JP2008098499A - Electronic component feeder - Google Patents

Electronic component feeder Download PDF

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JP2008098499A
JP2008098499A JP2006280124A JP2006280124A JP2008098499A JP 2008098499 A JP2008098499 A JP 2008098499A JP 2006280124 A JP2006280124 A JP 2006280124A JP 2006280124 A JP2006280124 A JP 2006280124A JP 2008098499 A JP2008098499 A JP 2008098499A
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tape
electronic component
edge
cover tape
component supply
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Daisaku Sagara
大策 相良
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Juki Corp
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Juki Corp
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Priority to CNA2007101628376A priority patent/CN101163391A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component feeder from which a cover tape is excellently peeled even when the width of a gap of an edge part for separating the cover tape and an edge part opposing edge becomes small. <P>SOLUTION: A peeling means 16 is constituted of a projection part 34 for separation and a projection part 36 for protection. The projection part 34 for separation is provided with the edge part 34A for separating the cover tape 24 on the distal end. The projection part 36 for protection is provided with the edge part facing edge 36A provided with a prescribed gap facing the edge part 34A in the direction of feeding an electronic component supply tape 20, and protects a carrier tape 22 where an electronic component 26 is exposed by the separation of the cover tape 24. The width W<SB>34A</SB>of the edge part 34A is made smaller than the interval L of two columns of adhesion parts 30. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子部品をプリント基板に実装する電子部品実装装置に電子部品を供給する電子部品供給装置に関し、さらに詳しくは電子部品を収納室に保持した電子部品供給テープを用いて電子部品を供給する電子部品供給装置に関する。   The present invention relates to an electronic component supply device that supplies an electronic component to an electronic component mounting apparatus that mounts the electronic component on a printed circuit board. More specifically, the electronic component is supplied using an electronic component supply tape that holds the electronic component in a storage chamber. The present invention relates to an electronic component supply apparatus.

電子部品を収納室に保持した電子部品供給テープを用いて電子部品を供給する電子部品供給装置において、カバーテープ（トップテープとも称する）をキャリアテープから分離する手段としては、図７に示すように、テープガイドに設けられたスリット４４にカバーテープ２４を挿入し、キャリアテープ２２の送り方向と反対側（送り方向上流側）のスリット端面（エッジ部４０）でカバーテープ２４をキャリアテープ２２から剥離させる技術が知られている。   In an electronic component supply apparatus that supplies an electronic component using an electronic component supply tape that holds the electronic component in a storage chamber, as means for separating the cover tape (also referred to as a top tape) from the carrier tape, as shown in FIG. The cover tape 24 is inserted into the slit 44 provided in the tape guide, and the cover tape 24 is peeled off from the carrier tape 22 at the slit end surface (edge portion 40) opposite to the feeding direction of the carrier tape 22 (upstream in the feeding direction). The technology to make it known is known.

特許文献１には、キャリアテープ送り方向側（送り方向下流側）のスリット端面（エッジ部対向縁４２）を、キャリアテープ２２上の電子部品２６の移動軌跡上に中心を持つ任意の曲率の円弧形状に形成することで、格納凹部（収納室２８）内での電子部品２６の回転や立ち上がりなどの発生を防止する技術が記載されている。   Patent Document 1 discloses an arc having an arbitrary curvature centered on the movement trajectory of the electronic component 26 on the carrier tape 22 with the slit end surface (edge facing edge 42) on the carrier tape feeding direction side (downstream side in the feeding direction). A technique for preventing the electronic component 26 from rotating or rising in the storage recess (the storage chamber 28) by forming the shape is described.

また、公知ではないが、本発明者の先行出願（出願番号：２００５−５９７７３）においては、図８に示すように、カバーテープ２４をキャリアテープ２２から剥離させる際に、スリット端面（エッジ部対向縁４６）に紙繊維が付着しないようにするために、カバーテープ２４をキャリアテープ２２から剥離させるエッジ部４０と対向するエッジ部対向縁４６に、カバーテープ２４を貼り付けるためのキャリアテープ接着部３０の間隔Ｌよりも短い長さの直線部を形成した突出部を備えさせた技術を提案している。   Although not known, in the prior application of the present inventor (application number: 2005-59773), as shown in FIG. 8, when the cover tape 24 is peeled from the carrier tape 22, the slit end face (facing the edge portion) In order to prevent the paper fibers from adhering to the edge 46), the carrier tape bonding portion for attaching the cover tape 24 to the edge portion facing edge 46 that faces the edge portion 40 that peels the cover tape 24 from the carrier tape 22. The technique which provided the protrusion part which formed the linear part of the length shorter than the space | interval L of 30 is proposed.

