JP2008197337A - Liquid crystal display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal display provided with a glass substrate, having a line capable of responding to a plurality of kinds of driver ICs, in which the bump arrangements are different from one another. <P>SOLUTION: The glass substrate 1 of the liquid crystal display is provided with an outputting pad 3, connected in common with two kinds of driver ICs and inputting pads 2a, 2b corresponding to the two kinds of driver ICs, respectively. The inputting pads 2a, 2b are aligned in two arrays and, according to the driver IC to be connected, permit connection to an inputting pad 2a or connection to an input pad 2b. By configuring the glass substrate 1 in this manner, with a single of glass substrate 1 two kinds of driver ICs can be coped with. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a liquid crystal display device applicable to an electronic device having an information display function, represented by a monitor of a television or a personal computer.

  The liquid crystal display device includes a liquid crystal panel having a liquid crystal layer sandwiched between two glass substrates and a polarizing plate, and controls the polarization of light transmitted or reflected by the liquid crystal panel by controlling the orientation of the liquid crystal. It is an apparatus that displays an image by selectively transmitting light through a plate.

  In recent years, active matrix liquid crystal display devices that control the alignment of liquid crystals using thin film transistors have become mainstream. As shown in the block diagram of the liquid crystal display device in FIG. 6, the active matrix type liquid crystal display device is input with a display portion 11 having a plurality of thin film transistors, a source driver 12 and a gate driver 13 for applying a voltage to the thin film transistors. A display control IC 16 that controls the source driver 12 and the gate driver 13 based on the video signal, and an output wiring 22 that connects the source driver 12 and the gate driver 13 to the display unit 11. The source driver 12 includes a plurality of source driver ICs 14, and the gate driver 13 similarly includes a plurality of gate driver ICs 15.

  In some liquid crystal display devices 10, the source driver IC 14 and the gate driver IC 15 are arranged on a glass substrate of a liquid crystal panel provided with the display unit 11 in order to reduce the size of the liquid crystal display device 10. In addition, the flip chip method is used to directly connect the pads provided at the end of the wiring arranged on the glass substrate and the protruding bumps provided on the surfaces of the source driver IC 14 and the gate driver IC 15. However, some of them are more compact.

  Wiring on a glass substrate to which driver ICs such as source driver ICs and gate driver ICs are connected by a flip chip method will be described with reference to FIG. FIG. 7 is a schematic view showing the vicinity of a portion where the driver IC of the glass substrate is arranged. As shown in FIG. 7, the glass substrate 17 includes an input wiring 19 for inputting a signal to the driver IC 18, an input pad 21 provided at an end of the input wiring 19 and connected to the input bump 20 of the driver IC 18, An output wiring 22 for supplying a signal output from the driver IC 18 to the thin film transistor and an output pad 24 provided at an end of the output wiring 22 and connected to the output bump 23 of the driver IC 18 are provided. In the figure, the driver IC 18 is indicated by a broken line.

  The direction in which the input pad 21 and the output pad 24 are aligned is substantially parallel, and the input pad 21 is aligned in one row and the output pad 24 is aligned in two rows. The output pads 24 constituting each row are shifted in a direction substantially perpendicular to the direction in which the pads 21 and 24 are aligned, and are alternately aligned. The arrangement of the input pad 21 and the output pad 24 corresponds to the arrangement of the input bump 21 and the output bump 24 of the driver IC 18 to be connected. Further, the surfaces of the input wiring 19 and the output wiring 22 connected to the input pad 21 and the output pad 24 are covered with an insulating resin, and are protected so that dust or the like does not adhere to the wirings 19 and 22.

As a liquid crystal display device to which a driver IC is connected in such a flip chip system, a liquid crystal display device in which a spare pad is provided in case the pad is damaged has been proposed (see Patent Document 1).
JP-A-9-120978

  However, the size of the driver IC and the arrangement of the input bumps and output bumps provided in the driver IC vary depending on the type of the driver IC, and other types of glass substrates having pads corresponding to bumps of a certain type of driver IC are provided. There is a problem that it is difficult to divert the driver IC. Therefore, conventionally, a glass substrate dedicated to each driver IC corresponding to each driver IC that may be used has been manufactured. Therefore, since it is necessary to manufacture various types of glass substrates, the productivity of the glass substrate is deteriorated, and accordingly, the productivity of the liquid crystal display device is also deteriorated.

  In addition, only one driver IC may be used, and only one type of glass substrate corresponding to only that driver IC may be manufactured. However, if that driver IC cannot be received due to some problem, it may be used. When it becomes impossible, the production of the liquid crystal display device is stopped, which is a further problem. Therefore, a glass substrate that can cope with a plurality of types of driver ICs having different bump arrangements has been desired so far.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve these problems and to provide a liquid crystal display device including a glass substrate having wiring that can correspond to a plurality of types of driver ICs having different bump arrangements.

