JP2008153531A - Semiconductor light-emitting element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element whose property can be improved. <P>SOLUTION: A semiconductor laser 30 comprises a substrate 1, an AlGaN layer 2 formed on the upper surface 1a of the substrate 1, and a quantum well light-emitting layer 4 composed of InGaN formed on the AlGaN layer 2. The AlGaN layer 2 comprises a first AlGaN layer 2a and a second AlGaN layer 2b formed on the first AlGaN layer 2a. The Al density of the first AlGaN layer 2a is higher than the Al density of the second AlGaN layer 2b. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor light emitting device, and more particularly to a semiconductor light emitting device including a quantum well light emitting layer made of InGaN.

  A nitride semiconductor made of InGaN is well known as a material of a light emitting element that emits light in a wavelength region from an ultraviolet region to an infrared region. For example, Japanese Patent Laying-Open No. 2003-229638 (Patent Document 1) discloses a configuration of a light emitting element using InGaN. Specifically, an n-type AlGaN cladding layer, an n-type GaN first light guide layer, an InGaN active layer, a p-type InGaN second light guide layer, a p-type AlGaN cladding layer, and a p-type GaN on an n-type GaN substrate. A laminated structure in which contact layers are sequentially laminated is disclosed. The n-type AlGaN cladding layer and the p-type AlGaN cladding layer function as an optical confinement layer for laser oscillation.

  Similarly to Patent Document 1, light emitting elements using a nitride semiconductor made of InGaN as a light emitting layer are disclosed in, for example, Japanese Patent Laid-Open No. 2002-190635 (Patent Document 2) and Japanese Patent Laid-Open No. 11-191658 (Patent Document 3). JP-A-2005-39223 (Patent Document 4) and JP-A-2000-223743 (Patent Document 5). In particular, Patent Documents 2, 4 and 5 disclose a configuration in which an AlGaN layer is formed between a nitride semiconductor substrate such as GaN and an InGaN light emitting layer. Patent Document 4 discloses a configuration in which an AlGaN intermediate layer is formed between a GaN substrate and a GaN homoepitaxial layer formed on the GaN substrate. Patent Document 5 discloses a configuration in which a light emitting layer is formed on a GaN substrate having an upper surface inclined with respect to the C plane. Patent Document 3 discloses a configuration in which an AlGaN layer is formed between a sapphire substrate and an InGaN light emitting layer.

In particular, when a GaN substrate is used among the nitride semiconductor substrates, the GaN substrate includes a region having a high dislocation density, and the surface thereof is often contaminated. For this reason, it is difficult to form an epitaxial layer with high crystallinity on the GaN substrate, and there may be a region where the epitaxial layer does not grow on the GaN substrate. In order to solve such a problem, in Patent Document 4, an AlGaN layer having good wettability with a GaN substrate is formed on the GaN substrate, and a GaN homoepitaxial layer is formed on the AlGaN layer. Flatness is ensured. Further, since AlGaN has good wettability with the nitride semiconductor substrate, the growth surface of the epitaxial layer formed on the AlGaN layer can be flattened by forming the AlGaN layer.
JP 2003-229638 A JP 2002-190635 A JP 11-191658 A JP 2005-39223 A JP 2000-223743 A

  Al contained in the AlGaN layer has a property of growing without moving in the lateral direction (without selecting a lower layer). The good wettability between the AlGaN layer and the nitride semiconductor substrate is attributed to the properties of Al. Therefore, by increasing the Al concentration of the AlGaN layer, the growth surface of the epitaxial layer formed on the AlGaN layer becomes flatter, and characteristics of semiconductor light emitting devices such as light emitting diodes and semiconductor lasers (threshold values of the semiconductor laser and It is considered that the driving voltage can be improved.

  However, if the Al concentration of the AlGaN layer is high, the difference in lattice constant from the InGaN light emitting layer increases, and the crystallinity of the InGaN light emitting layer decreases. In addition, cracks are likely to occur in the AlGaN layer, and the AlGaN layer cannot be formed thick. If the AlGaN layer is thin, the crystallinity of the InGaN light emitting layer is lowered. In addition, in a semiconductor laser, if the AlGaN layer is thin, the leakage of emitted light to the substrate side becomes large, and the characteristics of the semiconductor laser deteriorate. In particular, since the nitride semiconductor substrate has a higher refractive index than the sapphire substrate, the emitted light tends to leak. For these reasons, there is a limit to improving the characteristics of the semiconductor light emitting device even if the Al content of the AlGaN layer is increased.

  Accordingly, an object of the present invention is to provide a semiconductor light emitting device capable of improving characteristics.

