JP2008083496A - Method for manufacturing electrode substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electrode substrate capable of forming electrodes on both surfaces of the substrate, without causing defects in the substrate and in the conductive pattern formed thereon. <P>SOLUTION: The method for manufacturing the electrode substrate 1, having first translucent electrodes 104a and second translucent electrodes 104b on both surfaces of the translucent substrate 102(h), is provided. The method comprises a step (c) of forming a conductive film 104a' on a first major face S1 of the translucent substrate 102, a step (d) for patterning the conductive film 104a', a step (f) of forming the conductive film 104b' on a second major face S2 of the translucent substrate 102, and a step (g) for patterning the conductive film 104b'. The step (g) for patterning the conductive film 104b' is carried out, in a state of where a protective film 125 is disposed on the first major face S1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an electrode substrate having a conductive pattern such as a conductive film on both surfaces of one substrate.

  At present, in various electronic devices such as a mobile phone and a portable information terminal, for example, as a display unit for visually displaying various information related to the electronic device, an electric device such as a liquid crystal device or an EL (Electro luminessence) device is used. Optical devices are widely used. These electro-optical devices may be provided with an input device such as a touch panel. These electro-optical devices and input devices are generally configured using a substrate on which a conductive pattern made of a transparent conductive film, a metal film, or the like is formed.

  In the operation of forming a conductive pattern on a substrate, so-called pattern formation operation, generally, operations such as sputtering, exposure, development, etching, and the like are performed. However, when performing these operations, each operation is performed. In some cases, the substrate is fixed to a table or magazine included in the apparatus.

  As a method for manufacturing the substrate as described above, a method of forming a conductive pattern on one surface of a substrate has been conventionally known (see, for example, Patent Document 1). This manufacturing method is a method of manufacturing a liquid crystal device in which two substrates are stacked in a plane, and a conductive pattern made of a conductive film or the like is formed on one of the two substrates.

JP 2002-268042 A (6th page, FIG. 12)

  By the way, the conductive pattern formed on the substrate may be provided on both the front and back surfaces of the substrate. In this case, it is conceivable to perform pattern formation on one surface of the substrate and then perform pattern formation on the other surface of the substrate. However, the substrate manufacturing method disclosed in Patent Document 1 forms a pattern only on one surface of the substrate, and when the pattern is formed, the surface opposite to the surface on which the pattern is formed is protected. No consideration is given to what to do. Therefore, when trying to form a pattern on both the front and back surfaces of the substrate using the method disclosed in Patent Document 1, when performing pattern formation on one surface of the substrate, for example, in the step of transporting the substrate, etc. The other surface may be scratched or foreign matter may adhere to it, and a defect may occur in the pattern formed on the scratched surface.

  Also, when forming a pattern on the other surface of the substrate, a defect such as a scratch on the pattern already formed on one surface occurs due to direct contact with the table or the like of an apparatus that performs operations such as sputtering. There is a fear. If such pattern defects occur, the yield in the process of manufacturing the substrate may be reduced.

  The present invention has been made in view of the above problems, and an electrode substrate manufacturing method capable of forming electrodes on both sides of a substrate without causing defects in the substrate and the conductive pattern formed on the substrate. The purpose is to provide.

  The manufacturing method of the 1st electrode substrate which concerns on this invention is a manufacturing method of the electrode substrate which has an electrode on both surfaces of the 1st main surface and 2nd main surface of a board | substrate, Comprising: A 1st main surface of the said board | substrate WHEREIN: A first conductive film forming step of forming a conductive film; a first patterning step of patterning the first conductive film to form a first electrode; and a second conductive film formed on a second main surface of the substrate. And a second patterning step of patterning the second conductive film to form a second electrode, the second patterning step being performed after the first patterning step, and It is performed in a state where a protective means is provided on the first main surface.

  In the method for producing an electrode substrate according to the present invention, as the “protecting means”, for example, a photosensitive resin film, a glass body, a metal film, or the like can be used. In the first conductive film forming step and the second conductive film forming step, the conductive film is formed on the first main surface or the second main surface of the substrate using, for example, a sputtering apparatus. Further, the first patterning step and the second patterning step include an exposure process performed using, for example, an exposure apparatus. Moreover, the process of conveying the board | substrate under manufacture is performed between each process. In addition, various processes are executed as necessary.

  In the first manufacturing method according to the present invention, the second patterning step is performed in a state in which protective means is provided on the first main surface of the substrate. Thereby, in the second patterning step, the surface of the first main surface of the substrate itself or the first main surface is formed on a part (for example, a table or a magazine) on which the substrate is placed in a manufacturing apparatus such as an exposure apparatus. The touched electrode is not touched directly. As a result, it is possible to prevent the first main surface of the substrate itself or the electrode formed on the first main surface from being scratched or adhering to foreign matter, and to prevent the electrode on the substrate from being defective.

  Next, in the first electrode substrate manufacturing method according to the present invention, a first conductive film forming step of forming a first conductive film on the first main surface of the substrate, and patterning the first conductive film A first patterning step for forming one electrode; a first protective means forming step for forming a first protective means for protecting the first electrode; and a second main surface of the substrate after the first protective means forming step. A second conductive film forming step of forming a second conductive film; a second patterning step of patterning the second conductive film to form a second electrode; and the first protection means after the second patterning step. It is desirable to have the 1st protection means removal process to remove.

  In the method of manufacturing the electrode substrate having this configuration, after the first patterning step, a protection unit that covers the first electrode can be formed in the first protection unit formation step. As a result, the first electrode formed on the first main surface of the substrate is protected by the protection means. Therefore, when the second electrode is formed on the second main surface of the substrate in the second patterning step, the exposure apparatus or the sputter is formed. In a manufacturing apparatus such as an apparatus, the first main surface of the substrate and the first electrode do not directly touch a portion where the substrate is placed. As a result, it is possible to prevent the surface of the first main surface of the substrate and the first electrode from being damaged or foreign matter from adhering, and to prevent the first electrode from being defective.

  Next, in the first electrode substrate manufacturing method according to the present invention, a first conductive film forming step of forming a first conductive film on the first main surface of the substrate, and a second on the second main surface of the substrate. A second conductive film forming step for forming a conductive film; a second protective means forming step for forming a second protective means on the second conductive film after the first conductive film forming process; and the second protective means. A first patterning step of patterning the first conductive film after the formation step to form a first electrode; a second protection means removing step of removing the second protection means after the first patterning step; A first protective means forming step of forming a first protective means on the first electrode after the protective means removing step; and a second electrode formed by patterning the second conductive film after the first protective means forming step. Forming a second patterning step and the second pattern It is desirable to have a first protection means removing step of removing the first protective means after the ring step.

  The first conductive film and the second conductive film are generally formed on the surface of the substrate by sputtering. The sputtering process includes a high-temperature sputtering process performed in a high-temperature atmosphere and a low-temperature or normal-temperature sputtering process performed in a low-temperature atmosphere as compared with the high-temperature sputtering process. In order to form the conductive film as in the embodiment of the present invention, it is desirable to perform high-temperature sputtering treatment.

  However, in the case where the second conductive film is formed on the second main surface of the substrate with the first protection means provided on the first main surface of the substrate, in the sputtering process when forming the second conductive film The first protective means is exposed to a high temperature atmosphere. In this case, if the first protection means is formed using a resin film, gas may be generated from the resin film and the film formation of the second conductive film may be affected.

  In the aspect of the present invention, after forming the first conductive film and the second conductive film on both surfaces of the substrate, respectively, the second protective means is formed on the second conductive film, and then the first conductive film is patterned. . Thereby, since the protective means is not provided in the sputtering process for forming the first conductive film and the second conductive film, it is possible to prevent the occurrence of a failure such as generation of gas from the protective means. In addition, since the second conductive film is protected by the second protection means during the first patterning step, it is possible to prevent the second conductive film from being damaged or foreign matter from adhering. On the other hand, since the first electrode is protected by the first protection means during the second patterning step, the surface of the first main surface of the substrate or the first electrode is prevented from being scratched or adhering to foreign matter. It is possible to prevent the first electrode from being defective.

  Next, in the first electrode substrate manufacturing method according to the present invention, in the first protection means forming step, the first protection means is formed by applying a photosensitive resin to the first main surface of the substrate. In the second protection means forming step, the second protection means can be formed by applying a photosensitive resin to the second main surface of the substrate. In the first protective means forming step, a photosensitive resin film as the first protective means is attached to the first main surface of the substrate, and in the second protective means forming step, the second main surface of the substrate is A photosensitive resin film as the second protective means can be attached (that is, laminated).

  Thus, if the first protection means and the second protection means are formed as a film made of a photosensitive resin, the first protection means and the second protection means can be easily formed in a predetermined shape. it can. In the case where the first protective means and the second protective means are provided by applying a photosensitive resin, the same material and apparatus as the resist used for patterning the conductive film in the first patterning step and the second patterning step are used. Since it can be used, a protection means can be formed easily. Further, when the first protection means and the second protection means are provided by attaching (that is, laminating) a photosensitive resin film, the protection is performed by a simple operation of attaching the photosensitive resin film to the surface of the substrate. Means can be provided.

  Next, in the manufacturing method of the 1st electrode substrate which concerns on this invention, the glass body as said 1st protection means can be affixed on the 1st main surface of the said board | substrate at the said 1st protection means formation process. In the second protection means forming step, a glass body as the second protection means can be attached to the second main surface of the substrate. In this configuration, as the glass body, for example, the same glass substrate used as the substrate can be used. This glass body can be attached to the surface of the substrate using an adhesive, for example. The adhesive can be formed in a frame shape, for example, in plan view, and can seal the gap between the substrate and the glass body. Thereby, the electrode formed on the surface of the substrate itself or the surface of the substrate can be protected. Further, if a glass body is used as the protection means, the protection means can be easily attached and detached by providing or removing the adhesive.

  Next, in the first electrode substrate manufacturing method according to the present invention, a step of attaching a first protective film covering the first electrode to the first main surface of the substrate after the first protection means removing step; A step of attaching a second protective film covering the second electrode to the second main surface of the substrate after the first protective means removing step, and the first protective film and the second protective film being attached A step of providing a dividing groove on the substrate and a step of dividing the substrate along the dividing groove, wherein the first protective film and the second protective film are provided with the dividing groove. It is desirable not to be provided.

  As a method of manufacturing an electrode substrate, there are a method of making individual electrode substrates one by one and a so-called multi-cavity method of simultaneously producing a plurality of electrode substrates. In general, the latter multi-piece method is used. The aspect of the present invention relates to this multi-cavity technique. In this multi-cavity method, generally, a plurality of conductive patterns are formed on a large-area substrate on which a plurality of substrates can be formed, and then divided into individual substrates. In the process of dividing the substrate, a so-called scribing process is performed, in which a dividing groove is provided along a line dividing the substrate into individual substrates, and a process of dividing the substrate into individual substrates is performed. Done.

  According to the aspect of the present invention, after the first protection means removing step, the step of attaching the protective film covering the first electrode to the first main surface of the substrate, and the protective film covering the second electrode as the second main surface of the substrate Since the step of attaching to the substrate is provided, it is possible to prevent the surface itself on both sides of the substrate itself, the first electrode, and the second electrode from being damaged or foreign matter from adhering when the substrate is provided with a dividing groove. In addition, since the protective film is not provided in the portion where the groove is provided in the step of providing the dividing groove on the substrate, the protective film is not cut off during the step of providing the dividing groove. Thereby, it can prevent that dust generate | occur | produces by cutting a protective film.

  Next, in the first electrode substrate manufacturing method according to the present invention, a first conductive film forming step of forming a first conductive film on the first main surface of the substrate, and patterning the first conductive film A first patterning step for forming one electrode; a metal film forming step for forming a metal film covering the first electrode on the first main surface of the substrate; and a second main surface of the substrate after the metal film forming step. A second conductive film forming step for forming a second conductive film, a second patterning step for patterning the second conductive film to form a second electrode, and patterning the metal film after the second patterning step. And a third patterning step of forming a conductive member.

