JP2008244151A - Light emitting apparatus - Google Patents

Light emitting apparatus Download PDF

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Publication number
JP2008244151A
JP2008244151A JP2007082608A JP2007082608A JP2008244151A JP 2008244151 A JP2008244151 A JP 2008244151A JP 2007082608 A JP2007082608 A JP 2007082608A JP 2007082608 A JP2007082608 A JP 2007082608A JP 2008244151 A JP2008244151 A JP 2008244151A
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Japan
Prior art keywords
lead
sealing resin
reflector
light emitting
exposed
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Withdrawn
Application number
JP2007082608A
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Japanese (ja)
Inventor
Takeshi Matsuto
健史 松嶌
Original Assignee
Toyoda Gosei Co Ltd
豊田合成株式会社
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Application filed by Toyoda Gosei Co Ltd, 豊田合成株式会社 filed Critical Toyoda Gosei Co Ltd
Priority to JP2007082608A priority Critical patent/JP2008244151A/en
Publication of JP2008244151A publication Critical patent/JP2008244151A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

Provided is a light-emitting device capable of setting the area and shape of a portion exposed from each lead to be suitable for preventing peeling of a sealing resin while accurately preventing a wire from being disconnected.
A pair of conductive lead portions (4, 5), a non-conductive lead portion (3) on which a light emitting element (7) is mounted, and a reflector disposed on each lead portion (3, 4, 5) and surrounding a side of the light emitting element (7). Part 6, sealing resin 8 that seals light emitting element 7, and exposure hole 3 b that is formed so as to overlap non-conductive lead part 3 with the inner edge of the lower end of reflector part 6 in a top view, The sealing resin 8 in the exposed portion hole portion 3b was directly joined to the bottom portion 2.
[Selection] Figure 2

Description

  The present invention relates to a light emitting device in which a light emitting element is mounted on a bottom portion via a lead portion, and a reflector portion that reflects light of the light emitting element is mounted on the lead portion.
2. Description of the Related Art Conventionally, a light emitting device in which a light emitting element such as a light emitting diode (LED) is sealed with a translucent sealing resin such as an epoxy type or a silicone type is known. As a light emitting device of this type, a device in which a metal lead electrode is disposed on the bottom surface of a concave portion of a package molded body made of resin is known (for example, see Patent Document 1). In the light emitting device of Patent Document 1, the light emitting element is provided on the negative lead electrode, and the positive lead electrode and the negative lead electrode are formed with a symmetrical cut or opening, and a molding resin is formed inside the cut and the like. Filled. In this light emitting device, the light emitting element is electrically connected to the positive lead electrode and the negative lead electrode by wires. Here, the sealing resin has a greater bonding force with an insulating material such as a resin or ceramic than the bonding force with a metal, and the sealing resin peels off at the contact interface with the metal when it expands or contracts. It is easy to peel off at the contact interface with the insulating material. In Patent Document 1, since the molding resin is filled inside the notch or the like, the positive or negative electrode lead and the molding resin can be firmly fixed, and peeling between the positive or negative electrode lead and the molding resin can also be prevented. , And.
JP 2002-223004 A
However, in the light emitting device described in Patent Document 1, since the light emitting element is mounted on the negative lead electrode and the wire is connected to the negative lead electrode, the connection portion of the light emitting element and the negative lead electrode in the wire are connected. Over the connecting portion, the sealing resin is in contact with the lead electrode which is a metal. Accordingly, the sealing resin continuously contacts the negative lead electrode from the light emitting element to the wire connection portion of the negative lead electrode, and the sealing resin is easily peeled off from the lead electrode during this time. For this reason, when the sealing resin expands due to the heat generated in the light emitting element, the sealing resin may be peeled off from the lead electrode and moved, and the wire may be disconnected.
In addition, since only a pair of conductive lead electrodes are disposed on the bottom surface of the recess, the area and shape of the exposed portion of the package molded body obtained by the gap between the lead electrodes is limited, and the exposed portion of the package molded body is limited. Is difficult to set to an area and shape suitable for prevention of peeling of the sealing resin.
  The present invention has been made in view of the above circumstances, and the object of the present invention is to prevent the sealing resin from peeling off the area and shape of the portion exposed from each lead while accurately preventing disconnection of the wire. An object of the present invention is to provide a light emitting device that can be set to be suitable.
