JP2008227434A - Heat dissipating device of heating element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipating device of a heating element for radiating heat efficiently from two or more heating elements and maintaining the temperature of each heating element almost equal with each other. <P>SOLUTION: Two or more parallel branched passages 16a-16m, which are branched respectively from one pair of parallel passages 13-14 having an inlet 15a and outlet 15b of cooling medium at each end thereof, are provided correspondingly to two or more heating elements 12a-12n arranged in a row. The size of each branched passage 16 is adjusted according to the distance from the inlet 15a and the outlet 15b, and the heat is radiated by the cooling medium so that temperature rise of two or more heating elements 12 may become almost equal to each other. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat radiating device for a heat generating element, and more particularly to a heat radiating device for a heat generating element such as a power amplifier with large heat generation used for communication equipment including a TV transmitter.

  Electronic components include high heat generating electronic components that inevitably generate high heat during operation. The power amplifier is one of such high heat generation electronic components. In particular, a communication device including a TV transmitter and a radio signal relay device uses a power amplifier that amplifies a radio signal to a predetermined output power in order to transmit a radio wave having a sufficient electric field strength to the service area. However, a power amplifier for such an application is a typical example of an electronic component that generates the largest amount of heat.

  The power amplifier, which is such a highly heat-generating electronic component, needs to be cooled in order to maintain its operation stability and to achieve a predetermined operation life, and to keep the temperature rise within a predetermined range. For cooling such highly heat-generating electronic components, a heat-conductive member is placed in contact with the heat-generating part, and the heat of the heat-generating part is transferred to the outside to dissipate the heat. For example, forced air cooling that blows and cools low-temperature air to the heat generating part, and forced water cooling that circulates a coolant (for example, liquid) such as cooling water through a pipe and the like and carries heat to the outside by the coolant circulating in the pipe . Since the power amplifier such as the TV transmitter described above requires high cooling performance, it is common to employ forced water cooling.

  FIG. 3 shows a conventional cooling device or cooling structure for a general heating element. 3A is a plan view, FIG. 3B is a sectional view taken along line BB in FIG. 3A, and FIG. 3C is a sectional view taken along line AA in FIG. . The heat generating element cooling device 30 includes a plurality of heat generating elements 32a to 32n (for convenience of explanation, these multiple heat generating elements may be collectively referred to by reference numeral 32) on a cold plate (cooling plate member) 31. For example, they are arranged in two rows. Each heating element 32 is attached to the cold plate 31 via an electric heating member 33.

  In the cold plate 31, flow paths 34-35 are formed along the rows of the heat generating elements 32. For example, an inlet connector 36 is attached to one end of the flow path 34, and an outlet connector 38 is attached to one end of the flow path 35. The other ends of the flow paths 34 and 35 are connected to each other by a connecting pipe 37. And it is comprised so that refrigerant | coolants, such as cooling water, may flow in the flow path 34-35 over the inlet connector 36 and the outlet connector 38. FIG.

  According to the conventional heat generating element cooling apparatus 30 as described above, the cooling water injected from the inlet connector 36 is heated by sequentially receiving heat from the heat generating elements 32a, 32b, 32c,. Are discharged from the outlet connector 38). Therefore, the cooling efficiency of the heating element 32a closest to the inlet connector 36 is the highest, and the cooling efficiency of the heating element 32n closest to the outlet connector 38 is the lowest. Therefore, it is necessary to set the flow rate of the cooling water so that the heating element 32n having the lowest cooling efficiency (or the worst cooling condition) is cooled to a predetermined temperature range.

  A number of techniques intended to efficiently cool a large number of heating elements or large area heating elements are disclosed in the technical literature. A circuit board cooling device for cooling a heat generating element (electronic device) by forming a refrigerant conduction path through which a refrigerant flows from a refrigerant flow path corresponding to a plurality of heat generating elements mounted on the circuit board is disclosed. (For example, refer to Patent Document 1). Further, a heat sink for a power module is disclosed that efficiently dissipates heat generated by a power module by flowing a cooling medium through parallel flow paths formed for power devices arranged in a plane (for example, patents). Reference 2). Furthermore, a cooling structure for a heating element is disclosed in which cooling chambers are formed in parallel over the entire surface of the printed circuit board, and a coolant is allowed to flow through these cooling chambers to uniformly cool the entire printed circuit board (see, for example, Patent Document 3). .

