JP2007513512A - ポリマー膜上にエレクトロニクス構成部品を分子架橋する方法 - Google Patents
ポリマー膜上にエレクトロニクス構成部品を分子架橋する方法 Download PDFInfo
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- JP2007513512A JP2007513512A JP2006541994A JP2006541994A JP2007513512A JP 2007513512 A JP2007513512 A JP 2007513512A JP 2006541994 A JP2006541994 A JP 2006541994A JP 2006541994 A JP2006541994 A JP 2006541994A JP 2007513512 A JP2007513512 A JP 2007513512A
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/07—Structure, shape, material or disposition of the bonding areas after the connecting process
- H01L2224/08—Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area
- H01L2224/081—Disposition
- H01L2224/0812—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/08135—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the bonding area connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/08145—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the bonding area connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/07—Structure, shape, material or disposition of the bonding areas after the connecting process
- H01L2224/08—Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area
- H01L2224/081—Disposition
- H01L2224/0812—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/08151—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the bonding area connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/08221—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the bonding area connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/08225—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the bonding area connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/80009—Pre-treatment of the bonding area
- H01L2224/8001—Cleaning the bonding area, e.g. oxide removal step, desmearing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/80009—Pre-treatment of the bonding area
- H01L2224/8001—Cleaning the bonding area, e.g. oxide removal step, desmearing
- H01L2224/80012—Mechanical cleaning, e.g. abrasion using hydro blasting, brushes, ultrasonic cleaning, dry ice blasting, gas-flow
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/808—Bonding techniques
- H01L2224/80894—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
- H01L2224/80896—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces between electrically insulating surfaces, e.g. oxide or nitride layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/80909—Post-treatment of the bonding area
- H01L2224/80948—Thermal treatments, e.g. annealing, controlled cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/07—Structure, shape, material or disposition of the bonding areas after the connecting process
- H01L24/08—Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
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- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Formation Of Insulating Films (AREA)
Abstract
Description
Claims (13)
- 第1エレクトロニクス集積素子上への第2エレクトロニクス集積素子の分子架橋方法であって、
前記第1エレクトロニクス集積素子の接触面は、前記第1エレクトロニクス集積素子の表面に含まれるポリマーを含み、
前記ポリマーの少なくとも一部は接合層で被覆され、
前記分子架橋は前記接合層と前記第2エレクトロニクス集積素子との間で起こる、
ことを特徴とする方法。 - 請求項1に記載の方法であって、前記第2エレクトロニクス集積素子の接触面及び/又は、前記接合層と同様の層による前記接触面の被覆のクリーニング工程を有する方法。
- 請求項1又は2に記載の方法であって、前記第2エレクトロニクス集積素子を前記接合層に接合した後、前記第2エレクトロニクス集積素子を薄くする工程を有する方法。
- 請求項1から3のうちのいずれか1つに記載の方法であって、接合後、前記2つの集積素子の集合体の加熱処理を有する方法。
- 請求項1から4のうちのいずれか1つに記載の方法であって、前記被覆は50nmから300nmの厚さを有する接合層の堆積によって作製されることを特徴とする方法。
- 請求項1から5のうちのいずれか1つに記載の方法であって、前記接合層の研磨を有する方法。
