JP2008245111A - Microphone, method for assembling electronic equipment using the microphone, and portable terminal - Google Patents

Microphone, method for assembling electronic equipment using the microphone, and portable terminal Download PDF

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Publication number
JP2008245111A
JP2008245111A JP2007085421A JP2007085421A JP2008245111A JP 2008245111 A JP2008245111 A JP 2008245111A JP 2007085421 A JP2007085421 A JP 2007085421A JP 2007085421 A JP2007085421 A JP 2007085421A JP 2008245111 A JP2008245111 A JP 2008245111A
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Prior art keywords
microphone
sound hole
electronic device
case
acoustic transducer
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JP2007085421A
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Japanese (ja)
Inventor
Yasuo Otsuka
泰雄 大塚
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Matsushita Electric Ind Co Ltd
松下電器産業株式会社
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Priority to JP2007085421A priority Critical patent/JP2008245111A/en
Publication of JP2008245111A publication Critical patent/JP2008245111A/en
Application status is Pending legal-status Critical

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a microphone easily handled by air pickup, having a high design flexibility and manufactured by a simple processing. <P>SOLUTION: The microphone is provided with: an acoustic transducer part for converting a sound signal into an electric signal; an impedance conversion part for converting the electric signal into impedance and a case including the acoustic transducer part and the impedance conversion part; wherein, the case has a sound hole, the sound hole is filled with a sublimatable material, and the sublimatable material is heated at a sublimation temperature and more at the time of filling or after filling, to form the sound hole. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a microphone, a method of assembling an electronic device using the same, and a portable terminal, and more particularly to a structure for a sound hole, that is, a sound hole.

  The microphone detects sound as mechanical vibration, and is configured to guide sound from the outside to a diaphragm through a sound hole provided in the case.

  FIG. 7 shows an external perspective view of a conventional MEMS microphone. FIG. 8A is a side view of a conventional MEMS microphone. FIG. 8B is a plan view of a conventional MEMS microphone. FIG. 8C is a longitudinal sectional view of the conventional MEMS microphone (a sectional view taken along line AA in FIG. 7).

  A conventional MEMS microphone 300 shown in FIGS. 7 and 8 includes a substrate 301, a MEMS chip 200, and a shield case 303. Here, the MEMS chip 200 is a chip that converts a sound signal into an electric signal.

  Such a MEMS microphone 300 is used by being mounted on a main board such as a mobile phone, for example. In this case, in order to secure a sound signal passage, this MEMS microphone is arranged so that the microphone sound hole of the mobile phone casing (not shown) overlaps the sound hole 303c on the top plate 303a of the shield case. 300 is placed and implemented.

  Conventionally, microphones have been mounted via mechanical parts such as spring connectors, but in recent years, microphones that can be mounted directly on the main board by surface mounting have become mainstream in order to reduce man-hours and the number of parts. It's getting on.

Surface mounting is mainly performed in a process called reflow. The microphone is positioned and supplied on the main board on which the wiring pattern is formed. In the reflow process, mounting is performed in an environment that is higher than the melting temperature of the solder (about 240 ° C). The solder is temporarily melted and fixed by exposing the target microphone.
For this reason, the pre-process of the reflow process includes a pick-up process of a mounted component (a process of picking up a component from a tray or the like). The pickup process is mainly performed by a suction-type gripping tool (hereinafter referred to as an air pickup) using a nozzle.

  For example, when the MEMS microphone 300 is mounted on a main board such as a mobile phone, it is necessary to secure a chucking area S for picking and placing the MEMS microphone 300 on the top plate 303a. As shown in FIG. 8B, the chucking area S should have a certain area while avoiding the sound holes 303c on the top plate 303a of the shield case in order to prevent the failure of the MEMS chip 200. I must. Further, in order to carry the MEMS microphone 300 stably, it is desirable to arrange the chucking area S as close as possible to the center of gravity of the shield case, that is, near the center of the top plate 303a.

  In addition to the above-described circumstances, in recent years, the MEMS microphone 300 has been required to be further reduced in size and thickness, and the shield case 303 has also been reduced in size and thickness accordingly.

