JP2008277345A - Diode having lead leg for absorbing deformation force of terminal board - Google Patents
Diode having lead leg for absorbing deformation force of terminal board Download PDFInfo
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- JP2008277345A JP2008277345A JP2007115941A JP2007115941A JP2008277345A JP 2008277345 A JP2008277345 A JP 2008277345A JP 2007115941 A JP2007115941 A JP 2007115941A JP 2007115941 A JP2007115941 A JP 2007115941A JP 2008277345 A JP2008277345 A JP 2008277345A
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Abstract
Description
本発明は、温度変化による端子板の変形によって生じる力を吸収して強固な半田接続部分を保持できるダイオードに関する。特に、本発明のダイオードは、温度変化が著しい環境で使用される太陽電池パネル用端子箱において、放熱効果向上のために拡大された端子板を有する端子板回路に使用するために好適なものである。 The present invention relates to a diode that can absorb a force generated by deformation of a terminal plate due to a temperature change and retain a strong solder connection portion. In particular, the diode of the present invention is suitable for use in a terminal plate circuit having a terminal plate expanded for improving a heat dissipation effect in a terminal box for a solar cell panel used in an environment where temperature change is remarkable. is there.
ダイオードは一般に、回路内でその機能を発揮させるために、ダイオードのリード足を端子板に半田付けすることによって電気的に接続される。 In general, a diode is electrically connected by soldering a diode lead to a terminal board in order to perform its function in a circuit.
ダイオードの端子板への電気的接続は、通常の使用では、強固に接続されているが、太陽電池パネル用端子箱内に設置される端子板では、温度変化が著しい環境で使用されるため、端子板の平面方向の膨張・収縮が頻繁に起こり、従ってダイオードのリード足の端子板への半田付け部分がそれに耐えきれずにクラックを形成して半田が容易に剥離してしまうという問題があった。 The electrical connection to the terminal plate of the diode is firmly connected in normal use, but the terminal plate installed in the terminal box for solar cell panel is used in an environment where the temperature change is significant, There is a problem that the expansion and contraction of the terminal plate in the plane direction frequently occurs, and therefore the soldered portion of the diode lead foot to the terminal plate cannot withstand it and a crack is formed and the solder easily peels off. It was.
特に、特許文献1の太陽電池パネル用端子箱のように、ダイオードの放熱効果向上のために拡大された端子板を有するものは、端子板の平面方向の膨張・収縮が半田付け部分に大きく伝達されるため、上記の問題が顕著に表れていた。従って、かかる環境においても強固な半田付け部分を維持できる方法が求められていた。
本発明は、かかる従来技術の現状に鑑み創案されたものであり、その目的は、戸外に設置される太陽電池パネル用端子箱内のような温度変化の激しい環境下で使用しても強固な半田接続部分を維持することができるダイオード、及びそのダイオードを半田付けした端子板回路、並びにそれを含む太陽電池パネル用端子箱を提供することにある。 The present invention was devised in view of the current state of the prior art, and its purpose is robust even when used in an environment where the temperature changes rapidly, such as in a terminal box for a solar cell panel installed outdoors. An object of the present invention is to provide a diode capable of maintaining a solder connection portion, a terminal board circuit to which the diode is soldered, and a solar cell panel terminal box including the diode.
本発明者は、かかる目的を達成するために、端子板の変形によってダイオードと端子板との半田接続部分に伝達される力を吸収する構造について鋭意検討した結果、温度変化による端子板の変形のうち平面方向の膨張及び収縮の力が半田接続部分の欠陥の最も大きな原因であること、そしてこの力を吸収できる形状部分をリード足に設けることによって半田接続部分が温度変化の激しい環境でも十分に強固に維持できることを見出し、本発明の完成に至った。 In order to achieve this object, the inventor has intensively studied a structure that absorbs the force transmitted to the solder connection portion between the diode and the terminal plate by the deformation of the terminal plate. Of these, the expansion and contraction force in the planar direction is the biggest cause of defects in the solder connection part, and by providing the lead foot with a shape part that can absorb this force, the solder connection part is sufficient even in an environment where the temperature changes rapidly As a result, the present invention has been completed.
即ち、本発明は、端子板に半田付けされるリード足を有するダイオードであって、リード足の少なくとも一部に端子板の平面方向の膨張及び収縮の力を吸収する形状部分を形成したことを特徴とするダイオードである。 That is, the present invention is a diode having a lead foot soldered to a terminal board, and a shape portion that absorbs the expansion and contraction force in the planar direction of the terminal board is formed on at least a part of the lead leg. This is a characteristic diode.