- 請求項1から6のうちのいずれか1つに記載の方法であって、前記接合層の活性化を有する方法。
- 請求項1から7のうちのいずれか1つに記載の方法であって、前記ポリマーを被覆する前に、前記ポリマーをクロスリンクする工程を有する方法。
- 前記請求項のうちのいずれか1つに記載の方法であって、前記接合層は酸化シリコンを有することを特徴とする方法。
- 積層されたエレクトロニクス集積素子のアレイを製造する方法であって、
第1エレクトロニクス集積素子が少なくとも部分的にポリマーから構成されるように、少なくとも前記第1エレクトロニクス集積素子を現像する工程、及び、
請求項1から9までのいずれか1つで定義された方法に従った、第2集積素子をこの面上で接合する工程、
を有する方法。 - 複数の界面層を有するエレクトロニクス集積素子の3次元アレイであって、各前記界面層は前記界面層のレベルで前記アレイの表面と少なくとも同じであり、その際前記界面層のうちの少なくとも一部はポリマーを少なくとも一のエレクトロニクス構成部品からポリマーを分離する、ことを特徴とするアレイ。
- 請求項11に記載のアレイであって、
2つのエレクトロニクス集積素子の積層で構成され、
各集積素子は前記隣接する他方の集積素子と同じ形状かつ/又はサイズを有し、
前記隣接する集積素子は界面層で隔離されている、
ことを特徴とするアレイ。 - 請求項11又は12のうちのいずれか1つに記載の方法であって、前記界面層は酸化シリコン、窒化シリコン及び/又はシリコン・オキシナイトライドを有することを特徴とするアレイ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0350999A FR2863405B1 (fr) | 2003-12-08 | 2003-12-08 | Collage moleculaire de composants microelectroniques sur un film polymere |
FR0350999 | 2003-12-08 | ||
PCT/FR2004/050656 WO2005057637A2 (fr) | 2003-12-08 | 2004-12-06 | Collage moleculaire de composants microelectroniques sur un film polymere |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012113656A Division JP2012178605A (ja) | 2003-12-08 | 2012-05-17 | ポリマー膜上にエレクトロニクス構成部品を分子接合する方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007513512A true JP2007513512A (ja) | 2007-05-24 |
JP5100123B2 JP5100123B2 (ja) | 2012-12-19 |
Family
ID=34586454
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Application Number | Title | Priority Date | Filing Date |
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JP2006541994A Active JP5100123B2 (ja) | 2003-12-08 | 2004-12-06 | ポリマー膜上にエレクトロニクス構成部品を分子接合する方法 |
JP2012113656A Withdrawn JP2012178605A (ja) | 2003-12-08 | 2012-05-17 | ポリマー膜上にエレクトロニクス構成部品を分子接合する方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012113656A Withdrawn JP2012178605A (ja) | 2003-12-08 | 2012-05-17 | ポリマー膜上にエレクトロニクス構成部品を分子接合する方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7476595B2 (ja) |
EP (1) | EP1692716B1 (ja) |
JP (2) | JP5100123B2 (ja) |
FR (1) | FR2863405B1 (ja) |
WO (1) | WO2005057637A2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060020415A1 (en) * | 2004-07-23 | 2006-01-26 | Hardwicke Canan U | Sensor and method for making same |
FR2895562B1 (fr) | 2005-12-27 | 2008-03-28 | Commissariat Energie Atomique | Procede de relaxation d'une couche mince contrainte |
FR2962594B1 (fr) * | 2010-07-07 | 2012-08-31 | Soitec Silicon On Insulator | Procede de collage par adhesion moleculaire avec compensation de desalignement radial |
FR2992465B1 (fr) * | 2012-06-22 | 2015-03-20 | Soitec Silicon On Insulator | Procede de fabrication collective de leds et structure pour la fabrication collective de leds |
FR3008190B1 (fr) | 2013-07-08 | 2015-08-07 | Commissariat Energie Atomique | Procede et dispositif de mesure d'un champ magnetique au moyen d'excitations synchronisees |
FR3088480B1 (fr) | 2018-11-09 | 2020-12-04 | Commissariat Energie Atomique | Procede de collage avec desorption stimulee electroniquement |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01229229A (ja) * | 1988-03-09 | 1989-09-12 | Seikosha Co Ltd | 非晶質シリコン薄膜トランジスタおよびその製造方法 |
JPH04132258A (ja) * | 1990-09-25 | 1992-05-06 | Nec Corp | 半導体基板の接続体およびその接続方法 |
JPH0818022A (ja) * | 1994-06-28 | 1996-01-19 | Seiko Instr Inc | 半導体装置 |
JP2002536843A (ja) * | 1999-02-10 | 2002-10-29 | コミツサリア タ レネルジー アトミーク | 内部応力制御のなされた多層構造体、およびその製造方法 |
JP2002351354A (ja) * | 2001-05-18 | 2002-12-06 | Internatl Business Mach Corp <Ibm> | 薄膜トランジスタ・アレイ基板、薄膜トランジスタ・アレイ基板の製造方法および表示装置 |
