JP2008270607A - Light emitting apparatus and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively utilize a reflection property of light in a reflection part and to appropriately control an upper surface shape of a sealing material that seals a light-emitting element. <P>SOLUTION: When manufacturing a light emitting apparatus comprising a reflection part 100 having a coarse surface, being constituted of a porous material and including a through-hole and a mounting part 110 which closes one end of the through-hole and mounts a light-emitting element 120 thereon, a manufacturing method includes: an application step of applying a coating into a recess on the coarse surface of the reflection part 100; a burning step of generating, within the recess, an intra-recess form 106 by burning the coating applied into the recess in the application step; and a sealing step of filling, with a sealing material 134 having mobility, a recess that is burnt in the burning step, formed by closing the one end of the through-hole of the reflection part 100 with the mounting part 110 with the light-emitting element 120 thereon. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device having a reflecting portion that reflects light emitted from a light emitting element, and a method for manufacturing the light emitting device.

  2. Description of the Related Art In a light emitting device including a light emitting element such as a light emitting diode (LED), a form using a ceramic package as a package for mounting the light emitting element is known.

  As a ceramic package, a light emitting diode package in which a base material is applied to a tapered opening formed in a base body on which a light emitting element is mounted and a reflective material is further applied to the surface of the applied base material is described. (For example, refer to Patent Document 1).

In the package described in Patent Document 1, the luminance of the light emitting diode is improved by providing a reflective surface on the surface of the base material.
Japanese Patent Laid-Open No. 2006-60070

However, in the package described in Patent Document 1, since the base agent and the reflective material are applied, the manufacturing process increases.
Further, the light extraction efficiency for extracting the light emitted from the light emitting element to the outside of the light emitting device depends on the reflectance of the reflective substance. Therefore, it is difficult to utilize the reflection characteristics of the ceramic base body itself in a state where the reflective substance is applied.
Here, it is conceivable to make use of the reflection characteristics of the base body itself without applying the base agent and the reflective material to the base body forming the reflective portion. However, in this configuration, when the package is filled with the sealing material, the sealing material enters the concave portion of the ceramic surface which is a porous material and has a rough surface, and thus it is difficult to control the top shape of the sealing material. It is.

  The present invention has been made in view of the above circumstances, and an object thereof is to appropriately control the shape of the top surface of the sealing material that seals the light emitting element while utilizing the light reflection characteristics of the reflecting portion. There is to do.

  In order to achieve the above object, the present invention includes a reflective portion having a through hole formed of a porous material having a rough surface, and a mounting portion on which one end of the through hole is closed and a light emitting element is mounted. In manufacturing a light emitting device, a coating material is applied to the rough surface of the reflective portion, and the coating material is infiltrated into the concave portion of the rough surface. A firing step for generating a formed product in the recess, and a fluid seal in a recess formed by closing one end of the through hole of the reflection portion fired in the firing step by the mounting portion on which the light emitting element is mounted. There is provided a method of manufacturing a light emitting device including a sealing step of filling a material.

  Further, the coating substance may be composed of an organosilicon compound. The porous material may be ceramic, and the recess may be a ceramic open pore. Furthermore, the coating substance that penetrates into the recesses in the coating process may be silicone oil, and the formed material in the recesses may be an inorganic material generated by baking silicone oil. And it is preferable that a baking process bakes silicone oil at the temperature of 500 to 1000 degreeC. Furthermore, the sealing step may include a curing step for curing the sealing material filled in the depression.

  Further, in the present invention, the reflecting surface is formed of a porous material having a rough surface, has a through hole, a mounting portion that closes one end of the through hole and mounts the light emitting element, and a recess in the rough surface of the reflecting portion. There is provided a light emitting device including an in-recess formed product formed inside and a sealing portion that fills the through hole of the reflecting portion and seals the light emitting element.

  Here, the porous material may be ceramic, and the recess may be an open pore of ceramic. And the formation in a recessed part may be an inorganic material produced | generated in the open pores by baking the coating substance applied to the reflection part into the open pores and firing the penetrated coating substance. Further, the in-recess formed product may be transmissive to light emitted from the light emitting element.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to utilize the reflective characteristic of the light of a reflection part, the upper surface shape of the sealing material which seals a light emitting element can be controlled appropriately.