Japanese Patent Laying-Open No. 2005-191474 (page 3-4, FIGS. 1 and 4) JP 2006-310485 A (pages 7-8, FIG. 2) JP-A-5-335769 (page 3, Fig. 1)

  The conventional heating element cooling device or cooling method as described above has a problem that it is impossible or difficult to cool a large number of heating elements or a heating element having a large area as uniformly and efficiently as possible. Therefore, the cooling efficiency or cooling characteristics of the heating element are inferior.

  That is, in the prior art as shown in FIG. 3, since the cooling of the heating element of the power amplifier is connected by one flow path, the temperature of the cooling water rises due to the heat received from the upstream heating element. The temperature of the heating element becomes higher than that of the upstream heating element, and the temperature state differs between the heating elements. As a result, depending on the amount of heat generated by the heating element, the temperature condition is satisfied on the upstream side, but the temperature condition cannot be satisfied on the downstream side. Moreover, even if a plurality of cooling channels are provided as shown in Patent Documents 1 to 3 described above, the cooling efficiency varies depending on the distance from the refrigerant inlet of each channel, and uniform or uniform cooling is impossible. Or there was a problem that it was difficult.

  The present invention has been made in view of the above-described problems of the prior art, and enables a heat generating device for a heat generating element having excellent heat dissipation characteristics to enable cooling of each part of a plurality of heat generating elements or large heat generating elements substantially uniformly or uniformly. The purpose is to provide.

  In order to solve the above-described problems and achieve the above-described object, the heat-dissipating device for a heating element of the present invention employs the following characteristic configuration.

(1) In a heat dissipating device for a heat generating element that dissipates heat generated by a plurality of heat generating elements arranged in a row on one surface of a cooling plate member and maintains the heat at a predetermined temperature,
A pair of parallel refrigerant passages, each having one end serving as a refrigerant inlet and outlet, are provided along the row of the plurality of heating elements, and a plurality of the passages substantially orthogonal to the pair of refrigerant flow paths are provided. A branch channel is provided inside the cooling plate-like member, and the size of the plurality of branch channels is adjusted according to the distance from one end where the inlet and the outlet are formed, A heat-dissipating device for a heat-generating element that makes it possible to adjust the amount of refrigerant flowing through.
(2) The heat dissipation device for a heat generating element according to (1), wherein the refrigerant passage is formed away from the row of the plurality of heat generating elements.
(3) The heat dissipation device for a heating element according to (1) or (2), wherein the plurality of branch channels are formed in alignment with the heating element.
(4) The heat dissipation device for a heat generating element according to (1), (2), or (3), wherein the refrigerant passage and the branch flow path are provided inside a heat dissipation plate to which the plurality of heat generating elements are attached.
(5) The refrigerant passage and the branch flow path are formed in a frame shape, and the plurality of heating elements are arranged in the branch flow path via a pedestal (1), (2) or (3) Heating device for heat generating elements.
(6) The heat dissipation device for a heat generating element according to (5), wherein the refrigerant passage and the branch flow passage are formed by pipes having a substantially rectangular cross-sectional shape.
(7) The heat dissipation device for a heat generating element according to any one of (1) to (6), wherein the plurality of heat generating elements form a power amplifier.

  According to the heat-dissipating device for a heating element of the present invention, there are the following practical effects. That is, since a plurality of heat generating elements can be dissipated substantially uniformly, each heat generating element can be stably operated with a small amount of refrigerant. The reason is that the sizes of a plurality of branch channels branched from a pair of parallel refrigerant channels are adjusted according to the distance from the inlet. Therefore, it is particularly suitable for a heat dissipation device for an amplifying element such as a power amplifier in a TV transmitter using a large number of heat generating elements.

  Hereinafter, the configuration and operation of a preferred embodiment of a heat dissipating device for a heat generating element according to the present invention will be described in detail with reference to the accompanying drawings.

  First, FIG. 1 is a diagram showing a structure of a first embodiment of a heat dissipation device for a heat generating element (hereinafter sometimes simply referred to as a heat dissipation device) constituting a power amplifier according to the present invention, and FIG. (B) is sectional drawing in alignment with line BB in (A), (C) is sectional drawing in alignment with line AA in (A).

  A heat dissipation device 10 shown in FIG. 1 is applied to, for example, a power amplifier for a TV transmitter, and includes amplifying elements that generate heat, such as a plurality of transistors arranged at predetermined intervals from each other. As shown in FIG. 1A, the heat radiating device 10 includes a plurality of heat generating elements 12a to 12n arranged on one surface, for example, the upper surface, of a heat radiating plate member (hereinafter referred to as a heat radiating plate) 11 called a cold plate. Contains.

