JP2007173095A - Substrate laminate and composite electronic component - Google Patents

Substrate laminate and composite electronic component Download PDF

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Publication number
JP2007173095A
JP2007173095A JP2005370354A JP2005370354A JP2007173095A JP 2007173095 A JP2007173095 A JP 2007173095A JP 2005370354 A JP2005370354 A JP 2005370354A JP 2005370354 A JP2005370354 A JP 2005370354A JP 2007173095 A JP2007173095 A JP 2007173095A
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Prior art keywords
contact pattern
pattern forming
sliding contact
forming portion
switch
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JP2005370354A
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Japanese (ja)
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Masahito Suyama
真仁 須山
Tetsuji Namiki
哲二 並木
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Teikoku Tsushin Kogyo Co Ltd
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Teikoku Tsushin Kogyo Co Ltd
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Priority to JP2005370354A priority Critical patent/JP2007173095A/en
Publication of JP2007173095A publication Critical patent/JP2007173095A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate laminate which has a small number of components and is easy for assembling and of which the thickness can be made thinner, and provide a composite electronic component. <P>SOLUTION: The substrate laminate is composed of one flexible circuit board 110 in which a sliding contact pattern forming part 130 provided with a sliding contact pattern 137 with which a sliding piece 60 makes a siding contact, a contact point pattern forming part 150 provided with switch contact point patterns 151a, 151b for a push switch 151, and an intermediate part 140 fixed between the sliding contact pattern forming part 130 and the contact point forming part 150, are combined by combining parts 173, 175. The sliding contact pattern 137 and the switch contact point patterns 151a, 151b are formed on the same face of the flexible circuit board 110, and the face of the sliding contact pattern forming part 130 where the sliding contact pattern 137 is provided is taken as an upper face, under which the intermediate part 140 and the contact point pattern forming part 150 are laminated in this order, and the sliding contact pattern 137 and the switch contact point patterns 151a, 151b are arranged facing the same face side. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、複数枚の基板を重ね合わせて構成される基板積層体及びこの基板積層体を用いて構成される複合型電子部品に関するものである。   The present invention relates to a substrate laminate formed by stacking a plurality of substrates and a composite electronic component configured using the substrate laminate.

従来押圧スイッチ付きの回転式電子部品は、例えば特許文献1に示すように、合成樹脂製の取付板の上面にフレキシブル回路基板を設置してその上に回動自在に回転体を設置し、回転体の下面に取り付けた摺動子を前記フレキシブル回路基板に設けた摺接パターンに摺接させることで摺接パターンの出力を変化するとともに、前記取付板の下面側に押圧用スイッチを設けたフレキシブル回路基板を設置してその上に前記回転体を貫通して上下動する押釦つまみを設置し、押釦つまみを押圧することで前記押圧用スイッチをオンオフ操作するように構成されている。   Conventional rotary electronic components with a pressure switch are, for example, as shown in Patent Document 1, a flexible circuit board is installed on the upper surface of a synthetic resin mounting plate, and a rotating body is rotatably installed on the flexible circuit board. The sliding element attached to the lower surface of the body is slidably brought into contact with the sliding pattern provided on the flexible circuit board to change the output of the sliding contact pattern, and the pressing switch is provided on the lower surface side of the mounting plate. A pushbutton knob that moves up and down through the rotating body is installed on the circuit board, and the push switch is turned on and off by pressing the pushbutton knob.

しかしながら上記従来の押圧スイッチ付きの回転式電子部品においては、摺接パターン形成用のフレキシブル回路基板の他に、押圧用スイッチ形成用のフレキシブル回路基板を設置しなければならないので部品点数が多くなり、組み立ても煩雑であり、薄型化も図れない。
実開平4−125404号公報
However, in the conventional rotary electronic component with a pressure switch, in addition to the flexible circuit board for forming a sliding contact pattern, a flexible circuit board for forming a pressing switch has to be installed, so the number of parts increases. Assembling is complicated and thinning is not possible.
Japanese Utility Model Publication No. 4-125404

本発明は上述の点に鑑みてなされたものでありその目的は、部品点数が少なく、組立が容易で、薄型化も図れる基板積層体及び複合型電子部品を提供することにある。   The present invention has been made in view of the above points, and an object of the present invention is to provide a substrate laminate and a composite electronic component that have a small number of components, can be easily assembled, and can be thinned.

本願請求項1に記載の発明は、摺動子が回転しながら摺接する摺接パターンを設けると共に前記摺動子の回転中心部に開口を設けてなる摺接パターン形成部と、押圧スイッチ用のスイッチ接点パターンを設けてなる接点パターン形成部と、前記摺接パターン形成部と接点パターン形成部との間に設置される中間部と、を連結してなる1枚のフレキシブル回路基板を具備し、前記摺接パターンとスイッチ接点パターンとは前記フレキシブル回路基板の同一面に形成され、前記摺接パターン形成部の摺接パターンを設けた面を上面としてその下面側に中間部と接点パターン形成部とをこの順番で積み重ねることで前記摺接パターンとスイッチ接点パターンとを同一面側に向けると共に摺接パターン形成部の開口に前記スイッチ接点パターンを配置したことを特徴とする基板積層体にある。   The invention according to claim 1 of the present application provides a sliding contact pattern forming portion in which a sliding contact is made while the slider is rotating and an opening is provided in a rotation center portion of the sliding member, and a press switch. Comprising a single flexible circuit board formed by connecting a contact pattern forming portion provided with a switch contact pattern and an intermediate portion installed between the sliding contact pattern forming portion and the contact pattern forming portion; The slidable contact pattern and the switch contact pattern are formed on the same surface of the flexible circuit board, and a surface on which the slidable contact pattern of the slidable contact pattern forming portion is provided as an upper surface, and an intermediate portion and a contact pattern forming portion on the lower surface side. Are stacked in this order so that the sliding contact pattern and the switch contact pattern are directed to the same surface side, and the switch contact pattern is disposed in the opening of the sliding contact pattern forming portion. In substrate laminate, characterized in that the.

本願請求項2に記載の発明は、前記積み重ねた摺接パターン形成部と接点パターン形成部の間に硬質の取付部材を設置して重ね合わせたことを特徴とする請求項1に記載の基板積層体にある。このとき取付部材と摺接パターン形成部間、及び取付部材と接点パターン形成部間は何れも、直接接するように重ね合わせても良いし、他の回路基板部(中間部や下記するアースパターン形成部等)を介して重ね合わせても良い。   The invention according to claim 2 of the present application is characterized in that a hard mounting member is installed and overlapped between the stacked sliding contact pattern forming portions and the contact pattern forming portions. In the body. At this time, both the mounting member and the sliding contact pattern forming portion and between the mounting member and the contact pattern forming portion may be overlapped so as to be in direct contact with each other, or other circuit board portions (intermediate portion and ground pattern forming described below). And the like may be overlapped with each other.

本願請求項3に記載の発明は、前記取付部材の上面側と下面側にそれぞれ前記摺接パターン形成部と接点パターン形成部とを固定することを特徴とする請求項2に記載の基板積層体にある。   The invention according to claim 3 of the present application is characterized in that the sliding contact pattern forming portion and the contact pattern forming portion are fixed to the upper surface side and the lower surface side of the mounting member, respectively. It is in.

本願請求項4に記載の発明は、前記1枚のフレキシブル回路基板にはアースパターンを形成したアースパターン形成部が連結されており、このアースパターン形成部を前記摺接パターン形成部の上面側又は下面側に重ね合わせたことを特徴とする請求項1又は2又は3に記載の基板積層体にある。   According to a fourth aspect of the present invention, an earth pattern forming portion in which an earth pattern is formed is connected to the one flexible circuit board, and the earth pattern forming portion is connected to the upper surface side of the sliding contact pattern forming portion. The substrate laminate according to claim 1, wherein the substrate laminate is overlaid on a lower surface side.

本願請求項5に記載の発明は、請求項1乃至4の内の何れかに記載の基板積層体の、前記摺接パターン形成部の上部に、前記摺接パターンに摺接する摺動子を取り付けて回転する操作部材と、前記スイッチ接点パターンによって構成される押圧スイッチをオンオフ操作する押圧部材とを設置してなることを特徴とする複合型電子部品にある。   In the invention according to claim 5 of the present application, a slider slidably contacting the slidable contact pattern is attached to an upper portion of the slidable contact pattern forming portion of the substrate laminate according to any one of claims 1 to 4. The composite electronic component is provided with an operating member that rotates and a pressing member that turns on and off a pressing switch constituted by the switch contact pattern.

請求項1に記載の発明によれば、1枚のフレキシブル回路基板を折り畳んで積み重ねるだけで、複数の機能パターン(摺接パターンとスイッチ接点パターン)を有する基板積層体を、少ない部品点数で、容易に製造することができる。また積層するだけなので、その薄型化を図ることができる。また1枚のフレキシブル回路基板に摺接パターン形成部と接点パターン形成部の他に中間部を設けるので、このフレキシブル回路基板をつづら折り状に折り畳んで重ね合わせる際にスルーホールなどの複雑な回路構成を用いなくても、容易に摺接パターンとスイッチ接点パターンとを同一面側に向けて配置することが可能となる。これらのことからこの基板積層体を用いて構成される複合型電子部品の組み立てが容易になり、薄型化も図れる。   According to the first aspect of the present invention, a substrate laminate having a plurality of functional patterns (sliding contact patterns and switch contact patterns) can be easily formed with a small number of parts by simply folding and stacking one flexible circuit board. Can be manufactured. Moreover, since it is only laminated, the thickness can be reduced. In addition to the slidable contact pattern forming portion and the contact pattern forming portion, an intermediate portion is provided on one flexible circuit board. Therefore, when this flexible circuit board is folded in a zigzag manner and overlapped, a complicated circuit configuration such as a through hole is formed. Even if it is not used, the sliding contact pattern and the switch contact pattern can be easily arranged on the same surface side. For these reasons, it is easy to assemble a composite electronic component constituted by using this substrate laminate, and the thickness can be reduced.