  In the manufacturing method of the electrode substrate having this configuration, a metal film covering the first electrode can be formed in the metal film forming step after the first patterning step. In this way, the first electrode formed on the first main surface of the substrate is protected by the metal film, so that when the second electrode is formed on the second main surface of the substrate, the substrate is used in a manufacturing apparatus such as a sputtering apparatus. The surface of the first main surface of the substrate and the first electrode are not directly in contact with the portion where the substrate is placed. As a result, it is possible to prevent the surface of the first main surface of the substrate and the first electrode from being damaged or foreign matter from adhering, and to prevent the first electrode from being defective.

  In addition, the conductive member is formed by patterning the metal film after the second patterning step. As the conductive member, for example, a metal wiring, a metal terminal, or the like can be considered. These conductive members are generally provided on the electrode substrate. In the aspect of the present invention, since the metal film that is the conductive member material layer can be used as a protection means, the protective film can be provided without increasing the number of manufacturing steps. As a result, the manufacturing cost can be kept low.

  Next, in the first electrode substrate manufacturing method according to the present invention, after the third patterning step, a first protective film covering the first electrode and the conductive member is attached to the first main surface of the substrate; A step of attaching a second protective film covering the second electrode to the second main surface of the substrate after the third patterning step; and the substrate on which the first protective film and the second protective film are attached. A step of providing a dividing groove and a step of dividing the substrate along the dividing groove, wherein the first protective film and the second protective film are provided in a portion where the dividing groove is provided. It is desirable not to be provided.

  The aspect of the present invention also relates to a method of manufacturing an electrode substrate using a multi-cavity technique. According to the aspect of the present invention, after the third patterning step, the step of attaching the first protective film covering the first electrode and the conductive member to the first main surface of the substrate and the second protective film covering the second electrode are formed on the substrate. Since the step of attaching to the second main surface is provided, when the dividing grooves are provided in the substrate, the surface itself on both sides of the substrate itself, the first electrode, the second electrode, and the conductive member are scratched or foreign matter adheres. Can be prevented. In addition, since the first protective film and the second protective film are not provided in the portion where the groove is provided in the step of providing the dividing groove on the substrate, the protective film is removed in the step of providing the dividing groove. It will not be done. Thereby, it can prevent that dust generate | occur | produces by cutting a protective film.

  Next, in the first electrode substrate manufacturing method according to the present invention, the substrate has translucency, and the conductive material has translucency in the first conductive film forming step and the second conductive film forming step. It is desirable to form the first conductive film and the second conductive film by using. In an electro-optical device such as a liquid crystal device, a light-transmitting substrate is often used to perform display using light. According to the electrode substrate of this configuration, the substrate is made translucent, and the conductive film formed on both surfaces of the substrate is formed using a translucent material, which is suitable for an electro-optical device such as a liquid crystal device. Can be used.

  Next, in the first electrode substrate manufacturing method according to the present invention, the conductive material used in the first conductive film forming step may be p (poly) -ITO (Indium Tin Oxide). desirable. p-ITO is so-called crystalline ITO or polycrystalline ITO. This p-ITO is generally a conductive material having high transparency and low resistance. Therefore, when the first conductive film is formed using p-ITO, a conductive film having high transparency and low resistance can be provided on the surface of the substrate.

  Next, in the first electrode substrate manufacturing method according to the present invention, in the second conductive film forming step, the second conductive film is formed using amorphous ITO, and the second conductive film is patterned. It is desirable to further include a firing step for polymorphizing the second electrode. a-ITO is so-called amorphous ITO. This a-ITO is an ITO having weak etching resistance compared to p-ITO. That is, a-ITO can be etched with a weak etchant.

  Although the first electrode formed on the first main surface of the substrate is protected by the first protection means, the first protection means may be damaged for some reason. If the second patterning step is performed in this state, an etching solution for etching the second conductive film may enter from the scratched portion of the first protection means and corrode the first electrode. In the aspect of the present invention, since the second conductive film is formed using a-ITO, even if the etching solution enters from the first protection means and reaches the first electrode, the first electrode formed of p-ITO is used. Will not corrode.

  In the aspect of the present invention, the a-ITO used for the second conductive film can be polycrystallized (that is, crystallized or polycrystallized) in the firing step. Although a-ITO is a conductive material with low transparency and high resistance value, it can be improved in transparency and reduced in resistance value by polylization, and can have the same function as the first conductive film. Further, a-ITO can be formed at a lower temperature than p-ITO. Therefore, when forming the second conductive film in the second conductive film forming step, the first protective means formed on the opposite surface can be prevented from being cured by heat.

  Next, a second electrode substrate manufacturing method according to the present invention is a method for manufacturing an electrode substrate having electrodes on both the first main surface and the second main surface of the substrate. Forming a first conductive film on the surface; forming a first electrode by patterning the first conductive film; and forming the first substrate after the first patterning process. A thinning step, a second conductive film forming step of forming a second conductive film on the first main surface of the second substrate, a second patterning step of patterning the second conductive film to form a second electrode, After the second patterning step, the method includes a step of thinning the second substrate, and a step of bonding the second main surface of the first substrate and the second main surface of the second substrate.

  Unlike the above-described first manufacturing method, the second electrode substrate manufacturing method according to the present invention is a method of forming electrodes on both surfaces of the substrate without providing protective means. In the method of manufacturing an electrode substrate having this configuration, an electrode substrate having electrodes on one side of the substrate is formed by forming electrodes on the first main surface of both the first substrate and the second substrate, and the electrodes An electrode substrate having electrodes on both front and back surfaces was formed by bonding the substrates. The first substrate and the second substrate are each formed with electrodes only on one side of the substrate. Therefore, when forming the electrode on the first substrate, it is not necessary to provide protective means on the second main surface of the substrate in the first conductive film forming step and the first patterning step. Further, when forming the electrode on the second substrate, it is not necessary to provide a protective means on the second main surface of the substrate in the second conductive film forming step and the second patterning step. Therefore, it is possible to form a conductive pattern on both the front and back surfaces of the substrate without providing protective means on the surface of the substrate.

  In the second manufacturing method according to the present invention, a step of thinning both the first substrate and the second substrate is provided. In this step, for example, the first substrate and the second substrate can be formed thin by etching the surface on which no electrode is formed. In this case, an electrode substrate formed by bonding the first substrate and the second substrate to each other can be thinly formed. The step of thinning the substrate is performed after the first patterning step for the first substrate, and after the second patterning step for the second substrate. Accordingly, the operation of forming the electrodes on the first main surface of the first substrate and the first main surface of the second substrate can be performed in a state where the first substrate and the second substrate are sufficiently thick. It is possible to prevent the one substrate and the second substrate from being damaged during the work.

  Next, in the second electrode substrate manufacturing method according to the present invention, after the step of bonding the first substrate and the second substrate, a first protective film covering the first electrode is formed on the first electrode substrate. A step of affixing to the main surface; a step of affixing a second protective film covering the second electrode after the step of forming the electrode substrate to the second main surface of the electrode substrate; the first protective film and the first substrate; A step of providing a dividing groove on the electrode substrate to which two protective films are attached, and a step of dividing the electrode substrate along the dividing groove, wherein the first protective film and the second protective film are provided. It is desirable that the film is not provided in a portion where the dividing groove is provided.

  The aspect of the present invention also relates to a method of manufacturing an electrode substrate using a multi-cavity technique. According to the aspect of the present invention, after the step of forming the electrode substrate, the step of attaching the first protective film covering the first electrode to the first main surface of the electrode substrate, and the second protective film covering the second electrode as the electrode Since the step of attaching to the second main surface of the substrate is provided, when the groove for dividing is provided in the electrode substrate, the surface itself on both sides of the substrate itself, the first electrode and the second electrode are scratched or foreign matter adheres. Can be prevented. In addition, since the first protective film and the second protective film are not provided in the portion where the groove is provided in the step of providing the dividing groove on the electrode substrate, the protective film is not provided in the step of providing the dividing groove. It will not be shaved. Thereby, it can prevent that dust generate | occur | produces by cutting a protective film.

  Next, in the second electrode substrate manufacturing method according to the present invention, the first substrate and the second substrate have translucency, and in the first conductive film forming step and the second conductive film forming step, It is desirable to form the first conductive film and the second conductive film using a light-transmitting conductive material. In this case, it can be suitably used for an electro-optical device such as a liquid crystal device.

(First Embodiment of Electrode Substrate Manufacturing Method)
Hereinafter, a first embodiment of an electrode substrate manufacturing method according to the present invention will be described. Note that the electrode substrate exemplified in the description of the present embodiment is not intended for a specific application, but may be used as an apparatus that detects an instructed position in a planar area, for example, a touch panel. The embodiments described below are examples of the present invention and do not limit the present invention. In the following description, reference will be made to the drawings as necessary. In this drawing, in order to clearly show important constituent elements among the structure composed of a plurality of constituent elements, the relative dimensions different from actual ones are shown. Is shown.

  FIG. 1 shows the manufacturing method according to the present embodiment by the transition of the substrate structure. First, an electrode substrate manufactured by this manufacturing method will be described with reference to FIG. 1 (h). The electrode substrate 1 has electrodes 104a, 104a on both front and back surfaces of a translucent substrate 102 formed of glass, plastic, or the like. It is formed by forming 104b. Reference numeral 103 denotes a conductive member such as a wiring.

  In the manufacturing method of the present embodiment, the material film 103 ′ of the conductive member 103 is formed on the surface of the substrate 102 in FIG. 1A, and the material film 103 ′ is patterned by a photoetching process or the like, so that FIG. ) Is formed. Next, in FIG. 1C, a first conductive film 104a ′ is formed on the first main surface S1 of the substrate 102, and this first conductive film 104a ′ is patterned by a photoetching process or the like, and then FIG. The first electrode 104a shown in FIG. Further, in FIG. 1E, a protective film 125 is formed so as to cover the first electrode 104a.

  Next, the front and back sides of the substrate 102 are reversed, and in FIG. 1F, a second conductive film 104b ′ is formed on the second main surface S2 of the substrate 102, and this second conductive film 104b ′ is subjected to a photoetching process or the like. To form the second electrode 104b of FIG. At the time of this electrode formation, the first main surface S1, which is the opposite surface of the second main surface S2, which is the processing surface, is supported on the support base of the processing apparatus, so that scratches or foreign matters adhere to it. Inconvenience may occur. However, since the first main surface S1 is protected by the protective film 125, the first main surface S1 is not scratched or attached with foreign matter. After the second electrode 104b is formed on the second main surface S2 as described above, the protective film 125 on the opposite surface is removed to complete the electrode substrate 1 in FIG.

  As described above, according to the present embodiment, the conductive films 104 a ′ and 104 b ′ and the subsequent conductive film patterning are sequentially performed on each side of the substrate 102. Then, in the second patterning performed later in the process, the second patterning is performed while the surface patterned in the first patterning performed earlier is covered and protected by the protective film 125. In this way, the electrode formed by the first patterning is prevented from being scratched or foreign matter attached.

(Second Embodiment of Manufacturing Method of Electrode Substrate)
Hereinafter, 2nd Embodiment of the manufacturing method of the electrode substrate which concerns on this invention is described using FIGS. In the second embodiment, the first embodiment shown in FIG. 1 is implemented in a more realistic manner.

  First, an electrode substrate manufactured using the electrode substrate manufacturing method according to the present embodiment will be described with reference to FIGS. FIG. 2 is a side view of the electrode substrate. FIG. 3 is a plan view of the substrate viewed from the direction of arrow Z3 in FIG. In these drawings, the electrode substrate 1 has a translucent substrate 2, and the translucent substrate 2 has a first main surface S1 and a second main surface S2 which is the opposite surface. The translucent substrate 2 is formed using, for example, translucent glass, translucent plastic, or the like. On the first main surface S1 of the translucent substrate 2, a first translucent electrode 4a as a plurality of first electrodes and a wiring 3 connected to one end of the first translucent electrode 4a. And are provided. The first translucent electrodes 4a extend in a strip shape in the vertical direction X and are arranged at intervals in the horizontal direction Y, as indicated by broken lines in FIG.

  The first translucent electrode 4a is formed using p (poly) -ITO which is a translucent conductive material. p-ITO is so-called crystalline ITO or polycrystalline ITO. This p-ITO is generally a conductive material having high transparency and low resistance. Therefore, if the 1st translucent electrode 4a is formed using p-ITO, an electrode with high transparency and a low resistance value can be provided on the surface of the substrate. In addition, the 1st translucent electrode 4a can also be formed using translucent conductive materials other than ITO.

