JP2008186832A - Discharge device and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a discharge device improved in treatment efficiency without limiting a treatable object to be treated, and also to provide a method for manufacturing the discharge device. <P>SOLUTION: Electrodes 2, 3 are arranged on the surface of a dielectric 1 on a side opposite to a discharge side so as to discharge electricity between the dipole electrodes 2, 3 arranged in the dielectric 1 by the capacitative coupling of the dielectric 1. The electrodes 2, 3 are both arranged on the surface of the dielectric 1 on a side opposite to the discharge side, thus discharging electricity from the electrodes 2, 3 to the side of the dielectric 1 without discharging electricity by allowing the electrodes to oppose each other as before, and hence dispensing with the arrangement of a workpiece between the mutually opposing electrodes as before and preventing the treatable workpiece W from being limited. Also, since no workpiece needs to be arranged between mutually opposing electrodes as before, the workpiece W is brought closer to the dielectric 1 where both the electrodes 2, 3 are arranged, thus improving treatment efficiency. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a discharge device that discharges between two electrodes and a method of manufacturing the same.

Conventionally, as a discharge device, for example, there are a plasma generator that generates plasma by plasma discharge, an ozone generator that generates ozone (O ₃ ) by discharge in oxygen, and the like. In addition, examples of the predetermined process using discharge include a plasma process using plasma generated by plasma discharge and an ozone process using ozone generated by discharge in oxygen. A plasma process using plasma discharge will be described as an example.

  As plasma processing, for example, plasma etching (etching a workpiece to be processed) in the plasma and etching the workpiece, or plasma CVD (Chemical Vapor Deposition) for depositing the material to be vaporized by depositing it on the workpiece and depositing it on the workpiece In addition, there is plasma cleaning for cleaning the workpiece in order to improve the wettability of the workpiece.

  As shown in FIG. 11, the plasma processing apparatus evacuates the inside of the chamber C or depressurizes a rare gas such as argon (Ar) or helium (He) and puts it in the chamber C. A device that generates plasma PM by discharge is common. When plasma processing is performed, the workpiece W is placed in the chamber C and the workpiece W is processed.

  In such an apparatus as shown in FIG. 11, a power source applied to the electrode E requires a high frequency power source such as a microwave represented by 2.45 GHz or a 13.56 MHz RF (Radio Frequency) wave. In the case of microwaves, a waveguide is required, and in the case of RF waves, a matching circuit is required. Therefore, the cost is high and the apparatus becomes an overweight.

  Therefore, as shown in FIG. 12, an apparatus in which a dielectric barrier D is disposed between two electrodes E facing each other has been proposed (see, for example, Patent Documents 1 to 7). By disposing the dielectric barrier D, the dielectric barrier D is capacitively coupled and can be discharged between the two electrodes E.

When plasma processing is performed, the workpiece W is placed between the dielectric barriers D as shown in FIG. 12A, or the workpiece W is processed, or a rare gas or nitrogen gas as shown in FIG. 12B. GAS is introduced and plasma PM is injected from the side opposite to the inflow side to act on the workpiece W. The apparatus as shown in FIG. 12 does not require the high frequency power supply as shown in FIG. 11 and may be an AC power supply of about 1 kHz to 100 kHz. In addition, plasma discharge can be performed under atmospheric pressure.
JP-A-2006-12039 (page 1-8, FIG. 1-4) Japanese Patent Laying-Open No. 2006-092913 (page 1-9, FIG. 1) Japanese Patent Laying-Open No. 2005-093344 (page 1-10, FIG. 1-6) Japanese Patent Laying-Open No. 2004-31256 (page 1-9, FIG. 1-5) JP 2004-103251 A (pages 1 and 3-7, FIG. 1) JP 2003-347099 A (page 1-5, FIGS. 1 and 2) JP 2003-024771 A

  However, since the distance between the electrodes is about 5 mm at the maximum, if the distance between the electrodes exceeds 5 mm, the plasma treatment cannot be performed. Therefore, in the apparatus as shown in FIG. 12A, it is impossible to process the workpiece W having a thickness larger than the distance between the electrodes E, which is about 5 mm at the maximum, and the workpieces that can be processed are limited. . In the case of the apparatus as shown in FIG. 12B, the plasma treatment can be performed regardless of the thickness of the workpiece W, but the treatment can be performed only at the point, and the processing efficiency compared with FIG. 12A. Becomes lower. In the case of nitrogen gas, since the working distance from the plasma PM injection port to the workpiece W is about 5 mm, it cannot be processed efficiently.

