JP2008176626A - Non-contact data carrier and wiring board for non-contact data carrier - Google Patents

Non-contact data carrier and wiring board for non-contact data carrier Download PDF

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Publication number
JP2008176626A
JP2008176626A JP2007010326A JP2007010326A JP2008176626A JP 2008176626 A JP2008176626 A JP 2008176626A JP 2007010326 A JP2007010326 A JP 2007010326A JP 2007010326 A JP2007010326 A JP 2007010326A JP 2008176626 A JP2008176626 A JP 2008176626A
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layers
ic chip
wiring
antenna pattern
spiral antenna
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JP2007010326A
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JP5087932B2 (en
Inventor
Noboru Araki
Takuya Higuchi
Yasuhiko Katsuhara
Shinichi Okada
Yuji Yamaguchi
康彦 勝原
雄二 山口
晋一 岡田
樋口  拓也
荒木  登
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Dainippon Printing Co Ltd
大日本印刷株式会社
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce the size and thickness of a non-contact data carrier reading data held therein without contact and a wiring board for the non-contact data carrier configuring the non-contact data carrier. <P>SOLUTION: The non-contact data carrier includes an IC chip storing data therein and having two terminals connectable to an antenna and the wiring board having the IC chip mounted therein. The wiring board has n or more wiring layers (n is an even number equal to or larger than 4), and a spiral antenna pattern is formed in each of n or more wiring layers, and vertical-direction conductors are disposed in connection to an inner peripheral end and an outer peripheral end of each spiral antenna pattern, and two terminals of the IC chip are connected to inner peripheral ends of spiral antenna patterns formed on both outermost layers out of the n or more wiring layers through the vertical-direction conductors. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a non-contact data carrier that can read stored data in a non-contact manner and a wiring board for a non-contact data carrier that is a component thereof, and in particular, a non-contact data carrier and a non-contact data carrier that are suitable for further downsizing and thinning. The present invention relates to a wiring board for a contact data carrier.

  In recent years, contactless data carriers using IC chips (also referred to as IC tags, wireless tags, RFIDs, etc.) have been used as carriers for tag information of articles. The main components of the non-contact data carrier are an IC chip that holds data and an antenna connected to the IC chip. In some antennas, an antenna pattern is formed on a wiring board on which an IC chip is mounted (see, for example, Patent Document 1 below). As described in the document, when a wiring board is used, an antenna pattern can be provided in a plurality of wiring layers, and these can be connected in series with vias (a kind of longitudinal conductor) to constitute an antenna.

Non-contact data carriers are often required to be smaller and thinner due to their properties in use. Although the disclosure of this document is considered to show the miniaturization due to the structure in which the antenna is patterned into a plurality of wiring layers, no further miniaturization or thinning is disclosed.
Japanese Unexamined Patent Publication No. 2004-206736 (FIGS. 6, 7, 8, and 9)

  The present invention relates to a non-contact data carrier capable of reading stored data in a non-contact manner and a non-contact data carrier wiring board which is a component of the non-contact data carrier and a non-contact data carrier capable of realizing a further reduction in size and thickness. It aims at providing the wiring board for data carriers.

  In order to solve the above problems, a non-contact data carrier which is one embodiment of the present invention includes an IC chip capable of storing data and having two terminals connectable to an antenna, and the IC chip incorporated therein A wiring board, wherein the wiring board has n (n is an even number of 4 or more) wiring layers, a spiral antenna pattern is formed in each of the n or more wiring layers, and the spiral shape A vertical conductor is connected to each of the inner and outer peripheral ends of each antenna pattern, and the two terminals of the IC chip are respectively connected to both outermost layers of the n or more wiring layers. It is characterized by being connected to the inner peripheral end of each of the spiral antenna patterns formed via the longitudinal conductors.

  This non-contact data carrier uses a wiring board provided with a spiral antenna pattern in a multilayer structure, and an IC chip for retaining data is built in and mounted on the wiring board. The planar size is reduced by the multi-layered antenna pattern, and further, the dimension in the thickness direction is reduced by incorporating the IC chip in the wiring board. When the IC chip is built-in, the two terminals for antenna connection are respectively connected to the inner peripheral ends of the spiral antenna patterns on both outermost layers. By adopting such a configuration, it is possible to easily obtain a series connection arrangement that follows a multi-layered spiral antenna pattern from one end of the IC chip to the other end without pattern complication. That is, it is possible to form an antenna pattern and dispose an IC chip without waste of position space.

  Note that n is an even number because a pattern is drawn from the inner periphery to the outer periphery (or from the outer periphery to the inner periphery) in one spiral antenna pattern. This is because a match can be seen in the position. The reason why n is 2 is not included in the case of so-called double-sided wiring boards in which n = 2, because it is practically difficult to secure a space for incorporating an IC chip. The point that n is an even number excluding 2 is the same in the following embodiments.