[First Embodiment]
FIG. 1 shows a longitudinal sectional view of a light emitting device according to a first embodiment of the present invention. Moreover, FIG. 2 shows the schematic diagram which expanded a part of reflective surface which concerns on the 1st Embodiment of this invention.

(Configuration of Light Emitting Device 10)
The light emitting device 10 is mounted on the reflecting portion 100 having the through hole 101, the mounting portion 110 provided at one end of the through hole 101 of the reflecting portion 100, the submount 162 mounted on the mounting portion 110, and the submount 162. A light emitting element 120, a sealing part 130 that seals the reflective part 100 and the light emitting element 120, and a phosphor 140 that is dispersed in the sealing part 130. The submount 162 includes a first electrode pattern 155 bonded to one electrode of the light emitting element 120 and a second electrode pattern 157 bonded to the other electrode of the light emitting element 120.

  Further, the mounting unit 110 includes a first via hole 151 electrically connected to the first electrode pattern 155 through the first wire 154, a first electrode 150 electrically connected to the first via hole 151, and a second wire. A second via hole 153 electrically connected to the second electrode pattern 157 through 156, a second electrode 152 electrically connected to the second via hole 153, and a heat dissipating part 160 provided in a portion in contact with the submount 162, Have

  The reflection unit 100 includes a through hole 101 and a reflection surface 102 that is an inner peripheral surface of the through hole 101. In this embodiment, the reflection part 100 is mainly comprised from the alumina which is a ceramic as a porous material. The physical properties such as the density of alumina have a strength to maintain the shape of the reflecting portion 100, and are set in a range in which the reflectance of the reflecting surface 102 described later maintains a predetermined reflectance. The ceramic may be a white ceramic such as titania, zirconia, or zinc oxide.

  The reflective surface 102 having a rough surface is inclined from one end of the through hole 101 toward the other end of the through hole 101 at a predetermined angle with respect to the direction of the normal line of the mounting unit upper surface 112. Specifically, the reflecting surface 102 has a shape that expands from one end of the through hole 101 toward the opening of the through hole 101. The shape of the through hole 101 in the cross section parallel to the mounting portion upper surface 112 is a circular shape. A concave portion 104 is formed on the surface of the reflective surface 102 of the reflective portion 100 by alumina open pores. The shape of the through hole 101 in the cross section parallel to the mounting portion upper surface 112 may be an elliptical shape or a polygonal shape.

  Moreover, as shown in FIG. 2, the recessed part 104 has the recessed part formation thing 106 as an inorganic material formed in the inside. In this embodiment, the in-recess formed product 106 is glass as an inorganic material generated from silicone oil by baking silicone oil. In addition, the recessed part 104 contains the recessed part other than the open pore of the alumina surface which is a rough surface, and an open pore.

  The mounting unit 110 includes a first electrode 150 that extends from the mounting unit upper surface 112 via the first via hole 151 to the mounting unit lower surface 114, and a second electrode that extends from the mounting unit upper surface 112 via the second via hole 153 to the mounting unit lower surface 114. 152. The mounting portion 110 is mainly composed of alumina ceramic. Physical properties such as the density of alumina are set within a range in which the shape and strength of the mounting portion 110 are maintained. In addition, the ceramic which comprises the mounting part 110 may be a ceramic which has white, such as a titania, a zirconia, or a zinc oxide similarly to the reflection part 100. FIG. The mounting part 110 may be a resin.

  The shape of the mounting part 110 in a cross section parallel to the mounting part upper surface 112, that is, the shape of the transverse cross section of the mounting part 110 is substantially rectangular. Further, the shape of the mounting portion 110 in a cross section parallel to the mounting portion upper surface 112 may be a substantially circular shape or a polygonal shape. Here, each of the reflecting portion 100 and the mounting portion 110 is formed by molding. Then, the reflecting part 100 and the mounting part 110 are bonded and integrated, so that the mounting part 110 closes one end of the through hole 101. As a result, a recess is formed by the reflecting portion 100 and the mounting portion 110, and the mounting portion 110 mounts the light emitting element 120 on the mounting portion upper surface 112 in the recess surrounded by the reflecting surface 102.

