JP2007188994A - Packaging device and packaging method of electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging device and packaging method of electronic parts, wherein a positional misalignment of electronic parts caused by an offset or the like of a nozzle center is efficiently and economically recognized to ensure the packaging quality. <P>SOLUTION: The packaging device of electronic parts corrects a position and/or attitude of electronic parts stuck by suction to a nozzle attached in a liftable and rotatable manner to a transfer head movable horizontally, and packages the electronic parts at a packaging position on a board. The packaging device comprises a first recognizing means for recognizing electronic parts stuck to the nozzle, a first calculating means for calculating an offset between the position and attitude of the electronic parts stuck to the nozzle recognized by the first recognizing means and a predetermined reference position and reference attitude, a first correcting means for correcting the position and attitude of the electronic parts stuck to the nozzle based on the offset calculated by the first calculating means, a second recognizing means for recognizing the electronic parts stuck to the nozzle corrected by the first correcting means, a second calculating means for calculating an offset between the position and the reference position of the electronic parts stuck to the nozzle recognized by the second recognizing means, and a second correcting means for correcting the position of the electronic parts stuck to the nozzle based on the offset calculated by the second calculating means. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for picking up an electronic component by a nozzle and mounting the electronic component on a substrate.

  In the field of electronic component mounting, it is required to mount an electronic component at a predetermined mounting position on a substrate in a predetermined posture. Therefore, prior to mounting, the position and orientation of the electronic component sucked by the nozzle with respect to the nozzle center are recognized, and mounting is performed after adjusting the position and rotation angle of the nozzle based on the recognition result and correcting. . The nozzle is rotatably mounted on the transfer head, but the nozzle center may be displaced or inclined at the mounting stage. In addition, even if it is mounted accurately at the mounting stage, the nozzle center may be displaced or tilted due to changes in the working environment such as temperature changes. Furthermore, it may be caused by the processing accuracy of the transfer head itself. As described above, if the nozzle center is displaced, the nozzle center and the rotation axis of the nozzle do not coincide with each other, and the position of the electronic component may change if the nozzle is rotated to change the posture of the electronic component. . For this reason, there is a deviation between the position of the electronic component after correction by adjusting the rotation angle of the nozzle and the position that should be corrected, and the mounting quality is not correctly mounted at the mounting position on the board. There was a problem that decreased.

In order to solve such a problem, conventionally, several electronic components are test-mounted on a dummy substrate, and the position and rotation angle of the nozzle in the subsequent mounting are adjusted based on the result of recognizing the shift of the mounting position. (See Patent Document 1).
JP-A-8-23196

  However, since the dummy substrate is installed by replacing it with a product substrate during mounting operation, the operation must be temporarily interrupted to be inefficient. In addition, the electronic components that are test-mounted on the dummy substrate cannot be reused and become waste components, which is uneconomical.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and mounting method for efficiently and economically recognizing a positional shift of an electronic component caused by a nozzle center shift or the like to ensure mounting quality.

  According to the first aspect of the present invention, an electronic device mounted at a mounting position on a substrate by correcting the position and / or posture of an electronic component adsorbed by a nozzle mounted on a horizontally movable transfer head so as to be movable up and down and rotated. A component mounting apparatus comprising: a first recognizing unit that recognizes an electronic component sucked by the nozzle; a position and a posture of the electronic component sucked by the nozzle recognized by the first recognizing unit; A first calculation means for calculating a deviation amount from a determined reference position and reference posture; and a position correction of the electronic component adsorbed by the nozzle based on the deviation amount calculated by the first calculation means; A first correcting unit that performs posture correction; a second recognizing unit that recognizes an electronic component sucked by the nozzle corrected by the first correcting unit; and the second recognizing unit that is recognized by the second recognizing unit. Sucking into the nozzle A second computing means for computing a deviation amount between the position of the electronic component and the reference position, and a position of the electronic component adsorbed by the nozzle based on the deviation amount computed by the second computing means Second correction means for performing correction is provided.

The invention according to claim 2 further comprises storage means for storing the deviation amount calculated by the second calculation means in the invention according to claim 1, wherein the second correction means is stored in the storage means. Based on the stored deviation amount, the position of another electronic component sucked by the nozzle is corrected.

