JP2008173820A - Composite woody panel and woody building material - Google Patents

Composite woody panel and woody building material Download PDF

Info

Publication number
JP2008173820A
JP2008173820A JP2007008100A JP2007008100A JP2008173820A JP 2008173820 A JP2008173820 A JP 2008173820A JP 2007008100 A JP2007008100 A JP 2007008100A JP 2007008100 A JP2007008100 A JP 2007008100A JP 2008173820 A JP2008173820 A JP 2008173820A
Authority
JP
Japan
Prior art keywords
wood
board
composite
surface
veneer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007008100A
Other languages
Japanese (ja)
Inventor
Naohiko Maeda
Shinichi Suzuki
直彦 前田
伸一 鈴木
Original Assignee
Matsushita Electric Works Ltd
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd, 松下電工株式会社 filed Critical Matsushita Electric Works Ltd
Priority to JP2007008100A priority Critical patent/JP2008173820A/en
Publication of JP2008173820A publication Critical patent/JP2008173820A/en
Application status is Pending legal-status Critical

Links

Images

Abstract

An object of the present invention is to provide a composite wood board having high rigidity while suppressing the occurrence of warpage due to dimensional change of moisture absorption and release while effectively utilizing the surface smoothness inherent in engineering boards such as MDF and PB. .
A wood veneer 3 having moisture absorption / release characteristics equivalent to that of a wood substrate is adhered to the back surface of the wood substrate 2.
[Selection] Figure 1

Description

  The present invention relates to a composite wooden board and a wooden building material.

  As for plywood used for wooden construction materials for floors, southern plywood is difficult to obtain due to the worldwide problem of depletion of timber resources. Conifer plywood, MDF (medium density fiberboard), PB (particle conversion to so-called engineering boards such as board) has begun. Softwood plywood has the feature of sufficient bending strength, but has a rough surface and is therefore unsuitable for flooring and the like.

  Therefore, engineering boards such as MDF and PB are considered promising as a base material for wooden building materials, but engineering boards such as MDF and PB have sufficient surface strength and surface smoothness. There is a problem that the amount of bending in the bending test is considerably large.

  In the JAS bending test, the board was supported as a span of 700 mm, and when a load was applied with a weight of 3 kg per 100 mm length of the board on a load bar placed perpendicular to the center of the span and 7 kg per 100 mm width. The difference in deflection when the load calculated as is applied is obtained. The standard for flooring is that the amount of deflection is within 3.5 mm.

  In addition, engineering boards such as MDF and PB have a problem in that they easily absorb and absorb moisture, are dimensionally changed in thickness and length due to moisture absorption and release, and the amount of change is large.

Since such dimensional changes caused by moisture absorption and desorption appear as warping of the building material, in Patent Document 1, the same thickness is used for the front and back surfaces of the fiberboards such as MDF and PB. A plywood having a single plate structure is attached, and the plate material is made symmetrical with respect to the center in the thickness direction so as to suppress warping of the building material by canceling out internal stress.
JP 2001-262817 A

  Certainly, the board | plate material described in the cited reference 1 can solve the problem which engineering boards, such as MDF and PB, have, and can provide the wooden construction material by which curvature was suppressed. However, sticking wood veneers with the same thickness and the same structure to the front and back surfaces of engineering boards such as MDF and PB increases the manufacturing cost and makes it difficult to provide wooden construction materials at low cost. . Not only that, but engineering boards such as MDF and PB originally have excellent surface smoothness, but sticking a wood veneer on the surface of engineering boards such as MDF and PB. The surface smoothness is not effectively used.

  The present invention has been made in view of the circumstances as described above, and easily uses the surface smoothness originally possessed by engineering boards such as MDF and PB, and easily generates warpage due to the change in moisture absorption and desorption. In addition, it is an object to provide a composite wood board having high rigidity while keeping it inexpensive.

  In order to solve the above problems, the composite wood board of the present invention is characterized by the following.

  First, a wood veneer having moisture absorption / release characteristics equivalent to that of the wood substrate is attached to the back surface of the wood substrate.

  2ndly, in the said 1st characteristic, it protrudes and warps so that the surface side of the wood base material with which the wood single board was stuck on the back surface may be lifted.

  Thirdly, the wood building material of the present invention is characterized in that a wood veneer is stuck on the surface of the wood base material of the composite wood board having the first or second feature.

  According to the first invention, the wood veneer adhered to the back surface of the wood base material has the same moisture absorption and desorption characteristics as the wood base material. It is possible to apply the surface smoothness of the wooden base material as it is because it is attached only to the back surface. Even if a wood veneer is attached to the surface, the surface smoothness is maintained as it is. Further, since the wood veneer is attached only on the back surface, warpage can be easily and inexpensively suppressed, and the price of the composite wood veneer can be reduced. Furthermore, since the wood veneer stuck on the back surface of the wood base material has the same moisture absorption and desorption characteristics as the wood base material, it can sufficiently satisfy the standard of the JAS bending test.

