JP2008000941A - Inkjet recording head - Google Patents

Inkjet recording head Download PDF

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Publication number
JP2008000941A
JP2008000941A JP2006171159A JP2006171159A JP2008000941A JP 2008000941 A JP2008000941 A JP 2008000941A JP 2006171159 A JP2006171159 A JP 2006171159A JP 2006171159 A JP2006171159 A JP 2006171159A JP 2008000941 A JP2008000941 A JP 2008000941A
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Japan
Prior art keywords
region
plate
recording head
pressure chamber
body plate
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Pending
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JP2006171159A
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Japanese (ja)
Inventor
Nahomi Kubo
Yasuo Nishi
Hiroshi Oshitani
奈帆美 久保
宏史 押谷
泰男 西
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Konica Minolta Holdings Inc
コニカミノルタホールディングス株式会社
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Priority to JP2006171159A priority Critical patent/JP2008000941A/en
Publication of JP2008000941A publication Critical patent/JP2008000941A/en
Application status is Pending legal-status Critical

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Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem in an inkjet recording head which uses a deflection vibration mode, that is, the problem of deformation of the whole head or cross talk caused when a pressure chamber is driven, without raising costs. <P>SOLUTION: A reinforcing part is prepared at a surface of the opposite side to a surface opposed to a nozzle plate of a body plate, and in a second region which opens a first region where the pressure chambers and a partition wall separating the pressure chambers are arranged, and which surrounds the first region. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an ink jet recording head, and more particularly to a piezo ink jet recording head.

  Piezo-type ink jet recording heads include those that use the longitudinal vibration mode and those that use the flexural vibration mode. The latter allows the entire head to be thinned, and a thin film process is used in the head manufacturing process. It can be used in large numbers and is suitable for integration.

  However, in the latter ink jet recording head, there is a problem that deformation occurs in other than the driving pressure chamber at the time of recording operation, and in particular, when a large number of nozzles are driven simultaneously, crosstalk becomes remarkable.

For this,
・ Displacement loss of the pressure chamber occurs, driving efficiency decreases ・ Crosstalk occurs in which the volume of the adjacent pressure chamber that is not driven changes ・ Undesirable phenomena such as ink ejection characteristics change depending on the number of nozzles to be driven Occur.

  As a countermeasure against such a problem, Patent Document 1 proposes to provide a reinforcing member between the nozzle forming member and the pressure chamber forming member or on the nozzle forming member.

Further, Patent Document 2 proposes that a reinforcing member is formed at the time of processing the head substrate such as forming a pressure chamber, and a reinforcing member is provided on a partition wall that separates the pressure chamber.
JP-A-6-99785 JP 2002-11876 A

  In the case where a reinforcing member is provided between the nozzle forming member and the pressure chamber forming member as in Patent Document 1, the ink flow path becomes longer by the thickness of the reinforcing member. However, there is a problem that the driving efficiency is lowered and ink ejection characteristics are deteriorated, or the resonance frequency of the head is lowered to make it difficult to increase the printing speed.

  In addition, as in another example in Patent Document 1, in the case where a reinforcing member is provided on the nozzle plate, there is a problem in that the nozzle surface is uneven and it is difficult to clean the nozzle surface.

  As in Patent Document 2, there is a method of creating a head by performing all steps of head creation, such as formation of a pressure chamber and a common ink chamber, formation of a PZT layer, and formation of a nozzle, by patterning such as thin film formation and etching. However, there is another method in which a head substrate, a nozzle plate, a piezo element, and the like are separately formed, and these are bonded to create a head.

  The method of Patent Document 2 has an advantage that the manufacturing process and time can be shortened by partially incorporating thin film formation and etching, and the manufacturing cost is reduced as a whole.

  However, there is a problem that productivity is lowered due to the necessity of extremely high accuracy in processing of the reinforcing member, and costs are increased, and a variation in driving of the PZT actuator occurs due to variation in processing accuracy of the reinforcing member.

  An object of the present invention is to solve these problems in the prior art, and to provide an ink jet recording head that can be manufactured at low cost and does not cause problems such as crosstalk.