請求項2に記載の発明によれば、摺接パターン形成部と接点パターン形成部の間に硬質の取付部材を設置したので、摺動子が摺接パターン上を摺動しても、その弾圧力及び雰囲気温度の上昇によってフレキシブル回路基板製の摺接パターン形成部が凹むことはなく、その出力にノイズ等が発生することを防止できる。   According to the second aspect of the present invention, since the rigid mounting member is installed between the sliding contact pattern forming portion and the contact pattern forming portion, even if the slider slides on the sliding contact pattern, The sliding contact pattern forming portion made of the flexible circuit board does not dent due to the increase of the force and the atmospheric temperature, and it is possible to prevent noise and the like from being generated in the output.

請求項3に記載の発明によれば、摺接パターン形成部と接点パターン形成部とを取付部材に固定して一体化した基板積層体を構成できるので、この基板積層体を用いて構成される複合型電子部品の組立作業が容易になる。   According to the third aspect of the present invention, a substrate laminate in which the slidable contact pattern forming portion and the contact pattern forming portion are fixed and integrated with the mounting member can be configured, so that the substrate laminate is used. The assembly work of the composite electronic component is facilitated.

請求項4に記載の発明によれば、アースパターンによって摺接パターンへの静電気の侵入を容易に防止できる。その際部品点数が増加することもない。   According to the fourth aspect of the present invention, it is possible to easily prevent static electricity from entering the sliding contact pattern by the ground pattern. At that time, the number of parts does not increase.

請求項5に記載の発明によれば、上記基板積層体を用いることで、組み立てが容易で薄型化が図れる複合型電子部品を構成できる。   According to the invention described in claim 5, by using the substrate laminate, it is possible to constitute a composite electronic component that can be easily assembled and reduced in thickness.

以下、本発明の実施形態を図面に基づいて詳細に説明する。
〔第1実施形態〕
図1は本発明の第1実施形態にかかる基板積層体100を用いて構成される複合型電子部品(以下「押圧スイッチ付き回転式電子部品」という)1−1の概略断面図(説明の都合上、各部の断面位置は異なっている。)、図2は押圧スイッチ付き回転式電子部品1−1の分解斜視図である。なお図1においては、図示の都合上、取付部材(以下「取付板」という)190と中間部140との間と、接点パターン形成部150と絶縁部160との間にアースパターン183の厚み分の隙間があるように記載されているが、実際はアースパターン183の厚みは薄く、これらの隙間はない。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is a schematic cross-sectional view of a composite electronic component (hereinafter referred to as “rotary electronic component with a pressure switch”) 1-1 configured by using the substrate laminate 100 according to the first embodiment of the present invention (for convenience of description). FIG. 2 is an exploded perspective view of the rotary electronic component 1-1 with a press switch. In FIG. 1, for the sake of illustration, the thickness of the ground pattern 183 is between the mounting member (hereinafter referred to as “mounting plate”) 190 and the intermediate portion 140 and between the contact pattern forming portion 150 and the insulating portion 160. However, the ground pattern 183 is actually thin and there is no such gap.

両図に示すように押圧スイッチ付き回転式電子部品1−1は、操作つまみ10と、操作つまみ10の中央に設置される押圧部材(以下「押釦つまみ」という)30と、操作つまみ10の下部に設置される固定側部材であるケース40と、ケース40の下部に設置されて操作つまみ10と一体に移動(回転)する移動体(以下「回転体」という)50と、回転体50の上面側(操作つまみ10側)に設置されて前記回転体50を移動する際にクリック感触を生じるクリック機構80と、回転体50の下面側に設置される基板積層体100と、基板積層体100の下部に設置される支持部材(以下「支持板」という)200とを具備して構成されている。なお前記回転する操作つまみ10と回転体50を合わせて操作部材という。以下各構成部品について説明する。   As shown in both figures, the rotary electronic component 1-1 with a push switch includes an operation knob 10, a pressing member (hereinafter referred to as “push button knob”) 30 installed at the center of the operation knob 10, and a lower part of the operation knob 10. A case 40 which is a fixed-side member installed in the case, a moving body 50 (hereinafter referred to as “rotating body”) which is installed at the lower part of the case 40 and moves (rotates) integrally with the operation knob 10, A click mechanism 80 which is installed on the side (operation knob 10 side) and generates a click feeling when moving the rotating body 50, a substrate laminate 100 installed on the lower surface side of the rotating body 50, And a support member (hereinafter referred to as “support plate”) 200 installed in the lower portion. The rotating operation knob 10 and the rotating body 50 are collectively referred to as an operation member. Each component will be described below.

図3は押圧スイッチ付き回転式電子部品1−1を構成する各部品の内の基板積層体100と支持板200とを除いた他の各部品を裏面側から見た斜視図である。図1,図2に示すように操作つまみ10は合成樹脂製であり、略円板状の上面部11の外周に下方に向かって突出する略円筒状の側壁部13を設け、また上面部11の中央に円形に貫通する挿通部15を設け、また上面部11の下面側の前記挿通部15の周囲部分に円筒状に突出する軸部17を設け、軸部17の下端辺から複数本(3本)の突起部19を突出している。軸部17の内径は挿通部15の内径よりも少し大きく、これによってリング状の段部21が形成されている。ところでこの操作つまみ10は図1に示すように、上面部11と側壁部13とを構成する合成樹脂材料aと、軸部17と上面部11の下面を覆う下面部23とを構成する合成樹脂材料bとを異なる材料で構成してなる二材成形品であり、メッキし易い合成樹脂材料(この実施形態ではABS樹脂)aの露出している表面のみにメッキが付着し、メッキし難い合成樹脂材料(この実施形態ではポリカーボネート樹脂)bの露出している表面にはメッキは付着しない(又は付着したメッキが容易に除去できる)ようにしている。つまりこの実施形態においては、上面部11と側壁部13の露出表面のみに金属光沢を有する金属メッキが施されている。   FIG. 3 is a perspective view of other components, excluding the substrate laminate 100 and the support plate 200, of the components constituting the rotary electronic component 1-1 with a pressure switch, as viewed from the back side. As shown in FIGS. 1 and 2, the operation knob 10 is made of synthetic resin, and is provided with a substantially cylindrical side wall portion 13 projecting downward on the outer periphery of a substantially disc-shaped upper surface portion 11, and the upper surface portion 11. An insertion portion 15 penetrating circularly is provided in the center of the upper surface portion 11, and a shaft portion 17 protruding in a cylindrical shape is provided around the insertion portion 15 on the lower surface side of the upper surface portion 11. 3) projecting portions 19 are projected. The inner diameter of the shaft portion 17 is slightly larger than the inner diameter of the insertion portion 15, thereby forming a ring-shaped step portion 21. By the way, as shown in FIG. 1, the operation knob 10 is composed of a synthetic resin material a that forms the upper surface portion 11 and the side wall portion 13, and a synthetic resin that forms the shaft portion 17 and the lower surface portion 23 that covers the lower surface of the upper surface portion 11. This is a two-material molded product composed of different materials from the material b. The synthetic resin material (ABS resin in this embodiment) that is easy to plate is attached to the exposed surface of the synthetic resin material a and is difficult to plate. The plating is not attached to the exposed surface of the resin material (polycarbonate resin in this embodiment) b (or the attached plating can be easily removed). That is, in this embodiment, only the exposed surfaces of the upper surface portion 11 and the side wall portion 13 are subjected to metal plating having a metallic luster.

押釦つまみ30は合成樹脂成形品であり、略円板状の本体部31の外周下部から半径方向外方に向けてつば部33を突出し、また本体部31の下面中央から柱状の押圧部35を突出して構成されている。この押釦つまみ30は例えばABS樹脂製であり、その表面全体にはスパッタによる不連続蒸着(不伝導蒸着とも言う)が形成され、金属光沢のある装飾が施されている。不連続蒸着とはスパッタの初期段階で、核となる金属が合成樹脂表面に付着してはいるが、これら核間が連結されて連続した膜となる前の状態であり、不導電性を有する(又は抵抗値の高い)蒸着膜である。   The push button knob 30 is a synthetic resin molded product, and protrudes from the lower outer periphery of the substantially disc-shaped main body portion 31 toward the radially outer side, and from the center of the lower surface of the main body portion 31 to the columnar pressing portion 35. It is configured to protrude. The pushbutton knob 30 is made of, for example, ABS resin, and the entire surface thereof is formed by discontinuous vapor deposition by sputtering (also referred to as nonconductive vapor deposition), and is decorated with a metallic luster. Discontinuous deposition is the initial stage of sputtering, where the core metal is attached to the surface of the synthetic resin, but is a state before these cores are connected to form a continuous film, and has non-conductivity. It is a vapor deposition film (or high resistance value).

ケース40は合成樹脂製(この実施形態ではABS樹脂製)であり、その所定位置に上方向に筒状に突出してその上面に上面部43を有する突出部41を設け、これによって突出部41の下面側に凹状の収納部45を形成して構成されている。上面部43中央には円形の開口部47が形成され、また図3に示すようにケース40下面の収納部45の周囲には、下方向に向かって突出する複数本(8本)の突起からなる取付部48が設けられている。前記上面部43の下面には、図示しない取付手段によって弾性金属板をリング状に形成してなるクリックバネ81が取り付けられている。クリックバネ81はその所定位置に円弧状の弾発アーム部83と弾発アーム部83の中央に設けられる弾発部85とを具備している。   The case 40 is made of synthetic resin (in this embodiment, made of ABS resin), and is provided with a protruding portion 41 that protrudes upward in a cylindrical shape at its predetermined position and has an upper surface portion 43 on its upper surface. A concave storage portion 45 is formed on the lower surface side. A circular opening 47 is formed at the center of the upper surface portion 43, and a plurality of (eight) protrusions projecting downward are formed around the storage portion 45 on the lower surface of the case 40 as shown in FIG. A mounting portion 48 is provided. A click spring 81 formed by forming an elastic metal plate in a ring shape by an attaching means (not shown) is attached to the lower surface of the upper surface portion 43. The click spring 81 includes an arc-shaped bullet arm 83 and a bullet 85 provided at the center of the bullet arm 83 at a predetermined position.