  Moreover, you may form the reflection part 100 and the mounting part 110 using a green sheet lamination | stacking method. For example, ceramic sheets punched into a predetermined shape are stacked and sintered. And you may form the reflection part 100 and the mounting part 110 by parting the ceramic obtained by sintering the laminated ceramic sheet. Furthermore, in other embodiments, the reflecting portion 100 and the mounting portion 110 may be integrally molded and sintered after the integral molding. Note that the light emitting device 10 including the reflection unit 100 and the mounting unit 110 may be any of a surface mount type, a chip on board type, and a side view type.

  The first electrode 150 and the second electrode 152 are mainly composed of a metal such as aluminum or gold, for example. The first electrode 150 formed on the mounting unit upper surface 112 and the first electrode 150 formed on the mounting unit lower surface 114 are electrically connected via the first via hole 151. In addition, the second electrode 152 formed on the mounting portion upper surface 112 and the second electrode 152 formed on the mounting portion lower surface 114 are electrically connected via the second via hole 153.

  In addition, the mounting unit 110 includes a heat dissipation unit 160 made of a material whose thermal conductivity is higher than that of the material constituting the mounting unit 110. The heat radiating unit 160 is provided near the center of the mounting unit 110. And the heat radiating part 160 and the surface of the mounting part upper surface 112 form a flat surface. The heat radiation part 160 is mainly composed of, for example, aluminum nitride having a high thermal conductivity. Moreover, the heat radiating part 160 may be mainly composed of a ceramic such as silicon nitride or silicon carbide, a metal such as copper, or a composite material of a metal such as copper and ceramic.

  The submount 162 includes a first electrode pattern 155 and a second electrode pattern 157 that are bonded to the electrodes of the light emitting element 120. The submount 162 is mainly composed of a material having electrical insulation and excellent thermal conductivity, such as aluminum nitride, and has a substantially rectangular parallelepiped shape. Further, the submount 162 is mounted on the mounting unit upper surface 112 in contact with the heat dissipation unit 160. In such a case, the light emitting element 120 is mounted in advance on the submount 162. Note that the submount 162 may be mainly composed of other ceramics having electrical insulation properties and excellent thermal conductivity.

  The light emitting element 120 is a light emitting diode (LED) that emits light including at least a part of a wavelength region in the near ultraviolet region (wavelength: 300 nm to 400 nm). In the present embodiment, the light emitting element 120 is an LED having a GaN compound semiconductor. Specifically, the light-emitting element 120 is a flip-chip LED having a peak wavelength of 405 nm and a half-value width of 12 nm when the forward voltage is 3.5 V and the forward current is 350 mA. The peak wavelength of the LED may be in the range of 350 nm to 450 nm. In the present embodiment, the planar dimensions of the light emitting element 120 are designed such that the vertical dimension and the horizontal dimension are each 1 mm, for example. Note that the planar dimensions of the light emitting element 120 are not limited thereto. For example, the planar dimension of the light emitting element 120 may be designed such that the vertical dimension and the horizontal dimension are each 350 μm.

  The light emitting element 120 may be an LED having a GaN-based compound semiconductor that emits light including a wavelength in the blue region. The LED may be a face-up type LED. In another embodiment, the LED may be a GaP compound semiconductor, a GaAs compound semiconductor, or an InP compound semiconductor that emits light including wavelengths in the green light region, the red light region, or the infrared light region. Good. In still another embodiment, a plurality of LEDs may be mounted on the mounting unit 110.

  The light emitting element 120 is mounted in a state of being electrically connected to the first electrode pattern 155 and the second electrode pattern 157 included in the submount 162 by flip chip bonding. That is, the p electrode and the n electrode provided in the light emitting element 120 are electrically connected to the first electrode pattern 155 or the second electrode pattern 157, respectively, that matches the respective polarities. The first electrode pattern 155 and the second electrode pattern 157 are each made of a material containing a metal such as aluminum or gold.

  The first electrode pattern 155 is electrically connected to the first electrode 150 via the first wire 154. The second electrode pattern 157 is electrically connected to the second electrode 152 via the second wire 156. In addition, the 1st wire 154 and the 2nd wire 156 are mainly comprised from the gold wire whose diameter is 25 micrometers, for example.

