JP2007285643A - Cooling panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substantially uniform temperature throughout a whole panel area by suppressing uneven temperature through out a whole area of a cooling panel. <P>SOLUTION: In the cooling panel 1, heat absorbing plates 2 having passages for passing a heating medium are numerously arranged in a vertical direction. It is characterized by that a heat absorbing plate group 3 comprised of the arranged numerous heat absorbing plates 2 has a first passage 7 for carrying the heating medium from an arranged direction one side of the heat absorbing plates 2 to another side while carrying the heating medium in the vertical direction of the heat absorbing plates 2, and a second passage 8 for carrying the heating medium from the arranged direction other side of the heat absorbing plates 2 to the one side while carrying the heating medium in the vertical direction of the heat absorbing plates 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cooling panel used for radiation cooling, and more particularly to a cooling panel having a flow path for flowing a heat medium.

  Conventionally, in a cooling panel used for radiant cooling, the panel itself is cooled by a heat medium flowing in the panel, and cooling is performed by radiant heat from the cooled panel surface. For example, Japanese Patent Application Laid-Open No. 10-325570 (hereinafter referred to as Patent Document 1) discloses a cooling / heating device having a heat radiation absorbing mechanism and a fan surrounded by a casing having an opening. It is disclosed that the heat radiation absorption mechanism in this air conditioning / heating device has a configuration in which several heat medium pipes through which a heat medium passes are arranged in parallel, and these pipes are connected in series by a U-shaped tube.

  However, in the technique described in Patent Document 1, a large temperature difference may occur in the heat medium between the most upstream side and the most downstream side of the heat medium flow path in which the heat medium pipe and the U-shaped tube are connected in series. There is. For this reason, it is difficult to make the temperature of the heat medium substantially uniform throughout the heat radiation absorption mechanism including the heat medium pipes arranged side by side.

  On the other hand, Japanese Patent Application Laid-Open No. 10-220672 (hereinafter referred to as Patent Document 2) discloses a technique related to a floor heating radiator that connects heat medium flow paths in parallel. Specifically, there is disclosed a branch block having a plurality of forward flow passage ports and a plurality of return flow passage ports, to which end portions of heat medium tubes arranged meandering inside the floor heating radiator are connected. The purpose of this branch block is to prevent a temperature difference of the heat medium from occurring between the first forward flow path port and the last return flow path port in the branch block. That is, in the branch block described in Patent Document 1, the forward flow path connecting one forward flow path opening and the next forward flow path opening, and the return flow path connecting one return flow path opening and the next return flow path opening. The three-dimensional intersection is made in an X shape within the branch block.

JP-A-10-325570 JP-A-10-220672

  According to the branch block described in Patent Document 2, theoretically, the temperature difference of the heat medium between the first forward flow path port and the last return flow path port becomes small. However, depending on the arrangement of the heat medium tube connected to each flow path port of the branch block, there is a possibility that a temperature difference occurs in the heat medium on the floor surface of the floor heating radiator. For example, when a four-piece / four-piece combination block illustrated in the same manner is used for the heat radiating plate in which four heating medium tubes shown in Patent Document 2 are arranged, the floor surface of the heat radiating plate In this case, a temperature difference of the heat medium occurs. Specifically, on the floor surface of the heat sink, the heat medium tube on the right floor surface is located downstream of each heat medium tube on the left floor surface with the branch block as a boundary. A temperature difference occurs in the heat medium. For this reason, even if the temperature difference of the heat medium between the first forward flow path port and the last return flow path port can be reduced, it is difficult to make the temperature (heat radiation amount) almost uniform across the floor surface of the heat sink. is there.

  Accordingly, an object of the present invention is to suppress temperature unevenness in the entire area of the cooling panel composed of a plurality of heat absorbing plates having a heat medium flow path so that a substantially uniform temperature can be obtained over the entire area of the panel.

  In order to achieve the above object, a typical configuration of the present invention is a cooling panel in which a large number of heat absorbing plates each having a flow path for flowing a heat medium are arranged in parallel in the vertical direction. A first flow path for flowing a heat medium from one side to the other side of the endothermic plate while flowing the heat medium in a vertical direction of the heat end plate, the heat end plate group including a plurality of endothermic plates; And a second flow path for allowing the heat medium to flow from one side to the other side in the arrangement direction of the heat absorption plates while flowing the heat medium in the vertical direction of the heat absorption plate.

  Further, in addition to the above configuration, each of the flow paths is preferably a flow path that is connected in series so that the heat medium flows in the arrangement direction of the heat absorption plates while flowing in the vertical direction of the heat absorption plates.

  Further, in addition to the above-described configuration, it is preferable that the plurality of heat absorption plates have adjacent ones of the first flow channel and the second flow channel. It is preferable that the heat absorption plate having the first flow path and the heat absorption plate having the second flow path are alternately arranged in the arrangement direction.

  Alternatively, in addition to the above configuration, each of the plurality of heat absorbing plates preferably includes the first flow path and the second flow path.

  Further, in addition to the above configuration, each of the flow paths is preferably formed by one resin pipe. For example, the pipe is preferably a pipe made of a crosslinked polyolefin resin having a metal reinforcing layer.

  Moreover, in addition to the said structure, it is preferable that the said piping is 8 mm or less in internal diameter. Moreover, it is preferable to have a plurality of heat absorbing plate groups each having the first flow path and the second flow path. Moreover, it is preferable that one end part of the said 1st flow path and the said 2nd flow path is connected, or it is formed with one piping.

  In addition to the above configuration, the outer surface of the heat absorbing plate is provided with a large number of fins with cross-sectional protrusions continuous in the vertical direction, and the structure of the top end of the protrusions of the fins generates condensed water in the form of water droplets. The top is easy to fall without getting fat.

  Specifically, the condensed water is generated in the form of water droplets, and the generated water droplets are easy to fall off without thickening. The structure of the top of the protrusion tip of the fin is the width of the protrusion tip top of the fin of 1.5 mm. That's it. Furthermore, the width of the top end of the protrusion of the fin is 6.0 mm or less. The endothermic plate is preferably an extruded product of a conductive light metal. Further, in addition to the above configuration, the heat absorbing plate is preferably an integrally molded product.

  Moreover, in addition to the said structure, it is preferable that the external shape of the said heat absorption board is a taper shape whose horizontal cross-sectional shape is flat, and an edge part is thinner than a center part.

