JP2007171149A - Surface defect inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simplify constitution of a device, and to reduce an expense required for the device, in imaging inspection of a three-dimensional portion such as a a terminal edge part of a silicon wafer or a notch part provided in the terminal edge part. <P>SOLUTION: This surface defect inspection device is constituted of one imaging means for imaging an inspection object, the first diffusion light illumination means such as a flat light source illumination device for illuminating uniform diffusion light incident with a wide angle, the second diffusion light illumination means for illuminating diffusion light coaxially to an optical axis of an optical system of the imaging means, an optical path refraction means for imaging an imaging-objective portion not faced to the imaging means, and an image processing means for computation-processing an image data picked up by the imaging means, and the plurality of portions of the inspection object having a three-dimensional shape is imaged at the same time by the one imaging means. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention provides a plurality of inspection objects having a mirror-like surface and including a taper and an R portion, such as a peripheral edge of a silicon wafer and a notch provided at the peripheral edge. The present invention relates to a surface defect inspection apparatus having a three-dimensional mirror surface capable of simultaneously observing a part.

  Needless to say, the inspection of the surface flat portion of the silicon wafer used for manufacturing is inspected with great care in order to reduce the surface defects. On the other hand, the peripheral edge of the silicon wafer and the notch provided on the peripheral edge are parts that are not used in the final product and are discarded parts. I didn't. In recent years, it has gradually become clear that the minute defects in this part have a great influence on the yield to the post-process. In other words, if there are minute cracks at the end edge, the distortion at that end will spread throughout the silicon wafer, leading to breakage and peripheral contamination, or fine scattering at the end edge, causing particles to scatter. Thus, it has been regarded as a problem that defective products are generated.

  The terminal edge of the silicon wafer is tapered in consideration of strength, and it has an upper taper, a side, and a lower taper. Therefore, the observation target surface is a three-dimensional surface.

  Furthermore, since the U-shaped notch portion for determining the direction of the wafer crystal provided at the terminal edge of the silicon wafer is provided with a taper similar to the taper of the terminal edge other than the notch portion, The three-dimensional shape is more complicated than the end edge portion other than the notch portion.

  Japanese Patent Application Laid-Open No. 2003-243465 takes images of the end edge and the notch provided on the end edge of the silicon wafer, and provides the end edge and end edge of the silicon wafer from this image data. A configuration and contents of an inspection apparatus for detecting a defect existing on a notch portion is disclosed.

  In the inspection apparatus, as a means for imaging the side surface portion, the taper portion and the roll-off portion of the terminal edge of the silicon wafer, the side surface portion, the taper portion and the roll-off portion following the silicon wafer as the means for imaging the roll-off portion. A C-type illumination device for illuminating the image with diffused light, and three imaging cameras for imaging the side surface portion, the upper taper portion and the subsequent roll-off portion, and the lower taper portion and the subsequent roll-off portion are provided. It has been.

  Further, as means for imaging a U-shaped notch portion for determining the direction of the wafer crystal provided at the terminal edge of the silicon wafer, a dome-shaped illumination device that illuminates the notch portion with diffused light, and the above Five imaging cameras for imaging the notch from five different directions are provided.

  On the other hand, it is known that illumination means for illuminating an inspection object is important when performing inspection using an image of a mirror-like plane of the inspection object such as a silicon wafer. Here, in the inspection of the inspection object having a mirror-like surface such as a silicon wafer, in order to determine a defect that affects the performance of the inspection object and a slight friction mark that cannot be said to be a dirt or a defect, A diffused light illuminating means for irradiating from as wide a range as possible is preferable. Further, the irradiation direction of the illumination means needs to be coaxial or in the same direction as the optical axis of the imaging device.

  Japanese Unexamined Patent Application Publication No. 2004-319466 discloses a diffused light illuminating means that satisfies the above conditions. One of them is a method in which diffused light illumination is performed by a dome-type whole sky illumination device described as the prior art in the above publication, and an inspection object is imaged from an observation hole provided in a part of the dome-type device. The inspection apparatus disclosed in Japanese Patent Application Laid-Open No. 2003-243465 includes a dome-shaped illumination device as a notch illumination device, but in the same direction as the direction in which the five cameras are arranged. Since it needs to be arranged, it cannot be said that a sufficient size is obtained and uniform illumination light incident from a wide range of directions can be obtained.

