JP2007129019A - Apparatus and method of forming terminal electrode of array-type electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technology for forming a terminal electrode of an array-type electronic component, which can cope with a stringiness by a simple means, and urges leveling of an electrode material to stabilize the applied shape thereof as well as causes no variation in thickness and width of the terminal electrode. <P>SOLUTION: An endless belt 1 and the array-type electronic components 9 are so arranged that the endless belt 1 may be located upside and the array-type electronic components 9 may be located downside. The array-type electronic components are set with their surfaces where the terminal electrodes are to be formed as faced upwards. Then, by bringing the surfaces where the terminal electrodes are to be formed into contact with the surface of the downside transfer 1a of the endless belt 1, the electrode material is transfer-applied onto the surfaces where the terminal electrodes are to be formed to form the terminal electrodes 95. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a terminal electrode forming apparatus and a terminal electrode forming method for an array type electronic component for forming a terminal electrode by transferring and applying an electrode material to a surface of an array type (multi-terminal) electronic component.

  Conventionally, as a method of forming a terminal electrode by transferring and applying an electrode material to an array type electronic component that requires a terminal electrode, the surface of the terminal type electronic component of the array type electronic component is brought into contact with the surface of the electrode material and pulled up. A so-called dip method is known (see Patent Document 1).

  However, in this dip method, as shown in FIG. 10, the array type electronic component 9 and the electrode material P are arranged so that the array type electronic component 9 is on the top and the electrode material P is on the bottom.

As described above, when the array type electronic component 9 is disposed on the upper side, when the lower surface 91 of the array type electronic component 9 is brought into contact with the electrode material P and then the array type electronic component 9 is pulled up, the electrode material P becomes pasty. Therefore, the stringing phenomenon occurs in the electrode material P.
When the stringing portion P2 of the electrode material P is broken, the drooping portion P1 remains as it is due to gravity, so that the electrode material 9 cannot be leveled, and the application shape becomes unstable, and the terminal as shown in FIG. There has been a problem that unevenness occurs in the thickness and width of the electrode 95.
Japanese Patent Publication No. 7-153652

  The present invention has been made to solve the above problems, and can deal with the stringing phenomenon of the electrode material by simple means, promotes leveling of the electrode material to stabilize the coating shape, It is an object of the present invention to provide an array type electronic component terminal electrode forming apparatus and an array type electronic component terminal electrode forming method capable of ensuring a sufficient thickness for obtaining reliability without unevenness in width.

In order to solve the above-mentioned problem, a terminal electrode forming apparatus for an array type electronic component according to the present invention (Claim 1)
Electrode material is transferred and applied to the terminal electrode formation target surface by filling the endless belt with the electrode material in the groove formed on the surface and bringing the endless belt into contact with the terminal electrode formation target surface of the array type electronic component. A terminal electrode forming apparatus for an array type electronic component that is configured to form a terminal electrode,
The endless belt and the array-type electronic component are arranged so that the endless belt is on and the array-type electronic component is on the bottom,
The electrode material is transferred to the terminal electrode formation target surface by making the terminal electrode formation target surface of the array type electronic component the upper surface and contacting the terminal electrode formation target surface with the surface of the lower transition portion of the endless belt. A terminal electrode was formed by coating.

Moreover, the terminal electrode forming apparatus for an array type electronic component of the present invention (Claim 2)
An endless belt having a concave groove formed on the surface, an intermittent drive device for intermittently moving the endless belt, a holding device for an array type electronic component disposed below the endless belt, and a back surface of the endless belt A backing device for holding the material, and a material supply device for filling an electrode material into the concave groove of the endless belt,
The array type electronic component is held by a holding device so that the terminal electrode formation target surface is an upper surface,
In the intermittent stop state of the endless belt, the terminal electrode formation target surface of the array type electronic component is brought into contact with the surface of the lower transition portion of the endless belt while pressing the back surface of the lower transition portion of the endless belt with the holding device. Thus, the terminal electrode was formed by transferring and applying the electrode material to the terminal electrode formation target surface.

