JP2009010357A5 - - Google Patents

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Publication number
JP2009010357A5
JP2009010357A5 JP2008137578A JP2008137578A JP2009010357A5 JP 2009010357 A5 JP2009010357 A5 JP 2009010357A5 JP 2008137578 A JP2008137578 A JP 2008137578A JP 2008137578 A JP2008137578 A JP 2008137578A JP 2009010357 A5 JP2009010357 A5 JP 2009010357A5
Authority
JP
Japan
Prior art keywords
connection layer
printed wiring
wiring board
substrate
dimensional printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008137578A
Other languages
English (en)
Japanese (ja)
Other versions
JP5228626B2 (ja
JP2009010357A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008137578A priority Critical patent/JP5228626B2/ja
Priority claimed from JP2008137578A external-priority patent/JP5228626B2/ja
Publication of JP2009010357A publication Critical patent/JP2009010357A/ja
Publication of JP2009010357A5 publication Critical patent/JP2009010357A5/ja
Application granted granted Critical
Publication of JP5228626B2 publication Critical patent/JP5228626B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008137578A 2007-05-29 2008-05-27 立体プリント配線板とその製造方法 Expired - Fee Related JP5228626B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008137578A JP5228626B2 (ja) 2007-05-29 2008-05-27 立体プリント配線板とその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007141522 2007-05-29
JP2007141522 2007-05-29
JP2008137578A JP5228626B2 (ja) 2007-05-29 2008-05-27 立体プリント配線板とその製造方法

Publications (3)

Publication Number Publication Date
JP2009010357A JP2009010357A (ja) 2009-01-15
JP2009010357A5 true JP2009010357A5 (https=) 2011-06-30
JP5228626B2 JP5228626B2 (ja) 2013-07-03

Family

ID=40325088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008137578A Expired - Fee Related JP5228626B2 (ja) 2007-05-29 2008-05-27 立体プリント配線板とその製造方法

Country Status (1)

Country Link
JP (1) JP5228626B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3507638B2 (ja) 1996-11-13 2004-03-15 株式会社東芝 サイリスタ式パルス放電回路
BR112013026086A2 (pt) * 2012-02-16 2020-08-11 Sony Corporation aparelho de transmissão, método de transmissão e aparelho de recepção

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3375555B2 (ja) * 1997-11-25 2003-02-10 松下電器産業株式会社 回路部品内蔵モジュールおよびその製造方法
JP2000277913A (ja) * 1999-03-25 2000-10-06 Kyocera Corp 多層配線基板及びその製造方法
JP2001237549A (ja) * 2000-02-25 2001-08-31 Matsushita Electric Ind Co Ltd 多層配線基板およびその製造方法
JP4168223B2 (ja) * 2000-05-10 2008-10-22 日本ゼオン株式会社 硬化性樹脂組成物、絶縁材料及び回路基板
JP2003298232A (ja) * 2002-04-02 2003-10-17 Sony Corp 多層配線基板の製造方法および多層配線基板
JP4689375B2 (ja) * 2005-07-07 2011-05-25 富士通株式会社 積層基板および該積層基板を有する電子機器

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