  The diffused light illuminating device described as the invention of Japanese Patent Application Laid-Open No. 2004-319466 includes a large number of minute reflecting portions arranged so as to form a minute gap, a transparent body that supports the reflecting portion, and a light source. The light emitted from the light source is reflected by the reflecting part to illuminate the inspection object, and the light reflected by the inspection object is configured to pass through the illumination device through a minute gap between the reflecting parts. In addition to illuminating the inspection object with uniform diffused light, an image of the inspection object can be captured by the imaging means in the coaxial direction of the illumination device.

  JP 2003-243465 A   JP 2004-319466 A

  In the inspection apparatus disclosed in Japanese Patent Application Laid-Open No. 2003-243465, three cameras are required to image the terminal edge of the silicon wafer, and the notch portion provided at a part of the terminal edge is imaged. In other words, five cameras are required, and a total of eight cameras must be arranged around the silicon wafer. This complicates the apparatus and increases the production cost.

In addition, the illumination device that illuminates the notch part for photographing the notch part is difficult to arrange a dome-shaped illumination that is large enough for imaging because it arranges five cameras as imaging means. It is difficult to illuminate each part of the notch with uniform diffused light.

  In view of the above problems, the present invention images a terminal edge of a silicon wafer or a notch provided at the terminal edge without arranging a large number of imaging cameras, and uniformly diffuses light incident from various directions. It is a device capable of obtaining illumination, and the structure of the device is simplified, stable diffused light illumination can be obtained, and cost can be reduced at the end edge and the end edge of the silicon wafer. An object of the present invention is to provide a surface defect inspection apparatus for inspecting a surface defect of a notch portion provided.

  In order to achieve the above object, a surface defect inspection apparatus for inspecting a three-dimensional mirror surface according to the present invention has a single imaging means for imaging the inspection object and a single light from various directions on the surface of the inspection object. A diffusing light illuminating means for irradiating in such a manner, an optical path refracting means for refracting an optical path to image an imaging target portion that does not face the imaging means, and an image processing means for calculating the imaging data of the imaging means, A plurality of parts of a three-dimensional inspection object are simultaneously imaged by a single imaging means.

  According to the first problem solving means, when inspecting the three-dimensional mirror surface of the inspection object, it is possible to take an image by using the optical path refracting means even if the part is not directly facing the imaging means. Therefore, it becomes possible to image the site | parts of a several test target object with one imaging camera.

  The second problem solving means is the first problem solving means, characterized in that images of a plurality of parts to be imaged are separately arranged in one imaging screen, and a plurality of examinations of an object The site can be observed simultaneously.

  The third problem-solving means is the first problem-solving means, and the imaging range of each image is determined so that the images of the plurality of parts to be imaged have overlapping portions with the adjacent images. As a feature, it is possible to observe all inspection parts of the inspection object.

  The fourth problem-solving means is the first problem-solving means, and the imaging means is constituted by a telecentric optical system.

  The fifth problem solving means is the first problem solving means, characterized in that the diffused light illuminating means is disposed between the inspection object and the optical path refraction means.

  A sixth problem solving means is the first problem solving means, wherein the diffused light illuminating means is a surface light source, and is capable of transmitting reflected light from the inspection object to the imaging means. .

  The seventh problem-solving means is the first problem-solving means, wherein the diffused light illuminating means is formed in a dome shape, and an observation window for the imaging means is provided at a substantially top portion thereof. The diffused light illuminating means and a second diffused light illuminating means for irradiating coaxially with the optical axis of the optical system of the imaging means.

  The eighth problem-solving means is the seventh problem-solving means, wherein the first diffused light illuminating means is provided with a light emitting portion at the periphery of the dome, and the inner surface of the dome is used as a reflecting surface. The light reflected from the inner surface of the dome illuminates the inspection object from various directions, so that the surfaces of the inspection object in various directions can be observed by the imaging means.