本発明のダイオードの好ましい態様では、前記リード足の力吸収形状部分がU形状、S形状又はそれらの組み合わせのような湾曲部分を有し、前記湾曲部分が端子板の平面方向に対して実質的に垂直方向に向けられる。 In a preferred aspect of the diode of the present invention, the force absorption shape portion of the lead foot has a curved portion such as a U shape, an S shape, or a combination thereof, and the curved portion is substantially in the plane direction of the terminal plate. Oriented vertically.
また、本発明は、前記ダイオード、及び端子板を含む端子板回路であって、前記ダイオードのリード足が前記端子板に半田付けされていることを特徴とする端子板回路であり、その好ましい態様では、前記端子板が、前記ダイオードから発生した熱を十分に放散できるように拡大されている。 Further, the present invention is a terminal plate circuit including the diode and the terminal plate, wherein a lead leg of the diode is soldered to the terminal plate, and a preferable mode thereof Then, the terminal plate is enlarged so that heat generated from the diode can be sufficiently dissipated.
さらに、本発明は、前記端子板回路を含むことを特徴とする太陽電池パネル用端子箱である。 Furthermore, this invention is a terminal box for solar cell panels characterized by including the said terminal board circuit.
本発明のダイオードは、リード足に端子板の平面方向の膨張及び収縮の力を吸収する形状部分を形成しているので、半田付けしている端子板が温度変化によって膨張・収縮を繰り返しても、前述の力吸収形状部分がその膨張・収縮による力を吸収して半田接続部分への力の伝達を緩和することができ、結果として半田接続部分の信頼性の向上に寄与することができる。また、本発明のダイオードは、ダイオード本体が半田付けされる端子板の部分とリード足の先端が半田付けされる端子板の部分が分離されて同一平面上にない場合のようにリード足が上下方向に応力を受ける場合も半田接続部分への力の伝達を緩和することができる。従って、本発明のダイオードは、太陽電池パネル用端子箱内で拡大された端子板を有する環境で使用するために特に好適である。 In the diode of the present invention, the lead leg is formed with a shape portion that absorbs the expansion and contraction force in the planar direction of the terminal plate. Therefore, even if the terminal plate soldered repeatedly expands and contracts due to temperature changes. The force absorbing shape portion described above can absorb the force due to the expansion / contraction and can relax the transmission of the force to the solder connecting portion, thereby contributing to the improvement of the reliability of the solder connecting portion. In addition, the diode of the present invention is such that the terminal plate portion to which the diode body is soldered and the terminal plate portion to which the tip of the lead foot is soldered are separated and are not on the same plane. Even when stress is applied in the direction, transmission of force to the solder connection portion can be relaxed. Therefore, the diode of the present invention is particularly suitable for use in an environment having a terminal plate enlarged in a solar cell panel terminal box.
本発明のダイオードは、そのリード足を端子板に半田付けしたときに、その半田付けされた部分が端子板の温度変化による変形の影響を強く受けないように、端子板の平面方向の膨張及び収縮の力を吸収する形状部分をリード足の少なくとも一部に形成したことを特徴とする。 In the diode of the present invention, when the lead leg is soldered to the terminal board, the soldered portion is not strongly affected by the deformation due to the temperature change of the terminal board. The shape portion that absorbs the contraction force is formed on at least a part of the lead foot.
ダイオードのリード足の前述の力吸収形状部分は、ダイオードが端子板に半田付けされたときの端子板の平面方向の力を効果的に吸収できる限り、いずれの形状も採用することができ、例えば湾曲部分を有する形状であって、この湾曲部分が端子板から離れる方向又は端子板に近づく方向に、好ましくは端子板の平面方向に対して実質的に垂直方向に向けられているものが挙げられる。ここで言う湾曲部分は、リード足を直角又は鋭角又は鈍角に曲げたときのリード足の厚みから生じる表面の小さな湾曲を含まない。具体的には、前記湾曲部分がU形状、S形状、又はそれらの組み合わせの形状であって、それらの突出した湾曲部分が端子板の平面方向に対して実質的に垂直方向に向けられているものが挙げられる。実際には、ダイオードのリード足は、その末端部が端子板に半田付けされるため、取り付け時に末端部が端子板に接触又は接近されるような形状であることが好ましく、前述の力吸収部分は、ダイオード本体から末端部までのリード足の延出部分の途中に設けられることが好ましい。このように方向付けられた湾曲部分を有する力吸収形状部分は、端子板の平面方向の膨張及び収縮に対してアコーディオン状に膨張及び収縮することができ、従って半田接続部分への端子板の平面方向の力の伝達を大幅に軽減することができる。 Any shape can be adopted as the above-described force absorption shape portion of the diode lead foot as long as the force in the planar direction of the terminal plate can be effectively absorbed when the diode is soldered to the terminal plate. A shape having a curved portion, the curved portion being directed away from the terminal plate or in a direction approaching the terminal plate, preferably substantially perpendicular to the plane direction of the terminal plate. . The curved portion referred to here does not include a small curvature of the surface resulting from the thickness of the lead foot when the lead foot is bent at a right angle or an acute angle or an obtuse angle. Specifically, the curved portion is U-shaped, S-shaped, or a combination thereof, and the protruding curved portions are oriented substantially perpendicular to the planar direction of the terminal board. Things. In practice, since the end portion of the diode lead is soldered to the terminal plate, it is preferable that the end portion is in contact with or close to the terminal plate during mounting. Is preferably provided in the middle of the extended portion of the lead leg from the diode body to the end portion. The force-absorbing shaped part with the curved part oriented in this way can expand and contract in an accordion-like manner against the expansion and contraction of the terminal board in the plane direction, and thus the plane of the terminal board to the solder connection part Directional force transmission can be greatly reduced.