  According to a third aspect of the invention, there is provided the judging means according to the first or second aspect, further comprising a judging means for judging whether or not the deviation amount calculated by the second calculating means exceeds a predetermined threshold value. The position correction by the second correction unit is not performed when the determination unit determines that the deviation amount does not exceed a predetermined threshold value.

  The invention according to claim 4 is the invention according to any one of claims 1 to 3, further comprising update means for updating the reference position based on the deviation amount calculated by the second calculation means, The first calculation means and the second calculation means perform calculation based on a deviation amount between the reference position updated by the update means and the position of the electronic component sucked by the nozzle.

  The invention according to claim 5 is the electronic component mounting apparatus according to any one of claims 1 to 4, wherein a plurality of the nozzles are mounted on the transfer head. Based on the amount of deviation calculated by the second calculating means, the position of the electronic component attracted by another nozzle is corrected by the second correcting means.

  According to a sixth aspect of the present invention, there is provided an electronic device which is mounted at a mounting position on a substrate by correcting the position and / or posture of an electronic component adsorbed by a nozzle mounted on a horizontally movable transfer head so as to be moved up and down and rotated. A component mounting method, a first recognition step for recognizing an electronic component sucked by the nozzle, a position and orientation of the electronic component recognized in the first recognition step, and a predetermined reference position And a first calculation step for calculating a deviation amount from the reference posture, and a first correction step for correcting the position and posture of the electronic component attracted to the nozzle based on the deviation amount calculated in the first calculation step. The first recognition step, the second recognition step for recognizing the electronic component sucked by the nozzle whose position and orientation have been corrected in the first correction step, and the nozzle recognized in the second recognition step. A second calculation step of calculating a deviation amount between the position of the attached electronic component and the reference position; and an electronic component adsorbed by the nozzle based on the deviation amount calculated in the second calculation step. A second correction step of performing position correction.

  According to the present invention, the position and / or orientation of the electronic component sucked by the nozzle is recognized, and the electronic component sucked by the nozzle is mounted after being aligned with the mounting position on the substrate. Thus, it is possible to efficiently and economically recognize the displacement of the electronic component caused by the above and ensure the mounting quality.

An embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view showing a mounting apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing a configuration of correction means according to an embodiment of the present invention, and FIG. 3A is an embodiment of the present invention. FIG. 3B is an explanatory diagram for explaining the recognition by the second recognition means in the embodiment of the present invention, and FIG. 4 is an embodiment of the present invention. FIG. 5 is an explanatory diagram illustrating nozzle rotation position data according to an embodiment of the present invention, and FIG. 6 is a flowchart illustrating a mounting method according to the embodiment.

In FIG. 1, a substrate transport mechanism that transports a substrate and holds it at a predetermined position and a substrate guide 2 that is a holding mechanism are disposed substantially at the center on the base 1. Along the X direction. In the present invention, the conveyance direction of the substrate 3 is the X direction, and the direction orthogonal to the substrate 3 in the horizontal plane is the Y direction.

  Electronic component supply mechanisms 4 are arranged in parallel on both sides of the substrate guide 2 in the Y direction. The electronic component supply mechanism 4 can be constituted by a parts feeder such as a tape feeder or a bulk feeder. The electronic component supply mechanism 4 stores a plurality of electronic components and sequentially supplies them to a supply port 5 where the electronic components are picked up. Each electronic component supply mechanism 4 stores electronic components of the same type or different types, and a plurality of types of electronic components can be mounted on one substrate 3.

  A pair of Y tables 6 are disposed at both ends in the X direction of the base 1, and an X table 7 is constructed on the pair of Y tables 6. A transfer head 8 is mounted on the X table 7. The Y table 6 and the X table 7 serve as moving means for the transfer head 8. By combining the driving of the Y table 6 and the X table 7, the transfer head 8 can be connected to the supply port 5 of the electronic component supply mechanism 4 and the substrate. It is possible to move in the area including 3.

