JP2008053644A - Surface mounting component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface mounting component on which a highly adhesive metal pattern is precisely formed on a front surface of a base composed of an elastomeric material by comparatively easy steps. <P>SOLUTION: A surface mounting component 1 has a base 3 and a pattern 5 formed on the front surface of the base 3. The base 3 is formed with a conductive elastomeric material, wherein for a conductive elastomeric material, a material is utilized in which a silver filler is blended, the silver filler based on silicone-based elastomer, which functions as a conductive material. The pattern 5 is made by copper; i.e., a shape corresponding to the pattern 5 is printed onto the surface of the base 3 using catalytic element containing liquid, and metal component containing liquid including copper is brought into contact with the place where the printing is done to separate out the copper by an electroless plating method. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component for surface mounting that can be mounted on a printed wiring board.

  Conventionally, as a technique for providing a metal pattern on the surface of a base, a technique has been proposed in which a pattern is drawn on the surface of the base by an ink jet method and metal plating is applied to the pattern (for example, Patent Documents 1 and 2). reference.).

  In the case of the technique described in Patent Document 1, a pattern including a catalyst having a monomer polymerization ability is formed on a substrate by an inkjet method, and a monomer component that generates a conductive polymer is brought into contact with the catalyst to increase the conductivity. A desired metal pattern is formed by forming a molecular pattern and applying metal plating to the conductive polymer pattern.

In the case of the technique described in Patent Document 2 below, a pattern is formed on a substrate with a liquid containing metal ultrafine particles by an ink jet method, the substrate is baked to form a base conductive pattern, and the base conductive pattern is further formed. The desired metal pattern is formed by applying electroless plating to the film.
JP 2004-31392 A JP 2005-142420 A

  However, since the techniques described in Patent Documents 1 and 2 are techniques for forming a pattern on a substrate made of a relatively hard material, as techniques for forming a pattern on the surface of a base made of an elastomer material. Was not necessarily suitable.

  In particular, in the case of the technique described in Patent Document 1, a pattern comprising a catalyst layer is formed by ink jetting, a conductive polymer is generated thereon, and a conductive pattern is formed by electroplating. In addition, it may be difficult to form a uniform conductive polymer pattern. In this case, the final metal pattern tends to have uneven thickness and shape, resulting in poor pattern accuracy. There was.

  Further, in the case of the technique described in Patent Document 2, it is not easy to uniformly disperse the metal ultrafine particles in the liquid, so that the distribution density of the metal ultrafine particles in the pattern formed by the ink jet method is made uniform. There was also a problem that it was difficult. There is also a problem that the substrate made of an elastomer material is easily damaged by heat during firing.

  The present invention has been made to solve the above-described problems, and its object is to provide a surface mounting in which a highly adhesive metal pattern is accurately formed on a surface of a substrate made of an elastomer material by a relatively simple process. The purpose is to provide parts.

Hereinafter, the configuration employed in the present invention will be described.
The surface mounting component of the present invention is a surface mounting component in which a pattern formed of a metal material is provided on the surface of a base formed of an elastomer material, and the pattern is formed by electroless plating. Using the catalyst component-containing liquid containing the catalyst component used for promoting the deposition of the material, printing is performed on the surface of the substrate, and the metal component-containing liquid containing the metal material at the place where the printing is performed The metal material is deposited by bringing the metal material into contact with each other.

  According to the surface mounting component configured as described above, since the pattern of the metal material is formed on the surface of the base body, the surface mounting component is used by using a part of this pattern as a soldering region. It can be mounted on a printed wiring board. The pattern on the surface of the substrate may be used for constituting a part of an electric circuit, or may be used only for fixing a surface mounting component on a printed wiring board.

  Further, in this surface mounting component, since the base is formed of an elastomer material, when the surface mounting component is mounted on a printed wiring board and then used in contact with another member, the other member is used. The substrate is deformed by receiving the contact pressure with the other member, and the contact with other members can be maintained well. Therefore, for example, it is suitable as a component such as a contact that is electrically connected to another member in contact with the other member.

  Furthermore, in this surface mount component, the pattern is printed on the surface of the substrate using a catalyst component-containing liquid containing a catalyst component that is used to promote deposition of a metal material by an electroless plating method. It is formed by depositing a metal material by bringing a metal component-containing liquid containing the metal material into contact with the printed portion. Therefore, despite the fact that the base is formed of an easily deformable elastomer material, a metal pattern with high adhesion can be formed on the surface of the base with high accuracy.