特開平１１−５４９８９号公報Japanese Patent Laid-Open No. 11-54989

しかしながら、カバーテープ２４を分離するエッジ部４０と、このエッジ部４０と対向するエッジ部対向縁４２との隙間の幅Ｗ（図９参照）は、供給する電子部品の飛び出しや転がりを防止するため、該電子部品のテープ送り方向の幅よりも小さくしなければならず、供給する電子部品のサイズが小さくなればなるほど、隙間の幅Ｗは小さくする必要がある。   However, the width W (see FIG. 9) of the gap between the edge portion 40 that separates the cover tape 24 and the edge portion facing edge 42 that faces the edge portion 40 prevents the supplied electronic component from popping out or rolling. The width W of the gap needs to be reduced as the size of the electronic component to be supplied becomes smaller.

このため、極めて小さな電子部品を供給する場合は、隙間の幅Ｗも極めて小さくする必要があり、この場合、前記技術においても、図１０に示すように、カバーテープ２４がエッジ部対向縁４２の下側にもぐり込み、カバーテープ２４の剥離ができなくなってしまうことがあった。   For this reason, when supplying an extremely small electronic component, it is necessary to make the width W of the gap very small. In this case, as shown in FIG. In some cases, the cover tape 24 could not be peeled off due to the lower side.

本発明はかかる問題点に鑑みてなされたものであって、カバーテープを分離するエッジ部とエッジ部対向縁との隙間の幅が小さくなっても、良好にカバーテープの剥離がなされる電子部品供給装置を提供することを目的とする。   The present invention has been made in view of such problems, and even when the width of the gap between the edge portion separating the cover tape and the edge facing the edge portion is reduced, the cover tape can be peeled off satisfactorily. An object is to provide a supply device.

本発明者は、前記課題を解決するため鋭意研究した結果、カバーテープにわずかな伸びやたるみが生じると、カバーテープのうち、キャリアテープの２列の接着部に貼り付いている部分の剥離が遅れ、その部分がエッジ部対向縁の下側にもぐり込み、カバーテープの剥離ができなくなってしまうことがあることを見出した。カバーテープがエッジ部対向縁の下側にもぐり込む現象は、カバーテープを分離するエッジ部と、このエッジ部と対向するエッジ部対向縁との隙間の幅が小さいときにより起こりやすかった。   As a result of intensive research to solve the above problems, the present inventor has peeled off the portion of the cover tape that is attached to the adhesive portions of the two rows of the carrier tape when slight elongation or sagging occurs in the cover tape. It has been found that there is a case where the portion of the cover tape digs into the lower side of the edge opposite to the edge and the cover tape cannot be peeled off. The phenomenon in which the cover tape sunk into the lower side of the edge facing the edge portion is more likely to occur when the width of the gap between the edge portion separating the cover tape and the edge portion facing edge facing the edge portion is small.

従来の電子部品供給装置においては、図７に示すように、カバーテープ２４を分離するエッジ部４０の幅Ｗ40は、２列の接着部３０の間隔Ｌよりも大きいため、カバーテープ２４がエッジ部４０を通過するまでは、カバーテープ２４がエッジ部４０により押さえられ、カバーテープ２４をキャリアテープ２２上の２列の接着部３０から剥離させようとする力は発生しない。このため、カバーテープ２４の剥離は、カバーテープ２４がエッジ部４０を通過した後、カバーテープの剥離のために設けられたスリット４４の区間でのみ剥離がなされなければならなかった。一方、前述した通り、電子部品サイズが小さくなればなるほど、スリット幅も小さくしなければならない。 In the conventional electronic component supply apparatus, as shown in FIG. 7, the width W 40 of the edge portion 40 that separates the cover tape 24 is larger than the interval L between the two rows of the adhesive portions 30, so Until the portion 40 passes, the cover tape 24 is pressed by the edge portion 40, and no force is generated to peel the cover tape 24 from the two rows of adhesive portions 30 on the carrier tape 22. For this reason, the cover tape 24 has to be peeled only in the section of the slit 44 provided for peeling the cover tape after the cover tape 24 has passed through the edge portion 40. On the other hand, as described above, the smaller the electronic component size, the smaller the slit width must be.

