JP2007234698A5 - - Google Patents

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Publication number
JP2007234698A5
JP2007234698A5 JP2006051528A JP2006051528A JP2007234698A5 JP 2007234698 A5 JP2007234698 A5 JP 2007234698A5 JP 2006051528 A JP2006051528 A JP 2006051528A JP 2006051528 A JP2006051528 A JP 2006051528A JP 2007234698 A5 JP2007234698 A5 JP 2007234698A5
Authority
JP
Japan
Prior art keywords
semiconductor mounting
circuit board
mounting substrate
semiconductor
solder joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006051528A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007234698A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006051528A priority Critical patent/JP2007234698A/ja
Priority claimed from JP2006051528A external-priority patent/JP2007234698A/ja
Priority to US11/710,841 priority patent/US20070200252A1/en
Publication of JP2007234698A publication Critical patent/JP2007234698A/ja
Publication of JP2007234698A5 publication Critical patent/JP2007234698A5/ja
Withdrawn legal-status Critical Current

Links

JP2006051528A 2006-02-28 2006-02-28 回路基板装置、回路部品補強方法および電子機器 Withdrawn JP2007234698A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006051528A JP2007234698A (ja) 2006-02-28 2006-02-28 回路基板装置、回路部品補強方法および電子機器
US11/710,841 US20070200252A1 (en) 2006-02-28 2007-02-26 Circuit board apparatus, circuit component reinforcing method and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006051528A JP2007234698A (ja) 2006-02-28 2006-02-28 回路基板装置、回路部品補強方法および電子機器

Publications (2)

Publication Number Publication Date
JP2007234698A JP2007234698A (ja) 2007-09-13
JP2007234698A5 true JP2007234698A5 (https=) 2008-11-27

Family

ID=38443200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006051528A Withdrawn JP2007234698A (ja) 2006-02-28 2006-02-28 回路基板装置、回路部品補強方法および電子機器

Country Status (2)

Country Link
US (1) US20070200252A1 (https=)
JP (1) JP2007234698A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112235938A (zh) * 2019-07-15 2021-01-15 中兴通讯股份有限公司 Pcb板的焊接方法和pcb城堡板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
JP3639505B2 (ja) * 2000-06-30 2005-04-20 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線基板及び半導体装置
US6959489B2 (en) * 2000-09-29 2005-11-01 Tessera, Inc. Methods of making microelectronic packages
US7118940B1 (en) * 2005-08-05 2006-10-10 Delphi Technologies, Inc. Method of fabricating an electronic package having underfill standoff

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