次に本発明のダイオードの一例を図面に基づいて説明する。図1(a),(b)はそれぞれ、本発明のダイオードの側面図及び斜視図である。図1から明らかなように、本発明のダイオードのリード足の末端部は端子板に取り付けやすいように端子板に平行して接近する形状を有し、ダイオード本体からこの末端部までのリード足の延出部分の途中には、取り付け時の端子板から離れる方向(上方向)に湾曲部分を有するU形状部分がある。本発明のダイオードでは、このU形状部分により端子板の平面方向の膨張及び収縮の力を吸収するようにしている。一方、図2(a),(b)及び図3(a),(b)はそれぞれ、従来のダイオードの二つの例の側面図及び斜視図である。図2及び図3から明らかなように、従来のダイオードのリード足の末端部は端子板に取り付けやすいように端子板に接近する形状を有するが、ダイオード本体からこの末端部までのリード足の延出部分の途中には、直角に曲がる部分が存在するだけで、端子板の平面方向の膨張及び収縮の力を効果的に吸収することができない。 Next, an example of the diode of the present invention will be described with reference to the drawings. 1A and 1B are a side view and a perspective view of a diode of the present invention, respectively. As is clear from FIG. 1, the end portion of the lead leg of the diode of the present invention has a shape approaching in parallel with the terminal plate so that it can be easily attached to the terminal plate. In the middle of the extended portion, there is a U-shaped portion having a curved portion in a direction away from the terminal board at the time of attachment (upward direction). In the diode of the present invention, the U-shaped portion absorbs the expansion and contraction force in the planar direction of the terminal plate. On the other hand, FIGS. 2A and 2B and FIGS. 3A and 3B are a side view and a perspective view of two examples of a conventional diode, respectively. As is apparent from FIGS. 2 and 3, the end portion of the lead leg of the conventional diode has a shape approaching the terminal plate so that it can be easily attached to the terminal plate. In the middle of the protruding portion, there is only a portion that bends at a right angle, and the force of expansion and contraction in the planar direction of the terminal board cannot be effectively absorbed.
本発明のダイオードは、前述の力吸収形状部分を有する限り、いずれの種類のダイオードも使用することができ、例えば面実装型ダイオード、ベアーチップダイオード、パッケージ型ダイオードなどを使用することができる。また、本発明のダイオードは、そのリード足を端子板に半田付けして端子板回路を構成することができ、このとき端子板はダイオードから発生した熱を十分に放散できるように拡大することができる。このように形成した端子板回路は、特に温度変化が激しい環境で使用される太陽電池パネル用端子箱に組み込まれて使用されると効果を発揮する。 As long as the diode of the present invention has the above-described force absorbing shape portion, any type of diode can be used. For example, a surface mount diode, a bare chip diode, a package diode, or the like can be used. In addition, the diode of the present invention can be configured to form a terminal board circuit by soldering its lead legs to the terminal board, and at this time, the terminal board can be expanded so as to sufficiently dissipate the heat generated from the diode. it can. The terminal board circuit formed in this manner exhibits an effect when it is incorporated and used in a terminal box for a solar cell panel used in an environment where the temperature change is particularly severe.
本発明のダイオードが温度変化の激しい環境下でも半田接続部分の欠陥を生じないことを以下に示すが、本発明はこれらの例に限定されるものではない。 Although it will be shown below that the diode of the present invention does not cause a defect in the solder connection portion even under an environment where the temperature changes greatly, the present invention is not limited to these examples.