The object is achieved by the following invention.
1. Inkjet recording in which a plurality of pressure chambers arranged in parallel and a common ink chamber for supplying ink to the pressure chamber are formed by a body plate and a cover plate including a nozzle plate having a plurality of nozzles corresponding to the pressure chamber. In the head
The body plate has a first thickness in a first region including at least a region in which the plurality of pressure chambers are disposed and a region in which a partition that separates each of the pressure chambers is disposed, and the first region includes the first region. The surrounding second region has a second thickness that is greater than the first thickness, and the second thickness has a height difference on the surface of the body plate opposite to the side facing the cover plate. An ink jet recording head comprising a reinforcing portion formed by attaching a protrusion and protruding due to the height difference.
2. 2. The ink jet recording head according to 1, wherein the pressure chamber and the common ink chamber are formed by the body plate and the nozzle plate.
3. The cover plate has an intermediate glass plate interposed between the nozzle plate and the body plate, and the pressure chamber and the common ink chamber are formed by the intermediate glass plate and the body plate. 2. The ink jet recording head as described in 1 above.
4). The first region includes a region where the pressure chamber is disposed and a region where a partition partitioning each of the pressure chambers is disposed, and the second region includes a region where the common ink chamber is disposed. The inkjet recording head according to any one of 1 to 3 above.
5. The first region includes the region in which the pressure chamber is disposed, the region in which a partition wall separating each of the pressure chambers is disposed, and the region in which the common ink chamber is disposed. The inkjet recording head according to any one of the above.
6). 3. The ink jet recording head according to 2 above, wherein the body plate and the nozzle plate are joined by anodic bonding.
7). 4. The ink jet recording head according to item 3, wherein the intermediate glass plate is coupled to the body plate and the nozzle plate by anodic bonding.
8). 8. The ink jet recording head according to any one of 1 to 7, wherein the reinforcing portion has a thickness of 200 to 500 [mu] m.
9. 9. The ink jet recording head according to any one of 1 to 8, wherein the total thickness is 600 to 1000 μm.

  In the present invention, since the reinforcing portion is formed so as to open the entire region including the pressure chamber in which the wall is displaced during driving and the partition wall separating the pressure chamber, the ink jet recording head is reinforced, the manufacturing process and the manufacturing time The manufacturing cost can be reduced and the reinforcing member is provided on the surface of the body plate opposite to the nozzle plate, so that the ink ejection characteristics change and the high-speed performance can be improved by providing the reinforcing member. There is realized an ink jet recording head that is not lowered and that can always keep the ink ejection surface clean by cleaning.

  The present invention will be described below with reference to illustrated embodiments, but the present invention is not limited to these embodiments.

  FIG. 1 schematically shows an example of an ink jet recording head according to an embodiment of the present invention disassembled for each component. The ink jet recording head HD includes a nozzle plate 1, a body plate 2, and a piezoelectric element 3.

  A plurality of nozzles 101 for discharging ink are arranged on the nozzle plate 1.

  By covering the body plate 2 with the nozzle plate 1 and joining them, a pressure chamber groove 204 serving as a pressure chamber, an ink supply path groove 203 serving as an ink supply path, a common ink chamber groove 202 serving as a common ink chamber, In addition, an ink supply port 201 is formed.

  Then, the nozzle plate 1 and the body plate 2 are joined so that the nozzle 101 of the nozzle plate 1 and the pressure chamber groove 204 of the body plate 2 correspond one to one.

  Further, the piezoelectric element 3 is bonded to a position corresponding to each pressure chamber 204 on the surface opposite to the surface to be bonded to the nozzle plate 1 of the body plate 2. The piezoelectric element 3 is made of PZT and is an actuator that discharges ink from the nozzle 101.

  A reinforcing portion 205 (see FIGS. 2 and 3) is provided on the surface of the body plate 2 opposite to the surface on which the nozzle plate 1 is joined.

  In the following description, a chamber formed by the pressure chamber groove 204 and the nozzle plate 1 is referred to as a pressure chamber 204, and a chamber formed by the ink supply path groove 203 and the nozzle plate 1 is referred to as an ink supply path 203. In other words, a chamber formed by the common ink chamber groove 202 and the nozzle plate 1 is referred to as a common ink chamber 204.

  2 is a plan view of the ink jet recording head shown in FIG. 1, and FIG. 3 is a cross-sectional view taken along line X in FIG.

  As shown in FIG. 2, the reinforcing portion 205 is a second region surrounding the first region R <b> 1 including the region where the pressure chambers 204 and the piezoelectric elements 3 are disposed, and the region where the partition walls separating the individual pressure chambers 204 are disposed. It is formed in a frame shape so as to occupy R2.

