JP2009070891A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device of a PoP structure which improves the assembling yield of the semiconductor device by remedying package warping. <P>SOLUTION: The semiconductor device includes a first substrate which carries a first semiconductor element mounted thereon and has a core board and resin layers formed on both surfaces of the core board, a second substrate having a second semiconductor element that is mounted on the side of the surface of the first substrate on which the first semiconductor element is mounted, and solder bumps which connect the first and second substrates that are laminated together. The first semiconductor element is covered with a first sealant on its top and side faces. The ratio between the area (As1) of the first substrate in a plan view and the area (Ac1) of the first semiconductor element in a plan view, the ratio between the thickness (ts1) of the first substrate and the thickness (tc1) of the first semiconductor element, and the elastic modulus of the core board under an ordinary temperature are each within a specific range. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor device.

  In recent years, from the viewpoint of environmental protection, a heat-resistant material that does not contain halogen or phosphorus but has flame retardancy and can be bonded to Pb-free solder is required as a substrate material. On the other hand, in the market trend of downsizing, weight reduction, and high functionality of electronic devices, semiconductor devices are highly integrated and surface-mounted. For example, in order to meet the demand for higher pin count and higher speed, package-on-package (package on package: PoP) in which semiconductor packages are stacked vertically, including area mounted semiconductor packages such as ball grid arrays. Development is underway.

  In PoP, a logic package is often used in the lower stage and a memory package is often installed in the upper stage. PoP can be used by selecting a non-defective product, and can be combined with various memory capacity packages and logic packages. It is particularly suitable for applications that require short product cycles such as mobile phone devices and must be small and light. ing.

  Since the semiconductor package is composed of semiconductor elements, sealing materials, substrates, and the like having different physical properties, warping may occur. Especially in PoP, the influence of package warpage is large, and special solder paste is used as a flux of solder balls for mounting to improve the yield of the lower package and the mother board, and further improve the yield of the upper package and the lower package. Devise the mounting process. (Non-Patent Document 1)

ECTC 2006, A Study on Package Stacking Process for Package-on-Package (PoP), Aki Yoshida at. el. Amkor Technology Inc.

  An object of the present invention is to provide a semiconductor device capable of improving the assembly yield of a semiconductor device due to package warpage in a semiconductor device having a PoP structure.

Such an object is achieved by the present invention described in the following (1) to (5).
(1) A first substrate on which a first semiconductor element is mounted and having a core substrate and a resin layer provided on both sides of the core substrate; and a surface of the first substrate on which the first semiconductor element is mounted A semiconductor device in which a second substrate on which a second semiconductor element is mounted is stacked, and the first substrate and the second substrate are connected via solder bumps, and the first semiconductor element includes: The upper and side surfaces are covered with a first sealing material, and the ratio (Ac1 /) between the area (As1) of the first substrate in plan view and the area (Ac1) of the first semiconductor element in plan view As1) is 0.18 to 0.51, and a ratio (tc1 / ts1) between the thickness (ts1) of the first substrate and the thickness (tc1) of the first semiconductor element is 0.28 to 0. .50,
A semiconductor device, wherein the core substrate has an elastic modulus at room temperature of 26 GPa or more.
(2) The semiconductor device according to (1), wherein a thermal expansion coefficient in the in-plane direction of the core substrate of the first substrate is 13 ppm or less.
(3) The semiconductor device according to (1) or (2), wherein the thickness of the first semiconductor element is 30 to 200 μm.
(4) The semiconductor device according to any one of (1) to (3), wherein an elastic modulus (Es1) at 260 ° C. of the core substrate of the first substrate is 15 GPa or more.
(5) Said 1st board | substrate is comprised with the resin composition containing the at least 1 sort (s) of thermosetting resin in an epoxy resin, cyanate resin, benzocyclobutene resin, and bismaleimide triazine resin. 1) The semiconductor device according to any one of (4).

  According to the present invention, the assembly yield of a semiconductor device due to package warpage can be improved in a PoP structure semiconductor device.

Hereinafter, a semiconductor device of the present invention will be described based on preferred embodiments.
As shown in FIG. 1, a semiconductor device 100 includes a first substrate 1 on which a first semiconductor element 11 is mounted, and a second semiconductor element 21 on the upper side of the first substrate 1 (upper side in FIG. 1). The second substrate 2 is laminated. The first substrate 1 and the second substrate 2 are electrically connected via solder bumps 3.
In such a package-on-package semiconductor device, a logic package is often mounted on the lower package, and a memory package is often mounted on the upper package. Therefore, the lower logic package is often thicker than the memory package. Therefore, the influence of the substrate (in the present invention, the first substrate 1) is large in the characteristics of the lower package.

Hereinafter, each substrate will be described.
(First substrate)
As shown in FIG. 2, a first semiconductor element 11 is mounted on the upper side of the first substrate 1 (the upper side in FIG. 2). The upper surface and side surfaces of the first semiconductor element 11 are covered with a first sealing material 12. The functional surface of the first semiconductor element 11 (upper surface in FIG. 2) and the circuit wiring portion 14 of the first substrate 1 are electrically connected by a bonding wire 13.

The first substrate 1 includes a circuit wiring portion 14 formed on the surface, a core substrate 15 disposed between the circuit wiring portions 14, and a resin layer 151 (prepreg) provided on both surfaces of the core substrate 15. Is formed.
Solder balls 16 for secondary mounting are formed on the lower surface of the first substrate 1 (lower surface in FIG. 2). The upper surface and the lower surface of the first substrate 1 are electrically connected by forming a conductive layer or the like in the through hole.

In the present invention, the ratio (Ac1 / As1) of the area (As1) in plan view of the first substrate 1 to the area (Ac1) in plan view of the first semiconductor element 11 is 0.18 to 0.51. It is characterized by being. As a result, warpage can be reduced, and connection reliability with the mother board and the upper package (second substrate) can be ensured.
More specifically, the ratio (Ac1 / As1) is preferably 0.20 to 0.42, and if the ratio is within the range, warpage can be further reduced, and connection reliability can be further improved. Can be secured.

  In the present invention, the ratio (tc1 / ts1) between the thickness (ts1) of the first substrate 1 and the thickness (tc1) of the first semiconductor element 11 is 0.28 to 0.50. And More specifically, the ratio (tc1 / ts1) is preferably 0.30 to 0.38. When the ratio is within the above range, warpage can be further reduced, and connection reliability can be further ensured.

Although the thickness of the 1st board | substrate 1 is not specifically limited, It is preferable that it is 0.20-0.35 mm, and it is especially preferable that it is 0.26-0.35 mm. When the thickness is within the above range, the connection reliability is particularly excellent.
The thickness of the first semiconductor element 11 is not particularly limited, but is preferably 30 to 200 μm, and particularly preferably 50 to 150 μm. When the thickness is within the above range, the connection reliability is particularly excellent.

