JP2007231253A - Curable resin composition for transparent sealing, resin-sealed light-emitting device and method for producing the same - Google Patents

Curable resin composition for transparent sealing, resin-sealed light-emitting device and method for producing the same Download PDF

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JP2007231253A
JP2007231253A JP2007019278A JP2007019278A JP2007231253A JP 2007231253 A JP2007231253 A JP 2007231253A JP 2007019278 A JP2007019278 A JP 2007019278A JP 2007019278 A JP2007019278 A JP 2007019278A JP 2007231253 A JP2007231253 A JP 2007231253A
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resin
curable resin
resin composition
curable
fine particles
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Inventor
Yoshihisa Beppu
Tadayuki Inaba
Katsuaki Miyatani
Toshihiro Sakai
Kazuo Sunahara
Kumiko Takahashi
義久 別府
克明 宮谷
一夫 砂原
忠之 稲葉
智弘 酒井
久美子 高橋
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Asahi Glass Co Ltd
旭硝子株式会社
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Priority to JP2007019278A priority patent/JP2007231253A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

Provided are a light-emitting element encapsulated with a resin having a high refractive index and excellent in visible light transmittance, which can increase the light extraction efficiency, and a method for producing the same, and a resin composition therefor To do.
A dielectric crystal particle having an average primary particle diameter of 5 to 50 nm, an epoxy resin and a curable silicone resin, obtained by removing a glass matrix component after crystallizing a metal oxide in a glass matrix. A curable resin composition for translucent sealing of a light-emitting element, comprising at least one curable resin selected from the group consisting of: a resin-sealed light-emitting element sealed using the resin composition .
[Selection] Figure 1

Description

  The present invention relates to a curable resin composition for translucently sealing a light-emitting element, a resin-encapsulated light-emitting element, and a method for manufacturing the same.

  2. Description of the Related Art In recent years, a light emitting element (solid state) using a semiconductor light emitting chip (hereinafter referred to as a light emitting chip) such as a white light emitting diode (hereinafter referred to as LED), an organic LED (hereinafter referred to as OLED), a semiconductor laser diode (LD) or the like as a light source. Research and development of lighting elements) is actively conducted. Unlike fluorescent lamps and incandescent lamps, such light-emitting elements do not contain mercury, which can pollute the environment, do not generate heat rays, and have low power consumption and long life. Has attracted a great deal of attention as a friendly technology.

  However, low luminous efficiency is regarded as a problem. The refractive index of a semiconductor constituting an LED or the like is very large, for example, about 2.5 to 3.0 in the case of GaN. Therefore, in order to increase the extraction efficiency of light emitted from the LED, it is necessary to cover the LED with a material having a high refractive index. However, since the refractive index of the resin used for this coating is as low as 1.4 to 1.5 for the curable silicone resin and 1.5 to 1.6 for the epoxy resin, the PN junction or active layer of the optical semiconductor is low. The light emitted in step # 5 is totally reflected at the interface between the light emitting chip portion and the resin portion and is liable to cause a loss inside, so that sufficient extraction efficiency cannot be obtained.

  Many attempts have been made to increase the refractive index of the resin in order to increase the light extraction efficiency from the LED. The most common method for increasing the refractive index of the resin is to add titanium oxide having a high refractive index among the insulators. However, since titanium oxide absorbs in the visible light region, Not suitable for use. As other methods, a method of adding fine zinc oxide crystals or cerium oxide crystals having a number average particle diameter of 50 nm or less (Patent Document 1), a method of adding a composite oxide of silica and titanium (Patent Document) 2) etc. have been proposed, but by any of the methods, a refractive index as high as required for the resin for LED coating (about 1.7) has not been realized.

JP 2003-147090 (Claims) JP-A-2005-120229 (Claims)

  In view of the problems of the prior art as described above, the present invention is sealed with a resin that has a high refractive index and excellent visible light transmittance (cured), which can increase the light extraction efficiency as compared with the prior art. It is an object of the present invention to provide a curable resin composition, a resin-sealed light-emitting element sealed with the curable resin composition, and a method for producing the same for producing the light-emitting element. Moreover, it aims at providing the composition containing this curable resin composition and organic solvent used for optical element sealing.

  The present invention is characterized by having the following configuration.

  (1): Dielectric crystal fine particles having an average primary particle diameter of 5 to 50 nm, an epoxy resin and a curable silicone resin, obtained by removing a glass matrix component after crystallizing a metal oxide in a glass matrix A curable resin composition for translucent sealing of a light emitting device, comprising at least one curable resin selected from the group consisting of:

(2): the dielectric crystal particles, formula PbZr 1-x Ti x O 3 , BaTi 1-x Zr x O 3, Ba 1-x Sr x TiO 3, (Bi 1-x La x) 4 Ti 3 O 12 , (Sr 1-x Bi x ) 3 Ta 2 O 9 [0 ≦ x ≦ 1] and one or more kinds of dielectric crystal fine particles selected from the group consisting of solid solutions of each other Curable resin composition.

(3) The curable resin composition according to (1), wherein the dielectric crystal fine particles are CeO 2 .
(4): The curable resin composition according to (1), wherein the dielectric crystal fine particles are ZrO 2 .

  (5): The content ratio of the dielectric crystal fine particles and the resin component is [dielectric crystal fine particles] / [curable resin] = 5/95 to 50/50 by mass ratio (1) to (4) ) The curable resin composition in any one of.

  (6): The composition used for translucent sealing of a light emitting element containing the curable resin composition in any one of (1)-(5), and an organic solvent.

  (7): A resin-sealed light emitting device in which an opening through which light passes is sealed with a cured product of the curable resin composition according to any one of (1) to (5).