JP2003179216A (ja) * | 2002-10-18 | 2003-06-27 | Shin Etsu Handotai Co Ltd | Soiウエーハ |
JP2003523627A (ja) * | 2000-02-16 | 2003-08-05 | ジプトロニクス・インコーポレイテッド | 低温結合方法および結合構成物 |
JP2003234455A (ja) * | 2002-02-07 | 2003-08-22 | Matsushita Electric Ind Co Ltd | 電子デバイスの製造方法、電子デバイスおよび電子デバイス装置 |
Family Cites Families (9)
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NL8501773A (nl) * | 1985-06-20 | 1987-01-16 | Philips Nv | Werkwijze voor het vervaardigen van halfgeleiderinrichtingen. |
US5851927A (en) * | 1997-08-29 | 1998-12-22 | Motorola, Inc. | Method of forming a semiconductor device by DUV resist patterning |
JP4126747B2 (ja) * | 1998-02-27 | 2008-07-30 | セイコーエプソン株式会社 | 3次元デバイスの製造方法 |
FR2787919B1 (fr) * | 1998-12-23 | 2001-03-09 | Thomson Csf | Procede de realisation d'un substrat destine a faire croitre un compose nitrure |
FR2796491B1 (fr) | 1999-07-12 | 2001-08-31 | Commissariat Energie Atomique | Procede de decollement de deux elements et dispositif pour sa mise en oeuvre |
US6420262B1 (en) * | 2000-01-18 | 2002-07-16 | Micron Technology, Inc. | Structures and methods to enhance copper metallization |
US6645831B1 (en) * | 2002-05-07 | 2003-11-11 | Intel Corporation | Thermally stable crystalline defect-free germanium bonded to silicon and silicon dioxide |
US7015570B2 (en) * | 2002-12-09 | 2006-03-21 | International Business Machines Corp. | Electronic substrate with inboard terminal array, perimeter terminal array and exterior terminal array on a second surface and module and system including the substrate |
US7407863B2 (en) * | 2003-10-07 | 2008-08-05 | Board Of Trustees Of The University Of Illinois | Adhesive bonding with low temperature grown amorphous or polycrystalline compound semiconductors |
-
2003
- 2003-12-08 FR FR0350999A patent/FR2863405B1/fr not_active Expired - Fee Related
-
2004
- 2004-12-06 US US10/581,111 patent/US7476595B2/en active Active
- 2004-12-06 EP EP04816510.4A patent/EP1692716B1/fr active Active
- 2004-12-06 WO PCT/FR2004/050656 patent/WO2005057637A2/fr active Application Filing
- 2004-12-06 JP JP2006541994A patent/JP5100123B2/ja active Active
-
2012
- 2012-05-17 JP JP2012113656A patent/JP2012178605A/ja not_active Withdrawn
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01229229A (ja) * | 1988-03-09 | 1989-09-12 | Seikosha Co Ltd | 非晶質シリコン薄膜トランジスタおよびその製造方法 |
JPH04132258A (ja) * | 1990-09-25 | 1992-05-06 | Nec Corp | 半導体基板の接続体およびその接続方法 |
JPH0818022A (ja) * | 1994-06-28 | 1996-01-19 | Seiko Instr Inc | 半導体装置 |
JP2002536843A (ja) * | 1999-02-10 | 2002-10-29 | コミツサリア タ レネルジー アトミーク | 内部応力制御のなされた多層構造体、およびその製造方法 |
JP2003523627A (ja) * | 2000-02-16 | 2003-08-05 | ジプトロニクス・インコーポレイテッド | 低温結合方法および結合構成物 |
JP2002351354A (ja) * | 2001-05-18 | 2002-12-06 | Internatl Business Mach Corp <Ibm> | 薄膜トランジスタ・アレイ基板、薄膜トランジスタ・アレイ基板の製造方法および表示装置 |
JP2003234455A (ja) * | 2002-02-07 | 2003-08-22 | Matsushita Electric Ind Co Ltd | 電子デバイスの製造方法、電子デバイスおよび電子デバイス装置 |
JP2003179216A (ja) * | 2002-10-18 | 2003-06-27 | Shin Etsu Handotai Co Ltd | Soiウエーハ |
Also Published As
Publication number | Publication date |
---|---|
EP1692716A2 (fr) | 2006-08-23 |
US7476595B2 (en) | 2009-01-13 |
JP5100123B2 (ja) | 2012-12-19 |
FR2863405A1 (fr) | 2005-06-10 |
JP2012178605A (ja) | 2012-09-13 |
EP1692716B1 (fr) | 2019-11-20 |
US20070117258A1 (en) | 2007-05-24 |
WO2005057637A2 (fr) | 2005-06-23 |
FR2863405B1 (fr) | 2006-02-03 |
WO2005057637A3 (fr) | 2006-03-30 |
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