  According to another aspect of the present invention, a non-contact data carrier includes an IC chip having two terminals that can store data and can be connected to an antenna, and a wiring board in which the IC chip is built-in. The wiring board has n or more (n is an even number of 4 or more) wiring layers, and a spiral antenna pattern is formed in each of the n or more wiring layers. A vertical conductor is connected to each of the inner and outer peripheral ends of each of the spiral antenna patterns except for the inner peripheral end of any one of the inner layers of the spiral antenna pattern. One of the terminals is connected to the inner peripheral end of the one spiral antenna pattern, and the other of the two terminals of the IC chip is connected to the one spiral antenna pattern. Characterized in that it is connected to the inner end of the spiral antenna pattern formed on one wiring layer through the longitudinal conductor fit Ri.

  This non-contact data carrier also uses a wiring board provided with a spiral antenna pattern in a multilayer structure, and an IC chip for holding data is built in and mounted on the wiring board. The planar size is reduced by the multi-layered antenna pattern, and further, the dimension in the thickness direction is reduced by incorporating the IC chip in the wiring board. When the IC chip is built-in, one terminal for antenna connection is connected to the inner peripheral end of the spiral antenna pattern in one of the inner layers, and the other terminal is the inner periphery of the spiral antenna pattern adjacent to the inner one. It is configured to be connected to the end via a vertical conductor. Also by adopting such a configuration, a series connection arrangement that follows a multi-layered spiral antenna pattern from one end to the other end of the IC chip can be easily obtained without pattern complication. That is, it is possible to form an antenna pattern and dispose an IC chip without waste of position space.

  In addition, a non-contact data carrier wiring board according to another aspect of the present invention includes n (n is an even number of 4 or more) wiring layers each having a spiral antenna pattern, and the n or more wiring layers. An insulating layer that separates each of the spiral antenna patterns from each other, and a vertical conductor that is connected to each of the inner and outer peripheral ends of each of the spiral antenna patterns and is arranged in the vertical direction on the insulating layer. The n-layer or more wiring layers, except for the outermost two layers, are partially missing so as to expose a part of the pattern to the outside, and the part pattern exposed to the outside has an IC Two lands for mounting the chip are formed, and the two lands are respectively disposed in front of the inner peripheral edge of each of the spiral antenna patterns of both outermost layers of the n or more wiring layers. It is connected via the vertical conductors and wherein the are.

  This wiring board is an example of a part for constituting the non-contact data carrier as one aspect described above. A so-called cavity is provided to secure a space for mounting an IC without increasing the thickness direction.

  In addition, a non-contact data carrier wiring board according to another aspect of the present invention includes n (n is an even number of 4 or more) wiring layers each having a spiral antenna pattern, and the n or more wiring layers. Each of the spiral antenna patterns except for an insulating layer that separates each other, and an inner peripheral end of one spiral antenna pattern formed on one of the wiring layers on the innermost side from the outermost of the n or more wiring layers A longitudinal conductor connected to each of the inner peripheral end and the outer peripheral end of the wiring layer and disposed in the insulating layer in a vertical direction, wherein the insulating layer includes the one spiral antenna pattern. A part of the pattern is missing so as to expose a part of the pattern to the outside, and two lands for mounting an IC chip are formed on the part of the pattern exposed to the outside. Is connected to the inner peripheral end of the spiral antenna pattern formed in the outermost wiring layer adjacent to the one spiral antenna pattern via the longitudinal conductor, and the other of the two lands Is connected to the inner peripheral end of the one spiral antenna pattern.

  This wiring board is an example of a component for constituting the non-contact data carrier according to another aspect described above. In order to secure a space for mounting an IC without increasing the thickness direction, a so-called cavity is provided.

  According to the present invention, a non-contact data carrier that can read stored data in a non-contact manner and a non-contact data carrier wiring board that is a component of the non-contact data carrier can be further reduced in size and thickness.

  As an embodiment of the present invention, at least one of the spiral antenna patterns may be formed so as to include a planar overlap with the IC chip. This can be applied to a spiral antenna pattern at a position that does not interfere with the space with respect to an IC chip mounted therein. If the IC chip has a pattern including a planar overlap, the number of turns increases, so that the inductance can be increased and the communication performance can be improved.

  Further, as an embodiment, it may further include a capacitor or an inductor built in and mounted on the wiring board. Since this non-contact data carrier is mounted with an IC chip built-in, a capacitor and an inductor are similarly built-in mounted. By electrically connecting the capacitor and the inductor to the antenna pattern, the characteristics as an antenna can be improved as necessary without increasing the thickness as a non-contact data carrier.

  Further, as an embodiment, the wiring board includes a plurality of insulating layers separating the wiring layers, and at least one of the insulating layers includes a first member that contacts the IC chip, and the IC chip. It is good also as having a 2nd member located far away via the said 1st member. For example, the IC member mounting space is secured in the opening (missing portion, cavity) of the second member, and the IC member is sealed after the IC chip is mounted. It is a buried aspect.

