JP2008083154A - Method for thinning glass substrate, manufacturing method of liquid crystal display element and manufacturing method of liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for thinning glass substrate capable of avoiding or reducing the occurrence of etching abnormality when thinning the thicknesses of glass substrates by etching the two sheets of glass substrates stuck to each other in a liquid crystal display element. <P>SOLUTION: Before performing etching for thinning the thicknesses of the first and second glass substrates 1, 2 stuck to each other, first and second conductive films 11, 12 formed on outer surfaces of the first and second glass substrates 1, 2 are made to develop heat and, thereafter, are annealed. Thereby, fine flaw or residual stress on the outer surfaces of the first and second glass substrates 1, 2 are removed or reduced. Therefore, when the thicknesses of the first and second glass substrates stuck to each other are thinned by etching the first and second glass substrates after the annealing, the occurrence of the etching abnormality can be avoided or reduced. Further, the outer surface sides of the glass substrates are heat-treated and the glass substrates are quenched after the etching for thinning the thicknesses of the first and second glass substrates 1, 2 stuck to each other, the outer surface sides of the glass substrates 1, 2 are tempered and the strength of the glass substrates can be enhanced. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for thinning a glass substrate, a method for manufacturing a liquid crystal display element, and a method for manufacturing a liquid crystal display device.

  In a conventional method for manufacturing a liquid crystal display element, two glass substrates having an area capable of forming a plurality of completed liquid crystal display elements are provided in a portion corresponding to each liquid crystal display element formation region therebetween. The two single-element sealing materials and the outer peripheral sealing material provided between the outer peripheral sealing members are bonded together, and in this state, the two glass substrates are etched by being immersed in an etching solution in an etching tank. There is a method in which the thickness of two glass substrates is reduced (see, for example, Patent Document 1).

  In addition, liquid crystal is injected between two glass substrates of this liquid crystal display element, a polarizing plate is further attached, and a driving circuit is mounted on a driving circuit mounting region on one glass substrate, thereby providing a liquid crystal display device. Is completed. Further, a scanning signal line, a data signal line, a thin film transistor, a pixel electrode, an alignment film, and the like are formed on the surface of one of the two substrates included in the liquid crystal display element that faces the other substrate. A structure in which a color filter, a common electrode, an alignment film, and the like are formed on a surface of the substrate facing one substrate, two substrates are bonded together with a sealing material, and a liquid crystal is sealed between these substrates It has.

Japanese Patent Laid-Open No. 4-116619

  By the way, the surface of the glass substrate may have minute scratches or residual stress due to mechanical polishing or the like. When such a glass substrate is etched to reduce its thickness, etching abnormalities such as formation of relatively large etch pits may occur. Further, when the glass substrate is etched to reduce its thickness, the strength is naturally reduced.

Therefore, the present invention provides a method for thinning a glass substrate, a method for manufacturing a liquid crystal display element, and a liquid crystal display device that can avoid or reduce the occurrence of abnormal etching when the thickness is reduced by etching the glass substrate. An object is to provide a manufacturing method.
The present invention also provides a method for thinning a glass substrate, a method for manufacturing a liquid crystal display element, and a method for manufacturing a liquid crystal display device, which can increase the strength even if the glass substrate is etched to reduce its thickness. The purpose is to do.

  In order to achieve the above object, the method of thinning a glass substrate according to claim 1 includes a step of forming a conductive film on the surface of the glass substrate, and then heating the conductive film to heat the surface side of the glass substrate. The method includes a step of heat treatment, a step of cooling the glass substrate, a step of removing the conductive film, and a step of etching the surface side of the glass substrate.

  The method of thinning a glass substrate according to claim 2 includes a step of etching a surface side of the glass substrate, a step of forming a conductive film on the surface of the glass substrate, and then heating the conductive film to generate heat. The method includes a step of heat-treating the surface side of the glass substrate, a step of quenching the glass substrate, and a step of removing the conductive film.

  The method for thinning a glass substrate according to claim 3 further comprises a step of forming an electrode element and an active element on the back surface of the glass substrate in the invention according to claim 1 or 2. It is.

  The method of thinning the glass substrate according to claim 4 includes the step of etching the surface side of the glass substrate, the step of forming a conductive film on the surface of the glass substrate, and then heating the conductive film to generate heat. A step of heat-treating the surface side of the glass substrate, a step of quenching the glass substrate, and a step of patterning the conductive film to form an electrode element and an active element. .