  (8): A curable resin according to any one of (1) to (5), in which a light emitting chip is placed on a circuit board in which wiring is formed on the substrate and is electrically connected to the wiring. A method for producing a resin-encapsulated light-emitting element, comprising: coating the light-emitting chip with a composition; and then heat-curing the curable resin composition.

  According to the present invention, it is possible to obtain a light-emitting element that is light-transmitted and sealed with a resin having a high refractive index and excellent visible light transmittance. In particular, it is possible to increase the extraction efficiency of light emitted from the LED.

The present invention is described in detail below.
In the present invention, the light-transmitting sealing means at least light of the light-emitting chip so that light emitted from the light-emitting chip passes through the sealing material (cured product of the curable resin composition in the present invention) and is emitted from the light-emitting element. This means covering the emission surface with a sealing material. Since the light emitting chip is installed and wired on the substrate of the (optical) opening of the light emitting element, the sealing material preferably covers the light emitting chip and fills the opening of the optical element. In that case, the sealing material embeds the light emitting chip so as to be in contact with and cover at least the light emitting surface of the light emitting chip. The encapsulant is preferably colorless and transparent because it transmits the emitted light, but may be colored to adjust the color of the emitted light of the light emitting chip (for example, the colored emitted light is converted into white light). In order to adjust to a complementary color of the emitted light).

  Moreover, the curable resin composition (composition containing curable resin) in this invention means the composition which hardens | cures and becomes said sealing material. Therefore, components such as a solvent removed before the curable resin is cured are not included. On the other hand, the composition containing the curable resin composition and the organic solvent (used for translucent sealing of the light emitting device) in the present invention includes a component (solvent) that is not included in the sealing material. This is a composition used for facilitating the coating of the light-emitting chip with the curable resin composition or the filling of the curable resin composition into the light emitting element opening in the sealing step. is there.

  FIG. 1 is a cross-sectional view of a resin-sealed light emitting device manufactured according to an embodiment of the present invention. As shown in FIG. 1, the resin-sealed light emitting element 1 electrically connects the circuit board 3 on which the wiring 4 is formed, the semiconductor LED chip 7 as a light emitting chip, and the wiring 4 and the semiconductor LED chip 7. Wire 6. Here, the semiconductor LED chip 7 is covered with a resin (cured product of a curable resin composition) 2 filling the opening of the light emitting element 1. In order to increase the extraction efficiency of light emitted from the semiconductor LED chip 7, it is preferable that the difference in refractive index between the resin 2 and the constituent material of the semiconductor LED chip 7 is small.

Specifically, the resin-sealed light emitting device 1 is manufactured as follows.
First, a pattern of two wirings 4 is produced on the circuit board 3 (first step). Next, after mounting the semiconductor LED chip 7 on one wiring 4 and laminating the bonding pad 5 on the surface of the semiconductor LED chip 7 opposite to the wiring 4, the bonding pad 5 and the other wiring 4 are Connection is made by the wire 6 (second step). Further, the gap portion is filled with a curable resin composition and cured by heating to form the resin 2 (third step). After the third step, a lens may be formed on the resin 2 for the purpose of further improving the light extraction efficiency.

As the semiconductor LED chip 7 in the present embodiment, various materials can be used according to a desired emission color. For example, Al 0.35 Ga 0.65 As for red, GaP for green, and nitride semiconductors such as GaN and InGaN for blue.

  In the present invention, the resin 2 is obtained by crystallizing a metal oxide in a glass matrix and then removing the glass matrix component, the dielectric crystal fine particles having an average primary particle diameter of 5 to 50 nm, an epoxy resin, and A resin composition containing at least one curable resin selected from curable silicone resins is heat-cured.

  First, in the present invention, the dielectric crystal particles are components that serve as fillers for adjusting the refractive index of the resin 2. As the filler, since it is easy to maintain the crystal shape and the crystal system, it is desired to have high crystallinity with a high purity and uniform composition with few crystal lattice defects. In the present invention, since a fine particle having high crystallinity and few crystal lattice defects can be produced, it can be obtained by removing the glass matrix component after crystallizing the metal oxide to be a dielectric crystal in the glass matrix. Use the fine particles. That is, a metal oxide component to be crystallized as a dielectric crystal is dissolved in a glass base material melt, and the melt is rapidly cooled and vitrified, and then heat annealing is performed again in the base material. Fine particles obtained by a glass crystallization method for precipitating microcrystals. The precipitated microcrystals are taken out as fine particles by dissolving the glass matrix with an appropriate chemical solution or the like.

  Fine particles crystallized in such a glass matrix have fine particle end faces compared with fine particles obtained by a conventional solution method (a method of obtaining an oxide via a metal oxide hydrate or metal hydroxide). Residues such as hydroxyl groups are few and crystal lattice defects are few. In addition, the use of such a method makes it easy to control the form of the fine particles, and it is easy to produce fine particles having a relatively large anisotropy depending on annealing conditions, etc., and it is easy to obtain particles having a large aspect ratio. ing.

  As the glass base material, boric acid type, phosphoric acid type, silicic acid type and the like can be used, but from the viewpoint of easiness of production of a composite compound with meltability and a target oxide, easiness of elution of a matrix, etc. A boric acid-based glass base material is preferably used.

  In the following, the production of dielectric crystal fine particles will be described in detail by taking as an example a method for producing barium titanate fine particles. The dielectric crystal fine particles can be obtained by the following steps [1] to [4].

  [1] A glass forming component (for example, boron oxide) and a metal oxide (for example, barium oxide and titanium oxide) serving as a target dielectric are mixed and melted at a temperature of 1200 ° C. or higher [melting ].