  In FIG. 2, a plurality of nozzle units 9 are mounted on the transfer head 8. A nozzle 10 is mounted at the lower end of each nozzle unit 9, and each nozzle 10 is configured to be moved up and down in the Z direction and rotated in the θ direction (around the Z axis) by a Z axis drive mechanism 11 and a θ drive mechanism 12. ing. Each nozzle 10 is provided with an intake / exhaust mechanism (not shown). When picking up an electronic component, the inside of the nozzle is sucked and held by suction, and when mounting the electronic component, the nozzle is mounted. By evacuating the inside, a so-called vacuum break is performed to release the electronic component.

  The transfer head 8 is provided with a camera 13 as an imaging means for imaging the electronic component supplied to the supply port 5 of the electronic component supply mechanism 4, and the camera 13 moves integrally with the nozzle 10. The image of the supply port 5 captured by the camera 13 is transmitted as image data to the image recognition unit 14 and subjected to image processing, and the position and orientation of the electronic component are recognized. Based on this recognition result, the pickup operation of the electronic component by the nozzle 10 is controlled. That is, the control unit 15 controls the X table 7, the Y table 6, and the θ drive mechanism 12, thereby positioning the center of the nozzle 10 vertically above the center part of the electronic component and controlling the Z axis drive mechanism 11. By doing so, the nozzle 10 is lowered and raised after adsorbing the electronic component to the lower end of the nozzle 10. This series of operations completes the electronic component pickup. The storage unit 16 stores electronic component size data, an offset amount between the imaging center of the camera 13 and the center of each nozzle 10, and the like as basic data. In the control unit 15 based on these basic data. A control amount is determined.

  In FIG. 1, a camera 17 is disposed between the substrate guide 2 and the electronic component supply mechanism 4 as an imaging unit that images the electronic component sucked by the nozzle 10. An image captured by the camera 17 is transmitted to the image recognition unit 14 as image data and subjected to image processing. By this image processing, the position and posture of the electronic component sucked by the nozzle 10 are recognized. As described above, the camera 17 and the image recognition unit 14 function as a first recognition unit that recognizes the electronic component sucked by the nozzle 10.

  In FIG. 1, a nozzle stocker 18 in which a plurality of types of nozzles 10 are housed is disposed on the side of the camera 17. Each nozzle 10 is prepared in a form corresponding to the type of electronic component stored in the electronic component supply mechanism 4. The nozzle 10 is detachable from the nozzle unit 9 and can be exchanged for another type of nozzle 10 by moving the transfer head 8 above the nozzle stocker 18 and moving the nozzle 10 up and down. It is also possible for the operator to manually replace the nozzle 10.

  Next, correction of the position and posture of the electronic component sucked by the nozzle 10 will be described. As described above, the electronic component is sucked and picked up so that the central portion is sucked to the reference position, that is, the nozzle center, and the reference posture, that is, the posture that forms a predetermined angle with respect to the nozzle 10 in the θ direction. However, there are cases where the chuck is attracted in a state of being deviated from the reference position or reference posture due to errors due to processing accuracy of the mounting apparatus itself or various factors. Therefore, prior to mounting, the position and orientation of the electronic component sucked by the nozzle 10 are recognized by the first recognition means, and the calculation unit 19 compares the position and orientation with the reference position and calculates the respective deviation amounts. . Note that the reference position and reference posture are determined in advance for each type of electronic component and stored in the storage unit 16. The calculation unit 19 calculates the amount of deviation between the position and orientation of the electronic component adsorbed by the nozzle 10 recognized by the first recognition means (camera 17 and image recognition unit 14) and a predetermined reference position and reference orientation. It functions as a first computing means for computing.