  The wiring 3 is made of a conductive material, and a plurality of wirings 3 are provided. These wirings 3 are formed by a portion extending along the side edges 2 b and 2 c extending in the horizontal direction Y of the translucent substrate 2 and a portion extending in the vertical direction X. The individual wirings 3 are arranged with a space therebetween.

  In FIG. 2, a conductive member 7 is provided on the left end portion 6 of the wiring 3, and a terminal portion 5 a is formed by the tip portion 6 and the conductive member 7. Hereinafter, the tip portion 6 is referred to as a first layer of the terminal portion 5a, and the conductive member 7 is referred to as a second layer of the terminal portion 5a. A plurality of terminal portions 5a are provided on the substrate 2 as shown in FIG. These terminal portions 5 a are arranged at intervals along the vertical direction X in the vicinity of the edge 2 a extending in the vertical direction of the translucent substrate 2. Each terminal portion 5a is formed in a square or rectangular dot shape when seen in a plan view. The terminal portion 5a may be formed in a circular shape.

  In FIG. 2, the wiring 3 including the first layer 6 is made of metal. In this embodiment, a single layer structure of Cr (chromium) is used as the metal. The 2nd layer 7 of the terminal part 5a is formed using p-ITO which is a translucent conductive material like the 1st translucent electrode 4a. Note that the wiring 3 can also be formed of a laminated film made of Cr and p-ITO covering the same. In this case, the second layer 7 of the terminal portion 5 a is the upper layer itself of the laminated film forming the first layer 6.

  Next, on the second main surface S2 of the translucent substrate 2, a second translucent electrode 4b as a second electrode is provided. One end on the left side of the second translucent electrode 4b constitutes a terminal portion 5b. The terminal portion 5b is provided at a position overlapping the terminal portion 5a on the opposite surface in plan view. In addition, you may provide the terminal part 5a and the terminal part 5b in the position which does not overlap planarly.

  The second translucent electrode 4b is formed in a strip shape extending in the lateral direction Y as shown by a solid line in FIG. A plurality of the strip-like second light-transmissive electrodes 4 b are arranged along the vertical direction X with an interval. Accordingly, the second translucent electrode 4b formed in a strip shape extends in a direction orthogonal to the first translucent electrode 4a provided on the first main surface S1 which is the opposite surface. ing. The second translucent electrode 4b is formed using p-ITO, which is a translucent conductive material, like the first translucent electrode 4a. In addition, the 2nd translucent electrode 4b can also be formed using translucent conductive materials other than ITO.

  In this embodiment, the 1st translucent electrode 4a and the terminal part 5a comprise the electrode on a 1st main surface. Moreover, the 2nd translucent electrode 4b and the terminal part 5b comprise the electrode on a 2nd main surface. In the present specification, the electrode and other conductive elements (for example, the wiring 3) may be collectively referred to as a conductive pattern.

Hereinafter, a method for manufacturing the electrode substrate 1 having the above configuration will be described.
In the present embodiment, rather than manufacturing each electrode substrate one by one, a plurality of electrode substrates are simultaneously manufactured using a light-transmitting substrate having a large area (so-called mother light-transmitting substrate). The electrode substrate is manufactured based on the technique. In such a multi-cavity manufacturing method, the electrode substrates 1 shown in FIG. 3 are not formed one by one, but a plurality of electrode substrates 1 as shown in FIGS. 4 (a) and 4 (b). A plurality of elements of the electrode substrate 1 (that is, the first translucent electrode 4a, the second translucent electrode 4b, etc. are included on the mother translucent substrate 2 ′ having an area large enough to form A conductive pattern) is formed at the same time. In this way, a large-area panel structure 1 ′ having a size including a plurality of rows of electrode substrates 1 in the vertical and horizontal directions is produced, and the grooves for dividing the large-area panel structure 1 ′ in the vertical and horizontal directions. Then, the panel structure 1 ′ is divided along the grooves to produce individual electrode substrates 1.

  FIG. 5 shows an embodiment of a method for manufacturing an electrode substrate according to the present invention. 6 to 15 are structural transition diagrams showing the transition of the structure of the substrate formed in each step of FIG. In particular, FIGS. 6 to 10 show cross sections according to the Z6-Z6 line shown on the upper left side of FIG. 4A, that is, cross sections crossing the terminal portions 5a and 5b. FIGS. 11 to 15 are enlarged plan views showing the plane portion Z11 including the Z6-Z6 cross section. These sectional views of FIGS. 6 to 10 and plan views of FIGS. 11 to 15 show a sectional structure and a planar structure in the same process, respectively.

  In the cross-sectional views of FIGS. 6 to 10, the surface to be processed is drawn as the upper surface. For this reason, the state of FIGS. 6-8 and the state of FIGS. 9-10 are upside down. In addition, in the plan views of FIGS. 11 to 15, the surface to be processed is drawn as the front surface. For this reason, the state of FIGS. 11-13 and the state of FIGS. 14-15 are reversed. Hereinafter, the manufacturing method of FIG. 5 will be described with reference to FIGS.

  In FIG. 5, processes P1 to P7 are a first main surface forming process Q1 for forming a conductive pattern on the first main surface (back surface) S1 of the mother substrate 2 'of FIG. Step P8 to Step P11 in FIG. 5 are a second main surface forming step Q2 for forming a conductive pattern on the second main surface (front surface) S2 in FIG. Steps P13 and P14 in FIG. 5 are steps Q3 for dividing the mother substrate 2 'in FIG. 4A into individual substrates.

  First, the first main surface forming step Q1 for the mother substrate 2 'shown in FIG. In step P1 of FIG. 5, the mother substrate 2 'of FIG. 4A is cleaned with a predetermined cleaning liquid. Next, in step P2 of FIG. 5, as shown in FIGS. 6A and 11A, the material layer 3 ′ is sputtered on the first main surface S1 of the mother substrate 2 ′, for example, using Cr as a material. To a film thickness of about 2000 mm. The material layer 3 'is a material layer of the first layer 6 of the terminal 3a which is the wiring 3 in FIG.

  Next, in the process P3 of FIG. 5, the material layer 3 'shown in FIGS. 6A and 11A is patterned by a photoetching process. Specifically, first, as shown in FIGS. 6B and 11B, a resist 21a, which is a positive photosensitive resin, is formed on the material layer 3 ′ with a uniform thickness by, for example, spin coating. Apply to. Next, pre-baking is performed to remove the solvent in the resist 21a.

  Next, an exposure process is performed on the applied resist 21a in FIGS. 6C and 11C. Specifically, the mother substrate 2 'is installed at a predetermined position of an exposure apparatus, for example, a batch exposure apparatus, and an exposure mask 22A shown in FIG. 6C is installed at a predetermined position facing the mother substrate 2'. The exposure mask 22A is a two-tone exposure mask having two regions, a complete light transmission region A0 formed by the glass substrate 23 and a complete light shielding region A1 formed by the light shielding pattern 24A. The exposure mask 22A is placed at a position facing the mother substrate 2 ′ so that the complete light transmission region A0 faces the portion where the resist 21a is removed and the complete light shielding region A1 faces the portion where the resist 21a is left. . In this state, when the resist 21a is irradiated with a certain amount of exposure light L1 through the exposure mask 22A, an exposure image indicated by a chain line is formed and the exposed portion B1 is solubilized.

  Next, development processing is performed by immersing the mother substrate 2 ′ of FIGS. 6C and 11C in a developer for a predetermined time. Then, the resist 21a of the solubilized portion B1 in FIG. 6C is removed, and the resist 21a is patterned into the shapes shown in FIGS. 6D and 11D. Next, post-baking is performed to adjust the resistance of the resist 21a with respect to the etching solution used for the subsequent etching process. Thereafter, the material layer 3 ′ is patterned by performing an etching process on the material layer 3 ′ using the resist 21 a as a mask, as shown in FIG. 6E and FIG. 11E. Further, the resist 21a used as a mask is removed by, for example, sulfuric acid or the like, so that the wiring 3 and the terminal portion 5a (see FIG. 2) as a metal film as shown in FIG. 7 (f) and FIG. 12 (f). The first layer 6 is formed.

  Next, in the process P4 of FIG. 5 as the first conductive film forming process, the first translucent electrode 4a of FIG. 2 is formed on the wiring 3 and the first layer 6 of FIG. 7G and FIG. A p (poly) -ITO film 4a ′ as a first conductive film, which is a material of the above, is formed to a thickness of about 500 mm by sputtering.

  Next, the process P5 of FIG. 5 as the first patterning process is performed as shown in FIGS. 7 (h) to 8 (k) and FIGS. 12 (h) to 13 (k). Specifically, first, as shown in FIGS. 7H and 12H, a resist 21b, which is a positive photosensitive resin, is uniformly applied on the p-ITO film 4a ′ by, for example, spin coating. Apply to thickness. Next, pre-baking is performed to remove the solvent in the resist 21b.

  Next, an exposure process is performed on the applied resist 21b in FIGS. 7 (i) and 12 (i). Specifically, the mother substrate 2 'is set at a predetermined position of an exposure apparatus, for example, a batch exposure apparatus, and the exposure mask 22B of FIG. 7 (i) is set at a predetermined position facing the mother substrate 2'. The exposure mask 22B is a two-tone exposure mask having two regions, a complete light transmission region A0 formed by the glass substrate 23 and a complete light shielding region A1 formed by the light shielding pattern 24B. The exposure mask 22B is placed at a position facing the mother substrate 2 ′ so that the complete light transmission region A0 faces the portion where the resist 21b is removed and the complete light shielding region A1 faces the portion where the resist 21b is left. . In this state, when the resist 21b is irradiated with a certain amount of exposure light L2 through the exposure mask 22B, an exposure image indicated by a broken line is formed and the exposed portion B2 is solubilized.

  Next, the mother substrate 2 ′ shown in FIGS. 7 (i) and 12 (i) is immersed in a developer for a predetermined time to perform development processing. Then, the resist 21b of the portion B2 solubilized in FIG. 7 (i) is removed and patterned into the shapes shown in FIGS. 8 (j) and 13 (j). Next, post-baking is performed to adjust the resistance of the resist 21b with respect to the etching solution used for the subsequent etching process. Thereafter, the p-ITO film 4a 'is patterned by etching using the resist 21b as a mask, as shown in FIGS. 8K and 13K.

  Next, the resist 21b used as a mask is removed by, for example, an organic solvent or the like in step P6 of FIG. 5 to thereby form the first translucent electrode 4a as shown in FIGS. 8 (l) and 13 (l). And the 2nd layer 7 of the terminal part 5a is formed.

  Next, the protective film forming step P7 of FIG. 5 as the first protective means forming step is performed. Specifically, in FIGS. 8 (m) and 13 (m), a positive photosensitive resin 25, which is a protective film as the first protective means, is formed into a mother substrate to a thickness of 1 μm to 2 μm by spin coating, for example. The first translucent electrode 4a and the terminal portion 5a are covered with this protective film 25. The protective film 25 prevents the first translucent electrode 4a and the like from being scratched and foreign matter adhering in the subsequent steps. Thus, the first main surface forming process for the first main surface S1 of the mother substrate 2 'is completed.

  Next, the second main surface forming step Q2 for the second main surface S2 of the mother substrate 2 'will be described. First, in step P8 of FIG. 5, the mother substrate 2 ′ is turned over so that the second main surface (front surface) S2 of FIG. 4A can be processed, and the second main surface S2 is cleaned with a predetermined cleaning liquid. To do. Next, in step P9 of FIG. 5 as the second conductive film forming step, as shown in FIGS. 9A and 14A, the second main surface S2 of the mother substrate 2 ′ is formed on the second main surface S2 of FIG. An a (amorphous) -ITO film 4b ′, which is a material of the two translucent electrode 4b, is formed to a thickness of about 500 mm by sputtering.

  Next, the process P10 of FIG. 5 as the second patterning process is performed as shown in FIGS. 9B to 10E and FIGS. 14B to 15E. Specifically, first, as shown in FIGS. 9B and 14B, a resist 21c, which is a positive photosensitive resin, is uniformly applied on the a-ITO film 4b ′ by, for example, spin coating. Apply to thickness.