  [2] A glass containing metal ions having a dielectric composition is obtained by rapidly cooling the molten glass [vitrification].

  [3] Annealing is performed at a temperature of about 550 ° C. to 700 ° C. to form dielectric crystal nuclei in the glass, and the crystal is grown to a predetermined particle size by controlling the annealing conditions [crystallization].

[4] A glass base material component (for example, boron oxide) is removed by acid, water, or a mixture thereof to obtain dielectric crystal fine particles (for example, BaTiO 3 ) [Leaching].

  According to the above series of steps, since the dielectric is crystallized using a very high viscosity glass as a base material in the annealing temperature region, it is easy to control the particle diameter and particle morphology of the dielectric crystal fine particles, Further, there is a feature that crystal fine particles with high crystallinity can be obtained.

In the present invention, by setting the average primary particle diameter of the dielectric crystal fine particles to 5 nm or more, it is possible to prevent the dielectric crystal fine particles from aggregating and increasing the viscosity in the curable resin composition. The dielectric crystal fine particles are uniformly dispersed therein, and a high refractive index of the resin 2 can be realized. On the other hand, when the average primary particle diameter is 50 nm or less, the refractive index can be increased without impairing the visible light transmittance of the resin 2. In addition, since the dielectric crystal particles can be uniformly dispersed in the curable resin composition, they can be uniformly dispersed in the resin 2. The average primary particle diameter of the dielectric crystal fine particles is preferably 10 to 50 nm.
Furthermore, the average primary particle diameter of the dielectric crystal fine particles is preferably 40 nm, more preferably 20 nm or less. This is because the average primary particle diameter of the dielectric crystal particles is small, so that the refractive index of the resin 2 can be increased without losing light incident on the resin 2 due to scattering.

  Further, the content ratio of the dielectric crystal fine particles in the curable resin composition is preferably 5 to 50% by mass with respect to the curable resin. The refractive index of resin 2 can be raised by making the said content rate into 5 mass% or more. On the other hand, when the content ratio is 50% by mass or less, occurrence of thickening of the curable resin composition can be suppressed, and the resin 2 can have a high refractive index without impairing the visible light transmittance of the resin 2.

Here, examples of the dielectric include a metal oxide dielectric having a perovskite crystal structure represented by the general formula ABO 3 or a metal oxide dielectric having a layered perovskite crystal structure. Among them, as the metal oxide dielectric, general formulas Ba 1-x Sr x TiO 3 , BaTi 1-x Zr x O 3 , (Bi 1-x La x ) 4 Ti 3 O 12 , (Sr 1-x Bi x 3 Ta 2 O 9 , PbZr 1-x Ti x O 3 [0 ≦ x ≦ 1] and one or more selected from the group consisting of solid solutions thereof are preferably used because excellent dielectric properties can be obtained. In addition to the above, selected from the group consisting of Pb (Mg 1/3 Nb 2/3 ) O 3 , PbTiO 3 , PbZrO 3 , Ba 1-x Sr x TiO 3 [0 ≦ x ≦ 1] and their solid solutions. One or more metal oxide dielectrics, general formula (Bi 2 O 2 ) 2+ (A m-1 Ti m O 3.5m-0.5 ) 2- [A is Bi or Bi and La, La The atomic ratio of / Bi is 0 to 0.5, and m is an integer of 1 to 5. ], The general formula Sr 1-n Bi 2 + n Ta 2 O 9 [0 ≦ n ≦ 0.8] , etc. is also preferably used.

Further, if CeO 2 is used as the metal oxide dielectric, it has an absorption band in the ultraviolet region and there is little absorption in the visible region, which is preferable because the visible light transmittance of the resin 2 can be increased.
Furthermore, if ZrO 2 is used as the metal oxide dielectric, the resin has an absorption band in the ultraviolet region (wavelength of about 360 nm) and has little absorption in the visible region, particularly in the near ultraviolet visible region (wavelength of about 400 to 450 nm). The visible light transmittance of 2 can be maintained high up to the near ultraviolet region, which is preferable.

  Furthermore, the dielectric crystal fine particles are used in accordance with the purpose of improving the dispersibility and storage stability in the curable resin composition and preventing the expression of photocatalytic activity. Surface treatment may be performed with a ring agent or the like.

  Next, at least one curable resin selected from an epoxy resin and a curable silicone resin is a component that functions as a binder and a flexibility imparting agent for dielectric crystal particles. By using an epoxy resin and / or a curable silicone resin as the curable resin, the resin 2 is excellent in moldability when producing the resin 2, and the cured resin 2 has an excellent balance between heat resistance and mechanical strength. It can be a sealing material excellent in adhesive strength, light resistance, moisture resistance, corrosion resistance and refractive index.

In the present invention, the epoxy resin is composed of a main agent composed of polyepoxide (commonly referred to as an epoxy resin; hereinafter also referred to as component A) and a curing agent (component B).
Examples of the component A include bisphenol A type epoxy resins, bisphenol F type epoxy resins, novolak type epoxy resins such as phenol novolak type epoxy resins and cresol novolak type epoxy resins, alicyclic epoxy resins, triglycidyl isocyanurate, hydantoin. Nitrogen-containing ring epoxy resin such as epoxy resin, hydrogenated bisphenol A type epoxy resin, aliphatic epoxy resin, glycidyl ether type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin which is the mainstream of low water absorption rate cured type , Dicyclo ring type epoxy resin, naphthalene type epoxy resin and the like. These may be used alone or in combination of two or more. Among these epoxy resin main ingredients, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, alicyclic epoxy resin, triglycidyl isocyanurate may be used because of excellent transparency and discoloration resistance. preferable.

