JP2008162101A - Manufacturing method of molded structure body - Google Patents

Manufacturing method of molded structure body Download PDF

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JP2008162101A
JP2008162101A JP2006353294A JP2006353294A JP2008162101A JP 2008162101 A JP2008162101 A JP 2008162101A JP 2006353294 A JP2006353294 A JP 2006353294A JP 2006353294 A JP2006353294 A JP 2006353294A JP 2008162101 A JP2008162101 A JP 2008162101A
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Prior art keywords
pattern
mold structure
imprint resist
substrate
manufacturing
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Toshihiro Usa
利裕 宇佐
Shoichi Nishikawa
正一 西川
Kazunori Komatsu
和則 小松
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Fujifilm Corp
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Fujifilm Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a molded structure body for highly precisely and efficiently manufacturing the molded structure body for transferring and forming a high quality pattern on a discrete track medium or a pattern medium. <P>SOLUTION: The manufacturing method of the molded structure body has a transfer step which presses an uneven part side to an imprint resist where a master having the uneven part formed on the surface is applied on one side surface of a processed substrate having optical transparency, and transfers the shape of the uneven part to the imprint resist, a curing step for curing the imprint resist, and a pattern forming step which performs the etching of one side surface of the processed substrate using the imprint resist cured in the curing step as a mask and forms the uneven shaped pattern on the surface of one side of the processed substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、磁気記録媒体に情報を転写するための凹凸状のパターンを備えたモールド構造体の製造方法に関する。   The present invention relates to a method for manufacturing a mold structure having a concavo-convex pattern for transferring information to a magnetic recording medium.

近年、高速性やコストに優れたハードディスクドライブが、ストレージ機器の主力として、携帯電話、小型音響機器や、ビデオカメラなどのポータブル機器に搭載され始め、より一層の小型大容量化という要求に応えるために、記録密度を向上させる技術が求められている。
ハードディスクドライブの記録密度を高めるためには、磁気記録媒体の高性能化、及び磁気ヘッド幅の狭小化という手法が従来より用いられてきたが、データトラック間隔を狭めることにより、隣接トラック間の磁気の影響（クロストーク）や、熱揺らぎの影響が無視できなくなり、磁気ヘッドの狭小化などによる面記録密度の向上には限界があった。 In recent years, hard disk drives with excellent speed and cost have been installed in portable devices such as mobile phones, small audio devices, and video cameras as the mainstay of storage devices, in order to meet the demand for further miniaturization and larger capacity. In addition, a technique for improving the recording density is required.
In order to increase the recording density of the hard disk drive, methods of improving the performance of the magnetic recording medium and narrowing the magnetic head width have been used conventionally. However, by reducing the data track interval, the magnetic field between adjacent tracks can be reduced. (Crosstalk) and thermal fluctuation cannot be ignored, and there is a limit to the improvement of the surface recording density by narrowing the magnetic head.

そこで、クロストークによるノイズを解決する手段として、ディスクリートトラックメディアと呼ばれる形態の磁気記録媒体が提案されている（特許文献１〜２参照）。
ディスクリートトラックメディアは、隣接するトラック間に非磁性のガードバンド領域を設けて個々のトラックを磁気的に分離したディスクリート構造とすることにより、隣接トラック間の磁気的干渉を低減したものである。 Therefore, a magnetic recording medium called a discrete track medium has been proposed as means for solving noise caused by crosstalk (see Patent Documents 1 and 2).
Discrete track media have a discrete structure in which nonmagnetic guard band regions are provided between adjacent tracks to magnetically separate individual tracks, thereby reducing magnetic interference between adjacent tracks.

また、熱揺らぎによる減磁を解決する手段として、信号記録のための個々のビットを予め所定の形状パターンで備えたパターンドメディアと呼ばれる形態の磁気記録媒体が提案されている（特許文献３参照）。   As a means for solving demagnetization due to thermal fluctuation, a magnetic recording medium called a patterned medium in which individual bits for signal recording are provided in a predetermined shape pattern has been proposed (see Patent Document 3). ).

上記ディスクリートトラックメディアやパターンドメディアを製造する際には、特許文献４〜５に開示されたように、レジストパターン形成用モールド（スタンパとも称することがある。）を用いて、磁気記録媒体の表面に形成されたレジスト層に所望のパターンを転写するインプリンティング法がある。   When manufacturing the discrete track media or the patterned media, as disclosed in Patent Documents 4 to 5, the surface of the magnetic recording medium is used by using a resist pattern forming mold (also referred to as a stamper). There is an imprinting method in which a desired pattern is transferred to a resist layer formed on the substrate.

しかしながら、特許文献４に記載のレジストパターン形成用モールドの製造方法は、形状記憶性を有する組成の材料を、凹凸パターン化されたレジスト層上に成膜する成膜工程を有しているので、製造工程が多くなり、効率が悪かった。
また、従来では、レジストパターン形成用モールドを、後述する原盤として、その都度作製するために、生産効率が悪く、結果として、パターンが形成されたディスクリートトラックメディアや、パターンドメディアを作製する効率をも下げる結果となっていた。 However, since the method for producing a resist pattern forming mold described in Patent Document 4 includes a film forming step of forming a material having a shape memory property on a resist layer patterned into a concavo-convex pattern, The manufacturing process increased and the efficiency was poor.
In addition, conventionally, since a resist pattern forming mold is manufactured as a master, which will be described later, the production efficiency is low, and as a result, the efficiency of manufacturing a discrete track medium on which a pattern is formed or a patterned medium is improved. It was also the result of lowering.

したがって、磁気記録媒体の基板上に塗布されたレジスト層に対してパターンを転写するモールド構造体を高精細で効率よく作製する製造方法は未だ実現されておらず、その提供が望まれているのが現状である。   Therefore, a manufacturing method for producing a mold structure for transferring a pattern to a resist layer applied on a substrate of a magnetic recording medium with high definition and efficiency has not yet been realized, and its provision is desired. Is the current situation.

