JP2007105896A - Manufacturing method for plate laminate, layered structure of plate material and plate material - Google Patents

Manufacturing method for plate laminate, layered structure of plate material and plate material Download PDF

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Publication number
JP2007105896A
JP2007105896A JP2005296103A JP2005296103A JP2007105896A JP 2007105896 A JP2007105896 A JP 2007105896A JP 2005296103 A JP2005296103 A JP 2005296103A JP 2005296103 A JP2005296103 A JP 2005296103A JP 2007105896 A JP2007105896 A JP 2007105896A
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Japan
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plate
frame
plates
long
laminated
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JP2005296103A
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Japanese (ja)
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Naoki Katayama
直樹 片山
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Brother Ind Ltd
ブラザー工業株式会社
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Abstract

<P>PROBLEM TO BE SOLVED: To suppress deformation of plates when coupling pieces are cut. <P>SOLUTION: For manufacturing a passage unit, etching is carried out to six flat plates formed of a metal to be plate materials 101-106. A plurality of plates 11-16 each formed with a frame 111, a plurality of the coupling pieces 115 and a predetermined pattern are formed in respective plates. Etching is further carried out to the six flat plates, thereby forming four slits 131-134 in a pair of long side parts 112a of the frame 111. The plate materials 101-106 are thus fabricated. Next, the plate materials 101-106 layered in a positioning layering state are heated to a predetermined temperature. At the same time, the plates 101-106 are pressured in a layering direction to be diffusion joined to each other. Then, the plurality of coupling pieces 115 are cut by bending the pair of long side parts 112a, whereby a laminate of the plates 11-16 is separated from the frames 111. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a plate laminate in which a plurality of plates are joined to each other, a laminate structure of plate members having a plurality of plates, and a plate member.

  Patent Document 1 describes the structure of a lead frame (plate material) for constituting a cavity unit (flow path unit) of a piezoelectric inkjet printer head. In the cavity unit, a nozzle plate having a plurality of nozzles, a base plate having a pressure chamber for each nozzle, a manifold plate having a manifold chamber as a common ink chamber connecting the ink supply source and each pressure chamber, and the like are laminated and fixed. It is formed with.

  To manufacture the cavity unit, first, a plurality of lead frames are prepared. The lead frame is a substantially rectangular frame frame (frame body), a plurality of plates of the same type arranged in parallel on the inner peripheral side of the frame frame, and a bridge piece (connecting piece) that connects the plurality of plates and the frame frame. Are integrally formed. An ink flow path pattern such as an ink flow path and a pressure chamber is formed on the plurality of plates of the lead frame by etching.

  After preparing these plural types of lead frames, the plurality of lead frames are stacked while being aligned, and the plates are fixed with an adhesive. Then, a plurality of bridge pieces connecting the plate laminate in which the plurality of plates are laminated and fixed to the frame frame of each lead frame are pressed or punched using a punch or the like. Thus, the cavity unit is manufactured by separating the plate laminate from the frame.

JP 2005-28641 A

  In the technique described in Patent Document 1 described above, a pressing or punching force must be applied to each bridge piece using a punch or the like, which makes the work very complicated. However, since the plates are bonded to each other with an adhesive and the frame frames are not bonded to each other, each of the frame frames is cut so that the bridge pieces are cut so that the curvature of the bent portion of the bridge pieces is reduced. A plurality of bridge pieces can be cut for each lead frame. By the way, in the case where diffusion bonding is performed in a state where a plurality of lead frames are stacked while being aligned, portions that are in contact with each other in the stacked state are bonded. In other words, it is difficult to select the joining portion between the lead frames so that only the portion where the adhesive is applied, and the plates of the lead frame and the frame frames are joined. Thus, when not only the plates but also the frame frames are diffusion bonded, the bonded frame frames are bent all at once when cutting a plurality of bridge pieces. When the frame frame is bent all at once, the curvature of the bent portion of the bridge piece increases, and there is a problem that the bridge piece is deformed to the plate and the plate is also deformed.

  Accordingly, an object of the present invention is to provide a method for manufacturing a plate laminate, a laminate structure of plate materials, and a plate material that can suppress deformation of the plate even if the frame body is bent in a direction toward the plate in order to cut the connecting piece. Is to provide.

Means for Solving the Problems and Effects of the Invention

  The plate laminate manufacturing method of the present invention is a plate laminate manufacturing method for forming a plate laminate in which a plurality of plates are joined in a stacked state. In the plate laminate manufacturing method, a plurality of plates arranged in one direction at intervals are provided. A plate member forming step of forming a plurality of metal plate members each having a plate, a frame surrounding the plurality of plates, and a plurality of connecting pieces connecting any of the plurality of plates and the frame; A lamination process of laminating the plurality of plate members and diffusion bonding the plurality of plate members in a positioning lamination state in which the plates that are in contact with each other are aligned, and a laminate of the plates by cutting the plurality of connecting pieces And a separation step of separating from the frame. And the said board | plate material formation process includes the frame body manufacturing process of forming the recessed part or hole for making the said frame body easy to deform | transform.

  According to this, in the joining step, even if the plurality of plate members are positioned and laminated and joined to each other by diffusion bonding, the frame body has a recess or a hole, so the plurality of plate member frames are mutually connected. They are not joined or their joining force is weaker than the joining force at the plate. If the frames are not joined together, it is possible to bend the frame of each plate material individually, and even if the frames are joined together, if the joining force is weak, the connecting piece will be cut When bent, the plurality of stacked plate members slip at the frame portion. Therefore, when the connecting piece is bent, the frame bodies of the plurality of plate members move without being constrained by the other frame bodies stacked on each other, so that each connecting piece can have a small curvature. As a result, deformation of the plurality of plates can be suppressed in the separation step. Note that the frame body processing step may be performed on at least one of the plurality of plate members.