  This invention is made in view of such a situation, Comprising: The dischargeable device which can improve processing efficiency, and the method of manufacturing it are provided, without the to-be-processed to-be-processed object being restrict | limited. For the purpose.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention described in claim 1 is a discharge device that discharges between two electrodes disposed on the dielectric by capacitive coupling of the dielectric, and is a surface of the dielectric opposite to the discharge side. The two electrodes are arranged together.

  [Operation / Effect] According to the first aspect of the present invention, in order to cause discharge between the two electrodes disposed on the dielectric by capacitive coupling of the dielectric, the dielectric on the side opposite to the discharge side The above-described two electrodes are arranged on the surface. Since the two electrodes are disposed on the surface of the dielectric opposite to the discharge side, the electrodes are discharged from the two electrodes to the dielectric without being discharged with the electrodes facing each other as in the prior art. Therefore, it is not necessary to place an object to be processed between the electrodes facing each other as in the prior art, and the objects to be processed are not limited. In addition, since it is not necessary to place an object to be processed between electrodes opposed to each other as in the prior art, the object to be processed can be brought close to a dielectric provided with both electrodes, and the processing efficiency can be improved.

  The invention according to claim 7 is a method of manufacturing a discharge device that discharges between two electrodes disposed on the dielectric by capacitive coupling of the dielectric, the discharge device being opposite to the discharge side. The discharge device is manufactured by disposing the two electrodes together on the surface of the dielectric.

  [Operation / Effect] According to the invention described in claim 7, since the discharge electrode is manufactured by disposing the two electrodes on the surface of the dielectric opposite to the discharge side, It is possible to realize a discharge device that discharges from a bipolar electrode to the dielectric side without causing the electrodes to face each other. As a result, it is possible to realize a discharge device that can improve the processing efficiency without restricting the objects that can be processed.

  In these inventions described above, it is preferable to cover at least one of the bipolar electrodes with an insulator (the invention according to claim 2). Specifically, it is preferable to manufacture a discharge device by laminating on a dielectric provided with a bipolar electrode so that at least one of the bipolar electrodes is covered with an insulator (claim 8). Invention). By covering at least one of the two electrodes with an insulator, an insulator is interposed between the two electrodes, and discharge is performed on the surface opposite to the discharge side of the dielectric (that is, the electrode side). Can be prevented.

  An example of covering at least one of the two electrodes with an insulator is to mold-seal at least one of the two electrodes (the invention according to claim 3). Specifically, a liquid mold is sealed and solidified on a dielectric provided with a bipolar electrode, so that at least one of the bipolar electrodes is sealed with a mold material on the dielectric. The discharge device is manufactured by laminating insulators made of the above (invention according to claim 9). Of course, an example in which at least one of the two electrodes is covered with an insulator is not limited to the inventions described in claims 3 and 9. Conductive particles are embedded in sintered products (such as carbon silicon and silicon nitride) that are sintered from inorganic materials such as ceramics, glass, and cement, and the conductive particles serve as electrodes and insulate the sintered products. You may comprise as a body.

  In these inventions described above, discharge may be performed in a vacuum or may be discharged through a gas. When discharging through gas, the gas is passed from the opposite side of the dielectric to the discharge side (invention according to claim 4). Specifically, a through-hole through which a gas passes is provided in a dielectric, and a bipolar electrode is disposed on the surface of the dielectric opposite to the discharge side to manufacture a discharge device (claim 10). invention). Examples of the gas include a rare gas typified by argon (Ar) and helium (He), nitrogen gas, and air.

  When the through hole is provided in the dielectric, it can be manufactured by using a molding material as in the above-described invention according to claim 9. That is, a partition is formed on the dielectric according to the above-described through hole, and a liquid mold is sealed along the partition and solidified on the dielectric provided with the two-pole electrode. It is possible to manufacture a discharge device by molding and sealing at least one of the electrodes and laminating an insulator made of a molding material on the dielectric at a place other than the through hole. invention).