  In FIG. 2, the position and orientation of the electronic component P imaged by the camera 17 while being adsorbed by the nozzle 10 are subjected to image processing by the image recognition unit 14 and recognized as shown in FIG. In FIG. 3A, a rectangular body a indicates an electronic component P imaged by the camera 17, and a rectangular body b indicates an electronic component in a reference position and a reference posture. The rectangular body a has a deviation of Δx1 in the X direction, Δy1 in the Y direction, and an angle Δθ in the θ direction with respect to the rectangular body b. That is, the electronic component P sucked by the nozzle 10 is sucked by Δx1 in the X direction, Δy1 in the Y direction, and an angle Δθ in the θ direction with respect to the nozzle center. Accordingly, the correction of the position and orientation of the electronic component P attracted to the nozzle 10 is performed by controlling the X table 7, the Y table 6, and the θ drive mechanism 12 using the shift amounts Δx1, Δy1, and Δθ as control amounts. As described above, the X table 7, the Y table 6, the θ drive mechanism 12, and the control unit 15 that controls the driving of the X table 7, the Y table 6, the nozzle 10 based on the deviation amount calculated by the calculation unit 19 (first calculation means). It functions as a first correction unit that corrects the position and orientation of the sucked electronic component.

  By the way, although the nozzle 10 is rotatably mounted on the transfer head 8, there may be a case where the nozzle center is displaced or inclined at the mounting stage. In addition, even if it is mounted accurately at the mounting stage, the nozzle center may be displaced or tilted due to changes in the working environment such as temperature changes. Furthermore, it may be caused by the processing accuracy of the transfer head itself. Thus, if there is a deviation in the nozzle center, the rotation center of the nozzle center and the nozzle 10 do not coincide with each other, and if the nozzle 10 is rotated to change the posture of the electronic component, the position of the electronic component will also change. There is. For this reason, a deviation occurs between the position of the electronic component after the correction by adjusting the rotation angle of the nozzle 10 and the position that should be corrected, and the mounting is not performed correctly at the mounting position on the board. Quality deteriorates. For this reason, the corrected electronic component is imaged again by the camera 17, and the position of the electronic component is re-recognized. The re-recognized position of the electronic component is compared with the reference position by the calculation unit 19 to calculate a deviation amount. The deviation amount calculated by the calculation unit 19 is used as an alignment correction amount when the electronic component adsorbed by the nozzle 10 is mounted at the mounting position on the substrate. The camera 17 and the image recognition unit 14 function as second recognition means for recognizing the electronic component adsorbed by the nozzle 10 corrected by the first correction means. The computing unit 19 computes the amount of deviation between the position of the electronic component adsorbed by the nozzle 10 recognized by the camera 17 and the image recognition unit 14 (second recognition means) and a predetermined reference position. It functions as the second computing means.

In FIG. 3B, a rectangular body c indicates the corrected electronic component imaged by the camera 17. The rectangular body c is at a position of Δx2 and Δy2 in the Y direction with respect to the rectangular body b at the reference position. That is, the corrected electronic component has a deviation of Δx2 in the X direction and Δy2 in the Y direction with respect to the reference position. The deviation amounts Δx2, Δy2 are calculated by the second calculation means and stored in the storage unit 16. By controlling the operations of the X table 7 and the Y table 6 based on the shift amounts Δx2 and Δy2 stored in the storage unit 16, the position of the electronic component attracted by the nozzle 10 is corrected, and a predetermined mounting on the board is performed. Mounted aligned with the position. in this way,
The X table 7 and the Y table 6 and the control unit 15 for controlling the driving of the X table 7 and the Y table 6 are attracted to the nozzle 10 based on the deviation amount calculated by the calculation unit 19 (second calculation means) and stored in the storage unit 16. It functions as a second correcting means for correcting the position of the electronic component.

  In this way, the corrected electronic component is recognized again, and the recognized shift amount of the electronic component is used as an alignment correction amount when the electronic component sucked by the nozzle 10 is aligned with the mounting position on the substrate. By doing so, the deterioration of the mounting quality of electronic components due to nozzle center misalignment, etc. is avoided, so there is no need to interrupt mounting operations or use dummy boards or test mounting electronic components. Electronic components can be mounted efficiently and economically.

  The corrected electronic component deviation amounts Δx2 and Δy2 stored in the storage unit 16 can be used as alignment correction amounts when mounting other electronic components attracted to the same nozzle 10. Thereby, when a new electronic component is mounted, it is not necessary to perform recognition of the electronic component by the second recognition unit and calculation by the second calculation unit, and the mounting efficiency can be improved.