  The method of thinning the glass substrate according to claim 5 is the invention according to any one of claims 1 to 4, wherein the heat treatment step is a heat treatment at a temperature equal to or higher than a strain point of the glass substrate. It is characterized by.

  The method of thinning the glass substrate according to claim 6 is the invention according to any one of claims 1 to 4, wherein the heat treatment step is performed at a temperature that is not less than the strain point of the glass substrate and less than the transition point. It is characterized by heat treatment with.

  The method for thinning a glass substrate according to claim 7 is the invention according to any one of claims 1 to 4, wherein the heat treatment is performed by a direct resistance heating method or a direct induction heating method. It is what.

  The method of thinning the glass substrate according to claim 8 includes a step of forming a conductive film on a surface of the glass substrate, a step of heat-treating the surface of the glass substrate by heating the conductive film, A step of removing the glass substrate, a step of removing the conductive film, and a step of etching the front side of the glass substrate, and further forming an electrode element and an active element on the back surface of the glass substrate. And a step of bonding the glass substrate to another glass substrate via a sealing material.

  The method of thinning the glass substrate according to claim 9 includes a step of etching the surface side of the glass substrate, a step of forming a conductive film on the surface of the glass substrate, and then heating the conductive film to generate heat. A step of heat-treating the front side of the glass substrate, a step of rapidly cooling the glass substrate, and a step of removing the conductive film, and further forming an electrode element and an active element on the back surface of the glass substrate And a step of bonding the glass substrate to another glass substrate through a sealing material.

  The method for producing a liquid crystal display element according to claim 10, wherein the step of etching the surface side of the glass substrate, the step of forming a conductive film on the surface of the glass substrate, and the heat generation of the conductive film are then performed. A step of heat-treating the surface side of the glass substrate, and then a step of rapidly cooling the glass substrate, and further, the step of patterning the conductive film to form an electrode element and an active element; And a step of bonding through a glass substrate and a sealing material.

  The method for manufacturing a liquid crystal display element according to claim 11 is the invention according to any one of claims 8 to 10, wherein the step of bonding the two glass substrates is performed before the step of heat treatment. The heat treatment step is performed while cooling the other glass substrate.

  The method of manufacturing a liquid crystal display device according to claim 12, wherein the step of forming a conductive film on the surface of the glass substrate, the step of heat-treating the surface of the glass substrate by causing the conductive film to generate heat, A step of removing the glass substrate, a step of removing the conductive film, and a step of etching the front side of the glass substrate, and further forming an electrode element and an active element on the back surface of the glass substrate. And a step of bonding the glass substrate to another glass substrate through a sealing material, and then cutting the glass substrate into each element to form a liquid crystal display element, and then the liquid crystal display A step of attaching a polarizing plate to the element and mounting a driving device for driving the active element, and a step of injecting a liquid crystal between the two glass substrates. It is an feature.

  The method of manufacturing a liquid crystal display device according to claim 13 includes a step of forming a conductive film on a surface of a glass substrate, a step of heat-treating the surface side of the glass substrate by heating the conductive film, A step of removing the glass substrate, a step of removing the conductive film, and a step of etching the front side of the glass substrate, and further forming an electrode element and an active element on the back surface of the glass substrate. And a step of bonding the glass substrate to another glass substrate through a sealing material, and then cutting the glass substrate into each element to form a liquid crystal display element, and then the liquid crystal display A step of attaching a polarizing plate to the element and mounting a driving device for driving the active element, and a step of injecting a liquid crystal between the two glass substrates. It is an feature.

  The method of manufacturing a liquid crystal display device according to claim 14, wherein the step of etching the surface side of the glass substrate, the step of forming a conductive film on the surface of the glass substrate, and the heating of the conductive film are then performed. A step of heat-treating the surface side of the glass substrate, a step of quenching the glass substrate, and a step of patterning the conductive film to form an electrode element and an active element. A step of bonding the glass substrate and a sealing material through a sealing material, and then cutting the glass substrate into each element to form a liquid crystal display element, and then attaching a polarizing plate to the liquid crystal display element and And a step of mounting a driving device for driving an active element and a step of injecting liquid crystal between the two glass substrates.