  In addition, since a catalyst component-containing liquid is applied onto a substrate and a chemically activated surface is applied to the electrolytic solution, a simple process is used to generate metal on the coated surface. Compared with the manufacturing method which requires more processes, a metal pattern can be obtained easily.

  In addition, since heat treatment at high temperature for a long time is not required, there is no problem that production time is short and practical mass productivity is high, and substrates that can withstand heat treatment are limited.

  By the way, in the surface mounting component of the present invention, various methods can be considered as a method for printing the catalyst component-containing liquid. For example, the catalyst component-containing liquid may be formed by the ink jet method using the substrate. It is preferable to print on the surface. Employing such a configuration is preferable because a desired pattern can be printed relatively easily without using a dedicated plate or the like.

  In addition, in the surface mounting component of the present invention, various methods can be considered as a method of contacting the metal component-containing liquid with the printed portion after printing the catalyst component-containing liquid. In other words, it is preferable to immerse the printed substrate in the metal component-containing liquid tank.

  Or if another example is given, the said metal component containing liquid will be made to contact the location where the said printing was performed by overlapping and printing the said metal component containing liquid on the location where the said printing was performed by the inkjet system. Preferably. By adopting such a configuration, the metal component-containing liquid does not adhere to a place where it is not necessary to deposit the metal material, and thus the consumption of the metal component-containing liquid can be suppressed accordingly.

  Further, in the surface mounting component of the present invention, Cu, Sn, Au, or the like is preferable as the metal material used for forming the pattern. If these metal materials are used, a suitable pattern can be formed as a soldering region or a part of an electric circuit.

  In the surface mount component of the present invention, the elastomer material used to form the substrate is preferably a silicone elastomer or an epoxy elastomer blended as a base material. With such an elastomer material, the heat resistance of the substrate can be increased. Therefore, even when the surface mounting component is placed in a high-temperature environment when mounted on a printed wiring board, the characteristics as an elastomer included in the substrate Can be maintained well.

  Furthermore, in the surface mount component of the present invention, various functional fillers can be blended in the elastomer material used for forming the substrate, depending on the purpose of use of the surface mount component.

  For example, in the surface mount component of the present invention, the elastomer material may be blended with a filler that functions as a conductive material. In this case, conductivity can be imparted to the substrate. Examples of the filler that functions as a conductive material include fillers such as silver, aluminum, copper, and carbon.

  In the surface mount component of the present invention, the elastomer material may be blended with a filler that functions as a magnetic material. In this case, magnetism can be imparted to the substrate. Examples of the filler that functions as a magnetic material include fillers such as Fe—Si—Cr alloy, Fe—Si—Al alloy, and amorphous alloy.

  In the surface mount component of the present invention, the elastomer material may be blended with a filler that functions as a dielectric material. In this case, the dielectric constant of the substrate can be improved. Examples of the filler that functions as a dielectric material include fillers such as barium titanate and silicon carbide.

  In the surface mount component of the present invention, the elastomer material may be blended with a filler that functions as a heat conductive material. In this case, the thermal conductivity of the substrate can be improved. Examples of the filler that functions as a heat conductive material include fillers such as alumina and magnesia.

  Furthermore, in the surface mount component of the present invention, the catalyst component is preferably a palladium compound. If such a structure is employ | adopted, a metal material can be efficiently deposited by the catalytic action of palladium.

  In addition, in the surface mounting component of the present invention, the catalyst component-containing liquid may contain an ultraviolet curable resin component that is cured when irradiated with ultraviolet rays. In this case, the pattern contains the catalyst component. After printing on the surface of the substrate using a liquid, the portion where the printing is performed is irradiated with ultraviolet rays to cure the liquid component, and then the metal material is contained in the portion where the printing is performed. It is good to be formed by making a metal component containing liquid contact.

  If comprised in this way, since the printing by a catalyst component containing liquid can be hardened more reliably, an accurate pattern can be formed.

Next, embodiments of the present invention will be described with specific examples.
[First Embodiment]
FIG. 1 is a perspective view of a surface mounting component exemplified as an embodiment of the present invention.

The surface mounting component 1 includes a base 3 and a pattern 5 formed on the surface of the base 3.
The substrate 3 is formed of an elastomer material having conductivity. As the elastomer material having conductivity, a material obtained by blending a silver filler that functions as a conductive material based on a silicone elastomer is used. Yes.