  In this invention, the said board | plate material is the substantially rectangular shape in which the long side followed the said one direction, and the said frame body is a direction orthogonal to the said one direction and a pair of long frame part extended along the said one direction. A plurality of connecting pieces, each of which is provided between the long frame portion and the plate and arranged in the one direction, and the frame body. In the processing step, it is preferable that the concave portion or the hole is formed in the longitudinal frame portion so as to extend in the one direction. Thereby, since a recessed part or a hole is formed only in the location corresponding to a connection piece, a frame processing process can be performed efficiently.

  At this time, in the frame body processing step, the concave portion may be formed as one or a plurality of grooves extending in the one direction. This facilitates the processing of the grooves, reduces the bonding area in the frame portion of the stacked plate members, and reduces the curvature of the plurality of connecting pieces.

  Further, at this time, in the frame body processing step, the grooves are respectively formed in the longitudinal frame portions of the plurality of plate members, and are formed at positions that coincide with each other in a plan view in the positioning and lamination state. May be. Thereby, the joining area in the frame part of the laminated plate material is further reduced, and the curvature of the plurality of connecting pieces is further reduced.

  Further, at this time, in the frame processing step, the grooves formed at positions that coincide with each other in a plan view when each of the plurality of plate members is in the positioning laminated state are in the positioning laminated state. You may form in the surface used as the same side, respectively. Thereby, the joining area in the frame part of the laminated plate material can be further reduced, and the curvature of the connecting piece can be further reduced.

  Further, at this time, in the frame body processing step, a plurality of grooves are formed in the longitudinal frame portion, and the plurality of grooves may be alternately formed on different surfaces in the width direction of the longitudinal frame portion. Good. According to this, when the long frame part is bent so as to face the plate in the outermost layer of the plate laminate, a force in a slipping direction is easily applied to the adjacent long frame part. It becomes difficult to be restrained. Therefore, the connecting piece can further reduce the curvature.

  In this case, in the frame body processing step, two grooves formed on different surfaces adjacent to each other in the width direction of the longitudinal frame portion may be formed so as to partially overlap in a plan view. . Thereby, the longitudinal frame portions of the plate members are not joined to each other. Therefore, it becomes possible to bend for every longitudinal frame part, and the curvature of a some connecting piece becomes small significantly. Therefore, the plate hardly deforms when the plurality of connecting pieces are cut.

  Moreover, in this invention, it is preferable that the said board | plate material formation process includes the connection piece thinning process which makes the thickness of the said connection piece thinner than the said plate and the said frame. Thereby, it becomes easy to cut | disconnect a connection piece, and it becomes difficult to deform | transform a plate.

  The laminated structure of the plate material according to the present invention includes a plurality of plates arranged in one direction at intervals, a frame surrounding the plurality of plates, and any one of the plurality of plates and the frame. A plurality of metal plate members having a plurality of connecting pieces to be connected are diffusion-bonded to each other in a state where a plurality of metal plate members are stacked, and a laminate in which plates are stacked can be obtained by cutting the connecting pieces. In the laminated structure of the plate material, the frame body of the plate material is formed with a recess or a hole for reducing a bonding area with the frame body adjacent in the stacking direction.

  According to this, even if a plurality of plate members are bonded to each other by diffusion bonding, a concave portion or a hole for reducing the bonding area with the frame body adjacent in the stacking direction is formed. When the frame is bent so as to be cut, the curvature of the plurality of connecting pieces is reduced. Therefore, deformation of the plurality of plates can be suppressed when the plurality of connecting pieces are cut.

  The plate material of the present invention includes a plurality of plates arranged in one direction at intervals, a frame body that surrounds the plurality of plates, and a plurality of plates that connect any one of the plurality of plates and the frame body. A metal plate for obtaining a laminated body of the plates by diffusion bonding in a state in which a plurality of these are laminated and cutting the connection piece. And the said frame of the said board | plate material is formed with the recessed part or hole for making a joining area with the said frame adjacent to the lamination direction small.

  Thereby, when a plurality of plates are joined in a stacked state and the frame is bent so as to cut the connecting piece, the curvature of the connecting piece is reduced. Therefore, deformation of the plate can be suppressed when the connecting piece is cut.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  First, an ink jet head including a flow path unit (plate stack) manufactured by the plate stack manufacturing method according to the first embodiment of the present invention will be described. FIG. 1 is an exploded perspective view of an inkjet head including a plate laminate according to the first embodiment of the present invention. In addition, the area | region shown with the dashed-two dotted line in a figure is an area | region where the actuator unit 20 is arrange | positioned. The ink-jet head 6 is applied to an ink-jet printer that forms an image by ejecting ink onto paper. As shown in FIG. 1, the ink jet head 6 includes a head main body 21 that ejects ink and a flexible printed circuit (FPC) 40 that supplies a drive signal to the head main body 21. Among these, the head main body 21 includes a flow path unit 10 in which an ink flow path is formed, and a piezoelectric actuator unit 20 that applies ejection energy to the ink in the flow path unit 10. One end of the FPC 40 is electrically connected to the upper surface 20a of the actuator unit 20, and the other end is connected to a control unit (not shown) of the ink jet printer. Thus, when a drive signal (drive voltage) is supplied from the control unit to the actuator unit 20 via the FPC 40, ink is ejected from the ink ejection surface 6a (see FIG. 4) of the head body 21. A large number of nozzles 35 are opened on the lower surface of the flow path unit 10, that is, the ink ejection surface 6 a, and ink is ejected downward from each nozzle 35.

  FIG. 2 is an exploded perspective view of the flow path unit 10, and FIG. 3 is a partially enlarged perspective view of the flow path unit 10. 4 is a cross-sectional view taken along line IV-IV shown in FIG. As shown in FIG. 2, the flow path unit 10 is formed by laminating a total of six thin rectangular flat metal plates including a nozzle plate 11, a damper plate 12, two manifold plates 13 and 14, a spacer plate 15, and a base plate 16. In addition, the structures are diffusion-bonded to each other. In the present embodiment, each of the plates 11 to 16 is made of stainless steel, but may be made of other metals.

  As shown in FIGS. 2 and 3, a number of nozzles 35 for ejecting ink are formed on the nozzle plate 11 at predetermined intervals. These nozzles 35 are formed in two rows in a staggered arrangement along the longitudinal direction of the nozzle plate 11.