  As such an epoxy resin main ingredient, for example, trade name: Epicoat 827 (manufactured by Yuka Shell Epoxy), trade name: D.I. E. R. Examples thereof include bisphenol A type epoxy resins such as 331J (manufactured by Dow Chemical Japan), and bisphenol F type epoxy resins such as trade name: Epicoat 807 (manufactured by Yuka Shell Epoxy). These epoxy resin main ingredients may be used alone or in admixture of two or more.

  As said B component, what is normally known as a hardening | curing agent for epoxy resins can be used, for example, an acid anhydride type hardening | curing agent and a phenol type hardening | curing agent are mention | raise | lifted. Examples of the acid anhydride-based curing agent include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, anhydrous Examples include glutaric acid, methylhexahydrophthalic anhydride, and methyltetrahydrophthalic anhydride. These may be used alone or in combination of two or more. Among these acid anhydride curing agents, it is preferable to use phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, and methylhexahydrophthalic anhydride. These curing agents may be used alone or in combination of two or more. Although the preferable addition amount of a hardening | curing agent changes greatly with the kind, it can select suitably according to the hardening time selected according to a manufacturing process.

  On the other hand, curable silicone resins are widely used as materials for electric, electronic, precision equipment and the like because they are excellent in heat resistance, weather resistance, moisture resistance, electrical properties, etc. and have a relatively low elastic modulus. Since the silanol group of the curable silicone resin has an affinity for the surface of the dielectric crystal particles, the mixing of the dielectric crystal particles and the curable silicone resin can be controlled uniformly and freely. As a result, a curable resin composition capable of sufficiently expressing the characteristics of the dielectric crystal fine particles and the curable silicone resin is obtained, and the composition (including those containing a partially polymerized silicone resin described later) is used for the light-transmitting element. Suitable for light sealing. According to the curable resin composition of the present invention, translucent sealing of a light emitting element can be performed at a low temperature, the adhesive strength is strong, the adhesive processability is excellent, the mechanical heat resistance is high for a long time, and the gas leak resistance is high. It has many characteristics such as good performance, high airtightness retention and good heat-resistant dimensional stability.

Generally, the curable silicone resin is produced from a bifunctional silicon monomer (R 2 Si—X 2 ) and a trifunctional silicon monomer (RSi—X 3 ), and in some cases, a monofunctional silicon monomer (R 3 Si—X) or tetrafunctional. sometimes silicon monomer (Si-X 4) are used in combination. Here, R shows the organic group whose bond terminal is a carbon atom.

As the curable silicone resin, a curable methyl silicone resin or methylphenyl silicone resin is preferably used. Here, the curable methyl silicone resin is a curable silicone resin containing a methyl group as the organic group R, and the curable methyl phenyl silicone resin is both a methyl group and a phenyl group as the organic group R. Is a curable silicone resin. By using the curable methyl silicone resin or a curable methylphenyl silicone resin, silicon oxide occurs with Si atom having a hydrocarbon group bonded in the cured product, the silicon oxide is flexible as compared to SiO 2 Therefore, it is considered that the resin 2 as a binder is also excellent in flexibility, hardly cracks, and can maintain a high refractive index and visible light transmittance. In addition, the hydrocarbon group bonded to the Si atom may be partially decomposed and disappeared during the heat curing, but if the composition of the present invention is used, it can be translucently sealed at a low temperature. Therefore, it is considered that most of the hydrocarbon groups remain at the heat curing temperature.

In the curable silicone resin, R is preferably an alkyl group having 1 to 4 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms, and is a methyl group, an ethyl group or a phenyl group. It is more preferable. X is a hydroxyl group or a hydrolyzable group such as an alkoxy group or a chlorine atom. In the curable silicone resin, X is preferably hydrolyzed to become a hydroxyl group. The curable silicone resin is a copolymer obtained by partially hydrolyzing and condensing these monomers, and has a silanol group formed by hydrolysis of X. The curable silicone resin can be further condensed by the silanol group (can be cured), and when cured, the condensation of the silanol group proceeds to become an insoluble and infusible cured product. The cured product is composed of a bifunctional silicon unit (R 2 SiO) and a trifunctional silicon unit (RSiO 3/2 ). In some cases, a monofunctional silicon unit (R 3 SiO 1/2 ) or a tetrafunctional silicon unit (SiO 2 ). Each silicon unit in the curable silicone resin also means each silicon unit containing a silanol group which is generated by hydrolysis of X together with each silicon unit of these cured products and contributes to the curability of the silicone resin. For example, a bifunctional silicon unit having a silanol group is represented by (R 2 Si (OH)-), and a trifunctional silicon unit having a silanol group is represented by (RSi (OH) 2- ) or (RSi (OH) =). expressed. Further, it is considered that the molar ratio of each silicon unit in the curable silicone resin is equal to the molar ratio of each silicon monomer as a raw material.

  Further, the curable silicone resin can be modified with an epoxy resin, a phenol resin, an alkyd resin, a polyester resin, an acrylic resin, or the like. However, the amount of the resin to be modified is preferably small, and the curable silicone resin is preferably a curable silicone resin that is not substantially modified.

  In the resin composition of the present invention, the curable silicone resin has a molar ratio of bifunctional silicon units to (total of bifunctional silicon units and trifunctional silicon units) (simply referred to as a molar ratio of bifunctional silicon units) of 0. It is preferable that it is 0.05-0.55.

