in the semiconductor substrate, and a trench penetrating the semiconductor substrate;
Insulating and separating the plurality of element formation regions, at least an insulating layer formed on the side wall surface inside the trench and also formed on the back surface of the semiconductor substrate;
Inside the trench, a conductive material formed to fill a space surrounded by the insulating layer;
At least one active element or passive element formed in each of the plurality of element formation regions on the surface side of the semiconductor substrate;
A conductor formed on the surface of the semiconductor substrate,
The conductive material is deposited on the back surface of the semiconductor substrate continuously from the inside of the trench, and the conductive material in the trench is formed on the surface of the semiconductor substrate in at least one trench. A semiconductor device characterized in that, by being in contact with a body, the conductor on the front surface side and the conductive material on the back surface side of the semiconductor substrate can be electrically conducted through the conductive material inside the trench.   The semiconductor device according to claim 14, wherein the conductive material deposited inside the trench includes at least one of polysilicon and metal. A method of manufacturing a semiconductor device, wherein at least one of an active element and a passive element using a semiconductor substrate is formed in each of a plurality of element formation regions isolated and separated in one semiconductor substrate,
Preparing a semiconductor substrate having a front surface and a back surface;
Forming at least one active element or passive element in each of a plurality of element formation regions of the semiconductor substrate on the surface side of the semiconductor substrate, and forming an insulating film on the surface of the semiconductor substrate;
Reducing the thickness of the semiconductor substrate from the back side of the semiconductor substrate;
Forming a trench reaching the insulating film formed on the surface of the semiconductor substrate from the back side of the semiconductor substrate after reducing the thickness of the semiconductor substrate;
While leaving a cavity at least near the central axis of the trench, an insulating material is deposited on the sidewall surface of the trench to form an insulating layer in the trench to insulate and isolate the element formation region, and to backside the semiconductor substrate Depositing the insulating material on the substrate;
Depositing a conductive material in a cavity near the central axis of the trench, and depositing the conductive material also on the back surface of the semiconductor substrate,
A method of manufacturing a semiconductor device, wherein the element forming region can be electrically shielded by fixing a potential between a conductive material in the trench and a conductive material on the back surface of the semiconductor substrate. Forming a conductor on the insulating film on the surface of the semiconductor substrate;
In the trench facing the conductor formed on the surface side of the semiconductor substrate through the insulating film, the insulating film at the bottom of the trench on the surface side of the semiconductor substrate is removed to expose the conductor And a step of causing
In the step of depositing the conductive material, the conductive material deposited in the trench is electrically connected to the conductor formed on the surface side of the semiconductor substrate, and the trench is interposed via the conductor. The method of manufacturing a semiconductor device according to claim 16, wherein a potential between an internal conductive material and a conductive material on the back surface of the semiconductor substrate is fixed. The element formation region includes a vertical element formation region in which an electrode is formed on the back side of the semiconductor substrate,
In the step of depositing the conductive material, a conductive material for electrically shielding the element formation region and a conductive material to be a back electrode of the vertical element formation region are deposited on the back surface of the semiconductor substrate. In addition, an insulating layer is formed between a conductive material for electrically shielding the element formation region and a conductive material to be a back electrode of the vertical element formation region. The manufacturing method of the semiconductor device of description. Further comprising the step of bonding the conductive material deposited on the back surface of the semiconductor substrate onto the conductor plate;
The conductive material to be the back electrode of the vertical element formation region is formed thicker than the conductive material for electrically shielding the element formation region, so that the conductor plate is formed in the vertical element formation region. 19. The method of manufacturing a semiconductor device according to claim 18, wherein the semiconductor device is electrically connected only to a conductive material to be a back electrode. Further comprising the step of bonding the conductive material deposited on the back surface of the semiconductor substrate onto the conductor plate;
On the back surface of the semiconductor substrate, the conductive material is laminated in two layers via an insulating layer, and the conductive material that electrically shields the element formation region is a surface in contact with the semiconductor substrate by the insulating layer. While being insulated from the conductive material layer formed on the surface opposite to the surface, the conductive material to be the back surface electrode of the vertical element forming region is opposite to the surface contacting the semiconductor substrate through the insulating layer The conductive plate is electrically connected to only the conductive material that becomes the back electrode of the vertical element formation region by being electrically connected to the layer of the conductive material formed on the surface of the vertical element. The method for manufacturing a semiconductor device according to claim 18.   A step of bonding a conductive material deposited on the back surface of the semiconductor substrate onto a conductive plate; and a potential between the conductive material in the trench and the conductive material on the back surface of the semiconductor substrate through the conductive plate. The method of manufacturing a semiconductor device according to claim 16, wherein: The element formation region includes a vertical element formation region in which an electrode is formed on the back side of the semiconductor substrate,