In the present invention, the core substrate 15 of the first substrate 1 has an elastic modulus at room temperature of 26 GPa or more. As a result, warpage can be reduced, and connection reliability can be further ensured.
More specifically, the elastic modulus is preferably 26 to 35 GPa, and particularly preferably 28 to 33 GPa. When the elastic modulus is within the above range, warpage can be reduced, and connection reliability can be further ensured.
Here, the elastic modulus can be evaluated by, for example, DMA (dynamic thermomechanical measurement).

  The elastic modulus (Es1) at 260 ° C. of the core substrate 15 is not particularly limited, but is preferably 15 GPa or more, and particularly preferably 18 GPa or more. When the elastic modulus at 260 ° C. is within the above range, warpage particularly at 260 ° C. can be reduced, and connection reliability can be further ensured.

  As described above, in the semiconductor device 100 in which the first substrate 1 and the second substrate 2 are electrically connected via the solder bumps 3, the first substrate 1 and the first semiconductor element 11 as described above are provided. By setting the area ratio and thickness ratio of the first substrate 1 and the elastic modulus of the first substrate 1 at room temperature within the above-described ranges, warpage at room temperature and 260 ° C. can be reduced, and connection reliability can be reduced. Thus, it becomes possible to obtain the semiconductor device 100 excellent in the above.

Moreover, the thermal expansion coefficient in the in-plane direction of the core substrate 15 constituting the first substrate 1 is not particularly limited, but the thermal expansion coefficient at 50 ° C. to 100 ° C. in the XY direction is preferably 13 ppm or less, particularly 11 ppm. The following is preferable. When the thermal expansion coefficient is within the above range, the connection reliability is particularly excellent.
Here, the thermal expansion coefficient can be evaluated by, for example, TMA (thermomechanical analysis).

The core substrate 15 can be obtained, for example, by impregnating a sheet-like base material with a resin composition and then drying.
Examples of the resin composition include a thermosetting resin and a filler.
Examples of the thermosetting resin include novolak type phenol resins such as phenol novolak resin, cresol novolak resin, bisphenol A novolak resin, unmodified resol phenol resin, oil-modified resole phenol modified with tung oil, linseed oil, walnut oil, and the like. Phenol resin such as resol type phenol resin such as resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, bisphenol M type epoxy resin, bisphenol P type epoxy resin, bisphenol Z Type epoxy resin, bisphenol type epoxy resin, phenol novolac type epoxy resin, cresol novolac epoxy resin, etc. novolac type epoxy resin, biphenyl type epoxy resin , Biphenyl aralkyl type epoxy resin, aryl alkylene type epoxy resin, naphthalene type epoxy resin, anthracene type epoxy resin, phenoxy type epoxy resin, dicyclopentadiene type epoxy resin, norbornene type epoxy resin, adamantane type epoxy resin, fluorene type epoxy resin, etc. Epoxy resin, urea (urea) resin, resin having triazine ring such as melamine resin, unsaturated polyester resin, bismaleimide resin, polyurethane resin, diallyl phthalate resin, silicone resin, resin having benzoxazine ring, norbornene resin, Examples include cyanate resins, benzocyclobutene resins, bismaleimide triazine resins, and the like.
One of these can be used alone, or two or more having different weight average molecular weights can be used in combination, or one or two or more of these prepolymers can be used in combination.
Among these, in particular, at least one thermosetting resin among epoxy resins, cyanate resins (including cyanate resin prepolymers), benzocyclobutene resins, and bismaleimide triazine resins is preferable. Of these, cyanate resins are most preferred. Thereby, the thermal expansion coefficient of the core board | substrate 15 can be made small. Furthermore, the core substrate 15 is excellent in electrical characteristics (low dielectric constant, low dielectric loss tangent), mechanical strength, and the like.

  The cyanate resin can be obtained by, for example, reacting a halogenated cyanide compound with a phenol and prepolymerizing it by a method such as heating as necessary. Specific examples include bisphenol cyanate resins such as novolac type cyanate resin, bisphenol A type cyanate resin, bisphenol E type cyanate resin, and tetramethylbisphenol F type cyanate resin. Among these, novolac type cyanate resin is preferable. Thereby, the heat resistance improvement by a crosslinking density increase and flame retardance, such as a resin composition, can be improved. This is because the novolac-type cyanate resin forms a triazine ring after the curing reaction. Furthermore, it is considered that novolak-type cyanate resin has a high benzene ring ratio due to its structure and is easily carbonized.

  As said novolak-type cyanate resin, what is shown, for example by Formula (I) can be used.

前記式（Ｉ）で示されるノボラック型シアネート樹脂の平均繰り返し単位ｎは、特に限定されないが、１〜１０が好ましく、特に２〜７が好ましい。平均繰り返し単位ｎが前記下限値未満であるとノボラック型シアネート樹脂は耐熱性が低下し、加熱時に低量体が脱離、揮発する場合がある。また、平均繰り返し単位ｎが前記上限値を超えると溶融粘度が高くなりすぎ、コア基板１５の成形性が低下する場合がある。

The average repeating unit n of the novolak cyanate resin represented by the formula (I) is not particularly limited, but is preferably 1 to 10, and particularly preferably 2 to 7. When the average repeating unit n is less than the lower limit, the novolak cyanate resin has low heat resistance, and the low-mer may be desorbed and volatilized during heating. Moreover, when the average repeating unit n exceeds the upper limit, the melt viscosity becomes too high, and the moldability of the core substrate 15 may be lowered.

Although the weight average molecular weight of the cyanate resin is not particularly limited, a weight average molecular weight of 500 to 4,500 is preferable, and 600 to 3,000 is particularly preferable. When the core substrate 15 is produced when the weight average molecular weight is less than the lower limit, tackiness may occur, and when the core substrates 15 come into contact with each other, they may adhere to each other or transfer of the resin may occur. Moreover, when the weight average molecular weight exceeds the above upper limit, the reaction becomes too fast, and when it is used as a substrate (particularly a circuit substrate), molding defects may occur or the interlayer peel strength may decrease.
The weight average molecular weight of the cyanate resin or the like can be measured by, for example, GPC (gel permeation chromatography, standard substance: converted to polystyrene).

  In addition, although not particularly limited, the cyanate resin can be used alone or in combination of two or more having different weight average molecular weights, or one or two or more of these prepolymers. It can also be used together.