  Further, in addition to the above configuration, the heat absorption plate includes a hollow member in which a large number of fins are provided on the outer surface in the vertical direction, and a guide member that guides and supports the pipe in the hollow member, and the heat absorption plate As for the external shape, the horizontal cross-sectional shape is flat, and it is preferable that the edge part of the said hollow member is a taper shape thinner than the said guide member part.

  According to the present invention, the first flow path for flowing the heat medium from one side to the other side in the arrangement direction of the heat absorption plates while flowing the heat medium in the vertical direction of the heat absorption plates, and the flow of the heat medium in the vertical direction as well. Due to the second flow path through which the heat medium flows from the other side in the arrangement direction to the one side, temperature unevenness can be suppressed over the entire cooling panel, and a substantially uniform temperature can be obtained over the entire panel. Thereby, the cooling effect by radiation can be always maintained in a high state over the entire cooling panel.

  Furthermore, the cooling panel can increase the amount of heat absorption per unit area viewed from above in the vertical direction by arranging a large number of heat absorbing plates having heat medium flow paths in the vertical direction, further improving the cooling effect by the radiation. Can be increased.

  Moreover, by making each said flow path into the flow path connected in series, even if air may accumulate in a flow path, the air in this flow path can be extruded reliably. For this reason, the flow rate of the heat medium in the flow path can be kept constant, and the endothermic failure due to the decrease in flow rate can be prevented. In addition, since a header necessary for parallel connection is not required, the configuration can be simplified, and the weight and cost can be reduced.

  Further, the adjacent heat absorption plate has one of the first flow channel and the second flow channel, and further, the heat absorption plate having the first flow channel and the second flow channel. By adopting a configuration in which the endothermic plates having the above are arranged alternately in the arrangement direction, temperature unevenness can be further suppressed over the entire cooling panel, and a substantially uniform temperature can be obtained over the entire panel. Thereby, the cooling effect by radiation can be maintained in a higher state over the entire cooling panel.

  Alternatively, even if each of the plurality of heat absorbing plates has the first flow path and the second flow path, similarly, temperature unevenness can be further suppressed in the entire cooling panel, and substantially uniform over the entire panel. Temperature is obtained. Thereby, the cooling effect by radiation can be maintained in a higher state over the entire cooling panel.

  In addition, by forming each flow path with a single resin pipe, each pipe has good flexibility and can be bent to a small radius, making it easy to work on the pipe and assemble the pipe to the heat absorbing plate. . Moreover, since it is not necessary to connect the pipes between the respective heat absorbing plates, the work of assembling the pipes is further facilitated and the cost can be reduced. Further, the width of the heat absorbing plate can be reduced. Alternatively, by using a pipe made of a crosslinked polyolefin resin having a metal reinforcing layer as the pipe, in addition to the effects described above, the pipe is not only easily processed but also maintained in a processed state such as bending. Therefore, workability is further improved. Moreover, the strength can be further increased by metal reinforcement. In addition, since the metal layer is provided, the thermal conductivity and resistance can be further increased, and the tube can be thinned by increasing the strength by reinforcing the metal, and as a result, the heat conduction is further improved.

  Further, by setting the inner diameter of the pipe to 8 mm or less, it is possible to further reduce the width of the heat absorbing plate, and it is possible to arrange more heat absorbing plates in the installation space of the cooling panel. Thereby, the heat absorption amount of the cooling panel with respect to the installation space can be increased, and the cooling effect by the radiation can be further increased.

  Moreover, the cooling panel can suppress temperature nonuniformity for every heat absorption board group by having two or more heat absorption board groups which have the said 1st flow path and the said 2nd flow path. Therefore, temperature unevenness can be further suppressed over the entire area of the cooling panel, and a substantially uniform temperature can be obtained over the entire panel. Thereby, the cooling effect by radiation can be maintained in a higher state over the entire cooling panel.

  In addition, by connecting one end of the first flow path and the second flow path or by forming a single pipe, the configuration can be further simplified, and the work of assembling the pipe Furthermore, it becomes easy, and weight reduction and cost reduction can also be achieved.

  Furthermore, in the present invention, a large number of fins are provided to increase the surface area of the heat absorbing plate. Common sense is that fins are as high and thin as possible and sometimes blown to increase the endothermic effect. On the other hand, in the present invention, not only a large number of fins are provided in order to increase the surface area of the heat absorbing plate, but also the structure of the top of the protrusion tip of the fin is generated in the form of water droplets and the generated water droplets. The top is easy to fall without getting fat. Specifically, the width of the top of the protrusion tip of the fin is 1.5 mm or more, and further, the width of the top of the protrusion tip of the fin is 6.0 mm or less. As a result, condensation (drop-like condensation) is likely to occur at the top of the tip of the projection of the fin, and the condensation is likely to grow, and water droplets grown by the condensation are likely to be dripped by its own weight. That is, the time during which water droplets are attached to the top of the projection tip of the fin is short. That is, the tip of the tip of the fin protrusion is always kept in a state having a temperature difference from room temperature at which condensation easily occurs, and in addition to the effect of the above-described configuration, the cooling effect by radiation can be maintained in a high state, and The dehumidifying effect can also be enhanced.

  Moreover, by making the heat-absorbing plate an extruded product of a conductive light metal such as aluminum, it can be provided at a low cost with good thermal conductivity, light weight and good handling properties. Moreover, it is possible to provide a cooling device integrated with a building element such as a partition.

  In addition, efficient cooling and heating / cooling is possible by combining the cooling panel as described above with a geothermal heating / cooling system such as a heat pump system that uses geothermal heat (in summer, direct circulation of the heat medium from the ground is also possible) It is.

  Moreover, in addition to the said structure, the external shape of the said heat absorption board is made into the taper shape whose horizontal cross-sectional shape is flat, and an edge part is thinner than a center part. Specifically, for example, the heat absorption plate includes a hollow member in which a large number of fins are provided on the outer surface in the vertical direction, and a guide member that guides and supports the pipe in the hollow member. As for the external shape, the horizontal cross-sectional shape is flat, and the end of the hollow member has a tapered shape that is narrower than the guide member portion. Thereby, further weight reduction can be achieved while ensuring the strength. In particular, by forming a part or all of the hollow member and the guide member of the heat-absorbing plate by integral molding by extrusion, the hollow member is integrated without being divided, and the guide member becomes a reinforcing material. Increases strength. By increasing the strength by this integral molding, the hollow member and the guide member can be thinned. As a result, the heat conduction efficiency is improved and the weight can be further reduced. Furthermore, by making the end of the hollow member into a tapered shape, the design is enhanced, and the appearance can be improved as an interior of a part of a room or an ornament.

  Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings.

[First Embodiment]
The cooling panel composed of a large number of heat absorbing plates according to the first embodiment will be described in detail with reference to FIGS. FIG. 1 is a schematic configuration diagram of a cooling panel including a plurality of heat absorbing plates according to the first embodiment of the present invention.

  As shown in FIG. 1, the cooling panel 1 according to the present embodiment includes a large number of heat absorbing plates 2 having a flow path for allowing a heat medium to flow in the vertical direction. Here, as the endothermic plate 2, a configuration in which twelve endothermic plates 2a1 to 2a6 and 2b1 to 2b6 are arranged in the vertical direction is illustrated, but the number and arrangement of the endothermic plates may be appropriately set according to the application. Well, it is not limited to the configuration described above.

  The cooling panel 1 has a plurality of endothermic plate groups 3 including the plurality of endothermic plates 2 arranged side by side. Here, the cooling panel 1 having two endothermic plate groups 3A and 3B is illustrated as the endothermic plate group 3, but the number of the endothermic plate groups and the number of endothermic plates constituting one group are limited to this. What is necessary is just to set suitably according to a use.

  Each of the endothermic plate groups 3A and 3B includes a first flow path 7 for flowing a heat medium from one side to the other side in the arrangement direction of the endothermic plates 2 while flowing a heat medium in the vertical direction of the heat endothermic plate 2. And a second flow path 8 for allowing the heat medium to flow from the other side to the one side in the arrangement direction of the heat absorption plate 2 while flowing the heat medium in the vertical direction of the heat absorption plate 2.

  Further, the large number of heat absorbing plates 2 constituting each of the heat absorbing plate groups 3 has a configuration in which the adjacent heat absorbing plate has one of the first flow path 7 and the second flow path 8. ing. Here, as shown in FIG. 1, the heat absorption plates 2a1 to 2a6 having the first flow path 7 and the heat absorption plates 2b1 to 2b6 having the second flow path 8 are alternately arranged in the arrangement direction. It has become.

  Further, each of the flow paths 7 and 8 is a flow path connected in series so that the heat medium flows in the vertical direction of the heat absorption plate 2 and flows in the direction in which the heat absorption plates 2 are arranged.

  Further, the first flow path 7 and the second flow path 8 described above are each formed by one resin pipe 9a, 9b. Further, the pipe as the flow path has an inner diameter of 8 mm or less. In the following description, the first flow path 7 is referred to as a first pipe 9a, and the second flow path 8 is referred to as a second pipe 9b.

  Here, the heat absorbing plate constituting the cooling panel according to the present embodiment will be described in detail with reference to FIGS. 2 and 3. 2 and 3 are explanatory views of a heat absorbing plate constituting the cooling panel according to the first embodiment of the present invention. FIG. 2 is a sectional view of the heat absorbing plate. 3, (a) is an AA cross-sectional view of the endothermic plate, (b) is a side view of the endothermic plate, and (c) is an end front view of the endothermic plate.

  The heat absorbing plates 2a1 to 2a6 and 2b1 to 2b6 shown in FIG. 1 have different configurations in that they have either one of the pipes 9a and 9b forming the flow paths 7 and 8, but the other configurations are the same. Therefore, in FIG. 2 and FIG. 3, each of the heat absorbing plates 2 a 1 to 2 a 6 and 2 b 1 to 2 b 6 will be described as the heat absorbing plate 2, and the piping 9 a and 9 b that each of the heat absorbing plates has will be described as the piping 9.

  As shown in FIGS. 2 and 3, the heat absorbing plate 2 has a pipe 9 for circulating a heat medium therein. In the present embodiment, as described above, resin piping is used. By using the resin pipe in this way, the flexibility is good, the pipe can be bent to a small radius, and the processing of the pipe and the work of assembling the pipe to the heat absorption plate are facilitated. In addition, the pipes can be easily connected. Further, the width of the heat absorbing plate can be reduced.

  Furthermore, by using a resin pipe as the pipe 9, it is possible to process the pipe 9 flat in the thickness direction of the heat absorbing plate 2 so as not to impair the circulation of the heat medium in the pipe 9. is there. In this case, since the pipe 9 is processed flat in the thickness direction of the endothermic plate 2, not only can the thickness of the endothermic plate 2 be reduced, but also the contact area between the endothermic plate 2 and the pipe 9 can be increased, and thermal conductivity can be increased. Can be improved.

  The piping as the flow path for flowing the heat medium is not limited to the above-mentioned resin piping, and is appropriately used in consideration of thermal conductivity and resistance, and ease of processing and assembly work. It ’s fine. For example, a metal pipe or a resin pipe or a crosslinked polyolefin resin pipe having a metal reinforcing layer such as a metal reinforced polyethylene pipe may be used. In particular, when a crosslinked polyolefin resin tube having a metal reinforcing layer is used, in addition to the above-described effects, not only the processing of the piping is easy, but also the processing state such as bending can be maintained. Workability is further improved. Moreover, the strength can be further increased by metal reinforcement. In addition, since the metal layer is provided, the thermal conductivity and resistance can be further increased, and the tube can be thinned by increasing the strength by reinforcing the metal, and as a result, the heat conduction is further improved.

  As shown in FIGS. 2 and 3, the heat absorbing plate 2 includes a hollow member 6 provided with fins 5 to be described later on the outer surface, and a guide member that guides and supports the pipe 9 within the hollow member 6. A support part 4 is provided. In the heat absorbing plate 2 according to the present embodiment, the hollow member 6 and the support portion 4 are integrally formed.

  Further, the heat absorbing plate 2 is formed in a tapered shape whose outer cross section is flat in horizontal cross section and whose end portion 6a is thinner than the central portion 6b. Specifically, for example, as shown in FIG. 2, the end 6 a of the hollow member 6 is formed in a tapered shape that is narrower than the guide member portion 6 c provided with the support portion 4.

