JP2007176787A5 - - Google Patents

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Publication number
JP2007176787A5
JP2007176787A5 JP2006309207A JP2006309207A JP2007176787A5 JP 2007176787 A5 JP2007176787 A5 JP 2007176787A5 JP 2006309207 A JP2006309207 A JP 2006309207A JP 2006309207 A JP2006309207 A JP 2006309207A JP 2007176787 A5 JP2007176787 A5 JP 2007176787A5
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JP
Japan
Prior art keywords
tape
composition
article
composition according
layer
Prior art date
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Granted
Application number
JP2006309207A
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English (en)
Japanese (ja)
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JP5022675B2 (ja
JP2007176787A (ja
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Priority claimed from US11/543,742 external-priority patent/US7687417B2/en
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Publication of JP2007176787A publication Critical patent/JP2007176787A/ja
Publication of JP2007176787A5 publication Critical patent/JP2007176787A5/ja
Application granted granted Critical
Publication of JP5022675B2 publication Critical patent/JP5022675B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006309207A 2005-11-16 2006-11-15 鉛フリーのガラス、厚膜ペースト、テープの組成物およびそれから作製した低温共焼成したセラミックデバイス Expired - Fee Related JP5022675B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US73728005P 2005-11-16 2005-11-16
US60/737,280 2005-11-16
US11/543,742 2006-10-05
US11/543,742 US7687417B2 (en) 2005-11-16 2006-10-05 Lead free glass(es), thick film paste(s), tape composition(s) and low temperature cofired ceramic devices made therefrom

Publications (3)

Publication Number Publication Date
JP2007176787A JP2007176787A (ja) 2007-07-12
JP2007176787A5 true JP2007176787A5 (https=) 2009-11-26
JP5022675B2 JP5022675B2 (ja) 2012-09-12

Family

ID=37734924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006309207A Expired - Fee Related JP5022675B2 (ja) 2005-11-16 2006-11-15 鉛フリーのガラス、厚膜ペースト、テープの組成物およびそれから作製した低温共焼成したセラミックデバイス

Country Status (6)

Country Link
US (4) US7687417B2 (https=)
EP (1) EP1787963B1 (https=)
JP (1) JP5022675B2 (https=)
KR (3) KR100840109B1 (https=)
CN (1) CN1974450B (https=)
TW (1) TW200804226A (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
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US20090316060A1 (en) * 2008-06-18 2009-12-24 3M Innovative Properties Company Conducting film or electrode with improved optical and electrical performance
EP2411987A4 (en) * 2009-03-23 2015-01-07 Sba Materials Inc NOVEL DIELECTRIC OXIDE FILMS AND MANUFACTURING METHOD THEREOF
KR101141499B1 (ko) * 2009-10-09 2012-05-08 연세대학교 산학협력단 세라믹기판용 유리 조성물
US8633858B2 (en) * 2010-01-29 2014-01-21 E I Du Pont De Nemours And Company Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom
CN101923911B (zh) * 2010-04-27 2011-11-02 电子科技大学 基于不锈钢基板的ybco厚膜电阻浆料及其制备方法
WO2012161612A1 (en) * 2011-05-23 2012-11-29 Autonomous Non-Commercial Organization "Research Institute "Sitronics Labs"" Electronically beam steerable antenna device
EP2715788A1 (en) 2011-06-01 2014-04-09 E. I. Du Pont de Nemours and Company Low temperature co-fired ceramic structure for high frequency applications and process for making same
US20130052433A1 (en) 2011-08-29 2013-02-28 E I Du Pont De Nemours And Company Compositions for low k, low temperature co-fired composite (ltcc) tapes and low shrinkage, multi-layer ltcc structures formed therefrom
CN103936401B (zh) * 2013-11-25 2016-08-17 云南银峰新材料有限公司 一种低介电常数微波介质陶瓷材料的制备方法
WO2016208851A1 (ko) * 2015-06-23 2016-12-29 주식회사 베이스 Led용 유리의 제조 방법
CN105006611A (zh) * 2015-06-29 2015-10-28 南京理工大学 微波毫米波高抑制带通滤波器组
CN105070984A (zh) * 2015-06-29 2015-11-18 南京理工大学 基于ltcc与dgs技术的shf波段高性能滤波器组
WO2017010730A1 (ko) * 2015-07-14 2017-01-19 주식회사 베이스 유리 프릿을 활용한 색변환 소재를 포함하는 led 칩 스케일 패키지 및 그 제조방법
CN105006618A (zh) * 2015-08-07 2015-10-28 南京理工大学 一种基于ltcc和dgs的微型多路滤波器组
TWI585793B (zh) * 2015-11-18 2017-06-01 Prosperity Dielectrics Co Ltd 低溫共燒陶瓷微波介電陶瓷及其製造方法
CN106946567B (zh) * 2017-03-10 2019-10-11 南通通州湾新材料科技有限公司 一种铁铝金属间化合物与ZrO2复相材料手机陶瓷背板的制备方法
CN107134614B (zh) * 2017-05-05 2019-05-21 电子科技大学 一种多层陶瓷微波带通滤波器
CN107056312B (zh) * 2017-06-05 2019-10-11 武汉科技大学 一种硅质可塑料及其制备方法
CN107324808A (zh) * 2017-07-01 2017-11-07 朱胜利 无机非金属材料的增强方法及用于增强碳化硅陶瓷的方法
CN107285809B (zh) * 2017-08-07 2020-06-16 钱炜文 一种环保型硅藻土组合物及其应用
US10511099B2 (en) * 2017-10-09 2019-12-17 Aeroantenna Technology, Inc. Dual-band shaped-pattern quadrifilar helix antenna
JP6787955B2 (ja) * 2018-08-01 2020-11-18 双信電機株式会社 フィルタ
US11524918B2 (en) 2018-11-26 2022-12-13 Owens Corning Intellectual Capital, Llc High performance fiberglass composition with improved specific modulus
PL3887329T3 (pl) 2018-11-26 2024-06-03 Owens Corning Intellectual Capital, Llc Wysokowydajna kompozycja włókna szklanego o ulepszonym module sprężystości
CN109687065B (zh) * 2018-12-24 2020-11-06 瑞声精密制造科技(常州)有限公司 Ltcc滤波器
CN110357419B (zh) * 2019-07-18 2022-05-06 成都宏科电子科技有限公司 一种玻璃组合物和毫米波低温共烧陶瓷材料及其制备方法
CN111276782A (zh) * 2019-12-31 2020-06-12 南京理工大学 一种基于ltcc的宽带带通滤波器
CN111276776A (zh) * 2019-12-31 2020-06-12 南京理工大学 一种基于ltcc的新型带通滤波器
CN113213949B (zh) * 2021-03-10 2022-11-01 安徽华封电子科技有限公司 一种可电镀或化学镀的高频低损耗ltcc基板材料及其制备方法