  To achieve the above object, according to the present invention, a bottom portion made of an insulating material, a pair of metal conductive lead portions disposed on the bottom portion to be spaced apart from each other, and the pair of conductive lead portions on the bottom portion, A metal non-conductive lead portion disposed so as to be spaced apart; a light-emitting element mounted on the non-conductive lead portion and electrically connected to the pair of conductive lead portions by wires; the conductive lead portion and the conductive lead portion; A reflector part disposed on a non-conductive lead part and surrounding a side of the light-emitting element, and a region surrounded by the bottom part, the conductive lead part, the non-conductive lead part and the reflector part is filled with the light emission A sealing resin that seals the element and the wire, and the non-conductive lead portion are formed so as to overlap with the inner edge of the lower end of the reflector portion in a top view, and the upper surface of the bottom portion is made non-conductive And exposure hole portion which is exposed from the over de part joining the said bottom and the sealing resin, a light-emitting device in which a is provided.
According to this light emitting device, a part of the bottom is exposed by the exposure hole and the exposure notch of the non-conductive lead part, and the sealing resin is joined to the bottom by the exposure hole and the exposure notch. Become. Here, since the sealing resin has a greater bonding force with an insulating material such as a resin or ceramic than the bonding force with a metal, the sealing resin should be bonded to the bottom made of an insulating material rather than a metal lead portion. Peeling is less likely to occur. In addition, since the sealing resin generates a relatively large internal stress near the inner edge of the lower end of the reflector portion when shrinking, if the bonding force with the peripheral member in this part is improved, the sealing resin is removed from the bottom side of the sealing resin. It is effective in suppressing the peeling of the film.
According to this light emitting device, since the sealing resin is joined to the bottom at the inner edge of the lower end of the reflector portion where a relatively large stress is generated when the sealing resin contracts, the peeling of the sealing resin from the bottom side is suppressed. Is done. In addition, since the non-conductive lead portion on which the light emitting element is mounted is separated from each conductive lead portion to which the wire is connected, the sealing resin is bonded to the bottom portion between the non-conductive lead portion and each conductive lead portion. When the sealing resin expands due to the heat generated in the light emitting element, the movement of the sealing resin is suppressed, and the disconnection of the wire is accurately prevented.
In addition to the two conductive lead portions, the non-conductive lead portions are spaced apart from each other on the bottom, so that in addition to the gap formed between the conductive lead portions, each conductive lead portion and the non-conductive lead portion A gap is also formed between the two. As a result, the area of the exposed portion at the bottom becomes larger than that in which only the conductive lead portions are arranged, and the shape of the exposed portion at the bottom can be set relatively freely.
In addition, since no voltage is applied to the nonconductive lead portion on which the light emitting element is mounted, the die bond paste is not deteriorated by ion migration when a conductive die bond paste is used for the light emitting element.
Moreover, even if the hole for exposure is formed in the non-conductive lead portion, the reduction in the volume of the lead portion used for heat transfer is minimized, so that the heat dissipation performance of the heat generated when the light emitting element is used is impaired. There is nothing. Furthermore, since the decrease in the area covered by the lead portion at the bottom is minimized, the reflection performance of light incident on the lead portion is not impaired.
  In the light emitting device, it is preferable that the non-conductive lead portion extends in a predetermined direction, and the pair of exposing hole portions are formed to be symmetric with respect to the predetermined direction.
  In the above light emitting device, it is preferable that the exposing hole is formed in a circular shape when viewed from above.
  Further, in the light emitting device, the outer edge of the non-conductive lead portion is formed so as to overlap with the inner edge of the lower end of the reflector portion in a top view, the upper surface of the bottom portion is exposed from the non-conductive lead portion, and the bottom portion and the It is preferable to provide the notch part for exposure to which sealing resin is joined.
  Further, in the light emitting device, an exposed portion where an upper surface of the bottom portion is exposed from the plurality of lead portions and joined to the sealing resin is formed along an inner edge of a lower end of the reflector portion inside the reflector portion. It is preferable that they are arranged at almost equal intervals.
  According to the present invention, the area and shape of the portion exposed from each lead portion can be set to be suitable for preventing the peeling of the sealing resin while accurately preventing the wire from being disconnected.
  1 to 3 show an embodiment of the present invention, and FIG. 1 is an external perspective view of a light emitting device.
