JP2008004282A - Plasma display device, and manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a PDP with excellent discharge characteristics and its manufacturing method with shortening of aging time attained and density of impurities in a discharging space restrained. <P>SOLUTION: The PDP is of a structure in which concave parts 16 are formed directly above a display electrode 6, selectively, on a dielectric protective film 8. Since, with this, after a front plate 2 and a back plate 9 are pasted together, the impurity gas flowing out from barrier ribs 13 or the like into a discharge space 15 is absorbed by a part 17 other than the concave part 16 in the dielectric protective film 8, that is, a part 17 where sputtering is not carried out, an impurity density in the discharge space 15 can be lowered. Further, a shape normally made by the aging or a change in a surface composition is preliminarily made as a result, so that drastic reduction of the aging time and running cost of the PDP is realized. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a plasma display panel (hereinafter abbreviated as PDP) and a method for manufacturing the same.

  Hereinafter, a conventional PDP will be described with reference to FIG.

  The PDP 21 includes a front plate 22 and a back plate 23.

  The front plate 22 includes a scan electrode 25 and a sustain electrode 26 provided on a front substrate 24, which are covered with a dielectric layer 27, and the dielectric layer 27 is a dielectric made of magnesium oxide (MgO). Covered with a protective film 28.

  In particular, the dielectric protective film 28 applies a voltage between predetermined electrodes in addition to the function of preventing the dielectric layer 27 and the electrodes 25 and 26 from being directly exposed to plasma and being damaged by ion collision. In this case, it has a function of emitting secondary electrons and supplying a fired electron for gas discharge, and a function of lowering a drive voltage by accumulating wall charges, which greatly affects the discharge characteristics of the PDP 21.

  The back plate 23 has address electrodes 30 formed on a back glass substrate 29, covered with a dielectric layer 31, and partition walls 32 formed so as to sandwich the address electrodes 30 on the dielectric layer 31. . A phosphor 33 is applied on the wall surface of the partition wall 32 and the dielectric layer 31.

  The front plate 22 and the back plate 23 are bonded together, and a cell separated by the partition walls 32 is filled with, for example, a mixed rare gas composed of Ne and Xe as a discharge gas (usually Xe gas). By appropriately controlling the voltage applied to the electrodes, a discharge is generated in the cell discharge space 34, plasma of rare gas ions is formed, and the phosphor 33 is excited by ultraviolet light emitted from the excited discharge gas. The visible light emitted from the phosphor 33 is transmitted through the front plate 22.

  In the conventional method for producing a PDP, after the front plate 22 and the back plate 23 are produced, they are laminated, sealed, exhausted, filled with gas, and sealed to form a panel.

  Since the panel manufactured in this manner has unstable discharge characteristics, an aging process is performed in which a voltage including an alternating rectangular wave component is applied at least between the scan electrode 25 and the sustain electrode 26.

  It is known that when the panel is cleaved after the panel aging treatment and the surface of the dielectric protective film 28 is observed, sputter marks are formed (see Patent Document 1). This sputter mark is formed by changing the surface composition and shape of the dielectric protective film due to the collision of ions in the plasma.

  From this, the impurity gas adsorbed on the surface of the dielectric protective film 28, the phosphor 33, etc. is removed by aging, and the shape of the dielectric protective film 28 is changed. It is thought to induce initial fluctuations in discharge characteristics.

  However, in such an aging treatment, it is necessary to continue discharging until the discharge characteristics of the panel are stabilized, which leads to a long aging time, which causes various power consumption, place, labor cost, etc. during PDP manufacturing. This leads to increased running costs. It is clear that these problems will become more serious as the PDP becomes larger and mass-produced.