  As shown in FIG. 3, a plurality of pressure chambers 36 are formed in the base plate 16 in two rows in a staggered arrangement along the longitudinal direction of the base plate 16. Each pressure chamber 36 has a rectangular planar shape, and is formed such that its longitudinal direction is orthogonal to the longitudinal direction of the base plate 16. Further, on the side of the base plate 16 facing the spacer plate 15, there are formed a throttle portion 36d connected to each pressure chamber 36 and a communication hole 36b connected to the throttle portion 36d. The end portions 36a of the pressure chambers 36 located on the center side in the short direction of the base plate 16 are through holes 37a formed in a staggered arrangement on the spacer plate 15, the two manifold plates 13 and 14, and the damper plate 12, respectively. It communicates with the nozzle 35 via 37b, 37c, 37d. As shown in FIG. 2, four concave grooves 17 are formed in the surface of the base plate 16 facing the actuator unit 20 along the longitudinal direction. These concave grooves 17 are open to the actuator unit 20 side, and are disposed opposite to the edge portions on both sides of the actuator unit 20 outside the formation region of the pressure chamber 36, as shown in FIG.

  As shown in FIG. 3, two ink chamber halves 14a are formed in a penetrating manner in the manifold plate 14 on the side close to the spacer plate 15 of the two manifold plates. A connection portion 45 is formed on the side wall of the ink chamber half portion 14a so as to correspond to the communication hole 36b. On the other hand, in the manifold plate 13 on the damper plate 12 side, two ink chamber halves 13a are recessed so as to open only toward the manifold plate 14 on the other side. As shown in FIG. 4, in the state where the three plates of the two manifold plates 13 and 14 and the spacer plate 15 are laminated, two common ones are provided on both sides of the row of the through holes 37 a to 37 d. An ink chamber 7 is formed.

  As shown in FIG. 3, the damper plate 12 is provided with a damper groove 12c. The damper groove 12c is formed so as to open only toward the manifold plate 13 side. The planar shape coincides with the common ink chamber 7. Returning to FIG. 2, two ink supply holes 39 a are formed in the base plate 16, and two ink supply holes 39 b are also formed in the spacer plate 15. By joining the base plate 16 and the spacer plate 15, the corresponding ink supply holes 39 a and 39 b are connected to each other, and the ink supply ports 39 corresponding to the two common ink chambers 7 are formed. Further, communication holes 38 that allow the communication holes 36 b and the connection portions 45 to communicate with each other are formed on both ends of the spacer plate 15 in the short direction.

  The flow path unit 10 formed by laminating these six plates 11 to 16 has a communication hole from the common ink chamber 7 through the connection portion 45, the communication hole 38, the communication hole 36b, the throttle portion 36d, and the pressure chamber 36. A plurality of individual ink flow paths reaching the nozzle 35 via 37a to 37d are formed. Then, in each individual ink flow path, ejection energy is given to the ink in the pressure chamber 36 by the actuator unit 20, whereby the ink is ejected from the nozzle 35 through the through holes 37 a to 37 d.

  Next, the actuator unit 20 will be described. FIG. 5 is an exploded perspective view of the actuator unit shown in FIG. As shown in FIGS. 4 and 5, the actuator unit 20 has a structure in which two types of piezoelectric sheets 21 and 22 and one insulating sheet 23 are laminated. On the upper surface of one piezoelectric sheet 21, a plurality of narrow drive electrodes 24 corresponding to each pressure chamber 36 in the flow path unit 10 are provided in a staggered arrangement. As shown in FIG. 5, one end 24 a of each drive electrode 24 is formed so as to be exposed on the side surface of the actuator unit 20.

  A common electrode 25 is provided on the upper surface of the other piezoelectric sheet 22 across the plurality of pressure chambers 36. Similarly to the one end 24 a of the drive electrode 24, the one end 25 a of the common electrode 25 is also formed so as to be exposed on the side surface of the actuator unit 20. In addition, the piezoelectric sheets 21 and 22 can be laminated not only alternately one by one as shown, but also plural sheets can be alternately laminated. Each region in the piezoelectric sheet 22 sandwiched between each drive electrode 24 and the common electrode 25 becomes a pressure generation unit corresponding to each pressure chamber 36. When a voltage is applied between the drive electrode 24 and the common electrode 25, the pressure generating unit is displaced based on the electrostrictive effect of the piezoelectric sheet. Here, the pressure generating part expands and contracts mainly in the stacking direction according to the strength of the electric field.

  A plurality of surface electrodes 26 corresponding to each of the drive electrodes 24 are arranged in two rows on the upper surface of the uppermost insulating sheet 23 (that is, the upper surface 20a of the actuator unit 20). A surface electrode 27 corresponding to the common electrode 25 is provided on one outer side along the line.

  Further, on both side surfaces along the longitudinal direction of the actuator unit 20, a recess 30 is provided at one end 24 a of each drive electrode 24 and a recess 31 is provided at one end 25 a of the common electrode 25 so as to extend in the stacking direction. It has been. In each recess 30, a side electrode 26 a that electrically connects each drive electrode 24 and each surface electrode 26 is formed, and in each recess 31, the common electrode 25 and the surface electrode 27 are electrically connected. Side electrode 27a is formed. The electrodes 28 and 29 are discarded patterns.

  The flow path unit 10 and the actuator unit 20 having such a configuration are stacked and fixed so that the pressure chamber 36 and the drive electrode 24 face each other. At this time, as shown in FIG. 4, the actuator unit 20 is disposed at a position where the lower end portions of the side electrodes 26 a and 27 a face the concave groove 17 of the base plate 16 and is separated from the flow path unit 10. Further, the FPC 40 is laminated on the upper surface 20a of the actuator unit 20, and the wiring pattern (not shown) is electrically joined to the corresponding surface electrodes 26, 27 with solder or the like. As a result, a drive signal can be supplied to the drive electrode 24 via the FPC 40, and a ground potential can be supplied to the common electrode 25.

