JP2008091150A - Manufacturing method of image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an image display device capable of maintaining a high display performance for a long period and of improving reduction in manufacturing cost. <P>SOLUTION: This is the manufacturing method of the image display device provided with a front face substrate 11, an envelope which is oppositely arranged to this front face substrate and which has a rear face substrate, and a getter membrane 23 installed in the envelope. A getter solution containing a particular getter material is supplied while being agitated, a bonding liquid is supplied of which a liquid temperature is kept at 10°C or less, the getter solution and the bonding liquid supplied are ejected onto the inner face of the constitution member constituting the envelope by a spray or a dispenser, and the getter membrane 23 is formed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an image display device including an envelope having substrates disposed opposite to each other and a getter disposed inside the envelope.

  In recent years, as a lightweight and thin image display device, a liquid crystal display (hereinafter referred to as LCD) that controls the intensity of light using the orientation of liquid crystal, a plasma display panel (hereinafter referred to as LCD) that emits phosphors by ultraviolet rays of plasma discharge. (Referred to as PDP), field emission display (hereinafter referred to as FED) that emits a phosphor with an electron beam of a field emission electron emitter, and surface conduction electron that emits a phosphor with an electron beam of a surface conduction electron emitter. Emission element displays (hereinafter referred to as SEDs) have been developed.

  For example, an FED generally has a front substrate and a rear substrate that are opposed to each other with a predetermined gap, and these substrates are surrounded by a vacuum by surrounding each other through a rectangular frame-shaped side wall. Make up the vessel. A phosphor screen is formed on the inner surface of the front substrate, and a number of electron-emitting devices are provided on the inner surface of the rear substrate as electron emission sources that excite the phosphor to emit light.

  In order to support an atmospheric pressure load applied to the back substrate and the front substrate, a plurality of support members are disposed between these substrates. The potential on the back substrate side is almost the ground potential, and an anode voltage is applied to the phosphor screen. An image is displayed by irradiating the phosphors of red, green, and blue constituting the phosphor screen with the electron beams emitted from the electron-emitting devices and causing the phosphors to emit light.

  In such an FED, it is important to maintain a high degree of vacuum inside the envelope. If the degree of vacuum is low, stable electron emission cannot be performed, and the life of the image display device is reduced. Further, in PDP, it is an important technique to keep the inert gas filling the inside of the envelope with high purity.

In order to maintain a high vacuum in the envelope for a long period of time, a getter material that adsorbs the released gas is provided in the envelope and plays an important role. Conventionally, in order to improve the gas adsorption characteristics of the getter material, the getter material is deposited on the inner surface of the front substrate or the rear substrate or other structure in a vacuum processing apparatus, and both the substrates are sealed in a vacuum. A manufacturing method and a manufacturing apparatus for an image display device forming an envelope have been proposed (see, for example, Patent Document 1). For example, a method of forming a non-evaporable getter layer in a region adjacent to the panel side of the PDP has been proposed (see, for example, Patent Document 2).
JP 2001-229824 A JP-A-11-191378

  In the method of forming a getter film and sealing an envelope in a vacuum processing apparatus, undesired gas molecules are efficiently adsorbed on the getter film. For this reason, the inside of the vacuum envelope of the FED is maintained at a high degree of vacuum over a long period of time.

  However, since this method uses a large vacuum processing apparatus, the manufacturing cost increases, and as a result, the cost of the image display apparatus also increases. When an evaporative getter film is deposited over the entire surface of the phosphor screen, there is a problem in performance that the luminance is lowered.

  In addition, in the method of forming a non-evaporable getter film in the area adjacent to the side of the panel, undesired gas molecules existing in the area away from the getter, that is, in the central part of the phosphor screen are efficiently adsorbed to the getter. Can not do it. Therefore, the gas pressure at the center of the vacuum envelope increases, and the brightness at the center of the display device decreases. Furthermore, if the substrate is heated with the exhaust pipe or exhaust hole having a small conductance being exhausted, the pressure inside the envelope rises due to the released gas, and the getter is removed until sufficient getter characteristics are obtained. It becomes difficult to activate.