  That is, when the microphone is mounted, the front plate of the shield case 303 can be grasped with an air pickup and easily handled. However, if suction is performed including sound holes during air picking, the vibration film formed at the position facing the front plate may be damaged by the air pressure of the air pick. Was difficult.

  Therefore, the present applicant has proposed a structure in which slits are arranged on the side surface instead of the upper surface of the shield case and this is used as a sound hole (Patent Document 1).

Japanese Patent Application No. 2005-265733

  However, this shape is a special shape, and there are cases where the installation position is limited, which has the problem of hindering miniaturization and thinning.

Further, if an air pickup is applied to the slit on the side surface, the air is picked up including the slit, so that it is necessary to adjust the pickup position with high accuracy and there is a problem that the mounting workability is poor. Further, when suction is performed including a slit, there still remains a problem that the vibration membrane is easily damaged by the air pressure of the air pick.
As described above, when mounting the microphone with the air pickup and mounting it on the main board, the sound holes or the slits cause a decrease in workability in the pickup operation.

  Thus, it is necessary to adjust the pickup position with high accuracy, and there is a problem that mounting workability is poor. Further, in order to perform vacuum pickup safely so that the diaphragm is not destroyed, it is necessary to prevent the nozzle from hitting the sound hole. However, the pickup surface of the microphone is small, and the layout design of the sound hole has a low degree of design freedom due to restrictions such as offsetting so that the nozzle does not hit the sound hole.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a microphone with high mounting workability.
Another object of the present invention is to provide a microphone that can be easily handled by an air pickup.
It is another object of the present invention to provide a microphone that has a high degree of design freedom and can be manufactured by simple processing.

The present invention also includes an acoustic transducer unit that converts a sound signal into an electrical signal, an impedance conversion unit that converts the impedance of the electrical signal, and a case that surrounds the acoustic transducer unit and the impedance conversion unit, The case has a sound hole, and the sound hole is blocked with a sublimable material.
Due to this configuration, the sound holes are closed with a sublimation material, so when picking up the air, the holes are closed and the pickup nozzle is installed avoiding the sound holes so that the diaphragm is not destroyed. Therefore, it is possible to pick up with extremely good workability. In addition, the layout design for forming a location that can be picked up while avoiding the sound hole was extremely difficult when downsizing, but according to this configuration, it is not necessary to form a separate pickup area while avoiding the sound hole. Miniaturization is possible. In addition, the effect of increasing the degree of freedom in layout design is achieved.

  Further, the present invention includes the above microphone, wherein the case has a flat top surface, and the sound hole is formed on the top surface.

  Further, the present invention includes the above microphone, wherein the case has a square top surface.

  Further, the present invention includes the above microphone, wherein the acoustic transducer part is a MEMS element formed by a semiconductor manufacturing process.

  Further, the present invention includes the above microphone in which the acoustic transducer section and the impedance conversion section are formed on the same substrate.

  Further, in the microphone according to the present invention, the acoustic transducer unit includes a surface-mounting connection terminal, and is surface-mounted on a mounting board, and the sublimation temperature of the sublimable material is Includes those that are below the reflow temperature.

  Further, the present invention includes the above microphone, wherein the sublimable material is a resin having a sublimation temperature of 250 ° C. or lower.

Moreover, the present invention includes the above microphone, wherein the sublimable material is a melamine resin.
Melamine is a colorless solid of 2,4,6-triamino-1,3,5-triazine (C 3 H 6 N 6 ), has sublimation property, melting point is 250 ° C. or less, and aqueous solution is weakly basic. It has excellent water resistance and mechanical strength, and until the reflow process for surface mounting, it firmly protects the inside of the case and forms sound holes by sublimation in the reflow process. Protects the element, and a sound hole is formed at a good position after assembly.