  In another embodiment of the non-contact data carrier, the spiral antenna pattern formed on one wiring layer adjacent to any one of the spiral antenna patterns is the most of the wiring layers. It may be formed on one of the outer wiring layers. In this aspect, the connection between the terminal of the IC chip and the inner peripheral end of the spiral antenna pattern is made in the outermost wiring layer and the innermost wiring layer.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram for schematically explaining an antenna configuration in a non-contact data carrier as one embodiment of the present invention. More specifically, FIG. 1A is a plan view schematically showing an example of a spiral antenna pattern 1 formed in one wiring layer. FIG. 6B is a front view schematically showing the positional relationship between the spiral antenna patterns 1, 2,..., N configured in multiple layers and the data holding IC chip 101, and FIG. FIG. 6B is a diagram schematically showing (b), and showing a positional relationship between a multilayer (in this case, six layers) spiral antenna pattern and a data holding IC chip. These drawings are for showing the arrangement relationship, and specific dimensions and materials will be described in the embodiments shown in FIG. 5 and subsequent figures.

  As shown in FIG. 1A, the antenna pattern 1 formed on one wiring layer has a spiral shape extending from the outer peripheral end 1o to the inner peripheral end 1i (in some aspects, from the inner peripheral end 1i to the outer peripheral end 1o). Have Longitudinal conductors formed in the penetration direction of the insulating layer are connected to the outer peripheral end 1o and the inner peripheral end 1i, respectively, so that electrical conduction (interlayer connection) to another wiring layer is possible. is there. As the vertical conductor, a blind via type will be described as an example, but a through-hole type penetrating through all or a part of the insulating layer may be used.

  As shown in FIG. 1B, the antenna patterns 2,..., N of each layer including the first layer antenna pattern 1 are stacked and superimposed. The outer peripheral edge 1o of the first layer antenna pattern 1 is connected to the outer peripheral edge 2o of the second layer antenna pattern 2 by a one-layer / two-layer vertical conductor 12 provided so as to penetrate the first insulating layer 10. Then, the second-layer antenna pattern 2 is traced from the outer periphery to the inner periphery, and the inner-periphery end 2i is formed by the two-layer / three-layer vertical conductor 23 provided so as to penetrate through the second insulating layer 20 to form the third-layer antenna pattern. 3 is connected to the inner peripheral end 3i. Further, the third-layer antenna pattern 3 is traced from the inner periphery to the outer periphery, and the outer peripheral end 3o is formed by the third-layer / four-layer vertical conductor 34 provided so as to penetrate the third-layer insulating layer 30. 4 is connected to the outer peripheral end 4o.

  Similarly, the antenna pattern is traced from the outer periphery to the inner periphery (or from the outer periphery to the inner periphery) up to the n-th layer antenna pattern n, and electrical conduction is made to the adjacent layer with a longitudinal conductor at the ends thereof. Thus, one antenna is configured in series. Each antenna pattern 1, 2,..., N (where n is an even number) is formed in a direction in which the directions of the spirals that follow in series all coincide in a plane. This is to align the direction of the induced electromotive force.

  Here, since n is an even number, the inner peripheral end 1i of the outermost antenna pattern 1 and the inner peripheral end ni of the outermost antenna pattern n are the antenna patterns formed in the other layers. Instead, the IC chip 101 is electrically connected via the conductive paths 102 and 103 instead. That is, a series connection arrangement that follows the multilayer spiral antenna patterns 1, 2,..., N from one end to the other end of the IC chip 101 is obtained without any pattern complications. In the IC chip 101, it is possible to secure an easy position for incorporation by using a dead space (approximately the center in plan) of the spiral antenna pattern. Thereby, planar miniaturization is realized by the multi-layer antenna patterns 1, 2,..., N, and further thinning is realized by incorporating the IC chip 101 therein.

  FIG. 1C schematically shows the connection and arrangement relationship between the antenna pattern (including the vertical conductor) and the IC chip shown in FIG. 1B, where n = 6. The series configuration of antenna patterns can be traced in the direction of the arrow. As shown in FIG. 1C, the antenna pattern formation position and the interlayer connection position (that is, the position of the vertical conductor) and the IC chip arrangement do not interfere with each other, and the size and thickness can be reduced. A big contribution.

  Next, FIG. 2 is a diagram for schematically explaining an antenna configuration in a non-contact data carrier as another embodiment of the present invention. In FIG. 2, the same or equivalent parts as those shown in FIG. The description is omitted unless there is an additional matter.

  In this example, both terminals of the IC chip 101 are connected to the antenna pattern n (that is, the antenna pattern formed on the outermost wiring layer) and the antenna pattern n−1 located on both surfaces of the outermost insulating layer n0. They are connected via their inner peripheral ends. Accordingly, the outer peripheral end 1o of the outermost antenna pattern 1 and the outer peripheral end no of the outermost antenna pattern n are electrically connected by the n-layer 1 interlayer vertical conductor n1 penetrating all the insulating layers. Connected.

  This example is schematically illustrated as shown in FIG. Although the n-layer 1 interlayer vertical conductor n1 penetrating all the insulating layers is required, the multi-layer spiral antenna patterns 1, 2,..., N are traced from one end of the IC chip 101 to the other end. A series connection arrangement is obtained without pattern complications. In the IC chip 101, it is possible to secure an easy position for being built in. Planar miniaturization is realized by the multi-layered antenna patterns 1, 2,..., N, and further, the IC chip 101 is built in, so that the thickness is reduced.