特開昭５６−１１９９３４号公報Japanese Patent Laid-Open No. 56-119934 特開平２−２０１７３０号公報JP-A-2-201730 特開平３−２２２１１号公報JP-A-3-22211 特開２００４−２２１４６５号公報JP 2004-221465 A

本発明は、従来における前記問題を解決し、以下の目的を達成することを課題とする。即ち、本発明は、ディスクリートトラックメディアや、パターンドメディアに高品質なパターンを転写形成するモールド構造体を高精細で効率よく作製する製造方法を提供することを目的とする。   An object of the present invention is to solve the conventional problems and achieve the following objects. That is, an object of the present invention is to provide a manufacturing method for efficiently producing a mold structure for transferring and forming a high-quality pattern on a discrete track medium or a patterned medium.

前記課題を解決するための手段としては、以下の通りである。即ち、
＜１＞ 表面に凹凸部が形成された原盤を、光透過性を有する被加工基板の一方の表面に塗布されたインプリントレジストに対して、前記凹凸部側を押し当てて、前記凹凸部の形状を前記インプリントレジスト上に転写する転写工程と、
前記インプリントレジストを硬化させる硬化工程と、
該硬化工程において硬化したインプリントレジストをマスクにして前記被加工基板の一方の表面のエッチングを行い、前記被加工基板の一方の表面上に凹凸形状のパターンを形成するパターン形成工程とを有することを特徴とするモールド構造体の製造方法である。
該＜１＞に記載のモールド構造体の製造方法においては、原盤の表面に形成された凹凸部を、被加工基板上のインプリントレジストに押し当てて、前記凹凸部の形状を転写し、硬化させたインプリントレジストをマスクにして凹凸形状のパターンを形成するようにしたので、成膜工程等の複雑かつ時間を要する工程を経ることなく、ディスクリートトラックメディアや、パターンドメディアに高品質なパターンを転写形成するモールド構造体を、高精細で、効率よく作製する製造方法を提供することができる。
＜２＞ 原盤の材料が、Ｎｉ、Ｓｉ、及び石英の少なくともいずれかよりなる前記＜１＞に記載のモールド構造体の製造方法である。
＜３＞ 硬化工程が、光及び熱の少なくともいずれかによってインプリントレジストを硬化させる工程である前記＜１＞から＜２＞のいずれかに記載のモールド構造体の製造方法である。
＜４＞ 被加工基板が、石英よりなる前記＜１＞から＜３＞のいずれかに記載のモールド構造体の製造方法である。
＜５＞ 転写工程及び硬化工程の少なくともいずれかが、インプリント法によって行われる前記＜１＞から＜４＞のいずれかに記載のモールド構造体の製造方法である。
＜６＞ パターンは、少なくとも所定間隔を有して複数の凸部が同心円状に形成されたパターンである前記＜１＞から＜５＞のいずれかに記載のモールド構造体の製造方法である。 Means for solving the problems are as follows. That is,
<1> The master having a concavo-convex portion formed on the surface thereof is pressed against the concavo-convex portion side against an imprint resist applied to one surface of a substrate having light transmittance, A transfer step of transferring the shape onto the imprint resist;
A curing step of curing the imprint resist;
A pattern forming step of etching one surface of the substrate to be processed by using the imprint resist cured in the curing step as a mask to form a concavo-convex pattern on the one surface of the substrate to be processed. This is a method for manufacturing a mold structure.
In the method for producing a mold structure according to <1>, the uneven portion formed on the surface of the master is pressed against the imprint resist on the substrate to be processed, and the shape of the uneven portion is transferred and cured. As a result of forming a concavo-convex pattern using the applied imprint resist as a mask, high-quality patterns can be applied to discrete track media and patterned media without going through complicated and time-consuming processes such as film formation. It is possible to provide a manufacturing method for efficiently producing a mold structure for transferring and forming a film with high definition.
<2> The method for producing a mold structure according to <1>, wherein the material of the master is made of at least one of Ni, Si, and quartz.
<3> The method for producing a mold structure according to any one of <1> to <2>, wherein the curing step is a step of curing the imprint resist by at least one of light and heat.
<4> The method for producing a mold structure according to any one of <1> to <3>, wherein the substrate to be processed is made of quartz.
<5> The method for producing a mold structure according to any one of <1> to <4>, wherein at least one of the transfer step and the curing step is performed by an imprint method.
<6> The method for producing a mold structure according to any one of <1> to <5>, wherein the pattern is a pattern in which a plurality of convex portions are formed concentrically with a predetermined interval.

＜７＞ 前記＜１＞から＜６＞のいずれかに記載のモールド構造体の製造方法により作製されたモールド構造体に形成された凸部のパターン形状を、基板上に塗布された樹脂に対して転写する第２の転写工程と、該第２の転写工程において転写されたパターンに基づいて凹凸形状を前記基板上に形成するパターン形成工程とを有することを特徴とするディスクリート記録媒体の製造方法である。   <7> The pattern shape of the protrusions formed on the mold structure produced by the method for producing a mold structure according to any one of <1> to <6> is applied to the resin applied on the substrate. And a pattern forming step of forming a concavo-convex shape on the substrate based on the pattern transferred in the second transfer step. It is.

本発明によると、従来における諸問題を解決でき、ディスクリートトラックメディアや、パターンドメディアに高品質なパターンを転写形成するモールド構造体を効率よく作製する製造方法を提供することができる。   According to the present invention, conventional problems can be solved, and a manufacturing method for efficiently producing a mold structure for transferring and forming a high-quality pattern on a discrete track medium or a patterned medium can be provided.

以下、本発明のモールド構造体の製造方法について図面を参照して説明する。   Hereinafter, a method for producing a mold structure of the present invention will be described with reference to the drawings.