  The discharge may be a plasma discharge and may be a type in which plasma is generated by plasma discharge (the invention according to claim 5), or the discharge is a discharge in oxygen and ozone is generated by a discharge in oxygen. (Invention of Claim 6). Therefore, in the case of the former type, the discharge device can be applied to a plasma generation device that generates plasma by plasma discharge, or a plasma processing device that performs plasma processing using plasma generated by plasma discharge. In the case of the latter type, the discharge device can be applied to an ozone generator that generates ozone by discharge in oxygen or an ozone treatment device that performs ozone treatment using ozone generated by discharge in oxygen. .

  According to the discharge device and the method of manufacturing the same according to the present invention, in order to discharge between the two electrodes disposed on the dielectric by capacitive coupling of the dielectric, the dielectric on the side opposite to the discharge side Since the above-described two electrodes are disposed on the surface, the electrodes are discharged from the two electrodes to the dielectric side without causing the electrodes to discharge each other as in the conventional case. Therefore, the processing object which can be processed is not limited, and the processing efficiency can be improved.

Embodiments of the present invention will be described below with reference to the drawings.
1 is a schematic plan view of a plasma processing apparatus according to an embodiment, FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, and FIG. 3 uses the plasma processing apparatus according to the embodiment. It is a schematic sectional drawing which shows the one aspect | mode of a plasma processing. In the present embodiment, the plasma processing using plasma generated by plasma discharge will be described as an example of the predetermined processing using discharge, and a plasma processing apparatus that performs the plasma processing will be described as an example of the discharge device. To explain. Moreover, in FIG. 1, illustration of the mold material is omitted.

  In this embodiment, the plasma processing apparatus includes a dielectric 1 as shown in the cross-sectional view of FIG. 2, and both electrodes 2 and 3 are disposed on the surface of the dielectric 1 opposite to the discharge side. It is arranged. In this embodiment, the dielectric 1 is an alumina (aluminum oxide) substrate, or a sintered product (for example, carbon silicon or silicon nitride) that is sintered using an inorganic material as a representative material, such as ceramics, glass, and cement. It is formed with the formed substrate. The electrodes 2 and 3 are formed of a conductor plated with silver (Ag) or platinum (Pt). The dielectric 1 corresponds to the dielectric in the present invention, and the electrodes 2 and 3 correspond to the bipolar electrodes in the present invention.

  In the present embodiment, the molding material 4 is laminated on the dielectric 1 provided with the electrodes 2 and 3 so that both the electrodes 2 and 3 are covered with an insulator. In this embodiment, the molding material 4 is made of a silicone rubber or resin, and is preferably made of a withstand voltage material of 10 kV / mm or more (˜20 kV / mm). The mold material 4 corresponds to the insulator in the present invention and also corresponds to the mold material in the present invention.

  In this embodiment, as shown in the plan view of FIG. 1 and the cross-sectional view of FIG. 2, the through holes 5 are provided in the dielectric 1 at locations other than the electrodes 2 and 3. The through-hole 5 is a hole for allowing gas (“GAS” in FIGS. 2 and 3) to pass from the opposite side of the dielectric 1 to the discharge side (that is, the electrodes 2 and 3 side) to the discharge side. As shown in FIG. 2, the through hole 5 penetrates not only the dielectric 1 but also the mold material 4 laminated thereon. As the gas passing through the through hole 5 from the opposite side of the dielectric 1 to the discharge side (that is, the electrodes 2 and 3 side), the rare gas typified by argon (Ar) or helium (He) is used. Nitrogen gas or air. The gas may be at atmospheric pressure or depressurized. Even the atmospheric pressure of air is 2.74 kV / mm. Due to the difference in withstand voltage, glow discharge starts and plasma is generated. In a reduced pressure environment or when a rare gas is used, the withstand voltage is lower than the above-mentioned 2.74 kV / mm, so that it is easier to discharge and plasma can be generated easily. The through hole 5 corresponds to the through hole in the present invention.

  As shown in FIGS. 1 and 2, the electrodes 2 and 3 are electrically connected to an AC power source 6 having a voltage amplitude of about 15 kV at 1 kHz to 100 kHz. When the two electrodes 2 and 3 are paired, in this embodiment, as shown in FIG. 1, a plurality of pairs of electrodes are provided so that each electrode 2 and 3 is disposed over the entire surface of the dielectric 1 substrate. 2 and 3 are provided. Each electrode 2 is electrically connected to the electrode 7, and the electrode 7 is electrically connected to the AC power source 6, whereby the electrode 2 is electrically connected to the AC power source 6 through the electrode 7. In addition, each electrode 3 is electrically connected to the electrode 8, and the electrode 8 is electrically connected to the AC power source 6, whereby the electrode 3 is electrically connected to the AC power source 6 through the electrode 8. Yes. The AC power source 6 may be a pulse wave power source that outputs a pulse wave as shown in FIG. 4 or a sine wave power source that outputs a sine wave (sine wave) as shown in FIG. Good.