  Next, in FIG. 9C and FIG. 14C, exposure processing is performed on the applied resist 21c. Specifically, the mother substrate 2 'is set at a predetermined position of an exposure apparatus, for example, a batch exposure apparatus, and the exposure mask 22C is set at a predetermined position facing the mother substrate 2'. At this time, alignment is performed between the pattern on the first main surface S1, which is the back surface of the second main surface S2, and the exposure mask 22C through the translucent mother substrate 2 '. The exposure mask 22C is a two-tone exposure mask having two regions, a complete light transmission region A0 formed by the glass substrate 23 and a complete light shielding region A1 formed by the light shielding pattern 24C. The exposure mask 22C is placed at a position facing the mother substrate 2 ′ so that the complete light transmission region A0 faces the portion where the resist 21c is removed and the complete light shielding region A1 faces the portion where the resist 21c is left. . In this state, when the resist 21c is irradiated with a certain amount of exposure light L3 through the exposure mask 22C, an exposure image indicated by a broken line is formed and the exposed portion B3 is solubilized.

  Next, development processing is performed by immersing the mother substrate 2 ′ of FIGS. 9C and 14C in a developer for a predetermined time. Then, the resist 21c of the portion B3 solubilized in FIG. 9C is removed and patterned into the shapes shown in FIGS. 10D and 15D. Next, post-baking is performed to adjust the resistance of the resist 21c with respect to the etching solution used for the subsequent etching process. Thereafter, the a-ITO film 4b 'is etched using the resist 21c as a mask, thereby patterning the a-ITO film 4b' as shown in FIGS. 10 (e) and 15 (e).

  Next, in the process P11 of FIG. 5 as the first protection means removing process, the resist 21c of FIG. 10E used as a mask and the protective film 25 on the first main surface S1 which is the opposite surface are made of, for example, an organic solvent. The second light-transmissive electrode 4b and the terminal portion 5b are formed as shown in FIGS. 10 (f) and 15 (f). Thus, the second main surface forming step for the second main surface S2 of the mother substrate 2 ′ is completed, and the panel structure 1 ′ of FIG. 4 in which conductive patterns are formed on both surfaces of the mother translucent substrate 2 ′ is completed. To do.

  While the second main surface forming step Q2 is performed, the first main surface S1 of the mother substrate 2 'is supported on the support member of the processing apparatus used in each step. In this case, since 1st main surface S1 contacts the support surface of a supporting member, it is possible that a damage | wound or a foreign material adheres. However, in the present embodiment, since the first main surface S1 is covered and protected by the protective film 25 while the second main surface forming step Q2 is performed, the protective film 25 may be damaged. Although there is no damage, the electrodes in the protective film 25 are not damaged.

  Next, in step P12 of FIG. 5, on both sides of the panel structure 1 ′, as shown in FIG. 4B, which shows a cross-sectional structure according to the Z4-Z4 line shown on the right side of FIG. Thus, resin films 26a and 26b as protective films are provided in regions corresponding to the individual electrode substrate 1 portions. Specifically, on the first main surface S1 of the mother substrate 2 ′, the first translucent electrode 4a, the terminal portion 5a (see FIG. 4A) and the wiring 3 belonging to each electrode substrate 1 portion are covered. A plurality of island-shaped resin films 26a as first protective films having a shape capable of being attached are attached on the individual electrode substrate 1 portions (see FIG. 16B). These island-shaped resin films 26a are attached by sticking (that is, laminating) on the first main surface S1 of the mother substrate 2 '. Adjacent resin films 26a are provided at a predetermined interval. Accordingly, the region where the resin film 26a is not provided on the first main surface S1 of the mother substrate 2 ′, that is, the region T where the surface of the first main surface S1 of the mother substrate 2 ′ is exposed (FIG. 4A). ) And (b)).

  On the other hand, on the second main surface S2 of the mother substrate 2 ′, as shown in FIG. 4B, the second translucent electrode 4b and the terminal portion 5b (FIG. 4A) belonging to each electrode substrate 1 portion. A plurality of island-shaped resin films 26b as second protective films are attached on the respective electrode substrate 1 portions in a shape that can cover (see FIG. 16 (c)). These island-shaped resin films 26b are also attached by sticking (that is, laminating) on the second main surface S2 of the mother substrate 2 '. Adjacent resin films 26b are also provided at a predetermined interval. Therefore, on the second main surface S2 of the mother substrate 2 ′, the region where the resin film 26b is not provided, that is, the region T where the surface of the second main surface S2 of the mother substrate 2 ′ is exposed (FIG. 4A). ) And (b)). Further, as shown in FIG. 4A, a region T (indicated by hatching) where the resin films 26a and 26b are not provided is also provided along the outer periphery of the mother substrate 2 '. As the resin films 26a and 26b, for example, an acrylic resin or a nitride film can be used.

  The region along the chain line X0 in the region T indicated by oblique lines is a region in which a dividing groove is formed by scribing (that is, scoring) when the panel structure 1 ′ is divided into individual electrode substrates 1. . Thus, if the surface of the mother substrate 2 ′ is exposed without providing the resin films 26a and 26b in the region where the dividing groove is formed, the resin films 26a and 26b are scraped when the mother substrate 2 ′ is scribed. Therefore, the shaved resin films 26a and 26b do not become dust and pollute the atmosphere.

  By the way, the panel structure 1 ′ to which the resin films 26 a and 26 b are attached is then received in a magazine (that is, a storage frame) having an appropriate structure and subjected to necessary processing. Of the region T, the region along the outer periphery of the mother substrate 2 ′ is a region where the magazine contacts the mother substrate 2 ′ in a later process. If the substrate surface is exposed without providing the resin films 26a and 26b in the portion along the outer periphery of the mother substrate 2 'as in the present embodiment, the workability in the subsequent process is improved.

  Next, referring to FIG. 5, a process Q3 for dividing the panel structure 1 'will be described. First, in step P13, a dividing groove is formed by scribing, for example, with a glass scriber along the chain line X0 on the first main surface S1 of the panel structure 1 'of FIG. 4A. At this time, since the resin film 26a is not provided on the first main surface S1 of the mother substrate 2 ′ and along the chain line X0, the glass scriber removes the resin film 26a from the mother substrate 2 ′. The surface can be scribed directly. In addition, since the resin film 26b is not provided in the portion along the chain line X0 also on the second main surface S2 that is the back surface, the second main surface S2 of the mother substrate 2 'can also be directly scribed by the glass scriber.

  Next, in step P14 of FIG. 5, using a break machine or the like, for example, as shown in FIG. 16 (d), the panel structure 1 ′ is a strip including a plurality of elements of the electrode substrate 1 in a line. Into the shape 1a '(primary break). Thereafter, the strip-shaped panel structure 1a ′ is divided (secondary break) along the dividing grooves as shown in FIG. 16E, thereby producing the individual electrode substrates 1 shown in FIG. .

  Next, in the firing step P15 of FIG. 5, the individual electrode substrates 1 are fired at a predetermined temperature. By this baking, the second translucent electrode 4b (see reference numeral 4 'in FIG. 10) formed as a film by a-ITO in the process P9 and patterned in the process P10 is polycrystallized. By this polycrystallization, the translucency of the second translucent electrode 4b can be improved and the resistance value can be lowered. The electrode substrate 1 is completed through the series of steps described above.

  In the manufacturing method of the electrode substrate of this embodiment, in the protective film formation process P7 after the p-ITO patterning process P5 of FIG. 5, as shown in FIG. 8 (m) and FIG. The protective film 25 is formed in a shape covering the electrode 4a, the terminal portion 5a, and the wiring 3 (hereinafter referred to as a first main surface film element). As a result, the first main surface film elements 4a, 5a, 3 formed on the first main surface S1 of the substrate 2 ′ are protected by the protective film 25, so that the second main surface of the mother substrate 2 ′ of FIG. When the second translucent electrode 4b and the terminal portion 5b are formed on the surface (front surface) S2, the surface of the first main surface (back surface) S1 and the first main surface film elements 4a, 5a, 3 are formed by a sputtering device or the like. It is no longer possible to directly touch the table or magazine of the manufacturing apparatus. As a result, the surface of the first main surface S1 of the mother substrate 2 ′ and the first main surface film elements 4a, 5a, 3 can be prevented from being scratched or adhering to foreign matters, and the first main surface film elements 4a, 4a, It is possible to prevent defects from occurring in 5a and 3.

  Further, in this embodiment, in the protective film attaching step P12 of FIG. 5, as shown in FIG. 4A, it is made to correspond to the area of each electrode substrate 1 portion on both surfaces S1, S2 of the mother substrate 2 ′. Thus, a plurality of resin films 26a and 26b are attached. In this case, a region T where the surface of the substrate 2 ′ is exposed without the resin films 26 a and 26 b is provided between the resin films 26 a adjacent to each other and between the resin films 26 b adjacent to each other. This prevents the resin film 26a or 26b from being scraped during the scribing step P13 in the dividing step Q3 in FIG. As a result, the shaved resin film 26a or 26b can be prevented from becoming dust and contaminating the atmosphere.

  In the present embodiment, the first translucent electrode 4a on the first main surface (rear surface) S1 in FIG. 3 and the second layer 7 of the terminal portion 5a are formed in the first main surface forming step Q1 in FIG. -It was formed using ITO. On the other hand, the second translucent electrode 4b and the terminal portion 5b on the second main surface S2 in FIG. 3 are formed using a-ITO in the second main surface forming step Q2 in FIG. The a-ITO was decided to be polycrystallized by baking in the above.

  In the present embodiment, in the second main surface cleaning step P8 or the a-ITO sputtering step P9, the protective film 25 provided on the first main surface S1 that is the opposite surface of the second main surface S2 that receives those processes. May be scratched. When scratches are formed in this way, the etching solution may enter the scratches on the protective film 25 in the a-ITO patterning step P10. However, since a-ITO can be etched with a weaker etchant than p-ITO, if a weak etchant is used in the a-ITO patterning step P10, it is temporarily etched due to scratches or the like on the protective film 25. Even if the liquid enters and reaches the first translucent electrode 4a or the terminal portion 5a, the first translucent electrode 4a formed of p-ITO and the second layer 7 of the terminal portion 5a are corroded. Absent.

  Further, in the present embodiment, a-ITO (see FIG. 10E), which is formed in the process P9 of FIG. 5 and further patterned in the process P10 to form the second translucent electrode 4b (see FIG. 10E), In the firing step P15, the material is polycrystallized. Thereby, the transparency of the 2nd translucent electrode 4b can be improved, and resistance value can be made low. As a result, the second translucent electrode 4b can have high translucency and low electrical resistance, similar to the first translucent electrode 4a formed using p-ITO. Further, a-ITO can be formed at a lower temperature than p-ITO. Therefore, when the a-ITO film 4b 'is formed in the a-ITO sputtering step P9 in FIG. 5, the protective film 25 formed on the opposite surface can be prevented from being cured by heat.

(Third embodiment of electrode substrate manufacturing method)
Next, 3rd Embodiment of the manufacturing method of the electrode substrate which concerns on this invention is described based on FIG. In the previous embodiment shown in FIG. 1 and FIG. 5, when forming electrodes on both sides of the substrate, the conductive film and subsequent conductive film patterning are sequentially performed on each side of the substrate, and in subsequent steps. In the second patterning performed, the second patterning was performed while protecting the surface patterned in the first patterning performed earlier by covering it with a protective film. On the other hand, in this embodiment, the method for forming the conductive film is modified. Specifically, first, a conductive film is simultaneously formed on both surfaces of a substrate, and then the conductive films on both surfaces are patterned one by one. Hereinafter, this embodiment will be specifically described.

  In the manufacturing method of the present embodiment, the material film 103 ′ of the conductive member 103 (see FIG. 17 (i)) is formed on the first main surface S1 of the substrate 102 in FIG. The conductive member 103 shown in FIG. 17B is formed by patterning by an etching process or the like. Next, in FIG. 17C, a first conductive film 104a ′ is formed on the first main surface S1 of the substrate 102, and at the same time, a second conductive film 104b ′ is formed on the second main surface S2 which is the opposite surface. . Next, in FIG. 17D, a protective film 135 is formed so as to cover the second conductive film 104b '.