  The support portion 4 includes a first guide portion 4a formed integrally with the hollow member 6 and a second guide portion 4b detachably attached to the hollow member 6 so that the pipe 9 can be easily assembled. Consists of. In order to increase the rigidity of the hollow member 6, the first guide portion 4 a is integrally formed from one inner wall surface facing the other inside the hollow member 6 to the other inner wall surface. Although the second guide portion 4b is also detachable, the second guide portion 4b is guided and supported by one inner wall surface and the other inner wall surface facing each other in the hollow member 6 in order to contribute to increasing the rigidity of the hollow member 6. It is configured to be.

  The pipe 9 is inserted and supported in the support portion 4. The entire outer peripheral surface of the pipe 2 is in thermal contact with the peripheral surface of the support portion 4 in the heat absorbing plate 3 and has a good thermal conductivity.

  Although not shown, the pipe is assembled by being bent in a U shape in the lower part of the heat absorbing plate in order to circulate the heat medium. For this reason, the guide part corresponding to the inner side of the pipe 9 in the heat absorbing plate 2 in the support part 4 that supports the pipe 9 is a detachable second guide part 4b. Thereby, in order to circulate the heat medium in the heat absorbing plate 2, the pipe 9 bent in a U shape below the heat absorbing plate 2 can be easily covered in the heat absorbing plate 2. Here, if the entire support portion 4 is integrally formed with the hollow member 6, in order to cover the U-shaped bent portion of the pipe 9 in the heat absorption plate 2, the heat absorption plate 2 is formed and then the heat absorption plate 2. 2 must be cut off at a portion corresponding to the bent portion of the pipe 9 in the support portion 4 in the inside. According to the present embodiment, the above-described processing after the heat absorbing plate 2 is molded becomes unnecessary, and the assembly work of the pipe 9 into the heat absorbing plate 2 is facilitated.

  Further, as shown in FIGS. 2 and 3, the heat absorbing plate 2 is provided with a large number of fins 5 having cross-sectional protrusions extending in the vertical direction on the outer surface of the hollow member 6. And the structure of the protrusion tip top part of the said fin 5 is made into the structure where dew condensation water generate | occur | produces in the shape of a water droplet, and the top part is easy to fall, without the generated water droplet becoming fat. That is, the width w of the top end of the protrusion of the fin 5 is set to a width at which condensed water is likely to grow and water droplets grown with the condensed water are likely to be dripped by its own weight.

  In the structure of the tip of the projection of the fin 5, the generation of condensed water in the form of water droplets means that moisture (water vapor) in the air condenses on the panel surface (cooling surface) of the cooling panel as described above. In the steam condensation, a drop-like condensation is generated in which the liquid phase formed by the condensation has a drop-like shape. Also, the generated water droplets do not become thick, and the water droplets generated by the progress of the droplet condensation efficiently drop (drop) as the contact angle with the cooling surface increases. This means that the water droplets do not grow so large that the contact angle cannot be maintained.

  Specifically, the width w of the protrusion tip apex of the fin 5 is the structure of the protrusion tip apex of the fin 5 in which the condensed water is generated in the form of water droplets and the generated water droplets are easy to fall without getting thick. It is 1.5 mm or more. Furthermore, it is preferable that the width w of the top end of the protrusion of the fin 5 is 2.0 mm or more. In addition, the width w of the tip end of the protrusion of the fin 5 is preferably 6.0 mm or less, and more preferably 4.0 mm or less. In addition, the grounds that the width w of the top end of the protrusion of the fin 5 is preferably set to 2.0 mm to 4.0 mm will be described using experiments and results described later.

  In addition, the heat absorbing plate 3 in the present embodiment is an integrally molded product from the viewpoint of increasing the strength and reducing the weight, but the heat absorbing plate 3 is made of a conductive material such as aluminum in consideration of good thermal conductivity and dropping efficiency. It is preferably an extruded product of a porous light metal. As a result, the strength can be increased, the thermal conductivity is good, the weight is low, the handling property is good, and the cost can be further reduced. Moreover, the hollow member 6 and the support part 4 can be made thin by the strength improvement by integral molding, As a result, heat conduction efficiency improves and the further weight reduction can also be achieved. Moreover, it is possible to provide a cooling device integrated with a building element such as a partition. Furthermore, since the end portion of the endothermic plate has a tapered shape as described above, the design is enhanced, and the appearance can be improved as an interior of a part of a room or an ornament. In addition, although aluminum was illustrated here as an electroconductive light metal, this invention is not limited to this.

  In the heat absorbing plate 3 in the present embodiment, the fins 5 are provided in the hollow member 6, but the fins 5 are not provided in a part of the end 6 a and a part of the central part 6 b. By not providing the fin 5 at a part of the end portion 6a, the design effect is further enhanced, and the visual effect of making the heat absorbing plate 3 thinner and thinner can be obtained. The reason why the fins 5 are not provided in a part of the central portion 6b is to make it easy to connect the endothermic plates 3 with each other when the endothermic plates 3 are arranged in parallel to form a cooling panel.

  Here, with reference to FIG.4 and FIG.5, the structure of the protrusion tip top part of the said fin 5 is demonstrated in detail using an Example and a comparative example.

  Using the heat-absorbing plate 10 according to the example shown in FIG. 4A and the heat-absorbing plate 20 as a comparative example shown in FIG. . Specifically, water drops dripped at the lower part of each heat absorbing plate were stored, and the amount of stored water was measured.

  As shown in FIGS. 4 (a) and 4 (b), both heat absorbing plates 10 and 20 were obtained by attaching channel shape members 12 and 22 to each other at pitch intervals on aluminum plate members 11 and 21 of the same size. Further, the heat absorbing plates 10 and 20 were bonded with a hygroscopic material except for the effective dew condensation portion. Further, the joints between the aluminum plate members 11 and 21 and the channel members 12 and 22 are in close contact with each other.

As shown in FIG. 4A, the heat absorbing plate 10 according to the embodiment has a length l from one end to the other end of the plurality of fins 12a by the channel member 12 of 92 mm, and the height of each fin 12a. The length h is 20 mm, the interval t between the fins 12a is 16 mm, and the width w of the top end of the protrusion of the fin 12a is 2 mm. The effective dew condensation surface area of the heat absorbing plate 10 according to this embodiment is 0.4203 m ² .