以上のことから、カバーテープの剥離がわずかでも遅れると、図１０に示すように、カバーテープ２４がエッジ部対向縁４２の下にもぐり込み、カバーテープ２４の剥離ができなくなってしまうことがあった。そこで、これに対する対策を考究し、カバーテープ２４を分離するエッジ部４０の幅Ｗ40をキャリアテープ２２上の２列の接着部３０の間隔よりも小さくすることに思い至り、本発明をするに至った。 From the above, if the peeling of the cover tape is delayed even slightly, the cover tape 24 may go under the edge portion facing edge 42 as shown in FIG. 10 and the cover tape 24 may not be peeled off. It was. Therefore, a countermeasure against this is studied, and the width W 40 of the edge portion 40 separating the cover tape 24 is conceived to be smaller than the interval between the two rows of the adhesive portions 30 on the carrier tape 22, and the present invention is carried out. It came.

即ち、本発明に係る電子部品供給装置は、電子部品を収納する収納室が多数設けられて長手方向に前記収納室の列が形成されている帯状のキャリアテープ、前記収納室に収納された電子部品、前記キャリアテープ上で前記収納室の前記列の両側に所定の間隔を有して設けられた２列の接着部、及び該２列の接着部に接着して前記電子部品を前記収納室内に封入するカバーテープ、を有してなる電子部品供給テープと、該電子部品供給テープを間欠的又は連続的に送る駆動手段と、前記電子部品供給テープの前記カバーテープを前記キャリアテープから分離する剥離手段と、分離した前記カバーテープを巻き取る巻き取り手段と、を備えてなり、前記剥離手段は、前記カバーテープを前記キャリアテープから分離するエッジ部と、前記電子部品供給テープを送る方向に前記エッジ部と対向して所定の間隙を有して設けられたエッジ部対向縁と、を有し、前記エッジ部の幅が前記キャリアテープ上の前記２列の接着部の間隔よりも小さいことを特徴とする。   That is, the electronic component supply apparatus according to the present invention includes a strip-shaped carrier tape in which a large number of storage chambers for storing electronic components are provided and a row of the storage chambers is formed in the longitudinal direction, and an electronic device stored in the storage chamber. Parts, two rows of adhesive portions provided on both sides of the row of the storage chambers on the carrier tape at a predetermined interval, and the electronic components are bonded to the two rows of adhesive portions by attaching the electronic components to the storage chamber An electronic component supply tape comprising: a cover tape enclosed in the housing; drive means for intermittently or continuously sending the electronic component supply tape; and the cover tape of the electronic component supply tape is separated from the carrier tape. A peeling means; and a winding means for winding the separated cover tape; and the peeling means comprises an edge portion for separating the cover tape from the carrier tape, and the electronic component. Edge facing edges provided with a predetermined gap facing the edge portion in the feeding direction of the feeding tape, and the width of the edge portion is the two rows of adhesive portions on the carrier tape It is smaller than the interval.

ここで、２列の接着部の間隔とは、２列の接着部の間の領域の幅のことである。   Here, the interval between the two rows of bonding portions is the width of the region between the two rows of bonding portions.

また、カバーテープがエッジ部対向縁の下側にもぐり込む現象の発生をより防止するため、前記エッジ部対向縁の幅も、前記キャリアテープ上の前記２列の接着部の間隔よりも小さくすることが好ましい。   Further, in order to further prevent the occurrence of a phenomenon in which the cover tape digs down below the edge facing the edge, the width of the edge facing edge is also made smaller than the interval between the two rows of adhesive portions on the carrier tape. Is preferred.