  According to the second aspect of the invention, in addition to the effects of the first aspect of the invention, the surface decorative material such as the wood veneer and the resin decorative sheet used for the surface decoration is contracted by drying after being applied. However, if the wood substrate is warped in advance so that the surface side is lifted before the surface decorative material is attached, the surface of the composite wooden board becomes smooth as the surface decorative material contracts. It is possible to prevent the occurrence of defective products.

  According to the third aspect of the invention, in addition to the effects of the first or second aspect of the invention, there is provided a woody building material such as a flooring having a sufficiently high JAS bending strength and a warp that is easily and inexpensively suppressed. The

  FIG. 1 is a longitudinal sectional view showing an embodiment of the composite wood board of the present invention.

  The composite wood board 1 shown in FIG. 1 includes an engineering board 2 a such as MDF or PB as a wood base material 2. As described above, the engineering board 2a such as MDF or PB has sufficient surface strength and smoothness, but has a problem that the amount of bending is considerably large in the JAS bending test. In order to reduce the amount of bending, it is conceivable to improve the strength by sticking a highly rigid wood veneer to the back surface of the engineering board 2a. Generally, however, the wood veneer is more absorbent than the engineering board 2a. The amount of moisture dimensional change is small and the composite wood board 1 warps over time unless the wood veneer with the same thickness, moisture content, and tree species as the wood board attached to the back of the engineering board 2a is attached. There is a problem of doing. That is, if the composite wood board 1 does not have a symmetric structure with respect to the center in the thickness direction, the warp cannot be suppressed, and the dimensional change accompanying moisture absorption / release increases.

  Therefore, in the composite wood board 1 shown in FIG. 1, a wood veneer 3 having moisture absorption / release characteristics equivalent to that of the engineering board 2 a is appropriately provided on the back surface of the engineering board 2 a such as MDF or PB as the wood base material 2. It is stuck with an adhesive. The moisture absorption / release characteristics of the engineering board 2a such as MDF and PB used for the wooden substrate 2 are generally 0.12-0.22% in average in the moisture absorption / release dimensional change in the length direction (L direction). Is in range. This moisture absorption and desorption characteristic is a measurement result of a constant weight state at 20 ° C. and 65% (at the time of moisture release) and a constant weight state at 40 ° C. and 90% (at the time of moisture absorption). The constant weight state is a state in which the dimensional change is settled. is there. The amount of change in moisture absorption and release of general wood veneer is smaller than that of the engineering board 2a.

  However, in recent years, it has been found that some early-planted trees whose quality has been improved have a large amount of change in the moisture absorption and release dimensions, such as poplar, and are similar to engineering boards 2a such as MDF and PB. A wood veneer 3 having moisture absorption / release characteristics equivalent to an engineering board 2a such as MDF or PB as the wood substrate 2 is attached to the back surface of the composite wood plate 1.

  For this reason, even if the composite wood board 1 does not have symmetry with respect to the center in the thickness direction, it is possible to easily and inexpensively suppress the occurrence of warping over time by attaching the wood single board 3 only on the back surface. it can. The price of the composite wood board 1 can be suppressed. Furthermore, the wood veneer 3 adhered to the back surface of the wood base material 2 has the same moisture absorption / release characteristics as the wood base material 2 and can sufficiently satisfy the JAS bending test standard.

  In addition, since only the back surface is attached, the surface smoothness of the engineering board 2a such as MDF or PB as the wood substrate 2 can be utilized as it is, and the wood veneer 4 or resin is applied to the surface of the composite wood board 1. Even if a surface decorative material such as a decorative sheet is attached, the surface smoothness is maintained as it is. Since the engineering board 2a such as MDF or PB has sufficient surface strength, a surface decorative material such as a wooden veneer 4 or a resin decorative sheet is attached to the surface of the composite wooden board 1 using an appropriate adhesive. Thereby, the caster resistance when the composite wood board 1 is used as a flooring can be easily ensured. Thus, by sticking a surface decorative material such as a wooden veneer 4 or a resin decorative sheet to the surface of the engineering board 2a such as MDF or PB as the wooden base material 2, the warpage is easily and inexpensively suppressed, and JAS A wooden building material 1a such as a floor material having a sufficiently high bending strength and a high rigidity is provided.

  FIG. 2 is a longitudinal sectional view showing another embodiment of the composite wood board of the present invention.