  A ninth problem solving means is a seventh problem solving means, wherein the second diffused light illuminating means comprises a diffused light source part and a half mirror, and the diffused light from the diffused light source part is half. It is characterized in that it is reflected by a mirror and illuminated coaxially with the optical axis of the optical system of the imaging means, and the illumination light is reduced at the top of the first illumination means by the amount of the observation window for the imaging means. It plays a role to supplement and obtains uniform illumination light.

  A tenth problem solving means is a seventh problem solving means, wherein the second diffused light illuminating means is provided with a polarizing filter or a neutral density filter. By using these filters, The illuminance of the second illumination light is matched with the illuminance of the first illumination light.

  The eleventh problem-solving means is the first problem-solving means, wherein the optical path refracting means is formed of a plurality of refracting members, and is an inspection object that does not face the imaging means. Even a part can be imaged as if it were directly facing the imaging means.

  The twelfth problem solving means is the first problem solving means, wherein the optical path refracting means determines the shape of the refractive member so that the optical path lengths of the plurality of imaging parts are equal, and the imaging part is characterized in that Regardless of whether the focus is the same.

  The thirteenth problem solving means is the first problem solving means, and the object to be inspected is a notch portion provided at the peripheral edge of the silicon wafer, the notch portion upper surface taper portion, the notch portion lower surface taper portion, the notch At least five images of the left and right slopes of the side bottom and notch side are taken.

  The fourteenth problem-solving means is the first problem-solving means, and the inspection object is the entire circumference of the peripheral edge of the silicon wafer. An image of the taper part and the subsequent roll-off part and side part are taken.

  The fifteenth problem solving means is the first problem solving means, wherein the image processing means deletes overlapping portions of the images of a plurality of parts imaged by the imaging means and displays the images in a developed view. It is characterized by that.

  In the case of inspecting the surface of a three-dimensional part, conventionally, a plurality of imaging means are arranged to inspect a part having a different three-dimensional shape. However, this method has a problem that the more complex the shape, the more imaging means are required, and the apparatus becomes complicated and expensive.

  The surface defect inspection apparatus according to the present invention makes it possible to image a plurality of parts having different three-dimensional shapes by using a single imaging means, without preparing a large number of cameras as in the prior art. This enables imaging of a plurality of parts having a three-dimensional shape. As a result, the configuration of the apparatus is simplified and the production cost can be reduced.

  Further, by using the uniform diffused light illumination means, there is illumination light that is incident on the image pickup means even if it is a three-dimensional portion such as a round shape at the corner portion when there is no unevenness. Therefore, even if it is a three-dimensional part, there is no possibility of erroneously determining a defect, and the defect can be detected correctly.

  The method and apparatus of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by a present Example.

  FIG. 1 is a plan view for explaining a surface defect inspection apparatus according to a first embodiment of the present invention. The surface defect inspection apparatus 1 includes an imaging camera 2, diffused light illumination means 3, and optical path refraction means 4.

  FIG. 2 is a side view showing the form seen from the right direction in FIG. 1 with a partial cross section. The silicon wafer 5 is rotatably supported by a turntable (not shown) and horizontally.

  FIG. 3 shows the shape of the notch 6 provided at the peripheral edge of the silicon wafer 5 as the inspection object. 3A is a view of the notch 6 as viewed from above, and FIG. 3B is a view of the notch 6 as viewed from the front side of the side surface, that is, from the optical axis direction of the imaging camera 2. FIG. ) Is a cross-sectional view taken along arrow A. The notch 6 is provided at the peripheral edge of the silicon wafer 5 for discrimination and positioning of the crystal direction of the silicon wafer 5. As shown in FIG. 3A, the notch 6 has a substantially U-shaped edge. The shape is a notch. A taper surface is formed on the upper surface and the lower surface of the peripheral edge of the silicon wafer 5 over the entire periphery, and a taper surface is also formed on the notch portion as shown in FIG.