In order to solve this long aging time, before the front plate and the back plate are bonded together, the entire front plate is treated with ion bombardment, etc. It is known to provide a portion (sputter mark) (see Patent Document 2).
JP 2004-273442 A JP 2002-117758 A

  In general, magnesium oxide (MgO) used as a dielectric protective film has a high adsorptive property and easily changes to magnesium hydroxide or magnesium carbonate by absorbing impurity gases such as water vapor and carbon dioxide. It is known to have

  When this dielectric protective film is sputtered, the sputtered part is filled with space due to redeposition of magnesium oxide (MgO), etc., and the surface area in contact with the gas is larger than the part not affected by sputtering. Since it decreases, it is considered that the probability of adsorption of impurity gas is reduced compared to the portion not affected by sputtering.

  For this reason, just by sputtering the entire surface of the dielectric protective film as in the method described in Patent Document 2 above, there is an advantage of shortening the aging time, but the sealing of the front plate and the rear plate is possible. After the deposition, the impurity gas adhering to the partition walls of the back plate is not sufficiently absorbed by the dielectric protective film 26 and flows into the discharge space. Therefore, it has a demerit that the discharge characteristics are deteriorated.

  An object of the present invention is to solve such a conventional problem, and to provide a PDP having a good discharge characteristic and a method for manufacturing the PDP by suppressing the impurity concentration in the discharge space while achieving a shortening of the aging time. And

  In order to solve the above-described problem, the PDP of the present invention includes a first substrate in which an electrode, a dielectric layer, and a dielectric protective film are sequentially stacked on a main surface, and a second substrate including the first substrate. A plasma display panel in which the main surface and the second substrate face each other with the discharge space facing each other, and the periphery of the first substrate and the second substrate is sealed. A recess is provided immediately above the electrode on the discharge space side of the film.

  The manufacturing method of the present invention includes a first substrate forming step of sequentially laminating an electrode, a dielectric layer, and a dielectric protective film on a main surface, and the dielectric protective film on the opposite side of the dielectric layer. A dielectric protective film processing step for etching the portion directly above the electrode; and a bonding step for bonding the first substrate and the second substrate facing each other through a discharge space after the dielectric protective film processing step. is doing.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of PDP which can reduce the impurity concentration in discharge space, and shortening of aging time can be provided.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The following embodiments of the present invention and the drawings are for illustrative purposes, and the present invention is not limited thereto. In the drawings, components having substantially the same function are denoted by the same reference numerals for convenience of explanation.

(Embodiment)
1. (PDP overall configuration)
FIG. 1 is a schematic diagram showing a PDP according to a first embodiment of the present invention. Prior to the description of each part of the PDP 1, an outline of the PDP 1 is shown.

  Here, the front plate 2 is provided on the glass substrate 3, and covers the display electrode pair 6 including the sustain electrode 4 and the scan electrode 5, and the glass substrate 3 and the display electrode pair 6. And a dielectric protective film 8 provided on the dielectric layer 7.

  The back plate 9 includes a glass substrate 10, a plurality of address electrodes 11 provided on the glass substrate 10, a dielectric layer 12 covering the glass substrate 10 and the address electrodes 11, and a region between adjacent address electrodes 11. The insulating barrier rib 13 extends in parallel with the address electrode 11, and the phosphor layer 14 is provided on the dielectric layer 12 along the side wall surface of the barrier rib 13.

  The front plate 2 and the back plate 9 having such a configuration are sealed with glass frits on the outer peripheral edge portions of both panels while facing the display electrode pair 6 and the address electrode 11 so that the longitudinal directions thereof are orthogonal to each other. . Between these plates, a discharge gas made of a rare gas component such as He, Xe, Ne or the like is sealed as a discharge space 15 at a predetermined pressure.

  Here, the dielectric protective film 8 has a configuration in which a concave portion 16 is selectively provided only above the display electrode pair 6 on the discharge space 15 side.

  With this configuration, after bonding the front plate 2 and the back plate 9, the impurity gas flowing out from the barrier ribs 13 and the like into the discharge space 15 is absorbed by portions other than the concave portion 16 in the dielectric protective film 8, that is, portions not sputtered. Therefore, the impurity concentration in the discharge space 15 can be reduced.