  As shown in FIG. 1, the light emitting device 1 includes a bottom portion 2 made of an insulating material that forms the lower portion of the device, and a metal heat dissipation lead portion 3, a negative electrode lead portion 4, A positive electrode lead portion 5, a heat radiation lead portion 3, a negative electrode lead portion 4, and a reflector portion 6 disposed on the positive electrode lead portion 5 are provided. In the light emitting device 1, the bottom portion 2 and the reflector portion 6 are made of resin, and the lead portions 3, 4, 5 and the bottom portion 2 and the reflector portion 6 are integrally formed by transfer molding. Examples of the resin used for the bottom portion 2 and the reflector portion 6 include thermoplastic resins such as liquid crystal polymer (LCP), polyphenylene sulfide (PPS), syndiotactic polystyrene (SPS), polyphthalamide (PPA), and nylon. There are thermosetting resins such as epoxy resin and silicone. Moreover, as a metal used for each lead part 3, 4, 5, there exist aluminum (Al), silver (Ag), copper (Cu) etc., for example.
  The bottom part 2 and the reflector part 6 have a substantially rectangular parallelepiped shape as a whole, and the lead parts 3, 4, 5 extend outward from the bottom part 2 and the reflector part 6. A hole 6a penetrating vertically is formed in the reflector portion 6, and light of the LED element 7 described later is extracted through the hole 6a. The hole 6a of the reflector portion 6 is circular when viewed from above, and is formed so as to expand upward. The hole 6 a of the reflector portion 6 is filled with a sealing resin 8 that seals the LED element 7. In the present embodiment, the upper portion of the sealing resin 8 is covered with a translucent cover member 13.
FIG. 2 is a schematic top view of the light emitting device. In FIG. 2, illustration of sealing resin and a cover member is abbreviate | omitted for description.
As shown in FIG. 2, the LED element 7 is disposed on the heat radiating lead 3, and the side is surrounded by the reflector 6. The sealing resin 8 is filled in a region surrounded by the bottom portion 2, the heat radiation lead portion 3, the negative electrode lead portion 4, the positive electrode lead portion 5, and the reflector portion 6.
  As shown in FIG. 2, the heat radiating lead portion 3 as the non-conductive lead portion is disposed in the right region inside the reflector portion 6 in a top view. Here, the front-rear and left-right directions are illustrated in FIG. 2, but this is for convenience of explanation, and it is a matter of course that the arrangement direction of the light-emitting device 1 is not limited to this. . The heat radiation lead part 3 protrudes forward and backward from the bottom part 2 and the reflector part 6 and extends in the front-rear direction. And an exposure hole 3b formed so as to overlap with each other. In the present embodiment, a conductive die bond paste is used for fixing the LED element 7. Specifically, the die bond paste contains silver (Ag). The bottom 2 is exposed from the heat radiation lead 3 inside the reflector 6 through the exposure hole 3b. Further, the heat radiating lead portion 3 has an exposure notch 3 c that exposes the bottom from the heat radiating lead portion 3 inside the reflector portion 6 in a top view.
The element mounting portion 3 a is formed so that the upper surface is higher than the other portion of the heat dissipation lead portion 3. In the present embodiment, the element mounting portion 3a is formed in a circular shape when viewed from above.
In the present embodiment, the exposure hole 3b is formed at two positions with a space in the front and rear direction. Each exposure hole 3b is formed in a circular shape when viewed from above, and as shown in FIG. 2, the inner edge of the reflector 6 passes through the approximate center of the exposure hole 3b.
The notch 3c for exposure is formed by notching the right side of the heat radiating lead 3.
  The negative electrode lead portion 4 as the conductive lead portion is disposed in a lower left region inside the reflector portion 6 when viewed from above. The negative electrode lead part 4 protrudes rearward from the bottom part 2 and the reflector part 6, and a Zener diode 9 is mounted inside the reflector part 6.
  The positive electrode lead portion 5 as the conductive lead portion is disposed in an upper left region inside the reflector portion 6 when viewed from above. The positive electrode lead portion 5 protrudes forward from the bottom portion 2 and the reflector portion 6.
  The LED element 7 as a light emitting element is a face-up type in which a pair of electrodes are formed on the upper surface side, and each electrode is electrically connected to the negative electrode lead portion 4 and the positive electrode lead portion 5 by wires 10 and 11. . In the present embodiment, the LED element 7 that is made of a GaN-based semiconductor and emits blue light is used.