  The pattern 5 is formed of copper and, as will be described in detail later, using a catalyst component-containing liquid containing a palladium compound, a pattern corresponding to the pattern 5 is printed on the surface of the substrate 3, and the pattern 5 It is formed by bringing a metal component-containing liquid containing copper into contact with the printed portion and depositing copper by an electroless plating method.

  The surface mounting component 1 configured as described above is mounted on the printed wiring board 7 by soldering the pattern 5 to the metal portion 9 formed on the printed wiring board 7, for example. . The metal part 9 is a part having a ground potential on the printed wiring board 7. Then, the printed wiring board 7 is placed in the casing so that the surface 3a of the base 3 is brought into contact with a casing of an electronic device (not shown) and the surface mounting component 1 is sandwiched between the casing and the printed wiring board 7. By fixing with, the metal part 9 and the housing can be electrically connected.

Next, the procedure for forming the pattern 5 on the surface of the substrate 3 will be described.
First, as a catalyst component-containing liquid containing a palladium compound, a solution in which each substance was mixed at a blending ratio shown in Table 1 below was prepared.

上記表１中、酢酸パラジウムは、後の工程で金属を析出させるための触媒として機能する成分である。ＵＶ光重合開始剤Ａ，Ｂ、ＵＶ硬化型反応性希釈モノマー、六官能性モノマー、反応性四官能性ポリエステルアクリレートオリゴマーは、紫外線硬化樹脂成分である。ＵＶ光重合開始剤Ａとしては、製品名：Irgacure1700（イギリス・Ciba Specialty Chemicals社製）を使用し、ＵＶ光重合開始剤Ｂとしては、製品名：Irgacure819（イギリス・Ciba Specialty Chemicals社製）を使用した。また、ＵＶ硬化型反応性希釈モノマーとしては、ジプロピレングリコールジアクリレート（ベルギー・UCB社製）を使用した。また、六官能性モノマーとしては、ジペンタエリスリトールヘキサアクリレート（ベルギー・UCB社製）を使用した。また、反応性四官能性ポリエステルアクリレートオリゴマーとしては、製品名：Actilane505（イギリス・Akzo Nobel UV Resins社製）を使用した。ジアセトンアルコールは、他の固形分とともに基体に付着した後、他の固形分を残して蒸発する揮発性の成分である。ポリビニルピロリドンとしては、製品名：PVP K30（イギリス・ISP社製）を使用した。

In Table 1 above, palladium acetate is a component that functions as a catalyst for depositing metal in a later step. The UV photopolymerization initiators A and B, the UV curable reactive dilution monomer, the hexafunctional monomer, and the reactive tetrafunctional polyester acrylate oligomer are ultraviolet curable resin components. The product name: Irgacure1700 (manufactured by Ciba Specialty Chemicals, UK) is used as the UV photoinitiator A, and the product name: Irgacure819 (manufactured by Ciba Specialty Chemicals, UK) is used as the UV photoinitiator B. did. In addition, dipropylene glycol diacrylate (manufactured by UCB, Belgium) was used as the UV curable reactive dilution monomer. In addition, dipentaerythritol hexaacrylate (made by UCB, Belgium) was used as the hexafunctional monomer. As the reactive tetrafunctional polyester acrylate oligomer, product name: Actilane 505 (manufactured by Akzo Nobel UV Resins, UK) was used. Diacetone alcohol is a volatile component that adheres to the substrate together with other solids and then evaporates leaving other solids. The product name: PVP K30 (manufactured by ISP, UK) was used as polyvinylpyrrolidone.

  The catalyst component-containing liquid as described above was printed on the surface of the substrate 3 at a recording density of 180 × 250 dpi with an ink jet print head (product name: XJ500 / 180, UK, Xarr) to obtain a sample. . Thereafter, the printed surface of the sample was irradiated with ultraviolet rays (using Fusion 500 Watt H-bulb) to cure the solid content in the catalyst component-containing liquid.

  Subsequently, the sample was immersed in a bath containing a 1.6% solution of dimethylamine borane in deionized water, treated at 40 ± 2 ° C. for 2 minutes, and then deionized water was washed away to dry the sample. By this treatment, palladium acetate on the sample surface is reduced to palladium and activated as a catalyst.