  Further, the step of forming the recess 16 only in the dielectric protective film 8 just above the display electrode pair 6 is performed before the front plate 2 and the back plate 9 are bonded (panelized). For this reason, the shape change of the dielectric protective film 8 conventionally performed during aging is caused before aging in advance, and the initial fluctuation of the panel is greatly reduced, and the aging time can be greatly shortened.

2. (Configuration of the dielectric protective film 8 according to the front plate 2)
Here, the configuration of the dielectric protective film 8 which is the main feature of the present invention will be described more specifically with reference to FIG.

  In the dielectric protective film 8 according to the present embodiment, the recess 16 is formed only on the display electrode pair 16. This is because, in the conventional aging process, the upper portion of the display electrode pair 6 in the dielectric protective film 8 is exposed to discharge during aging and is affected by sputtering, so that at least the portion is sputtered in advance. This is because the aging time can be significantly shortened by providing 16. In addition, in the dielectric protective film 8 according to the present embodiment, the dielectric protective film in the case where no etching is performed by etching the portion directly above the electrode pair 6 before the front plate 2 and the rear plate 9 are bonded together. In comparison, the area of the non-sputtered portion that easily adsorbs the gas can be reduced. Thereby, when the front plate 2 and the back plate 9 are bonded together, the impurity gas brought into the discharge space 15 while being adsorbed by the dielectric protective film 8 can be reduced.

  In the dielectric protective film 8, the shape of the portion 17 (non-etched portion) other than the concave portion 16 is left as it is. This is because the non-etched portion 17 has a larger surface area than the etched portion (recessed portion) 16 and the probability that the impurity gas is absorbed increases.

  Accordingly, the non-sputtered portion 17 that is more likely to cause gas adsorption than the etched portion (portion exposed to discharge) 16 serves as a kind of getter, and discharges from each portion of the back panel 9 after sealing. The impurity gas flowing out into the space 15 can be sufficiently absorbed. As a result, the discharge space 15 can be kept clean, and further improvement and stability of the discharge characteristics are expected.

  Further, the depth of the recess 16 is shallower than the thickness of the dielectric protective film 8. That is, it is preferable that the recess 16 does not penetrate the dielectric protective film 8. This is to prevent the display electrode pair 6 from being directly exposed to the plasma and being damaged by ion collision, thereby significantly reducing the panel life.

3. (Operation of PDP1)
The operation principle of the PDP 1 according to the present embodiment configured as described above will be described.

  When driving the PDP, the panel driver applies a pulse to the display electrode pair 6 and the address electrode 11 to perform a write discharge, and then applies a pulse to each pair of display electrode pairs 6. As a result, discharge is started in the gap between the display electrode pair 6 where address discharge has been performed. Then, a sustain discharge is made in the discharge space 15 and a screen display is performed.

4). (Production method)
[Front panel]
First, the manufacturing method of each part which concerns on the front plate 2 of PDP1 mentioned above is described.

On the glass substrate 3 of the front plate 2, the display electrode pairs 6 are arranged so as to extend in parallel. First, a transparent electrode film having a relatively high film thickness of about 1000 mm made of ITO, SnO ₂ , ZnO or the like is patterned on a glass substrate 3 in a stripe shape, for example, and a pair of transparent electrodes is formed in a wide parallel manner. Is placed. Next, in order to reduce the electrical resistance, bus electrodes having a film thickness of, for example, several μm are formed almost in parallel on the transparent electrodes by Ag (silver), Al (aluminum) -based electrode materials, etc., in parallel, respectively, The display electrode pair 6 is formed extending in the direction perpendicular to the paper surface.

The dielectric layer 7 is made of lead or non-lead low melting point glass or SiO ₂ material so as to cover at least a part of the display electrode pair 6 and the glass substrate 3 surface. Formed with. On the dielectric layer 7, the secondary electron emission coefficient γ is large so as to further lower the discharge start voltage, and the sputtering resistance is high so as to protect the dielectric layer 7 from ion bombardment during discharge, The dielectric protective film 8 is formed with a film thickness of several thousand mm by a metal oxide material such as MgO (magnesium oxide) which is optically transparent and has high electrical insulation.