  The zener diode 9 has electrodes formed on the upper surface and the lower surface, the electrode on the lower surface contacts the negative electrode lead portion 4 and is electrically connected, and the electrode on the upper surface is electrically connected to the positive electrode lead portion 5 by the wire 12. Has been. The Zener diode 9 protects the LED element 7 from overvoltage and reverse current.
  As shown in FIG. 2, on the upper surface of the bottom portion 2 inside the reflector portion 6, gaps between the lead portions 3, 4, 5, which are spaced apart from each other, and exposures formed on the heat dissipation lead portion 3. The exposed portions 2a, 2b, 2c, 2d, 2e, and 2f that are not covered by the respective lead portions 3, 4, and 5 exist due to the hole portion 3b and the exposed notch 3c. Each exposed portion 2a, 2b, 2c, 2d, 2e, 2f overlaps the inner edge of the lower end of the reflector portion 6 as viewed from above.
  In the present embodiment, a first exposed portion 2 a extending in the front-rear direction is formed between the heat radiating lead portion 3 and the negative electrode lead portion 4, and a second exposed portion extending left and right between the negative electrode lead portion 4 and the positive electrode lead portion 5. Part 2b is formed, a third exposed part 2c extending forward and backward is formed between the positive electrode lead part 5 and the heat radiating lead part 3, and a fourth exposed part 2d is formed by the rear exposing hole part 3b. The fifth exposed portion 2e is formed by the notch 3c, and the sixth exposed portion 2f is formed by the front exposure hole 3b. The exposed portions 2a, 2b, 2c, 2d, 2e, 2f are directly joined to the sealing resin 8. In the present embodiment, the six exposed portions 2a, 2b, 2c, 2d, 2e, and 2f are arranged at substantially equal intervals in the circumferential direction.
FIG. 3 is a cross-sectional view taken along the line AA of FIG. In this cross section, the fourth exposed portion 2d and the sixth exposed portion 2f of the bottom portion 2 are shown.
As shown in FIG. 3, the sealing resin 8 has a bottom surface joint portion 8a filled in each exposure hole portion 3b of the heat radiating lead portion 3, and the fourth exposed portion 2d and the sixth exposed portion 2f Joined to the bottom 2. That is, each exposure hole 3 b exposes the upper surface of the bottom 2 from the heat radiating lead 3 and joins the bottom 2 and the sealing resin 8. Further, the resin for the bottom 2 enters each exposure hole 3b to form a wedge 2g. In the present embodiment, since the bottom portion 2 and the reflector portion 6 are integrally formed, the wedge portion 2g of the bottom portion 2 is formed continuously with the reflector portion 6. The surface of the wedge portion 2g is formed to extend downward from the lower end of the inner peripheral surface of the reflector portion 6. The sealing resin 8 is filled in a region surrounded by the bottom part 2, the heat radiation lead part 3, the negative electrode lead part 4, the positive electrode lead part 5, and the reflector part 6, and is then cured by heating.
  In the light emitting device 1 configured as described above, the sealing resin 8 is received in each exposure hole 3b of the heat radiating lead 3, and the sealing resin 8 is joined to the bottom 2 in this exposure hole 3b. The Rukoto. Here, since the sealing resin 8 has a larger bonding force with an insulating material such as resin or ceramic than the bonding force with metal, the sealing resin 8 should be bonded to the bottom portion 2 rather than the metal heat dissipation lead portion 3. Peeling is less likely to occur. In addition, since the sealing resin 8 generates a relatively large internal stress in the vicinity of the inner edge of the lower end of the reflector portion 6 at the time of contraction, when the bonding force with the peripheral member in this portion is improved, the sealing resin 8 This is effective for suppressing peeling from the bottom 2 and the lead portions 3, 4, and 5.
Therefore, according to the light emitting device 1, since the sealing resin 8 is joined to the bottom 2 at the lower end inner edge of the reflector portion 6 where a relatively large stress occurs when the sealing resin 8 contracts, the sealing resin 8 Peeling from the bottom 2 side of the wire can be suppressed, and disconnection of the wires 10, 11, and 12 during contraction can be prevented.