  Although content of the said thermosetting resin is not specifically limited, 5 to 50 weight% of the whole said resin composition is preferable, and 20 to 40 weight% is especially preferable. If the content is less than the lower limit, it may be difficult to form the core substrate 15, and if the content exceeds the upper limit, the strength of the core substrate 15 may be reduced.

Moreover, it is preferable that the said resin composition contains an inorganic filler. Thereby, even if the core substrate 15 is thinned (thickness of 0.5 mm or less), it can be excellent in strength. Furthermore, the reduction in thermal expansion of the core substrate 15 can be improved.
Examples of the inorganic filler include silicates such as talc, calcined clay, unfired clay, mica and glass, oxides such as titanium oxide, alumina, silica and fused silica, calcium carbonate, magnesium carbonate, hydrotalcite and the like. Carbonates, hydroxides such as aluminum hydroxide, magnesium hydroxide, calcium hydroxide, sulfates or sulfites such as barium sulfate, calcium sulfate, calcium sulfite, zinc borate, barium metaborate, aluminum borate, boron Examples thereof include borates such as calcium oxide and sodium borate, nitrides such as aluminum nitride, boron nitride, silicon nitride, and carbon nitride, titanates such as strontium titanate and barium titanate. As the inorganic filler, one of these can be used alone, or two or more can be used in combination. Among these, silica is particularly preferable, and fused silica (particularly spherical fused silica) is preferable in terms of excellent low thermal expansion. The shape is crushed and spherical, but in order to reduce the melt viscosity of the resin composition in order to ensure the impregnation of the fiber substrate, a method of use that suits the purpose, such as using spherical silica, is adopted. .

The average particle diameter of the inorganic filler is not particularly limited, but is preferably 0.01 to 5.0 μm, particularly preferably 0.1 to 2.0 μm. If the particle size of the inorganic filler is less than the lower limit, the viscosity of the varnish becomes high, which may affect the workability when the core substrate 15 is manufactured. When the upper limit is exceeded, phenomena such as sedimentation of the inorganic filler may occur in the varnish.
This average particle diameter can be measured, for example, by a particle size distribution meter (manufactured by HORIBA, LA-500).

  The inorganic filler is not particularly limited, but an inorganic filler having a monodispersed average particle diameter can be used, and an inorganic filler having a polydispersed average particle diameter can be used. Furthermore, one type or two or more types of inorganic fillers having an average particle size of monodispersed and / or polydispersed can be used in combination.

  Furthermore, spherical silica (especially spherical fused silica) having an average particle size of 5.0 μm or less is preferable, and spherical fused silica having an average particle size of 0.01 to 2.0 μm is particularly preferable. Thereby, the filling property of an inorganic filler can be improved.

  Although content of the said inorganic filler is not specifically limited, 20 to 80 weight% of the whole resin composition is preferable, and 30 to 70 weight% is especially preferable. When the content is within the above range, particularly low thermal expansion and low water absorption can be achieved.

When a cyanate resin (particularly a novolac-type cyanate resin) is used as the thermosetting resin, it is preferable to use an epoxy resin (substantially free of halogen atoms). Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, bisphenol M type epoxy resin, bisphenol P type epoxy resin, and bisphenol Z type epoxy resin. Bisphenol type epoxy resins, phenol novolac type epoxy resins, cresol novolac epoxy resins and other novolak type epoxy resins, biphenyl type epoxy resins, xylylene type epoxy resins, biphenyl aralkyl type epoxy resins and other aryl alkylene type epoxy resins, naphthalene type epoxy resins, Anthracene type epoxy resin, phenoxy type epoxy resin, dicyclopentadiene type epoxy resin, norbornene type epoxy resin, adamantane Epoxy resins, fluorene type epoxy resins and the like.
As the epoxy resin, one of them can be used alone, or two or more having different weight average molecular weights are used in combination, or one or two or more and those prepolymers are used in combination. You can also.
Among these epoxy resins, aryl alkylene type epoxy resins are particularly preferable. Thereby, moisture absorption solder heat resistance and a flame retardance can be improved.

  The arylalkylene-type epoxy resin refers to an epoxy resin having one or more arylalkylene groups in a repeating unit. For example, a xylylene type epoxy resin, a biphenyl dimethylene type epoxy resin, etc. are mentioned. Among these, a biphenyl dimethylene type epoxy resin is preferable. The biphenyl dimethylene type epoxy resin can be represented by, for example, the formula (II).

  The average repeating unit n of the biphenyl dimethylene type epoxy resin represented by the formula (II) is not particularly limited, but is preferably 1 to 10, and particularly preferably 2 to 5. When the average repeating unit n is less than the lower limit, the biphenyl dimethylene type epoxy resin is easily crystallized, and the solubility in a general-purpose solvent is relatively lowered, which may make handling difficult. On the other hand, if the average repeating unit n exceeds the upper limit, the fluidity of the resin is lowered, which may cause molding defects.

  Although content of the said epoxy resin is not specifically limited, 1 to 55 weight% of the whole resin composition is preferable, and 2 to 40 weight% is especially preferable. If the content is less than the lower limit, the reactivity of the cyanate resin may decrease, or the moisture resistance of the product obtained may decrease, and if the content exceeds the upper limit, the heat resistance may decrease.

The weight average molecular weight of the epoxy resin is not particularly limited, but a weight average molecular weight of 500 to 20,000 is preferable, and 800 to 15,000 is particularly preferable. If the weight average molecular weight is less than the lower limit, the core substrate 15 may have tackiness. If the weight average molecular weight exceeds the upper limit, the impregnation property into the sheet-like base material is reduced when the core substrate 15 is produced, and the product is uniform. May not be obtained.
The weight average molecular weight of the epoxy resin can be measured by GPC, for example.

  When using cyanate resin (especially novolak-type cyanate resin) as said thermosetting resin, it is preferable to use a phenol resin. Examples of the phenol resin include novolak-type phenol resins, resol-type phenol resins, and arylalkylene-type phenol resins. As the phenolic resin, one of these can be used alone, or two or more having different weight average molecular weights are used in combination, or one or two or more thereof and a prepolymer thereof are used in combination. You can also. Among these, arylalkylene type phenol resins are particularly preferable. Thereby, moisture absorption solder heat resistance can be improved further.

  Examples of the aryl alkylene type phenol resin include a xylylene type phenol resin and a biphenyl dimethylene type phenol resin. The biphenyl dimethylene type phenol resin can be represented by, for example, the formula (III).