  Then, the sample was immersed in the metal component containing liquid containing copper. As the metal component-containing liquid containing copper, a mixture of 75% deionized water and 25% copper plating solution was used. For the copper plating solution, three types of commercially available electroless copper plating solutions (product names: Enplate 872A, Enplate 872B, Enplate 872C, all manufactured by Enthone-OMI, UK) were blended at a ratio of 3: 3: 1. Is. Note that Enplate 872A contains copper sulfate as a metal source for plating. Enplate 872B also contains a cyanide complexing agent and formaldehyde. Enplate 872C contains sodium hydroxide.

  When the sample was immersed in the metal component-containing liquid, the metal component-containing liquid was stirred and the temperature of the metal component-containing liquid was maintained at 45 ± 2 ° C., and the sample was immersed for 2 minutes. As a result, a copper pattern 5 was formed on the surface of the substrate 3.

  According to the surface mounting component 1 described above, it is possible to form the metal pattern 5 with high adhesion on the surface of the base 3 with high accuracy even though the base 3 is formed of an easily deformable elastomer material. it can.

[Second Embodiment]
FIG. 2 is a perspective view of a surface mounting component exemplified as an embodiment of the present invention.
The surface mounting component 11 includes a base 13 and a pattern 15 formed on the surface of the base 13.

  The base 13 is formed of a conductive elastomer material. As the conductive elastomer material, a material obtained by blending a silver filler that functions as a conductive material based on a silicone elastomer is used. Yes.

  The pattern 15 is formed of copper. Like the first embodiment, the pattern 15 is printed on the surface of the substrate 13 with a shape corresponding to the pattern 15 using a catalyst component-containing liquid containing a palladium compound. It is formed by bringing a metal component-containing liquid containing copper into contact with the printed portion and depositing copper by an electroless plating method.

The surface mounting component 11 configured as described above is also mounted on the printed wiring board by soldering the pattern 15 to the metal portion formed on the printed wiring board.
In addition, since the surface mounting component 11 can be fixed to the printed wiring board at the four locations where the pattern 15 is provided, the effect of preventing the rotation of the component is higher than that when the equivalent pattern is provided at two locations. In other words, when mounting with the reflow soldering method, if there are only two places where the product is fixed by solder, the product installation position may be shifted or rotated due to a slight difference in wettability of the solder surface. is there. In this regard, the surface mounting component 11 has a structure in which the pattern 15 is divided into four locations, and the number of locations to be fixed to the printed wiring board can be increased by that amount, thereby preventing rotation of the component. it can. In addition, even if the shape of the pattern 15 is devised, it is possible to prevent component rotation. The shape and number of the patterns 15 can be set to any shape and number by printing.

[Third Embodiment]
FIG. 3A is a perspective view of a surface mounting component exemplified as an embodiment of the present invention, and FIG. 3B is an explanatory view showing a usage state of the surface mounting component.

The surface mounting component 21 includes a base body 23 and a pattern 25 formed on the surface of the base body 23.
The base 23 is formed of a conductive elastomer material. As the conductive elastomer material, a material obtained by blending a silver filler that functions as a conductive material based on a silicone elastomer is used. Yes.

  The pattern 25 is formed of copper. Like the first embodiment, the pattern 25 is printed on the surface of the base 23 using the catalyst component-containing liquid containing a palladium compound, and the pattern 25 is printed. It is formed by bringing a metal component-containing liquid containing copper into contact with the printed portion and depositing copper by an electroless plating method.

  The surface mounting component 21 configured as described above is also mounted on the printed wiring board 27 by soldering the pattern 25 to the metal portion 29 formed on the printed wiring board 27. The base 3 is brought into contact with the casing 30 of the electronic device, and the surface mounting component 21 is sandwiched between the casing 30 and the printed wiring board 27 so that the printed wiring board 27 is placed inside the casing 30. By fixing, the metal part 29 and the housing | casing 30 can be electrically connected.

  In the third embodiment, since the base body 23 has a hollow structure, it is easier to compress and deform than that of the first embodiment, and the surface mounting component 21 is provided between the housing 30 and the printed wiring board 27. It is possible to prevent excessive stress from acting on each part of the housing 30, the printed wiring board 27, and the surface mounting component 21.