The present invention also includes an acoustic transducer unit that converts a sound signal into an electrical signal, an impedance conversion unit that converts the impedance of the electrical signal, and a case that surrounds the acoustic transducer unit and the impedance conversion unit, The case has a sound hole, the step of preparing a microphone in which the sound hole is closed with a sublimable material, and the microphone is arranged on a mounting board of an electronic device by an air pickup, and the microphone is placed on the mounting board. A step of fixing the microphone, and a step of sublimating the sublimable material by heating to form a sound hole.
According to this configuration, until the heating process for mounting, the inside of the case is firmly protected, and the sound hole is formed by sublimation in the heating process, so the element is protected in the assembly process, and after assembly, Sound holes are formed at good positions.

According to the present invention, in the method for assembling the electronic device, the step of fixing the microphone of the electronic device and the step of forming the sound hole are performed in the same heating step.
According to this configuration, the fixing process and the sublimation process for forming the sound hole are performed in the same heating process, so that the assembly is completed with good workability.

In the electronic device assembling method according to the present invention, the acoustic transducer portion includes a surface mounting connection terminal, the top surface of the microphone is held by an air pickup, and the mounting substrate is mounted. After the positioning, the step of mounting the connection terminal and reflowing at a temperature equal to or higher than the sublimation temperature of the sublimable material to fix the connection terminal of the microphone on the mounting substrate.
In the case of surface mounting, positioning is extremely important, but it can be positioned with high accuracy by an air pickup, and sound holes can be formed while being fixed at a reflow temperature, so that mounting workability is high.

  Further, the present invention includes the above electronic device assembling method, wherein the fixing step is a step of heating to 250 ° C.

According to the present invention, in the electronic device assembling method, the step of preparing the microphone includes a step of filling a case having a sound hole with a sublimable material, and the case includes the acoustic transducer unit and the impedance conversion unit. And so as to surround.
According to this configuration, the case can be mounted in a state where the sound hole is closed, so that the assembling workability is good.

According to the present invention, in the electronic device assembling method, in the step of preparing the microphone, a sound hole is formed in a plate-like body, a sublimation material is filled in the sound hole, and then a case is formed by bending. And mounting the case so as to surround the acoustic transducer section and the impedance conversion section.
According to this structure, manufacturing workability | operativity is favorable and it can form without contaminating the said acoustic transducer part and the said impedance conversion part.

  The present invention also includes a portable terminal formed using the electronic device assembling method described above.

According to the present invention, the sound hole is closed with a sublimation material, and at the time of air pickup, the substantial area of the pickup portion of the case can be enlarged, so that the pickup workability is improved. Further, since the sound hole is closed at the time of air pickup, air is not sucked from the sound hole and the diaphragm is not destroyed.
Further, since the sublimable material sublimates by heat treatment in the reflow process without requiring a special process, it becomes equivalent to a microphone having a normal sound hole when it is mounted and assembled in an electronic device.

(Embodiment 1)
FIG. 1 is an external perspective view of the MEMS microphone 100 according to the first embodiment. FIG. 2 is a longitudinal sectional view of the MEMS microphone 100 (a sectional view taken along line BB in FIG. 1). As shown in FIGS. 1 and 2, the MEMS microphone 100 includes a substrate 101, a MEMS chip 102, and a shield case 103, and the sound hole 103c is blocked with melamine 103g, which is a sublimable material. It is characterized by. And this melamine is sublimated at the reflow temperature in the mounting process, and the sound hole 103c is exposed.

  The substrate 101 is a printed board for mounting the MEMS chip 102. The dimensions of the mounting surface of the substrate 101 are, for example, length × width 3 [mm] × 4 [mm].

  As shown in FIG. 2, the MEMS chip 102 converts a sound signal captured by the diaphragm electrode 43 into an electric signal. Specifically, the MEMS chip 102 has a vibrating membrane electrode 43 and an electret film 44 on a silicon substrate 41 with a first insulating layer 42 interposed therebetween. A fixed electrode 46 having a sound hole 47 is formed through an insulating layer 45. A back air chamber 55 formed by etching the silicon substrate 41 is formed on the back surface of the vibration membrane electrode 43. Note that a MEMS (Micro Electro Mechanical System) chip is an electromechanical element chip composed of minute parts formed by using a semiconductor microfabrication technique.