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US4547467A (en) * 1983-06-22 1985-10-15 Burroughs Corporation Dielectric composition and devices using it
JPS60221338A (ja) * 1984-04-12 1985-11-06 Ohara Inc 光学ガラス
US4655864A (en) * 1985-03-25 1987-04-07 E. I. Du Pont De Nemours And Company Dielectric compositions and method of forming a multilayer interconnection using same
US4830988A (en) * 1986-10-02 1989-05-16 General Electric Company Dielectric inks for multilayer copper circuits
US4861646A (en) * 1987-08-13 1989-08-29 Ceramics Process Systems Corp. Co-fired metal-ceramic package
US5258335A (en) 1988-10-14 1993-11-02 Ferro Corporation Low dielectric, low temperature fired glass ceramics
US5164342A (en) 1988-10-14 1992-11-17 Ferro Corporation Low dielectric, low temperature fired glass ceramics
TW524786B (en) 1998-01-23 2003-03-21 Du Pont Glass composition, castable dielectric composition and tape composition made therewith
US6228788B1 (en) * 1998-08-21 2001-05-08 Advanced Ceramic X Corporation High-frequency ceramic inductor formulation
FR2793241B1 (fr) * 1999-05-06 2002-03-08 Corning Inc Composition de verre borate dope a l erbium
JP4689019B2 (ja) * 1999-12-28 2011-05-25 石塚硝子株式会社 抗菌性付与用ガラス組成物、及びそれを用いた抗菌性高分子複合材料、抗菌性高分子複合材料成形体
JP2004515365A (ja) * 2000-12-15 2004-05-27 エグシル テクノロジー リミテッド 半導体材料のレーザー加工
DE10102296C1 (de) 2001-01-19 2002-02-21 Schott Glas Gläser mit hohem spezifischen Elastizitätsmodul und deren Verwendung
US6835682B2 (en) 2002-06-04 2004-12-28 E. I. Du Pont De Nemours And Company High thermal expansion glass and tape composition
US6841493B2 (en) * 2002-06-04 2005-01-11 E. I. Du Pont De Nemours And Company High K glass and tape composition for use at high frequency
DE102004026433A1 (de) * 2004-05-29 2005-12-22 Schott Ag Nanoglaspulver und deren Verwendung

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