  As shown in FIG. 3, the body plate 2 and the nozzle plate 1 are arranged in this order from the top, and the nozzle surface 1 a (lower surface) of the nozzle plate 1 from which ink droplets are ejected is formed in a flat surface. 2 is formed by making a height difference on the surface opposite to the surface facing the nozzle plate 1 and projecting by a height difference T2-T1 between the thickness T1 of the first region R1 and the thickness T2 of the second region R2. Is done.

  The thickness T2 of the reinforcing portion 205, that is, the difference T2-T1 between the thickness T2 of the second region R2 and the thickness T1 of the first region R1, is preferably about 200 to 500 μm.

  If the thickness is less than 200 μm, the reinforcing function is lowered, and there is a possibility that problems such as crosstalk, a decrease in driving efficiency, and difficulty in high-speed driving may occur.

  If it is thicker than 500 μm, it takes time for processing and productivity is lowered.

  The total head thickness T3 from the nozzle surface to the end surface of the reinforcing portion 205 is preferably about 600 to 1000 μm.

  FIG. 4 shows changes in the amount of deformation of the head when the thickness of the reinforcing portion is variously changed. In FIG. 4, the vertical axis indicates the amount of deformation of the head, that is, the amount of displacement of the nozzle surface, and is the amount of deformation when one channel is driven. The horizontal axis represents the thickness T2-T1 of the reinforcing portion 205 in FIG.

  As shown by the curve A, the deformation amount is reduced by increasing the thickness of the reinforcing portion 205, but it was confirmed from an actual printing test that a good image can be formed with the deformation amount being 21 nm or less. .

  Therefore, a good image can be formed by setting the thickness of the reinforcing portion 205 to 200 μm or more.

  Next, creation of the ink jet recording head HD will be described.

  The nozzle plate 1 is manufactured by using a silicon substrate having a thickness of about 150 μm to 500 μm as a base material, and using, for example, a known photolithography technique (resist application, exposure, development), an etching technique, and the like. It is performed by the procedure of forming. The hole diameter of the nozzle 101 is about φ1 μm to φ30 μm.

  The body plate 2 uses a silicon substrate having a thickness of about 200 to 500 μm as a base material, for example, a known photolithography technique (resist application, exposure, development), an etching technique, etc. Is used to form the pressure chamber grooves 204 that form a plurality of pressure chambers that communicate with the nozzles 101 of the nozzle plate 1 and the ink supply paths that communicate with the pressure chambers. An ink supply channel groove 203, a common ink chamber groove 202 serving as a common ink chamber communicating with the ink supply channel, an ink supply port 201, and a reinforcing portion 205 are formed.

  The size of the groove formed here may be determined appropriately depending on the application, the size and number of nozzles, and the like. In the recording head as an example of the present embodiment, for example, the pressure chamber groove 204 has a width of about 150 μm to 350 μm and a depth of about 50 μm to 200 μm, and the ink supply path groove 203 has a width of about 50 μm to 150 μm and a depth of about 30 μm to 150 μm. The common ink chamber groove is a through hole having a width of about 400 μm to 1000 μm, a depth of about 50 μm to 200 μm, and the ink supply port 201 having a diameter of about 400 μm to 1500 μm.

  The etching method for the silicon substrate is preferably a silicon (Si) anisotropic dry etching method that can perform etching processing perpendicularly to the surface of the body plate. Regarding the silicon (Si) anisotropic dry etching method, Sangyo Tosho Co., Ltd. “Semiconductor dry etching technology” can be referred to.

  Next, the nozzle plate 1 and the body plate 2 processed by the method described so far are bonded using an anodic bonding technique. This will be described below.

  FIG. 5 is a diagram showing a joining process between the nozzle plate 1 and the body plate 2. FIG. 5A shows a nozzle plate 1 in which nozzles (not shown) are processed using a silicon substrate as a base material. In addition, the body plate 2 in which the grooves such as the pressure chamber grooves 204 are formed by the processing described above is shown.

The nozzle plate 1 and the body plate 2 are joined by anodic bonding. When two substrates are bonded using an anodic bonding technique, silicon is used as a material constituting one of the substrates, and the other is silicon with a glass material containing mobile ions such as sodium ions (Na + ). It is preferable to use a material having a linear expansion coefficient relatively similar to (Si) (the linear expansion coefficient of silicon is about 4.2 × 10 −6 / ° C.), for example, borosilicate glass is used. .