  In such a plasma processing apparatus, as shown in FIG. 3, the workpiece (work) W is brought close to the discharge side of the dielectric 1 and discharged in a state where gas is passed through the discharge side. Specifically, gas is passed from the opposite side of the dielectric 1 to the discharge side through the through hole 5. At this time, since the workpiece W is close to the discharge side of the dielectric 1, a gas space, that is, a so-called “air curtain” is formed between the dielectric 1 and the workpiece W. A voltage is applied from the AC power source 6 to each of the electrodes 2 and 3 in the state of the air curtain. Plasma discharge occurs when a voltage is applied to each of the electrodes 2 and 3, and plasma PM is generated by the plasma discharge. Then, plasma processing is performed on the workpiece W.

  The plasma treatment is not particularly limited. For example, plasma CVD (Chemical Vapor Deposition) can be applied to plasma etching in which a workpiece W is placed in plasma PM and etching is performed on the workpiece W, and a material to be deposited is converted into plasma and deposited on the workpiece W. The present invention can also be applied to plasma cleaning for cleaning the workpiece W in order to improve the wettability of the workpiece W. In addition, the present invention may be applied to plasma ashing in which an unnecessary film such as a resist is removed by ashing with plasma PM.

  Next, a specific manufacturing method of the plasma processing apparatus according to the present embodiment will be described with reference to FIG. FIG. 6 is a schematic cross-sectional view of the manufacturing process of the plasma processing apparatus according to the embodiment.

  The electrodes 2 and 3 as shown in FIG. 1 are pattern-formed on the dielectric 1 formed of the above-described alumina substrate or carbon silicon or silicon nitride substrate by a photolithography technique, a print coating technique, or the like. Then, as shown in FIG. 6A, a through hole 5 through which gas passes is provided in the dielectric 1 at a place other than the electrodes 2 and 3. Note that the through hole 5 may be provided in the dielectric 1 first, and then the electrodes 2 and 3 may be patterned.

  As shown in FIG. 6B, the partition 11 is provided at both ends of the substrate, and the hollow cylindrical partition 12 is provided on the dielectric 1 in accordance with the through hole 5. Alternatively, the partitions 11 and 12 may be provided first, and then the electrodes 2 and 3 may be patterned to provide the through holes 5 in the dielectric 1. A liquid silicone rubber or resin is sealed on the dielectric 1 along the partitions 11 and 12 and solidified. By solidifying in this way, as shown in FIG. 6C, the two electrodes 2 and 3 are both molded and sealed, and the mold material 4 is formed on the dielectric 1 at a place other than the through hole 5. Laminate insulators. Of the partitions 11 and 12, the partition 12 corresponds to the partition in the present invention.

  After solidification, as shown in FIG. 6D, the plasma processing apparatus according to the present embodiment is manufactured by removing the partitions 11 and 12. Note that the partition plates 11 and 12 are not necessarily removed, and the partition plates 11 and 12 may be a part of the plasma processing apparatus.

  According to the plasma processing apparatus according to the present embodiment having the above-described configuration, in order to discharge between the two electrodes 2 and 3 disposed on the dielectric 1 by capacitive coupling of the dielectric 1, Is formed by disposing the above-described two-electrodes 2 and 3 on the surface of the dielectric 1 on the opposite side. Since the two electrodes 2 and 3 are disposed on the surface of the dielectric 1 opposite to the discharge side, as shown in FIGS. 2 and 3, the electrodes are opposed to each other and are not discharged as in the prior art. In addition, discharge from the bipolar electrodes 2 and 3 toward the dielectric 1 is performed. Therefore, it is not necessary to place a work between the electrodes facing each other as in the conventional case, and the work W that can be processed is not limited. Further, since it is not necessary to place a workpiece between the electrodes facing each other as in the prior art, the workpiece W can be brought close to the dielectric 1 provided with the two electrodes 2 and 3, and the processing efficiency can be improved. .