  Further, a threshold value that allows the corrected electronic component shift amount is stored in the storage unit 16 in advance, and when the shift amounts Δx2 and Δy2 do not exceed the threshold value, the second correction unit performs the correction again. It is also possible to mount an electronic component that has been corrected only by the first correction means without being performed. That is, if the corrected electronic component displacement amounts Δx2, Δy2 do not exceed the predetermined threshold, it can be determined that the displacement of the center of the nozzle 10 is relatively small, and the second correction unit performs the correction again. This is because the mounting quality can be ensured even if it is not performed. Thereby, the correction by the second correction means can be omitted, and the mounting efficiency can be improved. If the nozzle center deviation is relatively large, it is difficult to ensure the mounting quality. Therefore, another threshold value is stored in the storage unit 16, and the corrected electronic component deviation amounts Δx2 and Δy2 are the same. When the threshold value is exceeded, it is possible to provide a warning to the operator or to interrupt the mounting operation. The comparison between the threshold values and the corrected electronic component deviation amounts Δx2 and Δy2 is performed by the arithmetic unit 19, and the arithmetic unit 19 determines that the corrected electronic component deviation amounts Δx2 and Δy2 exceed a predetermined threshold value. It also functions as a determination means for determining whether or not the

  Further, the reference position stored in the storage unit 16 can be updated based on the corrected electronic component deviation amounts Δx2, Δy2 recognized by the second recognition means. For example, as shown in FIG. 3B, the corrected electronic component has a deviation of Δx2 in the X direction and Δy2 in the Y direction. Therefore, the reference position is −Δx2 in the X direction and −Δx in the Y direction. Update to a position shifted by Δy2. When correction is performed by the first correction unit with the updated reference position as a target, the electronic component sucked by the nozzle 10 is corrected to a position that is the original reference position. As a result, the mounting quality can be ensured only by the correction by the first correction unit, the correction by the second correction unit can be omitted, and the mounting efficiency can be improved. The update of the reference position is performed by the calculation unit 19, and the calculation unit 19 also functions as an update unit that updates the reference position based on the displacement amounts Δx2 and Δy2 of the electronic components calculated by the second calculation unit.

  As shown in FIG. 2, the transfer head 8 is provided with a plurality of nozzle units 9, and each nozzle unit is provided with a nozzle 10 that is independently driven by θ. Therefore, if the transfer head 8 itself is tilted, the nozzle centers of all the nozzles 10 are tilted. In such a case, the shift amounts Δx2 and Δy2 in which the electronic component sucked by the arbitrary nozzle 10 is recognized can be used as the alignment correction amount when mounting the electronic component sucked by the other nozzle 10. .

By the way, the recognition of the electronic component by the second recognizing means is performed in such a posture that the electronic component sucked by the nozzle 10 becomes 0 degrees with respect to the camera 17 (as shown in FIG. 3B). (Lateral orientation with the sides parallel to the Y direction and X direction). On the other hand, the electronic component that has been recognized by the second recognition unit is mounted after the posture is changed based on the mounting posture stored in the storage unit 16. The posture of the electronic component is changed by rotating the nozzle 10. For example, the electronic component is rotated 90 degrees (vertical posture), 180 degrees (horizontal posture), or 270 degrees (vertical posture) clockwise. The posture is changed.

  FIG. 4 shows the locus of the nozzle tip when the nozzle 10 makes one revolution. The rotation center f of the nozzle 10 when the center of the nozzle 10 has a shift or the like is a position shifted from the rotation center g when the nozzle 10 has no shift or the like. Further, the nozzle tip rotates to draw a locus h of an ellipse in plan view. In the figure, i, j, k, and l indicate the position of the tip of the nozzle 10 when the rotation angle of the nozzle 10 is 0 degree, 90 degrees, 180 degrees, and 270 degrees. As described above, if there is a deviation in the nozzle center, the position of the tip of the nozzle 10 varies depending on the rotation angle of the nozzle 10. And the Y direction.