  Next, the first conductive film 104a 'is patterned by a photo-etching process or the like to form the first electrode 104a shown in FIG. Next, the protective film 135 is removed as shown in FIG. Next, as shown in FIG. 17G, a protective film 125 is formed so as to cover the first electrode 104a. Next, the front and back sides of the substrate 102 are reversed, and the second conductive film 104b 'is patterned by a photo-etching process or the like to form the second electrode 104b of FIG.

  At the time of this electrode formation, the first main surface S1, which is the opposite surface of the second main surface S2, which is the processing surface, is supported on the support base of the processing apparatus, so that scratches or foreign matters adhere to it. Inconvenience may occur. However, since the first main surface S1 is protected by the protective film 125, the first main surface S1 is not scratched or attached with foreign matter. After the second electrode 104b is formed on the second main surface S2 as described above, the protective film 125 on the opposite surface is removed to complete the electrode substrate 1 of FIG. 17 (i).

  As described above, according to the present embodiment, after the conductive films 104 a ′ and 104 b ′ are simultaneously formed on both surfaces of the substrate 102, the subsequent conductive film patterning is sequentially performed on each surface of the substrate 102. Then, in the second patterning performed later in the process, the second patterning is performed while the surface patterned in the first patterning performed earlier is covered and protected by the protective film 125. In this way, the electrodes formed by the first patterning are prevented from being scratched or foreign matter attached.

(Fourth Embodiment of Electrode Substrate Manufacturing Method)
Hereinafter, 4th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention is described based on FIGS. In the fourth embodiment, the third embodiment shown in FIG. 17 is implemented in accordance with reality. In this embodiment, the electrode substrate 1 shown in FIG. 2 is manufactured. In the following description, the present embodiment will be described with a focus on differences from the previous embodiment, and description of common steps will be omitted.

  FIG. 18 is a process diagram showing each process constituting the electrode substrate manufacturing method according to the present embodiment. 19 and 20 are cross-sectional views showing the transition of the film configuration corresponding to each process from the double-sided p-ITO sputtering process P24 of FIG. 18 to the first resist and second main surface protective film peeling process P27. .

  In the present embodiment, the processes shown in P21 to P23 in FIG. 18 are the same as the processes shown in P1 to P3 in FIG. Moreover, the process shown to P29-P30 of FIG. 18 is the same as the process shown to P10-P11 of FIG. Therefore, detailed description of these steps is omitted.

  18 is completed, the wiring 3 and the first layer 6 of the terminal portion 5a (see FIG. 2) are formed as shown in FIG. 7F. Thereafter, in step P24 of FIG. 18, as shown in FIG. 19A, a p-ITO film 4a ′ as a first conductive film is formed on the first main surface S1 of the mother substrate 2 ′, and the mother substrate 2 ′. A p-ITO film 4b ″ as a second conductive film is formed on the second main surface S2. In the present embodiment, the p-ITO film 4a 'and the p-ITO film 4b "are simultaneously formed by simultaneously performing sputtering on both surfaces of the mother substrate 2'.

  Next, in the process P25 of FIG. 18 as the second protection means forming process, the positive type photosensitivity which is a protection film as the second protection means so as to cover the p-ITO film 4b ″ of FIG. 19B. The resin 35 is applied to form a film having a thickness of 1 μm to 2 μm, for example, by spin coating.

  Next, in the process P26 of FIG. 18 as the first patterning process, the p-ITO film 4a 'of FIG. 19B is patterned by a photoetching process. Specifically, first, in FIG. 19C, a resist 21d, which is a positive photosensitive resin, is applied on the p-ITO film 4a 'to a uniform thickness, and prebaked to obtain a solvent in the resist 21d. Remove. Thereafter, in FIG. 19D, an exposure process is performed on the resist 21d using the exposure mask 22D. By exposing using the exposure mask 22D, the exposed portion B4 in FIG. 19D is solubilized.

  Next, in FIG. 20E, the mother substrate 2 'is immersed in a developer for a predetermined time, and the resist 21d in the solubilized portion B4 (see FIG. 20D) is removed. Thereafter, post-baking is performed, and the p-ITO film 4a 'is etched using the resist 21d as a mask, thereby patterning the p-ITO film 4a' as shown in FIG.

  Thereafter, the resist 21d used as a mask and the protective film 35 on the opposite surface are peeled off in the process P27 of FIG. 18 as the second protective film removing process, whereby the first electrode 4a shown in FIG. A second layer 7 of the terminal portion 5a is formed. And in process P28 of Drawing 18 as the 1st protection means formation process, as shown in Drawing 20 (h), it is a protective film as the 1st protection means so that terminal part 5a and 1st electrode 4a may be covered. The positive photosensitive resin 25 is applied to form a film having a thickness of 1 μm to 2 μm, for example, by spin coating. Thus, the first main surface forming process Q1 of the mother substrate 2 'is completed.

  Thereafter, second main surface forming step Q2 is performed. This process Q2 is substantially the same as the process Q2 in the previous embodiment shown in FIG. 5, except for the following points. First, in the embodiment of FIG. 5, in FIG. 9A, an a-ITO film 4b 'as the second conductive film is formed on the second main surface S2 of the mother substrate 2'. On the other hand, in this embodiment, since the p-ITO film 4b ″ (see FIG. 19A) as the second conductive film has already been formed in the process P24 of FIG. 18, the first main surface formation is performed. When step Q1 is completed, the same film configuration as in FIG. 9A has been formed in FIG. Therefore, in the present embodiment shown in FIG. 18, the second main surface forming step Q2 is started from the second main surface p-ITO patterning step P29 as the second patterning step.

  As described above, the processes P29 to P30 are the same as the processes P10 to P11 in the previous embodiment shown in FIG. That is, in the process P29 in FIG. 18, the same processes as in FIGS. 9B to 10E are performed, and the second light-transmissive electrode 4b and the terminal portion 5b in FIG. 4A are formed. . Then, in step P30, the resist 21c shown in FIG. 10E and the protective film 25 on the opposite surface are peeled off, and the conductive film pattern shown in FIG. 10F appears, whereby the second main surface forming step. Q2 ends.

  Thereafter, as in the first embodiment, the protective film attaching step P12 shown in FIG. 5 is performed, the dividing step Q3 is subsequently executed, and further the firing is performed in the step P15, whereby the electrode substrate of FIG. 1 is completed.

  In this embodiment, after forming p-ITO films 4a ′ and 4b ″ on both surfaces of the mother substrate 2 ′ of FIG. 19A, respectively, the protection is performed on the p-ITO film 4b ″ of FIG. 19B. The film 35 was formed, and then the p-ITO film 4a ′ was patterned. As a result, the sputtering process for forming the p-ITO films 4a 'and 4b "can be performed in a state where no protective film is provided. Therefore, even if the p-ITO films 4a 'and 4b' 'are formed by high-temperature sputtering, it is possible to prevent the occurrence of a failure such as gas generation from the protective film.

  Further, during the first main surface p-ITO patterning step 26 of FIG. 18, the p-ITO film 4b ″ is protected by the protective film 35 as shown in FIGS. 19 (c) to 19 (f). Therefore, it is possible to prevent the p-ITO film 4b ″ from being scratched or adhering foreign matter. On the other hand, in the second main surface p-ITO film formation step P29 of FIG. 18, the first translucent electrode 4a and the terminal portion 5a are protected by the protective film 25 as shown in FIG. Therefore, it is possible to prevent the surface of the first main surface S1 of the substrate 2 ′, the first translucent electrode 4a, and the terminal portion 5a from being scratched or foreign matter, and the electrode 4a and the terminal portion 5a are defective. Can be prevented.

(Modification)
In step P24 of FIG. 18, the p-ITO film 4a ′ as the first conductive film and the second conductive film as the first conductive film are simultaneously sputtered on both surfaces of the mother substrate 2 ′ in FIG. 19A. The case where the p-ITO film 4b ″ is formed simultaneously is illustrated. However, the p-ITO film 4a ′ and the p-ITO film 4b ″ can be formed in separate steps. In this case, the step of forming the p-ITO film 4a ′ and the step of forming the p-ITO film 4b ″ are successively performed. In addition, when the first conductive film and the second conductive film are separately formed as described above, the second conductive film formed on the second main surface S2 can be formed using an a-ITO film. . In this way, as in the first embodiment, if the protective film 25 is damaged for any reason, the etching solution is temporarily removed from the scratch or the like on the protective film 25 in the a-ITO patterning step P10. Even if it enters and reaches the first light-transmissive electrode 4a or the terminal portion 5a, the first light-transmissive electrode 4a formed of p-ITO and the second layer 7 of the terminal portion 5a are not corroded. .

(Fifth embodiment of electrode substrate manufacturing method)
Next, 5th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention is described based on FIG. The overall steps of the manufacturing method of this embodiment are substantially the same as those of the manufacturing method according to the second embodiment shown in FIG. In the previous embodiment shown in FIG. 5, in the protective film forming step P7, the protective film 25 as the first protective means shown in FIG. 8 (m) is formed by spin coating or the like. On the other hand, in this embodiment, it replaces with the protective film 25 as a 1st protection means, and uses the glass body.

  The manufacturing method according to this embodiment will be described in the order of steps with reference to FIG. 21. In FIG. 21A, the material film 103 ′ of the conductive member 103 (see FIG. 21H) is formed on the first main surface S1 of the substrate 102. Then, the material film 103 ′ is patterned by a photoetching process or the like to form the conductive member 103 shown in FIG. Next, in FIG. 21C, a first conductive film 104a ′ is formed on the first main surface S1 of the substrate 102, and the first conductive film 104a ′ is patterned by a photo-etching process. The first electrode 104a is formed.

  Next, in FIG. 21E, a glass body 345 covering the first electrode 104 a is bonded to the substrate 102 using an adhesive material 346. Then, after turning the substrate 102 upside down, in FIG. 21F, a second conductive film 104b ′ is formed on the second main surface S2 of the substrate 102, and the film 104b ′ is patterned by a photoetching process. 21 (g) of the second electrode 104b is formed. Furthermore, in FIG. 21G, the adhesive 346 is removed and the glass body 345 is removed from the substrate 102, whereby the electrode substrate 1 shown in FIG. 21H is completed.

  As described above, according to the present embodiment, the conductive films 104 a ′ and 104 b ′ and the subsequent conductive film patterning are sequentially performed on each side of the substrate 102. In the second patterning performed later in the process, the second patterning is performed while the surface patterned in the first patterning performed earlier is covered with the glass body 345 and protected. In this way, the electrodes formed by the first patterning are prevented from being scratched or foreign matter attached.

(6th Embodiment of the manufacturing method of an electrode substrate)
The sixth embodiment of the electrode substrate manufacturing method according to the present invention will be described below with reference to FIG. In the sixth embodiment, the fifth embodiment shown in FIG. 21 is implemented in a more realistic manner. In this embodiment, the electrode substrate 1 shown in FIG. 2 is manufactured. In the following description, the present embodiment will be described with a focus on differences from the previous embodiment, and description of common steps will be omitted.

  In this embodiment, each process from the process P1 to the process P6 in FIG. 5 is executed, and as shown in FIG. 8L, the wiring 3 (see FIG. 3) and the first light transmitting property are formed on the mother substrate 2 ′. Electrode 4a and terminal portion 5a are formed. Next, the process P7 of FIG. 5 is performed, and the protection structure shown in FIG. 22 is made. FIG. 22 is a cross-sectional view showing a state in which the protective means is formed in the protective means forming step P7 shown in FIG. 5 among the steps constituting the substrate manufacturing method according to the present embodiment. This cross-sectional view is a cross section according to the Z22-Z22 line shown on the upper right side of FIG. 4A, that is, a cross section of a portion corresponding to the terminal portion 5a in one electrode substrate 1 in the mother substrate 2 ′. Show.