The semiconductor light emitting device of the present invention includes a nitride semiconductor substrate, an Al _s Ga _1-s N (0 <s ≦ 1) layer formed on one main surface of the nitride semiconductor substrate, an Al _s Ga _1- consisting of InGaN formed on the _s N layer and a quantum well active layer. Al concentration closest to the nitride semiconductor substrate at the Al _s Ga _1-s N layer is higher than the Al concentration of the portion nearest to the quantum well active layer in the Al _s Ga _1-s N layer.

According to the semiconductor light emitting device of the present invention, the Al _s Ga _1-s N layer has a high Al concentration in the portion closest to the nitride semiconductor substrate, so that Al _s Ga _{1-s is formed on one} main surface of the nitride semiconductor substrate. The N layer can easily grow normally, and the surface flatness of the epitaxial layer on the nitride semiconductor substrate can be improved. At the same time, since the Al concentration in the Al _s Ga _1-s N layer closest to the quantum well light emitting layer is low, the difference in lattice constant from the quantum well light emitting layer is reduced, and the crystallinity of the quantum well light emitting layer is improved. be able to. In addition, since the Al concentration of the portion nearest to the quantum well active layer in the Al _s Ga _1-s N layer is low, Al _s Ga _1-s N layer cracks hardly occur in, Al _s Ga _1-s N layer Can be formed thick. Thereby, when the semiconductor light emitting element is a semiconductor laser, it is possible to prevent leakage of emitted light to the nitride semiconductor substrate side and improve the light emission characteristics. Moreover, since the crystallinity fall of a quantum well light emitting layer can be prevented, the characteristic of a semiconductor light-emitting device can be improved.

In the semiconductor light emitting device of the present invention, the Al _s Ga _1-s N layer is preferably formed in contact with one main surface of the nitride semiconductor substrate.

As a result, the Al _s Ga _{1 -s} N layer can easily grow normally over the entire area of one main surface of the nitride semiconductor substrate, and the characteristics can be further improved.

In the semiconductor light emitting device of the present invention, preferably, the Al _s Ga _1-s N layer has a first AlGaN layer and a second AlGaN layer formed on the first AlGaN layer. The Al concentration of the first AlGaN layer is higher than the Al concentration of the second AlGaN layer.

  Thereby, the difference in lattice constant with the quantum well light emitting layer can be reduced by the second AlGaN layer while ensuring the surface flatness of the epitaxial layer on the nitride semiconductor substrate by the first AlGaN layer. In addition, when the second AlGaN layer is formed thick, when the semiconductor light emitting device is a semiconductor laser, leakage of the emitted light of the semiconductor laser to the nitride semiconductor substrate side can be prevented, and the characteristics of the semiconductor laser can be improved. it can.

In the semiconductor light emitting device of the present invention, preferably, the second AlGaN layer is made of Al _t Ga _1-t N (0 <t ≦ 0.05). By setting the Al composition of the second AlGaN layer to 5% or less, the characteristics can be further improved.

  In the semiconductor light emitting device of the present invention, the second AlGaN layer is preferably thicker than the first AlGaN layer.

  Since the second AlGaN layer has a low Al concentration, cracks are unlikely to occur even when the film thickness is increased. Therefore, increasing the thickness of the second AlGaN layer can further improve the crystallinity and prevent light leakage to the substrate side.

In the semiconductor light emitting device of the present invention, preferably, the Al concentration of the Al _s Ga _1-s N layer gradually decreases from the nitride semiconductor substrate side to the quantum well light emitting layer side. Thereby, the crystal quality of the quantum well light emitting layer can be improved while improving the surface flatness of the Al _s Ga _{1 -s} N layer.

In the semiconductor light emitting device of the present invention, preferably, the Al _s Ga _1-s N layer closest to the nitride semiconductor substrate is made of Al _s Ga _1-s N (0.05 ≦ s ≦ 1). By setting the Al composition closest to the nitride semiconductor substrate to 5% or more, the surface flatness of the Al _s Ga _1-s N layer is improved.

In the semiconductor light emitting device of the present invention, preferably, the Al _s Ga _1-s N layer closest to the quantum well light emitting layer is made of Al _s Ga _1-s N (0 <s <0.05). By making the Al composition in the portion closest to the quantum well light emitting layer less than 5%, the crystal quality of the quantum well light emitting layer is improved.

In the semiconductor light emitting device of the present invention, preferably, the nitride semiconductor substrate is made of Al _u Ga _1-u N (0 ≦ u ≦ 1).