回転体50は合成樹脂を略円板状に成形して構成されており、その中央には前記押釦つまみ30の押圧部35を上下動自在に挿入・ガイドする押圧部挿入部51が設けられ、押圧部挿入部51を囲む周囲位置には等間隔に複数(3つ、但し図1では1つのみ示す)の上下に貫通するスリット状のアースリード部挿通部53が設けられ、アースリード部挿通部53の外側を囲む周囲位置には等間隔に複数(3つ、但し図1では1つのみ示す)の上下に貫通するスリット状の突起部挿通部55が設けられている。回転体50の下面には摺動子60が取り付けられ、回転体50の上面にはクリック板91が取り付けられている。摺動子60は弾性金属板製であり、図3に示すように、矩形状で回転体50に取り付けられる基部61の1辺から2本の摺動冊子63を突出して基部61の下面側に折り返して構成されている。クリック板91は金属板をリング状に形成し、その外周には等間隔に複数(8つ、但し図1では1つのみ示す)の矩形状の切り欠きからなるクリック係合部93を設け、また中央には開口部95を設け、開口部95の内周辺から等間隔に複数本(3本、但し図1では1つのみ示す)の舌片状のアースリード部97を突出してそれらの根元部分を折り曲げて下方向に向けて前記回転体50に設けたアースリード部挿通部53に挿通している。また各アースリード部97の外周側には前記操作つまみ10の各突起部19を挿入する挿通部99を設けている。   The rotating body 50 is formed by molding a synthetic resin into a substantially disc shape, and a pressing portion insertion portion 51 for inserting and guiding the pressing portion 35 of the push button knob 30 is provided at the center thereof. A plurality of (three, but only one is shown in FIG. 1) slit-like earth lead part insertion parts 53 are provided at peripheral positions surrounding the pressing part insertion part 51 at an equal interval. A plurality of (three, but only one is shown in FIG. 1) slit-like projection insertion portions 55 penetrating vertically are provided at peripheral positions surrounding the outside of the portion 53 at equal intervals. A slider 60 is attached to the lower surface of the rotating body 50, and a click plate 91 is attached to the upper surface of the rotating body 50. The slider 60 is made of an elastic metal plate. As shown in FIG. 3, two sliding booklets 63 project from one side of the base 61 attached to the rotating body 50 in a rectangular shape so as to face the lower surface side of the base 61. Wrapped and configured. The click plate 91 is a metal plate formed in a ring shape, and is provided with click engagement portions 93 formed of a plurality of rectangular cutouts (eight, but only one is shown in FIG. 1) at equal intervals on the outer periphery thereof. Further, an opening 95 is provided at the center, and a plurality of (three, but only one is shown in FIG. 1) tongue-shaped ground lead portions 97 are projected from the inner periphery of the opening 95 at equal intervals to project the roots thereof. The portion is bent and inserted downward through a ground lead portion insertion portion 53 provided on the rotating body 50. Further, on the outer peripheral side of each ground lead portion 97, an insertion portion 99 for inserting each projection portion 19 of the operation knob 10 is provided.

図4,図5は基板積層体100の展開斜視図であり、図4は上側から見た図、図5は下側から見た図である。両図に示すように基板積層体100は、1枚の可撓性を有する合成樹脂フイルム(この実施形態ではポリエチレンテレフタレートフイルムを用いているが、他の各種合成樹脂フイルムを用いても良い)の表面に回路パターンを設けて構成されたフレキシブル回路基板110と、合成樹脂製の取付板190とによって構成されており、フレキシブル回路基板110は、円形の5つの回路基板部、即ちアースパターン形成部120、摺接パターン形成部130、中間部140、接点パターン形成部150、絶縁部160をそれぞれ帯状の連結部171,173,175,177によって連結して構成されている。接点パターン形成部150の外周辺には帯状の引出部179が接続されている。この実施形態では各回路基板部120,130,140,150,160及び取付板190は略円形であり、それらの外径寸法はほぼ同一に形成されている。   4 and 5 are developed perspective views of the substrate laminate 100, FIG. 4 is a view from above, and FIG. 5 is a view from below. As shown in both figures, the substrate laminate 100 is made of one flexible synthetic resin film (in this embodiment, polyethylene terephthalate film is used, but other various synthetic resin films may be used). The flexible circuit board 110 is configured by providing a circuit pattern on the surface and a synthetic resin mounting plate 190. The flexible circuit board 110 includes five circular circuit board parts, that is, an earth pattern forming part 120. The sliding contact pattern forming portion 130, the intermediate portion 140, the contact pattern forming portion 150, and the insulating portion 160 are connected by belt-like connecting portions 171, 173, 175, and 177, respectively. A strip-shaped lead portion 179 is connected to the outer periphery of the contact pattern forming portion 150. In this embodiment, the circuit board portions 120, 130, 140, 150, 160 and the mounting plate 190 are substantially circular, and the outer diameters thereof are formed substantially the same.

アースパターン形成部120はその中央に円形に貫通する押圧部挿通穴121を設け、外周近傍に複数(8つ)の貫通する小孔からなるケース取付部123を設け、また外周近傍の180°対向する位置に複数(一対)の貫通する小孔からなる取付穴125を設けて構成されている。摺接パターン形成部130はその中央(摺動子60の回転中心部)に円形に貫通する開口131を設け、外周近傍の前記ケース取付部123に対向する位置(重ね合わせた際に対向する位置)に複数(8つ)の貫通する小孔からなるケース取付部133を設け、また外周近傍の180°対向する位置(前記取付穴125に対向する位置)に複数(一対)の貫通する小孔からなる取付穴135を設け、またその上面の前記開口131の周囲にリング状で同心円状の一対の摺接パターン137を設けて構成されている。この実施形態の場合、外側の摺接パターン137が抵抗体パターンで、内側の摺接パターン137が導電性の高い導体パターンである。もちろんこれら摺接パターンはスイッチパターンであっても良いし、その本数(トラック本数)も1本又は3本以上でも良い。これら摺接パターン137の出力は図示しない回路パターンによって引出部179に引き出されている。中間部140はその中央に貫通する押圧部挿通穴141を設け、外周近傍の前記各ケース取付部123に対向する位置(重ね合わせた際に対向する位置)に複数(8つ)の貫通する小孔からなるケース取付部143を設け、また外周近傍の所定の二ヶ所に貫通する小孔からなる取付穴145を設け、また上面の前記押圧部挿通穴141の周囲にC字状の1本の固定抵抗パターン147を設けて構成されている。固定抵抗パターン147の出力は図示しない回路パターンによって引出部179に引き出されている。接点パターン形成部150はその上面中央に押圧スイッチ151を設け、外周近傍の前記各ケース取付部123に対向する位置(重ね合わせた際に対向する位置)に複数(8つ)の貫通する小孔からなるケース取付部153を設け、また外周近傍の前記取付穴145に対向する2ヵ所(重ね合わせた際に対向する位置)に貫通する小孔からなる取付穴155を設けて構成されている。押圧スイッチ151は接点パターン形成部150表面に形成した一対の導電パターンからなるスイッチ接点パターン151a,151b上に、弾性金属板をドーム形状に形成した反転板(可動接点板)151cをその外周が一方のスイッチ接点パターン151b上に当接し、その中央下面が他方のスイッチ接点パターン151aに所定の隙間を介して対向するように、反転板151c上を覆う粘着テープ151dによって取り付けて構成されている。押圧スイッチ151の出力は図示しない回路パターンによって引出部179に引き出されている。絶縁部160はその外周近傍の前記各ケース取付部123に対向する位置(重ね合わせた際に対向する位置)に複数(8つ)の貫通する小孔からなるケース取付部163を設け、またその外周近傍の前記取付穴145に対向する2ヵ所(重ね合わせた際に対向する位置)に貫通する小孔からなる取付穴165を設けて構成されている。   The ground pattern forming portion 120 is provided with a pressing portion insertion hole 121 penetrating in a circle at the center thereof, a case mounting portion 123 formed of a plurality (eight) penetrating small holes in the vicinity of the outer periphery, and facing 180 ° near the outer periphery. The mounting hole 125 which consists of a plurality (a pair) of penetrating small holes is provided at a position to be formed. The sliding contact pattern forming portion 130 is provided with an opening 131 penetrating circularly at the center (rotation center portion of the slider 60), and a position facing the case mounting portion 123 in the vicinity of the outer periphery (a position facing when overlapped). ) Are provided with a plurality of (eight) penetrating case mounting portions 133, and a plurality (a pair) of penetrating small holes at positions near the outer periphery at 180 ° (positions facing the mounting holes 125). And a pair of sliding contact patterns 137 having a ring shape and concentric circles are provided around the opening 131 on the upper surface thereof. In this embodiment, the outer sliding contact pattern 137 is a resistor pattern, and the inner sliding contact pattern 137 is a highly conductive conductor pattern. Of course, these sliding contact patterns may be switch patterns, and the number (number of tracks) may be one or three or more. The outputs of these sliding contact patterns 137 are drawn out to the lead-out portion 179 by a circuit pattern (not shown). The intermediate part 140 is provided with a pressing part insertion hole 141 penetrating in the center thereof, and a plurality (eight) small penetrating holes are provided at positions facing the case mounting parts 123 in the vicinity of the outer periphery (positions facing when overlapped). A case mounting portion 143 made of a hole is provided, a mounting hole 145 made of a small hole penetrating at two predetermined locations in the vicinity of the outer periphery is provided, and a single C-shape is formed around the pressing portion insertion hole 141 on the upper surface. A fixed resistance pattern 147 is provided. The output of the fixed resistance pattern 147 is drawn out to the lead portion 179 by a circuit pattern (not shown). The contact pattern forming portion 150 is provided with a pressing switch 151 in the center of the upper surface thereof, and a plurality (eight) small holes penetrating at positions facing the case mounting portions 123 in the vicinity of the outer periphery (positions facing when overlapped). And a mounting hole 155 composed of small holes penetrating at two positions facing the mounting hole 145 in the vicinity of the outer periphery (positions facing each other when overlapped). The pressure switch 151 has a reversing plate (movable contact plate) 151c in which an elastic metal plate is formed in a dome shape on a switch contact pattern 151a, 151b made of a pair of conductive patterns formed on the surface of the contact pattern forming portion 150. Is attached by an adhesive tape 151d covering the reverse plate 151c so that the lower surface of the center of the switch contact pattern 151b contacts the other switch contact pattern 151a with a predetermined gap. The output of the pressing switch 151 is drawn out to the drawing portion 179 by a circuit pattern (not shown). The insulating part 160 is provided with a case attaching part 163 composed of a plurality of (eight) penetrating small holes at positions facing the respective case attaching parts 123 in the vicinity of the outer periphery (positions facing when overlapped). There are provided mounting holes 165 formed of small holes penetrating at two positions (positions facing each other when overlapped) facing the mounting holes 145 in the vicinity of the outer periphery.