On the other hand, the heat absorbing plate 20 as a comparative example has a length l from one end to the other end of the plurality of fins 22a by the channel shape member 99 of 99 mm, the height h of each fin 22a is 20 mm, and the fins 22a The interval t is 13 mm, and the width w of the top end of the protrusion of the fin 22a is 1 mm. The effective dew condensation surface area of the heat absorbing plate 20 according to this comparative example is 0.55725 m ² .

  The experimental method is to install the above-mentioned heat absorbing plates 10 and 20 in order in the simple thermal insulation test apparatus 30 shown in FIG. 4 (c), and measure the amount of water that has been dripped and stored in the condensation-generating atmosphere under the same conditions. . In the test apparatus, one chamber is a low temperature chamber 32 and the other chamber is a high temperature chamber 33 partitioned by a partition wall 31 to which the heat absorbing plates 10 and 20 are attached. The heat absorbing plates 10 and 20 are attached to the partition wall 31 so that the surface on which the fins are provided faces the high temperature chamber 33 side.

  The environment setting conditions of the test apparatus 30 are as follows: the temperature on the low temperature side is 0 ° C., the temperature on the high temperature side (condensation generation side) is 30 ° C., the humidity is 70%, and humidification is performed for 3 hours. Went.

  As a result of the above-described experiment, the amount of water stored in the heat sink plate 10 according to the example was 100.3 g, and the amount of water stored in the heat sink plate 20 according to the comparative example was 79.8 g. From this result, the example in which the width w of the tip end of the projection of the fin is 2 mm has a higher dehumidifying effect than the comparative example in which the width w is 1 mm, although the effective dew condensation surface area is small (water storage It was found that the amount was large).

  As a method of growth of condensation, it grows from the top of the tip of the fin protrusion and starts to flow down. Therefore, in the embodiment in which the width w of the tip end of the fin is 2 mm, the width w is thicker than the comparative example in which the width w is 1 mm, and the cooled tip end of the fin touches the air containing moisture. It is thought that the growth of condensation is further promoted because the area increases.

  In addition, it seems that it is effective to increase the surface area (effective condensation surface area) in contact with moisture-containing air theoretically. However, in the above experimental results, the width of the top of the tip of the fin protrusion is considered to be effective. In the example where w is 2 mm, the amount of stored water was larger in spite of the smaller effective condensation surface area than in the comparative example where the same width w was 1 mm. It can be seen that the thickness of 2 mm or more is effective as a structure in which dew condensation water is generated in the form of water droplets and the top is easily dropped without the generated water droplets becoming thick.

  In addition, the dew condensation state of each heat sink plate 10 and 20 at the time of the above-mentioned experiment is shown in FIG. Fig.5 (a) is a figure which shows the dew condensation condition of the heat sink plate 10 which concerns on an Example, FIG.5 (b) is a figure which shows the dew condensation condition of the heat sink plate 20 which concerns on a comparative example. The heat absorption plate 10 according to the embodiment shown in FIG. 5A is condensed at the top end of the protrusion of the fin 12a by the channel shape member 12 than the heat absorption plate 20 according to the comparative example shown in FIG. It can be seen that there are few water droplets and the amount of flow at the top of the fin tip is large.

  Further, here, as a cooling panel comprising a plurality of heat absorbing plates having a heat medium flow path, the above-described cooling panel having a plurality of flow paths (Example) and a cooling panel having a single flow path (Comparative Example) ) And the temperature change of the endothermic plate in each cooling panel was compared. FIG. 6 is a diagram showing a temperature change of the heat absorbing plate in the cooling panel according to the example, and FIG. 7 is a diagram showing a temperature change of the heat absorbing plate in the cooling panel according to the comparative example.

  As the cooling panel according to the embodiment, 12 heat absorption plates are arranged in parallel, and the first flow path 7 and the second flow path 8 connected in series are alternately arranged on the adjacent heat absorption plates. Was used. On the other hand, in the comparative example, although twelve endothermic plates are arranged side by side, the U-shaped pipes in each endothermic plate are arranged so that the heat medium flows only from one side to the other side in the direction in which the endothermic plates are arranged. A cooling panel having flow paths connected in parallel by a header was used. Moreover, the heat absorption plate of the structure shown in FIG.2 and FIG.3 was used for the heat absorption plate of each cooling panel. And the temperature change of the same position in each cooling panel was measured in the state which maintained the flow volume of the heat medium at about 1.0 l / min in the environment which kept room temperature at about 22 degreeC. The temperature detection position in each cooling panel detected the inlet temperature and outlet temperature of the piping with respect to the cooling panel, and the temperature of the three endothermic plates. The positions of the three endothermic plates are the same in both the example and the comparative example. The first sheet (left end) and the sixth sheet (center) from the left side, which is the inlet (outward) side of the pipe in the direction of arrangement of the endothermic plates. The temperature of each endothermic plate on the 12th sheet (right end) was detected. 6 and 7, the line Li is the inlet temperature, and the line Lo is the outlet temperature. The line Ll is the temperature of the left end heat absorption plate, the line Lc is the temperature of the center heat absorption plate, and the line Lr is the temperature of the right end heat absorption plate. Line Lg is the globe temperature. The glove temperature is a temperature measured using a virtual black body sphere (glove) used to measure the radiation temperature. Here, the diameter was 15 cm, and the surface was measured with a thermometer placed at the center of a black matte hollow copper sphere. The experiment was performed under the same conditions in both the examples and the comparative examples except for the above-described conditions, such as the interval between the heat absorbing plates and other environmental conditions.

  As shown in FIG. 6, in the cooling panel according to the example, the detected temperatures of the three endothermic plates all change so as to cross within a range of about ± 0.5 ° C. around about 36 ° C. On the other hand, in the cooling panel according to the comparative example, as shown in FIG. 7, the detected temperatures of the left end heat absorption plate and the center endothermic plate near the inlet side of the heat medium are ± 1.0 centering on about 35 ° C. Although the temperature has changed in the range of about ℃, the right end heat absorption plate near the outlet side of the heat medium has moved in the range of about ± 1.0 ℃ centered around about 34 ℃, The change in the detected temperature of the position does not cross and keeps a constant temperature difference. From this result, in the cooling panel according to the example, due to the action of the first flow path and the second flow path, the temperature unevenness is suppressed at each detection position of the heat absorption plate, and the temperature is substantially uniform throughout the panel (absorption of heat). It can be seen that the amount of heat is. On the other hand, in the cooling panel according to the comparative example, it is understood that the temperature of the heat absorption plate on the downstream side in the flow direction of the heat medium is lower than the temperature on the upstream side, and temperature unevenness occurs in the entire panel. .