  The present invention has been made in view of the above points, and an object of the present invention is to easily and stably pattern a getter, maintain good display performance over a long period of time, and reduce manufacturing costs. An object of the present invention is to provide an image display device manufacturing method capable of achieving the above.

  An image display device manufacturing method according to an aspect of the present invention includes a front substrate, an envelope disposed opposite to the front substrate and having a rear substrate, and a getter layer provided in the envelope. In the method for manufacturing an image display device, a getter solution containing a particulate getter material is supplied with stirring, a binding liquid whose liquid temperature is kept at 10 ° C. or lower is supplied, and the supplied getter solution and the binding solution are supplied. The getter film is formed by spraying the landing liquid onto the inner surface of the constituent member constituting the envelope or by discharging it with a dispenser.

  According to the aspect of the present invention, it is possible to form a getter film uniformly in a short time, and the getter material can function effectively. In addition, it is possible to provide a method for manufacturing an image display device that can maintain high display performance over a long period of time without using an expensive vacuum device and can reduce the manufacturing cost.

Hereinafter, a method for manufacturing an image display device according to a first embodiment of the present invention will be described in detail with reference to the drawings. First, as an example of an image display device manufactured by this manufacturing method, an SED including a surface-conduction electron-emitting device will be described.
As shown in FIGS. 1 and 2, the SED includes a front substrate 11 and a rear substrate 12 each made of a rectangular glass plate, and these substrates are arranged to face each other at a predetermined interval. The back substrate 12 is formed with a size larger than that of the front substrate 11. The front substrate 11 and the back substrate 12 constitute a flat envelope 10 whose peripheral portions are joined to each other through a rectangular frame-shaped side wall 13 and the inside is maintained in a vacuum state. The side wall 13 functioning as a bonding member is sealed to the peripheral edge of the front substrate 11 and the peripheral edge of the back substrate 12 by, for example, a sealing material 25 such as low melting glass or low melting metal, and these substrates are bonded to each other. is doing.

  A plurality of plate-like support members 14 are provided inside the envelope 10 in order to support an atmospheric pressure load applied to the front substrate 11 and the rear substrate 12. These support members 14 extend in a direction parallel to one side of the envelope 10 and are arranged at a predetermined interval along a direction orthogonal to the one side. Both ends in the longitudinal direction of each support member 14 are opposed to the side wall 13 with a gap.

  As shown in FIGS. 2 to 4, a phosphor screen 16 that functions as an image display surface is formed on the inner surface of the front substrate 11. The phosphor screen 16 is configured by arranging red, green, and blue phosphor layers R, G, and B, and a black light-shielding layer 20 positioned between the phosphor layers. The phosphor layers R, G, and B of three colors of red, green, and blue are formed alternately with a gap in the first direction parallel to the long side of the front substrate 11, and the phosphor layers of the same color are formed. They are arranged with a gap in a second direction orthogonal to the first direction. Each of the phosphor layers R, G, and B constitutes a subpixel with single colors of red, green, and blue, and constitutes one pixel by combining the subpixels of three colors. The phosphor layer is not limited to a dot shape, and may be formed in a stripe shape.

  A matrix-shaped dividing layer 31 is formed so as to overlap the light shielding layer 20 of the phosphor screen 16. A metal back layer 17 made of an aluminum film or the like is formed on the phosphor screen 16. According to this embodiment, the metal back layer 17 is divided in the vertical direction and the horizontal direction by the dividing layer 31 and has a plurality of divided regions that are electrically separated from each other. The metal back layers 17 that are electrically separated from each other by the dividing layer 31 are positioned so as to overlap the phosphor layers R, G, and B, respectively.