  In order to form the protective means in the present embodiment, first, in FIG. 22, the adhesive 46 is formed on the first main surface S1 of the mother substrate 2 'by, for example, printing. As the adhesive 46, a material having resistance to an etching solution is used. For example, a thermosetting resin or an ultraviolet curable resin can be used. Further, the adhesive 46 is formed in a square shape or a rectangular shape in a plan view, and the first translucent electrode 4a formed corresponding to the electrode substrate 1 portion in the steps up to Step P6 in FIG. , A frame surrounding the terminal portion 5a and the wiring 3 is formed. The adhesive 46 is formed in a large frame shape surrounding a plurality of electrodes 4a and the like along the periphery of the mother substrate 2 ′ having a large area, instead of being formed in a frame shape corresponding to each part of the substrate 1. It can also be formed. In addition to forming the adhesive 46 in a frame shape corresponding to each electrode substrate 1, a large frame shape surrounding a plurality of electrodes 4 a and the like along the periphery of the mother substrate 2 ′ having a large area. It can also be formed.

  Next, the adhesive body 46 is used to bond the glass body 45 serving as the first protection means so as to face the first main surface S1 of the mother substrate 2 '. The glass body 45 is a glass plate formed in a plate shape, and for example, a glass substrate having the same material and shape as the mother substrate 2 ′ can be used. The glass body 45 can be formed in a shape other than a plate shape as long as it can cover the electrode 4a and the like formed on the first main surface S1 of the substrate 2 '.

  After the glass body 45 is bonded to the mother substrate 2 ′ as described above, each process from the process P 8 to the process P 15 in FIG. 5 is performed, and the electrode substrate 1 shown in FIG. 2 is manufactured. In the first embodiment described above, in step P11 of FIG. 5, the protective film 25 and the resist 21c of FIG. 10E are stripped using an organic solvent or the like. On the other hand, in this embodiment, the glass body 45 can be removed from the mother substrate 2 'by peeling the adhesive 46 from the mother substrate 2' using, for example, an organic solvent.

  In the present embodiment, as shown in FIG. 22, in the protective means forming step P7 of FIG. 5, the first translucent electrode 4a, the terminal portion 5a, and the wiring formed on the first main surface S1 of the mother substrate 2 ′. The glass body 45 was bonded to the mother substrate 2 ′ with an adhesive 46 so as to cover 3. Thereby, when forming the 2nd translucent electrode 4b and the terminal part 5a in 2nd main surface S2 of mother board | substrate 2 ', the surface itself of 1st main surface S1 of mother board | substrate 2' is 1st translucency. The electrode 4 a, the terminal portion 5 a, and the wiring 3 (that is, the first main surface film element) can be protected by the glass body 45. As a result, the surface of the first main surface S1 of the mother substrate 2 ′ and the first main surface film elements 4a, 5a, 3 can be prevented from being scratched or adhering to foreign matters, and the first main surface film elements 4a, 5a, 3 can be prevented from being defective.

  Further, when the glass body 45 is used as the first protection means as in the present embodiment, the protection means can be easily provided on the mother substrate 2 ′ by adhering to the mother substrate 2 ′ using the adhesive 46. be able to. Further, the glass body 45 can be easily removed from the mother substrate 2 ′ by peeling the adhesive 46 using an organic solvent or the like.

(7th Embodiment of the manufacturing method of an electrode substrate)
Next, 7th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention is described based on FIG. In the previous embodiments shown in FIGS. 1, 17, and 21, as shown in FIGS. 1 (h), 17 (i), and 21 (h), the conductive member 103 is provided below the electrode 104a. This is a manufacturing method suitable for manufacturing the electrode substrate 1 having a configuration in which is formed. On the other hand, the manufacturing method of the present embodiment shown in FIG. 23 is suitable for manufacturing the electrode substrate 1 having a configuration in which the conductive member 103 is formed on the electrode 104a as shown in FIG. It is a manufacturing method.

  In the present embodiment, a p-ITO film 104a 'is formed on the first main surface S1 of the substrate 102 in FIG. Next, the p-ITO film 104a 'is patterned to form the first electrode 104a shown in FIG. Then, after forming a metal film 103 ′ in FIG. 23C, the second main surface S2 of the substrate 102 is used as a protective means in FIGS. 23D and 23E. The electrode substrate 1 is manufactured by forming the second electrode 104b and then patterning the metal film 103 ′ in FIG.

  As described above, according to the present embodiment, the conductive films 104 a ′ and 104 b ′ and the subsequent conductive film patterning are sequentially performed on each side of the substrate 102. Then, in the second patterning performed later in the process, the second patterning is performed while the surface patterned in the first patterning performed earlier is covered and protected by the metal film 103 ′ (FIG. 23). (See (c), (d), (e)). In this way, the electrodes formed by the first patterning are prevented from being scratched or foreign matter attached.

(Eighth Embodiment of Electrode Substrate Manufacturing Method)
Hereinafter, an eighth embodiment of an electrode substrate manufacturing method according to the present invention will be described with reference to FIGS. In the eighth embodiment, the seventh embodiment shown in FIG. 23 is implemented in a more realistic manner. In this embodiment, the electrode substrate 51 shown in FIG. 24 is manufactured. The planar structure viewed from the arrow Z3 side of the electrode substrate 51 is the same as the planar structure shown in FIG. 3 except for the layer structure of the terminal portion 55a and the wiring 53. FIG. 25 is a process chart showing the method for manufacturing the electrode substrate according to this embodiment. 26 to 28 are structural transition diagrams showing the structure of the substrate formed in each step of FIG. 25 in the order of steps. 26 to 28 show the cross-sectional structure of the terminal portion according to the Z26-Z26 line shown on the left side of FIG.

  First, the conductive pattern provided on the electrode substrate 51 of FIG. 24 will be described. In the electrode substrate 51, the conductive pattern formed on the second main surface S2 of the translucent substrate 2 is formed on the second main surface S2 in the translucent substrate 2 of the previous embodiment shown in FIGS. Is the same pattern as That is, in FIG. 24, the second translucent electrode 4b as the second electrode made of p-ITO and the terminal portion 5b are formed on the second main surface S2.

  On the other hand, the conductive pattern on the first main surface S1 includes a wiring 53 as a conductive member, which is a metal film, a first translucent electrode 54a as a first electrode, and a terminal portion 55a. The terminal portion 55 a has a laminated structure of the first layer 56 and the second layer 57. The first layer 56 is formed using p-ITO which is a translucent conductive material. The second layer 57 is formed using metal, which is Cr in this embodiment.

  A plurality of wirings 53 are provided. These wirings 53 are formed in a single layer film using Cr. The wiring 53 extends to the terminal portion 55a and forms a second layer 57 of the terminal portion 55a. One end 53a of each wiring 53 is stacked on the end of the first light-transmissive electrode 54a. Thereby, the wiring 53 and the first translucent electrode 54a are conductively connected. On the other hand, since the other end of the wiring 53 is the second layer 57 of the terminal portion 55a, the wiring 53 and the terminal portion 55a are conductively connected to each other. That is, the first translucent substrate 54 a and the terminal portion 55 a are conductively connected via the wiring 53.

  Hereinafter, a method for manufacturing the electrode substrate 51 according to the present embodiment will be described. First, the first main surface forming step Q1 in FIG. 25 will be described. In step P41, the mother substrate 2 'shown in FIG. 26A is cleaned with a predetermined cleaning liquid. Next, in step P42 of FIG. 25, as shown in FIG. 26A, a first material that is the material of the first light-transmissive electrode 54a of FIG. 24 is formed on the first main surface S1 of the light-transmissive substrate 2 ′. A p-ITO film 54a ′ as a conductive film is formed to a thickness of about 500 mm by sputtering.

  Next, in step P43 of FIG. 25 as the first patterning step, the p-ITO film 54a 'of FIG. 26A is patterned by photoetching. Specifically, first, in FIG. 26B, a resist 21e, which is a positive photosensitive resin, is applied on the p-ITO film 54a 'to a uniform thickness, and prebaked to obtain a solvent in the resist 21e. Remove. Thereafter, in FIG. 26C, exposure processing is performed on the resist 21e using the exposure mask 22E. By exposing using the exposure mask 22E, the exposed portion B5 in FIG. 26C is solubilized.

  Next, the mother substrate 2 ′ in FIG. 26C is dipped in a developing solution for a predetermined time to remove the solubilized portion B 5 of the resist 21 e to obtain a resist pattern 21 e shown in FIG. Thereafter, post-baking is performed, and the p-ITO film 54a 'is etched using the resist 21e as a mask to obtain a p-ITO film 54a' as shown in FIG. Thereafter, in step P44 of FIG. 25, the resist 21e used as the mask is removed, thereby forming the first electrode 54a and the first layer 56 of the terminal portion 55a (see FIG. 24) shown in FIG. . Then, in the process P45 of FIG. 25 as the metal film formation process, as shown in FIG. 27G, the material layer 53 ′, which is a metal film so as to cover the first layer 56 and the first electrode 54a, is formed, for example, Cr. As a material, a film having a thickness of about 2000 mm is formed by sputtering. Thus, the first main surface forming step Q1 of FIG. 25 for the first main surface S1 of the mother substrate 2 'is completed.

  Thereafter, second main surface forming step Q2 is performed. In this step Q2, in steps P46 to P49, the first light transmitting electrode 4b and the terminal portion 5b are formed on the second main surface S2 of the substrate 2 shown in FIG. Step P46 to Step P49 are steps corresponding to the second main surface forming step Q2 (Step P8 to Step P11) in the previous embodiment shown in FIG. In step P8 to step P11 of FIG. 5, as described with reference to FIGS. 9A to 10F, when the conductive pattern such as the electrode 4b is formed on the second main surface S2, the first step is performed. One main surface S1 was covered and protected by a resin protective film 25 as a first protection means. On the other hand, the process P46 to P49 in this embodiment is performed by replacing the protective film 25 in the process P8 to P11 (FIGS. 9A to 10F) in FIG. Are formed as the first protection means, and the other processes are the same as those in steps P8 to P11 in FIG. Therefore, the description of the processes P46 to P49 in FIG. 25 is omitted.

  When step P49 in FIG. 25 is completed, as shown in FIG. 27 (m), the second translucent electrode 4b and the terminal portion 5b are formed as in FIG. 10 (e) in the previous embodiment shown in FIG. It is formed on the second main surface S2 of the mother substrate 2 ′. Thereafter, in the process P50 of FIG. 25 as the third patterning process, the material layer 53 'is patterned. Specifically, first, in FIG. 28A, a resist 21f, which is a positive photosensitive resin, is applied to the material layer 53 'to a uniform thickness, and prebaking is performed to remove the solvent in the resist 21f. To do. Thereafter, in FIG. 28B, exposure processing is performed on the resist 21f using the exposure mask 22F. By exposing using the exposure mask 22F, the exposed portion B6 in FIG. 28B is solubilized.

  Next, in FIG. 28 (c), the mother substrate 2 'is immersed in a developing solution for a predetermined time to remove the solubilized portion B6 (see FIG. 28 (b)) resist 21f. Thereafter, post-baking is performed, and the material layer 53 ′ is subjected to etching treatment using the resist 21 f as a mask, thereby patterning the material layer 53 ′ as shown in FIG. Thereafter, the resist 21f used as a mask is peeled off in step P51 of FIG. 25, whereby the wiring 53 and the second layer 57 of the terminal portion 55a shown in FIG. 28E are formed.

  Thus, the second main surface forming step Q2 for the second main surface S2 of the mother substrate 2 'is completed. Thereafter, in the same manner as in the first embodiment, the protective film attaching step P12 shown in FIG. 5 is performed, the dividing step Q3 is performed, and further, the baking treatment is performed in the step P15, whereby the electrode substrate of FIG. 51 is completed.

  In the electrode substrate manufacturing method according to the present embodiment, after the p-ITO patterning step P43 in FIG. 25, in the Cr sputtering step P45, which is a metal film forming step, the first translucent electrode 54a and the first transparent electrode 54a in FIG. A material layer 53 ′, which is a metal film, is formed so as to cover the first layer 56. When the second translucent electrode 4b and the terminal portion 5b are formed on the second main surface S2 of the mother substrate 2 ′, the first main surface S1 comes into contact with the substrate support surface of a processing apparatus such as a sputtering apparatus. However, in the present embodiment, the first translucent electrode 54a and the first layer 56 are protected by the material layer 53 ′ formed on the first main surface S1 of the mother substrate 2 ′. When forming the second translucent electrode 4b and the terminal portion 5b on the second main surface S2, the surface of the first main surface S1, the first translucent electrode 54a and the first layer 56 are the substrate support surface of the processing apparatus. You won't be touching directly. As a result, the surface itself of the first main surface S1, the first translucent electrode 54a, and the first layer 56 can be prevented from being scratched or adhered to foreign matter, and the first translucent electrode 54a and the first translucent electrode 54a can be prevented. It is possible to prevent a defect from occurring in the layer 56.