In addition, the terminal electrode forming method of the array type electronic component of the present invention (Claim 3)
Electrode material is transferred and applied to the terminal electrode formation target surface by filling the endless belt with the electrode material in the groove formed on the surface and bringing the endless belt into contact with the terminal electrode formation target surface of the array type electronic component. A terminal electrode forming method for an array type electronic component in which a terminal electrode is formed,
The endless belt and the array-type electronic component are arranged so that the endless belt is on and the array-type electronic component is on the bottom,
The electrode material is transferred to the terminal electrode formation target surface by making the terminal electrode formation target surface of the array type electronic component the upper surface and contacting the terminal electrode formation target surface with the surface of the lower transition portion of the endless belt. A terminal electrode was formed by coating.

  In the present invention, the endless belt refers to a belt having no end by making a belt member into a circular shape.

In the present invention, the endless belt and the array type electronic component are arranged so that the endless belt is on the top and the array type electronic component is on the bottom. The electrode material flows on the terminal electrode formation target surface, and the leveling of the electrode material is promoted.
In this way, the coating shape can be stabilized by simple means of arranging the endless belt up and the array-type electronic components down, and there is no unevenness in thickness and width, which is sufficient for obtaining reliability. A terminal electrode capable of securing the thickness can be formed.

  FIG. 1 is a schematic explanatory view showing an embodiment of a terminal electrode forming apparatus for an array type electronic component according to the present invention, FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is a perspective view of an array type electronic component, FIG. 4 is a perspective view of the endless belt as seen from below, showing the state of application of the electrode material, and FIGS. 5 to 9 are cross sections showing examples of the cross-sectional shape of the groove FIG.

In the figure, reference numeral 1 denotes an endless belt, which is wound around four rollers 15 and intermittently moves at regular intervals in the direction of arrow R by the intermittent drive device 2.
The endless belt 1 is made of silicon or the like and has elasticity in the thickness direction. A concave groove 10 is formed on the surface, and an electrode material P (metal-containing paste) is filled in the concave groove 10. It is like that.

  The concave groove 10 is formed in an annular shape along the length direction of the endless belt 1. As will be described later in the embodiment, four terminals are provided on the upper surface 90 and the lower surface 91, which are terminal electrode formation surfaces of the capacitor chip 9. The electrode 95 is formed, and the capacitor chips 9 are arranged in five rows in the width direction of the endless belt 1, and 20 bars in the width direction of the endless belt 1 (four sets as one set, five sets in total) 20 streaks) are formed.

  The cross-sectional shape of the groove 10 is, for example, a square shape as shown in FIG. 5, a V shape as shown in FIG. 6, a Y shape as shown in FIG. 7, a U shape as shown in FIG. Such a bottom V-shape is determined in consideration of the width and thickness of the terminal electrode.

A dispenser 30 for filling the concave groove 10 with the electrode material P is provided opposite to the concave grooves 10.
A squeegee 31 is attached to the tip of the dispenser 30 to scrape off the electrode material P protruding from the grooves 10 and to make the surface of the filled electrode material P uniform with the surface of the endless belt 1. The surface of the material P is leveled.

The capacitor chip 9 as an array type electronic component is formed in a rectangular parallelepiped shape, and the upper surface 90 and the lower surface 91 are used as terminal electrode formation target surfaces, and each of the terminal electrode formation target surfaces has four terminal electrodes. 95 is formed.
The array-type electronic component is not limited to a capacitor chip, but can be an inductor chip (filter chip), a resistor chip, a crystal oscillator chip, or the like.

The capacitor chip 9 as the array type electronic component is held by a holding device 4 disposed below the lower transition portion 1a of the endless belt 1.
The holding device 4 includes a clip holder 4a in which a fitting hole 40 of the capacitor chip 9 is formed, and a lower plate 4b for detachably holding the clip holder 4a.
In this case, a vacuum chamber 41 is formed on the upper surface of the lower plate 4b, and the clip holder 4a is set so as to close the vacuum chamber 41. In this state, the vacuum chamber 41 is evacuated through the vacuum channel 42 (negative pressure). By doing so, the clip holder 4a with the capacitor chip 9 held in the fitting hole 40 is held by the lower plate 4b.
In addition, in the Example, although the clip holder 4a is hold | maintained using a vacuum, the clip holder 4a can also be hold | maintained using a magnet.