(Formation of dielectric protective layer 8)
Before the front plate 2 of the PDP 1 manufactured as described above is bonded to the back plate 9 described below, a dielectric protective film 8 having a recess 16 provided immediately above the electrode pair 6 is formed.

  Hereinafter, the process of providing the recess 16 in the upper portion 6 of the electrode pair on the discharge space 15 side in the dielectric protective film 8 will be described with reference to FIG.

  First, the transparent electrode 18 is formed on the front substrate 2 (a). Next, the bus electrode 19 is formed on the transparent electrode 18 (b). A dielectric layer 7 is provided so as to cover the display electrode pair 6 thus formed, and a dielectric protective film layer 8 is formed on the dielectric layer 7 to form the front plate 2 (c).

  Next, on the front plate 2 formed by the above method, the mask 20 is applied to the dielectric protective film 8 except for the portion directly above the display electrode pair 6 (scanning electrode 4 and sustaining electrode 5), and ion sputtering is performed. Etching was performed only on the top of 6 (d).

  In addition, it is desirable to further include a step of removing scattered matters generated by etching before the front plate 2 and the back plate 9 are bonded together. Thereby, it is possible to reduce the scattered matter generated by the etching from being deposited on the phosphor layer 14, so that it is possible to prevent the absorption of ultraviolet rays, the decrease in transmittance, and the like, and to reduce the light emission efficiency and the luminance.

  Note that the step of removing the scattered matter by etching is realized by means such as shaking off, blowing off with air or the like, but is not limited to these means.

[Back plate 9]
Next, a method for manufacturing each part related to the back plate 9 of the PDP 1 will be described.

  On the surface of the glass substrate 10 on the back surface 9, address electrodes 11 are arranged in each discharge cell so as to intersect with the display electrode pair 6 extending on the front substrate 2 so as to be substantially orthogonal. In addition, as an electrode material of the address electrode 11, metals such as Ag, Al, Ni (nickel), Pt (platinum), Cr (chromium), Cu (copper), and Pd (palladium), carbides and nitrides of various metals are used. Materials such as conductive ceramics such as materials, combinations thereof, or laminated electrodes formed by laminating them can be used as necessary.

A dielectric layer 12 covering the address electrodes 11 and the glass substrate 10 is formed of lead-based or non-lead-based low-melting glass, SiO ₂ material, or the like.

  Next, on the surface of the dielectric layer 12, the partition walls 13 are formed and arranged in, for example, a cross-shaped pattern. The barrier ribs 13 are formed so that a low melting point glass material paste is applied on the dielectric layer 12 and baked, and then partitioning around the boundary with adjacent discharge cells (not shown), that is, a plurality of arrays of discharge cells. A cross-shaped pattern that divides rows and columns, and is formed into a rib shape using a method such as a sandblasting method or a photolithography method.

Then, the phosphor layer 14 is formed through a process of printing and applying phosphor material paste for each phosphor color on the back plate 9 in which the barrier ribs 13 are formed in a grid pattern, and firing. As each of the red, green, and blue light emitting phosphor layers 14, three color phosphors such as (Y, Gd) BO ₃ : Eu, Zn ₂ SiO ₄ : Mn, and BaMgAl ₁₀ O ₁₇ : Eu are used.

[PDP1]
The front plate 2 and the back plate 9 produced as described above are bonded together using sealing glass. The discharge space 15 partitioned by the partition walls 13 is exhausted to a high vacuum from an exhaust pipe attached to the back glass substrate 10 using the same sealing glass, and then a discharge gas having a predetermined composition is sealed at a predetermined pressure. To do.

  In addition, before bonding the front plate 2 and the back plate 9, the front plate 2 alone or in a state where the front plate 2 and the back plate 9 are separated by a certain distance, for example, above the softening point of the sealing glass It is preferable to remove impurities such as moisture adsorbed on the non-sputtered portion 17 of the dielectric protective layer 8 of the front plate 2 by heating to a temperature of. Thereby, it is possible to prevent the impurities from being brought into the discharge space 15 while being adsorbed by the dielectric protective film 8.