  Also, after the a-ITO patterning step P48 in FIG. 25, in the Cr patterning step P50, as shown in FIGS. 28B to 28E, the material layer 53 ′ is patterned to form the wiring 53 as a conductive member. In addition, the second layer 57 of the terminal portion 55a is formed. That is, the material layer 53 ′ of FIG. 28C used as a protection means in the second main surface formation step Q2 of FIG. 25 is etched at a different etching rate from the a-ITO film 4b ′ of FIG. Thus, the wiring 53 and the second layer 57 shown in FIG. In this way, since the protective means can be provided on the first main surface S1 of the mother substrate 2 'without increasing the number of manufacturing steps, the manufacturing cost can be kept low.

(Ninth embodiment of electrode substrate manufacturing method)
Next, a ninth embodiment of the electrode substrate manufacturing method according to the present invention will be described with reference to FIG. In each embodiment described so far, the case where an electrode was formed on both surfaces of one translucent substrate was illustrated. On the other hand, in this embodiment, one electrode substrate having electrodes on both surfaces is formed by bonding two substrates having electrodes formed on one surface. Hereinafter, this embodiment will be described in detail.

  The electrode substrate manufactured by the manufacturing method of this embodiment has the 1st board | substrate 102a and the 2nd board | substrate 103a which were bonded together by the adhesive material 114, as shown by the code | symbol 1 in FIG.29 (i). One translucent substrate is formed by the first substrate 102a and the second substrate 103a which are bonded to each other. A conductive member 113 and a first electrode 104a are formed on the first main surface (that is, the surface of the first substrate 102a) S1 of the translucent substrate. On the other hand, the second electrode 104b is formed on the second main surface (that is, the surface of the second substrate 103a) S2 of the translucent substrate.

  When manufacturing the electrode substrate 1 having the above-described configuration, the first substrate forming step Q4 is performed on one side, and the second substrate forming step Q5 is performed on the other side. In the first substrate formation step Q4, the first conductive film 113 ′ is formed on the first substrate 102a in FIG. 29A, and the conductive film is patterned to form the conductive member 113 in FIG. 29B. Then, a second conductive film 104a ′ is formed in FIG. 29C, the conductive film is patterned to form the first electrode 104a in FIG. 29D, and in FIG. The thickness of one substrate 102a is reduced by grinding, polishing, cutting, etching, or the like.

  In the second substrate forming step Q5, the third conductive film 104b ′ is formed on the second substrate 03a in FIG. 29F, and the conductive film is patterned to form the second electrode in FIG. In FIG. 29H, the thickness of the second substrate 103a is reduced by grinding, polishing, cutting, etching, or the like.

  Thereafter, in FIG. 29 (i), an adhesive 114 is applied to the back surface of either the first substrate 102a or the second substrate 103a by printing, printing, etc., and the other of the first substrate 102a or the second substrate 103a is attached to the other substrate. The adhesive 114 is bonded to the one substrate. Thereby, the electrode substrate 1 is produced.

According to the method for manufacturing an electrode substrate according to the present embodiment, each of the substrates 102a and 103a undergoes a process for forming an electrode or the like independently, and therefore a process for forming an electrode or the like on one substrate is performed. During the process, the electrode formed on the other substrate cannot be damaged or foreign matter may not adhere. For this reason, high-quality electrodes are always formed on the front and back surfaces of the electrode substrate 1 completed in FIG.

(10th Embodiment of the manufacturing method of an electrode substrate)
Hereinafter, 10th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention is described using FIGS. 30-32. The tenth embodiment is a more realistic implementation of the ninth embodiment shown in FIG. FIG. 30 is a side view of the electrode substrate 61 manufactured by the manufacturing method of the present embodiment. FIG. 31 is a process diagram showing the method for manufacturing the electrode substrate according to this embodiment. FIG. 32 is a structural transition diagram corresponding to the process diagram of FIG.

  First, the configuration of the electrode substrate 61 in FIG. 30 will be described. The electrode substrate 61 includes a first electrode substrate 62 and a second electrode substrate 63. The first electrode substrate 62 includes a first light-transmitting substrate 62a as a first substrate and a plurality of conductive patterns formed on the surface of the first light-transmitting substrate 62a. The conductive pattern includes a first translucent electrode 4a as a first electrode, a wiring 3, and a terminal portion 5a.

  The second electrode substrate 63 includes a second light transmissive substrate 63a as a second substrate and a plurality of conductive patterns formed on the surface of the second light transmissive substrate 63a. The conductive pattern includes a second translucent electrode 4b as a second electrode and a terminal portion 5a. The first light-transmitting substrate 62a and the second light-transmitting substrate 63a are bonded to each other with the adhesive material 64, whereby the electrode substrate 61 having a conductive pattern on both surfaces is formed. A surface opposite to the bonding surface of the first light transmitting substrate 62 a is the first main surface S <b> 1 of the electrode substrate 61. Further, the surface opposite to the bonding surface of the second light transmitting substrate 63a is the second main surface S2 of the electrode substrate 61.

  The first translucent substrate 62a and the second translucent substrate 63a are formed using, for example, translucent glass, translucent plastic, or the like. The pattern shape of the conductive pattern on the first electrode substrate 62 as viewed in plan from the arrow Z3 side is the pattern shape of the conductive pattern formed on the first main surface S1 of the translucent substrate 2 in the embodiment shown in FIG. Is the same. The wiring 3 is a metal film made of a metal mainly composed of Cr. The first translucent electrode 4a is made of p-ITO. The terminal portion 5a is formed as a laminated structure in which p-ITO is laminated on a metal containing Cr as a main component.

  The pattern shape of the conductive pattern on the second electrode substrate 63 as viewed in plan from the arrow Z3 side is the pattern shape of the conductive pattern formed on the second main surface S2 of the translucent substrate 2 in the embodiment shown in FIG. Is the same. The 2nd translucent electrode 4b is formed of p-ITO. The terminal portion 5b is also formed of p-ITO.

Hereinafter, a method for manufacturing the electrode substrate 61 will be described.
Also in the present embodiment, as in the above-described embodiments, the electrode substrate 61 is manufactured based on a multi-cavity technique. Therefore, in FIG. 32, the mother substrate of the first translucent substrate 62a is shown as 62a ', and the mother substrate of the second translucent substrate 63a is shown as 63a'. In the present embodiment, a series of steps from Step P61 to Step P66 in FIG. 31 is the same as a series of steps from Step P1 to Step P6 in the embodiment shown in FIG. A series of steps from Step P71 to Step P74 in FIG. 31 is the same as the steps shown in P41 to P44 in the embodiment shown in FIG. Therefore, detailed description of these steps is omitted.

  When the process up to Step P66 is completed in the first substrate manufacturing process of FIG. 31, as shown in FIG. 32A, the wiring 3, the terminal portion 5a, and the first transparent surface are formed on the first main surface S1 of the first mother substrate 62a ′. A photoelectrode 4a is formed. Thereafter, in step P67 of FIG. 31, as shown in FIG. 32B, the second main surface S3 of the first mother substrate 62a 'is etched to remove the portion Y1 indicated by the oblique lines. Accordingly, the first mother substrate 62a 'is thinned. For example, the thickness t0 = 0.5 mm of the substrate 62a ′ before etching is reduced to the thickness t1 = 0.2 mm of the substrate 62a ′ after etching. Thus, the manufacturing process of the first electrode substrate 62 is completed.

  Next, when step P74 in FIG. 31 is completed, as shown in FIG. 32C, the second light-transmissive electrode 4b and the terminal portion 5b are formed on the first main surface S2 of the second mother substrate 63a ′. Is done. Thereafter, in step P75 of FIG. 31, as shown in FIG. 32D, the second main surface S4 of the second mother substrate 63a 'is etched to remove the portion Y2 indicated by the oblique lines. Thereby, the 2nd translucent board | substrate 63a 'can be made thin. For example, the thickness t2 = 0.5 mm of the substrate 63a ′ before etching is reduced to the thickness t3 = 0.2 mm of the substrate 63a ′ after etching. Thus, the manufacturing process of the second electrode substrate 63 is completed.

  Next, in step P81 of FIG. 31, the first electrode substrate 62 shown in FIG. 32B and the second electrode substrate 63 shown in FIG. 32D are bonded together. Specifically, as shown in FIG. 32 (e), the second main surface S3 of the first translucent substrate 62a ′ and the second main surface S4 of the second translucent substrate 63a ′ are opposed to each other. Then, both substrates are bonded by the adhesive material 64. At this time, the thickness t4 of the adhesive 64 is, for example, 0.1 mm. Thereafter, in the same manner as in the embodiment shown in FIG. 5, the protective film attaching step P12 is performed, the dividing step Q3 is performed, and the baking process is performed in the step P15, whereby the electrode substrate shown in FIG. 61 is completed.

  In the present embodiment, the wiring 3, the first light transmissive electrode 4a, and the terminal portion 5a are formed on the first main surface S1 of the first light transmissive substrate 62a 'in FIG. Further, in FIG. 32C, the second light transmissive electrode 4b and the terminal portion 5b are formed on the first main surface S2 of the second light transmissive substrate 63a '. Then, in FIG. 32 (e), the first light-transmitting substrate 62a ′ and the second light-transmitting substrate 63a ′ are bonded to each other with an adhesive 64, thereby forming an electrode substrate 61 having electrodes on both front and back surfaces. I tried to do it. Thereby, it is possible to avoid the occurrence of scratches or adhesion of foreign substances on each substrate without providing a protective means on the surface of the first electrode substrate 62 or the second electrode substrate 63. Thus, since it is not necessary to use a protection means, an electrode substrate having conductive patterns on both the front and back surfaces can be formed without increasing the manufacturing cost.

  In step P67 of FIG. 31, as shown in FIG. 32B, the surface of the second main surface S3 of the first light-transmissive substrate 62a 'was removed by etching. Further, in step P75 of FIG. 31, as shown in FIG. 32D, the surface of the second main surface S4 of the second light transmissive substrate 63a 'was removed by etching. Accordingly, the first light-transmitting substrate 62a ′ and the second light-transmitting substrate 63a ′ in FIG. 30 can be formed thin, so that the electrode substrate 61 formed by bonding these substrates 62a ′ and 63a ′ is formed thin. it can.

  The process P67 for etching the first light-transmissive substrate 62a ′ is performed after the p-ITO patterning process P65, which is the first patterning process, and the process P75 for etching the second light-transmissive substrate 63a ′ is the second patterning. It was decided to carry out after the p-ITO patterning step P73 which is a step. Thereby, the operation of forming the conductive pattern on the first main surface S1 of the substrate 62a ′ and the first main surface S2 of the substrate 63a ′ is performed on the thickness of the first light-transmitting substrate 62a ′ and the second light-transmitting substrate 63a ′. Can be performed in a sufficiently thick state, so that it is possible to prevent the first light-transmitting substrate 62a ′ and the second light-transmitting substrate 63a ′ from being damaged during the operation.

(Other embodiments)
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the scope of the invention described in the claims.
For example, in each of the above embodiments, the wiring 3 (see, for example, FIG. 3), which is one of the conductive patterns formed on the substrate, is formed as a single layer film using a metal whose main component is Cr. However, the wiring 3 can also be formed as a single-layer film using a material other than Cr, such as an Al (aluminum) alloy, an Ag (silver) alloy, or a Cu (copper) alloy. For example, Mo can be used as an additive for a Cu-based alloy, and Pd, Cu, Ge, or the like can be used as an additive for an Ag-based alloy. In any case of Al-based alloy, Ag-based alloy, and copper-based alloy, the sheet resistance value of the wiring can be reduced to about 0.3Ω by forming it to a film thickness of 2000 mm.