一方図5に示すように、アースパターン形成部120と摺接パターン形成部130の下面には静電気侵入防止用の円形のアースパターン180,181が設けられ、アースパターン180,181は連結用のアースパターン183によって連結されて中間部140,接点パターン形成部150の下面を介して引出部179の下面に引き出されている。即ちアースパターンは導電性の高い導電パターン(例えば銀ペーストを印刷したもの)によって構成されており、アースパターン形成部120下面の押圧部挿通穴121の周囲を囲む部分に設けられるアースパターン180と、摺接パターン形成部130下面の開口131の周囲を囲む部分に設けられるアースパターン181と、これら両アースパターン180,181を接続して引出部179に導出するように中間部140下面の外周近傍部分の一部と接点パターン形成部150下面の外周近傍部分の一部と連結部171,173,175の下面と引出部179の下面とに設けられるアースパターン183とを具備している。アースパターン183は引出部179から引き出された後に図示しない位置でアースされる。なおフレキシブル回路基板110の表面には図示はしていないが必要に応じて絶縁層が印刷等によって形成されている。   On the other hand, as shown in FIG. 5, circular ground patterns 180 and 181 for preventing electrostatic intrusion are provided on the lower surfaces of the ground pattern forming portion 120 and the sliding contact pattern forming portion 130, and the ground patterns 180 and 181 are connected to the ground. They are connected by the pattern 183 and are drawn out to the lower surface of the drawing portion 179 through the lower surface of the intermediate portion 140 and the contact pattern forming portion 150. That is, the ground pattern is composed of a conductive pattern having high conductivity (for example, printed silver paste), and a ground pattern 180 provided in a portion surrounding the periphery of the pressing portion insertion hole 121 on the lower surface of the ground pattern forming portion 120; A ground pattern 181 provided in a portion surrounding the periphery of the opening 131 on the bottom surface of the sliding contact pattern forming portion 130, and a portion near the outer periphery of the bottom surface of the intermediate portion 140 so that both the ground patterns 180 and 181 are connected and led out to the lead-out portion 179. , A part of the vicinity of the outer periphery of the lower surface of the contact pattern forming portion 150, a lower surface of the connecting portions 171, 173 and 175, and a ground pattern 183 provided on the lower surface of the lead-out portion 179. The ground pattern 183 is grounded at a position (not shown) after being pulled out from the leading portion 179. Although not shown, an insulating layer is formed on the surface of the flexible circuit board 110 by printing or the like as necessary.

取付板190は合成樹脂を略円板状に成形して構成されており、その中央に円形に貫通する押圧部挿通穴191を設け、その外周近傍の前記各ケース取付部123に対向する位置(取付板190の上面に載置するアースパターン形成部120のケース取付部123に対向する位置)に複数(8つ)の貫通する小孔からなるケース取付部193を設け、またその上面の外周近傍の180°対向する位置(取付板190の上面に載置するアースパターン形成部120の取付穴125に対向する位置)に複数(一対)の小突起からなる取付突起195を設け、またその下面の外周近傍の前記取付穴145に対向する2ヵ所(取付板190の下面に載置する中間部140の取付穴145に対向する位置)に小突起からなる取付突起197を設けて構成されている。   The mounting plate 190 is formed by molding a synthetic resin into a substantially disc shape, and is provided with a pressing portion insertion hole 191 penetrating in a circular shape at the center thereof, and a position facing each case mounting portion 123 in the vicinity of the outer periphery ( A case mounting portion 193 having a plurality of (eight) penetrating small holes is provided at a position facing the case mounting portion 123 of the ground pattern forming portion 120 placed on the upper surface of the mounting plate 190, and in the vicinity of the outer periphery of the upper surface. A mounting projection 195 made up of a plurality of (a pair of) small projections is provided at a position opposite to 180 ° (position facing the mounting hole 125 of the ground pattern forming portion 120 placed on the upper surface of the mounting plate 190). Mounting projections 197 made of small projections are provided at two locations facing the mounting holes 145 in the vicinity of the outer periphery (positions facing the mounting holes 145 of the intermediate portion 140 placed on the lower surface of the mounting plate 190). It has been.

そして基板積層体100を組み立てるには図4に矢印で示すように、まずアースパターン形成部120を摺接パターン形成部130の下面側に重ね合わせておき、一方絶縁部160を接点パターン形成部150の下面側に重ね合わせてさらに重ね合わせた接点パターン形成部150と絶縁部160を中間部140の上面側に重ね合わせ、図6の状態にする。次に前記重ね合わせたアースパターン形成部120と摺接パターン形成部130の下面(アースパターン形成部120側)に取付板190を設置し、その際取付板190に設けた一対の取付突起195をアースパターン形成部120と摺接パターン形成部130に設けた取付穴125,135に挿入し、両取付突起195の先端を熱カシメして固定する。次に前記重ね合わせた中間部140と接点パターン形成部150と絶縁部160を連結部173の部分で折り返して取付板190の下面に設置し(このとき中間部140が取付板190の下面に当接する)、その際取付板190の下面に設けた一対の取付突起197を中間部140と接点パターン形成部150と絶縁部160に設けた取付穴145,155,165に挿入し、両取付突起197の先端を熱カシメすることで固定する。これによって図2に示す基板積層体100が完成する。図2に示すようにアースパターン形成部120に形成されたアースパターン180は、摺接パターン形成部130に形成された開口131内に露出している。また摺接パターン形成部130の開口131にスイッチ接点パターン151a,151bを含む押圧スイッチ151が配置される。   In order to assemble the substrate laminate 100, as shown by the arrow in FIG. 4, first, the ground pattern forming portion 120 is superposed on the lower surface side of the sliding contact pattern forming portion 130, while the insulating portion 160 is placed on the contact pattern forming portion 150. The contact pattern forming portion 150 and the insulating portion 160 that are superimposed on the lower surface side of the intermediate portion 140 are superimposed on the upper surface side of the intermediate portion 140 to obtain the state shown in FIG. Next, a mounting plate 190 is installed on the lower surface (ground pattern forming unit 120 side) of the superimposed ground pattern forming portion 120 and sliding contact pattern forming portion 130, and a pair of mounting projections 195 provided on the mounting plate 190 at that time are attached. It inserts in the attachment holes 125 and 135 provided in the earth pattern formation part 120 and the sliding contact pattern formation part 130, and the front-end | tip of both attachment protrusion 195 is fixed by heat crimping. Next, the overlapped intermediate portion 140, contact pattern forming portion 150, and insulating portion 160 are folded back at the connection portion 173 and installed on the lower surface of the mounting plate 190 (at this time, the intermediate portion 140 contacts the lower surface of the mounting plate 190). At that time, a pair of mounting projections 197 provided on the lower surface of the mounting plate 190 is inserted into mounting holes 145, 155, 165 provided in the intermediate portion 140, the contact pattern forming portion 150, and the insulating portion 160, and both mounting projections 197 are inserted. Fix it by caulking the tip. Thus, the substrate laminate 100 shown in FIG. 2 is completed. As shown in FIG. 2, the ground pattern 180 formed in the ground pattern forming portion 120 is exposed in the opening 131 formed in the sliding contact pattern forming portion 130. In addition, a pressing switch 151 including switch contact patterns 151 a and 151 b is disposed in the opening 131 of the sliding contact pattern forming unit 130.

次に支持板200は図2に示すように、金属板を前記基板積層体100の外径と略同一外径の略円板状に形成して構成されており、その外周近傍の前記アースパターン形成部120の各ケース取付部123に対向する位置(重ね合わせた際に対向する位置)に複数(8つ)の貫通する小孔からなるケース取付部203を設け、また外周近傍の前記中間部140の取付穴145に対向する2ヵ所の位置(重ね合わせた際に対向する位置)に貫通する小孔からなる穴205を設けて構成されている。   Next, as shown in FIG. 2, the support plate 200 is formed by forming a metal plate into a substantially disc shape having an outer diameter substantially the same as the outer diameter of the substrate laminate 100, and the ground pattern in the vicinity of the outer periphery thereof. A case mounting portion 203 having a plurality of (eight) penetrating small holes is provided at a position facing each case mounting portion 123 of the forming portion 120 (a position facing when overlapped), and the intermediate portion in the vicinity of the outer periphery. A hole 205 made of a small hole is provided at two positions (positions facing each other when overlapped) at two positions facing the 140 mounting holes 145.