  In order to achieve the above object, the present invention provides a glass substrate provided with a plurality of control elements for controlling the orientation of liquid crystal, and a driver provided with a plurality of input bumps and a plurality of output bumps arranged on the glass substrate. IC, a plurality of output wirings provided on the glass substrate for connecting the driver IC and the control element, an output pad provided on each of the output wirings and connected to the output bumps of the driver IC, A liquid crystal display provided with a plurality of input wirings provided on the glass substrate and for inputting a signal to the driver IC, and input pads provided on each of the input wirings and connected to the input bumps of the driver IC. In the apparatus, a plurality of the input pads are provided on one input wiring, and the input wiring Characterized in that it is connected in series.

  In the liquid crystal display device having the above-described configuration, the output pads may be arranged in a predetermined direction, and the input pads may be arranged in a plurality of rows aligned in a direction substantially equal to the direction.

  In the liquid crystal display device having the above-described configuration, the input pads may be aligned with respect to a direction substantially perpendicular to the predetermined direction in which the output pads are aligned.

  In the liquid crystal display device having the above-described configuration, two input pads may be provided for each input wiring.

  In addition, a liquid crystal display device of the present invention includes a glass substrate including a plurality of thin film transistors for controlling the alignment of liquid crystal, a driver IC including a plurality of input bumps and a plurality of output bumps arranged on the glass substrate. A plurality of output wirings provided on the glass substrate for connecting the driver IC and the thin film transistor; output pads provided on each of the output wirings and connected to the output bumps of the driver IC; and the glass substrate. In a liquid crystal display device comprising: a plurality of input wirings provided on the driver IC for inputting signals to the driver IC; and input pads provided on the input wirings and connected to the input bumps of the driver IC. Two of the input pads are provided on each of the input wirings, and It is connected in series by a force wiring and becomes two rows aligned in a direction substantially equal to a predetermined direction in which the output pads are aligned, and also in a direction substantially perpendicular to the predetermined direction in which the output pads are aligned, The input pads may be aligned.

  According to the configuration of the present invention, since the input pads corresponding to the positions of the bumps of the plurality of driver ICs are respectively provided, it is possible to correspond to the plurality of driver ICs with a single glass substrate. Therefore, the types of glass substrates to be produced can be reduced, and productivity can be improved.

  Hereinafter, a liquid crystal display device according to an embodiment of the present invention will be described with reference to FIGS. First, the structure of the pad provided on the glass substrate with which the liquid crystal display device in embodiment of this invention is provided is demonstrated using FIG. FIG. 1 is a schematic diagram showing the vicinity of a portion where a driver IC of a glass substrate is arranged, and corresponds to FIG. 7 showing a conventional example.

  As shown in FIG. 1, the glass substrate 1 provided in the liquid crystal display device according to the present embodiment includes an input wiring 4 for inputting a signal to the driver IC and an input bump of the driver IC provided at an end of the input wiring 4. Input pads 2a and 2b connected to the output wiring, output wiring 5 for supplying a signal output from the driver IC to the thin film transistor, and output pad 3 provided at an end of the output wiring 5 and connected to the output bump of the driver IC. And an alignment mark 9 for accurately arranging the driver IC.

  In addition, the input pads 2a, 2b and the output pad 3 are provided in two rows on the glass substrate, respectively, and the direction in which the pads 2a, 2b, 3 are aligned (the X direction in the figure, hereinafter referred to as the alignment direction). Are substantially parallel. However, the input pads 2a and 2b are aligned with each other in a direction perpendicular to the alignment direction, and the output pads 3 are shifted with respect to the direction perpendicular to the alignment direction and are alternately aligned.

  Of the input pads 2a and 2b, the input pads 2a and 2b adjacent in the direction substantially perpendicular to the alignment direction are connected in series by the input wiring 4, and the input of the driver IC is input to either input pad 2a or 2b. Even if the bump is connected, a signal is input to the driver IC. The surfaces of the input wiring 4 and the output wiring 5 are covered with an insulating resin.

  Next, the case where the driver IC is connected to the input pad and the output pad shown in FIG. 1 will be described with reference to FIGS. 2 and 3 are schematic views showing a case where a driver IC is attached to the input pad and the output pad shown in FIG. In this figure, the driver IC is indicated by a broken line.

  FIG. 2 is a diagram showing a case where the input bump 7a of the driver IC 6a is connected to the input pad 2a in the row closer to the output pad 3 out of the two rows of input pads 2a and 2b. It is the figure shown about the case where the input bump 7b of driver IC6b is connected with respect to the input pad 2b of the row | line | column far from the output pad 3. FIG.