  As the imaging camera 2, a two-dimensional imaging device such as an area sensor camera is suitable. The imaging camera 2 is arranged at a position facing the notch 6 toward the center of the silicon wafer 5 and images each part of the notch 6.

  The imaging camera 2 is preferably configured to include a telecentric optical system 7. FIG. 4 is an explanatory diagram for explaining a double-sided telecentric optical system.

  A diaphragm 72 is disposed between the object side lens 71 and the CCD side lens 73, and the position thereof is the rear focal point of the object side lens 71 and the front focal point of the CCD side lens 73. It is burned. In the optical system configured as described above, the principal ray becomes a ray parallel to the optical axis of the object side lens 71, and the principal ray that has passed through the CCD side lens 73 becomes parallel to the optical axis of the CCD side lens 73. That is, only light rays parallel to the optical axis of the telecentric optical system are incident on the CCD element 74. As a result, regardless of the position of the object to be imaged, the size of the image captured by the CCD element 74 is constant, and the size of the defect in the inspection object can be accurately measured. The CCD element 74 is a light receiving element, and when an area sensor camera is used, an area sensor is used.

  FIG. 6 is an explanatory view for explaining the flat diffused light illuminating means 4, FIG. 6 (a) shows a part of the flat diffused light illuminating means 4 in cross section, and FIG. 6 (b) shows that part. FIG. 6C is an explanatory diagram in which a part of FIG. 6A is enlarged.

  As shown in FIG. 6 (a), the flat diffused light illuminating means 4 is configured by providing a flat transparent member 31 with a large number of dome-shaped depressions, and applying a material that reflects light to the depressions. 32 is formed. Since the reflecting part 32 has a dome shape as shown in FIG. 6C, the light from the light source 33 is reflected at a wide angle, and these reflecting parts 32 are provided uniformly on the transparent member 31. Thus, uniform diffused light illumination can be obtained. Further, the reflected light can be more scattered by roughening the surface. Portions other than the recessed portion 32 of the transparent member 31 are kept so that light can be transmitted.

  Here, the size and interval of the recesses of the reflection unit 32 are configured so as not to affect the imaging due to the aperture value of the imaging lens of the imaging camera 2 and the interval between the imaging camera 2 and the silicon wafer 5 as the inspection object. do it. On the other hand, when the size of the indentation and the interval between the indentations are determined due to manufacturing restrictions, the aperture value of the imaging lens of the imaging camera 2 and the distance between the site to be inspected and the flat diffused light illumination means 3 are appropriately selected. Thereby, the influence on the imaging of the reflection part 32 can be made appropriate.

  Light emitted from the flat diffused light illuminating means 3 in various directions illuminates the edge portion of the silicon wafer 5 which is a three-dimensional inspection object on the mirror surface from various directions and is reflected on the surface of the silicon wafer 5. To do. This reflected light is transmitted through a portion of the transmissive member 31 other than the reflective portion 32 and is observed by the imaging means 2.

  In the above-described flat diffused light illuminating means 3, a recess is provided in the transparent member 31 to form the reflecting portion 32. However, as described in JP-A-2004-319466, a dome-shaped protrusion is provided in the transparent member. It is good also as a structure which makes this a reflection part.

  As shown in FIGS. 1 and 2, the optical path refracting means 4 is composed of a plurality of prisms 41, 42, 43, and 44, which are refracting members, and a transparent member 45, and each of the prisms corresponds to an image to be captured. The shape is defined. Here, the prism 41 is an optical path refraction member for imaging the left portion of the side surface of the notch 6, and the prism 42 is an optical path refraction member for imaging the right portion of the side surface of the notch 6. Is an optical path refraction member for imaging the upper tapered surface of the notch 6, and the prism 44 is an optical path refraction member for imaging the lower tapered surface of the notch 6. The transparent member 45 is used for adjusting the optical path length because the optical path length is different between the case where the bottom of the side surface of the notch 6 is imaged and the case where another prism member is used, but can be adjusted by the length of the prism member. In such a case, it is unnecessary.