  The substrate is suitable as a nitride semiconductor substrate because it is thermally stable and easy to manufacture.

  In the semiconductor light-emitting device of the present invention, preferably, the nitride semiconductor substrate has a low defect region having a relatively low defect density, and has a relatively high defect density, and a dot or line on one main surface of the nitride semiconductor substrate. And a defect concentration region distributed in a shape.

In the semiconductor light emitting device of the present invention, the dislocation density in the low defect region is preferably less than 1 × 10 ⁷ / cm ² .

  Thereby, a low defect area | region can be made into a light emission area | region, and the characteristic and reliability of a semiconductor light-emitting device can be improved further.

  According to the semiconductor light emitting device of the present invention, the characteristics of the semiconductor light emitting device can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a cross-sectional view showing a configuration of a semiconductor laser according to Embodiment 1 of the present invention. Referring to FIG. 1, a semiconductor laser 30 as a semiconductor light emitting device in the present embodiment includes a substrate 1 as a nitride semiconductor substrate, an AlGaN layer 2, an intermediate layer 3, a quantum well light emitting layer 4, and a guide. A layer 5, a p-type electron blocking layer 6, a p-type cladding layer 7, a p-type contact layer 8, an insulating layer 10, and electrodes 11 and 12 are provided.

The substrate 1 is made of a nitride semiconductor, and is made of, for example, Al _u Ga _1-u N (0 ≦ u ≦ 1). More specifically, the substrate 1 is made of AlN or GaN. On the upper surface 1a of the substrate 1, an AlGaN layer 2 is formed in contact with the upper surface 1a. An intermediate layer 3 made of In _v Ga _1-v N (0 ≦ v <1) is formed on the AlGaN layer 2. A quantum well light emitting layer 4 is formed on the intermediate layer 3. The quantum well light emitting layer 4 has a plurality of barrier layers and well layers (not shown). The barrier layers and the well layers are alternately formed in the stacking direction (vertical direction in FIG. 1). The well layer is made of In _w Ga _1-w N (0 <w <0.5), and the barrier layer is made of In _x Ga _1-x N (0 ≦ x <w). The carriers injected into the quantum well light emitting layer 4 are confined in the well layer by the energy barrier in the barrier layer.

FIG. 2 is a diagram showing an Al composition distribution in the AlGaN layer according to the first embodiment of the present invention. Referring to FIGS. 1 and 2, the AlGaN layer 2 is made of Al _s Ga _1-s N (0 <s ≦ 1), and includes a first AlGaN layer 2a and a second AlGaN layer 2b. The first AlGaN layer 2a is formed on the substrate 1 side, and the second AlGaN layer 2b is formed on the quantum well light emitting layer 4 side (on the first AlGaN layer 2a). The Al concentration of the first AlGaN layer 2a is higher than the concentration of the second AlGaN layer 2b. Specifically, the Al composition of the first AlGaN layer 2a is 12%, and the Al composition of the second AlGaN layer 2b is 3%. As a result, the Al concentration of the AlGaN layer 2 closest to the substrate 1 (interface with the substrate 1) is higher than the Al concentration of the portion closest to the quantum well light emitting layer 4 (interface with the intermediate layer 3). ing.

The second AlGaN layer 2b is preferably made of Al _t Ga _1-t N (0 <t ≦ 0.05), and the film thickness of the second AlGaN layer 2b is thicker than the film thickness of the first AlGaN layer 2a. Is preferred.

  Moreover, by making the film thickness of the first AlGaN layer 2a 500 nm or less, preferably 200 nm or less, it is possible to prevent the first AlGaN layer 2a from cracking. By setting the thickness of the first AlGaN layer 2a to 5 nm or more, preferably 20 nm or more, the AlGaN layer 2 can be uniformly formed on the GaN substrate.

  Furthermore, by setting the film thickness of the second AlGaN layer 2b to 400 nm or more, leakage of emitted light to the substrate 1 side can be effectively prevented, and by setting the film thickness of the second AlGaN layer 2b to 1 μm or more, The crystallinity of the quantum well light emitting layer 4 can be improved. By setting the film thickness of the second AlGaN layer 2b to 4 μm or less, it is possible to prevent the second AlGaN layer 2b from cracking, and by setting the film thickness of the second AlGaN layer 2b to 3 μm or less, the second AlGaN layer 2b Can be formed efficiently.