[Fourth Embodiment]
FIG. 4 is a perspective view of a surface mounting component exemplified as an embodiment of the present invention.
The surface mounting component 31 includes a base body 33 and patterns 35 a and 35 b formed on the surface of the base body 33.

The base 33 is made of a material obtained by blending a filler of Fe—Si—Cr alloy that functions as a magnetic material based on a silicone elastomer.
The patterns 35a and 35b are made of copper. Like the first embodiment, the patterns 35a and 35b are printed on the surface of the substrate 33 in a shape corresponding to the patterns 35a and 35b using a catalyst component-containing liquid containing a palladium compound. It is formed by making the metal component containing liquid containing copper contact the location where the said printing was performed, and depositing copper by the electroless-plating method.

  The surface mounting component 31 configured as described above can be soldered on the printed wiring board by using the pattern 35a as a soldering portion. The pattern 35b is used as an electric circuit. Such a surface mounting component 31 can be used as an inductor.

[Fifth Embodiment]
FIG. 5A is a perspective view of a surface mounting component exemplified as an embodiment of the present invention, and FIG. 5B is an exploded view showing a hierarchical structure of the surface mounting component.

The surface mounting component 41 includes a base body 43, patterns 45a, 45b, and 45c formed on the surface of the base body 43, and an insulating film 46 that covers the pattern 45b.
The substrate 43 is made of a material obtained by blending a silicon carbide filler that functions as a dielectric material based on a silicone elastomer.

  The patterns 45a, 45b, and 45c are formed of copper, and like the first embodiment, the substrate 45 is printed with a shape corresponding to the patterns 45a, 45b, and 45c using a catalyst component-containing liquid containing a palladium compound. In addition to being applied to the surface of 43, a metal component-containing liquid containing copper is brought into contact with the printed portion, and copper is deposited by an electroless plating method.

The insulating film 46 is formed by printing an insulating material, and the insulating film 46 prevents the pattern 45b and the printed wiring board from being in electrical contact.
In the surface mounting component 41 configured as described above, the pattern 45a is soldered on the printed wiring board, whereby the pattern 45b is used as an electric circuit.

  Further, the pattern 45c is soldered to a place having a ground potential on the printed wiring board. As a result, high-frequency noise flowing in the pattern 45b is dropped to the ground through the base body 43 that functions as a dielectric.

[Sixth Embodiment]
FIG. 6A is a perspective view of a surface mounting component exemplified as an embodiment of the present invention, and FIG. 6B is an explanatory view showing a usage state of the surface mounting component.

The surface mounting component 51 includes a base 53 and a pattern 55 formed on the surface of the base 53.
The base 53 is made of a material obtained by blending an alumina filler that functions as a heat conductive material based on an epoxy elastomer.

  The pattern 55 is formed of copper. Like the first embodiment, the pattern 55 is printed on the surface of the base 53 using a catalyst component-containing liquid containing a palladium compound, and the pattern 55 is printed. It is formed by bringing a metal component-containing liquid containing copper into contact with the printed portion and depositing copper by an electroless plating method.

  The surface mounting component 51 configured as described above is mounted on the printed wiring board 57 by soldering the pattern 55 to the metal portion 59 on the printed wiring board 57. Mounting on the printed wiring board 57 can be easily performed by an automatic mounting machine.

Then, after mounting the surface mounting component 51 on the printed wiring board 57, the IC 62 can be protected against heat by being crushed and sandwiched between the sheet metal 60 and the IC 62.
[Seventh Embodiment]
FIG. 7 is a perspective view of a surface mounting component exemplified as an embodiment of the present invention.

The surface mounting component 71 includes a base 73 and a pattern 75 formed on the surface of the base 73.
The base 73 is made of a material obtained by blending a silver filler that functions as a conductive material based on an epoxy elastomer.

  The pattern 75 is formed of copper. Like the first embodiment, the pattern 75 is printed on the surface of the substrate 73 with a shape corresponding to the pattern 75 using a catalyst component-containing liquid containing a palladium compound. It is formed by bringing a metal component-containing liquid containing copper into contact with the printed portion and depositing copper by an electroless plating method.

  The surface mounting component 71 configured as described above is mounted on the printed wiring board by soldering the pattern 75a on one side to a portion having a ground potential on the printed wiring board. Then, the printed wiring board is placed in the casing by bringing the pattern 75b on the other side into contact with the casing of the electronic device (not shown) and sandwiching the surface mounting component 71 between the casing and the printed wiring board. By fixing with, a portion having a ground potential on the printed wiring board and the housing can be electrically connected.