The sealing unit 130 includes a phosphor 140 having a predetermined particle size and a dispersant that disperses the phosphor 140 in the sealing unit 130. In the present embodiment, the phosphors 140 are three types of phosphors that emit visible light in the red region, the green region, and the blue region, respectively, when excited by light in the near ultraviolet region emitted from the light emitting element 120. For example, the phosphor 140 that emits visible light in the red region is La ₂ O ₂ S: Eu, Sm (YOS: Eu). The phosphor 140 that emits visible light in the green region is 3 (Ba, Mg, Eu, Mn) O.8Al ₂ O ₃ (BAM: Eu, Mn). Further, the phosphor 140 that emits visible light in the blue region is (Sr, Ca, Ba, Eu) ₁₀ (PO ₄ ) ₆ · Cl ₂ . The phosphor 140 may be, for example, a YAG phosphor, a silicate phosphor, or a nitride phosphor. Furthermore, the phosphor 140 may be a mixture in which these phosphors are mixed at a predetermined ratio. Note that the phosphor 140 may be deposited below the sealing portion 130, that is, on the light emitting element 120 side mounted on the mounting portion 110.

  The sealing unit 130 is filled in the through hole 101 of the reflecting unit 100 and covers the light emitting element 120. Specifically, a silicone resin as a sealing material having fluidity is filled in a recess formed by closing one end of the through hole 101 by the mounting portion 110, and the filled silicone resin is cured at a predetermined temperature. Thus, the sealing portion 130 is formed.

(Operation of the light emitting device 10)
Electric power is supplied to the light emitting element 120 through the first electrode 150 and the second electrode 152. For example, the polarity of the output terminal of the DC power supply device (not shown) and the first electrode pattern 155 electrically connected to the p electrode of the light emitting element 120 and the n electrode of the light emitting element 120 are electrically connected. A voltage is applied to the light emitting device 120 in accordance with the respective polarities of the second electrode pattern 157. Then, a current flows through the light emitting element 120 to which a voltage is applied, and the light emitting element 120 emits light having a peak wavelength in the near ultraviolet region.

  Part of the near-ultraviolet light emitted from the light emitting element 120 is converted from visible light in the red region to the red region by the phosphor 140 in the sealing unit 130. Then, the light emitted from the light emitting element 120 and the light converted by the phosphor 140 are emitted outside the sealing unit 130. At this time, the reflecting surface 102 reflects the light emitted from the light emitting element 120 and the light converted by the phosphor 140.

  As shown in FIG. 2, an in-recess formed product 106 exists inside the recess 104. The in-recess formed product 106 is an inorganic material generated in the open pores by the silicone oil as the coating material applied to the reflective portion 100 entering the open pores and firing the infiltrated silicone oil. Specifically, the in-recess formed product 106 is glass. The in-recess formed product 106 is transmissive to the light emitted from the light emitting element 120 and the light converted in the phosphor 140. Then, the light transmitted through the in-recess formed product 106 is reflected toward the inside of the through hole on the surface of the recess 104.

  FIG. 3A shows a graph of the reflectance of light with respect to the wavelength of light irradiated on alumina constituting the reflecting portion according to the first embodiment of the present invention. FIG. 3B shows a graph of the reflectance of light with respect to the wavelength of light irradiated on the resin constituting the conventional reflecting portion.

The conventional reflection part is comprised from the resin material (specifically modified nylon) containing barium sulfate as an inorganic filler. The reflectance of light in the reflecting portion made of this resin material is significantly reduced for light having a wavelength of 400 nm or less compared to light having a wavelength of 400 nm or more. As shown in FIG. 3B, in this resin material, the reflectance of light having a wavelength of 350 nm is less than 10%.
On the other hand, in the alumina constituting the reflecting unit 100 of the present embodiment, as shown in FIG. 3A, the reflectance in the wavelength region from the wavelength of 350 nm to the wavelength of 400 nm is 90% or more. Further, the reflectance in the wavelength region from the wavelength of 300 nm to 350 nm is also 75% or more in the alumina of the present embodiment.

  FIG. 4 is an SEM photograph of a part of the reflecting surface, and (a) shows an SEM photograph before applying a coating substance (before processing). Moreover, (b) shows the SEM photograph after apply | coating a coating substance and baking (after process).

  Referring to (a) of FIG. 4, the surface of the reflecting surface 102 made of ceramic is a rough surface and there are open pores. As shown in FIG. 4A, it can be seen that there are open pores having a size of about 0.5 μm to 2.0 μm. On the other hand, referring to FIG. 4B, it can be seen that after the coating material 108 is applied to the reflecting surface 102 and baked, the glass as the in-recess formed product 106 exists in the open pores of the rough surface portion. .