  2 is compared with FIG. 1 as follows. Assuming that the wiring layers are numbered from the top of the figure, in FIG. 1, the antenna pattern of the odd-numbered wiring layer and the antenna pattern of the next even-numbered wiring layer are connected on the outer peripheral side. The connection between the pattern and the antenna pattern of the next odd-numbered wiring layer is made on the inner circumference side. On the other hand, in FIG. 2, the antenna pattern of the odd-numbered wiring layer and the antenna pattern of the next even-numbered wiring layer are connected on the inner peripheral side, and the antenna pattern of the even-numbered wiring layer and the next odd-numbered wiring layer are connected. The connection with the antenna pattern of the second wiring layer is made on the outer peripheral side, which is opposite to the case of FIG.

  Further, in FIG. 1, the connection position of the IC chip 101 is between the inner peripheral ends 1i and ni of the outermost antenna patterns 1 and n. In FIG. It is between the inner peripheral end of the pattern n-1 and the inner peripheral end of the antenna pattern n of the even-numbered wiring layer having the largest number. There is no connection between the antenna patterns at the position corresponding to the connection of the IC chip 101 in both cases of FIGS. In the case of FIG. 1, it can be said that the IC chip 101 is inserted in the connection path between the outermost antenna patterns 1 and n. In the case of FIG. A connection path between the outer antenna patterns 1 and n (that is, the n-layer 1 interlayer vertical conductor n1) is separately provided between the outer peripheral ends 1o and no.

  In the case shown in FIG. 2, a room for providing the n-layer 1 interlayer vertical conductor n1 is necessary, which is somewhat disadvantageous for widening the opening area of the antenna pattern, but the disadvantage increase is minimized. be able to.

  Next, FIG. 3 is a diagram for schematically explaining an antenna configuration in a non-contact data carrier as still another embodiment of the present invention. In FIG. 3, the same reference numerals are given to the same or equivalent components as those in the already described drawings. The description is omitted unless there is an additional matter.

  In this example, both terminals of the IC chip 101 are connected to the antenna pattern 1 (that is, the antenna pattern formed on the outermost wiring layer) and the antenna pattern 2 located on both surfaces of the outermost insulating layer 10, and the inner periphery thereof. It is connected via the ends 1i and 2i. Accordingly, the outer peripheral end 1o of the outermost antenna pattern 1 and the outer peripheral end no of the outermost antenna pattern n are electrically connected by the n-layer 1 interlayer vertical conductor n1 penetrating all the insulating layers. Connected. This example is the same as that shown in FIG. 2 as an idea, and it can also be regarded as simply an inverted version of FIG. Therefore, what is shown in FIG. 3 is similar to FIG. 2 in comparison with that shown in FIG.

  Next, FIG. 4 is a diagram for schematically explaining an antenna configuration in a non-contact data carrier as still another embodiment of the present invention. Each drawing shown in FIG. 4 is a schematic illustration similar to that shown in FIG.

  4A is similar to that shown in FIGS. 2 and 3, but the connection position of the IC chip is the antenna pattern of an odd-numbered wiring layer (in this example, the third wiring layer). It is between the inner peripheral edge and the inner peripheral edge of the antenna pattern of the even-numbered wiring layer on the larger side next to it (the fourth wiring layer in this example). There is no connection between the antenna patterns at a position corresponding to the connection of the IC chip. It is the same in that a connection path (n-layer 1 interlayer vertical conductor) between the outermost antenna patterns is separately provided between the outer peripheral ends. This aspect is an aspect that can be adopted depending on the thickness specification of each insulating layer, although the arrangement of the IC chips is cramped in the vertical direction as compared with the case shown in FIGS.

  In FIG. 4B, the connection position of the IC chip is such that the connection position of the IC chip is the inner peripheral edge of the antenna pattern of an even-numbered wiring layer (in this example, the second wiring layer), and the adjacent odd-numbered wiring layer on the larger side ( In this example, it is between the inner peripheral edge of the antenna pattern of the third wiring layer). There is no connection between the antenna patterns at a position corresponding to the connection of the IC chip. In this case, the connection path (n-layer 1 interlayer vertical conductor) between the outermost antenna patterns is provided between the inner peripheral ends as shown in the figure.

  In this way, when an IC chip is provided between the inner peripheral edge of the antenna pattern of a certain even-numbered wiring layer and the inner peripheral edge of the antenna pattern of the adjacent odd-numbered wiring layer on the larger side, The connection path between the two antenna patterns is between the inner peripheral ends. Since the n-layer 1 interlayer vertical conductor penetrating all the insulating layers is not arranged on the outside, it is advantageous in increasing the opening area of the antenna pattern. An area for providing a body is required. In the case shown in FIG. 4B as well, the arrangement of the IC chips is cramped in the vertical direction as compared with the cases shown in FIGS. 2 and 3, but this is an aspect that can be adopted depending on the thickness specification of each insulating layer.

  4C is exactly the same as the connection position of the IC chip shown in FIG. 2B. The difference is that the vertical arrangement of the IC chip is closer to the upper side than that shown in FIG. Such an arrangement is also possible depending on the thickness specification of each insulating layer. In this case, a vertical conductor is interposed in both of the connections from the antenna pattern to both terminals of the IC chip. On the other hand, in the embodiments such as FIG. 2B and FIG. 3B, the connection from the antenna pattern to one terminal of the IC chip can be performed without using a vertical conductor.