本発明によれば、カバーテープをキャリアテープから分離するエッジ部の幅が、キャリアテープ上の２列の接着部の間隔よりも小さいので、カバーテープが前記エッジ部を通過する時に発生する張力により、剥離用の前記エッジ部より手前で、カバーテープをキャリアテープ上の２列の接着部から分離させようとする力が発生する。このため、キャリアテープ上の２列の接着部に接着されたカバーテープの分離の時期も早まり、カバーテープがエッジ部対向縁の下側にもぐり込む現象の発生が防止される。その結果、部品吸着に対する信頼性を向上させることができるとともに、吸着位置のズレによる部品の損失を減少させることができ、生産性の向上へとつながる。   According to the present invention, since the width of the edge portion separating the cover tape from the carrier tape is smaller than the distance between the two rows of adhesive portions on the carrier tape, the tension generated when the cover tape passes through the edge portion. A force for separating the cover tape from the two rows of adhesive portions on the carrier tape is generated before the edge portion for peeling. For this reason, the time of separation of the cover tape adhered to the two rows of adhesive portions on the carrier tape is also advanced, and the occurrence of the phenomenon that the cover tape is pulled down to the lower side of the edge portion facing edge is prevented. As a result, it is possible to improve the reliability with respect to the component adsorption, and to reduce the loss of the component due to the deviation of the adsorption position, leading to an improvement in productivity.

また、エッジ部対向縁の幅も、前記キャリアテープ上の前記２列の接着部の間隔よりも小さくすると、カバーテープがキャリアテープから分離する時期が遅くなった場合であっても、エッジ部対向縁がキャリアテープとカバーテープとの間に入り込むことができ、これによりカバーテープの分離を促進するので、カバーテープがエッジ対向縁の下側にもぐり込む現象はより起こりにくくなり、更なる生産性の向上へとつながる。   In addition, when the width of the edge facing edge is smaller than the interval between the two rows of adhesive portions on the carrier tape, even when the time when the cover tape is separated from the carrier tape is delayed, the edge facing The edge can penetrate between the carrier tape and the cover tape, which facilitates the separation of the cover tape, so that the phenomenon that the cover tape does not dig into the lower side of the edge-facing edge is less likely to increase the productivity. It leads to improvement.

以下図面を参照して、本発明の実施形態を詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図１に、本発明の適用対象である電子部品供給装置１０の概略図を示す。この電子部品供給装置１０は、電子部品供給テープ２０が巻かれたリール１２と、電子部品供給テープ２０を搬送方向に間欠的又は連続的に送り出すテープ送り機構１４（駆動手段）と、カバーテープ２４をキャリアテープ２２から引き剥がす剥離手段１６と、キャリアテープ２２から引き剥がされたカバーテープ２４を回収する回収リール１８（巻き取り手段）と、を備えている。   FIG. 1 shows a schematic diagram of an electronic component supply apparatus 10 to which the present invention is applied. The electronic component supply apparatus 10 includes a reel 12 around which an electronic component supply tape 20 is wound, a tape feeding mechanism 14 (drive means) that intermittently or continuously feeds the electronic component supply tape 20 in the transport direction, and a cover tape 24. And a recovery reel 18 (winding means) for recovering the cover tape 24 peeled off from the carrier tape 22.

図２は、電子部品供給テープ２０の構成を示す斜視図である。電子部品供給テープ２０は、電子部品２６を収納する収納室２８が長手方向に一定間隔で多数設けられて前記収納室の列が形成されている帯状のキャリアテープ２２と、収納室２８に収納された電子部品２６と、キャリアテープ２２上で収納室２８の列の両側に所定の間隔Ｌを有して設けられた２列の接着部３０と、該２列の接着部３０に接着して電子部品２６を収納室２８内に封入するカバーテープ２４と、を有してなる。収納室２８には、方向を一定に揃えた電子部品２６が１個ずつ収納されている。キャリアテープ２２の例えば片側には、キャリアテープ２２の長手方向に一定間隔で送り孔３２が多数設けられている。   FIG. 2 is a perspective view showing the configuration of the electronic component supply tape 20. The electronic component supply tape 20 is stored in the storage chamber 28 and a belt-like carrier tape 22 in which a large number of storage chambers 28 for storing the electronic components 26 are provided at regular intervals in the longitudinal direction to form a row of the storage chambers. The electronic parts 26, the two rows of adhesive portions 30 provided on the carrier tape 22 on both sides of the rows of the storage chambers 28 with a predetermined distance L, and the two rows of adhesive portions 30 are bonded to the electronic And a cover tape 24 that encloses the component 26 in a storage chamber 28. In the storage chamber 28, the electronic components 26 having a uniform direction are stored one by one. For example, on one side of the carrier tape 22, a number of feed holes 32 are provided at regular intervals in the longitudinal direction of the carrier tape 22.

