JP2008305818A - 冷却装置及び基板の処理装置 - Google Patents
冷却装置及び基板の処理装置 Download PDFInfo
- Publication number
- JP2008305818A JP2008305818A JP2007148793A JP2007148793A JP2008305818A JP 2008305818 A JP2008305818 A JP 2008305818A JP 2007148793 A JP2007148793 A JP 2007148793A JP 2007148793 A JP2007148793 A JP 2007148793A JP 2008305818 A JP2008305818 A JP 2008305818A
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- JP
- Japan
- Prior art keywords
- substrate
- supply pipe
- main body
- cooling medium
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
【解決手段】冷却装置は偏平ボックス状をなす本体10と、この本体10内に挿入される冷却媒体供給管11と、この冷却媒体供給管11に取り付けられるとともに前記本体の内表面に向けて冷却媒体を噴出するノズル12と、ノズル12から本体10内に噴出された水(冷媒)を回収する配管13と、この配管13からの水を所定温度まで冷却するチラー14と、チラー14によって冷却された水を再び前記冷却媒体供給管11に送り込む循環用配管15を備えている。
【選択図】図2
Description
Claims (3)
- 偏平ボックス状をなす本体と、この本体内に挿入される冷却媒体供給管と、この冷却媒体供給管に取り付けられるとともに前記本体の内表面に向けて冷却媒体を噴出するノズルとを備えることを特徴とする冷却装置。
- 請求項1に記載の冷却装置において、前記ノズルは前記本体の内表面に対して斜めに配置され、また本体内の一端寄りに挿入された冷却媒体供給管には他の供給管に取り付けられたノズルとは逆方向に傾斜したノズルも取り付けられていることを特徴とする冷却装置。
- 基板の搬送ラインの途中に露光装置を配置し、この露光装置の直前に、請求項1または請求項2に記載の冷却装置を配置したことを特徴とする基板の処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007148793A JP5103060B2 (ja) | 2007-06-05 | 2007-06-05 | 冷却装置及び基板の処理装置 |
US12/156,896 US8189169B2 (en) | 2007-06-05 | 2008-06-05 | Cooling apparatus and substrate treating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007148793A JP5103060B2 (ja) | 2007-06-05 | 2007-06-05 | 冷却装置及び基板の処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008305818A true JP2008305818A (ja) | 2008-12-18 |
JP5103060B2 JP5103060B2 (ja) | 2012-12-19 |
Family
ID=40095570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007148793A Expired - Fee Related JP5103060B2 (ja) | 2007-06-05 | 2007-06-05 | 冷却装置及び基板の処理装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8189169B2 (ja) |
JP (1) | JP5103060B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100070888A (ko) * | 2008-12-18 | 2010-06-28 | 삼성전자주식회사 | 기판 처리 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10312943A (ja) * | 1997-05-12 | 1998-11-24 | Komatsu Ltd | 温度制御装置 |
JP2002064133A (ja) * | 2000-03-30 | 2002-02-28 | Ibiden Co Ltd | 支持容器および半導体製造・検査装置 |
JP2006005364A (ja) * | 2004-06-19 | 2006-01-05 | Samsung Electronics Co Ltd | 熱処理装置 |
JP2006303104A (ja) * | 2005-04-19 | 2006-11-02 | Tokyo Electron Ltd | 加熱装置、塗布、現像装置及び加熱方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4153781B2 (ja) * | 2002-01-31 | 2008-09-24 | 大日本スクリーン製造株式会社 | 熱処理装置および基板処理装置 |
JP4115873B2 (ja) | 2003-04-14 | 2008-07-09 | 大日本スクリーン製造株式会社 | 熱処理装置および基板処理装置 |
JP2004207750A (ja) | 2004-02-12 | 2004-07-22 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US8550372B2 (en) * | 2005-03-02 | 2013-10-08 | Wisconsin Alumni Research Foundation | Full coverage spray and drainage system and method for orientation-independent removal of high heat flux |
JP4815847B2 (ja) | 2005-04-11 | 2011-11-16 | 株式会社ニコン | 基板処理装置及び露光装置 |
JP2007142190A (ja) * | 2005-11-18 | 2007-06-07 | Canon Inc | 露光装置及びデバイス製造方法 |
-
2007
- 2007-06-05 JP JP2007148793A patent/JP5103060B2/ja not_active Expired - Fee Related
-
2008
- 2008-06-05 US US12/156,896 patent/US8189169B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10312943A (ja) * | 1997-05-12 | 1998-11-24 | Komatsu Ltd | 温度制御装置 |
JP2002064133A (ja) * | 2000-03-30 | 2002-02-28 | Ibiden Co Ltd | 支持容器および半導体製造・検査装置 |
JP2006005364A (ja) * | 2004-06-19 | 2006-01-05 | Samsung Electronics Co Ltd | 熱処理装置 |
JP2006303104A (ja) * | 2005-04-19 | 2006-11-02 | Tokyo Electron Ltd | 加熱装置、塗布、現像装置及び加熱方法 |
Also Published As
Publication number | Publication date |
---|---|
US8189169B2 (en) | 2012-05-29 |
US20080304027A1 (en) | 2008-12-11 |
JP5103060B2 (ja) | 2012-12-19 |
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