Here, as borosilicate glass containing mobile ions (hereinafter referred to as borosilicate glass), Pyrex (registered trademark), Corning (USA) or Tempax Float (registered trademark), except for Japan, BOROFLOAT (registered trademark) ) And Shot Japan Co., Ltd. from the viewpoint of these linear expansion coefficients (both Pyrex (registered trademark) and Tempax Float (registered trademark) have a linear expansion coefficient of about 3.2 × 10 −6 / ° C.). More preferred.

  Further, since silicon can be finely processed more easily than borosilicate glass, a silicon substrate is used as a base material instead of borosilicate glass. Then, a borosilicate glass film is formed on the bonding surface of the silicon substrate as the base material to form a borosilicate glass surface. The film thickness in this case may be a film thickness that can be strongly bonded by anodic bonding, and is 0.5 μm from the viewpoint of the density and uniformity of the film and the heating and applied voltage of the bonding surface required during anodic bonding described later. A range of ˜3 μm is preferable, and a range of 1 μm to 2 μm is more preferable.

  Further, in this case, the borosilicate glass film may be formed by any one of a vacuum deposition method, a radio frequency (RF) magnetron sputtering method, and an ion plating method, and a substrate having a dense temperature can be easily formed at the time of film formation. It is preferable to heat so that it may become 250 degreeC or more. The upper limit of the temperature is not particularly defined, but is preferably about 400 ° C. from the viewpoint of a substrate mounting jig, a substrate temperature control device during film formation, and the like.

  In the recording head which is an example of the present embodiment, the nozzle plate 1 and the body plate 2 are both made of a silicon substrate for ease of fine processing. Therefore, it is necessary to make one of the joint surfaces of the nozzle plate 1 and the body plate 2 the surface of the borosilicate glass described above.

  If a borosilicate glass film is provided on the body plate 2 side, it is predicted that deformation due to deposition of the film will occur in the already formed fine shape due to the film thickness forming the surface of the borosilicate glass. Also, the bottom of the pressure chamber 204 is thickened by this film, so that the structure of the pressure chamber 204 itself is strengthened and distortion due to the piezoelectric element 3 cannot be sufficiently generated. As a result, ink cannot be discharged sufficiently or the piezoelectric element 3 There is a risk that a problem arises that the drive power must be increased.

  Therefore, the surface side of the nozzle plate 1 shown in FIG. 5B that covers the body plate is a borosilicate glass surface, and the nozzle plate 1 is a substrate, and the surface side of the substrate that covers the body plate is 0.5 μm to 3 μm. A borosilicate glass thick film 110 having a relatively thick film thickness in the range of is provided.

  Next, the nozzle plate 1 and the body plate 2 formed with the borosilicate glass film described above are overlapped and fixed in an appropriate positional relationship as shown in FIG. Is subjected to anodic bonding by applying a voltage using a DC high voltage power source 4. Below, it demonstrates concretely regarding anodic bonding of the nozzle plate 1 and the body plate 2. FIG.

  The polarity of the voltage applied in the case of anodic bonding is positive (+) on the silicon base material side and negative (-) on the borosilicate glass base material side. If it does in this way, an electric current will flow at the same time that a joining interface closely_contact | adheres by electrostatic attraction, and both board | substrates will be strongly anodically bonded.

  In the recording head which is an example of the present embodiment, it is only necessary to apply a voltage that is positive (+) for the body plate 2 and negative (−) for the nozzle plate 1 having the borosilicate glass thick film 110.

  The high temperature state at the time of joining is in a range of 300 ° C. to 550 ° C., and using a constant temperature bath capable of maintaining such an atmospheric temperature or a simple method using a hot plate having good insulation with a built-in ceramic heater or the like. What is necessary is just to heat the junction part of the nozzle plate 1 and the body plate 2.

  When joining is performed beyond the above temperature range, inconveniences such as inability to join or insufficient joining are likely to occur. For example, at 550 ° C. or more, although depending on the applied voltage, mobile ions may flow out at a stretch, resulting in deterioration such as the borosilicate glass film becoming cloudy or the film density becoming rough, and as a result, strong bonding may not be possible. is there. At 300 ° C. or lower, the movable ions are difficult to move, and in order to make it easier to move, it is necessary to increase the applied voltage. As a result of increasing the applied voltage, a short circuit occurs between the nozzle plate 1 and the body plate 2, and as a result, anodic bonding may not be sufficient.

  Further, the electric field strength of the DC voltage applied between the nozzle plate 1 and the body plate 2 by the DC high voltage power source 4 is preferably in the range of 30 kV / mm to 200 kV / mm. For example, if the thickness of the borosilicate glass is 0.5 μm, the applied voltage range is 15 to 100 V, and if it is 3 μm, it is 90 to 600 V.