電子部品供給装置１０は、テープ送り機構１４によってリール１２に巻かれた状態の電子部品供給テープ２０を搬送方向（図１実線矢印方向）に間欠的又は連続的に送り出し、その搬送の途中でキャリアテープ２２からカバーテープ２４を回収リール１８に巻き取り、カバーテープ２４を剥離させる。剥離されたカバーテープ２４は、回収リール１８に順次巻かれることにより回収リール１８に回収される。キャリアテープ２２は、図１の鎖線矢印に示すように電子部品供給装置１０の下方に搬送されて電子部品供給装置１０の外部へ排出される。   The electronic component supply device 10 intermittently or continuously feeds the electronic component supply tape 20 wound around the reel 12 by the tape feeding mechanism 14 in the transport direction (the direction indicated by the solid line in FIG. 1), and the carrier in the middle of the transport. The cover tape 24 is wound around the collection reel 18 from the tape 22, and the cover tape 24 is peeled off. The peeled cover tape 24 is collected on the collection reel 18 by being sequentially wound around the collection reel 18. The carrier tape 22 is conveyed below the electronic component supply device 10 as shown by a chain line arrow in FIG.

剥離手段１６は、テープ送り機構１４の上方に配置される。図３に示すように、本発明の一実施形態に係る電子部品供給装置の剥離手段１６は、分離用突出部３４と、保護用突出部３６とから構成される。分離用突出部３４は、カバーテープ２４を分離するエッジ部３４Ａを先端に備える。保護用突出部３６は、電子部品供給テープ２０を送る方向にエッジ部３４Ａと対向して所定の間隙を有して設けられたエッジ部対向縁３６Ａを備え、カバーテープ２４が分離されて電子部品２６が露呈したキャリアテープ２２を保護する。エッジ部３４Ａの幅Ｗ34Aは、２列の接着部３０の間隔Ｌよりも小さいことが必要である。また、エッジ部３６Ａの幅Ｗ36Aも、２列の接着部３０の間隔Ｌよりも小さいことが好ましい。 The peeling means 16 is disposed above the tape feeding mechanism 14. As shown in FIG. 3, the peeling means 16 of the electronic component supply device according to the embodiment of the present invention includes a separation protrusion 34 and a protection protrusion 36. The separation protrusion 34 includes an edge portion 34 </ b> A that separates the cover tape 24 at the tip. The protective protruding portion 36 includes an edge portion facing edge 36A provided with a predetermined gap so as to face the edge portion 34A in the direction in which the electronic component supply tape 20 is fed, and the cover tape 24 is separated and the electronic component is separated. 26 protects the exposed carrier tape 22. The width W 34A of the edge portion 34A needs to be smaller than the distance L between the two rows of the bonding portions 30. The width W 36A of the edge portion 36A is also preferably smaller than the distance L of the bonding portion 30 of the two rows.

エッジ部３４Ａ及びエッジ部対向縁３６Ａの形状は、直線状又は曲線状のいずれでもよいが、電子部品が接触した場合の負荷を緩和するとともに電子部品の引っ掛かりを防止するため、直線状又は曲線状のいずれの場合も縁端面部は面取り加工を行うことが好ましく、直線状とする場合は両角部を所定の曲率で面取り加工することが好ましい。   The shape of the edge portion 34A and the edge portion opposing edge 36A may be either linear or curved. However, in order to reduce the load when the electronic component comes in contact and prevent the electronic component from being caught, the shape is linear or curved. In any case, it is preferable to chamfer the edge surface portion, and when it is linear, it is preferable to chamfer both corner portions with a predetermined curvature.