  When a driving voltage (driving signal) is applied between the arbitrary driving electrode 24 and the common electrode 25, distortion in the stacking direction is generated in the portion of the driving electrode 24 (that is, the pressure generating portion). Discharge energy is given to the ink in the pressure chamber 36 corresponding to the electrode 24. In the flow path unit 10, ink that has flowed into the common ink chamber 7 from the ink supply port 39 is supplied to each pressure chamber 36 via the connection portion 45, the communication hole 38, and the throttle portion 36 d. The ink in each pressure chamber 36 is discharged from the nozzle 35 through the through holes 37a to 37d from the pressure chamber 36 by discharge energy. Thereby, predetermined printing on the paper is performed.

  Next, the laminated structure 100 of the six plate members 101 to 106 formed in the process of manufacturing the flow path unit 10 of the head body 21 will be described below. FIG. 6 is an exploded perspective view of a laminated structure of plate members according to the first embodiment of the present invention. FIG. 7 is a plan view of a laminated structure of plate members according to the first embodiment of the present invention. 8 is a cross-sectional view taken along line VIII-VIII shown in FIG. As shown in FIG. 6, four nozzle plates 11, damper plates 12, manifold plates 13 and 14, spacer plates 15, and base plates 16 each having a predetermined pattern are formed on plate members 101 to 106, respectively.

  Each of the plate members 101 to 106 includes a substantially rectangular frame-shaped frame (frame portion) 111 having a longitudinal direction in a direction orthogonal to the longitudinal direction of each of the plates 11 to 16, and four plates 11 of the same type inside the frame 111. To 16 are arranged along the longitudinal direction of the frame 111, and each of the plate sets 121 to 126 and a plurality of connecting pieces 115 having a small width that are integrally connected to the frame 111, respectively. Yes.

  As shown in FIG. 7, the frame 111 of each of the plate members 101 to 106 includes a pair of long side portions (longitudinal frame portions) 112 a extending along the longitudinal direction of the frame 111 in the drawing and a short side of the frame 111. It has a pair of short side portions (short frame portions) 112b on the left and right in the drawing extending along the hand direction. Positioning holes 113a and 113b for inserting positioning pins (not shown) are formed in the lower long side portion 112a of the pair of long side portions 112a. The positioning hole 113a has a circular planar shape, and the positioning hole 113b has an elliptical planar shape.

  Further, as shown in FIGS. 6 to 8, four grooves (concave portions) 131 to 134 extending along the longitudinal direction of the frame 111 are formed in the pair of long side portions 112 a, respectively. As shown in FIG. 8, of the four grooves 131 to 134, the two grooves 131 and 133 are formed on the upper surface of the long side portion 112a, and the two grooves 132 and 134 are formed on the long side portion 112a. It is formed on the lower surface. The four grooves 131 to 134 are arranged so as to alternately open upward and downward along the width direction of the long side portion 112a (short direction of the plate material). Further, the four grooves 131 to 134 partially overlap other adjacent grooves 131 to 134 in the width direction of the long side portion 112a in plan view. Further, the four grooves 131 to 134 formed in each long side portion 112a are aligned with each other when the plate members 101 to 106 are aligned and stacked, and the corresponding grooves 131 are aligned. -134 are open in the same direction. From this configuration, as shown in FIG. 8, when the plate members 101 to 106 are stacked, the surfaces on which the grooves 131 to 134 of the long side portion 112 a are not formed are just opposite to the grooves 131 to 134, so that they are adjacent to each other. The plate members 101 to 106 do not contact each other at the long side portion 112a. That is, the long side portions 112a are not fixed to each other.

  As shown in FIGS. 6 to 8, each plate in the plate sets 121 to 126 is connected to the pair of long side portions 112 a by the four connecting pieces 115. More specifically, both ends in the longitudinal direction of one plate and the long side portion 112a adjacent to each end are connected by two connecting pieces 115, respectively. As shown in FIG. 8, a missing region 116 is formed on the lower surface side in the entire area of the connecting pieces 115. That is, the thickness of the connecting piece 115 is smaller than the maximum thickness (distance between the upper surface and the lower surface) of the long side portion 112a and the thickness of the plate. Thereby, the adjacent board | plate materials 101-106 do not contact in the connection piece 115. FIG. The depth of the missing region 116 is the same as the depth of the grooves 131 to 134. Further, in plan view, the missing region 116 of the connecting piece 115 and the groove 131 partially overlap in the width direction of the long side portion 112a. That is, when the six plate members 101 to 106 are stacked, the adjacent plate members 101 to 106 do not contact each other at the boundary between the connecting piece 115 and the long side portion 112a. Accordingly, only the plate sets 121 to 126 and the short side portions 112b of the plate members 101 to 106 are in contact with each other. By laminating such six plate members 101 to 106 to each other and diffusion bonding the plate sets 121 to 124 and the short side portions 112b of the plate members 101 to 106, the laminated structure 100 of the plate members 101 to 106 is formed. The

  Then, the manufacturing method of the flow path unit 10 of the head main body 21 is demonstrated below. FIG. 9 is a manufacturing process diagram of the flow path unit. FIG. 10 is a situation diagram when cutting a connecting piece of plate material. As shown in FIG. 9, first, in step 1 (S1), six stainless steel flat plates to be used as plate members 101 to 106 are prepared. Next, in step 2 (S2), the frame 111 in which the positioning holes 113a and 113b are formed, a plurality of connecting pieces 115, and a predetermined pattern (such as the pressure chamber 36 and the nozzle 35) are formed to constitute the plate sets 121 to 126. Etching using a photoresist as a mask is performed on each flat plate so that the plates 11 to 16 are formed. In step 3 (S3), after removing the formed photoresist, the grooves 131 to 134 and the missing region 116 are formed in the pair of long side portions 112a and the plurality of connecting pieces 115 formed in step 2. As shown in the figure, a photoresist is again formed on the flat plate in the region excluding the portions to be the grooves 131 to 134 of the pair of long sides 112a and the region excluding the lower surface of the connecting piece 115, and half-etching is performed ( (Frame processing process, connecting piece thickness reduction process). At this time, the grooves 131 to 134 are formed in the long side portion 112a so as to extend along the longitudinal direction of the long side portion 112a and alternately open in the vertical direction with respect to the width direction of the long side portion 112a. It is formed. Further, when the plate members 101 to 106 are stacked as described above, the plurality of grooves 131 to 134 are positions that coincide with each other in a plan view and are partially adjacent to each other in the width direction of the long side portion 112a. A plurality of grooves 131 to 134 that coincide with each other in the long side portion 112a are formed on the same side surface of the long side portion 112a. At this time, the missing region 116 is formed on the lower surface side of the connecting piece 115 and at a position where the missing region 116 and the groove 131 partially overlap in plan view. Thus, when the connecting piece 115 becomes smaller than the thickness of the plates 11-16, it becomes easy to cut | disconnect at the time of the cutting mentioned later, and the plates 11-16 become difficult to deform | transform. Thus, six plate members 101 to 106 are formed (plate member forming step).