＜モールド構造体の構成＞
図１は、本発明のモールド構造体の製造方法によって作製されたモールド構造体の構成を示す部分斜視図である。
図１に示すように、本実施形態のモールド構造体の製造方法によって作製されたモールド構造体１は、円盤状をなす基板２の一方の表面２ａ（以下、基準面２ａということがある。）に、複数の凸部３が同心円状に、所定の間隔で形成されてなる。
なお、基板２としては、ニッケル、シリコン、石英板、ガラス、アルミニウム、セラミックス、合成樹脂等が用いられる。 <Configuration of mold structure>
FIG. 1 is a partial perspective view showing the configuration of a mold structure manufactured by the method for manufacturing a mold structure of the present invention.
As shown in FIG. 1, a mold structure 1 manufactured by the method for manufacturing a mold structure of the present embodiment has one surface 2a of a substrate 2 having a disc shape (hereinafter, sometimes referred to as a reference surface 2a). In addition, a plurality of convex portions 3 are formed concentrically at predetermined intervals.
As the substrate 2, nickel, silicon, quartz plate, glass, aluminum, ceramics, synthetic resin or the like is used.

また、前記同心円の半径方向（凸部３が列設されている方向）における凸部３の断面形状は、例えば、矩形をなしている。
なお、前記凸部３の断面形状は、矩形に限られず、目的に応じて、後述するエッチング工程を制御することにより、任意の形状を選択することができる。
以下、本実施形態の説明において、「断面（形状）」とは、特に断りがない限り、前記同心円の半径方向（凸部３が列設されている方向）における断面（形状）を指す。 Moreover, the cross-sectional shape of the convex part 3 in the radial direction (direction in which the convex parts 3 are arranged) of the concentric circles is, for example, rectangular.
In addition, the cross-sectional shape of the convex portion 3 is not limited to a rectangle, and an arbitrary shape can be selected by controlling an etching process described later according to the purpose.
Hereinafter, in the description of the present embodiment, “cross section (shape)” refers to a cross section (shape) in the radial direction of the concentric circle (direction in which the convex portions 3 are arranged) unless otherwise specified.

（モールド構造体の作製方法）
以下、本発明に係るモールド構造体の作製方法について図面を参照して説明する。 (Mold structure manufacturing method)
Hereinafter, a method for producing a mold structure according to the present invention will be described with reference to the drawings.

［第１の実施形態］
―原盤の作製―
図２Ａ〜Ｂは、第１の実施形態におけるモールド構造体の作製方法を示す断面図である。図２Ａに示すように、まず、Ｓｉ基板１０上に、スピンコートなどでＰＭＭＡなどのフォトレジスト液を塗布し、フォトレジスト層２１を形成する。
その後、Ｓｉ基板１０を回転させながら、サーボ信号に対応して変調したレーザー光（又は電子ビーム）を照射し、フォトレジスト全面に所定のパターン、例えば各トラックに回転中心から半径方向に線状に延びるサーボ信号に相当するパターンを円周上の各フレームに対応する部分に露光する。
その後、フォトレジスト層２１を現像処理し、露光部分を除去して、除去後のフォトレジスト層２１のパターンをマスクにしてＲＩＥなどにより選択エッチングを行い、凹凸形状を有する原盤１１を得る。 [First Embodiment]
―Making master disc―
2A and 2B are cross-sectional views showing a method for producing a mold structure according to the first embodiment. As shown in FIG. 2A, first, a photoresist solution such as PMMA is applied on the Si substrate 10 by spin coating or the like to form a photoresist layer 21.
Thereafter, while rotating the Si substrate 10, a laser beam (or electron beam) modulated in accordance with the servo signal is irradiated to form a predetermined pattern on the entire surface of the photoresist, for example, each track linearly from the rotation center to the radial direction. A pattern corresponding to the extended servo signal is exposed to a portion corresponding to each frame on the circumference.
Thereafter, the photoresist layer 21 is developed, the exposed portion is removed, and selective etching is performed by RIE or the like using the pattern of the removed photoresist layer 21 as a mask to obtain the master 11 having an uneven shape.

―モールドの作製―
次に、図２Ｂに示すように、光硬化性樹脂を含有するインプリントレジスト液を塗布してなるインプリントレジスト層２４が一方の面に形成された被加工基板としての石英基板３０に対して、原盤１１を押し当て、原盤１１上に形成された凸部のパターンがインプリントレジスト層２４に転写される。 ―Mold fabrication―
Next, as shown in FIG. 2B, a quartz substrate 30 as a substrate to be processed is provided with an imprint resist layer 24 formed by applying an imprint resist solution containing a photocurable resin on one surface. Then, the master 11 is pressed, and the pattern of the protrusions formed on the master 11 is transferred to the imprint resist layer 24.

ここで、本発明における被加工基板の材料は、光透過性を有し、モールド構造体として機能する強度を有する材料であれば、特に制限されることなく、目的に応じて適宜選択され、例えば、石英（ＳｉＯ２）や、有機樹脂（ＰＥＴ、ＰＥＮ、ポリカーボネート、低融点フッ素樹脂）等が挙げられる。
また、前記「光透過性を有する」とは、具体的には、被加工基板にインプリントレジスト層が形成される一方の面から出射するように、前記被加工基板の他方の面から光を入射した場合に、インプリントレジストが十分に硬化することを意味しており、少なくとも、前記他方の面から前記一方の面への光透過率が５０％以上であることを意味する。
また、前記「モールド構造体として機能する強度を有する」とは、磁気記録媒体の基板上に形成されたインプリントレジスト層に対して、平均面圧力が４ｋｇｆ／ｃｍ２という条件下で押し当て、加圧しても耐えられるような強度を意味する。 Here, the material of the substrate to be processed in the present invention is appropriately selected according to the purpose without any particular limitation as long as it is a material having optical transparency and functioning as a mold structure. , Quartz (SiO 2 ), organic resins (PET, PEN, polycarbonate, low melting point fluororesin) and the like.
Further, the “having light transmittance” specifically means that light is emitted from the other surface of the substrate to be processed so that the light is emitted from one surface on which the imprint resist layer is formed on the substrate to be processed. This means that the imprint resist is sufficiently cured when incident, and at least the light transmittance from the other surface to the one surface is 50% or more.
Further, “having the strength to function as a mold structure” means that the imprint resist layer formed on the substrate of the magnetic recording medium is pressed against the imprint resist layer under the condition that the average surface pressure is 4 kgf / cm 2 . It means strength that can withstand pressure.

