JP2008053700A5 - - Google Patents
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- Publication number
- JP2008053700A5 JP2008053700A5 JP2007192870A JP2007192870A JP2008053700A5 JP 2008053700 A5 JP2008053700 A5 JP 2008053700A5 JP 2007192870 A JP2007192870 A JP 2007192870A JP 2007192870 A JP2007192870 A JP 2007192870A JP 2008053700 A5 JP2008053700 A5 JP 2008053700A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- forming
- semiconductor
- electrode layer
- conductivity type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 68
- 239000010408 film Substances 0.000 claims 26
- 239000000758 substrate Substances 0.000 claims 24
- 230000001678 irradiating effect Effects 0.000 claims 11
- 238000005530 etching Methods 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007192870A JP5041903B2 (ja) | 2006-07-28 | 2007-07-25 | 表示装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006205711 | 2006-07-28 | ||
| JP2006205711 | 2006-07-28 | ||
| JP2007192870A JP5041903B2 (ja) | 2006-07-28 | 2007-07-25 | 表示装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008053700A JP2008053700A (ja) | 2008-03-06 |
| JP2008053700A5 true JP2008053700A5 (enrdf_load_html_response) | 2010-08-26 |
| JP5041903B2 JP5041903B2 (ja) | 2012-10-03 |
Family
ID=39237396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007192870A Expired - Fee Related JP5041903B2 (ja) | 2006-07-28 | 2007-07-25 | 表示装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5041903B2 (enrdf_load_html_response) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5216716B2 (ja) * | 2008-08-20 | 2013-06-19 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
| KR101213491B1 (ko) * | 2009-11-27 | 2012-12-20 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 제조 방법 및 유기 발광 표시 장치용 표면 처리 장치 |
| JP2010161084A (ja) * | 2010-04-02 | 2010-07-22 | Casio Computer Co Ltd | 表示装置及び表示装置の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302603A (ja) * | 1993-03-26 | 1994-10-28 | Hitachi Ltd | Ic素子 |
| JPH11251433A (ja) * | 1998-03-06 | 1999-09-17 | Rohm Co Ltd | 半導体装置およびその製法 |
| JP2001168061A (ja) * | 1999-09-27 | 2001-06-22 | Toshiba Corp | レーザ照射により半導体基板上に成膜を形成するためのターゲット及びその製造方法 |
| JP2004031933A (ja) * | 2002-05-09 | 2004-01-29 | Konica Minolta Holdings Inc | 有機薄膜トランジスタの製造方法及び、それにより製造された有機薄膜トランジスタと有機薄膜トランジスタシート |
| JP2005085799A (ja) * | 2003-09-04 | 2005-03-31 | Seiko Epson Corp | 成膜方法、配線パターンの形成方法、半導体装置の製造方法、電気光学装置、及び電子機器 |
| JP4801407B2 (ja) * | 2004-09-30 | 2011-10-26 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| KR101074389B1 (ko) * | 2004-11-05 | 2011-10-17 | 엘지디스플레이 주식회사 | 박막 식각 방법 및 이를 이용한 액정표시장치의 제조방법 |
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2007
- 2007-07-25 JP JP2007192870A patent/JP5041903B2/ja not_active Expired - Fee Related