According to the invention described in any one of claims 1, 8, and 12, before the etching for reducing the thickness of the glass substrate, when the surface side of the glass substrate is heat-treated and cooled, Small scratches and residual stress on the surface are removed or reduced, and therefore, when the glass substrate is etched to reduce its thickness, the occurrence of etching abnormalities can be avoided or reduced.
According to the invention of any one of claims 2, 9, and 13, after the etching for reducing the thickness of the glass substrate, when the surface side of the glass substrate is heat-treated and rapidly cooled, the outer surface side of the glass substrate becomes Even if the glass substrate is etched to reduce its thickness, the strength can be increased.
According to the invention described in any one of claims 4, 10, and 14, after the etching for reducing the thickness of the glass substrate, a conductive film is then formed on the surface side of the glass substrate, When the glass substrate is quenched by heat-treating the surface side and this conductive film is patterned, the outer surface side of the glass substrate is tempered glass, so that even if the glass substrate is etched to reduce its thickness, its strength is increased. In addition, the electrode element and the active element can be formed without increasing the number of manufacturing steps as compared with the above-described inventions.

  FIG. 1A shows a plan view of an example of a liquid crystal display device manufactured by a manufacturing method as one embodiment of the present invention, and FIG. 1B is a cross section taken along line BB in FIG. The figure is shown. In this liquid crystal display element, the first and second glass substrates 1 and 2 are bonded together via a substantially rectangular frame-shaped single element sealing material 3, and between the glass substrates 1 and 2 inside the single element sealing material 3. The liquid crystal 4 is sealed through a liquid crystal inlet 5 formed in the single element sealing material 3, and the liquid crystal inlet 5 is sealed with a sealing material 6.

  Here, the liquid crystal display device including the liquid crystal display element is an active matrix type, and although not shown, a plurality of pixel electrodes (electrode elements) are provided on the upper surface side (inner surface side) of the lower first glass substrate 1. ) And a plurality of thin film transistors (active elements) connected to the pixel electrodes are provided in a matrix, and a common electrode (electrode element) is provided on the lower surface side (inner surface side) of the upper second glass substrate 2. Yes. In this case, one side of the first glass substrate 1 protrudes from the second glass substrate 2. The thicknesses of the first and second glass substrates 1 and 2 are relatively thin, for example, about 0.3 mm. Note that the drive circuit described above is mounted in this protruding region.

  Next, an example of a manufacturing method of the liquid crystal display element will be described with reference to a manufacturing process diagram shown in FIG. First, in step S1 of FIG. 2, as shown in FIG. 3, the first and second areas have areas where a plurality of completed liquid crystal display elements (for example, 4 × 4 = 16) can be formed. Glass substrates 1 and 2 are prepared.

  In this case, although not shown, a plurality of pixel electrodes and a plurality of thin film transistors connected to the pixel electrodes are provided in each liquid crystal display element formation region on the upper surface side (inner surface side) of the lower first glass substrate 1. It is provided in a matrix. A common electrode is provided in each liquid crystal display element formation region on the lower surface side (inner surface side) of the lower first glass substrate 1. The thickness of the 1st, 2nd glass substrates 1 and 2 is comparatively thick with about 0.5 mm, for example.

  Next, in the sealing material forming step of step S2 in FIG. 2, a substantially rectangular frame-shaped single element made of epoxy resin or the like is formed on each liquid crystal display element forming region on the upper surface of the first glass substrate 1 by screen printing. The sealing material 3 is formed, and at the same time, a substantially rectangular frame-shaped outer peripheral sealing material 7 made of an epoxy resin or the like is formed on the outer peripheral portion of the first glass substrate 1. In this case, a liquid crystal inlet 5 is formed at one location of the single element sealing material 3, and an air escape port 8 is formed at four locations of the outer peripheral sealing material 7.

  Next, in the bonding process of step S3 in FIG. 2, the second glass substrate 2 is overlaid on the single element sealing material 3 and the outer peripheral sealing material 7 formed on the first glass substrate 1, and then the single glass sealing material is formed. By heating and hardening the element sealing material 3 and the outer peripheral sealing material 7, the first and second glass substrates 1 and 2 are bonded together via the single element sealing material 3 and the outer peripheral sealing material 7. At this time, air existing between the glass substrates 1 and 2 inside the outer peripheral sealing material 7 is thermally expanded. A part of the thermally expanded air is exposed to the outside through the air escape port 8 of the outer peripheral sealing material 7. The outer peripheral sealing material 7 is prevented from being broken.