  A plurality of non-evaporable getter films 23 are formed on the light shielding layer 20 of the phosphor screen 16 and, here, on the dividing layer 31, and are arranged with a gap therebetween. The getter film 23 is formed on the dividing layer 31 so as to avoid the phosphor layers R, G, and B, and has a plurality of regions that are electrically separated from each other. The getter film 23 may be provided only in a region that overlaps the light shielding layer 20, but even in a region that overlaps the phosphor layers R, G, and B, a region that does not receive the electron beam from the corresponding electron-emitting device 18 If so, they may be stacked.

  The getter film 23 adsorbs unnecessary gas in the envelope 10 and maintains a high degree of vacuum in the envelope. As shown in FIG. 8, each getter film 23 is formed by adhering a non-evaporable getter powder 23a onto a dividing layer 31 with a binding liquid 23b having an adhesive effect. The film thickness of the getter film 23 is about 15 μm.

  As shown in FIG. 2, on the inner surface of the back substrate 12, a number of surface conduction type electron emitters each emitting an electron beam as an electron source for exciting the phosphor layers R, G, B of the phosphor screen 16 are provided. An element 18 is provided. These electron-emitting devices 18 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. Each electron-emitting device 18 includes an electron emitting portion (not shown) and a pair of device electrodes for applying a voltage to the electron emitting portion. A large number of wirings 21 for supplying a potential to the electron-emitting devices 18 are provided in a matrix on the inner surface of the rear substrate 12, and end portions thereof are drawn out of the envelope 10.

  Exhaust holes 29 for exhausting the inside of the envelope 10 in the exhaust process are formed through the periphery of the back substrate 12, for example, corners. The exhaust hole 29 is provided at a position away from the phosphor screen 16, that is, at a position away from the effective display area. The exhaust hole 29 is hermetically sealed by the lid member 30. The number of exhaust holes 29 is not limited to one, and can be increased as necessary.

  In such an SED, when displaying an image, an anode voltage is applied to the phosphor screen 16 and the metal back layer 17, and the electron beam emitted from the electron-emitting device 18 is accelerated by the anode voltage to the phosphor screen. Collide. Thereby, the phosphor layers R, G, and B of the phosphor screen 16 are excited to emit light, and a color image is displayed.

Next, the manufacturing method of SED comprised as mentioned above is demonstrated.
In the manufacturing process of the SED, first, the phosphor screen 16 is formed on the plate glass to be the front substrate 11. Subsequently, a matrix-shaped dividing layer 31 is formed on the light shielding layer 20 of the phosphor screen 16, and then a metal back layer 17 made of an aluminum film or the like is deposited on the phosphor screen 16 by vapor deposition. The metal back layer 17 is divided in the vertical direction and the horizontal direction by the dividing layer 31 to form a plurality of divided regions that are electrically separated from each other.

  Subsequently, a getter film 23 is formed on the phosphor screen 16. The getter film 23 is formed by spraying or discharging a mixed solution obtained by mixing a non-evaporable getter powder with a low-viscosity binding liquid having an adhesive effect onto a phosphor screen. In the present embodiment, the getter material is, for example, a Zr alloy powder having an average particle diameter of 10 nm to 10 μm, and the binding liquid is 100 mPa.s. A colloidal silica solution having a viscosity of about s is prepared.

  The getter material is not limited to Zr, and other metal materials, organic materials, inorganic materials, and the like can be selected. For example, as a non-evaporable getter material, using one or more kinds of metals or two or more kinds of alloys among Ti, V, Fe, Al, Cr, Nb, Ta, W, Mo, Ni, Mn, and Y. Also good.

  As the binding liquid, colloidal silica solution, colloidal solution such as colloidal alumina using fine oxide particles, sodium-based water glass, potassium-based water glass, metal alkoxide, or a mixture solution thereof can be used.

  The getter material powder and the binding liquid are mixed at a ratio of 1: 1, for example, to prepare a mixed solution. When the proportion of the getter material is large, the adhesive strength with the substrate is lowered, and when the proportion of colloidal silica is large, the formed getter film is cracked.