  In order to avoid such a problem, as shown in FIG. 5, the position of the tip of each nozzle (nozzle No. 1, 2, 3,...) Is measured in advance, and the rotation center for each nozzle is measured. The positions of x1c, y1c... are calculated. The rotation center x1c, y1c... Of the nozzle 10 is calculated from the trajectory of the electronic component when the electronic component sucked by the nozzle 10 is rotated once (360 degrees) above the camera 17, and is detected by the image recognition unit 14. It is calculated by recognizing the locus of the electronic component and obtaining the center of the locus of the electronic component by the calculation unit 19. Since the mounting posture of the electronic component is generally 0 degree, 90 degrees, 180 degrees, or 270 degrees, the nozzle 10 when rotated to 0 degrees, 90 degrees, 180 degrees, or 270 degrees for each nozzle. Are stored in advance, and the position of the electronic component whose posture is changed to these mounting postures is corrected.

  Next, an electronic component mounting method will be described with reference to the flowchart shown in FIG. First, an electronic component is adsorbed to the nozzle 10 mounted on the transfer head 8 that can move horizontally so as to be movable up and down (ST1). Next, the transfer head 8 is moved, and the electronic component sucked by the nozzle 10 is moved to the recognition position, that is, above the camera 17 (ST2). Then, the electronic component is imaged by the camera 17 and image processing is performed by the image recognition unit 14 to recognize the position and posture of the electronic component (first recognition step ST3). The position and posture of the electronic component recognized in the first recognition step are compared with a predetermined reference position and reference posture, and deviation amounts Δx1, Δy1, and Δθ between them are calculated (first calculation step... -ST4). Next, position correction and posture correction of the electronic component sucked by the nozzle 10 are performed based on the deviation amounts Δx1, Δy1, and Δθ calculated in the first calculation step (first correction step... ST5). The electronic components that have been subjected to position correction and posture correction in the first correction step are imaged again by the camera 17 and the position is recognized (second recognition step... ST6). The position of the electronic component recognized in the second recognition step The reference position is again compared with the reference position, and the deviation amounts Δx2, Δy2 between them are calculated (second calculation step... ST7). The deviation amounts Δx2 and Δy2 are used as correction amounts when the electronic component is mounted at a predetermined mounting position on the board, and are adsorbed by the nozzle 10 based on the deviation amounts Δx2 and Δy2 calculated in the second calculation step. Electronic component position correction is performed (second correction step ST8). Then, the electronic component whose position has been corrected is mounted at a predetermined mounting position on the substrate (ST9).

By repeating the series of steps ST1 to ST9, predetermined electronic components are respectively mounted at a plurality of mounting positions on the substrate. Note that the second recognition step (ST6), the second calculation step (ST7), and the second correction step (ST8) are not necessarily performed for each mounting. For example, it is effective to periodically perform a shift or inclination in the nozzle center caused by a change in work environment such as a temperature change when a predetermined time elapses or after a predetermined number of electronic components are mounted. Further, it is effective to perform the deviation or inclination of the nozzle center due to the processing accuracy of the transfer head or the nozzle itself immediately after the start of mounting or when the nozzle 10 is replaced. Further, the deviation amounts Δx2 and Δy2 calculated in the second calculation step (ST7) are used as correction amounts when a new electronic component is mounted with the same nozzle, so that the second recognition step (ST6). In addition, the second calculation step (ST7) can be omitted, and the mounting efficiency can be improved.

  As described above, the electronic component sucked by the nozzle 10 is recognized by the first recognition step and the second recognition step, and the position and / or orientation of the electronic component is corrected based on the recognition result, and a predetermined value on the substrate is determined. By mounting at the mounting position, the deterioration of the mounting quality of electronic components due to nozzle center misalignment etc. is avoided, so mounting operation is interrupted and dummy boards and electronic components for test mounting are required Thus, electronic components can be mounted efficiently and economically.

  It is also possible to include a step of calculating the rotation center position of the nozzle 10 by rotating the upper portion of the camera 17 once while the electronic component is attracted to the nozzle 10. By including this step, it is possible to improve the mounting quality by correcting the position of the electronic component whose posture is changed to a predetermined mounting posture when mounting the electronic component.