As in the seventh embodiment, the pattern 75 can be formed on both the front and back surfaces of the base 73.
[Eighth Embodiment]
In the first embodiment to the seventh embodiment, various specific examples are mainly shown with respect to the form and material of the surface mounting component. However, in the eighth embodiment and later described below, a metal pattern is used. Various specific examples of the forming procedure will be described. Note that the pattern formation procedure described in the eighth and subsequent embodiments can be used when manufacturing each of the surface mount components exemplified in the first to seventh embodiments.

  The pattern formation procedure described in the first embodiment employs a method in which an ultraviolet curable resin component is blended in the catalyst component-containing liquid and the pattern of the catalyst component is solidified by ultraviolet irradiation, but this will be described as an eighth embodiment. The pattern forming procedure employs a method in which the catalyst component-containing liquid is printed and then dried by an infrared heater or naturally dried. In the first embodiment, the method of immersing the catalyst component-containing liquid in the metal component-containing liquid after printing is employed. However, in the eighth embodiment, the components corresponding to the metal component-containing liquid are divided into three solutions. In this method, the metal component-containing liquid is generated on the substrate by printing them in layers. This will be described in detail below.

  First, in the eighth embodiment, as a catalyst component-containing liquid containing a palladium compound, a solution in which each substance was mixed at a blending ratio shown in Table 2 below was prepared.

上記表２中、酢酸パラジウムは、後の工程で金属を析出させるための触媒として機能する成分である。ジアセトンアルコールとメトキシプロパノールは、他の固形分とともに基体に付着した後、他の固形分を残して蒸発する揮発性の成分である。ポリビニルブチラールは、触媒成分の基体への密着性を高めるために配合されているもので、分子量１５０００〜２５０００程度のものが好適である。水酸化カリウムは、後述する還元剤を活性化させる塩基として機能する成分である。

In Table 2 above, palladium acetate is a component that functions as a catalyst for depositing metal in a later step. Diacetone alcohol and methoxypropanol are volatile components that adhere to the substrate together with other solids and then evaporate leaving other solids. Polyvinyl butyral is blended in order to increase the adhesion of the catalyst component to the substrate, and preferably has a molecular weight of about 15,000 to 25,000. Potassium hydroxide is a component that functions as a base that activates a reducing agent described later.

  Moreover, the solution AC shown in the following Table 3-Table 5 was prepared as what divided the component corresponded to a metal component containing liquid into three solutions.

以上のような用意を行った後、まず、上記表２に示した触媒成分含有液を、インクジェット方式のプリントヘッド（製品名：XJ128-200、イギリス・Xarr社）に注入し、基体の表面に印刷して試料を得た。プリントヘッドからは、８０ｐＬ（ピコリットル）の液滴を噴出、噴出周波数は１〜２ｋＨｚ、噴射距離は１〜２ｍｍとした。

After the preparation as described above, first, the catalyst component-containing liquid shown in Table 2 above is injected into an ink jet type print head (product name: XJ128-200, UK, Xarr) and applied to the surface of the substrate. A sample was obtained by printing. A droplet of 80 pL (picoliter) was ejected from the print head, the ejection frequency was 1 to 2 kHz, and the ejection distance was 1 to 2 mm.

  After printing on the substrate with the catalyst component-containing liquid, the printed catalyst component-containing liquid was dried using an infrared heater disposed in the vicinity of the substrate. In addition, when using an infrared heater, it can be dried in about 30 seconds. However, when it may take more time, it may be naturally dried without using an infrared heater.

  Next, using the solutions A to C shown in Tables 3 to 5, printing was performed on the printed catalyst component-containing liquid. Printing is performed using the same amount of the solutions A to C, and the solutions A to C are printed on top of each other, so that these solutions A to C are mixed on the substrate to form a metal component-containing liquid on the substrate. It was to so. The range in which the solutions A to C are printed may be the entire printable range, or may be selectively printed only for the range overlapping the printing with the catalyst component-containing liquid.

  Thereafter, by allowing it to stand for about 5 minutes, copper was deposited on the substrate, and a copper pattern could be formed. After the pattern was formed, the excess solution and dried salt were wiped off from the substrate or washed with water to obtain a surface mounting component in which the desired pattern was formed on the surface of the substrate.