  At this time, comparing the driver IC 6a shown in FIG. 2 with the driver IC 6b shown in FIG. 3, the driver IC 6b is longer in the direction perpendicular to the alignment direction than the driver IC 6a. The distance between the input bumps 7a and 7b and the output bumps 8a and 8b provided in the respective driver ICs 6a and 6b is different in the direction perpendicular to the alignment direction, and the distance between the output bump 8b and the input bump 7b is greater. The distance between the output bump 8a and the input bump 7a is longer.

  However, the intervals and arrangement of the output bumps 8a and 8b of the driver ICs 6a and 6b are substantially equal, and the intervals and arrangement of the input bumps 7a and 7b are also substantially equal. Accordingly, in the driver ICs 6a and 6b, the distances between the input bumps 7a and 7b and the output bumps 8a and 8b are different from each other, and this difference in length is a problem in connecting the driver ICs 6a and 6b to the glass substrate 1. Become.

  Therefore, in the glass substrate 1 shown in FIGS. 1 to 3, the output pads 3 connected to the output bumps 8 a and 8 b of the respective driver ICs 6 a and 6 b are made common, and each driver is matched to the output pad 3. The glass substrate 1 is provided with input pads 2a and 2b for connection to the respective input bumps 7a and 7b, corresponding to the displacement of the positions of the respective input bumps 7a and 7b that occur when the ICs 6a and 6b are arranged. .

  The driver ICs 6a and 6b are arranged on the glass substrate 1 after accurately arranging the driver ICs 6a and 6b so that the input bumps 7a and 7b and the output bumps 8a and 8b are arranged on the input pads 2a and 2b and the output pad 3. Connect to. At this time, in order to accurately arrange the bumps 7a, 7b, 8a, 8b of the driver ICs 6a, 6b on the respective pads 2a, 2b, 3, the glass substrate 1 is mounted on a device for arranging and connecting the driver ICs 6a, 6b. The alignment mark 9 is read. Then, the connection is performed after the positions of the bumps 7a, 7b, 8a, 8b of the driver ICs 6a, 6b and the positions of the pads 2a, 2b, 3 of the glass substrate 1 are accurately matched.

  The connection between the input bumps 7a and 7b and the output bumps 8a and 8b of the driver ICs 6a and 6b and the input pads 2a and 2b and the output pad 3 is called, for example, an anisotropic conductive film (hereinafter referred to as an ACF). Fix using a tape-like adhesive or the like in which conductive particles are dispersed. After the input bumps 7a and 7b and the output bumps 8a and 8b are connected to the input pads 2a and 2b and the output pad 3 by the ACF, the driver ICs 6a and 6b are fixed on the glass substrate 1 with an insulating resin. . In addition, the unconnected input pads 2a and 2b are also covered with an insulating resin to prevent a short circuit caused by dust and the like.

  In this way, by arranging the input pads 2a and 2b in two rows, in the two driver ICs 6a and 6b assumed to be used, the distance between the input bumps 7a and 7b and the output bumps 8a and 8b can be changed. Even if the driver ICs 6a and 6b are different from each other, the connection can be made corresponding to each of the driver ICs 6a and 6b. Therefore, one type of glass substrate 1 can correspond to two types of driver ICs 6a and 6b, and it becomes unnecessary to produce a dedicated glass substrate corresponding to each of the driver ICs 6a and 6b, thereby improving productivity. it can.

  The input pads 2a and 2b that are not used for connection in FIGS. 2 and 3 are covered with an insulating resin after the driver ICs 6a and 6b are fixed with the insulating resin. In the case of FIG. Since the driver IC 6b covers the input pad 2a that is not used, the connection pad 2a may not be covered with an insulating resin after the driver IC 6b is fixed. Further, the surface of the input pad 2a may be covered with an insulating resin when the driver IC 6b is fixed with an insulating resin.

  1 to 3, the input pads 2a and 2b are arranged in two rows to correspond to the two types of driver ICs 6a and 6b. However, the input pads 2a and 2b are not limited to two rows, and FIG. As shown, there may be three rows or n rows. 1 to 3, one type of driver IC 6a, 6b corresponds to each row of the input pads 2a, 2b, but the bump positions of the plurality of driver ICs are substantially the same position. In a case where a plurality of driver ICs can correspond to a certain row of input pads 2a and 2b, two or more types of driver ICs may correspond to a certain row of input pads 2a and 2b. .

  By the way, the distance between the input bump and the output bump is different for each driver IC, and the glass substrates corresponding to the output bumps and the input bumps having substantially the same spacing and arrangement have been described. A glass substrate corresponding to the input bumps having different intervals and arrangement for each driver IC will be described with reference to FIG. FIG. 5 shows a glass substrate having an input pad corresponding to a driver IC whose input bump spacing is narrower than other driver ICs (for example, driver ICs 6a and 6b in FIGS. 2 and 3). This is equivalent to 3.