次に、エッジ部３４Ａの幅Ｗ34Aを、２列の接着部３０の間隔Ｌよりも小さくすることの作用を説明する。 Next, the effect | action of making width W34A of edge part 34A smaller than the space | interval L of the adhesion | attachment part 30 of 2 rows is demonstrated .

本発明の一実施形態に係る電子部品供給装置の剥離手段におけるエッジ部では、図３に示すように、エッジ部３４Ａの幅Ｗ34Aは、２列の接着部３０の間隔Ｌよりも小さくなっているため、カバーテープ２４がエッジ部３４Ａを通過するよりも前であっても、カバーテープ２４はエッジ部３４Ａにより押さえられておらず、カバーテープ２４をキャリアテープ２２上の２列の接着部３０から分離させようとする力が発生する。このため、カバーテープ２４がキャリアテープ２２上の２列の接着部３０から分離する時期が遅れにくくなり、カバーテープ２４がエッジ部対向縁３６Ａの下にもぐり込む現象は起こりにくくなり、図４に示すような正常な分離が続行する。その結果、部品吸着に対する信頼性を向上させることができるとともに、吸着位置のズレによる部品の損失を減少させることができ、生産性の向上へとつながる。 In the edge part of the peeling means of the electronic component supply device according to the embodiment of the present invention, as shown in FIG. 3, the width W 34A of the edge part 34A is smaller than the interval L between the two rows of adhesive parts 30. Therefore, even before the cover tape 24 passes through the edge portion 34 </ b> A, the cover tape 24 is not pressed by the edge portion 34 </ b> A, and the cover tape 24 is bonded to the two rows of adhesive portions 30 on the carrier tape 22. A force is generated to cause separation. For this reason, the time at which the cover tape 24 is separated from the two rows of the adhesive portions 30 on the carrier tape 22 is less likely to be delayed, and the phenomenon in which the cover tape 24 gets under the edge portion facing edge 36A is less likely to occur, as shown in FIG. Such normal separation continues. As a result, it is possible to improve the reliability with respect to the component adsorption, and to reduce the loss of the component due to the deviation of the adsorption position, leading to an improvement in productivity.

次に、エッジ部３６Ａの幅Ｗ36Aも、２列の接着部３０の間隔Ｌよりも小さくすることが好ましい理由について説明する。 Next, the width W 36A of the edge portion 36A also be made smaller than the spacing L of the bonding portion 30 of the two rows preferably reason will be described.

エッジ部対向縁３６Ａの幅Ｗ36Aを、２列の接着部３０の間隔Ｌよりも小さくすると、カバーテープ２４の接着部３０からの剥離が遅れた場合であっても、接着部３０上にエッジ部対向縁３６Ａが存在しないため、エッジ部対向縁３６Ａの下にカバーテープ２４がもぐり込みにくい。また、エッジ部対向縁３６Ａの幅Ｗ36Aを、２列の接着部３０の間隔Ｌよりも小さくすると、カバーテープの剥離遅れが発生した場合においても、図５に示すように、エッジ部対向縁３６Ａがカバーテープ２４とキャリアテープ２２との間に入り込むことができ、カバーテープ２４のキャリアテープ２２からの分離を促進することができる。さらに、図５に示すように、エッジ部対向縁３６Ａの上面のテープ送り方向に対する角度αを鋭角にすると、エッジ部対向縁３６Ａがカバーテープ２４とキャリアテープ２２との間により容易に入り込むことができるようになるため、好ましい。 The width W 36A of the edge portion opposite edge 36A, when smaller than the interval L of the bonding portion 30 of the two rows, even if the separation of the adhesive portion 30 of the cover tape 24 is delayed, the edge on the adhesive portion 30 Since the part facing edge 36A does not exist, the cover tape 24 is less likely to be caught under the edge part facing edge 36A. Further, when the width W 36A of the edge portion facing edge 36A is made smaller than the interval L between the two rows of the bonding portions 30, even when the cover tape peeling delay occurs, as shown in FIG. 36A can penetrate between the cover tape 24 and the carrier tape 22, and the separation of the cover tape 24 from the carrier tape 22 can be promoted. Furthermore, as shown in FIG. 5, when the angle α with respect to the tape feeding direction of the upper surface of the edge portion facing edge 36 </ b> A is an acute angle, the edge portion facing edge 36 </ b> A can easily enter between the cover tape 24 and the carrier tape 22. Since it becomes possible, it is preferable.