  Further, the dielectric 1 has a planar shape, and the plasma PM can be generated over a wide range. Therefore, plasma processing can be performed over a wide range without being able to perform processing only at a point with the conventional apparatus as shown in FIG. 12B, and the processing efficiency can be improved. Further, since there is no need for the opposed electrodes and dielectrics as in the prior art, there is an effect that only one dielectric 1 is required as in the embodiment.

  In this embodiment, the two electrodes 2 and 3 are both covered with an insulator. Specifically, the molding material 4 is laminated on the dielectric 1 provided with the electrodes 2 and 3 so as to cover both the electrodes 2 and 3. Thus, by covering the two electrodes 2 and 3 with an insulator, as shown in FIGS. 2 and 3, the insulator is interposed between the electrodes 2 and 3. It is possible to prevent discharge to the side opposite to the side (that is, the electrodes 2 and 3 side).

  In this embodiment, the electrodes 2 and 3 are molded and sealed to cover them with an insulator. Specifically, a liquid mold (silicone rubber or resin in the present embodiment) is sealed in the dielectric 1 in which the electrodes 2 and 3 are disposed and solidified to mold-seal the electrodes 2 and 3. Then, an insulator made of the molding material 4 is laminated on the dielectric 1.

  In particular, in this embodiment, in order to discharge through the gas, the gas is passed from the opposite side of the dielectric 1 to the discharge side. Specifically, a through-hole 5 through which gas passes is provided in the dielectric 1, and the electrodes 2 and 3 are disposed on the surface of the dielectric 1 opposite to the discharge side. In order to penetrate not only the dielectric 1 but also the molding material 4 through the through hole 5, a hollow cylindrical partition 12 is provided on the dielectric 1 in accordance with the through hole 5, and the electrodes 2 and 3 are provided. A liquid mold (silicone rubber or resin in this embodiment) is sealed along the above-described partition 12 and solidified on the disposed dielectric 1 to mold-seal the electrodes 2 and 3. The insulator made of the molding material 4 is laminated on the dielectric 1 at a place other than the through hole 5.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In the above-described embodiments, the plasma processing apparatus has been described as an example of the discharge apparatus. However, the present invention can also be applied to a plasma generation apparatus that generates plasma without placing a workpiece.

(2) In the above-described embodiments, the discharge device is a type that generates plasma by plasma discharge, but may be a type that generates ozone (O ₃ ) by discharge in oxygen. Therefore, the discharge device can be applied to an ozone generator (ozone generating reactor) that generates ozone by discharge in oxygen, or an ozone treatment device that performs ozone treatment using ozone generated by discharge in oxygen. . For example, as shown in FIG. 7, the dielectric 1 in which the electrodes 2 and 3 are disposed on the tank 21 in which pure water is stored is mounted and oxygen (O ₂ ) is passed through the through hole 5. The ozone water may be generated by discharging the gas and react with the pure water stored in the tank 21 to purify the ozone water. In addition, any ozone treatment that is normally used can be applied to deodorization, sterilization, bleaching, oxidation, and the like. In addition to the plasma discharge and the discharge in oxygen, the present invention can be applied to an apparatus that performs a predetermined treatment using discharge.

  (3) In the above-described embodiment, the electrodes 2 and 3 are covered with an insulator in order to prevent discharge on the side opposite to the discharge side of the dielectric 1 (that is, the electrodes 2 and 3 side). It is not necessary to cover 2 and 3 with an insulator. If the discharge on the electrodes 2 and 3 side of the dielectric 1 is small, the electrodes 2 and 3 may not be covered with an insulator. However, it is more preferable to cover the electrodes 2 and 3 with an insulator as in the embodiment.

  (4) In the above-described embodiment, the bipolar electrodes 2 and 3 are both covered with an insulator. However, if at least one of the bipolar electrodes 2 and 3 is covered with an insulator, the electrodes 2 and 3 It is not necessary to cover either one with an insulator. That is, as shown in FIG. 8, even if either one of the electrodes 2 and 3 is not covered with the insulator (mold material 4 in FIG. 8), the insulator is interposed between the electrodes 2 and 3. Therefore, similarly to the embodiment, it is possible to prevent the dielectric 1 from being discharged to the electrodes 2 and 3 side.