  Next, in step 4, positioning pins are inserted into the positioning holes 113a and 113b formed in the plate members 101 to 106 so that the grooves 131 to 134 formed in the plate members 101 to 106 coincide in plan view. Then, they are laminated together in an array of plate materials 101 to 106 as shown in FIG. And while heating the board | plate materials 101-106 (laminated body) laminated | stacked in the positioning state to predetermined temperature, the upper and lower surfaces of a laminated body are pinched | interposed with a pair of upper and lower plate-shaped jigs, and the lamination direction (perpendicular to the upper and lower surfaces of a board | plate material) is carried out. Pressure). In the present embodiment, the six plate members 101 to 106 constituting the laminated body are pressurized at the same time as reaching a predetermined temperature. However, the laminated body may be preliminarily heated to a predetermined temperature and then pressurized. The laminate may be heated to a predetermined temperature in a pressurized state. In this way, the six plate members 101 to 106 are diffusion bonded to each other (bonding step). At this time, the long sides 112a and the connecting pieces 115 of the plate members 101 to 106 are not diffusion-bonded because the surfaces facing each other are not in contact with each other as described above. That is, only the mutually opposing surfaces of the plates 11 to 16 and the short side portion 112b of the plate members 101 to 106 are diffusion-bonded.

  Next, in step 5 (S5), as shown in FIG. 10, the force application point is near the outer end of the long side portion 112a of the plate member 106 (the end portion farthest from the connecting piece 115 in the long side portion 112a). In the direction in which the long side portion 112a of the plate material 106 is separated from the long side portion 112a of the plate material 105 (the direction in which the angle formed by the upper surface of the long side portion 112a of the plate material 106 and the upper surface of the base plate 16 is reduced and the long side portion 112a is The plate member 106 is lifted in the direction of approaching the base plate 16). As a result, the plate member 106 bends at the connecting piece 115. By performing this bending once to several times, the connecting piece 115 of the plate member 106 is broken, and the plate member 106 is cut at the connecting piece 115. Such a cutting process is sequentially performed in the order of the plate material 106, the plate material 105, the plate material 104, the plate material 103, the plate material 102, and the plate material 101. At this time, since the four grooves 131 to 134 are formed in the long side portion 112a and the adjacent plate members 101 to 106 are not joined at the long side portion 112a and the connecting piece 115, in each cutting process, a predetermined condition The force required to bend the long side part 112a and the connecting piece 115 until the angle is satisfied (for example, the condition that the angle formed by the upper surface near the outer end of the long side part 112a and the upper surface of the base plate 16 is 90 °) is Compared to the case where the plate members 101 to 106 to be joined are joined at the long side portion 112 a and the connecting piece 115. Therefore, the bending work can be easily performed without requiring a large force. In this way, the manufacture of the flow path unit 10 is completed by separating each frame 111 and the laminated body to which the plates 11 to 16 are joined. Since each plate member 101 to 106 is formed with plate sets 121 to 126 including four plates 11 to 16 of the same type, four flow path units 10 are formed at a time.

  In the present embodiment, the plate members 101 to 106 are cut only at the connecting piece 115 in Step 5, but after cutting the plate members 101 to 106 at a place different from the connecting piece 115 in the following procedure. You may cut | disconnect in the connection piece 115. FIG. First, the outer side edge of the long side portion 112a of the plate 101 is bent in a direction approaching the lower surface of the nozzle plate 11, and cut at a position where the groove 133 of the long side 112a is formed. Do the same. And the cutting | disconnection location of the board | plate material 106 is bent in the direction approaching the upper surface of the baseplate 16, and it cut | disconnects in the location in which the groove | channel 132 of the long side part 112a was formed, and this also performs each board | plate material 101-105. That is, the long side part 112a of each board | plate material 101-106 is cut | disconnected in the location in which the grooves 131-133 were formed in order from the outer side. And finally, each long side part 112a is cut | disconnected by the connection piece 115, and the flow-path unit 10 can be manufactured similarly to this embodiment. Also in this case, the curvature at the time of cutting the connecting piece 115 is similarly reduced.

  As described above, according to the manufacturing method of the flow path unit 10 according to the present embodiment, even if the six plate members 101 to 106 are joined to each other by diffusion bonding in the positioning lamination state, the grooves 131 to 134 are formed in the long side portion 112a. Therefore, the long sides 112a of the plate members 101 to 106 are not fixed. As described above, since the long side portions 112a of the plate members 101 to 106 are not fixed, the six plate members 101 to 106 in a fixed state are not bent at a time, but are separated and bent one by one. Therefore, the curvature of the bent portion in the connecting piece 115 can be reduced. Therefore, the plurality of plates 11 to 16 can be prevented from being deformed when the connecting piece 115 is cut.

  Further, since the grooves 131 to 134 adjacent to each other in the width direction of the long side portion 112a partially overlap each other in a plan view, the long side portions 112a are not completely diffusion bonded. Therefore, it becomes possible to bend every long side part 112a of each board | plate material 101-106, and the curvature of the some connection piece 115 becomes remarkably small. Therefore, the plates 11 to 16 are hardly deformed when the plurality of connecting pieces 115 are cut.