  As described above, according to the present embodiment, the vertical flow path is similar to the first flow path 7 in which the heat medium flows from one side to the other side of the heat absorption plate while flowing the heat medium in the vertical direction of the heat absorption plate. Due to the action of the second flow path 8 for flowing the heat medium from the other side to the one side in the arrangement direction while flowing the heat medium in the direction, temperature unevenness can be suppressed in the entire cooling panel, and substantially uniform over the entire panel. A temperature is obtained. Thereby, the cooling effect by radiation can always be maintained in a high state over the entire cooling panel.

  Further, since the cooling panel 1 includes a large number of heat absorbing plates 2 having a heat medium flow path arranged in the vertical direction, the amount of heat absorbed per unit area as viewed from above in the vertical direction can be increased. The effect can be further increased.

  Moreover, even if air may accumulate in the flow paths 7 and 8 by making each flow path 7 and 8 into the flow path connected in series, the air in the flow paths 7 and 8 is kept. It can be pushed out reliably. For this reason, the flow rate of the heat medium in the flow paths 7 and 8 can be kept constant, and the endothermic failure due to the decrease in the flow rate can be prevented. In addition, since a header necessary for parallel connection is not required, the configuration can be simplified, and the weight and cost can be reduced.

  Adjacent endothermic plates have either one of the first channel 7 or the second channel 8, and further the endothermic plates 2a1-2a6 having the first channel 7; By arranging the heat absorbing plates 2b1 to 2b6 having the second flow path 8 alternately in the arrangement direction, temperature unevenness can be further suppressed over the entire cooling panel, and a substantially uniform temperature can be obtained over the entire panel. It is done. Thereby, the cooling effect by radiation can be maintained in a higher state over the entire cooling panel.

  Further, by forming each of the flow paths 7 and 8 with a single resin pipe 9a and 9b, it has good flexibility and can be bent to a small radius. Assembly work is easy. Moreover, since it is not necessary to connect the pipes between the respective heat absorbing plates, the work of assembling the pipes is further facilitated and the cost can be reduced. Further, the width of the heat absorbing plate can be reduced. Alternatively, by using a pipe made of a crosslinked polyolefin resin having a metal reinforcing layer as the pipe, in addition to the effects described above, the pipe is not only easily processed but also maintained in a processed state such as bending. Therefore, workability is further improved. Moreover, the strength can be further increased by metal reinforcement. In addition, since the metal layer is provided, the thermal conductivity and resistance can be further increased, and the tube can be thinned by increasing the strength by reinforcing the metal, and as a result, the heat conduction is further improved.

  In addition, by setting the inner diameter of the pipe 9 to 8 mm or less, the width of the heat absorbing plate 2 can be further reduced, and more heat absorbing plates 2 can be arranged in the installation space of the cooling panel 1. It becomes. Thereby, the heat absorption amount of the cooling panel with respect to the installation space can be increased, and the cooling effect by the radiation can be further increased.

  Moreover, the cooling panel 1 can suppress temperature nonuniformity for every heat absorption board group by having two or more the heat absorption board groups 3 which have the said 1st flow path 7 and the said 2nd flow path 8. FIG. Therefore, temperature unevenness can be further suppressed over the entire area of the cooling panel, and a substantially uniform temperature can be obtained over the entire panel. Thereby, the cooling effect by radiation can be maintained in a higher state over the entire cooling panel.

  Further, in the present embodiment, as described above, a large number of fins 5 are provided in order to increase the surface area of the heat absorbing plate 2. Common sense is that fins are as high and thin as possible and sometimes blown to increase the endothermic effect. On the other hand, in this embodiment, not only a large number of fins 5 are provided in order to increase the surface area (effective dew condensation surface area) of the heat absorbing plate 2, but also the structure of the top end of the protrusion of the fin 5 It has a structure that is generated in the form of water droplets and is easy to fall without causing the generated water droplets to thicken. Specifically, the width of the top end of the protrusion of the fin 5 is set to 1.5 mm or more, and the width of the top end of the protrusion of the fin 5 is set to 6.0 mm or less. As a result, condensation (drop-like condensation) is likely to occur at the top of the protrusion tip of the fin 5, and the condensation is likely to grow, and water droplets grown by the condensation are likely to be dripped by its own weight. That is, the time during which water droplets are attached to the top of the protrusion tip of the fin 5 is short. In other words, the top of the protrusion tip of the fin 5 is always kept in a state having a temperature difference from room temperature at which condensation easily occurs, and the dehumidifying effect is high, as can be seen from the fact that the amount of stored water is large. Furthermore, as can be seen from the fact that the top of the protrusion tip of the fin 5 is kept in a state having a temperature difference from room temperature, this cooling panel is further combined with the effect of the flow path configuration described above to further increase the cooling effect by radiation. Therefore, the dehumidifying effect can be enhanced.

  Further, as described above, the heat absorbing plate 2 constituting the cooling panel 1 is configured to include the hollow member 6 and the support portion 4 described above, and the end portion 6 a of the hollow member 6 is provided with the support portion 4. The taper shape is thinner than the member portion 6c. Thereby, not only the above-described effects can be obtained, but also the weight can be further reduced while securing the strength. In particular, by using the heat absorbing plate 3 as an integrally formed extrusion product, the strength can be further increased. Furthermore, the hollow member 6 and the support part 4 can be made thin by strength improvement by integral molding, and as a result, further weight reduction can be achieved. Furthermore, by making the end 6a of the hollow member 6 into a tapered shape, the design is enhanced, and the appearance can be improved as an interior of a part of a room or an ornament.

  In addition, the suitable application example of the cooling panel in this embodiment connects the piping for the heat medium circulation of a cooling panel with the piping which passes the part where the underground temperature of 3-5 m or less underground is constant, and is heated with a circulation pump. It is to make a very simple cooling device that only circulates water as a medium.

[Second Embodiment]
In the above-described embodiment, as shown in FIGS. 2 and 3, the endothermic plate 2 constituting the cooling panel 1 is tapered such that the end portion 6 a of the hollow member 6 is thinner than the guide member portion 6 c provided with the support portion 4. Although the shape is adopted, the shape and configuration of the heat absorbing plate are not limited to this.