次に押圧スイッチ付き回転式電子部品1−1の組立方法を説明する。まず図1において操作つまみ10をクリックバネ81を取り付けたケース40の突出部41上に配置し、このとき操作つまみ10の軸部17をケース40の開口部47に回動自在に挿入する。次にケース40の下面側から押釦つまみ30の本体部31を操作つまみ10の挿通部15内に挿入し、さらにその下側にクリック板91を取り付けた回転体50を配置する。その際押釦つまみ30の押圧部35は回転体50の押圧部挿入部51に上下動自在に挿入され、同時に操作つまみ10の各突起部19はクリック板91の各挿通部99と回転体50の各突起部挿通部55とに挿入される。そして各突起部19先端を回転体50の下面で熱カシメする。次に回転体50の下面側に基板積層体100と支持板200とを設置し、その際各アースパターン形成部120、摺接パターン形成部130、中間部140、接点パターン形成部150、絶縁部160と取付板190に設けられて上下に一致して重なり合っている複数の各ケース取付部123,133,143,153,163,193と、支持板200のケース取付部203とにそれぞれ図3に示すケース40の取付突起48を挿入し、各取付突起48の先端を支持板200の下面で熱カシメしてこれら各部材を一体化する。なお支持板200に設けた穴205は、絶縁部160の下面に露出する取付板190の取付突起197の熱カシメした先端部分を挿入する逃げ穴である。   Next, the assembly method of the rotary electronic component 1-1 with a press switch is demonstrated. First, in FIG. 1, the operation knob 10 is placed on the protruding portion 41 of the case 40 to which the click spring 81 is attached. At this time, the shaft portion 17 of the operation knob 10 is rotatably inserted into the opening 47 of the case 40. Next, the main body portion 31 of the push button knob 30 is inserted into the insertion portion 15 of the operation knob 10 from the lower surface side of the case 40, and the rotating body 50 with the click plate 91 attached thereto is further disposed below the main body portion 31. At this time, the pressing portion 35 of the push button knob 30 is inserted into the pressing portion insertion portion 51 of the rotating body 50 so as to be movable up and down, and at the same time, the protrusions 19 of the operation knob 10 are connected to the insertion portions 99 of the click plate 91 and the rotating body 50. It is inserted into each protrusion insertion portion 55. Then, the tip of each protrusion 19 is caulked with heat on the lower surface of the rotating body 50. Next, the substrate laminate 100 and the support plate 200 are installed on the lower surface side of the rotating body 50. At that time, each ground pattern forming part 120, sliding contact pattern forming part 130, intermediate part 140, contact pattern forming part 150, insulating part FIG. 3 shows a plurality of case mounting portions 123, 133, 143, 153, 163, and 193, which are provided on the mounting plate 190 and overlap with each other in the vertical direction, and the case mounting portion 203 of the support plate 200. The mounting protrusions 48 of the case 40 shown are inserted, and the tips of the mounting protrusions 48 are caulked on the lower surface of the support plate 200 to integrate these members. The hole 205 provided in the support plate 200 is a clearance hole for inserting the thermally crimped tip portion of the mounting protrusion 197 of the mounting plate 190 exposed on the lower surface of the insulating portion 160.

そして上記押圧スイッチ付き回転式電子部品1−1において、操作つまみ10を回転すれば、これと一体に回転体50が回転し、摺動子60の摺動冊子63が摺接パターン137上を回転しながら摺動してその電気的出力を変化する。一方押釦つまみ30を押圧すれば押圧部35が押圧スイッチ151を押圧して反転板151cを反転しこれをオンする。押釦つまみ30への押圧を解除すれば反転板151cは元の形状に自動復帰し押圧スイッチ151はオフする。一方、操作つまみ10や押釦つまみ30を操作する指等が帯電していた場合、操作つまみ10表面には導電性の金属メッキが施されているので、その静電気の多くは操作つまみ10の表面に入射し、操作つまみ10のメッキが施されている表面を導電した後にケース40の開口部47から回転体50の上面側に侵入する。そして回転体50の上面側に侵入した静電気は金属板製のクリックバネ81又はクリック板91に入射し(なおクリックバネ81に入射した静電気はこれと接しているクリック板91に導かれる)、クリック板91に設けたアースリード部97の先端からこれに接近して配置されているアースパターン180に放電され、アースされる。従って操作つまみ10や押釦つまみ30から回転体50の上面側に入射した静電気が回転体50の下面側に設置した電気的機能部である摺動子60や摺接パターン137やその他の回路パターンに入射することはなく、効果的に静電気の電気回路への侵入を防止できる。   When the operation knob 10 is rotated in the rotary electronic component 1-1 with the pressure switch, the rotating body 50 rotates integrally therewith, and the sliding booklet 63 of the slider 60 rotates on the sliding contact pattern 137. While sliding, the electrical output changes. On the other hand, when the push button knob 30 is pressed, the pressing portion 35 presses the pressing switch 151 to reverse the reversing plate 151c and turn it on. When the pressing on the push button knob 30 is released, the reversing plate 151c automatically returns to its original shape and the pressing switch 151 is turned off. On the other hand, when a finger or the like for operating the operation knob 10 or the push button knob 30 is charged, the surface of the operation knob 10 is subjected to conductive metal plating. After entering and conducting the plated surface of the operation knob 10, it enters the upper surface side of the rotating body 50 from the opening 47 of the case 40. Then, the static electricity that has entered the upper surface side of the rotating body 50 enters the click spring 81 or the click plate 91 made of a metal plate (note that the static electricity that has entered the click spring 81 is guided to the click plate 91 in contact with the click spring 81). The tip of the earth lead portion 97 provided on the plate 91 is discharged to the earth pattern 180 disposed close to the earth lead portion 97 and grounded. Therefore, the static electricity incident on the upper surface side of the rotating body 50 from the operation knob 10 and the push button knob 30 is applied to the slider 60, the sliding contact pattern 137 and other circuit patterns which are electrical function units installed on the lower surface side of the rotating body 50. There is no incidence and static electricity can be effectively prevented from entering the electric circuit.

なおこの実施形態では操作つまみ10の軸部17表面にメッキを行なわず、従って前記メッキ内を導通する静電気が軸部17にまで導電しないようにしており、これによって軸部17を回転体50に固定するために設けた突起部挿通部55を通してその下面側に静電気が侵入しないようにしている(静電気は突起部挿通部55を通過する前にその上にあるクリック板91に確実に捉えられる)。またこの実施形態の場合、静電気を導入するアースパターン180が摺接パターン137を形成した摺接パターン形成部130とは異なるアースパターン形成部120に設けられているので、両パターンが同一の面上にある場合に生じる恐れのある両者間の放電も確実に防止できる。なおこの実施形態では摺接パターン形成部120とアースパターン形成部130は同一のフレキシブル回路基板110であるが、摺接パターン137とアースパターン180とはフレキシブル回路基板110の上下の異なる面に設けられているので、この点からも両者間で放電は生じない。   In this embodiment, the surface of the shaft portion 17 of the operation knob 10 is not plated, so that static electricity conducted through the plating is not conducted to the shaft portion 17. Static electricity does not enter the lower surface side through the protruding portion insertion portion 55 provided for fixing (static electricity is reliably caught by the click plate 91 on the lower surface before passing through the protruding portion insertion portion 55). . In the case of this embodiment, since the ground pattern 180 for introducing static electricity is provided in the ground pattern forming portion 120 different from the sliding contact pattern forming portion 130 in which the sliding contact pattern 137 is formed, both patterns are on the same surface. It is also possible to reliably prevent discharge between the two that may occur in the case of. In this embodiment, the sliding contact pattern forming unit 120 and the ground pattern forming unit 130 are the same flexible circuit board 110, but the sliding contact pattern 137 and the ground pattern 180 are provided on different upper and lower surfaces of the flexible circuit board 110. Therefore, no discharge occurs between the two from this point.

なお上記実施形態においては静電気対策のためアースパターン形成部120を設けたが、その必要がない場合はアースパターン形成部120は省略しても良い。また絶縁部160も省略しても良い。   In the above-described embodiment, the ground pattern forming unit 120 is provided as a countermeasure against static electricity. However, the ground pattern forming unit 120 may be omitted if it is not necessary. Further, the insulating portion 160 may be omitted.