  Referring to FIG. 1, a guide layer 5 made of, for example, undoped GaN is formed on quantum well light-emitting layer 4, and a p-type electron block layer 6 made of, for example, AlGaN is formed on guide layer 5. . A p-type cladding layer 7 made of AlGaN is formed on the p-type electron blocking layer 6, and a p-type contact layer 8 made of GaN is formed on the p-type cladding layer 7. An insulating layer 10 having an opening 10 a is formed on the p-type contact layer 8. An electrode 12 is formed on the insulating layer 10 so as to fill the opening 10a. The electrode 12 is in direct contact with the insulating layer 10. An electrode 11 is formed on the lower surface 1 b of the substrate 1.

  In the semiconductor laser 30 of the present embodiment, when a predetermined potential is applied to the electrode 11 (p electrode) and the electrode 12 (n electrode), a voltage is generated between the electrode 11 and the electrode 12, and the second AlGaN layer 2b. Then, carriers are injected from each of the p-type cladding layers 7 into the quantum well light emitting layer 4. Then, the injected carriers are recombined in the quantum well light emitting layer, and light is emitted. This light is emitted in the direction perpendicular to the paper surface from the end face of the quantum well light emitting layer.

  Next, a method for manufacturing a semiconductor laser in the present embodiment will be described with reference to FIGS.

  First, referring to FIG. 3, on the upper surface 1a of the substrate 1, a first AlGaN layer 2a, a second AlGaN layer 2b, an intermediate layer 3, a quantum well light emitting layer 4, a guide layer 5, and a p-type electron block. The layer 6, the p-type cladding layer 7, and the p-type contact layer 8 are epitaxially grown in this order. These layers are formed using, for example, MOCVD (metal organic chemical vapor deposition).

  Here, the first AlGaN layer 2a and the second AlGaN layer 2b are formed by changing the concentration of Al-containing gas and the growth temperature. Further, the barrier layer and the well layer in the quantum well light emitting layer 4 are formed by periodically changing the concentration of the gas containing In.

  Next, referring to FIG. 4, insulating layer 10 is formed on p-type contact layer 8. Subsequently, a resist (not shown) is formed on the insulating layer 10, and the insulating layer 10 is etched using the resist as a mask. As a result, an opening 10 a is formed at a predetermined position of the insulating layer 10.

  Next, referring to FIG. 5, an electrode 12 is formed on insulating layer 10 so as to fill opening 10a. Subsequently, an electrode 11 is formed on the lower surface 1 b of the substrate 1. Thereafter, the substrate 1 is diced along the line AA in the figure, and separated into individual semiconductor lasers. Through the above steps, the semiconductor laser 30 shown in FIG. 1 is obtained.

  The semiconductor laser 30 in the present embodiment includes a substrate 1, an AlGaN layer 2 formed on the upper surface 1 a of the substrate 1, and a quantum well light-emitting layer 4 made of InGaN formed on the AlGaN layer 2. . The Al concentration in the AlGaN layer 2 closest to the substrate 1 is higher than the Al concentration in the AlGaN layer 2 closest to the quantum well light-emitting layer 4.

  According to the semiconductor laser 30 in the present embodiment, since the Al concentration of the first AlGaN layer 2a in the portion closest to the substrate 1 is high, the surface flatness of the epitaxial layer can be improved. At the same time, since the Al concentration of the second AlGaN layer 2b closest to the quantum well light emitting layer 4 is low, the difference in lattice constant with the quantum well light emitting layer 4 is reduced, and the crystallinity of the quantum well light emitting layer 4 is improved. be able to. In addition, cracks are unlikely to occur in the AlGaN layer 2, and the AlGaN layer 2 can be formed thick. Thereby, leakage of emitted light to the substrate 1 side can be prevented, and deterioration of crystallinity of the quantum well light emitting layer 4 can be prevented. As a result, the light emission characteristics of the semiconductor laser can be improved.

  Further, since the AlGaN layer 2 is formed in contact with the upper surface 1a of the substrate 1, the AlGaN layer 2 is likely to grow normally over the entire upper surface 1a of the substrate 1, and the light emission characteristics of the semiconductor laser can be further improved. .

  The AlGaN layer 2 includes a first AlGaN layer 2a and a second AlGaN layer 2b formed on the first AlGaN layer 2a. The Al concentration of the first AlGaN layer 2a is higher than the Al concentration of the second AlGaN layer 2b. . Thereby, the difference in lattice constant with the quantum well light-emitting layer 4 can be reduced by the second AlGaN layer 2b while the wettability with the substrate 1 is ensured by the first AlGaN layer 2a. In addition, by forming the second AlGaN layer 2b thick, leakage of emitted light to the substrate 1 side can be prevented and the light emission characteristics of the semiconductor laser can be improved.