  In addition, the dielectric protective film 8 according to the present embodiment has a recess 16 immediately above the display electrode pair 6, and gas can be moved through the recess 16, so that the exhaust efficiency of this gas is improved. The removal efficiency of adsorbate can be improved. Therefore, the impurity concentration in the discharge space 15 can be further reduced.

(Example 1)
In order to verify the effect of shortening the aging time of the present invention, a PDP 1 formed with the dielectric protective film 8 based on the above embodiment is prepared, and the conventional PDP having the dielectric protective film 8 without the recess 16 is prepared. Compared with.

  FIG. 4 shows the change over time of the discharge voltage accompanying aging of the PDP according to the present embodiment and the comparative example. The vertical axis and horizontal axis of the graph indicate the discharge voltage and the aging time, respectively, and both axes are normalized by the values at the end of aging of the panel having no recess.

  As shown in FIG. 3, the aging time of the panel having the concave portion 16 immediately above the display electrode pair 6 of the dielectric protective film 8 of the front plate 2 is shortened to about 1/5 to 1/10 compared with a normal panel. You can see that It can also be seen that there is almost no difference with respect to the discharge voltage after reaching the steady state. From this, it can be said that the aging time is significantly shortened by forming the concave portion 16 immediately above the display electrode pair 6 of the dielectric protective film 8 of the front plate 2 before the front plate 2 and the back plate 9 are bonded together. .

  The plasma display device and the manufacturing method of the present invention are useful as a display device used for a television device and a computer display in a transportation facility, public facility, home, etc., a manufacturing method thereof, and the like.

Sectional drawing which shows typically PDP which concerns on embodiment of this invention Sectional drawing which shows typically the dielectric material protective film which concerns on embodiment of this invention Manufacturing process diagram of dielectric protective film of front plate according to the embodiment of the present invention The characteristic view which shows the investigation result of the aging time of PDP which concerns on embodiment of this invention Sectional drawing which shows the conventional PDP typically

Explanation of symbols

1 Plasma display panel (PDP)
2 Front plate 3 Glass substrate 4 Maintenance power 5 Scan electrode 6 Display electrode pair 7 Dielectric layer (front plate)
8 Dielectric protective film (MgO)
9 Back plate 10 Glass substrate 11 Address electrode 12 Dielectric layer (Back plate)
13 Partition 14 Phosphor Layer 15 Discharge Space 16 Recess 17 Non-Sputter Part 18 Transparent Electrode 19 Bus Electrode 20 Mask

Claims (6)

A first substrate in which an electrode, a dielectric layer, and a dielectric protective film are sequentially stacked on a main surface, and a second substrate, the main surface of the first substrate and the second substrate being disposed through a discharge space. It is a plasma display panel that is disposed to face each other in a face-to-face relationship and is sealed around the first substrate and the second substrate,
A plasma display panel, wherein a recess is provided immediately above the electrode on the discharge space side of the dielectric protective film. The plasma display panel according to claim 1, wherein a depth of the concave portion is smaller than a thickness of the dielectric protective film. A first substrate forming step of sequentially laminating an electrode, a dielectric layer, and a dielectric protective film on the main surface;
A dielectric protective film treatment step for etching the portion immediately above the electrode on the opposite side of the dielectric protective film from the dielectric layer;
A method for manufacturing a plasma display panel, comprising: a step of bonding the first substrate and the second substrate facing each other through a discharge space after the dielectric protective film processing step. The method for manufacturing a plasma display panel according to claim 3, wherein the dielectric protective film treatment step includes a step of removing scattered substances generated during the etching simultaneously with the etching or after the etching. 5. The method for manufacturing a plasma display panel according to claim 3, wherein the dielectric protective film treatment step includes a step of removing impurities attached to the dielectric protective film simultaneously with the etching or after the etching. . 6. The method for manufacturing a plasma display panel according to claim 3, wherein the etching step is performed by an ion sputtering method, a plasma method, or a sand blast method.

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