  The vibrating membrane electrode 43 is made of conductive doped polysilicon, the electret film 44 is made of a silicon nitride film or a silicon oxide film, and the fixed electrode 46 is made of doped polysilicon and a silicon oxide film, It is formed by laminating a silicon nitride film.

  In addition, an amplification circuit 48 that amplifies an electrical signal of the MEMS chip 102 is electrically connected by a wire 49. The MEMS chip 102 and the amplifier circuit 48 are covered with a shield case 103.

  Next, the shield case 103 will be described. FIG. 3A is a side view of the MEMS microphone 100. FIG. 3B is a plan view of the MEMS microphone 100. FIG.3 (c) is CC sectional view taken on the line in FIG.3 (b). FIG.3 (d) is the DD sectional view taken on the line in FIG.3 (b). In addition, in each figure of FIG. 3, illustration of the MEMS chip | tip 102 is abbreviate | omitted.

  As shown in each figure, the shield case 103 is configured by a substantially rectangular top plate 103a having four rounded corners and four side plates 103b. The material of the shield case is, for example, a metal material having an electrical shield such as white (alloy made of copper, lead, nickel), Kovar, 42 alloy. Further, the shield case may be subjected to surface treatment such as Ni plating in order to obtain bonding with the substrate by soldering or the like. Each of the top plate 103a and the side plate 103b has a thickness of 0.25 [mm]. Further, the end portion 103f of the top plate 103 is formed in a shape having a corner. As a result, the area of the flat portion used for the pickup can be maximized. The shield case 103 forms a hole in a region corresponding to the sound hole of the plate-like body, and the hole is filled with melamine 103 g, and the flat plate-like body is knocked out in a press die, for example. It can be formed into a shape having corners by processing. The corner shape may be any shape as long as R is small (small roundness) as compared with the corner shape of the bent portion formed by the conventional drawing.

  As described above, with this configuration, the bent portion formed by the end portion of the top plate and the side plate as in the conventional shield case is not a shape having a relatively large R, but a shape having corners, Since R is a shape having a bent portion, the flat portion of the top plate is enlarged by the thickness of the side plate. Therefore, in the design of the top plate of the shield case, it is possible to secure a region where the gasket is in close contact and secure a chucking area for the air pickup.

  That is, for example, the top plate 103a of the shield case of the first embodiment has a sound hole 103c having a diameter of 0.6 [mm], but is filled with melamine 103g before mounting. Further, in the top plate 103a of the shield case, since the sound hole 103c is closed with the melamine 103g, the entire surface of the standard 103a is secured as a chucking area.

  With this configuration, when the shield case 103 is mounted on the substrate 101 by a reflow soldering process or the like, as shown in FIG. 2, solder enters the space of the R shape 103d to form the solder fillet 103e. It is also effective in that it can be firmly fixed.

  In the description of the first embodiment, the shield case has been described as having a rectangular lid shape. However, the shape is not limited to this, and the shield case may be deformed according to the shape of the substrate. For example, if the substrate 101 is circular, the top plate of the shield case 103 may be circular, and if the substrate 101 is polygonal, the top plate of the shield case 103 may be polygonal.

(Embodiment 2)
Next, an example in which the MEMS microphone 100 is used for a mobile phone will be described. FIG. 4 is an external perspective view of the mobile phone 150 on which the MEMS microphone 100 is mounted. FIG. 5 is a cross-sectional view of the main part in the vicinity of the microphone portion of the mobile phone 150 (cross-sectional view taken along the line EE in FIG. 4). FIG. 6 is a cross-sectional view of the main part near the microphone portion of the mobile phone 150 before reflow (cross-sectional view taken along the line EE in FIG. 4), and the sound hole is filled with melamine 103g.

  In the case 151 of the mobile phone 150 shown in FIG. 5, a microphone sound hole 152 is formed at a position near the user's mouth when in use.