The clip holder 4a is configured to hold a large number of capacitor chips 9. In the embodiment, a total of 60 pieces of 12 in the length direction of the endless belt 1 and 5 rows in the width direction of the endless belt 1 are used. A capacitor chip 9 is held.
In this case, each capacitor chip 9 is held with its upper and lower portions protruding from the fitting hole 40 of the clip holder 4a.
The number of capacitor chips 9 to be held by the clip holder 4a is not limited, but the number of capacitor chips 9 held at one time by the clip holder 4a of the holding device 4 (5 rows in the embodiment) The number (20 bars) obtained by multiplying the number of terminal electrodes 95 formed in 9 (54 in the embodiment) is the number of the concave grooves 10.

The holding device 4 is supported so as to be vertically movable.
In the elevating device 5, a nut member 51 is attached to a base 50 connected to the lower plate 4 b, and a feed screw 53 that rotates forward and backward by a servo motor 52 is screwed to the nut member 51, and the feed screw 53 rotates. The holding device 4 moves up and down while being guided by the left and right guide rails 54 and 54.

  That is, when the holding device 4 is lifted, the upper surface 90 (terminal electrode formation target surface) of the capacitor chip 9 held by the clip holder 4 a is brought into contact with the surface of the lower transition portion 1 a of the endless belt 1 to form the groove 10. The terminal electrode 95 is formed by transferring and applying the filled electrode material P to the upper surface 90.

A backing device 6 is provided above the lower transition portion 1a of the endless belt 1 for pressing the back surface of the lower transition portion 1a.
The backing device 6 is for preventing the endless belt 1 from escaping upward when the capacitor chip 9 is brought into contact with the surface of the lower transition portion 1a of the endless belt 1, and is moved up and down in the vertical direction. A possible receiving plate 60 is provided.
In the lifting device, a nut member 62 is attached to a base 61 connected to a receiving plate 60, and a feed screw 64 that rotates forward and backward by a servo motor 63 is screwed to the nut member 62. The plate 60 moves up and down while being guided by the left and right guide rails 65 and 65.

  That is, by lowering the receiving plate 60, it is brought into contact with the back surface of the lower transition portion 1a of the endless belt 1, and when the capacitor chip 9 is brought into contact with the surface of the lower transition portion 1a of the endless belt 1, The lower transition portion 1a of the belt 1 is prevented from being pushed upward and escaping.

A terminal electrode forming method using the terminal electrode forming apparatus of this embodiment will be described.
Each concave groove 10 of the endless belt 1 is filled with the electrode material P by the dispenser 30, and the electrode material P protruding from the concave groove 10 by the squeegee 31 is scraped off, and the surface of the electrode material P is leveled. ing.

  The endless belt 1 is intermittently moved by the intermittent drive device 2, and in the intermittent stop state, the receiving plate 60 of the backing device 6 descends and comes into contact with the back surface of the lower transition portion 1 a of the endless belt 1. The holding device 4 is raised, and the upper surface 90 (terminal electrode formation target surface) of the capacitor chip 9 held by the clip holder 4a of the holding device 4 comes into contact with the surface of the lower transition portion 1a.

  At this time, since the receiving plate 60 is in contact with the back surface of the lower transition portion 1a of the endless belt 1, it is possible to prevent the lower transition portion 1a of the endless belt 1 from being pushed upward and escaping.

  After the terminal electrode 95 is formed on the upper surface 90 of each capacitor chip 9 as described above, the receiving plate 60 of the backing device 6 is lifted away from the endless belt 1 and the holding device 4 is lowered. As a result, the capacitor chip 9 is separated from the endless belt 1, whereby the electrode material P filled in the concave groove 10 is transferred and applied to the upper surface of each capacitor chip 9 to form the terminal electrode 95.

  Since the endless belt 1 has elasticity in the thickness direction, when the upper surface 90 of the capacitor chip 9 is brought into contact with the surface of the lower transition portion 1a, the endless belt 1 is slightly compressed, As shown in FIG. 4, a wraparound portion 95a from the upper surface 90 of the capacitor chip 9 to the adjacent side surfaces 92 can be formed at both ends of the terminal electrode 95. By forming this wraparound portion 95a, the terminal electrode 95 is It can prevent peeling from the end.

  Then, after the receiving plate 60 of the backing device 6 is separated from the endless belt 1, and after the capacitor chip 9 is separated from the endless belt 1, the endless belt 1 is intermittently moved by the intermittent drive device 2, and a new capacitor is obtained. The clip holder 4a holding the chip 9 is attached to the lower plate 4b, and thereafter the terminal electrode 95 is formed on the upper surface 90 of a new capacitor chip 9 by the same operation.