以上のように上記基板積層体100は少なくとも、摺動子60が回転しながら摺接する摺接パターン137を設けると共に摺動子60の回転中心部に開口131を設けてなる摺接パターン形成部130と、押圧スイッチ用のスイッチ接点パターン151a,151bを設けてなる接点パターン形成部150と、前記摺接パターン形成部130と接点パターン形成部150との間に設置される中間部140と、を連結部173,175で連結してなる1枚のフレキシブル回路基板110を具備し、前記摺接パターン137とスイッチ接点パターン151a,151bとをフレキシブル回路基板110の同一面に形成し、前記摺接パターン形成部130の摺接パターン137を設けた面を上面としてその下面側に中間部140と接点パターン形成部150とをこの順番でつづら折り状に積み重ねることで前記摺接パターン137とスイッチ接点パターン151a,151bとを同一面側に向けると共に摺接パターン形成部130の開口131にスイッチ接点パターン151a,151bを含む押圧スイッチ151を配置して構成されている。即ち1枚のフレキシブル回路基板110を折り畳んで重ね合わせるだけで、複数の機能パターン(摺接パターン137とスイッチ接点パターン151a,151b)を有する基板積層体100を、少ない部品点数で、容易に製造することができ、また積層するだけなので、その薄型化も図ることができる。その際、1枚のフレキシブル回路基板110に摺接パターン形成部130と接点パターン形成部150の他に中間部140を設けるので、このフレキシブル回路基板110をつづら折り状に折り畳んで重ね合わせるだけで、別途スルーホールなどの複雑な回路構成を用いることなく、容易に摺接パターン137とスイッチ接点パターン151a,151bとを同一面側に向けて配置することが可能となる。   As described above, the substrate laminate 100 is provided with at least the sliding contact pattern 137 that is in sliding contact with the slider 60 while rotating, and the sliding contact pattern forming portion 130 that is provided with the opening 131 at the center of rotation of the slider 60. And a contact pattern forming part 150 provided with switch contact patterns 151a and 151b for pressing switches, and an intermediate part 140 installed between the sliding contact pattern forming part 130 and the contact pattern forming part 150. A plurality of flexible circuit boards 110 connected by the portions 173 and 175, the sliding contact pattern 137 and the switch contact patterns 151a and 151b are formed on the same surface of the flexible circuit board 110, and the sliding contact pattern is formed. A contact pattern is formed on the lower surface side of the surface of the portion 130 where the sliding contact pattern 137 is provided. 150 are stacked in this order in a zigzag manner so that the sliding contact pattern 137 and the switch contact patterns 151a and 151b are directed to the same surface side, and the switch contact patterns 151a and 151b are included in the opening 131 of the sliding contact pattern forming portion 130. A push switch 151 is arranged. That is, the substrate laminate 100 having a plurality of functional patterns (sliding contact pattern 137 and switch contact patterns 151a and 151b) can be easily manufactured with a small number of parts by simply folding and overlapping one flexible circuit board 110. In addition, since it is only laminated, the thickness can be reduced. In that case, since the intermediate part 140 is provided in addition to the sliding contact pattern forming part 130 and the contact pattern forming part 150 on one flexible circuit board 110, the flexible circuit board 110 is folded in a zigzag shape and overlapped. The sliding contact pattern 137 and the switch contact patterns 151a and 151b can be easily arranged on the same surface without using a complicated circuit configuration such as a through hole.

また上記基板積層体100には、積み重ねた摺接パターン形成部130と接点パターン形成部150の間に硬質の取付板190を設置して重ね合わせているので、摺動子60が摺接パターン137上を摺動しても、その弾圧力及び雰囲気温度の上昇によって合成樹脂フイルム製の摺接パターン形成部130が凹むことはなく、その出力にノイズ等が発生することを防止でき、また前記形成された凹みを摺動子60が通過することでクリック感覚を生じることも防止できる。また上記基板積層体100には、取付板190の上面側と下面側にそれぞれ摺接パターン形成部130とスイッチ接点パターン形成部150とを固定する構成なので、一体化した基板積層体100を構成でき、この基板積層体100を用いて構成される複合型電子部品1−1の組立作業が容易になる。また上記基板積層体100には、摺接パターン形成部130等を設けた1枚のフレキシブル回路基板110にアースパターン180を形成したアースパターン形成部120を連結し、このアースパターン形成部120を摺接パターン形成部130の下面側に重ね合わせた構成なので、アースパターン180によって摺接パターン137への静電気の侵入を容易に防止できる。その際部品点数が増加することもない。また上記複合型電子部品1−1は、摺接パターン形成部130の上部に、摺接パターン137に摺接する摺動子60を取り付けて回転する操作部材(操作つまみ10と回転体50)と、スイッチ接点パターン151a,151bによって構成される押圧スイッチ151をオンオフ操作する押釦つまみ30とを設置する構成なので、容易に複合型電子部品1−1を構成できる。   In addition, since the rigid mounting plate 190 is installed and overlapped between the stacked sliding contact pattern forming unit 130 and the contact pattern forming unit 150 on the substrate laminate 100, the slider 60 has the sliding contact pattern 137. Even if it slides on the surface, the sliding contact pattern forming portion 130 made of synthetic resin film does not dent due to an increase in the elastic pressure and the ambient temperature, and it is possible to prevent noise from being generated in the output, and the formation described above. It is also possible to prevent a click sensation from occurring when the slider 60 passes through the formed recess. Further, since the sliding structure pattern forming part 130 and the switch contact pattern forming part 150 are fixed to the upper surface side and the lower surface side of the mounting plate 190, respectively, the integrated substrate stacking body 100 can be configured. The assembly work of the composite electronic component 1-1 configured using the substrate laminate 100 is facilitated. Further, the substrate laminate 100 is connected to a ground pattern forming portion 120 having a ground pattern 180 formed on one flexible circuit board 110 provided with a sliding contact pattern forming portion 130 and the like, and the ground pattern forming portion 120 is slid. Since the configuration is superposed on the lower surface side of the contact pattern forming portion 130, the ground pattern 180 can easily prevent static electricity from entering the sliding contact pattern 137. At that time, the number of parts does not increase. The composite electronic component 1-1 includes an operation member (an operation knob 10 and a rotating body 50) that rotates by attaching a slider 60 that is in sliding contact with the sliding contact pattern 137 to the upper portion of the sliding contact pattern forming unit 130; Since the push button knob 30 for turning on and off the push switch 151 constituted by the switch contact patterns 151a and 151b is installed, the composite electronic component 1-1 can be easily constructed.

〔第2実施形態〕
図7は本発明の第2実施形態にかかる基板積層体100−2の斜視図、図8,図9は基板積層体100−2の展開平面図であり、図8は上側から見た図、図9は下側から見た図である。同図に示す基板積層体100−2において、前記第1実施形態にかかる基板積層体100と同一又は相当部分には同一符号を付す。なお以下で説明する事項以外の事項については、前記第1実施形態にかかる基板積層体100と同じである。
[Second Embodiment]
FIG. 7 is a perspective view of a substrate laminate 100-2 according to the second embodiment of the present invention, FIGS. 8 and 9 are developed plan views of the substrate laminate 100-2, and FIG. FIG. 9 is a view as seen from below. In the substrate laminate 100-2 shown in the figure, the same or corresponding parts as those in the substrate laminate 100 according to the first embodiment are denoted by the same reference numerals. Items other than those described below are the same as those of the substrate laminate 100 according to the first embodiment.

この実施形態にかかる基板積層体100−2において第1実施形態にかかる基板積層体100と相違する点は、基板積層体100−2の内のアースパターン形成部120の形状を変更し、中央に前記摺接パターン137を露出する大きさの摺接パターン露出用開口122を設け、アースパターン形成部120の下面全体にアースパターン180を形成し、且つアースパターン形成部120を摺接パターン形成部130の下面側ではなくその上面側に重ね合わせた点のみである。   The difference between the substrate laminate 100-2 according to this embodiment and the substrate laminate 100-2 according to the first embodiment is that the shape of the ground pattern forming portion 120 in the substrate laminate 100-2 is changed to the center. A sliding contact pattern exposure opening 122 of a size that exposes the sliding contact pattern 137 is provided, the ground pattern 180 is formed on the entire lower surface of the ground pattern forming portion 120, and the ground pattern forming portion 120 is connected to the sliding contact pattern forming portion 130. It is only the point which overlapped on the upper surface side instead of the lower surface side.

この基板積層体100−2にも、第1実施形態で示した押圧スイッチ付き回転式電子部品1−1を構成する各部品を取り付けることで、同様の押圧スイッチ付き回転式電子部品を構成することができる。ただしアースリード部97とアースリード部挿通部53は不用となる。この実施形態にかかる基板積層体100−2の場合、図1に示す回転体50の外周側から基板積層体100−2の上面に侵入してくる静電気をこれに対向する位置に設けた前記アースパターン180によって有効に除去することが可能となる。この基板積層体100−2の場合も、1枚のフレキシブル回路基板110をつづら折り状に折り畳んで重ね合わせるだけで、複数の機能パターン(摺接パターン137とスイッチ接点パターン151a,151b)を有する基板積層体100−2を、少ない部品点数で、容易に製造することができ、また積層するだけなので、その薄型化も図ることができ、また別途スルーホールなどの複雑な回路構成を用いることなく、容易に摺接パターン137とスイッチ接点パターン151a,151bとを同一面側に向けて配置することが可能となる等、前記基板積層体100と同様の作用・効果を有する。   The same rotary electronic component with a press switch is configured by attaching the components constituting the rotary electronic component with a press switch 1-1 shown in the first embodiment also to the substrate laminate 100-2. Can do. However, the ground lead portion 97 and the ground lead portion insertion portion 53 are unnecessary. In the case of the substrate laminate 100-2 according to this embodiment, the grounding provided at a position facing the static electricity that enters the upper surface of the substrate laminate 100-2 from the outer peripheral side of the rotating body 50 shown in FIG. The pattern 180 can be effectively removed. Also in the case of this substrate laminate 100-2, a substrate laminate having a plurality of functional patterns (sliding contact pattern 137 and switch contact patterns 151a and 151b) can be obtained by simply folding and overlapping one flexible circuit board 110 in a zigzag manner. The body 100-2 can be easily manufactured with a small number of parts, and since it is simply laminated, the thickness can be reduced, and it is easy without using a complicated circuit configuration such as a separate through hole. Further, the sliding contact pattern 137 and the switch contact patterns 151a and 151b can be arranged on the same surface side.

〔第3実施形態〕
図10,図11は本発明の第3実施形態にかかる基板積層体100−3の展開平面図であり、図10は上側から見た図、図11は下側から見た図である。同図に示す基板積層体100−3において、前記第1実施形態にかかる基板積層体100と同一又は相当部分には同一符号を付す。なお以下で説明する事項以外の事項については、前記第1実施形態にかかる基板積層体100と同じである。
[Third Embodiment]
10 and 11 are development plan views of the substrate laminate 100-3 according to the third embodiment of the present invention, in which FIG. 10 is a view seen from the upper side and FIG. 11 is a view seen from the lower side. In the substrate laminate 100-3 shown in the figure, the same or corresponding parts as those in the substrate laminate 100 according to the first embodiment are denoted by the same reference numerals. Items other than those described below are the same as those of the substrate laminate 100 according to the first embodiment.