  FIG. 5 shows a spray device 50 for spraying the mixed solution described above. The spray device 50 is provided on the outer surface of a tank 52 for storing the mixed solution 55, a nozzle 54 extending from the bottom of the tank 52, a stirrer 57 for stirring the mixed solution in the tank 52, and the other ink 52. A cooler 60 that maintains the mixed solution at a predetermined temperature and a compression pump 63 that supplies compressed air to the nozzle 54 through the supply pipe 62 and sprays the mixed solution from the nozzle are provided. The cooler 60 is configured by, for example, a Peltier element.

  The stirrer 57 includes a stirring blade 56 disposed in the tank 52 and immersed in the mixed solution 55, and a motor 58 that rotates the stirring blade at a rotation speed of 200 to 6000 rpm. The distance between the tip of the stirring blade 56 and the base end of the nozzle 54 is set to 0 to 10 mm, preferably 0 mm.

  In the case of spraying the mixed solution 55 using the spray device 50, first, a binding liquid that has been cooled to a predetermined temperature in advance, here, a colloidal silica solution, is filled into the tank 52 and stirred by the stirrer 57. Subsequently, the powder of the getter material is put into the tank 52 and mixed with the binder solution being stirred to make a mixed solution 55. The mixed solution 55 is constantly stirred, including during spraying, to uniformly disperse the getter material in the solution. At the time of stirring, the rotation speed of the stirring blade 56 was set to 3000 rpm. The rotation speed of the stirring blade 56 is desirably 200 rpm to 6000 rpm, the getter material tends to settle at 200 rpm or less, and the mixed solution 55 tends to scatter at 6000 rpm or more. Further, the distance between the tip of the stirring blade 56 and the base end of the nozzle 54 is preferably 0 mm to 10 mm, and if it exceeds 10 mm, the getter material tends to sink to the bottom of the tank 52.

  During spraying, the cooler 60 cools the mixed solution 55 in the tank 52, in particular, the binding liquid, and maintains the temperature at 10 ° C. or lower, for example, 5 ° C. Thereby, the binding liquid in the mixed solution 55 is prevented from solidifying in the tank 52 and the nozzle 54.

  In this manner, while the mixed solution 55 in the tank 52 is being stirred and cooled to about 5 ° C., compressed air is supplied from the compression pump 63 to the nozzle 54 and the mixed solution 55 is sprayed from the nozzle.

  As shown in FIG. 6, a plate-shaped metal mask 40 in which a large number of openings 41 are patterned is prepared. The front substrate 11 is placed on the heating plate 42 and the metal mask 40 is placed on the metal back layer 17 and the dividing layer 31. At this time, the metal mask is aligned with the front substrate 11 so that the opening 41 of the metal mask 40 is positioned on the dividing layer 31. If necessary, a magnet 44 is disposed outside the heating plate 42 to attract the metal mask 40 and bring it into intimate contact with the phosphor screen 16 and prevent displacement of the metal mask.

  The front substrate 11 is heated to 40 to 150 ° C., for example, about 80 ° C. by the heating plate 42. In this state, as shown in FIG. 7, the above-mentioned mixed solution 55 is sprayed on the front substrate 11 from the nozzle 54 of the spray device 50 through the metal mask 40, and the entire formation area is scanned. As a result, the mixed solution is attached onto the dividing layer 31 through the opening 41 of the metal mask 40. Then, the adhering mixed solution is heated by the heated front substrate 11, and the binder solution is evaporated and dried. As a result, the getter powder is fixed on the dividing layer 31 and the getter film 23 is patterned.

  By spraying the mixed solution 55 while the front substrate 11 is heated, the binding liquid adhering to the dividing layer 31 is immediately dried to fix the getter powder. Therefore, the patterning accuracy of the getter film 23 is improved. If the substrate temperature is too high, the binding solution dries immediately before the mixed solution 55 adheres to the dividing layer 31 and the adhesion with the substrate decreases, or unevenness occurs on the surface of the formed getter layer. When the substrate temperature is low, when the getter film 23 is stacked, the binding liquid enters between the metal mask 40 and the front substrate, and bleeding occurs. For this reason, the heating temperature of the front substrate 11 is preferably 40 to 150 ° C.