本発明の第２実施形態に係る電子部品供給装置の剥離手段を図６に示す。この第２実施形態は、分離用突出部を接着部３０の間隔Ｌよりも外径が小さい棒状の分離用突出部３５としたものである。図６では、分離用突出部３５を１本の棒状のもので構成しているが、接着部３０の間隔Ｌの中に分離用突出部の全てが入るのであれば、分離用突出部を複数本の棒状のものから構成してもよい。   FIG. 6 shows the peeling means of the electronic component supply apparatus according to the second embodiment of the present invention. In the second embodiment, the separation protrusion is a rod-shaped separation protrusion 35 having an outer diameter smaller than the interval L between the bonding portions 30. In FIG. 6, the separation protrusion 35 is configured as a single rod. However, if all of the separation protrusions are included in the interval L of the bonding portion 30, a plurality of separation protrusions are provided. You may comprise from the rod-shaped thing of a book.

本発明の適用対象である電子部品供給装置を示す概略図Schematic showing an electronic component supply apparatus to which the present invention is applied 電子部品供給テープの構成を示す斜視図The perspective view which shows the structure of an electronic component supply tape 本発明の一実施形態に係る電子部品供給装置の剥離手段を示す斜視図The perspective view which shows the peeling means of the electronic component supply apparatus which concerns on one Embodiment of this invention. カバーテープがキャリアテープから分離している状況を示す鉛直方向断面図Vertical section showing the situation where the cover tape is separated from the carrier tape エッジ部対向縁がカバーテープとキャリアテープとの間に入り込んだ状況を示す鉛直方向断面図Vertical sectional view showing the situation where the edge facing edge enters between the cover tape and the carrier tape 本発明の第２実施形態に係る電子部品供給装置の剥離手段を示す斜視図The perspective view which shows the peeling means of the electronic component supply apparatus which concerns on 2nd Embodiment of this invention. 従来の電子部品供給装置の剥離手段を用いた場合のカバーテープの分離の状況を示す斜視図The perspective view which shows the separation condition of the cover tape at the time of using the peeling means of the conventional electronic component supply apparatus 本発明者の先行出願（出願番号：２００５−５９７７３）に係る電子部品供給装置の剥離手段を示す斜視図The perspective view which shows the peeling means of the electronic component supply apparatus which concerns on the prior application (application number: 2005-59773) of this inventor. 電子部品供給装置の剥離手段を示す鉛直方向断面図Vertical sectional view showing the peeling means of the electronic component supply device カバーテープがエッジ部対向縁の下にもぐり込んだ状況を示す鉛直方向断面図Vertical sectional view showing the situation where the cover tape has sunk under the edge facing edge

符号の説明Explanation of symbols

１０…電子部品供給装置
１２…リール
１４…テープ送り機構
１６…剥離手段
１８…回収リール
２０…電子部品供給テープ
２２…キャリアテープ
２４…カバーテープ
２６…電子部品
２８…収納室
３０…接着部
Ｌ……接着部３０の間隔
３２…送り孔
３４、３５…分離用突出部
３４Ａ…エッジ部
Ｗ34A…エッジ部３４Ａの幅
３６…保護用突出部
３６Ａ…エッジ部対向縁
４０…エッジ部
Ｗ40…エッジ部４０の幅
４２…エッジ部対向縁
α……エッジ部対向縁の上面のテープ送り方向に対する角度
４４…スリット DESCRIPTION OF SYMBOLS 10 ... Electronic component supply apparatus 12 ... Reel 14 ... Tape feeding mechanism 16 ... Stripping means 18 ... Collection reel 20 ... Electronic component supply tape 22 ... Carrier tape 24 ... Cover tape 26 ... Electronic component 28 ... Storage chamber 30 ... Adhesion part L ... ... Spacing of bonding part 32 ... Feed hole 34, 35 ... Separation protrusion 34A ... Edge part W 34A ... Width of edge part 34A 36 ... Protective protrusion 36A ... Edge part facing edge 40 ... Edge part W 40 ... Edge Width of part 40 42 ... Edge part facing edge α ... Angle with respect to tape feeding direction of upper surface of edge part facing edge 44 ... Slit