――硬化工程――
その後、インプリントレジスト層２４に紫外線などを照射して転写されたパターンを硬化させる。 --Curing process--
Thereafter, the transferred pattern is cured by irradiating the imprint resist layer 24 with ultraviolet rays or the like.

――パターン形成工程――
その後、転写されたパターンをマスクにしてＲＩＥなどにより選択エッチングを行い、凹凸形状を有するモールド構造体１を得る。
なお、前記選択エッチングは、凹凸形状を有するモールド構造体１の凹部の断面形状が、図１に示す凸部３の断面形状を転写した断面形状となるように行われる。 --Pattern formation process--
Thereafter, selective etching is performed by RIE or the like using the transferred pattern as a mask to obtain a mold structure 1 having an uneven shape.
The selective etching is performed so that the cross-sectional shape of the concave portion of the mold structure 1 having a concavo-convex shape is a cross-sectional shape obtained by transferring the cross-sectional shape of the convex portion 3 shown in FIG.

［第２の実施形態］
―原盤の作製―
図３Ａ〜Ｂは、第２の実施形態におけるモールド構造体の作製方法を示す断面図である。図２Ａに示すように、まず、Ｓｉ基板１０上に、スピンコートなどでＰＭＭＡなどのフォトレジスト液を塗布し、フォトレジスト層２１を形成する。
その後、Ｓｉ基板１０を回転させながら、サーボ信号に対応して変調したレーザー光（又は電子ビーム）を照射し、フォトレジスト全面に所定のパターン、例えば各トラックに回転中心から半径方向に線状に延びるサーボ信号に相当するパターンを円周上の各フレームに対応する部分に露光する。
その後、フォトレジスト層２１を現像処理し、露光部分を除去して、除去後のフォトレジスト層２１のパターンをマスクにしてＲＩＥなどにより選択エッチングを行い、凹凸形状を有する原盤１１を得る。 [Second Embodiment]
―Making master disc―
3A and 3B are cross-sectional views illustrating a method for producing a mold structure according to the second embodiment. As shown in FIG. 2A, first, a photoresist solution such as PMMA is applied on the Si substrate 10 by spin coating or the like to form a photoresist layer 21.
Thereafter, while rotating the Si substrate 10, a laser beam (or electron beam) modulated in accordance with the servo signal is irradiated to form a predetermined pattern on the entire surface of the photoresist, for example, each track linearly from the rotation center to the radial direction. A pattern corresponding to the extended servo signal is exposed to a portion corresponding to each frame on the circumference.
Thereafter, the photoresist layer 21 is developed, the exposed portion is removed, and selective etching is performed by RIE or the like using the pattern of the removed photoresist layer 21 as a mask to obtain the master 11 having an uneven shape.

―モールドの作製―
次に、図３Ｂに示すように、光硬化性樹脂を含有するインプリントレジスト液を塗布してなるインプリントレジスト層２４が形成された石英基板３０に対して、原盤１１を押し当て、原盤１１上に形成された凸部のパターンがインプリントレジスト層２４に転写される。 ―Mold fabrication―
Next, as shown in FIG. 3B, the master 11 is pressed against the quartz substrate 30 on which the imprint resist layer 24 formed by applying an imprint resist solution containing a photocurable resin is formed. The pattern of the convex portions formed on the top is transferred to the imprint resist layer 24.

――硬化工程――
その後、インプリントレジスト層２４に紫外線などを照射して転写されたパターンを硬化させる。 --Curing process--
Thereafter, the transferred pattern is cured by irradiating the imprint resist layer 24 with ultraviolet rays or the like.

――パターン形成工程――
その後、転写されたパターンをマスクにしてＲＩＥなどにより選択エッチングを行い、凹凸形状を有するモールド構造体１を得る。
なお、前記選択エッチングは、凹凸形状を有するモールド構造体１の凹部の断面形状が、図１に示す凸部３の断面形状を転写した断面形状となるように行われる。 --Pattern formation process--
Thereafter, selective etching is performed by RIE or the like using the transferred pattern as a mask to obtain a mold structure 1 having an uneven shape.
The selective etching is performed so that the cross-sectional shape of the concave portion of the mold structure 1 having a concavo-convex shape is a cross-sectional shape obtained by transferring the cross-sectional shape of the convex portion 3 shown in FIG.