  According to the electronic component mounting apparatus and mounting method of the present invention, the position and / or orientation of the electronic component sucked by the nozzle is recognized, and the electronic component sucked by the nozzle is aligned and corrected to the mounting position on the substrate. Therefore, it has the advantage that it can efficiently and economically recognize the displacement of the electronic component due to the displacement of the nozzle center, etc., and ensure the mounting quality. This is useful in the field of mounting electronic components to be mounted on a substrate.

The top view which shows the mounting apparatus in one embodiment of this invention The block diagram which shows the structure of the correction | amendment means in one embodiment of this invention (A) Explanatory drawing explaining the recognition by the 1st recognition means in one embodiment of this invention (b) Explanatory drawing explaining the recognition by the 2nd recognition means in one embodiment of this invention Explanatory drawing explaining rotation operation | movement of the nozzle in one embodiment of this invention Explanatory drawing which shows the rotational position data of the nozzle in one embodiment of this invention The flowchart which shows the mounting method in one embodiment

Explanation of symbols

3 Substrate 6 Y table 7 X table 8 Transfer head 10 Nozzle 14 Image recognition unit 15 Control unit 16 Storage unit 17 Camera 19 Calculation unit P Electronic component

Claims (6)

An electronic component mounting apparatus that corrects the position and / or posture of an electronic component adsorbed by a nozzle mounted on a horizontally movable transfer head so as to be movable up and down, and mounts it on a mounting position on a substrate.
First recognition means for recognizing the electronic component sucked by the nozzle, position and posture of the electronic component sucked by the nozzle recognized by the first recognition means, and a predetermined reference position and reference posture And a first correction unit that performs position correction and posture correction of the electronic component attracted to the nozzle based on the shift amount calculated by the first calculation unit. Means, a second recognizing means for recognizing the electronic component sucked by the nozzle corrected by the first correcting means, and an electronic component sucked by the nozzle recognized by the second recognizing means. A second calculating means for calculating a shift amount between a position and the reference position; and a second correction for correcting the position of the electronic component sucked by the nozzle based on the shift amount calculated by the second calculating means. Correction hand Mounting apparatus of electronic components, characterized in that it comprises a. Further comprising storage means for storing the deviation amount calculated by the second calculation means;
2. The electronic component mounting according to claim 1, wherein the second correction unit corrects a position of another electronic component sucked by the nozzle based on the shift amount stored in the storage unit. Measure. A judgment means for judging whether or not the deviation amount calculated by the second calculation means exceeds a predetermined threshold;
3. The electronic device according to claim 1, wherein the position correction by the second correction unit is not performed when the determination unit determines that the deviation amount does not exceed a predetermined threshold value. 4. Component mounting equipment. Update means for updating the reference position based on the deviation amount calculated by the second calculation means;
The first calculation means and the second calculation means perform calculation based on a deviation amount between the reference position updated by the update means and the position of the electronic component sucked by the nozzle. The electronic component mounting apparatus according to claim 1.   5. The electronic component mounting apparatus according to claim 1, wherein a plurality of the nozzles are mounted on the transfer head, and the electronic component sucked by at least one nozzle is calculated by the second calculation means. An electronic component mounting apparatus, wherein the second correction means corrects the position of an electronic component attracted by another nozzle based on the shift amount. An electronic component mounting method for correcting the position and / or orientation of an electronic component adsorbed by a nozzle mounted on a horizontally movable transfer head so as to be moved up and down and rotating, and mounting the electronic component at a mounting position on a substrate,
A first recognition step for recognizing the electronic component sucked by the nozzle, and a deviation amount between the position and posture of the electronic component recognized in the first recognition step and a predetermined reference position and reference posture. A first calculation step for calculating, a first correction step for correcting the position and posture of the electronic component sucked by the nozzle based on the shift amount calculated in the first calculation step, A second recognition step for recognizing the electronic component sucked by the nozzle whose position and orientation have been corrected in one correction step; and a position of the electronic component sucked by the nozzle recognized in the second recognition step; A second calculation step for calculating a deviation amount with respect to the reference position; and a second supplementary step for correcting the position of the electronic component attracted to the nozzle based on the deviation amount calculated in the second calculation step. Mounting method of electronic components, which comprises a step.

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