Claims (2)

電子部品を収納する収納室が多数設けられて長手方向に前記収納室の列が形成されている帯状のキャリアテープ、前記収納室に収納された電子部品、前記キャリアテープ上で前記収納室の前記列の両側に所定の間隔を有して設けられた２列の接着部、及び該２列の接着部に接着して前記電子部品を前記収納室内に封入するカバーテープ、を有してなる電子部品供給テープと、
該電子部品供給テープを間欠的又は連続的に送る駆動手段と、
前記電子部品供給テープの前記カバーテープを前記キャリアテープから分離する剥離手段と、
分離した前記カバーテープを巻き取る巻き取り手段と、を備えてなり、
前記剥離手段は、前記カバーテープを前記キャリアテープから分離するエッジ部と、前記電子部品供給テープを送る方向に前記エッジ部と対向して所定の間隙を有して設けられたエッジ部対向縁と、を有し、前記エッジ部の幅が前記キャリアテープ上の前記２列の接着部の間隔よりも小さいことを特徴とする電子部品供給装置。 A strip-shaped carrier tape in which a plurality of storage chambers for storing electronic components are provided and a row of the storage chambers is formed in the longitudinal direction, the electronic components stored in the storage chamber, and the carrier tape on the carrier tape An electronic device comprising: two rows of adhesive portions provided at predetermined intervals on both sides of the row; and a cover tape that adheres to the two rows of adhesive portions and encloses the electronic component in the storage chamber. Component supply tape,
Drive means for sending the electronic component supply tape intermittently or continuously;
Peeling means for separating the cover tape of the electronic component supply tape from the carrier tape;
Winding means for winding the separated cover tape, and
The peeling means includes an edge portion that separates the cover tape from the carrier tape, and an edge portion facing edge that is provided with a predetermined gap facing the edge portion in the direction of feeding the electronic component supply tape. , And the width of the edge portion is smaller than the interval between the two rows of adhesive portions on the carrier tape. 前記エッジ部対向縁の幅が、前記キャリアテープ上の前記２列の接着部の間隔よりも小さいことを特徴とする請求項１に記載の電子部品供給装置。   2. The electronic component supply device according to claim 1, wherein a width of the edge-opposing edge is smaller than an interval between the two rows of adhesive portions on the carrier tape.
JP2006280124A 2006-10-13 2006-10-13 Electronic component feeder Pending JP2008098499A (en)

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WO2014050209A1 (en) * 2012-09-28 2014-04-03 株式会社日立ハイテクインスツルメンツ Component supply unit
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CN112292922B (en) * 2018-06-26 2022-02-01 株式会社富士 Feeder

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KR101804379B1 (en) * 2012-09-04 2018-01-10 한화테크윈 주식회사 Electric chip carrier tape feeding deive and electric chip carrier tape feeding method
WO2014050209A1 (en) * 2012-09-28 2014-04-03 株式会社日立ハイテクインスツルメンツ Component supply unit
JPWO2014050209A1 (en) * 2012-09-28 2016-08-22 ヤマハ発動機株式会社 Parts supply unit
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WO2019087270A1 (en) * 2017-10-31 2019-05-09 ヤマハ発動機株式会社 Component supply device and component mounting device
CN111247882A (en) * 2017-10-31 2020-06-05 雅马哈发动机株式会社 Component supply device and component mounting device
JPWO2019087270A1 (en) * 2017-10-31 2020-10-22 ヤマハ発動機株式会社 Parts supply equipment and parts mounting equipment
US11576290B2 (en) 2017-10-31 2023-02-07 Yamaha Hatsudoki Kabushiki Kaisha Component supply device and component mounting device

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