  Normally, when a voltage exceeding 1 kV is used, it is necessary to ensure the capacity of the DC high-voltage power supply 4 that generates the voltage and the insulation withstand voltage of the auxiliary device related to voltage application. The device becomes expensive and cumbersome. Therefore, it is preferable to set the appropriate film thickness so that the voltage applied during anodic bonding is less than 1 kV, which is easy to handle.

  The piezoelectric element 3 is bonded to the joined body A of the nozzle plate 1 and the body plate 2 joined by anodic bonding in this way.

  FIG. 6 shows a process of bonding the piezoelectric element 3 made of PZT to the body plate 2.

  The piezoelectric element 3 is bonded to the body plate 2 by transfer bonding as described below.

  As shown in FIG. 6b, a dry film 33 is laminated on a glass plate 30 having a foam release sheet 31 and a PZT bulk plate 32 adhered in this order (shown in FIG. 6a), and foamed by a known photolithography technique. The release sheet 31, the PZT bulk plate 32, and the dry film 33 are patterned to form the piezoelectric element group 300 (FIG. 6c). After the surface of the piezoelectric element group 300 is sandblasted, the dry film 33 is peeled off (FIG. 6d).

  Next, the resin sheet 34 having the adhesive layer 35 is adhered to the piezoelectric element group 300 (FIGS. 6e and 6f), the resin sheet 34 is isolated (FIG. 6g), and the piezoelectric element group 300 is attached from the adhesive layer 35 side. It adheres to the body plate 2 held by the jig 40, and the glass plate 30 and the piezoelectric element group 300 are heated by a hot plate (FIG. 6h).

  By heating, the foam release sheet 31 is melted and removed, the glass plate 30 is separated from the body plate 2 and the piezoelectric element group 300, and an ink jet recording head is completed.

  FIG. 7 is a plan view of another example of the inkjet recording head HD according to the embodiment of the present invention.

  In this example, the reinforcing portion 205 is not formed in the first region R1 including the region where the plurality of pressure chambers 204 are disposed, the region where the partition walls separating the pressure chambers 204 are disposed, and the region of the common ink chamber 202. A second region R2 surrounding the first region is formed in a frame shape.

  As shown in FIG. 7, in this example, the area where the common ink chamber 202 is disposed is also opened. During the recording operation, flow path crosstalk occurs in which the pressure wave is transmitted to the non-driven pressure chamber via the common ink chamber 202. However, as in this example, the area where the common ink chamber is disposed is opened. Thus, the pressure wave in the common ink chamber can be absorbed by the vibration of the wall forming the common ink chamber, and the flow path crosstalk can be suppressed.

  FIG. 8 is a diagram schematically showing still another example of the ink jet recording head HD according to the embodiment of the present invention.

  In this example, an intermediate glass plate 5 is provided between the nozzle plate 1 and the body plate 2. The intermediate glass plate 5 has a nozzle 501 at a position corresponding to the nozzle 101.

As shown in FIG. 9, the nozzle 501 has a larger diameter than the nozzle 101 of the nozzle plate 1. The intermediate glass plate 5 is coupled to the body plate 2 and the nozzle plate 1 by anodic bonding. Therefore, borosilicate glass is preferable as the material of the intermediate glass plate 6.
10 and 11 show still another example of the ink jet recording head according to the embodiment of the present invention, in which the pressure chambers, the piezoelectric elements, and the nozzles are arranged in two rows.

  In FIG. 10, the piezoelectric element group 3A, the piezoelectric element group 3B, and the pressure chamber groups 204A and 204B are arranged in two upper and lower rows, and although not shown, nozzles corresponding to these are arranged. A common ink chamber 202A corresponding to the upper pressure chamber group 204A is disposed above the pressure chamber group 204a, and a corresponding common ink chamber 202B is disposed below the lower pressure chamber group 204B.

  The reinforcing portion 205 is formed in a frame shape that opens the region R1 including the pressure chamber groups 204A and 204B and the common ink chamber groups 202A and 202B and covers the region R2 surrounding the region R1.