  A gasket 154 is sandwiched between the top plate 103 a of the shield case of the MEMS microphone 100 and the inner surface of the housing 151. As shown in FIG. 4, the sound hole 152 of the casing 151 and the sound hole 103 c of the shield case have substantially the same shape, and are aligned so that the sound holes match after assembly.

  Similarly, the gasket 154 has a hole 154a having substantially the same shape as the sound hole 103c. In addition, an acoustic resistance material 154b is formed at the end of the hole 154a on the housing side. The acoustic resistance material 154 b reduces the propagation speed of the sound signal, and here, functions to adjust the acoustic characteristics of the MEMS microphone 100.

  The thickness of the gasket 154 is a little thicker than the gap between the top plate 103a and the inner surface of the casing 151, and is sandwiched between the sound hole 103c of the shield case and the end of the top plate 103a.

  That is, as the region for sandwiching the gasket 154, the distance from the sound hole 103c of the shield case to each end of the top plate 103a is designed to have an interval of 1 [mm] or more. Airtightness is ensured.

  Therefore, the sound signal entering from the sound hole 152 of the housing does not leak into the gap between the top plate 103a and the inner surface of the housing 151, and the acoustic characteristics of the MEMS microphone 100 are not impaired.

  The sound that has entered from the sound hole 152 of the housing passes through the acoustic resistance material 154b and propagates to the diaphragm electrode 43 of the MEMS chip. The capacitance of the plate capacitor formed by the vibrating membrane electrode 43 and the fixed electrode 46 changes and is taken out as a voltage change.

  According to this configuration, since the miniaturized MEMS microphone 100 can be mounted on a mobile phone, the overall shape of the mobile phone 150 can be reduced in size and thickness.

Further, since the shield case 103 is in a state where the sound hole is closed with melamine at the time of assembly, the air pickup can be stably performed. Therefore, it can cope with downsizing. Thereby, in the assembly process, when the MEMS microphone 100 is transported by attracting the top surface of the shield case 103 by the chuck device, it can be transported stably. That is, the process of carrying the MEMS microphone 100 to the mounting position of the main board 155 of the mobile phone 150 can be performed stably and reliably. Then, the MEMS microphone 100 is positioned and supplied on the main substrate 155, heated at 235 ° C. for 60 seconds to perform solder reflow, and the terminals of the MEMS microphone 100 (not shown) are connected to the pads on the main substrate 155. At this time, the melamine filled in the sound hole is sublimated to form a sound hole.
In this way, high-precision alignment is possible with extremely high workability without adding a special process, and a small and highly reliable MEMS microphone 100 can be obtained.

(Embodiment 3)
Next, as Embodiment 3 of the present invention, a structure and a mounting method for preventing displacement of the sound holes of the casing 151 and the top plate 103a when the MEMS microphone 100 is used for a mobile phone will be described.
In this configuration, a hole that is expanded to the periphery of the sound hole formation position of the top plate 103a is formed, this hole is filled with a sublimation resin material, and is fixed to the housing in the same manner as in the second embodiment. By irradiating the laser through the sound hole and forming the sound hole in the top surface 103a only at the position corresponding to the sound hole of the housing, it is possible to eliminate the positional deviation between the sound holes of the housing 151 and the top plate 103a. it can.
Others are the same as those of the second embodiment.

  In the above embodiment, melamine is used as the sublimable material. However, the present invention is not limited to melamine, and other sublimable resins or ceramics obtained by pulverizing and heating a porous material such as calcium phosphate are used. Various materials such as an inorganic sublimable material that has been pulverized and pasted together with an organic compound can be used.

  Furthermore, as a MEMS microphone, the present invention is effective when not only the acoustic transducer part but also the impedance conversion part is formed on the same substrate to realize further miniaturization, and the air pickup can be reliably performed. Therefore, it is possible to provide a highly reliable small microphone.

  In the present invention, the air pickup is mounted in a state where the sound hole is closed with the sublimation material, and the sublimation material is sublimated to form the sound hole after the mounting process or mounting. Since the size and range can be increased, highly reliable mounting is possible without reducing the functionality even when the device is downsized, which is useful as a microphone for a small device such as a portable terminal.