  Subsequently, a laminated structure of plate members according to the second embodiment will be described below. FIG. 11 is a partial cross-sectional view of a laminated structure of plate members according to the second embodiment of the present invention. In addition, in the laminated structure of the board | plate material of this embodiment, about the thing similar to 1st Embodiment, it shows with the same code | symbol and abbreviate | omits description. As shown in FIG. 11, the six plate members 201 to 206 constituting the laminated structure 200 of plate members are substantially the same as the six plate members 101 to 106 of the first embodiment, but are formed in the long side portion 212a. The plurality of grooves 231 to 233 are different in form. That is, in the pair of long side portions 212a of the plate members 201 to 206, as shown in FIG. 11, three grooves 231 extending along the longitudinal direction of the long side portion 212a (the direction perpendicular to the paper surface in FIG. 11). To 233 are formed. In each long side part 212a, the three grooves 231 to 233 are formed to open upward and downward alternately with respect to the width direction of the long side part 212a. Further, the three grooves 231 to 233 are slightly separated from each other in the plan view when the adjacent grooves 231 to 233 are not overlapped with each other in the width direction of the long side portion 212a. Further, the three grooves 231 to 233 formed in each long side portion 212a are aligned with each other when the plate members 201 to 206 are aligned and stacked, and the plate members 201 to 206 are matched with each other in plan view. The grooves 231 to 233 of the long side portion 212a are open in the same direction. When such plate materials 201 to 206 are laminated, regions where the grooves 231 to 233 of the long side portion 212a are not formed are brought into contact with each other. And the laminated structure 200 of the board | plate materials 201-206 in which the surfaces where the long side part 212a contacted partially, the short side part, and plates were joined by diffusion bonding is formed.

  The plate materials 201 to 206 described above are manufactured in substantially the same manufacturing process as the plate materials 101 to 106 of the first embodiment. Since the grooves 231 to 233 are slightly different from the first embodiment in arrangement and shape as described above, the grooves 231 to 233 are formed by half etching using a corresponding photoresist as a mask. And in the state which each formed board | plate material 201-206 aligned, the laminated body of these board | plate materials 201-206 is heated to predetermined temperature, and as mentioned above, it pinches | interposes and presses with a pair of upper and lower plate-shaped jigs. At this time, since the long side portions 212a are partially in contact with each other, the contact surfaces are diffusion bonded. The short sides and the plates are diffusion-bonded on the entire surface. Next, the outer end portion of the laminated body of the long side portions 212 a joined to each other is bent in a direction approaching the upper surface of the base plate 16. At this time, since the three grooves 231 to 233 are formed in the long side portion 212a, the contact areas of the opposing surfaces of the long side portions 212a of the plate members 201 to 206 are reduced, and the long side portions 212a are The bonding force is weak. Therefore, the part of the long side part 212a of each board | plate material 201-206 can slip and displace independently with respect to the adjacent long side part 212a. In other words, since the long side portions 212a of the respective plate materials 201 to 206 can be displaced with a behavior close to that when each plate material is bent one by one, when the long side portions of the respective plate materials are firmly fixed as in the prior art. In comparison, the curvature of the bent portion of the connecting piece 215 can be reduced. Thereby, in each plate material 201-206, it can suppress that the plates 11-16 connected with the long side part 212a by the connection piece 215 bend | curve at the time of the cutting | disconnection of the connection piece 215. As described above, since the grooves 231 to 233 formed in the long side portions 212a are formed at positions that coincide with each other in a plan view, the contact area in the long side portion 112a is reduced to weaken their bonding force. be able to. Further, the grooves 231 to 233 formed so as to coincide with the long side portions 212a in plan view are formed on the same side surface of the long side portions 212a, so that the contact area in the long side portions 112a is reduced. These bonding forces can be further weakened by further reducing the size. Further, since the three grooves 231 to 233 are alternately formed on different surfaces with respect to the width direction of the long side portion 212a, adjacent long side portions when bent in a direction approaching the upper surface of the base plate 16 of the long side portion 212a. It is possible to easily apply a force in the slipping direction of 212a.

  Subsequently, a laminated structure of plate members according to the third embodiment will be described below. FIG. 12 is a plan view of a laminated structure of plate members according to the third embodiment of the present invention. 13 is a cross-sectional view taken along line XIII-XIII shown in FIG. In addition, in the laminated structure of the board | plate material of this embodiment, about the thing similar to 1st Embodiment, it shows with the same code | symbol and abbreviate | omits description. As shown in FIGS. 12 and 13, the six plate members 301 to 306 constituting the laminated structure 300 of plate members are substantially the same as the six plate members 101 to 106 of the first embodiment, but the long side portion 312a. A plurality of long holes (holes) 331 are not formed in the grooves. That is, a plurality of long holes 331 are arranged in two rows along the longitudinal direction of the long side portion 312a in the pair of long side portions 312a of the plate members 301 to 306. As shown in FIG. 12, the plurality of long holes 331 are arranged at predetermined intervals along the longitudinal direction of the long side portion 312a, and the region and the long side between the long holes 331 of the long side portion 312a are arranged. The outer region of the long hole 331 located on the outermost side in the longitudinal direction of the portion 312a is disposed on the extension of the connecting piece 315 in the extending direction (the width direction of the long side portion 312a). In addition, the plurality of long holes 331 formed in each long side portion 312a match each other in plan view when the plate members 301 to 306 are aligned and stacked. When such plate materials 301 to 306 are laminated, regions where the long holes 331 are not formed are in contact with each other on the upper and lower surfaces of the long side portion 312a. And the laminated structure 300 of the board | plate materials 301-306 is formed by carrying out the diffusion joining of the surfaces which the long side part 312a contacted partially, the short side part 312b, and plates 11-16.