  The film thickness of the second AlGaN layer 2b is thicker than the film thickness of the first AlGaN layer 2a. Thereby, even if the thickness of the second AlGaN layer 2b is increased, cracks are less likely to occur, and the crystallinity of the quantum well light-emitting layer 4 can be further improved.

Furthermore, since the substrate 1 is made of Al _u Ga _1-u N (0 ≦ u ≦ 1), the substrate 1 can be easily manufactured.

(Embodiment 2)
FIG. 6 is a cross-sectional view showing the configuration of the semiconductor laser according to the second embodiment of the present invention. Referring to FIG. 6, semiconductor laser 30 in the present embodiment differs from the semiconductor laser in the first embodiment in the composition distribution of AlGaN layer 2.

  FIG. 7 is a diagram showing an Al composition distribution in the AlGaN layer in the second embodiment of the present invention. Referring to FIGS. 6 and 7, the Al concentration in AlGaN layer 2 gradually decreases at a constant rate from the boundary surface with substrate 1 to the boundary surface with intermediate layer 3. Specifically, the Al composition is reduced from 12% to 3%. For this reason, the AlGaN layer 2 of this Embodiment is comprised by one layer. Further, the Al composition distribution of the AlGaN layer 2 may be as shown in FIG. 8, for example, in addition to the case shown in FIG. 6 and 8, the Al concentration in the AlGaN layer 2 decreases from the boundary surface with the substrate 1, reaches a minimum value at a certain position in the AlGaN layer 2, and increases toward the boundary surface with the intermediate layer 3. ing. 7 and FIG. 8, the Al concentration of the AlGaN layer 2 closest to the substrate 1 (interface with the substrate 1) is close to the quantum well light-emitting layer 4 (boundary with the intermediate layer 3). Surface) is higher than the Al concentration.

  Since the other configuration, operation, and manufacturing method of semiconductor laser 30 are the same as those of the semiconductor laser according to the first embodiment, the same components are denoted by the same reference numerals, and description thereof will not be repeated.

  According to the semiconductor laser 30 in the present embodiment, the same effect as that of the semiconductor laser in the first embodiment can be obtained.

(Embodiment 3)
FIG. 9 is a diagram schematically showing a substrate used in the semiconductor laser according to the third embodiment of the present invention. (A) is a perspective view, (b) is sectional drawing which follows the IXB-IXB line | wire of (a). Referring to FIGS. 9A and 9B, substrate 1 in the present embodiment has low defect region 50 and defect concentration region 51 which is a region having a higher defect density than low defect region 50. is doing. The defect concentration regions 51 are distributed in the form of dots on the upper surface 1a of the substrate 1 and penetrate the substrate 1 in the thickness direction (vertical direction in FIG. 9B).

  In FIGS. 9A and 9B, the boundary line between the low defect region 50 and the defect concentration region 51 is indicated by a solid line, but the boundary between the low defect region 50 and the defect concentration region 51 is Actually there is no such line.

  The substrate 1 in the present embodiment is one in which defects in other regions are reduced by concentrating defects in a certain region during manufacturing. Since the semiconductor laser 30 includes such a substrate 1, the low defect region 50 can be used as a light emitting region, and the light emission characteristics of the semiconductor laser can be further improved.

  As the substrate in the present embodiment, the defect concentration region 51 is linearly formed on the upper surface 1a as shown in FIG. 10 in addition to the case where the defect concentration region 51 is distributed in a dot shape as shown in FIG. It may be distributed.

  In this example, the semiconductor laser of Example 1 of the present invention and the semiconductor laser of Comparative Example 1 were manufactured, and the emission characteristics of each semiconductor laser were examined. The semiconductor laser of Example 1 of the present invention was manufactured by the following manufacturing method.