Even by the procedure described above, a metal pattern with high adhesion can be formed on the surface of the substrate with high accuracy.
[Ninth Embodiment]
Next, another embodiment of the procedure for forming a metal pattern will be described.

  The pattern forming procedure described as the ninth embodiment is a method of generating a metal component-containing liquid on a substrate by dividing a component corresponding to the metal component-containing liquid into two solutions and printing them in layers. This is different from the eighth embodiment.

  More specifically, instead of the solutions A and B shown in Table 3 and Table 4 in the eighth embodiment, a solution AB shown in Table 6 below was prepared in the ninth embodiment.

そして、上記第８実施形態において溶液Ａ，Ｂを印刷していた工程に代えて、上記溶液ＡＢを印刷する工程を採用し、その他の工程はすべて上記第８実施形態と同じ工程として、基体の表面に所期のパターンが形成された表面実装用部品を得ることができた。このような手順でも、基体の表面に精度よく密着性の高い金属のパターンを形成することができる。

Then, instead of the steps of printing the solutions A and B in the eighth embodiment, a step of printing the solution AB is adopted, and all other steps are the same as those of the eighth embodiment. A surface mount component having the desired pattern formed on the surface was obtained. Even with such a procedure, a metal pattern having high adhesion can be formed on the surface of the substrate with high accuracy.

[Tenth embodiment]
Next, another embodiment of the procedure for forming a metal pattern will be described.
The pattern formation procedure described as the tenth embodiment is a method in which the component corresponding to the metal component-containing liquid is not divided into a plurality of solutions, and this is different from the eighth and ninth embodiments.

  More specifically, in the tenth embodiment, the solutions shown in Table 7 below were prepared as the metal component-containing liquid.

上記表７中、無電解銅めっき用溶液Ａ〜Ｃとしては、市販の無電解銅めっき用溶液３種（製品名：Enplate 872A、Enplate 872B、Enplate 872C、いずれもイギリス・Enthone-OMI社製）を使用した。エチレングリコールは、湿潤剤として配合されているものであり、表面張力を低下させる作用がある。また、ｔ−ブタノールは、表面張力を低下させ濡れ性を向上させる作用がある。Ｎ−オクチル−２−ピロリドン（製品名：Surfadone LP-100）も湿潤剤である。

In Table 7 above, as electroless copper plating solutions A to C, three types of commercially available electroless copper plating solutions (product names: Enplate 872A, Enplate 872B, Enplate 872C, all manufactured by Enthone-OMI, UK) It was used. Ethylene glycol is blended as a wetting agent and has the effect of reducing the surface tension. Moreover, t-butanol has the effect | action which reduces surface tension and improves wettability. N-octyl-2-pyrrolidone (product name: Surfadone LP-100) is also a wetting agent.

  And it replaced with the process which printed solution AC in the said 8th Embodiment, the process of printing the solution shown in the said Table 7 is employ | adopted, and all the other processes are the same processes as the said 8th Embodiment. As a result, it was possible to obtain a surface mounting component in which the desired pattern was formed on the surface of the substrate. Even with such a procedure, a metal pattern having high adhesion can be formed on the surface of the substrate with high accuracy.

[Eleventh embodiment]
Next, another embodiment of the procedure for forming a metal pattern will be described.
The eleventh embodiment is an embodiment showing another example of the catalyst component-containing liquid.

  More specifically, in the eleventh embodiment, the solutions shown in Table 8 below were prepared as the catalyst component-containing liquid.

上記表８中、ポリビニルピロリドンは、分子量６００００〜７００００程度のもの（製品名：Ｋ３０、International Specialty Products社製）を使用した。このような触媒成分含有液を使用し、他は上記第８実施形態〜上記第１０実施形態と同様の工程で処理を行っても、基体の表面に精度よく密着性の高い金属のパターンを形成することができる。

In Table 8 above, polyvinyl pyrrolidone having a molecular weight of about 60,000 to 70000 (product name: K30, manufactured by International Specialty Products) was used. Using such a catalyst component-containing liquid and forming a metal pattern with high adhesion on the surface of the substrate with high accuracy even if the other processes are performed in the same manner as in the eighth to tenth embodiments. can do.

[Modifications, etc.]
As mentioned above, although embodiment of this invention was described, this invention is not limited to said specific one Embodiment, In addition, it can implement with a various form.