  1 (c), FIG. 2 (b), FIG. 3 (b), and FIG. 4 show the case where n = 6, but the same configuration can be made when n is an even even number.

  Next, more specific embodiments of the present invention will be described below. First, FIG. 5 is a cross-sectional view schematically showing an example of a non-contact data carrier having the antenna configuration shown in FIG. In FIG. 5, the same components as those shown in FIG. The description is simplified.

  In this embodiment, the insulating layer has five layers of insulating layers 10, 20, 30, 40, and 50. Therefore, the antenna pattern has a six-layer configuration of antenna patterns 1, 2, 3, 4, 5, and 6. is there. As the vertical conductors for interlayer connection, the vertical conductors 12, 23, 34, 45, and 56, which are substantially frustoconical bumps penetrating the insulating layers, are provided. Solder resists 104 and 105 are provided on the outermost surfaces to prevent alteration of the antenna patterns 1 and 6 and the like.

  The conductive path between the IC chip 101 and the inner peripheral edge 1i of the antenna pattern 1 is a one-layer / two-layer vertical conductor, a land pattern of a wiring layer having the antenna pattern 2, a two-layer / three-layer vertical conductor, and an antenna pattern 3 The wiring layer land pattern having 3 layers, 4 interlayer vertical conductors, the wiring layer land pattern having antenna pattern 4, the 4 layer 5 interlayer vertical conductors, the wiring layer land having antenna pattern 5 and the wiring pattern Composed. The conductive path between the IC chip 101 and the inner peripheral edge of the antenna pattern 6 depends on the land pattern of the wiring layer having the antenna pattern 5, the 5-layer vertical interlayer conductor, the land of the wiring layer having the antenna pattern 6, and the wiring pattern. Composed.

  Each of the insulating layers 10, 20, 30, 40, 50 can be made of, for example, an epoxy resin containing glass cloth, BT resin, aramid resin, polyimide, Teflon (registered trademark) resin, etc. Can be set to 0.07 mm, for example. The antenna patterns 1, 2, 3, 4, 5, 6 are each formed by patterning, for example, a copper foil, and the thickness is, for example, 18 μm. As a layout rule for forming the antenna patterns 1, 2, 3, 4, 5, 6, for example, a line / space with a 75 μm / 75 μm line can be adopted.

  The IC chip 101 includes a communication circuit unit (not shown) and a memory unit (not shown) as main internal components. The communication circuit unit is connected to an antenna composed of antenna patterns 1, 2, 3, 4, 5, 6 and receives a data read command signal from the outside via this antenna and reacts to this to respond to the memory unit. Mediates output of data stored in. The IC chip 101 is mounted on the wiring layer provided with the antenna pattern 5 by flip connection as shown, but may be mounted by wire bonding. As a region where the IC chip 101 is provided, a part of each of the insulating layers 20, 30, and 40 is provided in the vertical direction.

  The solder resist 104 is formed on the surface of the insulating layer 10 provided with the first layer antenna pattern 1 so as to include a pattern portion that does not require solder connection (thickness is nominally 25 μm, for example). The solder resist 105 is formed on the surface of the insulating layer 50 provided with the sixth layer antenna pattern 6 so as to include a pattern portion that does not require solder connection (the thickness is, for example, similar to that of the solder resist 104). 25 μm).

  In this example, the overall thickness can be about 0.4 mm. The planar size is, for example, 5 mm square. Compared with the case where the IC chip 101 is provided outside the insulating layer and sealed with a sealing material, the thickness can be reduced by at least 0.2 mm.

  FIG. 6 is a schematic view showing a part of the process of manufacturing the non-contact data carrier shown in FIG. 5 in cross section. In FIG. 6, components corresponding to those shown in FIG.

  The manufacturing process of this non-contact data carrier is as follows. First, for interlayer connection at a required position of three copper foils (in order to form a 1-layer 2 interlayer vertical conductor 12, a 3-layer 4 interlayer vertical conductor 34, or a 5-layer 6-layer vertical conductor 56) ) And projecting silver paste bumps, and the prepreg to be the insulating layer 10, the insulating layer 30, or the insulating layer 50 is laminated and integrated on the copper foil so that the silver paste bumps penetrate. . Next, separate copper foils are laminated and integrated on the prepregs so as to plastically deform the tips of the penetrating silver paste bumps, and at the same time, the prepregs are cured to insulate the insulating layer 10, the insulating layer 30, or the insulating layer. Each double-sided wiring board having 50 is obtained. Then, copper foils on both sides are patterned by etching to form antenna patterns 1, 2, 3, 4, or 5, 6.