Further, since the heat radiation lead portion 3 on which the LED element 7 is mounted is separated from the negative electrode lead portion 4 and the positive electrode lead portion 5 to which the wires 10 and 11 are connected, the heat radiation lead portion 3, the negative electrode lead portion 4 and the positive electrode are connected. When the sealing resin 8 is joined to the bottom portion 2 between the lead portion 5 and the sealing resin 8 expands due to heat generated in the LED element 7, the movement of the sealing resin 8 is suppressed, and the wires 10, 11. Is accurately prevented. Thus, in order to prevent disconnection of the wires 10 and 11, an exposed portion of the resin is interposed between the connection portion of the wires 10 and 11 with the LED element 7 and the connection portion of the lead portions 4 and 5. You can do it.
In particular, in the present embodiment, each of the six exposed portions 2a, 2b, 2c, 2d, 2e, and 2f is arranged at substantially equal intervals in the circumferential direction, so that the specific exposed portion 2a when the sealing resin 8 contracts. , 2b, 2c, 2d, 2e, 2f can be avoided.
In addition to the negative electrode lead portion 4 and the positive electrode lead portion 5, the heat radiating lead portion 3 is arranged on the bottom portion 2 so as to be separated from the gap formed between the negative electrode lead portion 4 and the positive electrode lead portion 5. A gap is also formed between the negative electrode lead portion 4 and the positive electrode lead portion 5 and the heat dissipation lead portion 3. As a result, the area of the exposed portion of the bottom portion 2 becomes larger than that in which only the negative electrode lead portion 4 and the positive electrode lead portion 5 are arranged, and the shape of the exposed portion of the bottom portion 2 can be set relatively freely. .
In addition, since no voltage is applied to the heat dissipation lead portion 3 on which the LED element 7 is mounted, the conductive die bond paste of the LED element 7 is not deteriorated by ion migration.
Therefore, the area and shape of the portions exposed from the lead portions 3, 4, and 5 can be set to be suitable for preventing the sealing resin 8 from peeling while preventing the deterioration of the die bond paste of the LED element 7.
  Further, in the present embodiment, since the bottom surface joint portion 8a of the sealing resin 8 enters the concave portion formed by the bottom portion 2 and the heat radiation lead portion 3, the bottom surface joint portion 8a has a structure that is difficult to be removed from the concave portion. It has become. Further, since the bottom surface joining portion 8a is joined to the surface of the wedge portion 2g in addition to the exposed portions 2d and 2f, the joining force to the bottom portion 2 is extremely high.
  In the present embodiment, the exposure hole 3b and the exposure hole 3b of the heat radiation lead 3 are exposed in correspondence with the three exposed portions 2a, 2b, 2c formed by the lead portions 3, 4, 5 spaced apart from each other. Three exposed portions 2d, 2e, and 2f are formed using the cutout 3c. Thereby, even if the arrangement state of each lead part 3, 4, 5 is arbitrarily set, the hole 3 b for exposure and the notch 3 c for exposure are formed in the heat radiating lead part 3 to suppress peeling of the sealing resin 8. The degree of freedom in design is high.
  In the present embodiment, the horizontal movement of the heat radiating lead 3 is hindered by the joint portion between the sealing resin 8 and the bottom 2 in each exposure hole 3b. In the present embodiment, the heat radiating lead portion 3 extends in the front-rear direction and protrudes from the bottom portion 2 and the reflector portion 6 to the front outer side and the rear outer side, so that a load in the front-rear direction is easily applied. Since the exposure hole 3b is formed, the load in the front-rear direction can be accurately resisted. Accordingly, it is possible to accurately prevent the heat radiation lead part 3 from coming out of the bottom part 2 and the reflector part 6. Further, the horizontal movement of the heat radiating lead 3 is also inhibited by the joint portion between the sealing resin 8 and the bottom 2 in the exposure notch 3 c of the heat radiating lead 3.
  Further, since each exposure hole 3b is formed in a circular shape, atmospheric gas such as air hardly remains from each exposure hole 3b when the sealing resin 8 is filled, and the inside of each exposure hole 3b. No bubbles are generated in the case.
  Further, even if each exposure hole 3b is formed in the heat radiating lead 3, the decrease in the volume of the heat radiating lead 3 used for heat transfer is minimized, so that the heat generated when the LED element 7 is used is reduced. The heat dissipation performance is not impaired. Furthermore, since the decrease in the area covered by the heat radiating lead 3 at the bottom 2 is minimized, the reflection performance of light incident on the heat radiating lead 3 is not impaired.