  Next, in the sealing material forming step of step S4 in FIG. 2, the air escape port 8 of the outer peripheral sealing material 7 is sealed with a sealing material 9 made of an ultraviolet curable epoxy-modified acrylic resin or the like. Here, what is shown in FIG. 3 in the state where the sealing material forming step of Step S4 in FIG. 2 is completed is hereinafter referred to as a liquid crystal display element forming structure 10. Next, in the conductive film forming step of step S5 in FIG. 2, the outer surfaces of the first and second glass substrates 1 and 2 of the liquid crystal display element forming structure 10 are made of aluminum, copper, or the like by vapor deposition or the like. First and second conductive films 11 and 12 (see FIG. 4) are formed.

  Next, in the heat treatment step of step S6 in FIG. 2, as shown in FIG. 4, the first conductive film 11 formed on the outer surface of the first glass substrate 1 of the liquid crystal display element forming structure 10 is cooled by a cooling device. 13 are placed in contact with the upper surface of the stage 14. As an example, the cooling device 13 blows compressed air to the lower surface of the stage 14 made of a metal such as copper having good thermal conductivity, and cools the one disposed on the upper surface via the stage 14.

  Next, rod-like electrodes 15 and 16 are disposed at both ends of the upper surface of the second conductive film 12, and a second conductive film is formed by flowing a current between these electrodes 15 and 16, that is, by a direct resistance heating method. 12 is heated, and the outer surface side of the second glass substrate 2 is heated to a temperature not less than the strain point of the second glass substrate 2 and less than the transition point, and then cooled down, whereby the second glass substrate 2 Minor scratches and residual stresses on the outer surface are removed or reduced. In this case, in order to prevent the thin film transistor, the single element sealing material 3 and the outer peripheral sealing material 7 provided on the inner surface side of the first glass substrate 1 from being deteriorated or destroyed by heating, the outer surface side of the first glass substrate 1 is used. Is cooled by the cooling device 13 through the first conductive film 11.

  Next, as shown in FIG. 5, the second conductive film 12 formed on the outer surface of the second glass substrate 2 of the liquid crystal display element forming structure 10 is brought into contact with the upper surface of the stage 14 of the cooling device 13. Arrange. Next, rod-shaped electrodes 15 and 16 are disposed on both ends of the upper surface of the first conductive film 11, and a current is passed between the electrodes 15 and 16, that is, by a direct resistance heating method, the first conductive film. 11 is heated, and the outer surface side of the first glass substrate 1 is heated to a temperature higher than the strain point of the first glass substrate 1 and lower than the transition point, and then cooled down to remove the first glass substrate 1. Minor scratches and residual stresses on the outer surface are removed or reduced. Also in this case, the outer surface of the second glass substrate 2 is used to prevent the thin film transistor, the single element sealing material 3 and the outer peripheral sealing material 7 provided on the inner surface side of the first glass substrate 1 from being deteriorated or destroyed by heating. The side is cooled by the cooling device 13 through the second conductive film 12.

  Next, in the conductive film removing step of step S7 in FIG. 2, the first and second conductive films 11 and 12 are removed by etching. Next, in the etching process of step S8 of FIG. 2, the liquid crystal display element forming structure 10 is immersed in an etching solution in an etching tank (not shown). Then, the first and second glass substrates 1 and 2 of the liquid crystal display element forming structure 10 are etched, and the thickness gradually decreases. When the thickness of the first and second glass substrates 1 and 2 of the liquid crystal display element forming structure 10 is about 0.3 mm, the liquid crystal display element forming structure 10 is placed in the etching solution in the etching tank. To finish etching.

  In this case, the outer surfaces of the first and second glass substrates 1 and 2 are removed by cooling the outer surfaces of the first and second glass substrates 1 and 2 in the heat treatment step of step S6 in FIG. Therefore, when the first and second glass substrates 1 and 2 are etched to reduce their thickness, the occurrence of etching abnormality can be avoided or reduced. it can.