External perspective view of MEMS microphone 100 of the first embodiment. Longitudinal sectional view of the MEMS microphone 100 (sectional view taken along line BB in FIG. 1) The figure which shows the MEMS microphone of Embodiment 2 of this invention, (a) Side view, (b) The top view of a MEMS microphone, (c) CC sectional view, (d) DD sectional view External perspective view of mobile phone 150 on which MEMS microphone 100 is mounted Cross-sectional view of the main part in the vicinity of the microphone part of the mobile phone 150 (cross-sectional view taken along line EE in FIG. 4) Cross-sectional view of the main part in the vicinity of the microphone part of the mobile phone 150 (cross-sectional view taken along line EE in FIG. 4) External perspective view of a conventional MEMS microphone (A) Side view of a conventional MEMS microphone, (b) Plan view of the conventional MEMS microphone, (c) Longitudinal sectional view of the conventional MEMS microphone (sectional view taken along line AA in FIG. 7)

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 MEMS microphone 101 Substrate 102 MEMS chip 103 Shield case 103a Top plate 103b Side plate 103c Sound hole 103d R shape part 103e Solder fillet 103g Melamine (sublimation material)
103f Bent part 150 Mobile phone 151 Case 151 Sound hole on case 154 Gasket 155 Main (main) substrate of mobile phone

Claims (15)

  1. An acoustic transducer that converts sound signals into electrical signals;
    An impedance converter for impedance converting the electrical signal;
    A case surrounding the acoustic transducer section and the impedance converter section;
    The case has a sound hole;
    A microphone in which the sound hole is closed with a sublimable material.
  2. The microphone according to claim 1,
    The case has a flat top surface;
    A microphone in which the sound hole is formed on the top surface.
  3. The microphone according to claim 1 or 2,
    The case is a microphone having a square top surface.
  4. The microphone according to any one of claims 1 to 3,
    The acoustic transducer section is a microphone that is a MEMS element formed by a semiconductor manufacturing process.
  5. The microphone according to claim 4,
    A microphone in which the acoustic transducer section and the impedance conversion section are formed on the same substrate.
  6. A microphone according to any one of claims 1 to 5,
    The acoustic transducer portion includes a surface-mounting connection terminal, and is surface-mounted on a mounting board,
    A microphone in which a sublimation temperature of the sublimable material is not higher than a reflow temperature.
  7. The microphone according to claim 6, wherein
    The microphone in which the sublimable material is a resin having a sublimation temperature of 250 ° C. or lower.
  8. A microphone according to claim 7,
    The microphone in which the sublimable material is melamine resin.
  9. An acoustic transducer unit that converts a sound signal into an electrical signal; an impedance converter unit that converts the impedance of the electrical signal; and a case that surrounds the acoustic transducer unit and the impedance converter unit. And providing a microphone in which the sound hole is closed with a sublimable material;
    Arranging the microphone on a mounting board of an electronic device by a suction-type gripping tool (hereinafter referred to as air pickup), and fixing the microphone on the mounting board;
    And a step of sublimating the sublimable material by heating to form a sound hole.
  10. An electronic device assembling method according to claim 9,
    The method of assembling an electronic device, wherein the step of fixing the microphone and the step of forming the sound hole are performed in the same heating step.
  11. An electronic device assembling method according to claim 10,
    The acoustic transducer portion includes a connection terminal for surface mounting,
    After gripping the top surface of the microphone with an air pickup and positioning with respect to the mounting substrate, the connection terminal is placed,
    A method of assembling an electronic device, comprising: reflowing at a temperature equal to or higher than a sublimation temperature of the sublimable material to fix a connection terminal of a microphone on the mounting substrate.
  12. An electronic device assembling method according to claim 11,
    The method of assembling an electronic device, wherein the fixing step is a step of heating to 250 ° C.
  13. An electronic device assembling method according to claim 9,
    The step of preparing the microphone includes
    Filling the case with sound holes with a sublimable material;
    A method of assembling an electronic device, comprising: mounting the case so as to surround the acoustic transducer section and the impedance conversion section.
  14. An electronic device assembling method according to claim 9,
    The step of preparing the microphone includes
    Forming a sound hole in the plate-like body, filling the sound hole with a sublimable material, and then forming a case by bending;
    A method of assembling an electronic device, comprising: mounting the case so as to surround the acoustic transducer section and the impedance conversion section.
  15.   A portable terminal formed by using the electronic device assembling method according to claim 9.
JP2007085421A 2007-03-28 2007-03-28 Microphone, method for assembling electronic equipment using the microphone, and portable terminal Pending JP2008245111A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010035781A1 (en) 2008-09-25 2010-04-01 クラリオン株式会社 Lane determining device and navigation system
JP2011003520A (en) * 2009-06-22 2011-01-06 Askey Computer Corp Electrostatic protection method and structure for electronic product
CN102020233A (en) * 2009-09-09 2011-04-20 台湾积体电路制造股份有限公司 Micro-electro-mechanical systems (mems), systems, and operating methods thereof
WO2011104784A1 (en) * 2010-02-24 2011-09-01 パナソニック株式会社 Converter module, and method for producing same
JP2011223324A (en) * 2010-04-09 2011-11-04 Yamaha Corp Sound pick-up device and capacitor microphone
US8918150B2 (en) 2010-08-06 2014-12-23 Blackberry Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234499A (en) * 1985-08-07 1987-02-14 Ngk Spark Plug Co Ltd Ultrasonic sensor
JPH08162798A (en) * 1994-12-02 1996-06-21 Matsushita Electric Ind Co Ltd Electronic part, its mounting method and mounter htereof
JPH08199042A (en) * 1995-01-25 1996-08-06 Matsushita Electric Works Ltd Melamine resin molding material
JP2000050393A (en) * 1998-05-25 2000-02-18 Hosiden Corp Electret condenser microphone
JP2004200766A (en) * 2002-12-16 2004-07-15 Karaku Denshi Kofun Yugenkoshi Capacitor microphone and its manufacturing method
JP2007060661A (en) * 2005-08-20 2007-03-08 Bse Co Ltd Silicon based condenser microphone and packaging method for the same
JP2007081706A (en) * 2005-09-13 2007-03-29 Matsushita Electric Ind Co Ltd Condenser microphone