  When the terminal electrode 95 is formed on the lower surface 91 of the capacitor chip 9, after the terminal electrode 95 formed on the upper surface 90 is dried, the clip holder 4 a is turned upside down while holding the capacitor chip 9. The lower surface 91 is made the upper surface 90, and the terminal electrode 95 is formed on the upper surface 90 in the same manner as described above.

It is a schematic explanatory drawing which shows the Example of the terminal electrode formation apparatus of the array type | mold electronic component of this invention. It is AA sectional drawing of FIG. 1, and is a cross-sectional arrow view of the direction orthogonal to the transition direction of an endless belt. It is a perspective view of an array type electronic component. The electrode material is applied and is a perspective view of the endless belt as viewed from below. It is sectional drawing which shows the example of the cross-sectional shape of a ditch | groove. It is sectional drawing which shows the example of the cross-sectional shape of a ditch | groove. It is sectional drawing which shows the example of the cross-sectional shape of a ditch | groove. It is sectional drawing which shows the example of the cross-sectional shape of a ditch | groove. It is sectional drawing which shows the example of the cross-sectional shape of a ditch | groove. It is explanatory drawing for demonstrating the conventional problem. It is explanatory drawing for demonstrating the conventional problem.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Endless belt 1a Lower side transition part 10 Groove 15 Roller 2 Intermittent drive device 30 Dispenser 31 Squeegee 4 Holding device 4a Clip holder 4b Lower plate 40 Fitting hole 41 Vacuum chamber 42 Vacuum flow path 5 Lifting device 50 Base 51 Nut member 52 Servo motor 53 Feed screw 54 Guide rail 6 Backing device 60 Back plate 61 Base 62 Nut member 63 Servo motor 64 Feed screw 65 Guide rail 9 Capacitor chip (array type electronic component)
90 upper surface 91 lower surface 92 side surface 95 terminal electrode 95a wraparound portion P electrode material

Claims (3)

Electrode material is transferred and applied to the terminal electrode formation target surface by filling the endless belt with the electrode material in the groove formed on the surface and bringing the endless belt into contact with the terminal electrode formation target surface of the array type electronic component. A terminal electrode forming apparatus for an array type electronic component that is configured to form a terminal electrode,
The endless belt and the array-type electronic component are arranged so that the endless belt is on and the array-type electronic component is on the bottom,
The electrode material is transferred to the terminal electrode formation target surface by making the terminal electrode formation target surface of the array type electronic component the upper surface and contacting the terminal electrode formation target surface with the surface of the lower transition portion of the endless belt. A terminal electrode forming apparatus for an array type electronic component, wherein the terminal electrode is formed by coating. An endless belt having a concave groove formed on the surface, an intermittent drive device for intermittently moving the endless belt, a holding device for an array type electronic component disposed below the endless belt, and a back surface of the endless belt A backing device for holding the material, and a material supply device for filling an electrode material into the concave groove of the endless belt,
The array type electronic component is held by a holding device so that the terminal electrode formation target surface is an upper surface,
In the intermittent stop state of the endless belt, the terminal electrode formation target surface of the array type electronic component is brought into contact with the surface of the lower transition portion of the endless belt while pressing the back surface of the lower transition portion of the endless belt with the holding device. Thus, a terminal electrode forming apparatus for an array type electronic component, wherein a terminal electrode is formed by transferring and applying an electrode material to a surface on which a terminal electrode is to be formed. Electrode material is transferred and applied to the terminal electrode formation target surface by filling the endless belt with the electrode material in the groove formed on the surface and bringing the endless belt into contact with the terminal electrode formation target surface of the array type electronic component. A terminal electrode forming method for an array type electronic component in which a terminal electrode is formed,
The endless belt and the array-type electronic component are arranged so that the endless belt is on and the array-type electronic component is on the bottom,
The electrode material is transferred to the terminal electrode formation target surface by making the terminal electrode formation target surface of the array type electronic component the upper surface and contacting the terminal electrode formation target surface with the surface of the lower transition portion of the endless belt. A terminal electrode forming method for an array type electronic component, wherein the terminal electrode is formed by coating.

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