  Next, in the cutting process of step S9 in FIG. 2, the sealing material 9 is removed from the first and second glass substrates 1 and 2 of the liquid crystal display element forming structure 10 by a cutting means such as a glass cutter. After cutting, the first and second glass substrates 1 and 2 from which the sealing material 9 has been removed are cut into individual pieces. Next, in the liquid crystal injection process in step S10 of FIG. 2, the liquid crystal 4 is sealed between the glass substrates 1 and 2 inside the single element sealing material 3 as shown in FIGS. Injection is performed through the liquid crystal injection port 5 of the material 3. Next, in the liquid crystal injection port sealing step of step S11 in FIG. 2, when the liquid crystal injection port 5 is sealed with the sealing material 6, the liquid crystal display elements shown in FIGS. 1A and 1B are obtained. A polarizing plate (not shown) is attached to the liquid crystal display element, and a driving circuit (not shown) is mounted on one side of the first glass substrate 1 protruding from the second glass substrate 2. Thus, the liquid crystal display device is completed.

  In the above description, the liquid crystal display element forming structure 10 is in a state in which the first and second glass substrates 1 and 2 are bonded together via the single element sealing material 3 and the outer peripheral sealing material 7. However, the present invention is not limited to this, and the single first and second glass substrates 1 and 2 may be heat-treated.

  That is, first, the first conductive film 11 is formed on the other surface of the first glass substrate 1 provided with the pixel electrode and the thin film transistor on one surface side, and the first conductive film 11 is heated to generate the first glass substrate. The other side of the first surface is heat-treated, cooled, and the first conductive film 11 is removed. Also, the second conductive film 12 is formed on the other surface of the second glass substrate 2 on which the common electrode is provided on the one surface side, and the second conductive film 12 is heated to generate the second glass substrate 12 on the other surface side. Is subjected to heat treatment, and then cooled, and the second conductive film 12 is removed. Thereafter, the first and second glass substrates 1 and 2 are bonded together via the single element sealing material 3 and the outer peripheral sealing material 7 to form the liquid crystal display element forming structure 10, and then the liquid crystal display element forming structure The first and second glass substrates 1 and 2 of the body 10 are etched to reduce their thickness.

  In this case, when the first glass substrate 1 is heat-treated in a single state, it is necessary to consider deterioration or destruction due to heating of the thin film transistor, so the cooling device 13 is used. On the other hand, since the second glass substrate 2 is heat-treated in a single state, there is no need to consider deterioration or destruction due to heating of the thin film transistor, the single element sealing material 3 and the outer peripheral sealing material 7. It is not necessary to use it, and the temperature control during the heat treatment can be roughly performed.

  Alternatively, the heat treatment may be performed in a state of a mere first glass substrate 1 in which a pixel electrode and a thin film transistor are not provided on one side and a mere second glass substrate 2 in which a common electrode is not provided on the one side. That is, first, the first and second conductive films 11 and 12 are formed on the other surfaces of the first and second glass substrates 1 and 2, and the first and second conductive films 11 and 12 are heated. The other surfaces of the first and second glass substrates 1 and 2 are heat-treated and cooled to remove the first and second conductive films 11 and 12. Thereafter, a pixel electrode and a thin film transistor are formed on one surface side of the first glass substrate 1, and a common electrode is formed on one surface side of the second glass substrate 2, and then the first and second glass substrates 1, 2 are bonded together via a single element sealing material 3 and an outer peripheral sealing material 7 to form a liquid crystal display element forming structure 10, and then the first and second glass substrates 1 of the liquid crystal display element forming structure 10, Etch 2 to reduce its thickness.

  In this case, since the heat treatment is simply performed in the state of the first and second glass substrates 1 and 2, there is no need to consider deterioration or destruction due to heating of the thin film transistor, the single element sealing material 3 and the outer peripheral sealing material 7, and cooling It is not necessary to use the apparatus 13, and the temperature control during the heat treatment can be roughly performed.

  Further, in the case of the mere first glass substrate 1, conductive films are formed on one surface and the other surface of the first glass substrate 1, and these conductive films are heated so that one surface side of the first glass substrate 1 and Heat treatment is performed on the other side, cooling is performed, the conductive film on the other side is removed, and the conductive film on the other side is subsequently patterned to form the gate electrode or source / drain electrode of the thin film transistor, and the gate line or drain line. You may make it form. In this case, the conductive film on one surface side is also removed, and a newly formed electrode forming conductive film is patterned on one surface of the first glass substrate 1 to form the gate electrode or source / drain electrode of the thin film transistor, and the gate line or drain. A line may be formed. In either case, both surfaces of the first glass substrate 1 can be heat-treated, so that minute scratches and residual stress on both outer surfaces are removed or reduced. Furthermore, the electrode element and the active element can be formed without increasing the number of manufacturing steps as compared with the above-described embodiment.