前記式（III）で示されるビフェニルジメチレン型フェノール樹脂の繰り返し単位ｎは、特に限定されないが、１〜１２が好ましく、特に２〜８が好ましい。平均繰り返し単位ｎが前記下限値未満であると耐熱性が低下する場合がある。また、前記上限値を超えると他の樹脂との相溶性が低下し、作業性が低下する場合がある。

Although the repeating unit n of the biphenyl dimethylene type phenol resin represented by the formula (III) is not particularly limited, 1 to 12 is preferable, and 2 to 8 is particularly preferable. If the average repeating unit n is less than the lower limit, the heat resistance may be lowered. Moreover, when the said upper limit is exceeded, compatibility with other resin will fall and workability | operativity may fall.

  The combination of the above-mentioned cyanate resin (particularly novolak-type cyanate resin) and arylalkylene-type phenol resin can control the crosslinking density and easily control the reactivity.

  Although content of the said phenol resin is not specifically limited, 1 to 55 weight% of the whole resin composition is preferable, and 5 to 40 weight% is especially preferable. If the content is less than the lower limit, the heat resistance may be reduced, and if the content exceeds the upper limit, the characteristics of low thermal expansion may be impaired.

The weight average molecular weight of the phenol resin is not particularly limited, but a weight average molecular weight of 400 to 18,000 is preferable, and 500 to 15,000 is particularly preferable. If the weight average molecular weight is less than the lower limit, the core substrate 15 may have tackiness. If the weight average molecular weight exceeds the upper limit, the impregnation property into the sheet-like base material is reduced when the core substrate 15 is produced, and the product is uniform. May not be obtained.
The weight average molecular weight of the phenol resin can be measured by, for example, GPC.

  Furthermore, the cyanate resin (especially novolac-type cyanate resin), the phenol resin (arylalkylene-type phenolic resin, particularly biphenyldimethylene-type phenolic resin), and the epoxy resin (arylalkylene-type epoxy resin, especially biphenyldimethylene-type epoxy resin). When a board (especially a circuit board) is produced using a combination with the above, particularly excellent dimensional stability can be obtained.

The resin composition is not particularly limited, but it is preferable to use a coupling agent. The coupling agent uniformly fixes the thermosetting resin and the inorganic filler to the sheet-like substrate by improving the wettability of the interface between the thermosetting resin and the inorganic filler. The heat resistance, particularly the solder heat resistance after moisture absorption can be improved.
As the coupling agent, any commonly used one can be used. Specifically, an epoxy silane coupling agent, a cationic silane coupling agent, an aminosilane coupling agent, a titanate coupling agent, and a silicone oil type coupling. It is preferable to use one or more coupling agents selected from among the agents. Thereby, the wettability with the interface of an inorganic filler can be made high, and thereby heat resistance can be improved more.

  The addition amount of the coupling agent is not particularly limited because it depends on the specific surface area of the inorganic filler, but is preferably 0.05 to 3 parts by weight, particularly 0.1 to 2 parts per 100 parts by weight of the inorganic filler. Part by weight is preferred. If the content is less than the lower limit, the inorganic filler cannot be sufficiently coated, and thus the effect of improving the heat resistance may be reduced. If the content exceeds the upper limit, the reaction is affected, and the bending strength is reduced. There is a case.

  A curing accelerator may be used in the resin composition as necessary. A well-known thing can be used as said hardening accelerator. For example, organic metal salts such as zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), trisacetylacetonate cobalt (III), triethylamine, tributylamine, diazabicyclo [2,2 , 2] tertiary amines such as octane, 2-phenyl-4-methylimidazole, 2-ethyl-4-ethylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxyimidazole Imidazoles such as 2-phenyl-4,5-dihydroxyimidazole, phenolic compounds such as phenol, bisphenol A, and nonylphenol, organic acids such as acetic acid, benzoic acid, salicylic acid, paratoluenesulfonic acid, and the like, or a mixture thereof. . As the curing accelerator, one kind including these derivatives can be used alone, or two or more kinds including these derivatives can be used in combination.

  Although content of the said hardening accelerator is not specifically limited, 0.05-5 weight% of the whole said resin composition is preferable, and 0.2-2 weight% is especially preferable. If the content is less than the lower limit, the effect of promoting curing may not appear, and if the content exceeds the upper limit, the storage stability of the core substrate 15 may be deteriorated.

In the resin composition, thermoplastic resins such as phenoxy resin, polyimide resin, polyamideimide resin, polyphenylene oxide resin, polyethersulfone resin, polyester resin, polyethylene resin, polystyrene resin, styrene-butadiene copolymer, styrene-isoprene copolymer are used. Polystyrene thermoplastic elastomers such as polymers, polyolefin thermoplastic elastomers, polyamide elastomers, thermoplastic elastomers such as polyester elastomers, and diene elastomers such as polybutadiene, epoxy modified polybutadiene, acrylic modified polybutadiene, and methacryl modified polybutadiene are used in combination. May be.
The resin composition may contain additives other than the above components such as pigments, dyes, antifoaming agents, leveling agents, ultraviolet absorbers, foaming agents, antioxidants, flame retardants, and ion scavengers as necessary. May be added.
Moreover, it is preferable that the thermosetting resin etc. which are used with the said resin composition are a thing which does not contain a halogen atom substantially. Thereby, a flame retardance can be provided, without using a halogen compound.
Here, “substantially free of halogen atoms” means, for example, those in which the content of halogen atoms in the epoxy resin is 0.15 wt% or less (JPCA-ES01-2003).

  Examples of the sheet-like substrate include glass fiber substrates such as glass woven fabric and glass nonwoven fabric, polyamide resin fibers, aromatic polyamide resin fibers, polyamide resin fibers such as wholly aromatic polyamide resin fibers, polyester resin fibers, and aromatics. Polyester resin fiber, polyester resin fiber such as wholly aromatic polyester resin fiber, polyimide resin fiber, synthetic fiber substrate composed of woven fabric or nonwoven fabric mainly composed of fluororesin fiber, kraft paper, cotton linter paper, Examples thereof include organic fiber base materials such as paper base materials mainly composed of linter and kraft pulp mixed paper. Among these, a glass fiber base material is preferable. Thereby, the strength and water absorption rate of the core substrate 15 can be improved. In addition, the thermal expansion coefficient of the core substrate 15 can be reduced.

  Examples of the method for impregnating the sheet-like substrate with the resin composition include, for example, preparing a resin varnish using the resin composition of the present invention, and immersing the sheet-like substrate in the resin varnish, and applying with various coaters. The method, the method of spraying with a spray, etc. are mentioned. Among these, the method of immersing a sheet-like base material in a resin varnish is preferable. Thereby, the impregnation property of the resin composition with respect to a sheet-like base material can be improved. In addition, when a sheet-like base material is immersed in a resin varnish, a normal impregnation coating equipment can be used.