  Next, procedures and functions for performing inspection using the surface inspection apparatus of this embodiment will be described. A silicon wafer 5 as an inspection object is placed on a rotary table (not shown), and the notch 6 stops at a position facing the imaging camera 2, and the notch 6 is imaged by the imaging camera 2. Perform surface defect inspection.

  At this time, the imaging camera 2 passes through the optical path guided by the prism and the transparent member in which the five parts of the left side portion, the bottom side surface, the right side surface portion, the upper tapered surface, and the lower tapered surface of the notch are respectively guided by the prism and the transparent member. Each image is captured by arriving at.

  The function of the optical path refracting means 4 will be described with reference to FIG. 5 taking as an example a prism 41 arranged for imaging the left part of the side surface of the notch. Since the flat diffused light illuminating means 3 is illuminated from a wide angle direction, the illumination light reaches the surface of the notch 6 from various directions at a wide angle. When the surface of the notch 6 is not scratched, the notch surface is a mirror surface, so that there is illumination light that reflects in the direction of the arrow A in FIG. Here, the arrow A direction is a direction orthogonal to the surface 41 a of the prism 41 of the optical path refracting means 4. The reflected light traveling in the direction of arrow A enters the prism 41, which is one of the refractive members of the optical path refracting means 4, and is totally reflected by the surface 41b, and then totally reflected by the surface 41c and proceeds in the optical axis direction of the imaging camera 2. The image is taken as an image by the imaging camera 2. That is, the prism 41 is formed in such a shape that light incident in a direction orthogonal to the surface 41 a is refracted twice by the surface of the prism 41 and proceeds in the optical axis direction of the imaging means 2. The image by the prism is captured by the imaging camera 2 as an erect image because total reflection occurs twice. The other prisms are formed in the same manner, and images of the corresponding notch 6 are obtained.

  A prism 42 is disposed at a position symmetrical to the prism 41 with respect to the optical axis of the imaging camera 2. The prism 42 is an optical path refracting means for imaging the right portion of the side surface of the notch 6. Similarly, it plays a role of making the side surface portion of the notch enter the imaging camera 2 as an upright image.

  As shown in FIG. 2, the prism 43 is an optical path refracting means for imaging the upper tapered surface of the notch 6, and the upper tapered surface portion of the notch is used as an upright image to the imaging camera 2 in the same manner as the prisms 41 and 42. Plays the role of incidence. Similarly, the prism 44 causes the lower tapered surface portion of the notch to enter the imaging camera 2 as an erect image. The bottom of the side surface of the notch is imaged by the reflected light passing through the transparent member 45.

  Since the imaging means used in the surface defect inspection apparatus 1 of the present embodiment is a telecentric optical system imaging means, the reflected light that is parallel to the optical axis of the optical system of the imaging means out of the illumination light from the flat diffused light illumination means 3. Only incident on the CCD element 74. Therefore, light is scattered at locations where there are flaws or deposits that are defects on the surface being imaged, resulting in a decrease in the amount of light rays parallel to the optical axis incident on the imaging means, and contrast between locations that are flat. There is a difference. That is, a shadow appears in a place where there is a flaw or a deposit that is a defect. The minute unevenness inspection apparatus of the present invention uses this property to detect minute unevenness on the inspection surface as a difference in brightness.

  The telecentric optical system can convert the irregularities of specular defects into grayscale images, and because the object is imaged at a constant size regardless of the position of the object, the size and position of the defect can be accurately determined in defect inspection. It has the feature of knowing. Although it is possible to detect defects using an imaging camera with a normal optical system that does not have a telecentric optical system, the size of the image changes when the distance of the inspection object changes, so the defect can be accurately detected. The position and size cannot be known.

  Since the prisms 41 and 42 are arranged as shown in FIGS. 1 and 2, the bottom of the side surface of the notch 6 is arranged at the center of the field of view of the imaging camera 2, and the left side of the notch 6 is the side of the imaging camera 2. The right side of the field of view and the right side of the side surface of the notch 6 are arranged on the left side of the field of view of the imaging camera 2 and images are taken without overlapping each other. The same applies to the images by the prisms 43 and 44, and they are arranged in the field of view of the imaging camera as shown in FIG.