  For example, in the case of a methylphenyl silicone resin, the curable silicone resin is produced by a method of hydrolytic cocondensation of dichlorodimethylsilane and trichlorophenylsilane, a method of hydrolytic cocondensation of dichlorodiphenylsilane and trichloromethylsilane, or the like. . The molar ratio of the bifunctional silicon unit of the curable silicone resin is more preferably 0.2 to 0.4. The curable silicone resin is preferably substantially composed of only a bifunctional silicon unit and a trifunctional silicon unit. Such a curable silicone resin does not easily decompose or discolor even when kept at a high temperature of 250 ° C. or higher for a long time, and has excellent heat resistance.

  The curable silicone resin is usually subjected to handling such as transportation and storage in a solution (varnish) dissolved in an organic solvent. The curable resin composition of the present invention can be produced using this varnish. A composition containing a varnish solvent or a separately blended organic solvent (used for translucent sealing of a light-emitting element) is a paste-like composition having fluidity.

  The curable silicone resin can be present as a partially polymerized silicone resin (also simply referred to as a partially polymerized silicone resin) in the resin composition. The partially polymerized silicone resin undergoes a certain degree of dehydration condensation reaction of the curable silicone resin of the raw material, and therefore, compared with the curable silicone resin of the raw material, there is less generation of moisture when sealing the light emitting element, and therefore The curable resin composition containing the partially polymerized silicone resin can reduce air bubbles and improve the airtightness when sealing and curing the light emitting element, compared to the raw material silicone resin. . Further, the partially polymerized silicone resin is a high-viscosity liquid or a solid having a high melt viscosity as compared with the raw material curable silicone resin, and has properties suitable when the curable resin composition of the present invention is used as a molded product. . For example, when the molded body of the curable resin composition disposed at a predetermined portion of the light emitting element is cured, the risk of the silicone resin flowing and protruding from the predetermined portion is reduced.

  The partially polymerized silicone resin is a curable silicone resin in which the curing of the curable silicone resin that is a raw material thereof is partially advanced. The curable silicone resin in the present invention means a curable silicone resin that is a raw material of a partially polymerized silicone resin, and also means this partially polymerized silicone resin. Hereinafter, a product obtained by partially polymerizing a curable silicone resin in the production stage of the resin composition of the present invention is referred to as a partially polymerized silicone resin.

  The partial polymerization of the curable silicone resin is usually carried out by stopping the curing reaction by heating the raw material silicone resin to the extent that it is not completely completed. For example, it can be obtained by partially curing the curable silicone resin as a raw material by a method such as heating at a lower temperature than in a normal curing reaction or heating for a shorter time than the time required for normal curing. In order to perform partial polymerization of the curable silicone resin, for example, polymerization is performed at a temperature of 120 ° C. to 180 ° C., and the reaction is stopped when the crosslinking reaction does not proceed. The partial polymerization of the raw material curable silicone resin can be carried out at the stage of the resin alone, in the composition in which the dielectric crystal particles are present, or in the process of producing the composition.

  Curing of the curable silicone resin by dehydration condensation usually proceeds only by heating, and is due to a dehydration condensation reaction between silanol groups of the resin and a dehydration condensation reaction between the silanol groups of the resin and the silanol groups on the surface of the dielectric crystal particles. A cured product insoluble in the solvent is formed. For example, the resin composition applied to the light emitting element is cured at a temperature of 140 ° C. or higher, preferably 180 ° C. to 300 ° C. for 1 to 120 minutes, so that the resin is cured and insolubilized to form a cured resin of resin 2. Become an ingredient. The composition (used for translucent sealing of a light emitting device) of the present invention contains an organic solvent, and the organic solvent and varnish solvent (hereinafter referred to as organic solvent) are volatilized and removed at the initial stage of heating. When non-heat-resistant substances such as organic substances are present, they are removed by volatilization or decomposition during curing. However, in order to perform stable curing, it is preferable to perform volatilization removal (drying) of the organic solvent or the like at a lower temperature before curing the resin composition. Such volatilization removal of the organic solvent or the like is carried out, for example, at a temperature of 100 to 140 ° C. for 30 to 60 minutes, depending on the type of the organic solvent or the like.

  In the curable resin composition of the present invention, other curable resins and curable compounds other than the epoxy resin and the curable silicone resin, a relatively small amount with respect to the total amount of the epoxy resin and the curable silicone resin, May be included. As other curable resins and curable compounds, curable silicon compounds other than the curable silicone resin are preferable. Examples of the curable silicon compound include silane coupling agents and oligomers thereof. The silane coupling agent has a structure in which one of the hydrocarbon groups in the bifunctional hydrolyzable silane or trifunctional hydrolyzable silane is substituted with a functional group-containing organic group (the organic group is bonded to a silicon atom by a carbon-silicon bond). It is a silicon compound having The oligomer is obtained by partially hydrolyzing and condensing a silane coupling agent as described above. Moreover, the reaction material of 2 types of silane coupling agents which have a mutually reactive functional group can also be used.

  Examples of the functional group in the silane coupling agent include an amino group, an epoxy group, an acryloyloxy group, a methacryloyloxy group, a mercapto group, and a chlorine atom. Specific examples of the silane coupling agent include 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, and N- (2-aminoethyl) -3-aminopropylmethyldimethoxy. Silane, 3-glycidoxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-chloropropyltrimethoxy Silane etc. are mentioned.

  In addition, the curable resin composition may have other components in addition to the dielectric crystal fine particles and the curable resin. The other component is preferably a compound that can be dissolved in the curable resin composition, but insoluble components such as solid fine particles as long as the refractive index and visible light transmittance of the resin 2 are not impaired. In addition, a composition that can be stably dispersed in the composition may be contained. Specific examples include a fluorescent material, a curing catalyst for lowering the curing temperature of the curable silicone resin, quaternary ammonium salts, chelates such as aluminum and titanium, various amines or salts thereof. These other components are preferably components that impart functionality to the resin 2.