  In FIG. 11, the arrangement of the pressure chamber group, the piezoelectric element group, and the nozzle group is the same as in FIG. 10, but the shape of the reinforcing portion 205 is different from that in FIG. 10, and the upper pressure chamber group 204 </ b> A and piezoelectric element group 3 </ b> A are A region R11 including the lower pressure chamber group 204B, and a region R12 including the piezoelectric element group 3B, a region R13 including the upper common ink chamber 202A, and a region R14 including the lower common ink chamber 202B. A reinforcing portion 205 is formed as a frame-like portion that covers the surrounding region. In the example of FIG. 11, the region R21 between the upper pressure chamber group 204A and the upper common ink chamber 202A, the upper pressure chamber group 204A and the piezoelectric element group 3A, and the lower pressure chamber group 204B and the piezoelectric element group 3B. And the region R23 between the lower pressure chamber group 204B and the lower common ink chamber 202B are regions covered by the reinforcing portion 205.

FIG. 2 is a diagram schematically illustrating an example of the ink jet recording head according to the embodiment of the present invention, disassembled for each component. It is a top view of the inkjet recording head shown in FIG. FIG. 3 is an enlarged sectional view taken along line X in FIG. FIG. 3 is an enlarged sectional view taken along line X in FIG. 2. It is a graph which shows the deformation | transformation of the head at the time of a head drive. It is a figure which shows the joining process of a nozzle plate and a body plate. It is a figure which shows the adhesion process of a piezoelectric element. It is a top view of other examples of ink jet recording head HD concerning an embodiment of the invention. It is a figure which shows typically the further another example of the inkjet recording head HD which concerns on embodiment of this invention. It is a figure which expands and shows the nozzle of embodiment shown in FIG. It is a figure which shows the further another example of the inkjet recording head which concerns on embodiment of this invention. It is a figure which shows the further another example of the inkjet recording head which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Nozzle plate 101 Nozzle 110 Borosilicate glass thick film 2 Body plate 201 Ink supply port 202 Common ink chamber 203 Ink supply path 204 Pressure chamber 205 Reinforcement part 3 Piezoelectric element 4 DC high voltage power supply 5 Intermediate glass plate

Claims (9)

  1. Inkjet recording in which a plurality of pressure chambers arranged in parallel and a common ink chamber for supplying ink to the pressure chamber are formed by a body plate and a cover plate including a nozzle plate having a plurality of nozzles corresponding to the pressure chamber. In the head
    The body plate has a first thickness in a first region including at least a region in which the plurality of pressure chambers are disposed and a region in which a partition that separates each of the pressure chambers is disposed, and the first region includes the first region. The surrounding second region has a second thickness that is greater than the first thickness, and the second thickness has a height difference on the surface of the body plate opposite to the side facing the cover plate. An ink jet recording head comprising a reinforcing portion formed by attaching a protrusion and protruding due to the height difference.
  2. 2. The ink jet recording head according to claim 1, wherein the pressure chamber and the common ink chamber are formed by the body plate and the nozzle plate.
  3. The cover plate has an intermediate glass plate interposed between the nozzle plate and the body plate, and the pressure chamber and the common ink chamber are formed by the intermediate glass plate and the body plate. The inkjet recording head according to claim 1, wherein
  4. The first region includes a region in which the pressure chamber is disposed and a region in which a partition that separates each of the pressure chambers is disposed, and the second region includes a region in which the common ink chamber is disposed. The inkjet recording head according to any one of claims 1 to 3, wherein
  5. The first region includes a region in which the pressure chamber is disposed, a region in which a partition partitioning each of the pressure chambers is disposed, and a region in which the common ink chamber is disposed. The inkjet recording head according to any one of the above.
  6. The ink jet recording head according to claim 2, wherein the body plate and the nozzle plate are joined by anodic bonding.
  7. 4. The ink jet recording head according to claim 3, wherein the intermediate glass plate is coupled to the body plate and the nozzle plate by anodic bonding.
  8. The ink jet recording head according to claim 1, wherein the reinforcing portion has a thickness of 200 to 500 μm.
  9. The inkjet recording head according to claim 1, wherein the total thickness is 600 to 1000 μm.
JP2006171159A 2006-06-21 2006-06-21 Inkjet recording head Pending JP2008000941A (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07101058A (en) * 1993-10-01 1995-04-18 Seiko Epson Corp Ink jet head
JP2003291346A (en) * 1995-11-24 2003-10-14 Seiko Epson Corp Ink jet printer head and its producing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07101058A (en) * 1993-10-01 1995-04-18 Seiko Epson Corp Ink jet head
JP2003291346A (en) * 1995-11-24 2003-10-14 Seiko Epson Corp Ink jet printer head and its producing method

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