  FIG. 8 shows an image captured by the image capturing camera 2 shown in FIG. 7, with the overlapping portions removed by image processing means (not shown) and displayed in a developed view with the contact points of the images matched. Yes, the state of the notch surface can be confirmed at a glance.

  A second embodiment of the surface defect inspection apparatus of the present invention is shown in the plan view of FIG. 9 and the side view of FIG. The difference from the surface defect apparatus of the first embodiment is an illumination apparatus, and the other configurations are the same. The lighting device includes a dome-shaped lighting device 8 and a coaxial lighting device 9.

  As shown in FIG. 11, the dome-shaped illumination device 8 includes a light guide 81 of a metal halide lamp light source disposed around the opening 83 of the dome, a dome-shaped reflecting surface 82, and an opening 83, and the top of the dome. The part is provided with an imaging window 84 in which an optical path refracting means to be described later is arranged. As can be seen from FIG. 11, the diffused light emitted from the light guide 81 arranged toward the dome-shaped reflecting surface 82 is reflected by the dome-shaped reflecting surface, and the reflected light illuminates the inspection object. Light enters the surface of the object at various angles. Further, it is desirable that the reflecting surface 82 be a surface with extremely fine irregularities. As a result, the reflected light is reflected at various angles, and enters the surface of the silicon wafer 5 to be inspected at various angles. Thus, the illumination light is incident on the object at a wide angle.

  The dome illumination device 8 has a problem in that since the imaging window 84 is provided at the top, the amount of reflected light from the vicinity of the top cannot be secured, and uniform illumination light cannot be obtained. Therefore, the coaxial illumination device 9 is disposed as the second diffused light illumination means to reinforce the illumination light from the vicinity of the top.

  As shown in FIG. 12, the coaxial illumination device 9 is provided with a surface light source 91 that emits diffused light in a direction substantially orthogonal to the optical axis of the imaging camera 1, and the illumination light emitted from the surface light source 91 is emitted from the imaging means. The light is reflected by the half mirror 92 disposed at an angle of approximately 45 ° with respect to the optical axis, and the notch 6 is illuminated from the optical axis direction of the imaging means. A light amount adjustment filter 93 for adjusting the light amount is disposed between the surface light source 91 and the half mirror. A deflection filter or a neutral density filter can be used as the light amount adjustment filter 93.

  When the dome illumination device 8 and the coaxial illumination device 9 are turned on at the same time, the illumination light in which these illumination lights are combined is not necessarily uniform illumination light. Therefore, the intensity of the illumination light of the coaxial illumination device 9 is adjusted by disposing a light amount adjustment filter 93 for adjusting the amount of light between the surface light source 91 and the half mirror 91, and uniform diffusion to the inspection object. Realize light illumination. As the light amount adjustment filter 93, a deflection filter or a neutral density filter can be used. A deflection filter is a filter that adjusts the amount of light by allowing only specific deflection light to pass therethrough, and a neutral density filter, so-called ND filter, is a filter that reduces the amount of transmitted light.

  FIG. 13 is a side view for explaining a surface defect inspection apparatus according to a third embodiment of the present invention. The inspection object is a terminal edge portion excluding the notch portion 6 of the silicon wafer. The surface defect inspection apparatus 11 includes an imaging camera 12, a flat diffused light illuminating unit 3, and an optical path refracting unit 13. Although FIG. 13 illustrates an example using a flat diffused light illuminating means, a configuration in which uniform diffused light illumination is obtained by combining the dome-shaped illuminating device 3 and the coaxial illuminating device 4 as the second illuminating means is also possible. Good.

  FIG. 14 is a cross-sectional view of the end edge portion of the silicon wafer 6 and shows the shape of the end edge portion other than the notch portion. The roll-off part shown by FIG. 15 means the flat part which does not become the product following a taper part.