The conductor plate is an insulating material between a region where a conductive material for electrically shielding the element formation region is bonded and a region where a conductive material to be a back electrode of the vertical element formation region is bonded. 23. The method of manufacturing a semiconductor device according to claim 21, wherein a dividing plate is inserted and electrically divided by the insulating material.   23. The method of manufacturing a semiconductor device according to claim 16, wherein a potential at which the conductive material inside the trench and the conductive material on the back surface of the semiconductor substrate are fixed is a ground potential. .   24. The method of manufacturing a semiconductor device according to claim 16, wherein the conductive material has a melting point of 1100 [deg.] C. or lower.   25. The method of manufacturing a semiconductor device according to claim 16, wherein as a result of depositing the conductive material inside the trench, a gap remains in the vicinity of a central axis inside the trench. A semiconductor substrate having a front surface and a back surface;
Each surrounding a plurality of element formation regions in the semiconductor substrate, and a trench penetrating the semiconductor substrate;
Insulating and separating the plurality of element formation regions, at least an insulating layer formed on the side wall surface inside the trench and also formed on the back surface of the semiconductor substrate;
Inside the trench, a conductive material formed to fill a space surrounded by the insulating layer;
At least one active element or passive element formed in each of the plurality of element forming regions on the surface side of the semiconductor substrate;
The conductive material is continuously deposited from the inside of the trench and is also deposited on the back surface of the semiconductor substrate, and by fixing the potential between the conductive material inside the trench and the conductive material on the back surface of the semiconductor substrate, A semiconductor device characterized in that the element formation region can be electrically shielded. Comprising a conductor formed on the surface of the semiconductor substrate;
In at least one of the trenches, the conductive material inside the trench is in contact with the conductor formed on the surface of the semiconductor substrate, so that the conductive material inside the trench and the semiconductor are interposed via the conductor. 27. The semiconductor device according to claim 26, wherein a potential with the conductive material on the back surface of the substrate is fixed. The element formation region includes a vertical element formation region in which an electrode is formed on the back side of the semiconductor substrate,
On the back surface of the semiconductor substrate, a conductive material for electrically shielding the element formation region and a conductive material to be a back electrode of the vertical element formation region are deposited, and the element formation region is 28. The semiconductor device according to claim 27, wherein an insulating layer is formed between a conductive material for electrical shielding and a conductive material to be a back electrode of the vertical element formation region. A conductive plate bonded to a conductive material deposited on the back surface of the semiconductor substrate;
The conductive material to be the back electrode of the vertical element formation region is formed thicker than the conductive material for electrically shielding the element formation region, so that the conductor plate is formed in the vertical element formation region. 29. The semiconductor device according to claim 28, wherein the semiconductor device is electrically connected only to a conductive material to be a back electrode. A conductive plate bonded to a conductive material deposited on the back surface of the semiconductor substrate;
On the back surface of the semiconductor substrate, the conductive material is laminated in two layers via an insulating layer, and the conductive material that electrically shields the element formation region is a surface in contact with the semiconductor substrate by the insulating layer. While being insulated from the conductive material layer formed on the surface opposite to the surface, the conductive material to be the back surface electrode of the vertical element forming region is opposite to the surface contacting the semiconductor substrate through the insulating layer The conductive plate is electrically connected to only the conductive material that becomes the back electrode of the vertical element formation region by being electrically connected to the layer of the conductive material formed on the surface of the vertical element. The semiconductor device according to claim 28.   A conductive plate that is bonded to a conductive material deposited on the back surface of the semiconductor substrate, and fixes a potential between the conductive material in the trench and the conductive material on the back surface of the semiconductor substrate via the conductive plate; 27. The semiconductor device according to claim 26. The element formation region includes a vertical element formation region in which an electrode is formed on the back side of the semiconductor substrate,
The conductor plate is an insulating material between a region where a conductive material for electrically shielding the element formation region is bonded and a region where a conductive material to be a back electrode of the vertical element formation region is bonded. 32. The semiconductor device according to claim 31, wherein the semiconductor device is a divided plate that is inserted and electrically divided by the insulating material.   33. The semiconductor device according to claim 26, wherein a potential at which the conductive material inside the trench and the conductive material on the back surface of the semiconductor substrate are fixed is a ground potential.   34. The semiconductor device according to claim 26, wherein a melting point of the conductive material is 1100 [deg.] C. or lower.   35. The method of manufacturing a semiconductor device according to claim 26, wherein a gap remains in the vicinity of the central axis of the conductive material inside the trench.

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