  The content ratio of the dielectric crystal fine particles and the curable resin in the curable resin composition of the present invention is preferably [dielectric crystal fine particles] / [curable resin] = 5/95 to 50/50 by mass ratio. . By setting the content ratio to 5/95 or more, the refractive index can be increased while the resin 2 is formed into a dense and durable film. On the other hand, when the content ratio is 50/50 or less, it becomes easy to maintain the dispersibility and affinity between the dielectric crystal fine particles and the curable resin. Leakage of moisture etc. can be prevented. Moreover, the adhesive strength between the resin 2 and the semiconductor LED chip 7 can be maintained. A preferred content ratio is 20/80 to 40/60.

  The curable resin composition of the present invention is a composition that is cured to become the resin 2. In order to make it easy to coat the light emitting chip with this curable resin composition, preferably in order to easily fill the opening where the light emitting chip of the light emitting element is installed, It is preferable to contain a solvent to obtain a fluid composition. When the curable resin is a liquid or a low melting point solid, an organic solvent is not necessarily required, but in order to improve the handleability of the curable resin composition in the sealing process, it is used as a composition containing an organic solvent. It is preferable. Further, the composition containing the organic solvent may further contain a component not included in the resin 2 (a component removed before curing of the curable resin or a component removed by thermal decomposition after curing). Moreover, although it is not necessary as a component in the resin 2, the component (leveling agent etc.) which improves the handleability of the composition containing an organic solvent may be included.

  The composition used for translucent sealing of the light emitting device of the present invention containing the organic solvent includes the dielectric crystal fine particles, at least one curable resin selected from an epoxy resin and a curable silicone resin, and It is a composition containing an organic solvent as an essential component. This composition is preferably a paste-like composition. When the amount of the organic solvent is small, the composition may be a solid that can be easily heated and fluidized at room temperature. Using this composition, the light emitting chip is coated, the organic solvent is removed by drying or the like, a coating layer of the curable resin composition is formed on the light emitting chip, and then the curable resin is cured to form the light emitting chip. It seals in a light emitting element (it is set as the sealed light emitting element).

  As the organic solvent, a solvent capable of dissolving the curable resin is preferably used. However, as long as the resin component can be dissolved, the solvent capable of dissolving the curable resin and the curable resin may be used. You may mix and use a solvent with low solubility. The type of the organic solvent is not particularly limited. For example, alcohols such as methanol, ethanol, n-propyl alcohol, n-butanol, pentyl alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, and ethylene glycol are dissolved in the curable resin. It is preferably used from the viewpoint of excellent solubility, particularly solubility of the curable silicone resin. Of course, two or more of the above organic solvents may be used in combination. Furthermore, the solvent (toluene, xylene, etc.) of the said curable silicone resin varnish can be used as an organic solvent or as a part of organic solvent.

  The solid content concentration in the composition of the present invention is preferably 1 to 60% by mass. Here, the solid content refers to the total content of components excluding volatile components (components removed during drying of the coating film such as organic solvents) in the composition. When the solid content concentration is 1% by mass or more, the resin 2 having a sufficient thickness can be efficiently formed. On the other hand, when the solid content concentration is 60% by mass or less, the curable resin can be dissolved in the composition, and the stability of the composition can be maintained.

  The said composition and curable resin composition of this invention are obtained by mixing each component. As a mixing method, a known technique can be used, and specifically, a ball mill, a jet mill, a roll mill or the like is used.

  A light emitting chip is sealed using the curable resin composition obtained above to obtain a resin-sealed light emitting element 1. Specifically, on a wiring board in which wiring is formed on the substrate, a light emitting chip is installed and electrically connected to the wiring, and after covering the light emitting chip with the curable resin composition, The curable resin composition is cured by heating. At this time, the coating method with the curable resin composition is not particularly limited, and a known molding method such as normal transfer molding or casting may be used. In the heat curing, it is preferable to heat at 140 ° C. or higher, preferably 180 to 300 ° C. for 1 to 120 minutes.

  EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to the following examples.

[Production of BaTiO 3 crystal fine particles]
Barium carbonate, titanium oxide (rutile) and boron oxide are weighed as BaO, TiO 2 and B 2 O 3 to be 50.0, 25.0 and 25.0 mol%, respectively, and an automatic mortar using a small amount of ethanol The mixture was then wet mixed and dried to obtain a raw material powder. The obtained raw material powder is filled in a platinum container (containing 10% rhodium) with a nozzle for melting droplets, and heated at 1350 ° C. for 2 hours in an electric furnace using molybdenum silicide as a heating element. Melted. Next, the nozzle portion was heated, and the melt was dropped onto a twin roll made of SUS316 (roll diameter 150 mm, roll rotation speed 50 rpm, roll surface temperature 30 ° C.) installed under the electric furnace to obtain a flaky solid. .

  The obtained flaky solid was transparent, and as a result of powder X-ray diffraction, it was confirmed to be an amorphous substance. This flaky solid was heated at 590 ° C. for 12 hours for crystallization treatment. Next, this flake powder was added to a 1 mol / L aqueous acetic acid solution maintained at 80 ° C., stirred for 12 hours, centrifuged, washed with water, and dried to obtain a white powder.

  When the obtained white powder was identified by powder X-ray diffraction, it was a powder composed of a tetragonal barium titanate single phase. As a result of observation with a transmission electron microscope, the average primary particle size was 30 nm.