  The plate materials 301 to 306 described above are manufactured in substantially the same manufacturing process as the plate materials 101 to 106 of the first embodiment. The plurality of long holes 331 are formed by etching using a corresponding photoresist as a mask. And in the state which each formed board | plate material 301-306 aligned, the laminated body of these board | plate materials 301-306 is heated to predetermined temperature, and as mentioned above, it pinches | interposes and presses with a pair of upper and lower plate-shaped jigs. At this time, since the long side portions 312a are partially in contact with each other, the contact surfaces are diffusion bonded. The short side portion and the plates are diffusion-bonded by the entire surface. Next, the outer end portion of the laminated body of the long side portions 312a joined to each other is bent in a direction approaching the upper surface of the base plate 16 or the lower surface of the nozzle plate 11, and the connecting pieces 315 of the plate members 301 to 306 are cut. At this time, since a plurality of long holes 331 are formed in the long side portion 312a, the contact areas of the opposing surfaces of the long side portions 312a of the plate members 301 to 306 are reduced, and the long side portions 312a The joining force is weak. Therefore, as in the second embodiment, the long side portions 312a of the plate members 301 to 306 can be displaced with a behavior close to that when the plate members are bent one by one, so that the curvature of the connecting piece 315 is reduced. Thereby, in each plate material 301-306, it can suppress that the plates 11-16 connected with the long side part 312a by the connection piece 315 bend at the time of the cutting | disconnection of the connection piece 315. FIG.

  Next, an ink jet head 400 including a head body manufactured by the plate laminate manufacturing method according to the fourth embodiment will be described below. FIG. 14 is an exploded perspective view of an inkjet head including a plate laminate (head body) according to a fourth embodiment of the present invention. 15 is a cross-sectional view taken along line XV-XV shown in FIG. As shown in FIG. 14, the inkjet head 400 in the present embodiment is the same as the first embodiment except for the configuration of the actuator unit 20. Accordingly, components similar to those described above are denoted by the same reference numerals, and description thereof is omitted.

  The ink jet head 400 includes a head main body 421 to which the flow path unit 10 and the actuator unit 420 are fixed, and an FPC 40 that supplies a drive signal to the head main body 421. The actuator unit 420 includes a vibration plate 431 having substantially the same rectangular planar shape as the base plate 16, a piezoelectric layer 432 continuously formed across the plurality of pressure chambers 36 on the upper surface of the vibration plate 431, and the upper surface of the piezoelectric layer 432. Are provided with a plurality of individual electrodes 435 formed respectively corresponding to the plurality of pressure chambers 36.

  The diaphragm 431 is made of a metal material such as an iron-based alloy such as stainless steel, nickel alloy, aluminum alloy, or titanium alloy, and is diffusion bonded to the upper surface of the base plate 16 while covering all the pressure chambers 36. The diaphragm 431 is also opposed to the plurality of individual electrodes 435 and serves as a common electrode for applying an electric field to the piezoelectric layer 432 between the individual electrodes 435 and the diaphragm 431. The diaphragm 431 is grounded in a region (not shown) and grounded. It is held at a potential. In addition, two holes 439 arranged to face the ink supply port 39 are formed on one end side of the vibration plate 431.

  The piezoelectric layer 432 is a solid solution of lead titanate and lead zirconate, and is composed of lead zirconate titanate (PZT) whose main component is a ferroelectric. The piezoelectric layer 432 is formed on the upper surface of the diaphragm 431 excluding the region near the hole 439, and is continuously formed across the plurality of pressure chambers 36. Therefore, the piezoelectric layer 432 can be formed for all the pressure chambers 36 at once, and the formation of the piezoelectric layer 432 is facilitated.

  A plurality of individual electrodes 435 having a rectangular planar shape that is slightly smaller than the pressure chamber 36 are formed on the upper surface of the piezoelectric layer 432. The plurality of individual electrodes 435 are respectively formed at positions overlapping the central portion of the corresponding pressure chamber 36 in plan view. That is, the plurality of individual electrodes 435 are also arranged in two rows in a zigzag manner like the pressure chambers 36. The individual electrode 435 is made of a conductive material such as gold, copper, silver, palladium, platinum, or titanium.

  The FPC 40 is laminated on the upper surface of the actuator unit 420 having such a configuration, and its wiring pattern (not shown) is electrically connected to the corresponding individual electrode 435.

  Next, the operation of the actuator unit 420 will be described. When ink is ejected from the nozzle 35, a drive signal is supplied to each individual electrode 435 through the FPC 40. At this time, since the diaphragm 431 is held at the ground potential, a potential difference is generated between the diaphragm 431 and the individual electrode 435. Then, an electric field in the thickness direction is generated in a region sandwiched between the individual electrode 435 and the diaphragm 431 of the piezoelectric layer 432, and contracts in a horizontal direction perpendicular to the thickness direction that is a polarization direction. Along with this contraction, distortion in the stacking direction is generated in a region of the vibration plate 431 and the piezoelectric layer 432 facing the pressure chamber 36. As a result, the volume of the pressure chamber 36 changes and pressure is applied to the ink in the pressure chamber 36. Thus, ink is ejected from the nozzles 35 corresponding to the individual electrodes 435, and predetermined printing is performed on the paper.

  Next, in the process of manufacturing the inkjet head 400, a laminated structure of the seven plate members 101 to 106 and 451 constituting the head main body 421 will be described below. FIG. 16 is an exploded perspective view of a laminated structure of plate members according to the fourth embodiment of the present invention. As shown in FIG. 16, four nozzle plates 11, damper plates 12, manifold plates 13 and 14, spacer plates 15, base plates 16, and vibration plates 431 each having a predetermined pattern are formed on plate members 101 to 106 and 451, respectively. Is formed. Note that the six plate members 101 to 106 are the same as those in the first embodiment, and a description thereof will be omitted.

  The plate material 451 includes a substantially rectangular frame-shaped frame (frame portion) 452 having a longitudinal direction in a direction orthogonal to the longitudinal direction of the diaphragm 431, and four diaphragms 431 of the same type inside the frame 452. A diaphragm set 453 arranged along the longitudinal direction, and a plurality of connecting pieces 455 each having a very small width are integrally connected to the diaphragm set 453 and the frame 452.