  In the above description, the outer surfaces of the first and second glass substrates 1 and 2 are removed before performing the etching for reducing the thickness of the first and second glass substrates 1 and 2 bonded together. Although the case where it heat-processes was demonstrated, not only this but after performing the etching for making thickness of the 1st, 2nd glass substrates 1 and 2 bonded together thin, the 1st, 2nd glass substrate You may make it heat-process the outer surface side of 1 and 2.

  That is, first, the first and second glass substrates 1 and 2 of the liquid crystal display element forming structure 10 shown in FIG. 3 are etched to reduce their thickness. Next, first and second conductive films are formed on the outer surfaces of the first and second glass substrates 1 and 2, and the first and second conductive films are heated to generate heat. Heat treatment is performed on the outer surface side of the first and second conductive films, and then the outer surface side of the first and second glass substrates 1 and 2 is rapidly cooled to thereby cool the first and second conductive films. The outer surface side of the glass substrates 1 and 2 is tempered glass, and then the first and second conductive films are removed.

  Thus, after performing the etching for reducing the thickness of the first and second glass substrates 1 and 2 bonded together, the outer surface side of the first and second glass substrates 1 and 2 is heat-treated. Since the outer surfaces of the first and second glass substrates 1 and 2 are tempered glass, the first and second glass substrates 1 and 2 are etched to reduce their thickness. , Its strength can be increased. In this case, it is preferable to use the cooling device 13.

  By the way, the heat generation of the conductive film is not limited to the direct resistance heating method, but may be a direct induction heating method. That is, scan in one direction using a planar angular spiral coil corresponding to the planar shape of the planar rectangular conductive film, or using a rectangular prismatic coil corresponding to one side of the conductive film, Alternatively, the conductive film is formed by an induced current generated in the conductive film under the coil by a magnetic field generated when a high-frequency current is passed through the coil by scanning in the X and Y directions using a plane angle spiral coil corresponding to a part of the conductive film. May be caused to generate heat.

  In this case, the conductive film may be heated uniformly, or only the surface side of the conductive film may be instantaneously heated like steel surface hardening. In the case where the conductive film is uniformly heated, it is preferable to use the cooling device 13. However, in the case where only the surface side of the conductive film is heated instantaneously, the heating is instantaneous. If the sealing material 3 and the outer peripheral sealing material 7 are not deteriorated or destroyed by heating, the cooling device 13 may not be used.

  Here, after the etching process of step S8 in FIG. 2, different first and second conductive films are formed on the outer surfaces of the first and second glass substrates 1 and 2, and the different first and second conductive films are formed. By heating the film, the outer surface sides of the first and second glass substrates 1 and 2 may be heat-treated again, then rapidly cooled, and then the other first and second conductive films may be removed. In such a case, since the outer surface side of the first and second glass substrates 1 and 2 can be tempered glass, the thickness of the first and second glass substrates 1 and 2 is etched to obtain the thickness. Even if it is made thinner, its strength can be increased.

(A) is a top view of an example of the liquid crystal display element manufactured by the manufacturing method as one Embodiment of this invention, (B) is sectional drawing which follows the BB line. The figure which shows the manufacturing process of the liquid crystal display element shown in FIG. The top view which notched some liquid crystal display element formation structural bodies shown in order to demonstrate step S1-S4 of FIG. Schematic shown in order to demonstrate the heat processing of the outer surface side of a 2nd glass substrate. Schematic shown in order to demonstrate the heat processing of the outer surface side of a 1st glass substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st glass substrate 2 2nd glass substrate 3 Single element sealing material 4 Liquid crystal 5 Liquid crystal inlet 6 Sealing material 7 Perimeter sealing material 8 Air escape port 9 Sealing material 10 Structure for liquid crystal display element formation 11 1st Conductive film 12 second conductive film 13 cooling device 14 stage 15, 16 electrode

Claims (14)