  Fig.5 (a) shows the schematic diagram at the time of filling the hollow formed from a mounting part and a reflection part with a silicone resin. FIG.5 (b) shows the table | surface of the sinking amount in case a silicone resin is filled into a hollow. Furthermore, FIG. 6 shows a graph of the amount of displacement of the upper surface of the silicone resin when the depression is filled with silicone resin. In FIG. 5A, wires and electrode patterns are omitted for the sake of simplicity.

  Here, the sinking amount 200 was defined as the distance from the upper surface 204 of the silicone resin 135 when the depression was filled with the silicone resin 135 to the lowermost portion 202 of the upper surface 204 of the silicone resin 135 after a predetermined time had elapsed. Then, the time when the depression was filled with the silicone resin 135 was set as the reference time “0 minute”, and the subsidence amount 200 was measured every time a predetermined time passed.

  In addition, the silicone resin 135 with which the hollow was filled is SCR-1011 (made by Shin-Etsu Chemical Co., Ltd.), and the viscosity is 0.8 Pa · s. And measurement conditions are 25 degreeC and the air | atmosphere. Moreover, the reflection part 100 is comprised from the alumina, and the porosity of the said alumina is 80%.

  Referring to FIGS. 5B and 6, after applying the coating material 108 to the reflecting portion 100 and baking (processed: FIG. 6B), the coating material 108 is applied to the reflecting portion 100. As compared with the case where it was not performed (untreated: FIG. 6A), a result in which the sinking amount 200 was suppressed was obtained. Specifically, the sinking amount 200 of the silicone resin 135 when the reflecting part 100 has been processed is 1/65 to 1/75 of the sinking amount 200 of the silicone resin 135 when the reflecting part 100 is not processed. The amount of subsidence within the range of 200.

  This is because, when the reflection part 100 is untreated, there are open pores and depressions present on the reflection surface 102, and therefore the silicone resin 135 enters the open pores and depressions. On the other hand, when the reflective portion 100 has been processed, the open pores and the depressed portion include the in-recess formed product 106, so that the silicone resin 135 is formed in the open pores and the depressed portion as compared with the case where the reflective portion 100 is not treated. The amount of intrusion is suppressed. Therefore, the processed reflection part 100 can suppress the sinking amount 200 as compared with the unprocessed reflection part 100.

(Method for manufacturing light-emitting device 10)
FIG. 7A to FIG. 7D show the respective steps of the method for manufacturing the light emitting device according to the first embodiment.

(Coating process)
First, the reflection part 100 which has the through-hole 101 and is made of alumina, which is ceramic, and the mounting part 110 on which the light-emitting element 120 is mounted by closing one end of the through-hole 101 are separately prepared. Then, silicone oil is applied as an application substance 108 to the open pores as the concave portions 104 of the reflecting surface 102 (FIG. 7A). In other embodiments, the reflecting unit 100 and the mounting unit 110 may be prepared as a single unit, and silicone oil may be applied to the reflecting surface 102 of the reflecting unit 100 and the mounting unit upper surface 112 of the mounting unit 110. .

Here, the coating material 108 used in the present embodiment is an organosilicon compound. As the organosilicon compound, for example, it is preferable to use silicone oil from the viewpoints of surface tension and coating properties on the reflecting surface 102. That is, in the present embodiment, it is preferable to use a silicone oil having a surface tension smaller than that of other organosilicon compounds such as silicone resin, silicone rubber, and gel-like silicone. This is because silicone oil can easily enter the recess 104 due to good wettability of the silicone oil to the reflective surface 102 and ease of spreading of the silicone oil on the reflective surface 102 when applied to the reflective surface 102. It is.
Silicone oil includes straight silicone oil (for example, dimethyl silicone oil, methylphenyl silicone oil, etc.) and modified silicone oil (for example, epoxy modified silicone oil, carboxy modified silicone oil, etc.). In the present embodiment, either straight silicone oil or modified silicone oil can be selected according to desired characteristics.

In another embodiment, the coating substance 108 may be a metal alkoxide that generates an inorganic material by firing. For example, tetraethoxysilane that generates SiO ₂ by firing can be used as the metal alkoxide.