[Production of Ba 0.6 Sr 0.4 TiO 3 Crystalline Fine Particles]
Barium carbonate, strontium carbonate, titanium oxide (rutile) and boron oxide, BaO, SrO, so as to be respectively 40.0,10.0,20.0 and 30.0 mol% TiO 2 and B 2 O 3 were weighed The mixture was thoroughly wet-mixed in an automatic mortar using a small amount of ethanol and dried to obtain a raw material powder. The obtained raw material powder, which has been melted, cooled and crystallized in the same manner as described above, is added to a 1 mol / L acetic acid aqueous solution, and stirred, centrifuged, washed with water, and dried as described above. To obtain a white powder.

When the obtained white powder was identified by powder X-ray diffraction, it was a powder composed of cubic Ba 0.6 Sr 0.4 TiO 3 single phase, and was observed with a transmission electron microscope. The diameter was 30 nm.

[Production of CeO 2 crystal fine particles]
Cerium oxide (CeO 2 ), barium carbonate (BaCO 3 ) and boron oxide (B 2 O 3 ) are respectively 25.0, 25.0 and 50.0 mol% as CeO 2 , RO and B 2 O 3 , respectively. It was weighed so that it was mixed well in an automatic mortar using a small amount of ethanol and then dried to obtain a raw material powder. The obtained raw material powder, which has been melted, cooled and crystallized in the same manner as described above, is added to a 1 mol / L acetic acid aqueous solution, and stirred, centrifuged, washed with water, and dried as described above. To obtain a white powder.

When the obtained white powder was identified by powder X-ray diffraction, it was a powder made of CeO 2 single phase, and as a result of observation with a transmission electron microscope, the average primary particle size was 25 nm.

[Production of ZrO 2 crystal fine particles]
Zirconium oxide (ZrO 2 ), barium carbonate (BaCO 3 ) and boron oxide (B 2 O 3 ) are respectively 25.0, 25.0 and 50.0 mol% as ZrO 2 , RO and B 2 O 3 , respectively. It was weighed so that it was mixed well in an automatic mortar using a small amount of ethanol and then dried to obtain a raw material powder. The obtained raw material powder, which has been melted, cooled and crystallized in the same manner as described above, is added to a 1 mol / L acetic acid aqueous solution, and stirred, centrifuged, washed with water, and dried as described above. To obtain a white powder.

When the obtained white powder was identified by powder X-ray diffraction, it was a powder composed of a ZrO 2 single phase, and as a result of observation with a transmission electron microscope, the average primary particle size was 15 nm.

[Example 1]
As the resin component, a commercially available curable methyl silicone resin (manufactured by GE Toshiba Silicone, product number: TSR-127B) having a high proportion of silicon atoms having one methyl group bonded thereto was used. The resin and the 1-propanol dispersion (5% by mass) of the BaTiO 3 crystal particles obtained above in a mass ratio of [BaTiO 3 dielectric crystal particles] / [curable resin] = 20/80. The mixture was obtained by mixing.

  Spin coating method (about 5cm in length, 5cm in width, 0.7mm thickness glass plate (Asahi Glass Co., Ltd., trade name: AN100)) is applied to almost the entire surface of the mixed liquid obtained above. The number of revolutions was 1000 rpm, and the coating was performed for 20 seconds, followed by drying at 150 ° C. for 10 minutes in an electric furnace in an air atmosphere. After repeating the process consisting of the above-mentioned application-drying five times, the resin component was heated and cured in an electric furnace in an air atmosphere at 250 ° C. for 30 minutes to obtain a glass plate with a cured product.

[Example 2]
A glass plate with a cured product was obtained in the same manner as in Example 1 except that the Ba 0.6 Sr 0.4 TiO 3 crystal particles obtained above were used in place of the BaTiO 3 crystal particles.

[Example 3]
A glass plate with a cured product was obtained in the same manner as in Example 1 except that the CeO 2 crystal particles obtained above were used in place of the BaTiO 3 crystal particles.

[Example 4 (comparative example)]
A glass plate with a cured product was obtained in the same manner as in Example 1 except that Ba 0.7 Sr 0.3 TiO 3 fine particles (manufactured by TPL) manufactured by a hydrothermal synthesis method were used instead of BaTiO 3 crystal fine particles. It was.

[Evaluation of glass plate with cured product]
About the glass plate with hardened | cured material obtained in Examples 1-4, the transmittance | permeability of the glass plate with hardened | cured material was evaluated by the following method about the layer thickness and transmittance | permeability of hardened | cured material. The evaluation results are shown in Table 1.
Layer thickness of cured product: measured using a stylus type surface roughness measuring device (Sloan, DekTak3).
Transmittance: Measured using a spectrophotometer (H-4100, U-4100).

  The hardened | cured material of Examples 1-3 obtained using the resin composition of this invention shows a high visible light transmittance | permeability compared with Example 4. FIG. This is presumably because dielectric crystal particles with few lattice defects and little absorption in the visible light region were used.

[Example 5]
A glass plate with a cured product was obtained in the same manner as in Example 1 except that the ZrO 2 crystal particles obtained above were used in place of the BaTiO 3 crystal particles.
About the obtained glass plate with hardened | cured material, the transmittance | permeability of the glass plate with hardened | cured material was evaluated like the Examples 1-4 about the layer thickness and the transmittance | permeability of hardened | cured material. The evaluation results are shown in Table 2.

As shown in Table 2, the cured product of Example 5 obtained using the resin composition of the present invention exhibits a higher visible light transmittance than that of Example 4. This is presumably because dielectric crystal particles with few lattice defects and little absorption in the visible light region were used.
In particular, the cured product of Example 5 hardly absorbs visible light on the low wavelength side (wavelength 450 nm) and exhibits a very high transmittance. Therefore, the hardened | cured material of Example 5 can be used conveniently for sealing of short wavelength light emitting elements, such as white LED.