  Next, the IC chip 101 is mounted on the wiring board having the antenna patterns 5 and 6 and the insulating layer 50 by a predetermined method (flip connection or connection by wire bonding). Thereby, the wiring board material A in FIG. 6 is obtained. The wiring board having the antenna patterns 1 and 2 and the insulating layer 10 and the wiring board having the antenna patterns 3 and 4 and the insulating layer 30 are respectively provided with silver at a necessary position on the antenna pattern 2 and antenna pattern 4 side. Bumps such as paste bumps 23a and 45a are printed and formed, and the prepreg 20a or prepreg 40a to be the insulating layer 20 or the insulating layer 40 is laminated and integrated so that the silver paste bumps penetrate. Before or after stacking and integration, the portions of the prepreg 20a, the insulating layer 30, and the prepreg 40a corresponding to the position of the IC chip 101 are removed. As a result, the wiring board materials C and B in FIG. 6 are obtained.

  Then, the wiring board materials A, B, and C are laminated and integrated in an arrangement as shown in FIG. In this lamination integration, the prepregs 20a and 40a are fluidized by heat and filled around the IC chip 101 and cured. Further, bumps such as the bumps 23a and 45a come into contact with the land (copper pattern) with which the tip side contacts, and are plastically deformed and hardened to establish electrical connection. Thereafter, solder resists 104 and 105 are formed. As described above, the non-contact data carrier shown in FIG. 5 can be manufactured. In addition, about the wiring layer which has the outermost antenna patterns 1 and 6, you may make it perform the pattern formation after the last lamination | stacking integration shown in FIG.

  Next, FIG. 7 is a cross-sectional view schematically showing an example of a non-contact data carrier having the antenna configuration shown in FIG. In FIG. 7, the same reference numerals are given to the same components as those shown in the already described drawings. The description is omitted as much as possible.

  This embodiment differs from that shown in FIG. 5 in that the antenna configuration corresponds to that shown in FIG. 2, but is otherwise substantially the same as that shown in FIG. In the formation of each antenna pattern 1, 2, 3, 4, 5, 6, the positions of the inner and outer peripheral ends thereof are different from those shown in FIG. 5, and the arrangement positions of the respective vertical conductors 23, etc. However, the configuration can be easily understood if attention is paid to the fact that is different from that shown in FIG. The manufacturing method may also be referred to FIG.

  Next, FIG. 8 is a cross-sectional view schematically showing another example of a non-contact data carrier having the antenna configuration shown in FIG. In FIG. 8, the same reference numerals are given to the same components as those shown in the already described drawings. The description is omitted as much as possible.

  This embodiment includes an IC chip 101 and a chip capacitor 106. The other points are the same as the embodiment shown in FIG. As a manufacturing method, as shown in FIG. 9, in order to obtain the wiring board material Aa, in addition to mounting the IC chip 101, the chip capacitor 106 is also mounted on the wiring layer having the antenna pattern 5. Further, the parts of the prepreg 20a, the insulating layer 30, and the prepreg 40a are removed so as to secure the positions of the IC chip 101 and the chip capacitor 106.

  FIG. 10 is a circuit diagram of the non-contact data carrier shown in FIG. Corresponding components in FIG. As shown in FIG. 10A, the chip capacitor 106 can be provided, for example, in parallel with the IC chip 101 with respect to the antenna pattern. Further, as shown in FIG. 10B, the chip inductor 106A can be provided, for example, in series with the IC chip 101 with respect to the antenna pattern. These connections are made by patterning the wiring layer having the antenna pattern 5 in a predetermined pattern. By having the chip capacitor 106 and / or the chip inductor 106A, the characteristics as an antenna can be improved as necessary.

  Next, FIG. 11 is a sectional view schematically showing still another example of a non-contact data carrier having the antenna configuration shown in FIG. In FIG. 11, the same reference numerals are given to the same components as those shown in the already described drawings. The description is omitted as much as possible.

  This embodiment differs from that shown in FIGS. 5, 7, and 8 in that both outermost antenna patterns 1 </ b> A and 6 </ b> A are formed so as to include a planar overlap with the IC chip 101. This is substantially the same as that shown in FIG. In the formation of each antenna pattern 1A, 2, 3, 4, 5, 6A, the positions of the inner and outer peripheral ends thereof are different from those shown in FIG. 5, and the arrangement positions of the vertical conductors 23 and the like are different. The configuration can be easily understood if attention is paid to differences from the one shown in FIG.

  In the present embodiment, the outermost antenna patterns 1A and 6A can be formed so as to include a planar overlap with the IC chip 101. The outermost wiring layers are also incorporated in such a shape in the IC chip. This is because no interference occurs at the position 101. If the number of wiring layers is larger, the number of wiring layers that can form an antenna pattern including a planar overlap with the built-in IC chip 101 can be increased in the same manner. According to such an antenna, the number of turns can be increased and the inductance can be further increased, so that communication performance can be improved.

  Next, FIG. 12 is a cross-sectional view schematically showing an example of a non-contact data carrier having the antenna configuration shown in FIG. In FIG. 12, the same reference numerals are given to the same components as those shown in the already described drawings. The description is omitted as much as possible.

  In this embodiment, the IC chip 101 is mounted on a wiring board having antenna patterns 1, 2, 3, and 4 having a cavity for incorporating the IC chip 101 and sealed. . The antenna is configured by serial connection of four layers of antenna patterns. The insulating layer 20A, the wiring layer including the antenna patterns 2 and 3 on both sides thereof, and the longitudinal conductors 23A between these wiring layers are formed in advance as a so-called core substrate, and the insulating layer 10A is formed on the core substrate. 30A are stacked (build-up). Insulating layers 10A and 30A are each provided with a vertical conductor 34A or the like at a required position, and a wiring layer including antenna patterns 1 and 4 is provided on the surface thereof.