［第３の実施形態］
―原盤の作製―
図４Ａ〜Ｂは、第３の実施形態におけるモールド構造体の作製方法を示す断面図である。図４Ａに示すように、まず、石英基板３０上に、スピンコートなどでＰＭＭＡなどのフォトレジスト液を塗布し、フォトレジスト層２１を形成する。
その後、石英基板３０を回転させながら、サーボ信号に対応して変調したレーザー光（又は電子ビーム）を照射し、フォトレジスト層２１の全面に所定のパターン、例えば各トラックに回転中心から半径方向に線状に延びるサーボ信号に相当するパターンを円周上の各フレームに対応する部分に露光する。
その後、フォトレジスト層２１を現像処理し、露光部分を除去して、除去後のフォトレジスト層２１のパターンをマスクにしてＲＩＥなどにより選択エッチングを行い、凹凸形状を有する原盤３１を得る。 [Third Embodiment]
―Making master disc―
4A and 4B are cross-sectional views illustrating a method for producing a mold structure according to the third embodiment. As shown in FIG. 4A, first, a photoresist solution such as PMMA is applied on the quartz substrate 30 by spin coating or the like to form a photoresist layer 21.
Thereafter, while rotating the quartz substrate 30, a laser beam (or electron beam) modulated in accordance with the servo signal is irradiated, and a predetermined pattern is applied to the entire surface of the photoresist layer 21, for example, each track in the radial direction from the rotation center. A pattern corresponding to a linearly extending servo signal is exposed at a portion corresponding to each frame on the circumference.
Thereafter, the photoresist layer 21 is developed, the exposed portion is removed, and selective etching is performed by RIE or the like using the pattern of the removed photoresist layer 21 as a mask to obtain a master 31 having an uneven shape.

―モールドの作製―
次に、図４Ｂに示すように、光硬化樹脂が含有されたインプリントレジスト液を塗布してなるインプリントレジスト層２４が形成された石英基板３０に対して、原盤３１を押し当て、原盤３１上に形成された凸部のパターンがインプリントレジスト層２４に転写される。 ―Mold fabrication―
Next, as shown in FIG. 4B, the master 31 is pressed against the quartz substrate 30 on which the imprint resist layer 24 formed by applying an imprint resist solution containing a photocurable resin is formed. The pattern of the convex portions formed on the top is transferred to the imprint resist layer 24.

――硬化工程――
その後、インプリントレジスト層２４に紫外線などを照射して転写されたパターンを硬化させる。 --Curing process--
Thereafter, the transferred pattern is cured by irradiating the imprint resist layer 24 with ultraviolet rays or the like.

――パターン形成工程――
その後、転写されたパターンをマスクにしてＲＩＥなどにより選択エッチングを行い、凹凸形状を有するモールド構造体１を得る。
なお、前記選択エッチングは、凹凸形状を有するモールド構造体１の凹部の断面形状が、図１に示す凸部３の断面形状を転写した断面形状となるように行われる。 --Pattern formation process--
Thereafter, selective etching is performed by RIE or the like using the transferred pattern as a mask to obtain a mold structure 1 having an uneven shape.
The selective etching is performed so that the cross-sectional shape of the concave portion of the mold structure 1 having a concavo-convex shape is a cross-sectional shape obtained by transferring the cross-sectional shape of the convex portion 3 shown in FIG.

［第４の実施形態］
―原盤の作製―
図５Ａ〜Ｂは、第４の実施形態におけるモールド構造体の作製方法を示す断面図である。図５Ａに示すように、まず、Ｓｉ基板１０上に、スピンコートなどでＰＭＭＡなどのフォトレジスト液を塗布し、フォトレジスト層２１を形成する。
その後、Ｓｉ基板１０を回転させながら、サーボ信号に対応して変調したレーザー光（又は電子ビーム）を照射し、フォトレジスト全面に所定のパターン、例えば各トラックに回転中心から半径方向に線状に延びるサーボ信号に相当するパターンを円周上の各フレームに対応する部分に露光する。
その後、フォトレジスト層２１を現像処理し、露光部分を除去して、除去後のフォトレジスト層２１のパターンをマスクにしてＲＩＥなどにより選択エッチングを行い、凹凸形状を有する原盤１１を得る。 [Fourth Embodiment]
―Making master disc―
5A and 5B are cross-sectional views illustrating a method for producing a mold structure according to the fourth embodiment. As shown in FIG. 5A, first, a photoresist solution such as PMMA is applied on the Si substrate 10 by spin coating or the like to form a photoresist layer 21.
Thereafter, while rotating the Si substrate 10, a laser beam (or electron beam) modulated in accordance with the servo signal is irradiated to form a predetermined pattern on the entire surface of the photoresist, for example, each track linearly from the rotation center to the radial direction. A pattern corresponding to the extended servo signal is exposed to a portion corresponding to each frame on the circumference.
Thereafter, the photoresist layer 21 is developed, the exposed portion is removed, and selective etching is performed by RIE or the like using the pattern of the removed photoresist layer 21 as a mask to obtain the master 11 having an uneven shape.

―モールドの作製―
次に、図５Ｂに示すように、熱硬化性樹脂を含有するインプリントレジスト液を塗布してなるインプリントレジスト層２４が一方の面に形成された被加工基板としての石英基板３０に対して、原盤１１を押し当て、原盤１１上に形成された凸部のパターンがインプリントレジスト層２４に転写される。 ―Mold fabrication―
Next, as shown in FIG. 5B, with respect to the quartz substrate 30 as a substrate to be processed on which the imprint resist layer 24 formed by applying an imprint resist solution containing a thermosetting resin is formed on one surface. Then, the master 11 is pressed, and the pattern of the protrusions formed on the master 11 is transferred to the imprint resist layer 24.

――硬化工程――
その後、インプリントレジスト層２４に熱を加えて、転写されたパターンを硬化させる。 --Curing process--
Thereafter, heat is applied to the imprint resist layer 24 to cure the transferred pattern.

――パターン形成工程――
その後、転写されたパターンをマスクにしてＲＩＥなどにより選択エッチングを行い、凹凸形状を有するモールド構造体１を得る。
なお、前記選択エッチングは、凹凸形状を有するモールド構造体１の凹部の断面形状が、図１に示す凸部３の断面形状を転写した断面形状となるように行われる。 --Pattern formation process--
Thereafter, selective etching is performed by RIE or the like using the transferred pattern as a mask to obtain a mold structure 1 having an uneven shape.
The selective etching is performed so that the cross-sectional shape of the concave portion of the mold structure 1 having a concavo-convex shape is a cross-sectional shape obtained by transferring the cross-sectional shape of the convex portion 3 shown in FIG.