この実施形態にかかる基板積層体100−3において第1実施形態にかかる基板積層体100と相違する点は、基板積層体100に設けていたアースパターン形成部120を省略し、これに伴なってアースパターン180と連結部171とを省略し、その代りに基板積層体100では絶縁部160とした部分にアースパターン形成部220を設置した点である。即ちアースパターン形成部220は帯状の連結部177によって接点パターン形成部150に連結されており、その中央に円形に貫通する押圧部挿通穴221を設け、外周近傍に複数(8つ)の貫通する小孔からなるケース取付部223を設け、また外周近傍の180°対向する位置に複数(一対)の貫通する小孔からなる取付穴225を設け、さらにアースパターン形成部220の下面の押圧部挿通穴221の周囲に円形のアースパターン185を設け、アースパターン185を連結用のアースパターン183によって接点パターン形成部150の下面に設けたアースパターン183に接続して構成されている。   The substrate laminate 100-3 according to this embodiment differs from the substrate laminate 100 according to the first embodiment in that the ground pattern forming unit 120 provided in the substrate laminate 100 is omitted, and accordingly. The ground pattern 180 and the connecting portion 171 are omitted, and instead, the ground pattern forming portion 220 is installed in the portion of the substrate laminate 100 that is the insulating portion 160. In other words, the ground pattern forming portion 220 is connected to the contact pattern forming portion 150 by a strip-like connecting portion 177, and a pressing portion insertion hole 221 penetrating circularly is provided at the center, and a plurality (eight) of penetrating holes are formed in the vicinity of the outer periphery. A case mounting portion 223 made of a small hole is provided, a mounting hole 225 made of a plurality of (a pair of) through holes is provided at a position opposed to 180 ° in the vicinity of the outer periphery, and the pressing portion insertion on the lower surface of the ground pattern forming portion 220 A circular earth pattern 185 is provided around the hole 221, and the earth pattern 185 is connected to the earth pattern 183 provided on the lower surface of the contact pattern forming portion 150 by a connecting earth pattern 183.

そしてこの基板積層体100−3を組み立てるには、図12に示すように、まず接点パターン形成部150を中間部140の上面側に折り畳んで重ね合わせ、次に前記重ね合わせた中間部140と接点パターン形成部150とを連結部173の部分で折り返して取付板190の下面に設置し(このとき中間部140が取付板190の下面に当接する)、その際取付板190の下面に設けた一対の取付突起197(図5参照)を中間部140と接点パターン形成部150に設けた取付穴145,155に挿入し、両取付突起197の先端を熱カシメすることで固定する。次に前記アースパターン形成部220を取付板190の上面側に折り返して載置し、その上に前記摺接パターン形成部130を載置し、その際取付板190に設けた一対の取付突起195をアースパターン形成部220の取付穴225と摺接パターン形成部130の取付穴135に挿入し、両取付突起195の先端を熱カシメして固定する。これによって基板積層体100−3が完成する。このように構成しても第1実施形態の基板積層体100と同様に、アースパターン形成部220に形成されたアースパターン185は、摺接パターン形成部130に形成された開口131内に露出する。   In order to assemble the substrate laminate 100-3, as shown in FIG. 12, first, the contact pattern forming portion 150 is folded and overlapped on the upper surface side of the intermediate portion 140, and then the overlapped intermediate portion 140 and the contact point are contacted. The pattern forming portion 150 is folded back at the connecting portion 173 and installed on the lower surface of the mounting plate 190 (at this time, the intermediate portion 140 contacts the lower surface of the mounting plate 190). The mounting protrusions 197 (see FIG. 5) are inserted into mounting holes 145 and 155 provided in the intermediate part 140 and the contact pattern forming part 150, and the tips of both mounting protrusions 197 are fixed by heat caulking. Next, the ground pattern forming portion 220 is folded and placed on the upper surface side of the mounting plate 190, and the sliding contact pattern forming portion 130 is placed thereon, and a pair of mounting projections 195 provided on the mounting plate 190 at that time. Is inserted into the mounting hole 225 of the ground pattern forming portion 220 and the mounting hole 135 of the sliding contact pattern forming portion 130, and the tips of both mounting projections 195 are crimped and fixed. Thereby, the substrate laminate 100-3 is completed. Even in this configuration, the ground pattern 185 formed in the ground pattern forming portion 220 is exposed in the opening 131 formed in the sliding contact pattern forming portion 130, as in the substrate laminate 100 of the first embodiment. .

この基板積層体100−3のようにアースパターン形成部220を接点パターン形成部150側に連結してもよい。つまりアースパターン形成部は1枚のフレキシブル回路基板110の何れか一端側(摺接パターン形成部130側又は接点パターン形成部150側)に設ければ良い。   The ground pattern forming unit 220 may be connected to the contact pattern forming unit 150 side like the substrate laminate 100-3. That is, the ground pattern forming portion may be provided on one end side (sliding contact pattern forming portion 130 side or contact pattern forming portion 150 side) of one flexible circuit board 110.

そしてこの基板積層体100−3も、第1実施形態で示した押圧スイッチ付き回転式電子部品1−1を構成する各部品を取り付けることで、同様の押圧スイッチ付き回転式電子部品を構成することができる。この基板積層体100−3の場合も、1枚のフレキシブル回路基板110を折り畳んで重ね合わせるだけで、複数の機能パターン(摺接パターン137とスイッチ接点パターン151a,151b)を有する基板積層体100−3を、少ない部品点数で、容易に製造することができ、また積層するだけなので、その薄型化も図ることができ、また別途スルーホールなどの複雑な回路構成を用いることなく、容易に摺接パターン137とスイッチ接点パターン151a,151bとを同一面側に向けて配置することが可能となる等、前記基板積層体100と同様の作用・効果を有する。   And this board | substrate laminated body 100-3 also comprises the same rotary electronic component with a press switch by attaching each component which comprises the rotary electronic component 1-1 with a press switch shown in 1st Embodiment. Can do. In the case of the substrate laminate 100-3, the substrate laminate 100- having a plurality of functional patterns (sliding contact pattern 137 and switch contact patterns 151a and 151b) can be obtained by simply folding and overlapping one flexible circuit board 110. 3 can be easily manufactured with a small number of parts, and since it is only laminated, the thickness can be reduced, and it can be easily slid without using a complicated circuit configuration such as a through-hole. The pattern 137 and the switch contact patterns 151a and 151b can be arranged on the same surface side, and the same operations and effects as the substrate laminate 100 are obtained.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載のない何れの形状・構造・材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば上記実施形態においては、本発明を回転式電子部品に利用した場合を説明したが、本発明はスライド式電子部品等の他の各種電子部品にも利用することができる。また上記実施形態では接点パターン形成部150上に一対のスイッチ接点パターン151a,151bを形成しその上に反転板(可動接点板)151cを設置して押圧スイッチ151を構成したが、接点パターン形成部150上に一方のスイッチ接点パターンを形成し、別途他方のスイッチ接点パターンを形成したフレキシブル回路基板を前記スイッチ接点パターン上に載置することで両スイッチ接点パターンを対向させて構成されるメンブレンスイッチで押圧スイッチを構成しても良い。その場合、他方のスイッチ接点パターンを形成したフレキシブル回路基板を接点パターン形成部150と連結部で連結した1枚のフレキシブル回路基板110に形成し、これを折り畳むように構成するのが好適である(この場合も両スイッチ接点パターンはフレキシブル回路基板110の同一面上に形成される)。上記実施形態では取付部材として合成樹脂製の取付板190を用いたが、摺動子60による弾圧力によってフレキシブル回路基板が凹まない程度の硬質の部材であれば他の材質のものでもよく、鉄板などであっても良い。また上述した摺動子60の弾圧による問題を考慮しなくて良い場合は、取付板190は省略しても良い。その場合は、より基板積層体100の薄型化が図れる。また上記実施形態では操作つまみ10と回転体50を合わせて操作部材としたが、何れか一方のみで操作部材を構成しても良く、また操作つまみ10や回転体50以外の部材によって操作部材を構成しても良い。要は摺接パターンに摺接する摺動子を取り付けた操作部材であればどのような構成であっても良い。また押圧部材も押釦つまみ30に限定されず、要はスイッチ接点パターンによって構成される押圧スイッチをオンオフ操作する押圧部材であれば良い。また上記実施形態では、中間部140の形状を摺接パターン形成部130等と同一の外径寸法の略円形としたが、他の形状としても良く、例えば中間部140は連結部173,175と同様の帯状(即ち連結部の一部)としても良い。この場合は連結部の一部が中間部140を構成することとなる。また上記第1実施形態ではアースパターン形成部120に押圧部挿通穴121を設けたが、この押圧部挿通穴121は省略しても良い。アースパターン形成部120は可撓性を有するので、その上から押釦つまみ30の押圧部35を押圧しても押圧スイッチ151を押圧して操作することができる。なお中間部140は取付板190の上面側に設置しても良い。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in the above embodiment, the case where the present invention is used for a rotary electronic component has been described. However, the present invention can also be used for various other electronic components such as a slide electronic component. In the above embodiment, the pair of switch contact patterns 151a and 151b are formed on the contact pattern forming unit 150, and the reversing plate (movable contact plate) 151c is installed thereon to configure the pressing switch 151. However, the contact pattern forming unit 150 is a membrane switch configured such that one switch contact pattern is formed on 150 and a flexible circuit board on which the other switch contact pattern is separately formed is placed on the switch contact pattern so that both switch contact patterns face each other. A push switch may be configured. In that case, it is preferable that the flexible circuit board on which the other switch contact pattern is formed is formed on one flexible circuit board 110 connected to the contact pattern forming part 150 by the connecting part, and this is folded. Also in this case, both switch contact patterns are formed on the same surface of the flexible circuit board 110). In the above-described embodiment, the synthetic resin mounting plate 190 is used as the mounting member. However, any other material may be used as long as the flexible circuit board is not depressed by the elastic force of the slider 60. It may be. In addition, the mounting plate 190 may be omitted if the above-described problem due to the pressure of the slider 60 need not be considered. In that case, the substrate laminate 100 can be made thinner. In the above embodiment, the operation knob 10 and the rotating body 50 are combined to form an operation member. However, the operation member may be configured by only one of them, and the operation member may be formed by a member other than the operation knob 10 or the rotation body 50. It may be configured. In short, any configuration may be used as long as the operation member is provided with a slider that is in sliding contact with the sliding contact pattern. Further, the pressing member is not limited to the push button knob 30 and may be any pressing member that turns on and off a pressing switch constituted by a switch contact pattern. In the above embodiment, the shape of the intermediate portion 140 is a substantially circular shape having the same outer diameter as that of the sliding contact pattern forming portion 130 or the like. However, other shapes may be used, for example, the intermediate portion 140 may be connected to the connecting portions 173 and 175. It is good also as the same strip | belt shape (namely, a part of connection part). In this case, a part of the connecting portion constitutes the intermediate portion 140. Moreover, in the said 1st Embodiment, although the press part penetration hole 121 was provided in the earth pattern formation part 120, this press part insertion hole 121 may be abbreviate | omitted. Since the earth pattern forming portion 120 has flexibility, even if the pressing portion 35 of the push button knob 30 is pressed from above, the pressing switch 151 can be pressed and operated. The intermediate portion 140 may be installed on the upper surface side of the mounting plate 190.