  Forming a conductive film on the surface of the glass substrate, then heat-treating the surface of the glass substrate by heating the conductive film, then removing the glass substrate, and then A method for thinning a glass substrate, comprising: a step of removing, and then a step of etching a surface side of the glass substrate.   A step of etching the surface side of the glass substrate, a step of forming a conductive film on the surface of the glass substrate, a step of heat-treating the surface side of the glass substrate by heating the conductive film, and then the glass A method of thinning a glass substrate, comprising: a step of rapidly cooling the substrate; and then a step of removing the conductive film. In the invention according to claim 1 or 2,
Furthermore, the method of thinning a glass substrate characterized by including the process of forming an electrode element and an active element in the back surface of the said glass substrate.   A step of etching the surface side of the glass substrate, a step of forming a conductive film on the surface of the glass substrate, a step of heat-treating the surface side of the glass substrate by heating the conductive film, and then the glass A method of thinning a glass substrate comprising: rapidly cooling the substrate; and then patterning the conductive film to form electrode elements and active elements. In the invention according to any one of claims 1 to 4,
The method of thinning a glass substrate, wherein the heat treatment step includes performing a heat treatment at a temperature equal to or higher than a strain point of the glass substrate. In the invention according to any one of claims 1 to 4,
The method of thinning a glass substrate is characterized in that the step of performing the heat treatment is a heat treatment at a temperature that is greater than or equal to a strain point of the glass substrate and less than a transition point. In the invention according to any one of claims 1 to 4,
The method of thinning a glass substrate, wherein the heat treatment step is performed by a direct resistance heating method or a direct induction heating method.   Forming a conductive film on the surface of the glass substrate, then heat-treating the surface of the glass substrate by heating the conductive film, then removing the glass substrate, and then And a step of etching the front side of the glass substrate, and further, forming an electrode element and an active element on the back surface of the glass substrate, and sealing the glass substrate with another glass substrate. A method of manufacturing a liquid crystal display element, comprising a step of bonding through a material.   A step of etching the surface side of the glass substrate, a step of forming a conductive film on the surface of the glass substrate, a step of heat-treating the surface side of the glass substrate by heating the conductive film, and then the glass A step of rapidly cooling the substrate, and then a step of removing the conductive film, and a step of forming an electrode element and an active element on the back surface of the glass substrate, and the glass substrate is separated from another glass substrate and a sealing material And a step of laminating them via a liquid crystal display element.   A step of etching the surface side of the glass substrate, a step of forming a conductive film on the surface of the glass substrate, a step of heat-treating the surface side of the glass substrate by heating the conductive film, and then the glass Quenching the substrate, patterning the conductive film to form electrode elements and active elements, and bonding the glass substrate to another glass substrate through a sealing material. A method for producing a liquid crystal display element, comprising: In the invention according to any one of claims 8 to 10,
The step of bonding the two glass substrates is performed before the heat treatment step,
The method of manufacturing a liquid crystal display element, wherein the heat treatment step is performed while cooling the another glass substrate.   Forming a conductive film on the surface of the glass substrate, then heat-treating the surface of the glass substrate by heating the conductive film, then removing the glass substrate, and then And a step of etching the front side of the glass substrate, and further, forming an electrode element and an active element on the back surface of the glass substrate, and sealing the glass substrate with another glass substrate. And a step of forming a liquid crystal display element by cutting the glass substrate into each element, and then affixing a polarizing plate to the liquid crystal display element and driving the active element A method for manufacturing a liquid crystal display device, comprising: a step of mounting a driving device; and a step of injecting liquid crystal between the two glass substrates.   Forming a conductive film on the surface of the glass substrate, then heat-treating the surface of the glass substrate by heating the conductive film, then removing the glass substrate, and then And a step of etching the front side of the glass substrate, and further, forming an electrode element and an active element on the back surface of the glass substrate, and sealing the glass substrate with another glass substrate. And a step of forming a liquid crystal display element by cutting the glass substrate into each element, and then affixing a polarizing plate to the liquid crystal display element and driving the active element A method for manufacturing a liquid crystal display device, comprising: a step of mounting a driving device; and a step of injecting liquid crystal between the two glass substrates.   A step of etching the surface side of the glass substrate, a step of forming a conductive film on the surface of the glass substrate, a step of heat-treating the surface side of the glass substrate by heating the conductive film, and then the glass A step of rapidly cooling the substrate, and then a step of patterning the conductive film to form an electrode element and an active element, and further bonding the glass substrate to another glass substrate through a sealing material; Next, a step of cutting the glass substrate into each element to form a liquid crystal display element, a step of attaching a polarizing plate to the liquid crystal display element and mounting a driving device for driving the active element, and 2 And a step of injecting liquid crystal between the glass substrates.

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