  In the above embodiment, the face-up type is shown as the LED element 7, but it is needless to say that a flip-chip type may be used. Moreover, although what emitted blue light as the LED element 7 was shown, you may use what emits green light or red light, for example. Alternatively, a light emitting device that emits white light may be used in which three LED elements of blue, green, and red are mounted on separate lead portions. In this case, it is preferable to form exposure holes in all of the lead portions on which the three LED elements are mounted. Further, although the light emitting device 1 using the GaN-based semiconductor material as the LED element 7 has been described, a light-emitting element made of another semiconductor material such as ZnSe-based or SiC-based may be used.
  Moreover, in the said embodiment, although the bottom part 2 and the reflector part 6 showed the light-emitting device 1 which consists of resin, it cannot be overemphasized that this invention is applicable to the light-emitting device which the bottom part 2 and the reflector part 6 consist of ceramics. Absent.
In the above embodiment, the exposure hole 3b is formed with the wedge 2g. However, for example, as shown in FIG. 4, only the sealing resin 8 is filled without forming the wedge 2g. You may be made to do. In the light emitting device 1, the bottom surface bonding portion 8 a of the sealing resin 8 enters the lower side of the reflector portion 6. Therefore, when a load in a direction away from the bottom surface is applied to the sealing resin 8, the bottom surface bonding portion 8 a Is caught by the lower end of the reflector part 6, and the movement of the sealing resin 8 is suppressed. In this configuration, since the wedge portion 2g is not formed, the limit value against the load in the front-rear direction of the heat radiating lead 3 is lower than that in the above embodiment, but the heat radiating lead portion 3 has an exposure notch 3c. By forming this, the movement of the heat radiating lead portion 3 in the horizontal direction can be reliably prevented.
For example, as shown in FIG. 5, the sealing resin 8 may not be filled in the exposure hole 3b, and the wedge 2g of the bottom 2 may be formed on the entire exposure hole 3b.
  Moreover, in the said embodiment, although what showed the pair of front-and-back exposure hole 3b in the thermal radiation lead part 3 was shown, the number and arrangement | positioning location of the exposure hole part 3b are arbitrary. For example, an exposure hole 3b is formed instead of the exposure notch 3c in the above embodiment, and as shown in FIG. 6, a total of three exposure holes are formed with the right side of the heat radiating lead 3 being the exposure hole 3b. 3b may be formed. Also in FIG. 6, the six exposed portions 2 a, 2 b, 2 c, 2 d, 2 e, 2 f on the upper surface of the bottom portion 2 are arranged at substantially equal intervals in the circumferential direction. Further, for example, as shown in FIG. 7, an exposure hole 3 b may be formed only on the right side of the heat radiating lead 3.
  Moreover, in the said embodiment, although the inner edge of the reflector part 6 was shown circularly formed by the top view, for example, as shown in FIG. 8, it may be formed in a square shape. The shape of the reflector portion 6 is arbitrary.
  Moreover, in the said embodiment, although the light-emitting device 1 using the LED element 7 as a light-emitting element was demonstrated, a light-emitting element is not limited to an LED element, About other specific detailed structures etc. suitably Of course, it can be changed.
It is an external appearance perspective view of the light-emitting device which shows one Embodiment of this invention. It is a schematic top view of a light-emitting device. It is AA sectional drawing of FIG. It is sectional drawing of the light-emitting device in the cross section which shows a modification and corresponds to the AA cross section of FIG. It is sectional drawing of the light-emitting device in the cross section which shows a modification and corresponds to the AA cross section of FIG. It is a schematic top view of the light-emitting device which shows a modification. It is a schematic top view of the light-emitting device which shows a modification. It is a schematic top view of the light-emitting device which shows a modification.