  According to the present invention, since the light emitting device can be sealed with a resin having a high refractive index and excellent visible light transmittance, if used for sealing an optical semiconductor device such as an LED, OLED, LD, etc., it is emitted from the optical semiconductor device. It is considered that the extraction efficiency of the emitted light can be increased.

1 is a cross-sectional view of a light-emitting element in an embodiment of the present invention.

Explanation of symbols

1: Light emitting element 2: Resin 3: Circuit board 4: Wiring 5: Bonding pad 6: Wire 7: Semiconductor LED chip

Claims (8)

  1.   Dielectric crystal fine particles having an average primary particle diameter of 5 to 50 nm, obtained by crystallizing a metal oxide in a glass matrix and then removing the glass matrix component, and at least selected from an epoxy resin and a curable silicone resin A curable resin composition for translucent sealing of a light-emitting element, comprising one type of curable resin.
  2. The dielectric crystal fine particles are represented by the general formulas PbZr 1-x Ti x O 3 , BaTi 1-x Zr x O 3 , Ba 1-x Sr x TiO 3 , (Bi 1-x La x ) 4 Ti 3 O 12 , 2. The curable resin according to claim 1, wherein the curable resin is one or more kinds of dielectric crystal fine particles selected from the group consisting of (Sr 1-x Bi x ) 3 Ta 2 O 9 [0 ≦ x ≦ 1] and solid solutions thereof. Composition.
  3. The curable resin composition according to claim 1, wherein the dielectric crystal fine particles are CeO 2 .
  4. The curable resin composition according to claim 1, wherein the dielectric crystal fine particles are ZrO 2 .
  5.   The content ratio of the dielectric crystal fine particles and the resin component is [dielectric crystal fine particles] / [curable resin] = 5/95 to 50/50 in mass ratio. Curable resin composition.
  6.   The composition used for translucent sealing of a light emitting element containing the curable resin composition and organic solvent in any one of Claims 1-5.
  7.   A resin-sealed light emitting device in which an opening through which light passes is sealed with a cured product of the curable resin composition according to claim 1.
  8.   A light emitting chip is installed on a circuit board formed with wiring on a substrate and is electrically connected to the wiring, and the light emitting chip is made of the curable resin composition according to claim 1. A method for producing a resin-sealed light-emitting element, wherein the curable resin composition is heated and cured after coating.
JP2007019278A 2006-01-31 2007-01-30 Curable resin composition for transparent sealing, resin-sealed light-emitting device and method for producing the same Pending JP2007231253A (en)

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WO2009142391A3 (en) * 2008-05-23 2010-01-14 엘지이노텍주식회사 Light-emitting device package and method of manufacturing the same
JP2010037458A (en) * 2008-08-06 2010-02-18 Nitto Denko Corp Resin composition containing fine metal oxide particle
JP2010129906A (en) * 2008-11-28 2010-06-10 National Institute For Materials Science Illumination device for display device and display device
JP2010186845A (en) * 2009-02-12 2010-08-26 Sumitomo Bakelite Co Ltd Resin composition, wavelength conversion composition, wavelength conversion layer, and photovoltaic device including the same
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US8608980B2 (en) 2007-09-03 2013-12-17 National Institute For Materials Science Phosphor, method for producing the same and light-emitting device using the same
WO2009142391A3 (en) * 2008-05-23 2010-01-14 엘지이노텍주식회사 Light-emitting device package and method of manufacturing the same
US9190450B2 (en) 2008-05-23 2015-11-17 Lg Innotek Co., Ltd. Light emitting device package including a substrate having at least two recessed surfaces
US8878229B2 (en) 2008-05-23 2014-11-04 Lg Innotek Co., Ltd. Light emitting device package including a substrate having at least two recessed surfaces
US7982237B2 (en) 2008-05-23 2011-07-19 Lg Innotek Co., Ltd. Light emitting device package including a semiconductor substrate having at least one surface
US8592855B2 (en) 2008-05-23 2013-11-26 Lg Innotek Co., Ltd. Light emitting device package including a substrate having at least two recessed surfaces
US8125000B2 (en) 2008-05-23 2012-02-28 Lg Innotek Co., Ltd. Light emitting device package having dual recessed substrate
US9455375B2 (en) 2008-05-23 2016-09-27 Lg Innotek Co., Ltd. Light emitting device package including a substrate having at least two recessed surfaces
JP2010037458A (en) * 2008-08-06 2010-02-18 Nitto Denko Corp Resin composition containing fine metal oxide particle
US8550645B2 (en) 2008-11-28 2013-10-08 Showa Denko K.K. Illumination device for display device, and display device
JP2010129906A (en) * 2008-11-28 2010-06-10 National Institute For Materials Science Illumination device for display device and display device
JP2010186845A (en) * 2009-02-12 2010-08-26 Sumitomo Bakelite Co Ltd Resin composition, wavelength conversion composition, wavelength conversion layer, and photovoltaic device including the same
US8324654B2 (en) 2010-05-24 2012-12-04 Lg Innotek Co., Ltd. Light emitting device and light unit having the same
US8860072B2 (en) 2010-05-24 2014-10-14 Lg Innotek Co., Ltd. Light emitting device and light unit having the same
EP2390915A1 (en) * 2010-05-24 2011-11-30 LG Innotek Co., Ltd Light emitting device and light unit having the same
WO2014046310A1 (en) * 2012-09-21 2014-03-27 Dow Corning Toray Co., Ltd. Curable silicone composition, and semiconductor sealing material and optical semiconductor device using the same
CN104619779A (en) * 2012-09-21 2015-05-13 道康宁东丽株式会社 Curable silicone composition, and semiconductor sealing material and optical semiconductor device using the same

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