  The solvent used in the resin varnish desirably exhibits good solubility in the resin component in the resin composition, but a poor solvent may be used within a range that does not adversely affect the resin varnish. Examples of the solvent exhibiting good solubility include acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, cellosolve and carbitol.

  The solid content of the resin varnish is not particularly limited, but the solid content of the resin composition is preferably 40 to 80% by weight, and particularly preferably 50 to 65% by weight. Thereby, the impregnation property to the fiber base material of the resin varnish can further be improved. The core substrate 15 can be obtained by impregnating the fiber base material with the resin composition and drying at a predetermined temperature, for example, 80 to 200 ° C.

Next, the resin layer will be described.
Resin layers 151 are provided on both surfaces of the core substrate 15 described above.
Examples of the resin layer include a prepreg and a buildup layer.
In the case of a prepreg, it can be obtained by impregnating a sheet-like base material with a resin composition in the same manner as described above and then drying. As the thermosetting resin and filler used for the prepreg, the same materials as those used for the core substrate 15 can be used.

Similarly, the build-up layer is composed of a thermosetting resin constituting the core substrate 15 and a resin composition containing a filler and the like.
As the thermosetting resin and the filler, the same ones as described above can be used.

In addition, it is preferable to contain film forming resin in addition to the above-mentioned thermosetting resin, a filler, etc. in the resin composition which comprises a buildup layer. Thereby, formation of a buildup layer becomes easy, a base material with a buildup layer, etc. can be obtained easily, and workability | operativity can be improved by it.
Examples of the film-forming resin include phenoxy resins, bisphenol F resins, olefin resins, and the like.
As the film-forming resin, one kind including these derivatives can be used alone, or two or more kinds having different weight average molecular weights can be used in combination, or one kind or two kinds or more can be used. A prepolymer can also be used in combination. Among these, a phenoxy resin is preferable. Thereby, heat resistance and a flame retardance can be improved.

Examples of the phenoxy resin include a phenoxy resin having a bisphenol A skeleton, a phenoxy resin having a bisphenol F skeleton, a phenoxy resin having a bisphenol S skeleton, a phenoxy resin having a bisphenol M skeleton, a phenoxy resin having a bisphenol P skeleton, and a bisphenol Z. A phenoxy resin having a bisphenol skeleton such as a phenoxy resin having a skeleton, a phenoxy resin having a novolac skeleton, a phenoxy resin having an anthracene skeleton, a phenoxy resin having a fluorene skeleton, a phenoxy resin having a dicyclopentadiene skeleton, a phenoxy resin having a norbornene skeleton, Examples include phenoxy resins having a naphthalene skeleton, phenoxy resins having a biphenyl skeleton, and phenoxy resins having an adamantane skeleton. It is.
Moreover, as the phenoxy resin, a structure having a plurality of types of skeletons can be used, or phenoxy resins having different ratios of the skeletons can be used. Furthermore, a plurality of types of phenoxy resins having different skeletons can be used, a plurality of types of phenoxy resins having different weight average molecular weights can be used, or prepolymers thereof can be used in combination.

Among these, a phenoxy resin having a biphenyl skeleton and a bisphenol S skeleton can be used. Thereby, the glass transition temperature can be increased due to the rigidity of the biphenyl skeleton, and the adhesion of the plated metal when the multilayer printed wiring board is manufactured can be improved by the bisphenol S skeleton.
Alternatively, a phenoxy resin having a bisphenol A skeleton and a bisphenol F skeleton can be used. Thereby, the adhesiveness to an inner-layer circuit board can be improved at the time of manufacture of a multilayer printed wiring board. Further, the phenoxy resin having the biphenyl skeleton and the bisphenol S skeleton and the phenoxy resin having the bisphenol A skeleton and the bisphenol F skeleton may be used in combination.

The molecular weight of the film-forming resin is not particularly limited, but the weight average molecular weight is preferably 1,000 to 100,000. Furthermore, it is preferable that it is 10,000-60,000.
If the weight average molecular weight of the film-forming resin is less than the lower limit, the effect of improving the film-forming property may not be sufficient. On the other hand, when the upper limit is exceeded, the solubility of the film-forming resin may decrease. By making the weight average molecular weight of the film-forming resin within the above range, the balance of these properties can be made excellent.

Although content of film forming resin is not specifically limited, It is preferable that it is 1 to 40 weight% of the whole resin composition. Furthermore, it is preferable that it is 5 to 30 weight%.
When the content of the film-forming resin is less than the lower limit, the effect of improving the film-forming property may not be sufficient. On the other hand, when the upper limit is exceeded, the content of the cyanate resin is relatively decreased, and thus the effect of imparting low thermal expansion may be reduced. By setting the content of the film-forming resin within the above range, it is possible to achieve an excellent balance of these characteristics.

In addition, similar to the resin composition constituting the core substrate, a coupling agent, a curing accelerator, a pigment, a dye, an antifoaming agent, a leveling agent, an ultraviolet absorber, a foaming agent, an antioxidant, a flame retardant, and an ion trap. You may add additives other than the said components, such as an agent.
Moreover, it is preferable that the thermosetting resin etc. which are used with the said resin composition are a thing which does not contain a halogen atom substantially. Thereby, a flame retardance can be provided, without using a halogen compound.
Here, “substantially free of halogen atoms” means, for example, those in which the content of halogen atoms in the epoxy resin is 0.15 wt% or less (JPCA-ES01-2003).

  In the build-up layer, an imidazole compound is particularly preferable as a curing accelerator. Thereby, moisture absorption solder heat resistance can be improved. And although the said imidazole compound is not specifically limited, It is desirable to have compatibility with the said cyanate resin, an epoxy resin, and a film forming resin component. Here, having compatibility with the cyanate resin, epoxy resin, and film forming resin component means that the imidazole compound is mixed with the cyanate resin, epoxy resin, and film forming resin component, or the imidazole compound is mixed with the cyanate resin. When mixed together with an epoxy resin, a film-forming resin component and an organic solvent, it indicates a property that can be dissolved or dispersed to a state substantially close to the molecular level.

By using such an imidazole compound, the reaction of a cyanate resin or an epoxy resin can be effectively promoted, and equivalent characteristics can be imparted even if the amount of the imidazole compound is reduced.
Furthermore, a resin composition using such an imidazole compound can be cured with high uniformity from a minute matrix unit with a resin component. Thereby, the insulation of a buildup layer and heat resistance can be improved.