基板積層体100を用いて構成される押圧スイッチ付き回転式電子部品1−1の概略断面図である。It is a schematic sectional drawing of the rotary electronic component 1-1 with a press switch comprised using the board | substrate laminated body 100. FIG. 押圧スイッチ付き回転式電子部品1−1の分解斜視図である。It is a disassembled perspective view of the rotary electronic component 1-1 with a press switch. 押圧スイッチ付き回転式電子部品1−1を構成する各部品の内の基板積層体100と支持板200とを除いた他の各部品を裏面側から見た斜視図である。It is the perspective view which looked at each other components except the board | substrate laminated body 100 and the support plate 200 in each component which comprises the rotary electronic component with a press switch 1-1 from the back side. 基板積層体100を上側から見た展開斜視図である。It is the expansion | deployment perspective view which looked at the board | substrate laminated body 100 from the upper side. 基板積層体100を下側から見た展開斜視図である。It is the expansion | deployment perspective view which looked at the board | substrate laminated body 100 from the lower side. 基板積層体100の組立方法説明図である。FIG. 10 is an explanatory diagram of an assembly method for the substrate laminate 100. 基板積層体100−2の斜視図である。It is a perspective view of the board | substrate laminated body 100-2. 基板積層体100−2を上側から見た展開平面図である。It is the expansion | deployment top view which looked at the board | substrate laminated body 100-2 from the upper side. 基板積層体100−2を下側から見た展開平面図である。It is the expansion | deployment top view which looked at the board | substrate laminated body 100-2 from the lower side. 基板積層体100−3を上側から見た展開平面図である。It is the expansion | deployment top view which looked at the board | substrate laminated body 100-3 from the upper side. 基板積層体100−3を下側から見た展開平面図である。It is the expansion | deployment top view which looked at the board | substrate laminated body 100-3 from the lower side. 基板積層体100−3の組立方法説明図である。It is assembly method explanatory drawing of the board | substrate laminated body 100-3.

符号の説明Explanation of symbols

1−1 押圧スイッチ付き回転式電子部品(複合型電子部品)
10 操作つまみ(操作部材)
30 押釦つまみ(押圧部材)
40 ケース
50 回転体(移動体,操作部材)
60 摺動子
80 クリック機構
100 基板積層体
110 フレキシブル回路基板
120 アースパターン形成部
130 摺接パターン形成部
137 摺接パターン
140 中間部
150 接点パターン形成部
151 押圧スイッチ
151a,151b スイッチ接点パターン
160 絶縁部
171,173,175,177 連結部
179 引出部
180,181,183,185 アースパターン
190 取付板(取付部材)
200 支持板(支持部材)
100−2 基板積層体
100−3 基板積層体
220 アースパターン形成部
1-1 Rotary electronic components with a push switch (composite electronic components)
10 Operation knob (operation member)
30 Pushbutton knob (pressing member)
40 Case 50 Rotating body (moving body, operation member)
60 Slider 80 Click Mechanism 100 Substrate Stack 110 Flexible Circuit Board 120 Ground Pattern Forming Unit 130 Sliding Contact Pattern Forming Unit 137 Sliding Contact Pattern 140 Intermediate Portion 150 Contact Pattern Forming Unit 151 Press Switch 151a, 151b Switch Contact Pattern 160 Insulating Part 171, 173, 175, 177 Connecting portion 179 Leading portion 180, 181, 183, 185 Ground pattern 190 Mounting plate (mounting member)
200 Support plate (support member)
100-2 Substrate Laminate 100-3 Substrate Laminate 220 Earth Pattern Forming Unit

Claims (5)

摺動子が回転しながら摺接する摺接パターンを設けると共に前記摺動子の回転中心部に開口を設けてなる摺接パターン形成部と、
押圧スイッチ用のスイッチ接点パターンを設けてなる接点パターン形成部と、
前記摺接パターン形成部と接点パターン形成部との間に設置される中間部と、を連結してなる1枚のフレキシブル回路基板を具備し、
前記摺接パターンとスイッチ接点パターンとは前記フレキシブル回路基板の同一面に形成され、
前記摺接パターン形成部の摺接パターンを設けた面を上面としてその下面側に中間部と接点パターン形成部とをこの順番で積み重ねることで前記摺接パターンとスイッチ接点パターンとを同一面側に向けると共に摺接パターン形成部の開口に前記スイッチ接点パターンを配置したことを特徴とする基板積層体。
A sliding contact pattern forming portion that is provided with a sliding contact pattern that is in sliding contact with the slider while being rotated, and an opening is provided at a rotation center portion of the slider;
A contact pattern forming portion provided with a switch contact pattern for a pressure switch;
Comprising one flexible circuit board formed by connecting an intermediate portion installed between the sliding contact pattern forming portion and the contact pattern forming portion;
The sliding contact pattern and the switch contact pattern are formed on the same surface of the flexible circuit board,
The sliding contact pattern and the switch contact pattern are placed on the same surface side by stacking the intermediate portion and the contact pattern forming portion in this order on the lower surface side of the surface where the sliding contact pattern forming portion is provided as the upper surface. A substrate laminate in which the switch contact pattern is disposed at the opening of the sliding contact pattern forming portion.
前記積み重ねた摺接パターン形成部と接点パターン形成部の間に硬質の取付部材を設置して重ね合わせたことを特徴とする請求項1に記載の基板積層体。   The substrate laminate according to claim 1, wherein a hard attachment member is installed and overlapped between the stacked sliding contact pattern forming portions and the contact pattern forming portions. 前記取付部材の上面側と下面側にそれぞれ前記摺接パターン形成部と接点パターン形成部とを固定することを特徴とする請求項2に記載の基板積層体。   The substrate laminate according to claim 2, wherein the sliding contact pattern forming portion and the contact pattern forming portion are fixed to an upper surface side and a lower surface side of the attachment member, respectively. 前記1枚のフレキシブル回路基板にはアースパターンを形成したアースパターン形成部が連結されており、
このアースパターン形成部を前記摺接パターン形成部の上面側又は下面側に重ね合わせたことを特徴とする請求項1又は2又は3に記載の基板積層体。
An earth pattern forming portion in which an earth pattern is formed is connected to the one flexible circuit board,
4. The substrate laminate according to claim 1, wherein the ground pattern forming portion is superposed on an upper surface side or a lower surface side of the sliding contact pattern forming portion.
請求項1乃至4の内の何れかに記載の基板積層体の、前記摺接パターン形成部の上部に、前記摺接パターンに摺接する摺動子を取り付けて回転する操作部材と、前記スイッチ接点パターンによって構成される押圧スイッチをオンオフ操作する押圧部材とを設置してなることを特徴とする複合型電子部品。   An operation member that rotates by attaching a slider that is in slidable contact with the slidable contact pattern on an upper portion of the slidable contact pattern forming portion of the substrate laminate according to any one of claims 1 to 4, and the switch contact A composite electronic component comprising a pressing member for turning on and off a pressing switch constituted by a pattern.
JP2005370354A 2005-12-22 2005-12-22 Substrate laminate and composite electronic component Pending JP2007173095A (en)

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JP2005370354A Pending JP2007173095A (en) 2005-12-22 2005-12-22 Substrate laminate and composite electronic component

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62175618U (en) * 1986-04-25 1987-11-07
JPH0276436U (en) * 1988-11-30 1990-06-12
JPH0973843A (en) * 1995-09-01 1997-03-18 Asahi Optical Co Ltd Switch structure
JP2001357758A (en) * 2000-06-12 2001-12-26 Alps Electric Co Ltd Combined control input device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62175618U (en) * 1986-04-25 1987-11-07
JPH0276436U (en) * 1988-11-30 1990-06-12
JPH0973843A (en) * 1995-09-01 1997-03-18 Asahi Optical Co Ltd Switch structure
JP2001357758A (en) * 2000-06-12 2001-12-26 Alps Electric Co Ltd Combined control input device

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