Invention Example 1: A semiconductor laser was manufactured according to the manufacturing method shown in the first embodiment. First, an n-type GaN (0001) substrate having a low defect region having a threading dislocation density of less than 1 × 10 ⁶ cm ⁻² and a defect concentration region distributed linearly is prepared and formed on a susceptor in a film forming apparatus. Arranged. Subsequently, ammonia and hydrogen were introduced while controlling the internal pressure of the apparatus at 30 kPa, and cleaning was performed for 10 minutes while the substrate was heated to 1050 ° C. Subsequently, the substrate temperature was raised to 1100 ° C., and trimethylgallium (24 μmol / min), trimethylaluminum (4.3 μmol / min), ammonia, and monosilane were introduced into the apparatus mainly using hydrogen as a carrier gas. Thereby, an n-type first AlGaN layer (Al composition 12%) having a thickness of 50 μm was grown. Next, with the substrate temperature maintained at 1100 ° C., the carrier gas was mainly hydrogen, and trimethylgallium (99 μmol / min), trimethylaluminum (8.2 μmol / min), ammonia, and monosilane were introduced into the apparatus. Thereby, an n-type second AlGaN cladding layer (Al composition 3%) having a thickness of 2 μm was grown. Next, with the substrate temperature kept at 1100 ° C., the carrier gas was mainly hydrogen, and trimethylgallium and ammonia were introduced into the apparatus to grow a 3 nm thick non-doped GaN intermediate layer. Next, the layer growth was temporarily stopped, the substrate temperature was raised to 880 ° C., and trimethylgallium, trimethylindium, and ammonia were introduced into the apparatus mainly using nitrogen as a carrier gas. As a result, a non-doped InGaN barrier layer (In composition 1%) having a thickness of 15 nm was grown. Thereafter, the substrate temperature was lowered to 800 ° C., and trimethylgallium, trimethylindium, and ammonia were introduced into the apparatus mainly using nitrogen as a carrier gas. Thereby, a 3 nm-thick non-doped InGaN well layer (In composition 8%) was grown. By repeating the step of forming the non-doped InGaN barrier layer and the step of forming the non-doped InGaN well layer, a three-period quantum well light-emitting layer was formed.

  Next, the layer growth was temporarily interrupted, the substrate temperature was raised to 1050 ° C., and then trimethylgallium and ammonia were introduced into the apparatus mainly using hydrogen as a carrier gas. Thereby, a non-doped GaN guide layer having a thickness of 100 nm was grown. Subsequently, trimethylgallium, trimethylaluminum, ammonia, and cyclopentadienylmagnesium were introduced into the apparatus mainly using hydrogen as a carrier gas. Thereby, a p-type AlGaN electron block layer (Al composition 18%) having a thickness of 20 nm was grown. Thereafter, trimethylgallium, trimethylaluminum, ammonia, and cyclopentadienylmagnesium were introduced into the apparatus mainly using hydrogen as a carrier gas. As a result, a p-type AlGaN cladding layer (Al composition 7%) having a thickness of 150 nm was grown. Next, trimethylgallium, ammonia, and cyclopentadienylmagnesium were introduced into the apparatus mainly using hydrogen as a carrier gas. As a result, a p-type GaN contact layer having a thickness of 50 nm was grown.

  Thereafter, the substrate was taken out from the film forming apparatus, and the surface of the p-type contact layer was observed using an optical microscope. As a result, good surface flatness was obtained. Next, an insulating film was formed on the p-type GaN contact layer, an opening having a width of 5 μm was opened in the insulating film by etching, and a p-electrode made of Ni / Au was formed. Next, after reducing the thickness of the GaN substrate, an n-type electrode was formed on the lower surface of the substrate. Thereafter, dicing into a bar having a length of 800 μm was performed to form an end face mirror. The semiconductor laser (blue-violet light emitting element) of FIG. 1 was obtained by the above method.

The semiconductor laser of Comparative Example 1 was manufactured by the following manufacturing method.
Comparative Example 1: In the manufacturing method of Invention Example 1, instead of forming the first and second AlGaN layers, an n-type AlGaN layer (Al composition 7%) having a thickness of 0.6 μm was formed. When forming the n-type AlGaN layer, the carrier gas is mainly nitrogen while keeping the substrate temperature at 1100 ° C., trimethylgallium (49 μmol / min), trimethylaluminum (4.0 μmol / min), ammonia, and Monosilane was introduced into the apparatus. Except for this, a semiconductor laser (blue-violet light emitting device) was manufactured in the same manner as in Example 1 of the present invention.

  When a pulse current was applied at room temperature to each of the semiconductor laser of Example 1 of the present invention and the semiconductor laser of Comparative Example 1 thus obtained, laser oscillation was observed. The slope efficiency was 1.0 W / A in Invention Example 1 and 0.4 W / A in Comparative Example 1. From these results, it can be seen that according to the present invention, the light emission characteristics of the semiconductor laser can be improved.

  In this example, the relationship between the Al composition of the second AlGaN layer and the PL (photoluminescence) intensity in the semiconductor laser of FIG. 1 was examined. Specifically, a semiconductor laser was manufactured by the following method. First, an n-type GaN (0001) substrate was prepared and cleaned by the same method as Example 1 of the present invention. Then, an n-type first AlGaN layer, an n-type second AlGaN cladding layer, a non-doped GaN intermediate layer, a three-period quantum well light-emitting layer, and a non-doped GaN guide layer were formed on the n-type GaN (0001) substrate. When forming the n-type second AlGaN cladding layer, the Al composition of the n-type second AlGaN cladding layer was adjusted by changing each of the supply amount of trimethylgallium and the supply amount of trimethylaluminum.