  The imaging camera 12 used in the third embodiment is a line sensor camera, and sets the main scan direction of the linear sensor array as the imaging element in the thickness direction of the silicon wafer. Further, by using an imaging camera provided with a telecentric optical system, the size of the measurement object can be confirmed without being affected by the distance to the inspection object.

  As shown in FIG. 13, the optical path refracting means 13 is configured by combining prisms 43 and 44 and a transparent member 45. Unlike the case of the notch used in the first and second embodiments, the left and right side prisms 41 and 42 are omitted.

  The surface defect inspection apparatus of the third embodiment performs surface defect inspection by placing the silicon wafer 5 on a turntable (not shown) and picking up an image with the image pickup camera 12 while rotating at a constant speed. The main scan direction of the line sensor array mounted on the imaging camera 12 is set to the thickness direction of the silicon wafer 5, that is, the vertical direction in FIG. 13, and the silicon wafer 5 is rotated at a constant speed to be orthogonal to the main scan direction. The two-dimensional image of the terminal edge of the silicon wafer 5 is imaged over the entire periphery of the terminal edge.

  The optical path refracting means 13 includes a prism 43 for imaging the upper tapered surface and the subsequent roll-off portion of the silicon wafer 5, and a prism 44 for imaging the lower tapered surface and the subsequent roll-off portion as shown in FIG. Therefore, it is possible to pick up a precise image as if the individual cameras were arranged at the directly facing positions.

  The surface defect apparatus of the third embodiment is different from the first embodiment and the second embodiment only in the form of the imaging camera and the configuration of the optical path refraction means, and the other main parts are common. The inspection procedure is the same as in the first and second embodiments, but the captured image is different in that a two-dimensional image is obtained after the entire circumference of the silicon wafer 5 is captured.

  As described above, the surface defect apparatus of the present embodiment has been described as being applied to the surface defect inspection of the peripheral edge portion of the silicon wafer and the notch provided at the peripheral edge portion. However, the surface defect device is not limited to these inspection objects. However, the present invention can be applied to any three-dimensional inspection object having a mirror-like surface.

  When inspecting the surface of a three-dimensional part, conventionally, it is a normal method to inspect a part having a different three-dimensional shape by arranging a plurality of imaging means, but the more complicated the shape is A large number of imaging means are required, and there is a problem that the apparatus is complicated and expensive.

  According to the surface defect inspection apparatus of the present invention, an optical path refracting unit is disposed between an inspection object and an imaging unit, thereby imaging a plurality of parts having different three-dimensional shapes using the imaging unit and one imaging unit. Thus, it is possible to image a plurality of three-dimensional parts without preparing a plurality of cameras as in the prior art.

  Furthermore, since uniform diffused light illumination that is incident at a wide angle, such as a flat light source illumination device, is used, uniform diffused light from various angles sufficient for defect detection even on a complicated three-dimensional surface. Lighting can be obtained.

  As a result, since a plurality of imaging cameras are not required for manufacturing the device, the manufacturing cost is greatly reduced and the configuration of the device is simple, so that the time required for assembly and adjustment of the device is shortened. The In addition, since the configuration of the apparatus is simple, the time required for maintenance is reduced. As a result, high productivity can be secured and the contribution to the industry is great.