  In the composite wood board 1 shown in FIG. 2, the same reference numerals are given to the parts common to the composite wood board 1 shown in FIG. 1, and the description thereof is omitted, but in the composite wood board 1 shown in FIG. 2, When adhering the wood veneer 2 having the same moisture absorption / release characteristics as the engineering board 2a to the back surface of the engineering board 2a such as MDF or PB as the wood substrate 2, the engineering board 2a is protruded so that the surface side is raised. Warping. Such convex warpage of the engineering board 2a can be realized by controlling the moisture content when the wood veneer 3 is bonded. Specifically, by controlling the moisture content of the wood base material 2 on a completely dry basis to an average of 14 to 19%, when the wood veneer 3 is bonded, MDF, PB, etc. as the wood base material 2 The engineering board 2a can be convexly warped so that the surface is lifted.

  In this way, the engineering board 2a such as MDF or PB as the wooden base material 2 is warped in the surface decorative material to be adhered to the surface, like a wet veneer, and shrinks after drying. There is a thing, and when sticking the surface decoration material which may cause the shrinkage like that, the surface side lifts the engineering board 2a such as MDF or PB which is the wooden base material 2 before the sticking. As shown in FIG. 2, when the surface warping material 4 a is applied, the warping is forced and the composite wood board 1 has a smooth surface and prevents the occurrence of defective products. be able to. A wooden construction material 1a effective as a flooring or the like is provided.

  If the engineering board 2a has a concave warp such that the back surface is lifted, the surface of the composite wood board 1 is not smoothed even by sticking the surface decorative material 4a, and the concave warp is promoted. Must be avoided.

  In the composite wood board 1 of the present invention, even if the wood veneer 3 attached to the back surface of the wood base material 2 such as the engineering board 2a such as MDF or PB is a single piece, the composite wood board 1 It can be a small width having the same length in the length direction (L direction), and can be attached in parallel. Moreover, when improving the curvature of the width direction of the composite wooden board 1, it sticks so that the L direction of the wooden single board 3 may face the width direction of the wooden base material 2, and also the wooden base material 2 of the back surface is attached. It is also possible to adopt a multilayer structure in which the wood veneer 3 is stuck in the length direction so that the L direction coincides.

  Table 1 shows examples of the wood substrate and wood veneer used in Examples 1-5 and Comparative Examples 1 and 2 below. The moisture absorption / release dimensional change shown in Table 1 is the moisture absorption / release dimensional change in the length direction (L direction) for both the wood base and the wood veneer.

(Example 1)
Wood substrate PB: manufactured by Novopan Kogyo Co., Ltd.
Adhesive: Isocyanate
Thickness: 9.0mm Specific gravity: 0.81
Wood veneer: Poplar veneer Thickness: 1.5mm
Moisture content (fully dry basis): 14.2-17.7%
Back surface bonding: Adhesive: Water-based vinyl urethane
Application amount: 120 g / m 2 Press pressure: 8 kg / cm 2
Crushing time: 60 minutes Wood veneer: Tree species: Hippo Wet slice veneer (0.23mm)
Surface bonding: Adhesive: Rubber latex emulsion
(Structure Bond made by Sunbake Co., Ltd.)
Application amount: 93 g / m 2 Hot pressure: 120 ° C., 8 kg, 60 seconds (Example 2)
In Example 1, hot pressing is performed for bonding wood single plates.

Back surface lamination: Adhesive: Rubber latex emulsion
(Structure Bond made by Sunbake Co., Ltd.)
Application amount: 100 g / cm 2 Pressing pressure: 5 kg / cm 2
Clamping time: 3 minutes (Example 3)
In Example 1, the wood substrate was MDF.

Wood base material MDF: Hokushin Co., Ltd.
Adhesive: Isocyanate
Thickness: 9.0mm (two 5.5mm products are laminated with a reduced thickness)
Specific gravity: 0.82
Example 4
In Example 1, when a poplar veneer having a moisture content (dry base) of 22% is used.
(Example 5)
In Example 1, when a poplar veneer having a moisture content (dry base) of 12% is used.
(Comparative Example 1)
When only the surface veneer veneer is attached to the wood substrate PB.
(Comparative Example 2)
In Example 1, when a lauan veneer is used instead of a poplar veneer.

Lauan veneer: Thickness 1.5mm Moisture content 16%
About the obtained sample,
1. JAS bending test A load of 3 kg and 7 kg was applied to a span of 700 mm and a width of 100 mm, and the amount of deflection was measured. Passed within 3.5mm. A sample whose total thickness did not reach 12 mm was converted to 12 mm.
2. Moisture absorption warp Place in an atmosphere of 40 ° C 90% for 120 hours. Average value of diagonal warpage measurement in a sample of 300 mm × 300 mm.
3. Moisture release warp for 120 hours in an atmosphere of 40 ° C and 20%. Average value of diagonal warpage measurement in a sample of 300 mm × 300 mm.

  The results are as shown in Table 2.