  FIG. 8 is an explanatory diagram of a cooling panel according to the second embodiment, in which (a) is a cross-sectional view of a heat absorbing plate constituting the cooling panel, and (b) is a schematic perspective view showing one configuration example of the cooling panel. In the present embodiment, members having the same functions as those of the above-described embodiments are denoted by the same reference numerals.

  As shown in FIG. 8B, the cooling panel 1 according to this embodiment is also configured by arranging a large number of heat absorbing plates 3 in parallel in the vertical direction, as in the above-described embodiment. FIG. 8B illustrates a configuration in which each heat absorption plate is arranged so as to be orthogonal to the cooling panel direction (the arrangement direction of the many heat absorption plates) as a cooling panel including a plurality of heat absorption plates. However, the present invention is not limited to this. For example, the flow of wind passing between the heat absorption plates may be changed by changing the angle of the heat absorption plates with respect to the cooling panel direction.

  As shown in FIG. 8 (a), the heat absorbing plate 2 constituting the cooling panel 1 has the pipe 9 that forms the first flow path 7 or the second flow path described above. In the present embodiment, a copper pipe is used as the pipe 9, but this pipe is not limited to this, and may be appropriately used in consideration of thermal conductivity and resistance, such as the resin pipe and the stainless pipe described above. .

  Moreover, unlike the taper shape of embodiment mentioned above, the heat absorption board 2 which concerns on this embodiment becomes a plate-shaped shape which has the substantially uniform width | variety according to the diameter of the piping distribute | arranged inside. Further, the support portion 4 as a guide member for guiding and supporting the pipe 9 is integrally formed in a hollow member 6 provided with fins 5 on the outer surface. The entire outer peripheral surface of the pipe 9 is bonded to the peripheral surface of the support portion 4 in the heat absorbing plate 2 and thermally coupled thereto, and has a configuration with better thermal conductivity.

  Since other configurations are the same as those of the above-described embodiment, the description thereof is used, and detailed description thereof is omitted here.

  Even if the heat absorbing plate is used, substantially the same effect as that of the above-described embodiment can be obtained. In addition, according to this embodiment, the metal pipe 9 is used, and the entire outer peripheral surface of the pipe 9 is thermally bonded to the peripheral surface of the support portion 4 in the heat absorbing plate 2. The structure has better thermal conductivity.

[Other Embodiments]
The cooling panel using the above-described heat absorbing plate can be used as a cooling device using a refrigerant or a heat exchanger used in a cooling device such as a cooler. Moreover, it can also be used as a heating device by replacing the heat medium circulating in the piping with a heated heat medium from a cooled heat medium.

  Also, in the underground heat utilization cooling and heating system equipped with a heat medium circulation pipe buried in the ground, a heat exchange unit having a heat pump, etc., the dehumidifying function is achieved by using the cooling panel using the above-described heat absorbing plate. It is possible to use as an air conditioning apparatus provided with.

  2. Description of the Related Art As a cooling / heating device using a geothermal heating / cooling system, a configuration in which a radiation-type floor heating panel used only for heating and a fan coil unit used for cooling / heating are used in combination is known. However, in a cooling device (fan coil unit) having a blowing function, for example, when it is hot immediately after returning home, the blowing of cool air is comfortable, but once it cools down, the blowing may change and become uncomfortable. On the other hand, since the radiant cooling device (cooling panel) does not blow air, the comfort of cold air can be maintained for a long time. Although it is possible to use it as a cooling device by circulating a chilled heat medium through the radiant floor heating panel, the floor heating panel is a device that is directly touched by humans. A technique for controlling the operation so as not to cause the above-mentioned condensation by sensing the temperature is required, which is more expensive than the cooling panel according to the present embodiment.

  For this reason, it is possible to use not only comfort but also 24 hours in terms of cost by combining the above-described cooling panel 1 with an underground heating / cooling system without using a floor heating panel and a fan coil unit. Comfortable air conditioning is possible.

  When the cooling panel is used as a heating device, the heat medium is circulated through a heat exchange unit. When the cooling panel is used as a cooling device (or a dehumidifying device), the heat medium is circulated through a heat exchange unit. Alternatively, the heat medium may be directly circulated from a pipe buried in the ground. Here, when the cooling panel is used for heating, compared to the floor heating panel provided on the floor where a predetermined strength is required, the cooling panel can be exposed indoors, so the temperature of the circulating heat medium is Lower than floor heating panel. For this reason, even if it is a radiation type | system | group apparatus using geothermal similarly, the operation cost of the cooling panel is cheaper.

  In the above-described embodiment, the outer shape of the heat absorbing plate is configured such that the horizontal cross-sectional shape is flat and the end portion is a tapered shape that is thinner than the central portion, as shown in FIG. Although a substantially elliptical shape in which two arcs face each other is illustrated, the present invention is not limited to this.

  In the above-described embodiment, the heat absorbing plate is exemplified as a guide member (support portion) for guiding and supporting the pipe, but the guide member having a configuration covering the entire outer peripheral surface of the pipe is not limited thereto. Any other guide member may be used as long as the pipe is guided and supported in the hollow member. That is, the guide member can guide and support the pipe so that the pipe through which the heat medium circulates in the hollow member of the heat absorption plate does not break and the hollow member and the pipe are always in contact (or pressure contact). If it is provided in.

  Further, the number of pipes included in the heat absorbing plate is appropriately set as necessary, and is not limited to the above-described form.

  In the above-described embodiment, the heat absorption plate having the first flow path and the heat absorption plate having the second flow path are illustrated as being alternately arranged one by one in the arrangement direction of the heat absorption plates. However, the present invention is not limited to this. What is necessary is just to set suitably the number of sheets which arrange | position the endothermic board which has each flow path alternately instead of a thing.

  In the above-described embodiment, the configuration in which the adjacent heat absorption plate has one of the first flow path and the second flow path is exemplified, but the present invention is not limited to this. The multiple heat absorbing plates may each have a first flow path and a second flow path. For example, it is good also as a structure which provides a 1st flow path in the perpendicular direction upper side of each heat sink, and a 2nd flow path in the perpendicular direction lower side of each heat sink. Also with this configuration, temperature unevenness can be suppressed over the entire cooling panel, and a substantially uniform temperature can be obtained over the entire panel. Thereby, the cooling effect by radiation can always be maintained in a higher state over the entire cooling panel.