And the build-up layer composed of such a resin composition is subjected to a roughening treatment on the surface using an oxidizing agent such as permanganate or dichromate. A large number of minute uneven shapes with high uniformity can be formed on the surface.
When a metal plating process is performed on the surface of the build-up layer after such a roughening process, the smoothness of the roughened surface is high, so that a fine conductor circuit can be accurately formed. Moreover, the anchor effect can be enhanced by the minute uneven shape, and high adhesion can be imparted between the build-up layer and the plated metal.

  Examples of the imidazole compound include 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, and 2,4-diamino-6. -[2'-Methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- (2'-undecylimidazolyl) -ethyl-s-triazine, 2,4-diamino-6 -[2'-ethyl-4-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, etc. be able to.

  Among these, an imidazole compound selected from 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, and 2-ethyl-4-methylimidazole is preferable. These imidazole compounds have particularly excellent compatibility, so that a highly uniform cured product can be obtained and a fine and uniform roughened surface can be formed, so that a fine conductor circuit can be easily formed. In addition, the multilayer printed wiring board can exhibit high heat resistance.

  Although it does not specifically limit as content of the said imidazole compound, 0.01 to 5 weight% is preferable with respect to the sum total of the said cyanate resin and an epoxy resin, and 0.05 to 3 weight% is especially preferable. Thereby, especially heat resistance can be improved.

Such a resin composition can be formed on a substrate, for example, to obtain a buildup layer. That is, a resin varnish is prepared by dissolving / dispersing a resin composition in, for example, a solvent, and the resin varnish is applied to a substrate using various coater devices, and then the resin varnish is sprayed. And a method of drying after spray coating on the substrate.
Among these, it is preferable to apply a resin varnish to a substrate using various coaters such as a comma coater and a die coater and then dry the resin varnish. Thereby, the buildup layer which does not have a void and has a uniform thickness can be efficiently manufactured.

The solvent used in the resin varnish desirably exhibits good solubility in the resin component in the resin composition, but a poor solvent may be used within a range that does not adversely affect the resin varnish. Examples of the solvent exhibiting good solubility include acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, cellosolve and carbitol.
Although it does not specifically limit as solid content in the said resin varnish, 30 to 80 weight% is preferable and especially 40 to 70 weight% is preferable.

  Here, although the thickness of a buildup layer is not specifically limited, It is preferable that it is 5-100 micrometers. More preferably, it is 10-80 micrometers. Thereby, while being excellent in the filling property of the unevenness | corrugation of an inner layer circuit, suitable insulation layer thickness can be ensured.

  Moreover, such a buildup layer can also use what impregnated the above-mentioned resin composition to the sheet-like base material. Thereby, the thermal expansion coefficient of a buildup layer can be made small, and curvature can be reduced by it. In this case, the sheet-like substrate is preferably an organic fiber substrate or a glass fiber substrate having a thickness of 50 μm or less. Thereby, it is excellent in the balance of a low thermal expansion coefficient and workability.

The first substrate 1 can be obtained by stacking the core substrate 15 and the resin layer 151.
Then, the first semiconductor element 11 is bonded to the first substrate 1 via, for example, a die attach film, and the first semiconductor element 11 and the first substrate 1 are electrically connected by the bonding wire 13. 1 The semiconductor element 11 is sealed with a first sealing material 12 so as to cover the top and side surfaces (FIG. 2).

  Moreover, in the 1st board | substrate 1, ratio (te1 / ts1) of the thickness (ts1) of the 1st board | substrate 1 and the thickness (te1) of the 1st sealing material 12 is 0.2-2.0. It is preferable that it is 0.77-1.35 especially. Thereby, connection reliability with the mother board and the upper package (second substrate 2) can be ensured.

Moreover, the 1st sealing material 12 is comprised with the hardened | cured material of the resin composition containing an epoxy resin, a phenol resin hardening | curing agent, a hardening accelerator, an inorganic filler etc., for example.
The elastic modulus at 260 ° C. of the sealing material (that is, a cured product of a resin composition composed of an epoxy resin, a phenol resin curing agent, etc.) is not particularly limited, but is preferably 400 MPa or more and 1,200 MPa or less. And it is preferable that the thermal expansion coefficient in 260 degreeC is 20 ppm or more and 50 ppm or less. Thereby, the curvature in normal temperature can be reduced more and the connection reliability with a motherboard and an upper stage package (2nd board | substrate 2) can be improved more.

  Such a 1st board | substrate 1 can be used suitably as a bottom board | substrate of a package on package structure. The bottom substrate of the package-on-package structure is required to have less warpage than a normal substrate for reliability of connection with the mother board and the upper package (second substrate 2). However, the first substrate 1 as described above is required. Can be suitably used as a bottom substrate of a package-on-package structure since warpage of the substrate at room temperature is particularly small.

(Second board)
Next, the second substrate 2 will be described.
As shown in FIG. 3, the second semiconductor element 21 is mounted on the upper side of the second substrate 2 (upper side in FIG. 3). The upper surface and side surfaces of the second semiconductor element 21 are covered with a second sealing material 22. The functional surface of the second semiconductor element 21 (upper side surface in FIG. 3) and the circuit wiring portion 24 of the second substrate 2 are electrically connected by a bonding wire 23.
The second substrate 2 is composed of a core substrate 2a.
The core substrate 2a may be the same as or different from the core substrate 15 of the first substrate 1. The first substrate 1 has been described as being composed of the core substrate 15 and the resin layer 151. However, in the case of the second substrate 2, a semiconductor element for memory is often mounted. Often there are few. Therefore, there are many cases where it is mainly composed of only the core substrate 2a.

  Although the thickness of the 2nd board | substrate 2 is not specifically limited, 50-220 micrometers is preferable and 100-220 micrometers is especially preferable. When the thickness is within the above range, the connection reliability with the lower package (first substrate 1) is particularly excellent.

  The ratio (ts1 / ts2) between the thickness (ts1) of the first substrate 1 and the thickness (ts2) of the second substrate 2 is not particularly limited, but is preferably 0.5 to 5.0, particularly preferably 0.8. 9 to 4.0 are preferred. When the ratio is within the above range, the connection reliability between the upper package and the lower package is particularly excellent.

  The elastic modulus at normal temperature of the core substrate 2a of the second substrate 2 is not particularly limited, but is preferably 26 to 35 GPa, particularly preferably 26 to 30 GPa. When the elastic modulus is within the above range, the connection reliability with the lower package is particularly excellent.

  Ratio of the elastic modulus at normal temperature of the core substrate 15 of the first substrate 1 and the elastic modulus at normal temperature of the core substrate 2a of the second substrate 2 (elastic modulus of the second substrate 2 / elastic modulus of the first substrate 1). Is not particularly limited, but is preferably 6.4 to 1.1 (Top / Btm), more preferably 7.4 to 1.0. When the ratio is within the above range, the connection reliability between the upper package and the lower package is excellent.