  The film thickness of the getter film 23 was set to about 15 μm. As shown in FIG. 8, after forming the getter film 23 and drying the colloidal silica that is the binding liquid 23b, the non-evaporable getter particles 23a are firmly adhered to the non-evaporable type via the colloidal silica. The surface of the getter particle 23a can be exposed in a relatively large area. Therefore, after the non-evaporable getter particles 23a are activated in the subsequent activation step, the gas adsorption function of the non-evaporable getter can be sufficiently exhibited.

The film thickness of the getter film 23 is preferably 5 μm to 50 μm. If it is less than 5 μm, the gas adsorption ability of the getter film tends to be insufficient, and if it exceeds 50 μm, there is a tendency to cause discharge with the back substrate side. The film thickness of the getter film 23 can be adjusted by spraying the mixed solution 55 a plurality of times and repeatedly applying it.
Thereafter, the metal mask 40 is removed from the front substrate 11. As a result, a getter film 23 having a predetermined pattern is formed as shown in FIGS.

  On the other hand, the electron-emitting device 18 and the wiring 21 are formed on the plate glass for the back substrate 12. Next, low melting point glass as the sealing material 25 is applied in a rectangular frame shape along the inner periphery of the back substrate 12 to form a sealing layer. The back substrate 12 is temporarily fired in the atmosphere. Then, after aligning the side wall 13 on the sealing layer, the temperature is raised to the crystal precipitation temperature of the low-melting glass in the atmosphere, and the side wall 13 is sealed to the back substrate 12 by maintaining the temperature. Thereafter, the electron-emitting device 18 is activated. Next, the plurality of support members 14 are aligned with respect to the back substrate 12, and the end portions thereof are fixed to the back substrate.

  Subsequently, the peripheral portions of the front substrate 11 and the back substrate 12 formed as described above are sealed. In the present embodiment, the front substrate 11 and the rear substrate 12 are aligned with each other, and placed in a heating furnace (not shown) in a state of being opposed to each other with a certain gap. Then, the front substrate 11 and the back substrate 12 are heated to about 450 ° C. By heating, melting of the low melting point glass previously applied starts. For example, the temperature is maintained at about 450 ° C. in an argon atmosphere over 30 minutes, and the low melting glass melts and crystal precipitation begins. Thereafter, crystal precipitation of the low melting point glass is almost completed, and the back substrate 12 and the front substrate 11 are sealed to each other through the side wall 13 by the low melting point glass.

  Subsequently, the temperature in the heating furnace is maintained at a high temperature higher than the activation temperature of the getter film 23, for example, 400 to 450 ° C., and the front substrate 11 and the back substrate 12 are baked for about 1 hour. As a result, undesired gas components adsorbed on the front substrate, the rear substrate, the phosphor screen, and the electron-emitting device are released to perform degassing. In order to prevent oxidation of the electron-emitting device, it is desirable to seal and bake the inside of the heating furnace in an inert atmosphere and a reducing atmosphere. The atmosphere can be selected according to time and temperature.

  During the degassing by baking, the inside of the envelope 10 is exhausted from the exhaust hole 29 by the exhaust pump. As a result, gas components desorbed from the substrate, the phosphor screen, and the like are discharged from the envelope 10 to the outside, and the inside of the envelope 10 is in a clean vacuum state.

  The getter film 23 is activated by heating the front substrate 11 and the back substrate 12 at about 350 to 500 ° C. for a predetermined time, for example, 2 hours. As a result, the getter film 23 is in an operating state without substantially deteriorating the adsorption capability.