  For example, in each of the above-described embodiments, when the surface of the substrate is printed with the catalyst component-containing liquid, there is no description that the pretreatment is particularly performed on the surface of the substrate, but the adhesion between the catalyst component and the substrate is improved. For this reason, in order to improve the adhesion between the finally formed metal pattern and the substrate, the substrate surface may be pretreated. Specific examples of such pretreatment include surface modification treatment such as corona discharge treatment, primer treatment, and silica film formation treatment.

  Moreover, in the said embodiment, although copper was mentioned as an example of the metal material utilized when performing electroless plating, if it is a metal material used with an electroless-plating method, it can utilize arbitrarily. Among them, examples of metals useful for providing a metal pattern in a surface mounting component include Sn, Au, and the like in addition to copper.

  Further, in the above-described embodiment, the catalyst component-containing liquid is attached only to the region corresponding to the pattern by printing the catalyst component-containing liquid by the ink jet method. However, other printing methods may be employed. Good.

  For example, when the catalyst component-containing liquid contains an ultraviolet curable resin component, the catalyst component-containing liquid is attached to the entire surface of the substrate in advance, and only the area corresponding to the pattern is irradiated with ultraviolet light. The catalyst component-containing liquid may be cured, and then the catalyst component-containing liquid may be washed away for uncured regions. Even with such a technique, printing with the catalyst component-containing liquid can be performed only on the region corresponding to the pattern.

The perspective view of the component for surface mounting illustrated in 1st Embodiment. The perspective view of the component for surface mounting illustrated in 2nd Embodiment. The components for surface mounting illustrated in 3rd Embodiment are shown, (a) is the perspective view, (b) is explanatory drawing which shows the use condition. The perspective view of the component for surface mounting illustrated in 4th Embodiment. The components for surface mounting illustrated in 5th Embodiment are shown, (a) is the perspective view, (b) is the exploded view which shows the hierarchical structure. The surface mounting components illustrated in 6th Embodiment are shown, (a) is the perspective view, (b) is explanatory drawing which shows the use condition. The perspective view of the component for surface mounting illustrated in 7th Embodiment.

Explanation of symbols

  1, 11, 21, 31, 41, 51, 71... Surface mounting parts, 3, 13, 23, 33, 43, 53, 73... Substrate, 5, 15, 25, 35a, 35b, 45a 45b, 45c, 55, 75, 75a, 75b ... pattern, 46 ... insulating film.

Claims (11)

A surface-mounting component in which a pattern formed of a metal material is provided on the surface of a substrate formed of an elastomer material,
The pattern is printed on the surface of the substrate using a catalyst component-containing liquid containing a catalyst component used for promoting the deposition of the metal material by an electroless plating method, and the printed portion The component for surface mounting is formed by bringing a metal component-containing liquid containing the metal material into contact therewith to deposit the metal material. The surface mounting component according to claim 1, wherein the catalyst component-containing liquid is printed on the surface of the substrate by an ink jet method. The metal component-containing liquid is brought into contact with the portion where the printing is performed by printing the metal component-containing liquid over the portion where the printing is performed by an inkjet method. The surface mounting component according to claim 1. The surface mount component according to any one of claims 1 to 3, wherein the metal material is Cu, Sn, or Au. The surface-mount component according to any one of claims 1 to 4, wherein the elastomer material is blended with a silicone elastomer or an epoxy elastomer as a base material. The surface-mount component according to claim 1, wherein the elastomer material is blended with a filler that functions as a conductive material. The surface-mount component according to any one of claims 1 to 6, wherein the elastomer material is blended with a filler that functions as a magnetic material. The component for surface mounting according to any one of claims 1 to 7, wherein the elastomer material is blended with a filler that functions as a dielectric material. The surface-mount component according to claim 1, wherein the elastomer material is blended with a filler that functions as a heat conductive material. The component for surface mounting according to any one of claims 1 to 9, wherein the catalyst component is a palladium compound. The catalyst component-containing liquid contains an ultraviolet curable resin component that cures when irradiated with ultraviolet rays,
After the pattern was printed on the surface of the substrate using the catalyst component-containing liquid, the liquid component was cured by irradiating ultraviolet rays to the portion where the printing was performed, and then the printing was performed. It is formed by making the metal component containing liquid containing the said metal material contact in the location. The surface mounting component in any one of Claims 1-10 characterized by the above-mentioned.

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