［第５の実施形態］
―原盤の作製―
図６Ａ〜Ｂは、第１の実施形態におけるモールド構造体の作製方法を示す断面図である。図６Ａに示すように、まず、Ｓｉ基板１０上に、スピンコートなどでＰＭＭＡなどのフォトレジスト液を塗布し、フォトレジスト層２１を形成する。
その後、Ｓｉ基板１０を回転させながら、サーボ信号に対応して変調したレーザー光（又は電子ビーム）を照射し、フォトレジスト全面に所定のパターン、例えば各トラックに回転中心から半径方向に線状に延びるサーボ信号に相当するパターンを円周上の各フレームに対応する部分に露光する。
その後、フォトレジスト層２１を現像処理し、露光部分を除去して、除去後のフォトレジスト層２１のパターンをマスクにしてＲＩＥなどにより選択エッチングを行い、凹凸形状を有する原盤１１を得る。 [Fifth Embodiment]
―Making master disc―
6A and 6B are cross-sectional views illustrating a method for producing a mold structure according to the first embodiment. As shown in FIG. 6A, first, a photoresist solution such as PMMA is applied on the Si substrate 10 by spin coating or the like to form a photoresist layer 21.
Thereafter, while rotating the Si substrate 10, a laser beam (or electron beam) modulated in accordance with the servo signal is irradiated to form a predetermined pattern on the entire surface of the photoresist, for example, each track linearly from the rotation center to the radial direction. A pattern corresponding to the extended servo signal is exposed to a portion corresponding to each frame on the circumference.
Thereafter, the photoresist layer 21 is developed, the exposed portion is removed, and selective etching is performed by RIE or the like using the pattern of the removed photoresist layer 21 as a mask to obtain the master 11 having an uneven shape.

―モールドの作製―
次に、図６Ｂに示すように、光硬化性樹脂及び熱硬化性樹脂を含有するインプリントレジスト液を塗布してなるインプリントレジスト層２４が一方の面に形成された被加工基板としての石英基板３０に対して、原盤１１を押し当て、原盤１１上に形成された凸部のパターンがインプリントレジスト層２４に転写される。 ―Mold fabrication―
Next, as shown in FIG. 6B, quartz as a substrate to be processed having an imprint resist layer 24 formed by applying an imprint resist solution containing a photocurable resin and a thermosetting resin formed on one surface. The master 11 is pressed against the substrate 30, and the pattern of the protrusions formed on the master 11 is transferred to the imprint resist layer 24.

――硬化工程――
その後、インプリントレジスト層２４に熱を加えて、紫外線などを照射することで、転写されたパターンを硬化させる。 --Curing process--
Thereafter, the transferred pattern is cured by applying heat to the imprint resist layer 24 and irradiating it with ultraviolet rays or the like.

――パターン形成工程――
その後、転写されたパターンをマスクにしてＲＩＥなどにより選択エッチングを行い、凹凸形状を有するモールド構造体１を得る。
なお、前記選択エッチングは、凹凸形状を有するモールド構造体１の凹部の断面形状が、図１に示す凸部３の断面形状を転写した断面形状となるように行われる。 --Pattern formation process--
Thereafter, selective etching is performed by RIE or the like using the transferred pattern as a mask to obtain a mold structure 1 having an uneven shape.
The selective etching is performed so that the cross-sectional shape of the concave portion of the mold structure 1 having a concavo-convex shape is a cross-sectional shape obtained by transferring the cross-sectional shape of the convex portion 3 shown in FIG.

上記第１〜３の実施形態においては、ポジ型のフォトレジストを用いて露光及び現像を行ったが、前記レジスト液をネガ型とすることで、本実施形態とは対称的なパターンのモールド構造体を作製することもできる。したがって、本実施形態におけるフォトレジストの適用に特に制限はなく、目的に応じて、ネガ型フォトレジスト、及びポジ型フォトレジストのいずれが適宜選択される。   In the first to third embodiments, exposure and development are performed using a positive photoresist. However, a mold structure having a pattern symmetrical to that of the present embodiment is obtained by making the resist solution negative. The body can also be made. Therefore, the application of the photoresist in the present embodiment is not particularly limited, and either a negative photoresist or a positive photoresist is appropriately selected according to the purpose.

また、前記原盤にメッキを施して第２の原盤を作製し、この第２の原盤を使用してメッキを行い、ネガ状凹凸パターンを有する基板を作製してもよい。更に、第２の原盤にメッキを行うか、樹脂液を押し付けて硬化を行って第３の原盤を作製し、第３の原盤にメッキを行い、ポジ状凹凸パターンを有する基板を作製してもよい。   Alternatively, the master may be plated to produce a second master, and the second master may be used for plating to produce a substrate having a negative uneven pattern. Further, even if the second master is plated, or the resin liquid is pressed and cured to produce a third master, the third master is plated, and a substrate having a positive uneven pattern is produced. Good.