  It is a top view explaining the 1st example of the present invention.   It is a side view explaining the 1st example of the present invention.   It is explanatory drawing which shows the shape of a notch.   It is explanatory drawing explaining a telecentric optical system.   It is explanatory drawing explaining the function of an optical path refraction means.   It is explanatory drawing explaining a flat light source illuminating device.   It is explanatory drawing which shows the relationship between the visual field of an imaging camera, and a target imaging part.   It is explanatory drawing in the case of combining the captured image.   It is a side view explaining the 2nd example of the present invention.   It is a top view explaining the 2nd example of the present invention. It is sectional drawing explaining a dome-shaped illuminating device.   It is explanatory drawing explaining a coaxial illuminating device.   It is a side view explaining the 3rd example of the present invention.   It is explanatory drawing which shows the termination | terminus edge part of a silicon wafer in a cross section.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Surface defect inspection apparatus 2 Imaging camera 3 Flat light source illumination apparatus 4 Optical path refraction means 5 Silicon wafer 6 Notch 7 Telecentric optical system 8 Dome type illumination apparatus 9 Coaxial illumination apparatus 11 Surface defect inspection apparatus 12 Imaging camera 13 Optical path refraction means 21 Side right Partial image 22 Side left side image 23 Upper tapered surface image 24 Lower tapered surface image 25 Side bottom image 41, 42, 43, 44 Prism 45 Transparent member 71 Object side lens 72 Aperture 73 CCD side lens 74 CCD element 81 Light guide 82 Reflecting surface 83 Opening 84 Window 91 Surface light source 92 Half mirror 93 Light amount adjustment filter

Claims (15)

  An inspection apparatus for inspecting a three-dimensional mirror surface of an inspection object, wherein one imaging means for imaging the inspection object and diffused light that uniformly irradiates light from various directions on the surface of the inspection object A three-dimensional inspection target, comprising: an illuminating unit; an optical path refracting unit that refracts an optical path to capture an imaging target portion that does not face the imaging unit; and an image processing unit that performs arithmetic processing on imaging data of the imaging unit. A surface defect inspection apparatus characterized in that a plurality of parts of an object are simultaneously imaged by a single imaging means.   The surface defect inspection apparatus according to claim 1, wherein images of a plurality of parts to be imaged are separately arranged in one imaging screen.   2. The surface defect inspection apparatus according to claim 1, wherein an imaging range of each image is determined such that images of a plurality of parts to be imaged have overlapping portions with adjacent images.   The surface defect inspection apparatus according to claim 1, wherein the imaging unit includes a telecentric optical system.   The surface defect inspection apparatus according to claim 1, wherein the diffused light illuminating unit is disposed between the inspection object and the optical path refracting unit.   The surface defect inspection apparatus according to claim 1, wherein the diffused light illuminating unit is a surface light source and can transmit reflected light from an inspection object to the imaging unit.   The diffused light illuminating means is formed in a dome-like shape, and has a first diffused light illuminating means provided with an observation window for the imaging means at a substantially top portion thereof, and coaxial with the optical axis of the optical system of the imaging means. The surface defect inspection apparatus according to claim 1, comprising a second diffused light illuminating means for irradiating.   The surface defect inspection apparatus according to claim 7, wherein the first diffused light illuminating means includes a light emitting portion in a peripheral portion of the dome, and uses the inner surface of the dome as a reflecting surface.   The second diffused light illuminating means comprises a diffused light source part and a half mirror, and the diffused light from the diffused light source part is reflected by the half mirror and illuminated coaxially with the optical axis of the optical system of the imaging means. The surface defect inspection apparatus according to claim 7.   The surface defect inspection apparatus according to claim 7, wherein the second diffused light illumination unit includes a polarizing filter or a neutral density filter.   2. The surface defect inspection apparatus according to claim 1, wherein the optical path refracting means is formed of a plurality of refractive members.   The surface defect inspection apparatus according to claim 11, wherein the optical path refracting means determines the shape of the refractive member so that the optical path lengths of the plurality of imaging regions are equal.   The inspection object is a notch portion provided at the peripheral edge of the silicon wafer, and at least five portions of the notch portion upper surface taper portion, the notch portion lower surface taper portion, the notch side surface bottom portion and the left slope surface and right slope portion of the notch side surface. The surface defect inspection apparatus according to claim 1, wherein an image is picked up.   The inspection object is the entire circumference of the peripheral edge of the silicon wafer, and images of the upper surface taper part of the peripheral edge part and the roll-off part, lower-surface taper part, and subsequent roll-off part and side part of the subsequent part are taken. The surface defect inspection apparatus according to claim 1.   The surface defect inspection apparatus according to claim 1, wherein the image processing unit deletes overlapping portions of the images of a plurality of parts imaged by the imaging unit and displays the images in a developed view.

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