  The insulating layers 10A, 20A, and 30A can be made of, for example, epoxy resin with glass cloth, BT resin, aramid resin, polyimide, Teflon (registered trademark) resin, or the like. As the longitudinal conductors 24A, 34A, etc., those in which a silver paste is filled in a hole penetrating the insulating layer by laser processing or the like in advance can be used.

  During the build-up of the insulating layer 10A, the insulating layer 10A has a portion corresponding to the mounting position of the IC chip 101 removed. The wiring layer having the antenna pattern 2 has two lands for mounting the IC chip 101, and these lands are exposed to the outside because there is a removed portion in the insulating layer 10A before the IC chip 101 is mounted. Yes. After mounting the IC chip 101, a sealing resin 107 (for example, epoxy resin) is applied to the upper side of the insulating layer 10A including the inside of the cavity, and the IC chip 101 is sealed. At the longitudinal position of the IC chip 101, the sealing resin 107 is a member (corresponding to the first member) that contacts the IC chip 101, and the insulating layer 10A is far from the sealing resin 107 when viewed from the IC chip 101. Is another member (corresponding to the second member).

  In this embodiment, since the mounting position of the IC chip 101 is at a position where it sinks on the wiring board, the thickness of the non-contact data carrier can be reduced accordingly. For example, the total thickness can be about 0.7 mm. Compared with the case where the IC chip 101 is normally provided and sealed with a sealing material, the thickness can be reduced by at least about 0.1 mm.

  Next, FIG. 13 is a cross-sectional view schematically showing another example of a non-contact data carrier having the antenna configuration shown in FIG. In FIG. 13, the same reference numerals are given to the same components as those shown in the already described drawings. The description is omitted as much as possible.

  This embodiment is almost the same as that shown in FIG. 12, but the sealing resin 107A for sealing the IC chip 101 is not formed on the upper side of the insulating layer 10A. Depending on the thickness of the IC chip 101 or the thickness of the insulating layer 10 </ b> A, even such a configuration may be a problem as a sealing of the IC chip 101.

  12 and 13 show the contactless data carrier having the antenna configuration shown in FIG. 3, but it is also possible to easily make a contactless data carrier having the antenna configuration shown in FIG. .

The figure for demonstrating typically the antenna structure in the non-contact data carrier as one Embodiment of this invention. The figure for demonstrating typically the antenna structure in the non-contact data carrier as another embodiment of this invention. The figure for demonstrating typically the antenna structure in the non-contact data carrier as another embodiment of this invention. The figure for demonstrating typically the antenna structure in the non-contact data carrier as another embodiment of this invention. Sectional drawing which shows typically the example of the non-contact data carrier which has the antenna structure shown in FIG. The schematic diagram which shows a part of process in which the non-contact data carrier shown in FIG. 5 is manufactured in cross section. Sectional drawing which shows typically the example of the non-contact data carrier which has the antenna structure shown in FIG. Sectional drawing which shows typically another example of the non-contact data carrier which has the antenna structure shown in FIG. The schematic diagram which shows a part of process in which the non-contact data carrier shown in FIG. 8 is manufactured in cross section. The circuit diagram of the non-contact data carrier shown in FIG. Sectional drawing which shows typically another example of the non-contact data carrier which has the antenna structure shown in FIG. Sectional drawing which shows typically the example of the non-contact data carrier which has the antenna structure shown in FIG. Sectional drawing which shows typically another example of the non-contact data carrier which has an antenna structure shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,1A ... 1st layer antenna pattern, 1i ... Inner edge of 1st layer antenna pattern, 1o ... Outer edge of 1st layer antenna pattern, 2 ... 2nd layer antenna pattern, 2i ... Of 2nd layer antenna pattern Peripheral edge, 2o ... Outer edge of second layer antenna pattern, 3 ... Third layer antenna pattern, 3i ... Inner edge of third layer antenna pattern, 3o ... Outer edge of third layer antenna pattern, 4 ... Fourth layer Antenna pattern, 4i ... Inner edge of the fourth layer antenna pattern, 4o ... Outer edge of the fourth layer antenna pattern, 5 ... Fifth layer antenna pattern, 5i ... Inner edge of the fifth layer antenna pattern, 5o ... Fifth The outer peripheral edge of the layer antenna pattern, 6, 6A ... the sixth layer antenna pattern, 6i ... The inner peripheral edge of the sixth layer antenna pattern, 6o ... The outer peripheral edge of the sixth layer antenna pattern, n ... The nth layer antenna pattern, n ... inner edge of the sixth layer antenna pattern, no ... outer edge of the sixth layer antenna pattern, 10, 10A ... first insulating layer, 20, 20A ... second insulating layer, 20a ... prepreg, 30, 30A ... third Insulating layer, 40 ... 4th insulating layer, 40a ... Prepreg, 50 ... 5th insulating layer, n0 ... nth insulating layer, 12 ... 1 layer 2 interlayer longitudinal conductor, 23, 23A ... 2 layer 3 interlayer longitudinal conduction , 23a... Silver paste bump, 34, 34A... 3 layer 4 interlayer longitudinal conductor, 45... 4 layer 5 interlayer longitudinal conductor, 45a... Silver paste bump, 56. −1n... N-1 layer n interlayer vertical conductor, n1... N layer 1 interlayer vertical conductor, 101... IC chip, 102 and 103... Conductive path from IC chip to antenna, 104 and 105. 106: Chip capacitor, 10 A ... chip inductor, 107 and 107a ... sealing resin.