  As the 2nd sealing material 22, the thing similar to what comprises the 1st sealing material 12 can be used.

(Semiconductor device)
The semiconductor device 100 can be obtained by bonding the first substrate 1 on which the first semiconductor element 11 as described above is mounted and the second substrate 2 on which the second semiconductor element 21 is mounted.
The first substrate 1 and the second substrate 2 are bonded via, for example, solder balls 16 as shown in FIG. Here, in the present invention, since the first substrate 1 as described above is used as the lower substrate of the semiconductor device having a package-on-package structure, the assembly yield of the semiconductor device due to package warpage can be improved. It is. That is, it is found that when the area ratio of the first substrate and the first semiconductor element as described above in a plan view is in a specific range, the first substrate and the first semiconductor element have a greater influence on the package warpage. By controlling them, the assembly yield of the semiconductor device can be improved.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example and a comparative example, this invention is not limited to this.

Example 1
1. 1. Production of first substrate 1.1 Core substrate Novolak-type cyanate resin (Lonza Japan Co., Ltd., Primaset PT-60, weight average molecular weight of about 2,600) 15% by weight (hereinafter abbreviated as%) and biphenyldimethylene type 8% epoxy resin (Nippon Kayaku Co., Ltd., NC-3000P, epoxy equivalent 275), 7% biphenyldimethylene type phenol resin (Maywa Kasei Co., Ltd., MEH-7851-S, hydroxyl equivalent 203), epoxy silane type An inorganic filler is prepared by dissolving 0.3 parts by weight (hereinafter abbreviated as “parts”) of a coupling agent (manufactured by Nihon Unicar Co., Ltd., A-187) in methyl ethyl ketone with respect to 100 parts by weight of an inorganic filler described later. Spherical fused silica SFP-10X (manufactured by Denki Kagaku Kogyo Co., Ltd., average particle size 0.3 μm) 20% and spherical fused silica SO-32R (ADMATEX) A resin varnish was prepared by adding 50% (average particle size: 1.5 μm) and stirring for 10 minutes using a high-speed stirrer.
Next, the above-mentioned resin varnish is made of glass woven fabric (a plain weave base material made of E glass, thickness 100 μm, warp weave density 60 / inch, weft weave density 58 / inch, manufactured by Nitto Boseki Co., Ltd. , WEA-116E, thermal expansion coefficient 6 ppm / ° C. from room temperature to 250 ° C.) and dried in a heating furnace at 120 ° C. for 2 minutes to obtain a varnish solid content (ratio of resin and silica in the prepreg) of about 50 % Prepreg was obtained.
One obtained prepreg and a 12 μm copper foil on each side were overlaid and heat-pressed at a pressure of 4 MPa and a temperature of 200 ° C. for 2 hours to obtain a 0.1 mm core substrate (thermal expansion coefficient 11 ppm).

1.2 Resin layer The resin varnish used in the formation of the core substrate is impregnated in a glass woven fabric (WEA-1037, thickness 24 μm, manufactured by Nitto Boseki Co., Ltd.), dried in a heating furnace at 120 ° C. for 2 minutes, and then varnished. A prepreg having a solid content (ratio of resin and silica in the prepreg) of about 72% was obtained.

1.3 Production of first substrate A conductor wiring layer having a predetermined pattern is formed on the copper foil on the surface of the core substrate, and the surface of the core substrate and the conductor wiring layer are roughened with a chemical solution. The resin layer was vacuum pressed.
Via holes were formed by laser at predetermined positions in the resin layer (via hole forming step).
Next, a conductor layer in the via hole and further a conductor wiring layer were formed by a semi-additive method. Specifically, a copper film (seed film) of about 1 μm was formed on the entire surface of the insulating layer by electroless plating, and then a photoresist (mask) having a predetermined pattern was formed on the insulating layer. Then, the plating film was formed in the part (for example, via hole etc.) in which the mask was not formed by electrolytic plating. As a result, a conductor layer was formed in the via hole, and further, a conductor wiring layer was formed on the surface of the insulating layer.
Then, after removing the mask, the conductor wiring layer was roughened, and the above-described vacuum press, via hole forming step, conductor layer and conductor wiring layer forming step were performed. By repeating this operation, a multilayer board having a plurality of insulating layers and a plurality of conductor wiring layers is formed, and then an etching resist film is formed on the uppermost conductor wiring layer to thereby form the first substrate (size 14 × 14 mm, thickness 0.26 mm).

A first semiconductor element (size 7 × 7 mm, thickness 0.1 mm) is bonded to the first substrate via a die attach film (manufactured by Sumitomo Bakelite Co., Ltd., product number: Sumilite IBF-3021). The first substrate was electrically connected with a bonding wire and then sealed with a first sealing material so as to cover the top and side surfaces of the first semiconductor element.
At this time, a ratio (Ac1 / As1) of an area (As1) in plan view of the first substrate and an area (Ac1) in plan view of the first semiconductor element is 0.25, and the first The ratio (tc1 / ts1) between the thickness (ts1) of the substrate and the thickness (tc1) of the first semiconductor element was 0.38.

2. Production of Second Substrate Next, a second substrate (size 14 × 14 mm, thickness 0.13 mm) was obtained using a double-sided plate made only of the core substrate described above as the second substrate. A second semiconductor element (size 10 × 10 mm, thickness 0.35 mm) is bonded to the second substrate via a die attach film (manufactured by Sumitomo Bakelite Co., Ltd., product number: Sumilite IBF-3021). The second substrate was electrically connected with a bonding wire and then sealed with a second sealing material so as to cover the upper and side surfaces of the second semiconductor element to obtain a second substrate.
At this time, a ratio (Ac2 / As2) of an area (As2) in plan view of the second substrate and an area (Ac2) in plan view of the second semiconductor element is 0.59, and the second The ratio (tc2 / ts2) between the thickness (ts2) of the substrate and the thickness (tc2) of the second semiconductor element was 2.70.

3. Manufacturing of package-on-package semiconductor device The first substrate and the second substrate described above are arranged so that the first substrate is a bottom substrate, and solder-connected, whereby the package-on-package semiconductor device is manufactured. Obtained.

(Example 2)
The size of the first substrate is 14 × 14 mm, the size of the first semiconductor element is 6 × 6 mm, the area (As1) in plan view of the first substrate, and the area (Ac1) in plan view of the first semiconductor element. ) And the ratio (Ac1 / As1) to 0.18 were the same as in Example 1.

(Example 3)
The size of the first substrate is 14 × 14 mm, the size of the first semiconductor element is 10 × 10 mm, the area (As1) in plan view of the first substrate, and the area (Ac1) in plan view of the first semiconductor element. ) And the ratio (Ac1 / As1) to 0.51 were the same as Example 1.