  The wiring 3 can also be formed by laminating Al and Mo. The wiring 3 can also be formed by stacking materials other than Al and Mo, for example, Al and Cr. The wiring 3 can also be formed by stacking more than two different types of metal materials. When the wiring 3 has a laminated structure as described above, the wiring 3 can be formed by performing metal film formation and subsequent photoetching twice. Further, it is possible to form a pattern by performing a single photoetching process after performing continuous film formation once. For example, if Al and Mo are continuously formed at 2000 mm and 200 mm respectively and these films are simultaneously etched with an etching solution of phosphonitrate, two types of patterns can be formed by one photoetching process. The batch photoetching step can be omitted and the wiring width can be reduced.

  In FIG. 8M, the protective film 25 is formed by applying a positive photosensitive resin by spin coating or the like. However, the protective film 25 can also be provided by attaching (so-called laminating) a sheet of photosensitive resin.

It is a figure which shows 1st Embodiment of the manufacturing method of the electrode substrate which concerns on this invention by the transition of a substrate structure. It is a side view which shows the electrode substrate manufactured using 2nd Embodiment of the manufacturing method of the electrode substrate which concerns on this invention. It is a top view which shows a board | substrate from the arrow Z3 direction of FIG. FIG. 4 is a plan view showing a panel structure including a plurality of sets of film elements formed on the substrate of FIG. 3. It is process drawing which shows 2nd Embodiment of the manufacturing method of the electrode substrate which concerns on this invention. It is sectional drawing which shows the transition of the film | membrane structure on the 1st main surface of a board | substrate corresponding to the process drawing of FIG. FIG. 7 is a cross-sectional view showing the transition of the film configuration on the first main surface of the substrate following FIG. 6. FIG. 8 is a cross-sectional view illustrating the transition of the film configuration on the first main surface of the substrate following FIG. 7. It is sectional drawing which shows the transition of the film | membrane structure on the 2nd main surface of a board | substrate corresponding to the process drawing of FIG. FIG. 10 is a cross-sectional view showing the transition of the film configuration on the second main surface of the substrate following FIG. 9. It is a top view which shows the transition of the film | membrane structure on the 1st main surface of the board | substrate corresponding to FIG. It is a top view which shows the transition of the film | membrane structure on the 1st main surface of the board | substrate corresponding to FIG. It is a top view which shows the transition of the film | membrane structure on the 1st main surface of the board | substrate corresponding to FIG. FIG. 10 is a plan view showing the transition of the film configuration on the second main surface of the substrate corresponding to FIG. 9. It is a top view which shows the transition of the film | membrane structure on the 2nd main surface of the board | substrate corresponding to FIG. FIG. 6 is a structural transition diagram corresponding to a division step Q3 in the process diagram of FIG. It is a figure which shows 3rd Embodiment of the manufacturing method of the electrode substrate which concerns on this invention by the transition of a board | substrate structure. It is process drawing which shows 4th Embodiment of the manufacturing method of the board | substrate which concerns on this invention. It is sectional drawing which shows the transition of the film | membrane structure of a board | substrate corresponding to the process drawing of FIG. FIG. 20 is a cross-sectional view illustrating the transition of the film configuration of the substrate following FIG. 19. It is a figure which shows 5th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention by the transition of a board | substrate structure. It is sectional drawing which shows the electrode substrate manufactured using 6th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention. It is a figure which shows 7th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention by the transition of a substrate structure. It is a side view which shows the board | substrate manufactured using 8th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention. It is process drawing which shows 8th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention. It is sectional drawing which shows the transition of the film | membrane structure of a board | substrate corresponding to the process drawing of FIG. FIG. 27 is a cross-sectional view showing the transition of the film configuration of the substrate following FIG. 26. FIG. 28 is a cross-sectional view showing the transition of the film configuration of the substrate following FIG. 27. It is a figure which shows 9th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention by the transition of a substrate structure. It is a side view which shows the board | substrate manufactured using 10th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention. It is process drawing which shows 10th Embodiment of the manufacturing method of the electrode substrate which concerns on this invention. FIG. 32 is a cross-sectional view showing the transition of the film configuration of the substrate corresponding to the process diagram of FIG. 31.

Explanation of symbols

1, 51, 61. Electrode substrate, 1 '. 1. Panel structure Translucent substrate,
2a, 2b, 2c. Edge, 2 'mother translucent substrate, 3,53. Wiring (metal film),
3 ', 53'. Material layer, 4a, 54a. A first translucent electrode (first electrode),
4a ', 54a'. p-ITO film (first conductive film),
4b. 2nd translucent electrode (2nd electrode), 4b '. a-ITO film (second conductive film),
5a, 55a. 1st terminal part (1st electrode), 5b. A second terminal portion (second electrode),
6,56. Terminal layer first layer 7,57. Terminal layer second layer, L1, L2, L3. Exposure light, A0. Complete light transmission region, A1. Complete shading area,
B1, B2, B3, B4, B5, B6. Solubilized region,
21a, 21b, 21c, 21d, 21e, 21f. Resist (positive photosensitive resin),
22A, 22B, 22C, 22D, 22E, 22F. Exposure mask,
23. Glass substrate, 24A, 24B, 24C. Shading pattern,
25. Protective film (first protective means), 26a, 26b. Protective film,
35. Protective film (second protective means), 45. Glass body, 46. Adhesive,
62. First electrode substrate 62a. First translucent substrate (first substrate), 63. A second electrode substrate,
63a. 64. a second light transmitting substrate (second substrate); Adhesive, S1. 1st main surface,
S2. Second main surface, S3. A second main surface of the first translucent substrate, S4. Second main surface of second translucent substrate

Claims (18)

A method of manufacturing an electrode substrate having electrodes on both the first main surface and the second main surface of the substrate,
A first conductive film forming step of forming a first conductive film on the first main surface of the substrate;
A first patterning step of patterning the first conductive film to form a first electrode;
A second conductive film forming step of forming a second conductive film on the second main surface of the substrate;
A second patterning step of patterning the second conductive film to form a second electrode,
The method of manufacturing an electrode substrate, wherein the second patterning step is performed after the first patterning step and in a state in which a protective unit is provided on the first main surface. In the manufacturing method of the electrode substrate of Claim 1,
A first conductive film forming step of forming a first conductive film on the first main surface of the substrate;
A first patterning step of patterning the first conductive film to form a first electrode;
A first protection means forming step of forming a first protection means for protecting the first electrode;
A second conductive film forming step of forming a second conductive film on the second main surface of the substrate after the first protective means forming step;
A second patterning step of patterning the second conductive film to form a second electrode;
A method of manufacturing an electrode substrate comprising: a first protection means removing step of removing the first protection means after the second patterning step.   3. The method of manufacturing an electrode substrate according to claim 2, wherein in the first protection means forming step, the first protection means is formed by applying a photosensitive resin to the first main surface of the substrate. A method for manufacturing an electrode substrate.   3. The method of manufacturing an electrode substrate according to claim 2, wherein in the first protection means forming step, a photosensitive resin as the first protection means is attached to the first main surface of the substrate. Production method.   3. The method of manufacturing an electrode substrate according to claim 2, wherein a glass body as the first protection means is attached to the first main surface of the substrate in the first protection means forming step. . In the manufacturing method of the electrode substrate of Claim 1,
A first conductive film forming step of forming a first conductive film on the first main surface of the substrate;
A second conductive film forming step of forming a second conductive film on the second main surface of the substrate;
A second protective means forming step of forming a second protective means on the second conductive film after the first conductive film forming step;
A first patterning step of patterning the first conductive film to form a first electrode after the second protection means forming step;
A second protection means removing step of removing the second protection means after the first patterning step;
A first protective means forming step of forming a first protective means on the first electrode after the second protective film removing step;
A second patterning step of patterning the second conductive film to form a second electrode after the first protection means forming step;
A method of manufacturing an electrode substrate comprising: a first protection means removing step of removing the first protection means after the second patterning step.   7. The method of manufacturing an electrode substrate according to claim 6, wherein in the first protection means forming step, the first protection means is formed by applying a photosensitive resin to the first main surface of the substrate, and the second protection means. In the means forming step, the second protective means is formed by applying a photosensitive resin to the second main surface of the substrate.   7. The method of manufacturing an electrode substrate according to claim 6, wherein in the first protective means forming step, a photosensitive resin film as the first protective means is attached to the first main surface of the substrate, and the second protective means forming step. Then, the photosensitive resin film as said 2nd protection means is affixed on the 2nd main surface of the said board | substrate, The manufacturing method of the electrode board | substrate characterized by the above-mentioned.   7. The method of manufacturing an electrode substrate according to claim 6, wherein in the first protection means forming step, a glass body as the first protection means is attached to the first main surface of the substrate, and in the second protection means formation step, A method of manufacturing an electrode substrate, comprising attaching a glass body as the second protection means to a second main surface of the substrate.   The method for manufacturing an electrode substrate according to claim 2 or 6, wherein a first protective film covering the first electrode is attached to the first main surface of the substrate after the first protective means removing step; A step of affixing a second protective film covering the second electrode to the second main surface of the substrate after the protective means removing step; and a step of attaching the first protective film and the second protective film to the substrate. A step of providing a dividing groove; and a step of dividing the substrate along the dividing groove, wherein the first protective film and the second protective film are provided in a portion where the dividing groove is provided. A method for manufacturing an electrode substrate, which is not provided. In the manufacturing method of the electrode substrate of Claim 1,
A first conductive film forming step of forming a first conductive film on the first main surface of the substrate;
A first patterning step of patterning the first conductive film to form a first electrode;
Forming a metal film covering the first electrode on the first main surface of the substrate; and
A second conductive film forming step of forming a second conductive film on the second main surface of the substrate after the metal film forming step;
A second patterning step of patterning the second conductive film to form a second electrode;
And a third patterning step of forming a conductive member by patterning the metal film after the second patterning step.   12. The method of manufacturing an electrode substrate according to claim 11, wherein a first protective film covering the first electrode and the conductive member is attached to the first main surface of the substrate after the third patterning step, and the third patterning. A step of attaching a second protective film covering the second electrode to the second main surface of the substrate after the step, and a groove for dividing the substrate on which the first protective film and the second protective film are attached. And a step of dividing the substrate along the dividing groove, and the first protective film and the second protective film are not provided in a portion where the dividing groove is provided. A method of manufacturing an electrode substrate.   13. The method of manufacturing an electrode substrate according to claim 1, wherein the substrate has a light-transmitting property, and the first conductive film forming step and the second conductive film forming step are transparent. A method for manufacturing an electrode substrate, wherein the first conductive film and the second conductive film are formed using a conductive material having conductivity.   14. The method of manufacturing an electrode substrate according to claim 13, wherein the conductive material used in the first conductive film forming step is poly-ITO.   15. The method of manufacturing an electrode substrate according to claim 1, wherein in the second conductive film forming step, the second conductive film is formed using amorphous ITO, and the second conductive film is formed. A method for producing an electrode substrate, further comprising a baking step of polymorphizing the second electrode formed by patterning. A method of manufacturing an electrode substrate having electrodes on both the first main surface and the second main surface of the substrate,
A first conductive film forming step of forming a first conductive film on the first main surface of the first substrate;
A first patterning step of patterning the first conductive film to form a first electrode;
Thinning the first substrate after the first patterning step;
A second conductive film forming step of forming a second conductive film on the first main surface of the second substrate;
A second patterning step of patterning the second conductive film to form a second electrode;
Thinning the second substrate after the second patterning step;
A method of manufacturing an electrode substrate, comprising: bonding a second main surface of the first substrate and a second main surface of the second substrate.   17. The method of manufacturing an electrode substrate according to claim 16, wherein a first protective film that covers the first electrode is provided after the step of bonding the second main surface of the first substrate and the second main surface of the second substrate. A step of affixing to the first main surface of the electrode substrate; a step of affixing a second protective film covering the second electrode after the step of forming the electrode substrate to the second main surface of the electrode substrate; A step of providing a dividing groove on the electrode substrate to which the protective film and the second protective film are attached; and a step of dividing the electrode substrate along the dividing groove, the first protection The method of manufacturing an electrode substrate, wherein the film and the second protective film are not provided in a portion where the dividing groove is provided.   18. The method of manufacturing an electrode substrate according to claim 16, wherein the first substrate and the second substrate have translucency, and the first conductive film forming step and the second conductive film forming step are transparent. A method of manufacturing an electrode substrate, wherein the first conductive film and the second conductive film are formed using a conductive material having a light property.

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