  (5) In the embodiment described above, the electrodes 2 and 3 are mold-sealed to cover them with an insulator, but the present invention is not limited to this. For example, as shown in FIG. 9, conductive particles 32 are embedded in a sintered product (for example, carbon silicon or silicon nitride) 31 that is sintered using an inorganic substance as a raw material, represented by ceramics, glass, cement, and the like. You may comprise the particle | grains 32 as the electrodes 2 and 3, and the sintered compact 31 as an insulator. Electric discharge occurs on the thin side of the sintered product 31 when viewed from the conductive particles 32, and discharge is difficult on the thick side of the sintered product 31. Further, the thin side of the sintered product 31 also functions as the dielectric 1 in the embodiment. Therefore, in the case of FIG. 9, the sintered product 31 and the conductive particles 32 are configured so that plasma or ozone is generated on the lower side of the drawing. Moreover, as shown in FIG. 10, the sintered product 31 shown in FIG.

  (6) In the above-described embodiment, the gas is discharged through the gas, but the discharge may be performed in a vacuum. In that case, the above-described through hole is not necessarily required.

It is a schematic plan view of the plasma processing apparatus which concerns on an Example. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. It is a schematic sectional drawing which shows the one aspect | mode of the plasma processing using the plasma processing apparatus which concerns on an Example. It is the schematic regarding the output of a pulse wave. It is the schematic regarding the output of a sine wave (sine wave). (A)-(d) is a schematic sectional drawing of the manufacturing process of the plasma processing apparatus which concerns on an Example. It is the schematic of the discharge device (ozone processing apparatus) which concerns on a modification. It is a schematic sectional drawing of the insulator (mold material) which concerns on a modification. It is a schematic sectional drawing of the insulator (sintered material) which concerns on a modification. It is a schematic sectional drawing which combined the insulator (sintered material) and dielectric material which concern on the further modification. It is the schematic of the conventional plasma processing apparatus. (A) and (b) are the schematic of the conventional plasma processing apparatus different from FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Dielectric 2,3 ... Electrode 4 ... Mold material 5 ... Through-hole 12 ... Partition PM ... Plasma

Claims (11)

  A discharge device that discharges between two electrodes disposed on the dielectric by capacitive coupling of the dielectric, wherein the two electrodes are disposed on a surface of the dielectric opposite to the discharge side. A discharge device characterized by that.   2. The discharge device according to claim 1, wherein at least one of the two electrodes is covered with an insulator.   3. The discharge device according to claim 2, wherein the insulator is a mold material and seals at least one of the two electrodes.   4. The discharge device according to claim 1, wherein gas is passed from the opposite side of the dielectric to the discharge side. 5.   The discharge device according to any one of claims 1 to 4, wherein the discharge is a plasma discharge, and plasma is generated by the plasma discharge.   The discharge device according to any one of claims 1 to 4, wherein the discharge is a discharge in oxygen, and ozone is generated by the discharge in oxygen.   A method of manufacturing a discharge device that discharges between two electrodes disposed on a dielectric by capacitive coupling of the dielectric, wherein the two electrodes are disposed on the surface of the dielectric opposite to the discharge side. A method of manufacturing a discharge device, characterized in that the discharge device is manufactured by being disposed together.   8. The method of manufacturing a discharge device according to claim 7, wherein a discharge device is manufactured by laminating on the dielectric provided with two electrodes so that at least one of the two electrodes is covered with an insulator. A method for manufacturing a discharge device.   The method for manufacturing a discharge device according to claim 8, wherein the insulator is a molding material, and a liquid mold is sealed on the dielectric on which the electrodes of the two electrodes are disposed and solidified. A method for manufacturing a discharge device, wherein a discharge device is manufactured by molding and sealing at least one of two electrodes and laminating an insulator made of a molding material on a dielectric.   10. The method of manufacturing a discharge device according to claim 7, wherein a through-hole through which a gas passes is provided in the dielectric, and the bipolar electrode is provided on the surface of the dielectric opposite to the discharge side. A method of manufacturing a discharge device, characterized in that the discharge device is manufactured by being disposed together.   11. The method of manufacturing a discharge device according to claim 10, wherein a partition is provided on the dielectric body in accordance with the through hole, and a liquid mold is provided along the partition on the dielectric body on which the two-pole electrodes are disposed. Sealing and solidifying at least one of the bipolar electrodes, and stacking an insulator made of a molding material on the dielectric at a place other than the through-hole to manufacture a discharge device A method for manufacturing a discharge device characterized by the above.

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