  In the sample obtained in Example 1-3 which is the composite wood board of the present invention, the occurrence of warpage was suppressed, and the JAS bending strength was within the standard. In the samples obtained in Examples 4 and 5 in which the moisture content of the wood veneer was slightly high or low, the warpage was slightly increased although it was an acceptable range. In Comparative Example 1, unlike the composite wood board of the present invention, the wood single board was not attached to the back surface of the wood base material, so the JAS bending strength did not fall within the standard. The sample obtained in Comparative Example 2 was not able to suppress the occurrence of warping because the moisture absorption / release characteristics of the wood veneer were different from the wood substrate.

It is the longitudinal cross-sectional view which showed one Embodiment of the composite wood board of this invention. It is the longitudinal cross-sectional view which showed another embodiment of the composite wood board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Composite wood board 1a Wood building material 2 Wood base material 3 Wood veneer 4 Wood veneer

Claims (3)

  1.   A composite wood board characterized in that a wood veneer having moisture absorption / release characteristics equivalent to that of a wood base material is adhered to the back surface of the wood base material.
  2.   2. The composite wood board according to claim 1, wherein the wood board is convexly warped so that the surface side of the wood base material having the wood single board attached to the back surface is lifted.
  3.   A wooden building material, wherein a wooden veneer is adhered to the surface of a wooden substrate of the composite wooden board according to claim 1 or 2.
JP2007008100A 2007-01-17 2007-01-17 Composite woody panel and woody building material Pending JP2008173820A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007008100A JP2008173820A (en) 2007-01-17 2007-01-17 Composite woody panel and woody building material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007008100A JP2008173820A (en) 2007-01-17 2007-01-17 Composite woody panel and woody building material

Publications (1)

Publication Number Publication Date
JP2008173820A true JP2008173820A (en) 2008-07-31

Family

ID=39701209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007008100A Pending JP2008173820A (en) 2007-01-17 2007-01-17 Composite woody panel and woody building material

Country Status (1)

Country Link
JP (1) JP2008173820A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011226103A (en) * 2010-04-16 2011-11-10 Panasonic Electric Works Co Ltd Method of manufacturing wood floor material
KR101256317B1 (en) 2009-03-11 2013-04-18 다이니폰 인사츠 가부시키가이샤 Decorative material for flooring
JP2016113766A (en) * 2014-12-12 2016-06-23 パナソニックIpマネジメント株式会社 Floor material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101256317B1 (en) 2009-03-11 2013-04-18 다이니폰 인사츠 가부시키가이샤 Decorative material for flooring
JP2011226103A (en) * 2010-04-16 2011-11-10 Panasonic Electric Works Co Ltd Method of manufacturing wood floor material
JP2016113766A (en) * 2014-12-12 2016-06-23 パナソニックIpマネジメント株式会社 Floor material

Similar Documents

Publication Publication Date Title
EP1985464A1 (en) Construction plate, in particular floor panel and method for its production
US5925211A (en) Low pressure melamine/veneer panel and method of making the same
ES2459293T3 (en) Procedure for manufacturing a laminated decoration panel
US9085905B2 (en) Powder based balancing layer
US6887583B1 (en) Low pressure melamine/veneer panel
CA1191774A (en) Composite wood panel
US10100535B2 (en) Wood fibre based panel with a surface layer
KR100679815B1 (en) Wood flooring with laminated wood and hdf using symmetric structure and process for manufacturing the same
ES2288908T3 (en) Procedure for the manufacture of decorative laminated material.
US20090269522A1 (en) Water Resistant Wide Flooring Boards
CN1490227A (en) Container baseboard and producing method thereof
CN101092848A (en) Engineered wood floor using core material with vertical glue-line position
EP1689576A2 (en) Plywood laminate having improved dimensional stability and resistance to warping and delamination
KR20060026664A (en) Wood flooring laminated with high pressure veneer and impregnated low weight printing paper
KR100918559B1 (en) Interior product having transfer-printed base layer and process for preparing the same
EP2422027B1 (en) Floor panel
KR20130069609A (en) Method for manufacturing a building panel comprising a powder overlay
CN201525061U (en) Composite plywood with surface layer of fiberboard or shaving board
JP2010504866A (en) Symmetrical wood flooring using heat-treated wood and method for manufacturing the same
JP2733641B2 (en) Building board
DE10245914A1 (en) Parquet or veneered floor tile manufacture involves resin impregnation of softwood facing layer and printing of wood pattern on the dried surface
DE102010045266A1 (en) Method for manufacturing component for lining of e.g. floor surface of building, involves applying upper decoration part of ink above non-woven fabric layer before or after applying non-woven fabric layer on base body
DE10362218B4 (en) Method for sealing a building board
JP2000265652A (en) Wooden facing flooring material and its manufacture
US6667108B2 (en) Wearprotected wood veneer