  As shown in FIGS. 1B and 1C, the heat radiating plate 11 has a two-body (or double) structure including an upper heat radiating plate 11a and a lower heat radiating plate 11b. The plurality of heating elements 12a to 12n described above are arranged in, for example, two rows over substantially the entire surface (upper surface) of the upper heat radiating plate 11a. Furthermore, a heat radiation (or cooling) path for flowing a coolant such as cooling water is formed at the joint between the upper heat radiation plate 11a and the lower heat radiation plate 11b. As shown in FIG. 1 (A), this heat radiation path is a pair of relatively large parallel coolant passages 13 each having a refrigerant inlet (connector) 15a and a discharge outlet (connector) 15b formed at one end. -14 and a plurality of mutually parallel branch flow paths 16a to 16m branched substantially orthogonally to the refrigerant passage 13-14. Here, the refrigerant passages 13-14 are arranged slightly apart from each other outside the rows of the plurality of heating elements 12a to 12n arranged in two rows. On the other hand, the plurality of branch flow paths 16a to 16m are respectively aligned with the heating elements 12a to 12n (that is, formed directly under these heating elements 12).

  Next, the above-described heat radiating plate (cold plate) 11 includes an upper heat radiating plate 11a and a lower heat radiating plate 11b, and is bonded to each other by brazing or the like. As shown in FIGS. 1B and 1C, a recess 17 is formed at a position corresponding to each heating element 12 on the surface of the upper heat radiating plate 11a, and each recess 17 has a heat transfer material 18 interposed therebetween. A heating element 12 is attached. Further, a printed circuit board 19 is disposed on the upper surface of the upper heat radiating plate 11a, and a connection between the plurality of heat radiating elements 12 and other passive electronic devices (not shown) are mounted.

  As shown in FIG. 1 (A), the sizes of the plurality of branch channels 16a to 16m described above are adjusted according to the distance from the refrigerant inlet 15a and outlet 15b. That is, the branch flow path 16a and the like close to one end provided with the injection port 15a and the discharge port 15b are reduced in size, and the branch flow path 16m and the like separated from the one end are increased in size. As a result, it should be noted that the refrigerant injected from the injection port 15a is diverted into different amounts to the plurality of branch flow paths 16a to 16m, and is adjusted so as to cool the corresponding heating elements 12 substantially uniformly. .

  The size of the refrigerant passage 13-14 is selected to be sufficiently large compared to the refrigerant inlet 15a, for example, compared to the branch flow path 16a. The size of the refrigerant passage 13-14 may be substantially equal to the size of the branch flow channel 16m that is farthest from the inlet 15a, for example.

  Next, the operation of the heat dissipation device 10 shown in FIG. 1 will be described. First, when a power amplifier or the like constituted by the heating element 12 is operated, the heating element 12 generates heat. Therefore, when cooling water or the like, which is a refrigerant, is injected from the inlet 15a, the injected refrigerant passes through the refrigerant passage 13, and is an inlet of one end of the plurality of branch flow paths 16a to 16m (lower ends in FIG. 1A). To reach quickly. Then, it passes through each branch channel 16 to the refrigerant passage 14 on the opposite side, which is an outlet, and is discharged from the discharge port 15. Meanwhile, heat conducted from the heating element 12 to the heat radiating plate 11 via the heat transfer material 18 is taken away by the regulated amount of refrigerant flowing in the branch flow path 16 and is radiated by the refrigerant.

  Here, the heat generated by the heating elements 12 is conducted to the heat dissipation plate 11 around each heating element 12. That is, it is conducted to the outside and the inside of the row of heating elements 12. By providing the refrigerant passage 13-14 outside the heating element 12, the heat conducted from the row of the heating elements 12 to the outside is radiated by the refrigerant flowing through the refrigerant passage 13-14. On the other hand, the heat conducted to the inside of the row of the heating elements 12 is radiated by the refrigerant flowing through the branch flow path 16. Therefore, by efficiently dissipating the heat generated by the heating element 12, the temperature rise of the heating element 12 can be suppressed within a preset temperature range. In addition, it is possible to apply a predetermined pressure to the refrigerant to control the speed of the refrigerant flowing in the refrigerant passages 13-14 and the branch flow path 16 (accordingly, the flow rate of the refrigerant per unit time).

  Next, FIG. 2 is a plan view showing a second embodiment of a heat dissipation device (heat dissipation device) for a heating element according to the present invention. In this heat radiating device 20, for convenience of explanation, the same reference numerals are given to the constituent elements corresponding to those of the heat radiating device 10 shown in FIG. 1, and the following explanation will be made focusing on differences from the heat radiating device 10. I will do it.

