JP2009066613A5 - - Google Patents

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Publication number
JP2009066613A5
JP2009066613A5 JP2007235832A JP2007235832A JP2009066613A5 JP 2009066613 A5 JP2009066613 A5 JP 2009066613A5 JP 2007235832 A JP2007235832 A JP 2007235832A JP 2007235832 A JP2007235832 A JP 2007235832A JP 2009066613 A5 JP2009066613 A5 JP 2009066613A5
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JP
Japan
Prior art keywords
cutter wheel
glass substrate
vertical movement
pedestal
peripheral surface
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Application number
JP2007235832A
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English (en)
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JP2009066613A (ja
JP5060880B2 (ja
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Application filed filed Critical
Priority to JP2007235832A priority Critical patent/JP5060880B2/ja
Priority claimed from JP2007235832A external-priority patent/JP5060880B2/ja
Priority to TW097125515A priority patent/TWI394628B/zh
Priority to KR1020080070920A priority patent/KR101211427B1/ko
Priority to CN2008102151778A priority patent/CN101386467B/zh
Publication of JP2009066613A publication Critical patent/JP2009066613A/ja
Publication of JP2009066613A5 publication Critical patent/JP2009066613A5/ja
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Publication of JP5060880B2 publication Critical patent/JP5060880B2/ja
Expired - Fee Related legal-status Critical Current
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Description

取付フレーム１５には、さらにカッターホイール１８が、上下移動調節機構１７を介して取り付けられている。このカッターホイール１８は、焼結ダイヤモンドまたは超硬合金を材料とし、外周面に頂点を刃先とするＶ字形の稜線部を備えたものであって、ガラス基板Ｇへの圧接力が上下移動調節機構１７によって微細に調整できるようになっている。カッターホイール１８は、専ら、ガラス基板Ｇの端縁に初期亀裂ＴＲ（図２）を形成するときに、台座７をＸ方向に移動させつつ一時的に下降させるようにして用いる。
JP2007235832A 2007-09-11 2007-09-11 脆性材料基板の分断装置および分断方法 Expired - Fee Related JP5060880B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007235832A JP5060880B2 (ja) 2007-09-11 2007-09-11 脆性材料基板の分断装置および分断方法
TW097125515A TWI394628B (zh) 2007-09-11 2008-07-07 The splitting device and segmentation method of brittle material substrate
KR1020080070920A KR101211427B1 (ko) 2007-09-11 2008-07-22 취성재료기판의 절단장치 및 절단방법
CN2008102151778A CN101386467B (zh) 2007-09-11 2008-09-10 脆性材料基板的分割装置和分割方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007235832A JP5060880B2 (ja) 2007-09-11 2007-09-11 脆性材料基板の分断装置および分断方法

Publications (3)

Publication Number Publication Date
JP2009066613A JP2009066613A (ja) 2009-04-02
JP2009066613A5 true JP2009066613A5 (ja) 2010-10-14
JP5060880B2 JP5060880B2 (ja) 2012-10-31

Family

ID=40476174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007235832A Expired - Fee Related JP5060880B2 (ja) 2007-09-11 2007-09-11 脆性材料基板の分断装置および分断方法

Country Status (4)

Country Link
JP (1) JP5060880B2 (ja)
KR (1) KR101211427B1 (ja)
CN (1) CN101386467B (ja)
TW (1) TWI394628B (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5478957B2 (ja) * 2009-06-30 2014-04-23 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
KR101097324B1 (ko) 2009-12-29 2011-12-23 삼성모바일디스플레이주식회사 레이저 커팅 방법 및 유기 발광 소자의 제조방법
DE102010028589A1 (de) * 2010-05-05 2011-11-10 Robert Bosch Gmbh Verfahren zur Herstellung eines keramischen Sensorelements
US9266195B2 (en) * 2011-03-29 2016-02-23 Jfe Steel Corporation Laser welding method
KR101250223B1 (ko) * 2011-04-28 2013-04-09 주식회사 엠엠테크 레이저 절단장치용 절단 헤드
KR101250225B1 (ko) * 2011-05-03 2013-04-09 주식회사 엠엠테크 레이저 절단장치 및 절단방법
JP2014195040A (ja) * 2013-02-27 2014-10-09 Mitsuboshi Diamond Industrial Co Ltd Ｌｅｄ素子の製造方法、ｌｅｄ素子製造用ウェハ基材およびｌｅｄ素子の製造装置
WO2014157245A1 (ja) * 2013-03-26 2014-10-02 旭硝子株式会社 ガラス板の加工方法、およびガラス板の加工装置
CN103386549B (zh) * 2013-04-09 2016-04-13 杨波 一种激光模切机的排烟气管结构
CN103203554A (zh) * 2013-04-09 2013-07-17 杨波 一种激光模切机
DE102015104802A1 (de) * 2015-03-27 2016-09-29 Schott Ag Verfahren zum Trennen von Glas mittels eines Lasers, sowie verfahrensgemäß hergestelltes Glaserzeugnis
KR102167941B1 (ko) * 2016-05-25 2020-10-20 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 기판의 분단 방법
CN106077970B (zh) * 2016-06-30 2018-04-20 维沃移动通信有限公司 一种电阻陶瓷基板的加工方法
JP6775822B2 (ja) * 2016-09-28 2020-10-28 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置
CN107199410B (zh) * 2017-07-25 2019-04-02 东莞市盛雄激光设备有限公司 一种激光切割设备及其切割方法
JP6997566B2 (ja) * 2017-09-14 2022-01-17 株式会社ディスコ レーザー加工装置
CN108393596B (zh) * 2018-05-07 2024-03-01 王立国 一种双工位多功能激光裁切机
WO2020130165A1 (ko) * 2018-12-18 2020-06-25 이석준 취성재료의 레이저 절단 가공방법
JP7323792B2 (ja) * 2019-08-13 2023-08-09 日本製鉄株式会社 レーザー照射装置及び鋼板の加工システム
CN112828474B (zh) * 2020-12-31 2022-07-05 武汉华工激光工程有限责任公司 用于透明脆性材料的斜向切割补偿方法及系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03285786A (ja) * 1990-03-30 1991-12-16 Toshiba Corp レーザ加工装置
KR100673073B1 (ko) * 2000-10-21 2007-01-22 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치
JPWO2003008168A1 (ja) * 2001-07-16 2004-11-04 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ装置
TW583046B (en) * 2001-08-10 2004-04-11 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing brittle material substrate
KR100794284B1 (ko) * 2001-09-29 2008-01-11 삼성전자주식회사 비금속 기판 절단 방법
JP3887394B2 (ja) * 2004-10-08 2007-02-28 芝浦メカトロニクス株式会社 脆性材料の割断加工システム及びその方法
JP2007099587A (ja) * 2005-10-07 2007-04-19 Kyoto Seisakusho Co Ltd 脆性材料の割断加工方法

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