Explanation of symbols
DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Bottom part 2a 1st exposed part 2b 2nd exposed part 2c 3rd exposed part 2d 4th exposed part 2e 5th exposed part 2f 6th exposed part 2g Wedge part 3 Heat radiation lead part 3a Element mounting part 3b Exposure hole Part 3c notch for exposure 4 negative electrode lead part 5 positive electrode lead part 6 reflector part 6a hole 7 LED element 8 sealing resin 8a bottom surface joining part 9 zener diode 10 wire 11 wire 12 wire 13 cover member 101 light emitting device 102a exposed part 102b exposed part 102c Exposed portion 102d Exposed portion 103 First lead portion 103b Exposed hole portion 104 Second lead portion 104b Exposed hole portion

Claims (5)

  1. A bottom made of insulating material;
    A pair of metal conductive leads disposed on the bottom portion to be spaced apart from each other;
    A metal non-conductive lead portion disposed on the bottom portion to be separated from the pair of conductive lead portions;
    A light emitting element mounted on the non-conductive lead portion and electrically connected to the pair of conductive lead portions by wires;
    A reflector portion disposed on the conductive lead portion and the non-conductive lead portion and surrounding a side of the light emitting element;
    A sealing resin that fills a region surrounded by the bottom portion, the conductive lead portion, the nonconductive lead portion, and the reflector portion, and seals the light emitting element and the wire;
    An exposure hole formed so as to overlap the non-conductive lead portion with the inner edge of the lower end of the reflector portion in a top view, exposing the top surface of the bottom portion from the non-conductive lead portion, and joining the bottom portion and the sealing resin. A light emitting device.
  2. The non-conductive lead portion extends in a predetermined direction,
    The light-emitting device according to claim 1, wherein the pair of exposure hole portions are formed to be symmetric with respect to the predetermined direction.
  3.   The light emitting device according to claim 2, wherein the exposing hole is formed in a circular shape when viewed from above.
  4.   An exposure that is formed so as to overlap the outer edge of the non-conductive lead portion with the inner edge of the lower end of the reflector portion in a top view, and exposes the upper surface of the bottom portion from the non-conductive lead portion to join the bottom portion and the sealing resin. The light emitting device according to claim 3, further comprising a notch for use.
  5.   Inside the reflector portion, exposed portions where the upper surface of the bottom portion is exposed from the plurality of lead portions and joined to the sealing resin are arranged at substantially equal intervals along the inner edge of the lower end of the reflector portion. The light-emitting device according to claim 1.
JP2007082608A 2007-03-27 2007-03-27 Light emitting apparatus Withdrawn JP2008244151A (en)

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Application Number Priority Date Filing Date Title
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JP2008270444A (en) * 2007-04-19 2008-11-06 Stanley Electric Co Ltd Optical semiconductor device and method of manufacturing the same
JP2010153861A (en) * 2008-12-15 2010-07-08 Yiguang Electronic Ind Co Ltd Light emitting diode package structure
JP2011249368A (en) * 2010-05-21 2011-12-08 Sharp Corp Semiconductor light-emitting device
JP2012519973A (en) * 2009-03-10 2012-08-30 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH Optoelectronic semiconductor parts

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JP2002223004A (en) * 2001-01-26 2002-08-09 Nichia Chem Ind Ltd Package molding and light emitting device
JP2002252373A (en) * 2001-02-26 2002-09-06 Nichia Chem Ind Ltd Surface-mounted type light-emitting element and light emission device using the same
JP2006086178A (en) * 2004-09-14 2006-03-30 Toshiba Corp Resin-sealed optical semiconductor device
JP2006222454A (en) * 2006-05-01 2006-08-24 Toshiba Corp Semiconductor light emitting device and surface-mounted package

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JP2002223004A (en) * 2001-01-26 2002-08-09 Nichia Chem Ind Ltd Package molding and light emitting device
JP2002252373A (en) * 2001-02-26 2002-09-06 Nichia Chem Ind Ltd Surface-mounted type light-emitting element and light emission device using the same
JP2006086178A (en) * 2004-09-14 2006-03-30 Toshiba Corp Resin-sealed optical semiconductor device
JP2006222454A (en) * 2006-05-01 2006-08-24 Toshiba Corp Semiconductor light emitting device and surface-mounted package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270444A (en) * 2007-04-19 2008-11-06 Stanley Electric Co Ltd Optical semiconductor device and method of manufacturing the same
JP2010153861A (en) * 2008-12-15 2010-07-08 Yiguang Electronic Ind Co Ltd Light emitting diode package structure
US8704264B2 (en) 2008-12-15 2014-04-22 Everlight Electronics Co., Ltd. Light emitting diode package structure
JP2012519973A (en) * 2009-03-10 2012-08-30 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH Optoelectronic semiconductor parts
US8946756B2 (en) 2009-03-10 2015-02-03 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component
JP2011249368A (en) * 2010-05-21 2011-12-08 Sharp Corp Semiconductor light-emitting device

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