  After the activation of the getter film 23 is completed, the envelope 10 is cooled to a desired temperature, and the exhaust hole 29 of the envelope 10 is hermetically sealed by the lid member 30. The lid member 30 can be sealed using a known technique such as sealing with a low melting point metal such as indium or welding by local heating. Next, the envelope 10 is removed from the heating furnace. The SED envelope 10 is completed through the above steps.

  According to the SED manufacturing method configured as described above, the getter film is formed on the entire surface of the phosphor screen 16 and is formed on the light shielding layer 20 so as to avoid the phosphor layers R, G, and B. Has been. For this reason, the entire interior of the envelope 10 can be maintained at a high degree of vacuum without lowering the luminance by the getter film 23.

  By spraying the mixed solution while stirring and maintaining it at a predetermined temperature, settling of the getter material in the mixed solution and solidification of the binder are prevented, and clogging of the tip of the nozzle 54 is suppressed and uniform. It is possible to continuously produce a simple getter film under stable conditions.

  By mixing and spraying the getter material and the binding liquid, it becomes possible to form a getter film uniformly in a short time, making the getter material function effectively, and providing good display performance over a long period of time. Can be maintained. Without using an expensive vacuum device, it is possible to provide a method for manufacturing an image display device that can maintain high display performance over a long period of time and can reduce the manufacturing cost.

  Next, a method for manufacturing the SED according to the second embodiment will be described. In the second embodiment, a getter film is formed by discharging a mixed solution onto a substrate using a dispenser. FIG. 9 shows a dispenser 70 used for forming the getter film. The dispenser 70 includes an ejection head 72 that is movably supported by a head moving mechanism (not shown). The discharge head 72 includes a syringe 74 as a reservoir for storing a mixed solution of a getter material powder and a binding liquid, a needle 75 for discharging the mixed solution 55 sent from the syringe to a formation position of the getter film, and a syringe. A cooler 80 is provided around 74 to cool the mixed solution and maintain it at a desired temperature, for example, 5 ° C. The cooler 80 is configured by a Peltier element, for example. The dispenser 70 also includes a stirrer 77 that stirs the mixed solution in the syringe 74 and a discharge pump 84 that supplies compressed air to the syringe 74 via the supply pipe 82.

  The stirrer 77 includes a stirring blade 76 disposed in the syringe 74 and immersed in the mixed solution 55, and a motor 78 that rotates the stirring blade at a rotation speed of 200 to 6000 rpm. The distance between the tip of the stirring blade 76 and the base end of the needle 75 is set to 0 to 10 mm, preferably 0 mm.

  When the mixed solution 55 is dropped or discharged using the dispenser 70, first, a binding liquid that has been cooled to a predetermined temperature in advance, here, a colloidal silica solution, is filled into the syringe 74 and stirred by the stirrer 77. Subsequently, the getter material powder is put into the syringe 74 and mixed with the agitated binder solution to make a mixed solution 55. As the getter material powder and the binding liquid, those similar to those of the first embodiment described above can be used. Further, the getter material powder and the binding liquid are mixed at a ratio of 1: 1, for example.

  The mixed solution 55 is always stirred, including when the mixed solution is dropped and discharged, and the getter material is uniformly dispersed in the solution. At the time of stirring, the rotation speed of the stirring blade 56 was set to 3000 rpm. The rotation speed of the stirring blade 56 is desirably 200 rpm to 6000 rpm, the getter material tends to settle at 200 rpm or less, and the mixed solution 55 tends to scatter at 6000 rpm or more. The distance between the tip of the stirring blade 56 and the base end of the needle 75 is preferably 0 mm to 10 mm, and if it exceeds 10 mm, the getter material tends to settle on the bottom of the syringe 74.

  Further, during the dropping or discharging, the cooler 80 cools the mixed solution 55 in the syringe 74, particularly the binding liquid, and maintains the temperature at 10 ° C. or lower, for example, 5 ° C. Thereby, the binding liquid in the mixed solution 55 is prevented from solidifying in the syringe 74 and the needle 75.