  In the heat radiating device 20 shown in FIG. 2, a pair of parallel pipes (refrigerant passages) 23-24 and a pair of these pipes 23-24 are used without using a heat radiating plate (cold plate) forming a refrigerant flow path. A pipe-like frame composed of branch pipes (branch flow paths) 26a to 26m arranged in parallel and pedestals 21a to 21m provided on the respective branch pipes 26. For example, a power amplifier is constructed on each pedestal 21. A plurality of heating elements 22a to 22n are mounted. An inlet (connector) 25a and an outlet 25b are respectively provided at one end of the parallel pipes 23-24.

  In the heat radiating device 20 as well, similarly to the heat radiating device 10 shown in FIG. 1, the size of the plurality of branch pipes 26 depends on the distance from one end where the inlet 25a and the outlet 25b are provided to each branch pipe 26. Different sizes are selected. The cross-sectional shapes of the pipes 23-24 and 26 are not necessarily circular, and may be any shape such as a rectangle. In particular, the mounting surface of the pedestal 21 is preferably substantially flat.

  As mentioned above, the heat radiating device of the heat generating element according to the present invention has been described in detail based on the preferred embodiment. However, it should be noted that such embodiments are merely examples of the present invention and do not limit the present invention. Those skilled in the art can easily understand that various modifications and changes can be made according to a specific application without departing from the gist of the present invention.

  For example, the plurality of heat generating elements are not necessarily arranged in two rows, and can be arranged in a plurality of rows of three or more rows. In addition, the plurality of branch flow paths branching from the pair of refrigerant passages connected to the inlet and the outlet are curved with acute angles (angles less than 90 °) or rounded at both ends with respect to the refrigerant flow path. You may let them. The heat-radiating device for heat-generating elements of the present invention is preferably applied for heat-dissipating and cooling power amplifiers of television transmitters and other high-power electronic devices that use a large number of heat-generating elements that generate a large amount of heat.

1 shows a first embodiment of a heat dissipation device for a heat generating element according to the present invention, (A) is a plan view, (B) is a cross-sectional view taken along line BB in (A), and (C) is in (A). It is sectional drawing in alignment with line AA. The top view of 2nd Embodiment of the thermal radiation apparatus of the heat generating element by this invention is shown. The heat dissipation structure of the conventional heat generating element (power amplifier) is shown, (A) is a top view, (B) is sectional drawing in alignment with line BB in (A), (C) is line A in (A). It is sectional drawing which follows -A.

Explanation of symbols

10, 20 Heat radiating device (heat radiating device)
11 Heat sink (cold plate)
12, 22 Heating element 13-14, 23-24 Refrigerant flow path 15a, 25a Refrigerant inlet 15b, 25b Refrigerant discharge port 16, 26 Branch flow path (branch pipe)
17 Recess 18 Conductive material 19 Printed circuit board

Claims (7)

In a heat dissipation device for a heat generating element that dissipates heat generated by a plurality of heat generating elements arranged in a row on one surface of the cooling plate member and maintains the heat at a predetermined temperature,
A pair of parallel refrigerant passages, each having one end serving as a refrigerant inlet and outlet, are provided along the row of the plurality of heating elements, and a plurality of the passages substantially orthogonal to the pair of refrigerant flow paths are provided. A branch channel is provided inside the cooling plate-like member, and the size of the plurality of branch channels is adjusted according to the distance from one end where the inlet and the outlet are formed, A heat dissipating device for a heat generating element, characterized in that the amount of refrigerant flowing through the air can be adjusted.   2. The heat dissipation device for a heat generating element according to claim 1, wherein the refrigerant passage is formed outwardly from the row of the plurality of heat generating elements.   The heat dissipation device for a heat generating element according to claim 1, wherein the plurality of branch flow paths are formed in alignment with the heat generating element.   The heat-radiating device for a heat-generating element according to claim 1, wherein the refrigerant passage and the branch flow path are provided inside a heat-dissipating plate to which the plurality of heat-generating elements are attached.   4. The refrigerant passage and the branch flow path are formed in a frame shape, and the plurality of heating elements are arranged in the branch flow path via a pedestal. A heat dissipation device for a heating element.   The heat dissipation device for a heat generating element according to claim 5, wherein the refrigerant passage and the branch flow path are formed by a pipe having a substantially rectangular cross-sectional shape. The heat-radiating device for a heating element according to claim 1, wherein the plurality of heating elements form a power amplifier.

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