  The glass substrate 1 shown in FIG. 5 includes three rows of input pads 2a, 2b, and 2d as in FIG. 4, but unlike FIG. 4, the input pad 2d of the input pads 2a, 2b, and 2d is aligned. And are aligned with respect to a substantially vertical direction. Therefore, by using this glass substrate 1, not only can the driver ICs have the same input bump spacing and arrangement, but also the driver ICs can have different input bump intervals and arrangement.

  In FIG. 5, the input pads 2a, 2b, and 2d are arranged in three rows, but may be arranged in n rows. In FIG. 5, the input pad 2d farthest from the output pad 3 is shifted with respect to the other input pads 2a and 2b. However, the input pads 2d shifted may be in any column, and n columns. A plurality of middle rows may be shifted. Further, similarly to the output pad 3, the input pads 2a, 2b, and 2d may be alternately arranged.

  Further, FIG. 5 shows the case where the input pads 2d corresponding to the driver ICs having a narrow input bump interval are provided. However, the input pads in a certain column are shifted and arranged so as to correspond to the driver ICs having a wide interval. It doesn't matter.

  The liquid crystal display device according to the embodiment of the present invention has been described above, but the scope of the present invention is not limited to this, and various modifications can be made without departing from the spirit of the invention.

  The present invention is applicable to a liquid crystal display device in which a driver IC is connected to a glass substrate by a flip chip method.

These are the schematic diagrams which showed the part vicinity in which the driver IC is arrange | positioned in the glass substrate of the liquid crystal display device which concerns on embodiment of this invention. These are the schematic diagrams which show the case where driver IC is arrange | positioned on the glass substrate of the liquid crystal display device which concerns on embodiment of this invention. These are the schematic diagrams which show the case where driver IC is arrange | positioned on the glass substrate of the liquid crystal display device which concerns on embodiment of this invention. These are the schematic diagrams which showed the part vicinity in which the driver IC is arrange | positioned in the glass substrate of the liquid crystal display device which concerns on embodiment of this invention. These are the schematic diagrams which showed the part vicinity in which the driver IC is arrange | positioned in the glass substrate of the liquid crystal display device which concerns on embodiment of this invention. FIG. 3 is a block diagram of a liquid crystal display device. These are the schematic diagrams which showed the part vicinity in which the driver IC of the glass substrate of the conventional liquid crystal display device is arrange | positioned.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass substrate 2a-2d Input pad 3 Output pad 4 Input wiring 5 Output wiring 6a, 6b Driver IC
7a, 7b Input bump 8a, 8b Output bump 9 Alignment mark 10 Liquid crystal display device 11 Display unit 12 Source driver 13 Gate driver 14 Source driver IC
15 Gate driver IC
16 Display control IC
17 Glass substrate 18 Driver IC
19 Input wiring 20 Input bump 21 Input pad 22 Output wiring 23 Output bump 24 Output pad

Claims (5)

A glass substrate having a plurality of thin film transistors for controlling the orientation of liquid crystal, a driver IC having a plurality of input bumps and a plurality of output bumps arranged on the glass substrate, and the driver provided on the glass substrate A plurality of output wirings connecting the IC and the thin film transistor; output pads provided on each of the output wirings and connected to the output bumps of the driver IC; and signals provided to the driver IC on the glass substrate. In a liquid crystal display device comprising a plurality of input wirings for inputting the input pads, and input pads provided on each of the input wirings and connected to the input bumps of the driver IC,
The input pads are provided in two on each of the input wirings and are connected in series by the input wirings, and are arranged in two rows aligned in a direction substantially equal to a predetermined direction in which the output pads are aligned, The liquid crystal display device, wherein the input pads are aligned in a direction substantially perpendicular to the predetermined direction in which the output pads are aligned. A glass substrate provided with a plurality of control elements for controlling the orientation of the liquid crystal, a driver IC provided with a plurality of input bumps and a plurality of output bumps while being arranged on the glass substrate, and provided on the glass substrate. A plurality of output wirings connecting the driver IC and the control element, output pads provided on the output wirings and connected to the output bumps of the driver IC, and provided on the glass substrate and the driver ICs In a liquid crystal display device comprising: a plurality of input wirings for inputting signals to the input wirings; and input pads provided on each of the input wirings and connected to the input bumps of the driver IC.
2. A liquid crystal display device according to claim 1, wherein a plurality of the input pads are provided on one input wiring and are connected in series by the input wiring.   The liquid crystal display device according to claim 2, wherein the output pads are aligned in a predetermined direction, and the input pads are arranged in a plurality of rows aligned in a direction substantially equal to the direction.   4. The liquid crystal display device according to claim 3, wherein the input pads are aligned with respect to a direction substantially perpendicular to the predetermined direction in which the output pads are aligned.   The liquid crystal display device according to claim 2, wherein two input pads are provided for each of the input wirings.

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