Example 4
The thickness of the first substrate is 0.35 mm, the thickness of the first semiconductor element is 0.1 mm, and the ratio between the thickness (ts1) of the first substrate and the thickness (tc1) of the first semiconductor element Example 1 was repeated except that (tc1 / ts1) was changed to 0.29.

(Example 5)
Example 1 was repeated except that the following was used as the core substrate.
30% novolak-type cyanate resin (Lonza Japan, Primaset PT-60, weight average molecular weight of about 2,600) and biphenyldimethylene type epoxy resin (Nippon Kayaku, NC-3000P, epoxy equivalent 275) 16 %, Biphenyl dimethylene type phenol resin (Maywa Kasei Co., Ltd., MEH-7851-S, hydroxyl group equivalent 203) 14%, and epoxy silane type coupling agent (Nihon Unicar Co., Ltd., A-187) to be described later 0.3 part of 100 parts by weight of the material is dissolved in methyl ethyl ketone at room temperature, and 10% spherical fused silica SFP-10X (manufactured by Denki Kagaku Kogyo Co., Ltd., average particle size 0.3 μm) is used as an inorganic filler. Thermal expansion using resin varnish added with 30% silica SO-32R (manufactured by Admatechs, average particle size 1.5 μm) To obtain a core substrate having 13 ppm.

(Example 6)
In the preparation of the resin varnish of Example 1, the total amount of the novolak cyanate resin (Lonza Japan, Primaset PT-60, weight average molecular weight of about 2,600) was added to the biphenyldimethylene type epoxy resin (Nippon Kayaku Co., Ltd.). , NC-3000P, epoxy equivalent 275).

(Comparative Example 1)
The size of the first substrate is 14 × 14 mm, the size of the first semiconductor element is 5 × 5 mm, the area (As1) in plan view of the first substrate, and the area (Ac1) in plan view of the first semiconductor element. ) And the ratio (Ac1 / As1) to 0.13 were the same as in Example 1.

(Comparative Example 2)
The size of the first substrate is 14 × 14 mm, the size of the first semiconductor element is 11 × 11 m, the area (As1) of the first substrate in plan view, and the area of the first semiconductor element (Ac1) ) And the ratio (Ac1 / As1) to 0.62 were the same as in Example 1.

(Comparative Example 3)
The thickness of the first substrate is 0.40 mm, the thickness of the first semiconductor element is 0.1 mm, and the ratio of the thickness of the first substrate (ts1) to the thickness of the first semiconductor element (tc1) Example 1 was repeated except that (tc1 / ts1) was changed to 0.25.

(Comparative Example 4)
The thickness of the first substrate is 0.17 mm, the thickness of the first semiconductor element is 0.1 mm, and the ratio between the thickness of the first substrate (ts1) and the thickness of the first semiconductor element (tc1) Example 1 was repeated except that (tc1 / ts1) was changed to 0.59.

(Comparative Example 5)
The core substrate was the same as Example 1 except that the following was used.
ELC-4762 (elastic modulus 25 GPa at room temperature) manufactured by Sumitomo Bakelite Co., Ltd. was used as the core substrate.

  The semiconductor device obtained in each example and comparative example was evaluated as follows. The evaluation items are shown together with the contents. The obtained results are shown in Table 1.

1. Package warpage Package warpage was evaluated with a temperature variable laser three-dimensional measuring machine (LS200-MT100MT50: manufactured by T-Tech Corporation).

2. Motherboard mountability Motherboard mountability was evaluated with a flying checker (1116X-YC Hitester: manufactured by HIOKI) after mounting the motherboard. A 100-point continuity test was conducted, and the disconnected location was examined. Each code is as follows.
(Double-circle): There was no disconnection location.
○: There were 1 to 10 disconnection points.
(Triangle | delta): The disconnection location was 11-50 locations.
X: The disconnection location was 51 or more locations.

3. Connection Reliability Connection reliability was evaluated with a flying checker (1116X-Y C Hitester: manufactured by HIOKI) after TC500 cycle processing. A 100-point continuity test was conducted, and the disconnected location was examined. Each code is as follows.
(Double-circle): There was no disconnection location.
○: There were 1 to 10 disconnection points.
(Triangle | delta): The disconnection location was 11-50 locations.
X: The disconnection location was 51 or more locations.

As is apparent from Table 1, Examples 1 to 6 had small package warpage. Therefore, improvement of the assembly yield of the semiconductor device was suggested.
Moreover, Examples 1-6 (especially Example 1 and 2) were excellent also in the motherboard mounting reliability and connection reliability.

It is sectional drawing which shows an example of a semiconductor device. It is sectional drawing which shows an example of a 1st board | substrate. It is sectional drawing which shows an example of a 2nd board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st board | substrate 11 1st semiconductor element 12 1st sealing material 13 Bonding wire 14 Circuit wiring part 15 Core board | substrate 151 Resin layer 16 Solder ball 2 2nd board | substrate 2a Core board | substrate 21 2nd semiconductor element 22 2nd sealing material 23 Bonding wire 24 Circuit wiring part 3 Solder bump 100 Semiconductor device

Claims (5)

A first substrate on which a first semiconductor element is mounted and having a core substrate and a resin layer provided on both sides of the core substrate, and a second semiconductor on the side of the first substrate on which the first semiconductor element is mounted A semiconductor device in which a second substrate on which an element is mounted is laminated, and the first substrate and the second substrate are connected via solder bumps,
The upper part and the side of the first semiconductor element are covered with a first sealing material,
The ratio (Ac1 / As1) of the area (As1) in plan view of the first substrate to the area (Ac1) in plan view of the first semiconductor element is 0.18 to 0.51;
A ratio (tc1 / ts1) between the thickness (ts1) of the first substrate and the thickness (tc1) of the first semiconductor element is 0.28 to 0.50;
A semiconductor device, wherein the core substrate has an elastic modulus at room temperature of 26 GPa or more.   2. The semiconductor device according to claim 1, wherein a coefficient of thermal expansion in an in-plane direction of the core substrate of the first substrate is 13 ppm or less.   The semiconductor device according to claim 1, wherein the first semiconductor element has a thickness of 30 to 200 μm.   4. The semiconductor device according to claim 1, wherein an elastic modulus (Es1) at 260 ° C. of the core substrate of the first substrate is 15 GPa or more.   5. The first substrate is composed of a resin composition containing at least one thermosetting resin among epoxy resin, cyanate resin, benzocyclobutene resin and bismaleimide triazine resin. The semiconductor device in any one of.

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