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234499A (en) * 1985-08-07 1987-02-14 Ngk Spark Plug Co Ltd Ultrasonic sensor
JPH08162798A (en) * 1994-12-02 1996-06-21 Matsushita Electric Ind Co Ltd Electronic part, its mounting method and mounter htereof
JPH08199042A (en) * 1995-01-25 1996-08-06 Matsushita Electric Works Ltd Melamine resin molding material
JP2000050393A (en) * 1998-05-25 2000-02-18 Hosiden Corp Electret condenser microphone
JP2004200766A (en) * 2002-12-16 2004-07-15 Karaku Denshi Kofun Yugenkoshi Capacitor microphone and its manufacturing method
JP2007060661A (en) * 2005-08-20 2007-03-08 Bse Co Ltd Silicon based condenser microphone and packaging method for the same
JP2007081706A (en) * 2005-09-13 2007-03-29 Matsushita Electric Ind Co Ltd Condenser microphone

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010035781A1 (en) 2008-09-25 2010-04-01 クラリオン株式会社 Lane determining device and navigation system
JP2011003520A (en) * 2009-06-22 2011-01-06 Askey Computer Corp Electrostatic protection method and structure for electronic product
CN102020233A (en) * 2009-09-09 2011-04-20 台湾积体电路制造股份有限公司 Micro-electro-mechanical systems (mems), systems, and operating methods thereof
WO2011104784A1 (en) * 2010-02-24 2011-09-01 パナソニック株式会社 Converter module, and method for producing same
JP2011223324A (en) * 2010-04-09 2011-11-04 Yamaha Corp Sound pick-up device and capacitor microphone
US8918150B2 (en) 2010-08-06 2014-12-23 Blackberry Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device

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