本発明例として図1に記載のダイオードを用意し、比較例1,2としてそれぞれ図2、図3に記載のダイオードを用意し、図4に記載のように各ダイオードを端子板に半田付けして端子板回路を作成した。かくして形成された端子板回路を太陽電池パネル用端子箱に入れてシリコン樹脂で封止した。なお、これらの端子箱を本発明例及び比較例1,2の試験のためにそれぞれ10個ずつ作成した。 The diode shown in FIG. 1 is prepared as an example of the present invention, the diodes shown in FIGS. 2 and 3 are prepared as comparative examples 1 and 2, and each diode is soldered to a terminal board as shown in FIG. Terminal board circuit was created. The terminal board circuit thus formed was put in a solar cell panel terminal box and sealed with silicon resin. In addition, ten terminal boxes were prepared for each of the examples of the present invention and the comparative examples 1 and 2.
次に、本発明例及び比較例1,2の端子箱を温度−60℃、湿度40%で30分、+100℃、湿度40%で30分を1サイクルとする冷熱衝撃試験に供した。これらの試験は、250,500,750,又は1000サイクルで行ない、それぞれのサイクルの終了後にダイオードの定格電流を流し、そのときの電圧を測定した。この電圧が定格電圧より高い場合、半田にクラックや剥がれなどの問題が生じた可能性があるので解体してダイオードのリード足と端子の半田接続部分を顕微鏡で観察し、実際に半田に問題があるものをNGとして評価した。表1にその結果を示す。 Next, the terminal boxes of the present invention example and Comparative Examples 1 and 2 were subjected to a thermal shock test in which one cycle was a temperature of −60 ° C. and a humidity of 40% for 30 minutes, and + 100 ° C. and a humidity of 40% for 30 minutes. These tests were performed at 250, 500, 750, or 1000 cycles, and after the end of each cycle, the rated current of the diode was passed and the voltage at that time was measured. If this voltage is higher than the rated voltage, there may have been a problem such as cracking or peeling in the solder, so disassembly and observation of the diode lead feet and terminal solder joints with a microscope will actually cause problems with the solder. Some were evaluated as NG. Table 1 shows the results.
上記の表1から明らかなように、本発明例は、1000サイクルの冷熱衝撃試験に供しても半田接続部分に問題を生じなかったのに対し、比較例1,2は、500サイクルまたは750サイクル以上になると半田接続部分の問題が生じうることがわかる。 As is apparent from Table 1 above, the inventive example did not cause a problem in the solder joint even when subjected to the thermal shock test of 1000 cycles, whereas Comparative Examples 1 and 2 had 500 cycles or 750 cycles. It turns out that the problem of a solder connection part may arise if it becomes above.
本発明のダイオードによれば、温度変化の激しい環境下で端子板が膨張・収縮してもその力を吸収できる部分を有するので、太陽電池パネル用端子箱内の端子板回路のような過酷な使用環境において極めて有用である。 According to the diode of the present invention, since it has a portion that can absorb the force even when the terminal plate expands and contracts under an environment where the temperature changes severely, it is a severe condition such as a terminal plate circuit in a terminal box for a solar cell panel. It is extremely useful in the usage environment.
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Citations (6)
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JPH01215054A (en) * | 1988-02-24 | 1989-08-29 | Toshiba Corp | Semiconductor device |
JP2001077391A (en) * | 1999-09-01 | 2001-03-23 | Oonanba Kk | Solar cell module connecting terminal box device |
JP2001135847A (en) * | 1999-11-05 | 2001-05-18 | Kanegafuchi Chem Ind Co Ltd | Semiconductor device and terminal box provided therewith |
JP2002093978A (en) * | 2000-09-11 | 2002-03-29 | Minebea Co Ltd | Semiconductor lead structure and method for tightly fixing semiconductor to heat radiation plate |
JP2005251962A (en) * | 2004-03-04 | 2005-09-15 | Oonanba Kk | Terminal box for solar cell panel |
JP2006165227A (en) * | 2004-11-15 | 2006-06-22 | Oonanba Kk | Terminal box for solar panel |
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2007
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01215054A (en) * | 1988-02-24 | 1989-08-29 | Toshiba Corp | Semiconductor device |
JP2001077391A (en) * | 1999-09-01 | 2001-03-23 | Oonanba Kk | Solar cell module connecting terminal box device |
JP2001135847A (en) * | 1999-11-05 | 2001-05-18 | Kanegafuchi Chem Ind Co Ltd | Semiconductor device and terminal box provided therewith |
JP2002093978A (en) * | 2000-09-11 | 2002-03-29 | Minebea Co Ltd | Semiconductor lead structure and method for tightly fixing semiconductor to heat radiation plate |
JP2005251962A (en) * | 2004-03-04 | 2005-09-15 | Oonanba Kk | Terminal box for solar cell panel |
JP2006165227A (en) * | 2004-11-15 | 2006-06-22 | Oonanba Kk | Terminal box for solar panel |
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