Claims (8)

  1. An IC chip capable of storing data and having two terminals connectable to an antenna;
    A wiring board on which the IC chip is built-in,
    The wiring board has n (n is an even number of 4 or more) layers or more, and a spiral antenna pattern is formed on each of the n or more wiring layers,
    Longitudinal conductors are arranged connected to the inner and outer peripheral ends of each of the spiral antenna patterns,
    The two terminals of the IC chip are respectively connected to the inner peripheral ends of the spiral antenna patterns formed on both outermost layers of the n or more wiring layers via the vertical conductors. A non-contact data carrier characterized in that
  2. An IC chip capable of storing data and having two terminals connectable to an antenna;
    A wiring board on which the IC chip is built-in,
    The wiring board has wiring layers of n (n is an even number of 4 or more) layers or more, and a spiral antenna pattern is formed in each of the wiring layers of n layers or more,
    A vertical conductor is connected to each of the inner and outer peripheral ends of each of the spiral antenna patterns except for the inner peripheral end of one of the inner layers of the n or more wiring layers. And
    One of the two terminals of the IC chip is connected to the inner peripheral end of the one spiral antenna pattern,
    The other of the two terminals of the IC chip is connected to the inner peripheral end of the spiral antenna pattern formed on one wiring layer adjacent to the one spiral antenna pattern via the longitudinal conductor. Non-contact data carrier characterized by being connected.
  3.   The spiral antenna pattern formed on one wiring layer adjacent to any one of the spiral antenna patterns is formed on one of the outermost wiring layers of the wiring layers. The non-contact data carrier according to claim 2.
  4.   3. The contactless data carrier according to claim 1, wherein at least one of the spiral antenna patterns is formed so as to include a planar overlap with the IC chip.
  5.   The non-contact data carrier according to claim 1, further comprising a capacitor or an inductor built in the wiring board.
  6.   The wiring board has a plurality of insulating layers separating the wiring layers, and at least one of the insulating layers has a first member in contact with the IC chip, and the first member from the IC chip. 3. The non-contact data carrier according to claim 1, further comprising a second member located far away via the second member.
  7. Wiring layers of n (n is an even number of 4 or more) layers each having a spiral antenna pattern;
    An insulating layer separating the n or more wiring layers from each other;
    A vertical conductor connected to each of the inner and outer peripheral ends of each of the spiral antenna patterns and arranged in the vertical direction on the insulating layer;
    The insulating layer is partially missing so as to expose a partial pattern of one wiring layer excluding both outermost layers of the n or more wiring layers,
    Two lands for mounting an IC chip are formed on the partial pattern exposed to the outside,
    The two lands are respectively connected to the inner peripheral ends of the spiral antenna patterns of both outermost layers of the n or more wiring layers via the longitudinal conductors. A non-contact data carrier wiring board.
  8. Wiring layers of n (n is an even number of 4 or more) layers each having a spiral antenna pattern;
    An insulating layer separating the n or more wiring layers from each other;
    Except for the inner peripheral edge of one spiral antenna pattern formed on one of the innermost wiring layers from the outermost of the n or more wiring layers, the inner peripheral edge and the outer peripheral edge of each of the spiral antenna patterns. A longitudinal conductor connected to each of the insulating layers and disposed in the longitudinal direction on the insulating layer;
    The insulating layer is partially missing so as to expose a partial pattern of the wiring layer having the one spiral antenna pattern to the outside,
    Two lands for mounting an IC chip are formed on the partial pattern exposed to the outside,
    One of the two lands is connected to the inner peripheral end of the spiral antenna pattern formed on the outermost wiring layer adjacent to the one spiral antenna pattern via the longitudinal conductor.
    The non-contact data carrier wiring board, wherein the other of the two lands is connected to the inner peripheral end of the one spiral antenna pattern.
JP2007010326A 2007-01-19 2007-01-19 Non-contact data carrier, wiring board for non-contact data carrier Expired - Fee Related JP5087932B2 (en)

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JP2012221212A (en) * 2011-04-08 2012-11-12 Toppan Printing Co Ltd Non-contact ic module
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JP5930137B1 (en) * 2014-12-19 2016-06-08 株式会社村田製作所 Wireless IC device, resin molded body and manufacturing method thereof
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JP2011018893A (en) * 2009-07-08 2011-01-27 Samsung Electro-Mechanics Co Ltd Insulation material, electronic element incorporation type printed board, and method of manufacturing the same
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WO2016098379A1 (en) * 2014-12-19 2016-06-23 株式会社村田製作所 Wireless ic device, resin molded product, and manufacturing method therefor
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