JP2007220902A - 発光装置およびその製造方法 - Google Patents
発光装置およびその製造方法 Download PDFInfo
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- JP2007220902A JP2007220902A JP2006039532A JP2006039532A JP2007220902A JP 2007220902 A JP2007220902 A JP 2007220902A JP 2006039532 A JP2006039532 A JP 2006039532A JP 2006039532 A JP2006039532 A JP 2006039532A JP 2007220902 A JP2007220902 A JP 2007220902A
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- nitride semiconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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Abstract
【解決手段】この発明に従った発光装置の製造方法では、まず発光装置を構成する窒化物半導体基板を準備する基板準備工程(S10)、窒化物半導体基板の表面において電極を形成するべき領域上に保護膜を形成する保護膜形成工程(S20)、保護膜が形成された状態で、窒化物半導体基板の表面に凹凸部を形成する非鏡面化処理工程(S30)、加工工程の後、窒化物半導体基板の表面から前記保護膜を除去する保護膜除去工程(S40)、窒化物半導体基板の表面において保護膜が除去された部分上に電極を形成する電極形成工程(S50)、を実施する。
【選択図】図3
Description
Claims (7)
- 発光装置を構成する窒化物半導体基板を準備する工程と、
前記窒化物半導体基板の表面において電極を形成するべき領域上に保護膜を形成する工程と、
前記保護膜が形成された状態で、前記窒化物半導体基板の表面に凹凸部を形成する加工工程と、
前記加工工程の後、前記窒化物半導体基板の表面から前記保護膜を除去する工程と、
前記窒化物半導体基板の表面において前記保護膜が除去された部分上に電極を形成する工程とを備える、発光装置の製造方法。 - 前記加工工程では、ウェットエッチングを用いて前記窒化物半導体基板の表面に凹凸部を形成し、
前記保護膜は前記ウェットエッチングにおいて用いられるエッチング液による前記窒化物半導体基板のエッチングスピードより、前記エッチング液によるエッチングスピードの遅い材料によって構成される、請求項2に記載の発光装置の製造方法。 - 前記加工工程では、前記エッチング液としてアルカリ性のエッチング液を用い、
前記保護膜を構成する材料は、ニッケル、金、白金、銀、タングステン、モリブデン、パラジウム、銅、クロム、酸化シリコン、酸化窒化シリコン、窒化シリコンからなる群から選択される少なくとも1つを含む、請求項2に記載の発光装置の製造方法。 - 窒化物半導体基板と、前記窒化物半導体基板の第1の主表面の側に、n型窒化物半導体層と、前記窒化物半導体基板から見て前記n型窒化物半導体層より遠くに位置するp型窒化物半導体層と、前記n型窒化物半導体層およびp型窒化物半導体層の間に位置する発光層とを備えた発光装置であって、
前記p型窒化物半導体層の側をダウン実装し、前記窒化物半導体基板の前記第1の主表面と反対側の主表面である第2の主表面から光を放出し、
前記窒化物半導体基板の前記第2の主表面は凹凸部が形成された領域を含み、
前記窒化物半導体基板の前記第2の主表面上に形成された電極を備え、
前記窒化物半導体基板の前記第2の主表面において前記電極の下に位置する領域は、平坦な部分を含む、発光装置。 - 前記平坦な部分は、前記窒化物半導体基板の前記第2の主表面において前記電極の側壁より外側に位置する領域にまで延在する、請求項4に記載の発光装置。
- 前記平坦な部分は、前記窒化物半導体基板の前記第2の主表面において前記電極の側壁より内側に形成されており、
前記凹凸部の一部が前記電極の下にまで延在している、請求項4に記載の発光装置。 - 前記電極の幅は100μm越えであり、
前記電極において前記窒化物半導体基板の前記第2の主表面と対向する表面と反対側に位置する表面には、前記平坦な部分と対向するとともに平坦な領域が形成され、
前記平坦な領域の幅は100μm以上前記電極の幅以下である、請求項4〜6のいずれか1項に記載の発光装置。
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010044422A1 (ja) * | 2008-10-17 | 2010-04-22 | 住友電気工業株式会社 | 窒化物系半導体発光素子、窒化物系半導体発光素子を作製する方法、及び発光装置 |
JP2010114411A (ja) * | 2008-11-06 | 2010-05-20 | Samsung Electro-Mechanics Co Ltd | 化合物半導体発光素子及びその製造方法 |
WO2010079639A1 (ja) * | 2009-01-06 | 2010-07-15 | 株式会社 東芝 | 半導体発光装置およびその製造方法 |
US8188496B2 (en) | 2008-11-06 | 2012-05-29 | Samsung Led Co., Ltd. | Semiconductor light emitting device including substrate having protection layers and method for manufacturing the same |
JP2013074245A (ja) * | 2011-09-29 | 2013-04-22 | Oki Electric Ind Co Ltd | 発光ダイオードの製造方法及び発光ダイオード |
JP2014120776A (ja) * | 2012-12-12 | 2014-06-30 | Seoul Viosys Co Ltd | 発光ダイオード及びその製造方法 |
WO2014199546A1 (ja) * | 2013-06-14 | 2014-12-18 | パナソニックIpマネジメント株式会社 | 発光素子 |
JP2017163111A (ja) * | 2016-03-11 | 2017-09-14 | Dowaエレクトロニクス株式会社 | 半導体光デバイスおよびその製造方法 |
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2006
- 2006-02-16 JP JP2006039532A patent/JP4449919B2/ja not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010044422A1 (ja) * | 2008-10-17 | 2010-04-22 | 住友電気工業株式会社 | 窒化物系半導体発光素子、窒化物系半導体発光素子を作製する方法、及び発光装置 |
JP2010118647A (ja) * | 2008-10-17 | 2010-05-27 | Sumitomo Electric Ind Ltd | 窒化物系半導体発光素子、窒化物系半導体発光素子を作製する方法、及び発光装置 |
JP2010114411A (ja) * | 2008-11-06 | 2010-05-20 | Samsung Electro-Mechanics Co Ltd | 化合物半導体発光素子及びその製造方法 |
US8188496B2 (en) | 2008-11-06 | 2012-05-29 | Samsung Led Co., Ltd. | Semiconductor light emitting device including substrate having protection layers and method for manufacturing the same |
US8916402B2 (en) | 2008-11-06 | 2014-12-23 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device including substrate having protection layers providing protection against chemicals and method for manufacturing the same |
WO2010079639A1 (ja) * | 2009-01-06 | 2010-07-15 | 株式会社 東芝 | 半導体発光装置およびその製造方法 |
US8357557B2 (en) | 2009-01-06 | 2013-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light-emitting device and process for production thereof |
US8659040B2 (en) | 2009-01-06 | 2014-02-25 | Kabushiki Kaisha Toshiba | Semiconductor light-emitting device and process for production thereof |
JP2013074245A (ja) * | 2011-09-29 | 2013-04-22 | Oki Electric Ind Co Ltd | 発光ダイオードの製造方法及び発光ダイオード |
JP2014120776A (ja) * | 2012-12-12 | 2014-06-30 | Seoul Viosys Co Ltd | 発光ダイオード及びその製造方法 |
WO2014199546A1 (ja) * | 2013-06-14 | 2014-12-18 | パナソニックIpマネジメント株式会社 | 発光素子 |
JP2017163111A (ja) * | 2016-03-11 | 2017-09-14 | Dowaエレクトロニクス株式会社 | 半導体光デバイスおよびその製造方法 |
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