更に、上記第１〜３の実施形態においては、光硬化性樹脂を含有するインプリントレジスト液を基板上に塗布してインプリントレジスト層２４を形成する実施形態を説明したが、前記インプリントレジスト液には、光硬化性樹脂、及び熱硬化性樹脂の少なくともいずれかが含まれていることが好ましい。
前記インプリントレジスト液に熱硬化性樹脂が含まれる場合には、前述の被加工基板の「光透過性」の条件と同様に、レジストが十分に硬化する程度の熱伝導率の材料が、前記被加工基板に採用されていることが好ましい。
そして、前記インプリントレジスト液に光硬化性樹脂、及び熱硬化性樹脂が含まれる場合には、前述の硬化工程において、被加工基板への光の照射、及び被加工基板の加熱が段階的に行われてもよい。
熱可塑性樹脂がインプリントレジスト液に含まれる場合、該熱可塑性樹脂のガラス転移点（Ｔｇ）付近に維持した状態で、凸部のパターンをインプリントレジスト層２４に転写後、インプリントレジスト層２４を前記熱可塑性樹脂のガラス転移点よりも低下させることにより転写されたパターンを硬化させ、該パターンをマスクにしてＲＩＥなどにより選択エッチングを行い、凹凸形状を有するモールド構造体１を得ることとなる。 Furthermore, in the said 1st-3rd embodiment, although the imprint resist liquid containing a photocurable resin was apply | coated on a board | substrate and the imprint resist layer 24 was formed, the said imprint resist was demonstrated. The liquid preferably contains at least one of a photocurable resin and a thermosetting resin.
When the thermosetting resin is included in the imprint resist solution, the material having a thermal conductivity sufficient to cure the resist is the same as the above-described “light transmission” condition of the substrate to be processed. It is preferable that it is adopted for the substrate to be processed.
If the imprint resist solution contains a photocurable resin and a thermosetting resin, light irradiation to the substrate to be processed and heating of the substrate to be processed are stepwise in the above-described curing step. It may be done.
When the thermoplastic resin is contained in the imprint resist solution, the pattern of the convex portion is transferred to the imprint resist layer 24 in a state maintained near the glass transition point (Tg) of the thermoplastic resin, and then the imprint resist layer 24. The transferred pattern is cured by lowering the glass transition point of the thermoplastic resin, and selective etching is performed by RIE or the like using the pattern as a mask to obtain a mold structure 1 having an uneven shape. .

＜磁気記録媒体の作製方法＞
以下、本発明に係るモールド構造体を用いて、ディスクリートトラックメディアや、パターンドメディアなどの磁気記録媒体を作製する作製方法について図面を参照して説明する。
図７に示すように、例えば、上記第１の実施形態で作製したモールド構造体１を用いる場合、磁性層５０と、ＰＭＭＡなどのインプリントレジスト液を塗布してなるインプリントレジスト層２４とがこの順に形成された磁気記録媒体の基板４０に対して、モールド構造体１を押し当て、加圧することにより、モールド構造体１上に形成された凸部３のパターンをインプリントレジスト層２４に転写する。
なお、インプリントレジスト層２４にモールド構造体１を押し当てる際には、系を前記レジスト液のガラス転移点（Ｔｇ）付近に維持しておき、転写後、インプリントレジスト層２４が前記レジスト液のガラス転移点よりも低下することにより硬化することとなる。
その後、凸部３のパターンが転写されたインプリントレジスト層２４をマスクにして、ＲＩＥなどにより選択エッチングを行い、モールド構造体１上に形成されたパターン形状に基づく凹凸形状を磁性層５０に形成し、凹部に非磁性材料７０を埋め込み、表面を平坦化した後、必要に応じて、保護膜などを形成して磁気記録媒体１００を得る。 <Method for producing magnetic recording medium>
Hereinafter, a manufacturing method for manufacturing a magnetic recording medium such as a discrete track medium or a patterned medium using the mold structure according to the present invention will be described with reference to the drawings.
As shown in FIG. 7, for example, when using the mold structure 1 manufactured in the first embodiment, the magnetic layer 50 and the imprint resist layer 24 formed by applying an imprint resist solution such as PMMA are provided. The pattern of the convex portion 3 formed on the mold structure 1 is transferred to the imprint resist layer 24 by pressing and pressing the mold structure 1 against the substrate 40 of the magnetic recording medium formed in this order. To do.
When the mold structure 1 is pressed against the imprint resist layer 24, the system is maintained in the vicinity of the glass transition point (Tg) of the resist solution, and the imprint resist layer 24 is transferred to the resist solution after the transfer. It will harden | cure by falling below the glass transition point of this.
Thereafter, using the imprint resist layer 24 to which the pattern of the convex portion 3 is transferred as a mask, selective etching is performed by RIE or the like to form an uneven shape based on the pattern shape formed on the mold structure 1 in the magnetic layer 50. Then, after embedding the nonmagnetic material 70 in the recess and planarizing the surface, a protective film or the like is formed as necessary to obtain the magnetic recording medium 100.

以上説明したように、本発明に係るモールド構造体の製造方法によれば、原盤の表面に形成された凹凸部を、被加工基板上のインプリントレジストに押し当てて、前記凹凸部の形状を転写し、硬化させたインプリントレジストをマスクにして凹凸形状のパターンを形成することにより、原盤を複製したモールド構造体を作製することができるので、成膜工程等の複雑かつ時間を要する工程を経ることなく、ディスクリートトラックメディアや、パターンドメディアに高品質なパターンを転写形成するモールド構造体を、高精細で、効率よく作製する製造方法を提供することができる。   As described above, according to the method for manufacturing a mold structure according to the present invention, the uneven portion formed on the surface of the master is pressed against the imprint resist on the substrate to be processed, so that the shape of the uneven portion is reduced. By forming a concavo-convex pattern using the imprint resist that has been transferred and cured as a mask, a mold structure that duplicates the master can be produced. It is possible to provide a manufacturing method for efficiently producing a mold structure that transfers and forms a high-quality pattern on a discrete track medium or a patterned medium without passing through.

本発明のモールド構造体は、該モールド構造体上に形成された微細なパターンが、基板上のレジストに効率よく入り込み、高い歩留まりで前記基板上にパターンを形成することができるので、ディスクリートメディアの作製や、パターンドメディアの作製に好適である。   According to the mold structure of the present invention, the fine pattern formed on the mold structure can efficiently enter the resist on the substrate, and the pattern can be formed on the substrate with a high yield. It is suitable for production and production of patterned media.