  In the above-described embodiment, the flow paths are connected in series so that the heat medium flows in the arrangement direction of the heat absorption plates while flowing in the vertical direction of the heat absorption plates. However, the present invention is not limited to this. is not. If the first flow path is a flow path in which the heat medium flows in one direction in the alignment direction, and the second flow path is a flow path in which the heat medium flows in a direction opposite to the one direction in the alignment direction, A configuration in which the pipes of the heat absorbing plates are connected in parallel may be employed.

  In the above-described embodiment, each of the first flow path and the second flow path is formed by one pipe, but the present invention is not limited to this. For example, it is good also as a structure which connected one edge part of the 1st flow path and the 2nd flow path, or you may form the 1st flow path and the 2nd flow path with one piping. . As a result, the work of assembling the piping becomes easier, and the weight and cost can be reduced.

  INDUSTRIAL APPLICABILITY The present invention can be used not only for detached houses and apartment houses, but also for cooling devices such as office buildings, public buildings, cold storage warehouses, dehumidifying devices, or air conditioning units.

It is a model perspective view which shows the flow-path structure of the cooling panel which concerns on 1st Embodiment. It is sectional drawing of the heat sink plate which comprises the cooling panel which concerns on 1st Embodiment. It is explanatory drawing of the heat sink which comprises the cooling panel which concerns on 1st Embodiment, (a) is AA sectional drawing of a heat sink, (b) is a side view of a heat sink, (c) is an end of a heat sink FIG. It is a figure explaining the experiment which concerns on the structure of the protrusion front-end | tip part of the fin in a cooling panel, (a) is sectional drawing which shows the heat sink plate which concerns on an Example, (b) is sectional drawing which shows the heat sink plate which concerns on a comparative example, (C) is a schematic view of a test apparatus. It is a principal part enlarged view which shows the dew condensation condition of each heat absorption board at the time of experiment, (a) is a figure which shows the dew condensation condition of the heat absorption board which concerns on an Example, (b) is the dew condensation condition of the heat absorption board which concerns on a comparative example. FIG. It is a figure which shows the temperature change of the heat sink in the cooling panel which concerns on an Example. It is a figure which shows the temperature change of the heat sink in the cooling panel which concerns on a comparative example. It is explanatory drawing of the cooling panel which concerns on 2nd Embodiment, (a) is sectional drawing of the heat sink plate which comprises a cooling panel, (b) is a model perspective view which shows one structural example of a cooling panel.

Explanation of symbols

w ... width 1 of the tip end of the projection of the fin 1 ... cooling panels 2, 10, 20 ... endothermic plates 2a1-2a6, 2b1-2b6 ... endothermic plates 3, 3A, 3B ... endothermic plate group 4 ... support part (guide member)
4a ... 1st guide part 4b ... 2nd guide part 5,12a, 22a ... Fin 6 ... Hollow member 6a ... End part 6b ... Center part 6c ... Guide member part 7 ... 1st flow path 8 ... 2nd Flow path 9, 9a, 9b ... Piping 11, 21 ... Aluminum plate 12,22 ... Channel shape 30 ... Simple heat insulation test device 31 ... Partition wall 32 ... Low temperature chamber 33 ... High temperature chamber

Claims (17)

A cooling panel in which a number of heat absorbing plates having flow paths for flowing a heat medium are arranged in a vertical direction,
A heat sink plate group comprising a plurality of the heat sink plates arranged in parallel is a first for flowing a heat medium from one side to the other side in the arrangement direction of the heat sink plates while flowing the heat medium in the vertical direction of the heat sink plate. A cooling panel comprising: a flow path; and a second flow path for flowing the heat medium from the other side in the arrangement direction of the heat absorption plates to the one side while flowing the heat medium in the vertical direction of the heat absorption plates. .   2. The cooling panel according to claim 1, wherein each of the flow paths is a flow path that is connected in series so that the heat medium flows in the arrangement direction of the heat absorption plates while flowing in the vertical direction of the heat absorption plates. .   3. The cooling according to claim 1, wherein the plurality of endothermic plates have adjacent ones of the first passage and the second passage. 4. panel.   4. The cooling panel according to claim 3, wherein the heat absorption plate having the first flow path and the heat absorption plate having the second flow path are alternately arranged in the arrangement direction. 5.   The cooling panel according to claim 1 or 2, wherein each of the plurality of heat absorbing plates has the first flow path and the second flow path.   The cooling panel according to any one of claims 1 to 5, wherein each of the flow paths is formed by a single resin pipe.   The cooling panel according to claim 6, wherein the pipe is a pipe made of a crosslinked polyolefin resin having a metal reinforcing layer.   The cooling panel according to claim 6 or 7, wherein the pipe has an inner diameter of 8 mm or less.   The cooling panel according to claim 1, comprising a plurality of heat absorbing plate groups each having the first flow path and the second flow path.   The one end of the first channel and the second channel are connected to each other or formed by a single pipe. Cooling panel.   The outer surface of the heat sink plate is provided with a large number of fins with cross-sectional protrusions that run in the vertical direction, and the structure of the top of the protrusion tips of the fins is such that condensed water is generated in the form of water droplets and the generated water droplets fall without falling The cooling panel according to any one of claims 1 to 10, wherein the cooling panel is made easy.   The outer surface of the heat absorbing plate is provided with a plurality of fins having a cross-sectional protrusion extending in a vertical direction, and the width of the top end of the protrusion tip of the fin is 1.5 mm or more. The cooling panel according to item.   The cooling panel according to claim 12, wherein the width of the top end of the protrusion of the fin is 6.0 mm or less.   The cooling panel according to any one of claims 11 to 13, wherein the endothermic plate is an extruded product of a conductive light metal.   The cooling panel according to any one of claims 11 to 14, wherein an outer shape of the endothermic plate is flat in a horizontal cross-sectional shape and has a tapered shape with an end portion narrower than a central portion.   The endothermic plate has a hollow member in which a large number of fins are provided in the vertical direction on the outer surface, and a guide member that guides and supports the pipe in the hollow member, and the outer shape of the endothermic plate has a horizontal cross-sectional shape. The cooling panel according to claim 11, wherein the end of the hollow member has a tapered shape that is narrower than the guide member portion.   The cooling panel according to any one of claims 11 to 16, wherein the heat absorbing plate is an integrally molded product.