  In this manner, while stirring the mixed solution 55 in the syringe 74 and cooling to about 5 ° C., compressed air is supplied from the discharge pump 84 to the syringe 74, and the mixed solution 55 is dropped or discharged from the needle 75. To do.

  When forming the getter film, as shown in FIG. 10, the front substrate 11 on which the phosphor screen 16, the dividing layer 31, and the metal back layer 17 are formed is placed on the heating plate 42 and positioned. The front substrate 11 is heated to 40 to 150 ° C., for example, about 80 ° C. by the heating plate 42.

Subsequently, the ejection head 72 of the dispenser 70 is moved relative to the front substrate 11 by a moving mechanism (not shown), and the needle 75 is positioned at the getter formation position of the front substrate 11, here, the position facing the dividing layer 31. In this state, the mixed solution 55 described above is discharged or dropped onto the dividing layer 31 from the needle 75 of the dispenser 70 while stirring and cooling.
Thereafter, the ejection head 72 is sequentially moved to another getter formation position on the front substrate 11, and the mixed solution 55 is sequentially ejected or dropped by the same process as described above.

  As a result, the mixed solution 55 is attached to the getter formation position on the dividing line 31. The admixed mixed solution 55 is heated by the heated front substrate 11, and the binder solution is evaporated and dried. As a result, the getter powder is fixed on the dividing layer 31 and the getter film 23 is patterned.

  In the second embodiment, other configurations of the SED and other steps of the manufacturing method are the same as those of the first embodiment described above, and detailed description thereof is omitted. Also in the second embodiment, by stirring or mixing the mixed solution while maintaining the predetermined temperature, the settling of the getter material in the mixed solution and the solidification of the binder are prevented, It becomes possible to continuously produce a uniform getter film under stable conditions by suppressing clogging of the tip of the needle 75.

  By mixing and discharging the getter material and the binding liquid, it is possible to pattern the getter film uniformly in a short time, the getter material can function effectively, and good display performance can be achieved over a long period of time. Can be maintained over time. Accordingly, it is possible to provide a method for manufacturing an image display device that can maintain high display performance over a long period of time without using an expensive vacuum device and can reduce the manufacturing cost.

  The present invention is not limited to the above-described embodiment, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. Some constituent elements may be deleted from all the constituent elements shown in the embodiments, or constituent elements over different embodiments may be appropriately combined.

  In the above-described embodiment, the SED provided with the front substrate having the phosphor screen on the inner surface has been described as an example. However, the present invention is not limited to this and is applied to other display devices such as an FED and a PDP. Can do. The dimensions, materials, and the like of each component are not limited to the numerical values and materials exemplified in the above-described embodiment, and can be variously selected as necessary.

  The material of the getter material and the binding liquid is not limited to the above-described embodiment, and various materials can be selected according to the vacuum characteristics, emission gas characteristics, heat resistance, etc. of the device to be used. For example, as the getter material, metal materials other than those described above, organic materials, inorganic materials, and the like can be selected. The heating of the front substrate can form a getter film without heating the front substrate depending on the viscosity and volatilization rate of the binder solution used.

  In the above-described embodiment, the getter film is provided on the phosphor screen. However, the present invention is not limited to this, and the getter film may be formed on another constituent member constituting the envelope. For example, a getter film may be provided on the structure on the back substrate 12 side, and in this case, the wiring 21 may be formed at a position where the wiring 21 is not short-circuited at a position away from the electron-emitting device 18.

  In the above-described embodiment, the mixed solution of the getter powder and the binding liquid is sprayed or discharged. However, the getter solution containing the getter powder and the binding liquid may be separately sprayed or discharged. Good. In this case, the getter solution is sprayed or discharged while stirring, and the binder solution is sprayed or discharged while being cooled to a predetermined temperature.