図１は、本発明のモールド構造体の製造方法によって作製されたモールド構造体の構成を示す斜視図である。FIG. 1 is a perspective view showing a configuration of a mold structure manufactured by the method for manufacturing a mold structure of the present invention. 図２Ａは、本発明の第１の実施形態におけるモールド構造体の製造方法を示す断面図である。FIG. 2A is a cross-sectional view illustrating a method for manufacturing a mold structure according to the first embodiment of the present invention. 図２Ｂは、本発明の第１の実施形態におけるモールド構造体の製造方法を示す断面図である。FIG. 2B is a cross-sectional view illustrating the method for manufacturing the mold structure according to the first embodiment of the present invention. 図３Ａは、本発明の第２の実施形態におけるモールド構造体の製造方法を示す断面図である。FIG. 3A is a cross-sectional view illustrating a method for manufacturing a mold structure according to a second embodiment of the present invention. 図３Ｂは、本発明の第２の実施形態におけるモールド構造体の製造方法を示す断面図である。FIG. 3B is a cross-sectional view illustrating the method for manufacturing the mold structure according to the second embodiment of the present invention. 図４Ａは、本発明の第３の実施形態におけるモールド構造体の製造方法を示す断面図である。FIG. 4A is a cross-sectional view illustrating a method for manufacturing a mold structure according to a third embodiment of the present invention. 図４Ｂは、本発明の第３の実施形態におけるモールド構造体の製造方法を示す断面図である。FIG. 4B is a cross-sectional view illustrating the method for manufacturing the mold structure according to the third embodiment of the present invention. 図５Ａは、本発明の第４の実施形態におけるモールド構造体の製造方法を示す断面図である。FIG. 5A is a cross-sectional view illustrating a method for manufacturing a mold structure according to a fourth embodiment of the present invention. 図５Ｂは、本発明の第４の実施形態におけるモールド構造体の製造方法を示す断面図である。FIG. 5B is a cross-sectional view showing a method for manufacturing a mold structure in the fourth embodiment of the present invention. 図６Ａは、本発明の第５の実施形態におけるモールド構造体の製造方法を示す断面図である。FIG. 6A is a cross-sectional view illustrating a method for manufacturing a mold structure according to a fifth embodiment of the present invention. 図６Ｂは、本発明の第５の実施形態におけるモールド構造体の製造方法を示す断面図である。FIG. 6B is a cross-sectional view illustrating the method for manufacturing the mold structure according to the fifth embodiment of the present invention. 図７は、本発明のモールド構造体の製造方法によって作製されたモールド構造体を用いて磁気記録媒体を製造する製造方法を示す断面図である。FIG. 7 is a cross-sectional view showing a manufacturing method for manufacturing a magnetic recording medium using a mold structure manufactured by the method for manufacturing a mold structure of the present invention.

符号の説明Explanation of symbols

１ モールド構造体
２ 基板
３ 凸部
１０ Ｓｉ基板
１１ Ｓｉ原盤
２１ フォトレジスト
２２ 導電膜
２３ Ｎｉ基板
２４ インプリントレジスト層
３０ 石英基板
３１ 石英原盤
４０ 磁気記録媒体の基板
５０ 磁性層
１００ 磁気記録媒体 DESCRIPTION OF SYMBOLS 1 Mold structure 2 Substrate 3 Convex part 10 Si substrate 11 Si master 21 Photoresist 22 Conductive film 23 Ni substrate 24 Imprint resist layer 30 Quartz substrate 31 Quartz master 40 Magnetic recording medium substrate 50 Magnetic layer 100 Magnetic recording medium

Claims (6)

表面に凹凸部が形成された原盤を、光透過性を有する被加工基板の一方の表面に塗布されたインプリントレジストに対して、前記凹凸部側を押し当てて、前記凹凸部の形状を前記インプリントレジスト上に転写する転写工程と、
前記インプリントレジストを硬化させる硬化工程と、
該硬化工程において硬化したインプリントレジストをマスクにして前記被加工基板の一方の表面のエッチングを行い、前記被加工基板の一方の表面上に凹凸形状のパターンを形成するパターン形成工程とを有することを特徴とするモールド構造体の製造方法。 The master having a concavo-convex portion formed on the surface is pressed against the imprint resist applied to one surface of the substrate to be processed with light transmittance, and the concavo-convex portion side is pressed against A transfer process for transferring onto the imprint resist;
A curing step of curing the imprint resist;
A pattern forming step of etching one surface of the substrate to be processed by using the imprint resist cured in the curing step as a mask to form a concavo-convex pattern on the one surface of the substrate to be processed. The manufacturing method of the mold structure characterized by these. 原盤の材料が、Ｎｉ、Ｓｉ、及び石英の少なくともいずれかよりなる請求項１に記載のモールド構造体の製造方法。   The method for manufacturing a mold structure according to claim 1, wherein the material of the master disk is made of at least one of Ni, Si, and quartz. 硬化工程が、光及び熱の少なくともいずれかによってインプリントレジストを硬化させる工程である請求項１から２のいずれかに記載のモールド構造体の製造方法。   The method for producing a mold structure according to claim 1, wherein the curing step is a step of curing the imprint resist by at least one of light and heat. 被加工基板が、石英よりなる請求項１から３のいずれかに記載のモールド構造体の製造方法。   The method for manufacturing a mold structure according to any one of claims 1 to 3, wherein the substrate to be processed is made of quartz. 転写工程及び硬化工程の少なくともいずれかが、インプリント法によって行われる請求項１から４のいずれかに記載のモールド構造体の製造方法。   The method for producing a mold structure according to any one of claims 1 to 4, wherein at least one of the transfer step and the curing step is performed by an imprint method. パターンは、少なくとも所定間隔を有して複数の凸部が同心円状に形成されたパターンである請求項１から５のいずれかに記載のモールド構造体の製造方法。   The method for producing a mold structure according to claim 1, wherein the pattern is a pattern in which a plurality of convex portions are formed concentrically with a predetermined interval.
JP2006353294A 2006-12-27 2006-12-27 Manufacturing method of molded structure body Pending JP2008162101A (en)

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