Thereafter, the substrate was taken out from the film forming apparatus, and the quantum well structure was irradiated with a He—Cd laser having a wavelength of 325 nm, and the intensity of PL from the quantum well structure was observed. FIG. 11 is a diagram showing the relationship between the Al composition of the second AlGaN layer and the PL intensity in Example 2 of the present invention. Referring to FIG. 11, it can be seen that when the Al composition of the second AlGaN layer is 5% or less, the PL intensity is dramatically improved. As described above, the second AlGaN layer is preferably made of Al _t Ga _1-t N (0 <t ≦ 0.05).

  In this example, the effect of forming the AlGaN layer in contact with one main surface of the substrate was examined. The semiconductor laser of Example 2 of the present invention was manufactured by the following manufacturing method.

  Invention Example 2: First, an n-type GaN (0001) substrate was prepared and cleaned by the same method as in Invention Example 1. Subsequently, the substrate temperature was raised to 1100 ° C., and trimethylgallium, ammonia, and monosilane were introduced into the apparatus mainly using hydrogen as a carrier gas. Thereby, an n-type GaN buffer layer having a thickness of 2 μm was formed. Thereafter, in the same manner as in Example 1, the n-type first AlGaN layer, the n-type second AlGaN cladding layer, the non-doped GaN intermediate layer, the three-period quantum well light emitting layer, the non-doped GaN guide layer, the p-type AlGaN electron blocking layer, A p-type AlGaN cladding layer and a p-type GaN contact layer were formed on the n-type GaN buffer layer.

  Thereafter, the substrate was taken out from the film forming apparatus and the surface of the p-type contact layer was observed using an optical microscope. As a result, a certain degree of surface flatness was obtained. Next, an insulating film, a p-electrode, and an n-type electrode were formed by the same method as in Invention Example 1. Through the above steps, a semiconductor laser (blue-violet light emitting element) was obtained.

  When a pulse current was applied at room temperature to the thus obtained semiconductor laser of Example 2 of the present invention, laser oscillation was observed. The slope efficiency was 0.6 W / A. From the results of Invention Example 1 and Invention Example 2, it can be seen that the emission characteristics can be improved by forming the AlGaN layer in contact with one main surface of the substrate.

  In this example, the semiconductor laser of Example 3 of the present invention was examined. The semiconductor laser of Example 3 of the present invention was manufactured by the following manufacturing method.

  Invention Example 3: A semiconductor laser was manufactured according to the manufacturing method shown in the second embodiment. First, an n-type GaN (0001) substrate was prepared and cleaned by the same method as Example 1 of the present invention. Subsequently, the substrate temperature was raised to 1100 ° C., and trimethylgallium, trimethylaluminum, ammonia, and monosilane were introduced into the apparatus mainly using hydrogen as a carrier gas. Thereby, an n-type AlGaN layer having a thickness of 0.6 μm was grown. When forming the n-type AlGaN layer, the supply amount of trimethylgallium and the supply amount of trimethylaluminum were changed as follows. At the start of AlGaN layer growth, the supply amount of trimethylgallium was 24 μmol / min, and the supply amount of trimethylaluminum was 4.3 μmol / min. As a result, the Al composition of the AlGaN layer at the start of growth was set to 12%. As the AlGaN layer grows, the supply amount of trimethylgallium and trimethylaluminum is increased. At the end of the growth of the AlGaN layer, the supply amount of trimethylgallium is 99 μmol / min, and the supply amount of trimethylaluminum is 8.2 μmol / min. did. As a result, the Al composition of the AlGaN layer at the end of growth was set to 12%. It took 20 minutes to form the AlGaN layer. Thereafter, in the same manner as in Invention Example 1, a non-doped GaN intermediate layer, a three-period quantum well light-emitting layer, a non-doped GaN guide layer, a p-type AlGaN electron blocking layer, a p-type AlGaN cladding layer, and a p-type GaN contact layer are formed. It was formed on an AlGaN layer.

  Thereafter, the substrate was taken out from the film forming apparatus, and the surface of the p-type contact layer was observed using an optical microscope. As a result, good surface flatness was obtained. Next, an insulating film, a p-electrode, and an n-type electrode were formed by the same method as in Invention Example 1. Through the above steps, a semiconductor laser (blue-violet light emitting element) was obtained.