(Baking process)
Next, after applying the coating substance 108 on the reflective surface 102, the reflective portion 100 including the reflective surface 102 is baked, thereby generating the in-recess formed product 106 in the concave portion 104 (FIG. 7B). Firing is performed at a temperature of 500 ° C. to 1000 ° C. in an air atmosphere. Preferably, the reflecting part 100 is baked at 850 ° C. As a result, an inorganic material as the in-recess formation product 106, that is, glass in the present embodiment, is generated in the recess 104. Note that in the case where a metal alkoxide is used as the coating material 108, baking may be performed in an air atmosphere at a temperature of 100 ° C. to 1400 ° C., preferably 800 ° C. to 1200 ° C.

(Washing process)
Here, for the purpose of removing carbonized components and debris generated by firing of the organic component contained in the coating material 108 from the reflecting surface 102, the fired reflecting portion 100 is washed. Specifically, the surface of the reflecting part 100 after baking is subjected to acid / alkali cleaning or organic cleaning. In the cleaning process, ultrasonic cleaning may be used in combination.

(Installation process)
Subsequently, the submount 162 on which the light emitting element 120 is mounted in advance is mounted at a predetermined position of the mounting unit 110. Then, the first electrode pattern 155 bonded to the electrode of the light emitting element 120 and the first electrode 150 of the mounting unit 110 are electrically connected via the first wire 154. Similarly, the second electrode pattern 157 bonded to the electrode of the light emitting element 120 and the second electrode 152 of the mounting portion 110 are electrically connected via the second wire 156 (FIG. 7C). .

(Sealing process)
Next, the phosphor 140 is dispersed in a fluid sealing material 134 in a recess formed by closing one end of the through hole 101 of the reflecting portion 100 by the mounting portion 110 on which the light emitting element 120 is mounted. And sealed (FIG. 7D). The sealing material 134 is a silicone resin 135 in this embodiment. In another embodiment, the sealing material 134 may be an epoxy resin or glass.

(Curing process)
Subsequently, the silicone resin 135 as the sealing material 134 in which the depression is sealed is cured by heating at a predetermined temperature for a predetermined time in a predetermined atmosphere.

(Effects of the first embodiment)
According to the first embodiment of the present invention, the following effects can be obtained.

  Since the in-recess formed product 106 is generated in the open pores and the depressed portions existing on the reflecting surface 102, the silicone resin 135 filling the depression can be prevented from entering the open pores and the depressed portions. As a result, the amount of subsidence 200 of the upper surface 140 of the sealing part 130 can be accommodated within a predetermined range, and the shape of the upper surface 140 of the sealing part 130 can be appropriately controlled. It is possible to prevent an error from occurring in the optical design of the light emitting device 10.

  Further, in the first embodiment, since the silicone oil is infiltrated into the open pores and the depressed portion existing on the reflecting surface 102, the glass is generated from the silicone oil in the open pores and the depressed portion by firing. The deep portions of the pores and the depressed portion can be sealed with glass. Thereby, the reflection characteristic of the ceramic light which comprises the reflection part 100 can be utilized. Therefore, the diffuse reflection of light on the ceramic surface constituting the reflecting surface 102 can contribute to the improvement of the light emission efficiency of the light emitting device 10.

  In addition, since the in-recess formed product 106 is transmissive to the light emitted from the light emitting element 120, the light emitted from the light emitting element 120 is rough on the reflecting surface 102 in the same manner as in the case where the in-recess formed product 106 is not present. Reflected at the surface. Thereby, the reflection characteristic of the ceramic light which comprises the reflection part 100 can be utilized substantially as it is.

  In the first embodiment, since the reflecting portion 100 is mainly composed of ceramic, light in a wider wavelength range than light reflected by the resin material containing the inorganic filler is higher than that of the resin material. It can reflect with reflectivity. Thereby, the light emitting device 10 according to the present embodiment can greatly improve the color rendering properties.

[Second Embodiment]
FIG. 8 is a cross-sectional view of the light emitting device according to the second embodiment.

  In the second embodiment, the light-emitting element in the first embodiment shown in FIG. 1 is a face-up type, and other configurations are the same as those in the first embodiment.

  The light emitting element 121 mounted on the light emitting device 11 according to the present embodiment is a face-up type LED. For example, the light emitting element 121 emits light including a near ultraviolet region.