FIG. 1 is a perspective view showing a partially broken SED according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the SED along line AA in FIG. FIG. 3 is an enlarged plan view showing a part of the front substrate and phosphor screen of the SED. 4 is a cross-sectional view of the front substrate along the line BB in FIG. 3. FIG. 5 is a cross-sectional view schematically showing a spray apparatus used for forming a getter film. FIG. 6 is a cross-sectional view showing a state where a front substrate is placed on a heating plate and a metal mask is placed on a phosphor screen in the SED manufacturing process. FIG. 7 is a cross-sectional view showing a state in which getter powder and a binding liquid are sprayed on a phosphor screen through a metal mask in the manufacturing process of the SED. FIG. 8 is an enlarged cross-sectional view of a non-evaporable getter film. FIG. 9 is a cross-sectional view schematically showing a dispenser used for forming a getter film. FIG. 10 is a cross-sectional view showing a state in which getter powder and a binding liquid are discharged onto a phosphor screen in the manufacturing process of the SED.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Envelope, 11 ... Front substrate, 12 ... Back substrate, 13 ... Side wall,
14 ... support member, 16 ... phosphor screen, 17 ... metal back layer,
18 ... electron-emitting device, R, G, B ... phosphor layer, 20 ... light shielding layer,
23 ... Getter film, 23a ... Getter powder, 23b ... Binder,
40 ... Metal mask 50 ... Spray device 52 ... Tank 54 ... Nozzle
57 ... Stirrer, 55 ... Mixed solution, 60 ... Cooler, 70 ... Dispenser,
74 ... Syringe, 75 ... Needle, 77 ... Stirrer, 80 ... Cooler

Claims (10)

In a method for manufacturing an image display device, comprising: a front substrate, an envelope disposed opposite to the front substrate and having a rear substrate; and a getter layer provided in the envelope.
Supply a getter solution containing particulate getter material while stirring,
Supplying a binding liquid whose liquid temperature is kept at 10 ° C. or lower,
A method of manufacturing an image display device, wherein the supplied getter solution and binding solution are sprayed on an inner surface of a constituent member constituting the envelope or discharged by a dispenser to form a getter film.   The method for manufacturing an image display device according to claim 1, wherein the particulate getter material and the binding liquid are mixed, and the mixed solution is discharged or sprayed while being stirred and maintained at 10 ° C. or lower.   2. The image display device according to claim 1, wherein the binding liquid is a colloidal silica solution, a colloidal solution such as colloidal alumina using fine oxide particles, a sodium-based water glass, a potassium-based water glass, a metal alkoxide, or a mixture thereof. Manufacturing method.   The said getter material uses Ti, Zr, V, Fe, Al, Cr, Nb, Ta, W, Mo, Ni, Mn, Y, or one or more types of metals or two or more types of alloys. Manufacturing method of the image display apparatus.   The method for manufacturing an image display device according to claim 1, wherein a getter material having a particle size of 10 nm to 10 μm is used.   The manufacturing method of the image display apparatus of Claim 1 which rotates the stirrer arrange | positioned in the said getter solution by the rotation speed of 200 rpm-6000 rpm, and stirs the said getter solution.   The method for manufacturing an image display device according to claim 1, wherein the getter solution and the binding solution are discharged or sprayed in a state where the component member is heated to 40 to 150 ° C.   The method for manufacturing an image display device according to claim 1, wherein a mask having a predetermined aperture pattern is disposed on the component member, and the getter solution and the binding liquid are sprayed through the mask.   The phosphor screen having a plurality of phosphor layers and a light shielding layer located between the phosphor layers is formed on the inner surface of the front substrate, and the getter solution and the binding solution are discharged or sprayed on the light shielding layer. The manufacturing method of the image display apparatus as described in 1 .. After forming the getter layer, sealing the peripheral portions of the front substrate and the back substrate,
Heating the envelope at a temperature higher than the activation temperature of the getter film to degas the envelope;
While degassing, the inside of the envelope is evacuated,
The method for manufacturing an image display device according to claim 9, wherein the non-evaporable getter is activated after the degassing.

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