  When a pulse current was applied at room temperature to the thus obtained semiconductor laser of Example 3 of the present invention, laser oscillation was observed. The slope efficiency was 1.2 W / A. From the results of Invention Example 3 and Comparative Example 1, it can be seen that according to the present invention, the emission characteristics of the semiconductor laser can be improved.

  It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is sectional drawing which shows the structure of the semiconductor laser in Embodiment 1 of this invention. It is a figure which shows Al composition distribution in the AlGaN layer in Embodiment 1 of this invention. It is sectional drawing which shows the 1st process of the manufacturing method of the semiconductor laser in Embodiment 1 of this invention. It is sectional drawing which shows the 2nd process of the manufacturing method of the semiconductor laser in Embodiment 1 of this invention. It is sectional drawing which shows the 3rd process of the manufacturing method of the semiconductor laser in Embodiment 1 of this invention. It is sectional drawing which shows the structure of the semiconductor laser in Embodiment 2 of this invention. It is a figure which shows Al composition distribution in the AlGaN layer in Embodiment 2 of this invention. It is a figure which shows the modification of Al composition distribution in the AlGaN layer in Embodiment 2 of this invention. It is the figure which showed typically the board | substrate used for the semiconductor laser in Embodiment 3 of this invention. (A) is a perspective view, (b) is sectional drawing which follows the IXB-IXB line | wire of (a). It is the figure which showed typically the other example of the board | substrate used for the semiconductor laser in Embodiment 3 of this invention. It is a figure which shows the relationship between Al composition of 2nd AlGaN layer in Example 2 of this invention, and PL intensity | strength.

Explanation of symbols

  1 substrate, 1a substrate upper surface, 1b substrate lower surface, 2 AlGaN layer, 2a first AlGaN layer, 2b second AlGaN layer, 3 intermediate layer, 4 quantum well light emitting layer, 5 guide layer, 6 p-type electron blocking layer, 7 p-type cladding Layer, 8 p-type contact layer, 10 insulating layer, 10a opening, 11, 12 electrode, 30 semiconductor laser, 50 low defect region, 51 defect concentration region.

Claims (11)

A nitride semiconductor substrate;
An Al _s Ga _1-s N (0 <s ≦ 1) layer formed on one main surface of the nitride semiconductor substrate;
A quantum well light emitting layer made of InGaN formed on the Al _s Ga _1-s N layer,
Al concentration in the portion closest to the nitride semiconductor substrate in the Al _s Ga _1-s N layer is higher than the Al concentration of the portion closest to the quantum well active layer in the Al _s Ga _1-s N layer A semiconductor light emitting device characterized by the above. 2. The semiconductor light emitting device according to claim 1, wherein the Al _s Ga _1-s N layer is formed in contact with the one main surface. The Al _s Ga _1-s N layer has a first AlGaN layer and a second AlGaN layer formed on the first AlGaN layer, and the Al concentration of the first AlGaN layer is higher than the Al concentration of the second AlGaN layer. The semiconductor light emitting element according to claim 1, wherein the semiconductor light emitting element is characterized in that Wherein the 2AlGaN layer is characterized by consisting of _{Al t Ga 1-t N (} 0 <t ≦ 0.05), the semiconductor light emitting device according to claim 3.   5. The semiconductor light emitting device according to claim 3, wherein a film thickness of the second AlGaN layer is larger than a film thickness of the first AlGaN layer. 6. 3. The semiconductor light emitting element according to claim 1, wherein the Al concentration of the Al _s Ga _1-s N layer gradually decreases from the nitride semiconductor substrate side to the quantum well light emitting layer side. The semiconductor light emitting element according to claim 6, wherein a portion of the Al _s Ga _1-s N layer closest to the nitride semiconductor substrate is made of Al _s Ga _1-s N (0.05 ≦ s ≦ 1). The Al _s Ga _1-s portion closest to the quantum well active layer in the N layer is made of _{Al s Ga 1-s N (} 0 <s <0.05), the semiconductor light emitting device according to claim 6 or 7 . The semiconductor light emitting device according to claim 1, wherein the nitride semiconductor substrate is made of Al _u Ga _1-u N (0 ≦ u ≦ 1).   The nitride semiconductor substrate has a low defect region with a relatively low defect density and a defect concentration region with a relatively high defect density and distributed in a dotted or linear manner on the one main surface. The semiconductor light-emitting device according to claim 1. 11. The semiconductor light emitting device according to claim 10, wherein the dislocation density of the low defect region is less than 1 × 10 ⁷ pieces / cm ² .

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