  Electric power is supplied to the light emitting element 121 via the first electrode 150 and the second electrode 152. For example, the polarity of the output terminal of a DC power supply device (not shown), the first electrode 150 electrically connected to the p-electrode of the light-emitting element 121 via the first wire 154, and the n-electrode of the light-emitting element 121 A voltage is applied to the light emitting element 121 in accordance with the respective polarities of the second electrodes 152 electrically connected via the second wire 156. Then, a current flows through the light-emitting element 121 to which a voltage is applied, and the light-emitting element 121 emits light including a near-ultraviolet wavelength region.

  Although the embodiments of the invention have been described above, the embodiments described above do not limit the invention according to the claims. In addition, it should be noted that not all the combinations of features described in the embodiments are essential to the means for solving the problems of the invention.

It is a longitudinal cross-sectional view of the light-emitting device which concerns on 1st Embodiment. It is the schematic diagram which expanded a part of reflective surface which concerns on 1st Embodiment. (A) is a graph of the reflectance with respect to the wavelength of the alumina which comprises a reflection part, (b) is a graph of the reflectance with respect to the wavelength of the resin which comprises the conventional reflection part. (A) is the SEM photograph of the reflective surface before application | coating of a coating material, (b) is the SEM photograph of the reflective surface after apply | coating a coating material and baking. (A) is a schematic diagram at the time of filling a hollow with a silicone resin, (b) is a table | surface of the subsidence amount at the time of filling a hollow with a silicone resin. It is a graph of the amount of settlement when filling a hollow with silicone resin. (A) to (d) is a diagram showing each manufacturing process of the light emitting device according to the first embodiment. It is sectional drawing of the light-emitting device which concerns on 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 11 Light-emitting device 100 Reflective part 101 Through-hole 102 Reflective surface 104 Recessed part 106 Formed part in recessed part 108 Coating substance 110 Mounted part 112 Mounted part upper surface 114 Mounted part lower surface 120, 121 Light emitting element 130 Sealed part 134 Sealant 135 Silicone Resin 140 Phosphor 150 1st electrode 151 1st via hole 152 2nd electrode 153 2nd via hole 154 1st wire 155 1st electrode pattern 156 2nd wire 157 2nd electrode pattern 160 Heat radiation part 162 Submount 200 Subsidence amount 202 Bottom part 204 Top surface

Claims (10)

In manufacturing a light emitting device comprising a reflective portion having a through-hole formed of a porous material having a rough surface, and a mounting portion that closes one end of the through-hole and mounts a light-emitting element,
An application step of applying a coating substance on the rough surface of the reflective portion, and intruding the coating substance into the concave portion of the rough surface;
From the coating material that has entered the recess in the coating step, a firing step of generating a formation in the recess in the recess by firing,
A sealing step of filling a recess formed by closing one end of the through hole of the reflecting portion fired in the firing step with the mounting portion on which the light emitting element is mounted, with a fluid sealing material. A method for manufacturing a light emitting device.   The method for manufacturing a light emitting device according to claim 1, wherein the coating substance is composed of an organosilicon compound. The porous material is ceramic;
The method for manufacturing a light emitting device according to claim 1, wherein the recess is an open pore of the ceramic. The application substance that enters the recess in the application step is silicone oil,
The method for manufacturing a light emitting device according to any one of claims 1 to 3, wherein the formation in the recess is an inorganic material generated by baking the silicone oil.   The light emitting device manufacturing method according to claim 4, wherein in the baking step, the silicone oil is fired at a temperature of 500 ° C. to 1000 ° C.   The light emitting device manufacturing method according to claim 1, wherein the sealing step includes a curing step of curing the sealing material filled in the depression. A reflective part composed of a porous material having a rough surface, and having a through hole;
A mounting portion for closing one end of the through hole and mounting the light emitting element;
An in-recessed formation formed in a recess in the rough surface of the reflecting portion;
A light emitting device comprising: a sealing portion that fills the through hole of the reflecting portion and seals the light emitting element. The porous material is ceramic,
The light emitting device according to claim 7, wherein the recess is an open pore of the ceramic.   9. The in-recess formed product is an inorganic material that is generated in the open pores when the coating material applied to the reflective portion enters the open pores and the applied coating material is baked. Light emitting device.   The light emitting device according to any one of claims 7 to 9, wherein the in-recess formed product is transmissive to light emitted from the light emitting element.

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