  The frame 452 of the plate member 451 includes a pair of long side portions (longitudinal frame portions) 454 a extending along the longitudinal direction of the frame 452 and a pair of short side portions (short) extending along the short direction of the frame 452. Hand frame portion) 454b. The pair of long side portions 454a and the pair of short side portions 454b are the same as the pair of long side portions 112a and the pair of short side portions 112b of the plate members 101 to 106, as shown in FIG. That is, positioning holes 113a and 113b and four grooves (concave portions) 131 to 134 for inserting positioning pins (not shown) are formed in the pair of long side portions 454a. The plurality of connecting pieces 455 are similar to the connecting pieces 115 of the plate members 101 to 106. Seven such plate members 101 to 106 and 451 are laminated to each other, and the plate sets 121 to 126 and the vibration plate sets 435 and the short side portions 112b and 454b in each of the plate members 101 to 106 and 451 are diffusion bonded. By forming the piezoelectric layer 432 on the upper surface of the vibration plate 431 and forming the plurality of individual electrodes 435 on the upper surface of the piezoelectric layer 432, a stacked structure 450 of the plate materials 101 to 106 and 451 is formed. Note that the pair of long side portions 454a of the plate member 451 are the same as the pair of long side portions 112a, and thus do not contact each other and are not diffusion bonded.

  Then, the manufacturing method of the inkjet head 400 is demonstrated below. FIG. 17 is a manufacturing process diagram of an inkjet head. FIG. 18 is a diagram illustrating a situation where the piezoelectric layer 432 and the individual electrode 435 are formed on the vibration plate 431. As shown in FIG. 17, first, in step 1 (T1), seven stainless steel flat plates to be used as the plate members 101 to 106 and 451 are prepared. Next, in step 2 (T2), as in the first embodiment, the frames 111 and 452 in which the positioning holes 113a and 113b are formed, a plurality of connecting pieces 115 and 455, a predetermined pattern (such as the pressure chamber 36 and the nozzle 35). ) Are formed, and etching processing using a photoresist as a mask is performed on each of the seven flat plates so that the plates 11 to 16 constituting the plate sets 121 to 126 and the vibration plate 431 constituting the vibration plate set 453 are formed. Apply.

  Next, in step 3 (T3), after removing the formed photoresist, the pair of long side portions 112a and 454a and the plurality of connecting pieces 115 and 455 formed in step 2 (T2) are provided with grooves 131. To 134 and the cutout region 116, the photoresist is again applied to the region excluding the portions to be the grooves 131 to 134 of the pair of long side portions 112a and 454a and the region excluding the lower surfaces of the connecting pieces 115 and 455. Is formed into a flat plate and half-etched (frame body processing step, connecting piece thickness reduction step). At this time, the grooves 131 to 134 are long so as to extend along the longitudinal direction of the long side portions 112a and 454a and alternately open in the vertical direction with respect to the width direction of the long side portions 112a and 454a. Formed on the side portions 112a and 454a. Further, when the plate members 101 to 106 and 451 are stacked as described above, the plurality of grooves 131 to 134 coincide with each other in the plan view and adjacent to each other in the width direction of the long side portions 112a and 454a. Are partially overlapped, and a plurality of grooves 131 to 134 that coincide in the long side portions 112a and 454a are formed on the same side surface of the long side portions 112a and 454a, respectively. Further, at this time, the missing region 116 is formed on the lower surface side of the connecting pieces 115 and 455 and at a position where the missing region 116 and the groove 131 partially overlap in plan view. As described above, since the connecting pieces 115 and 455 are smaller than the thicknesses of the plates 11 to 16 and the vibration plate 431, the connection pieces 115 and 455 are easily cut at the time of cutting described later, and the plates 11 to 16 and the vibration plate 431 are not easily deformed. Thus, seven plate members 101 to 106 and 451 are formed (plate member forming step).

  Next, in step 4, the positioning holes 113a and 113b formed in the plate members 101 to 106 and 451 are positioned so that the grooves 131 to 134 formed in the plate members 101 to 106 and 451 coincide in plan view. Are inserted and positioned, and are stacked in the arrangement of plate members 101 to 106 and 451 as shown in FIG. And while heating the board | plate materials 101-106,451 (laminated body) laminated | stacked in the positioning state to predetermined temperature, the upper and lower surfaces of a laminated body are pinched | interposed with a pair of upper and lower plate-shaped jigs, and are pressurized in the lamination direction. In this way, the seven plate members 101 to 106 and 451 are diffusion bonded to each other (bonding step). At this time, the long side portions 112a and 454a and the connecting pieces 115 and 455 of the plate members 101 to 106 and 451 are not diffusion-bonded because the surfaces facing each other do not contact each other. That is, only the mutually opposing surfaces of the plates 11 to 16 of the plate members 101 to 106 and 451, the diaphragm 431, and the short side portions 112b and 454b are diffusion bonded.

  Next, in step 5 (T5), as shown in FIG. 18A, the deposited layers 461 that respectively become the piezoelectric layers 432 are formed on the upper surface of the vibration plate 451 that is diffusion-bonded to the base plate 16. Here, in the step of forming the deposition layer 461, a plurality of PZT particles are formed on the upper surface of the vibration plate 431 from above by a chemical vapor deposition (CVD) method, an aerosol deposition method (AD method), or the like. A deposition layer 461 is formed by depositing the pressure chambers 36 so as to continuously extend. At this time, since the vibration plate 431 is diffusion bonded to the base plate 16 to enhance rigidity, even if an impact is applied to the vibration plate 431 due to collision of PZT particles, deformation such as warping does not occur.

  Next, in step 6 (T6), as shown in FIG. 18B, screen printing, vapor deposition, or sputtering is performed on the upper surface of the piezoelectric layer 432 so as to overlap with the plurality of pressure chambers 36 in plan view. A plurality of individual electrodes 435 are formed using a method or the like. Then, in step 7 (T7), an annealing process is performed in which the seven layers of the plate materials 101 to 106 and 451 on which the deposition layer 461 is formed and diffusion-bonded are heated to a predetermined temperature to fire the deposition layer 461, and the piezoelectric layer 432 is fired. Form. Since the seven plate members 101 to 106 and 451 are heated during the annealing step, there is a possibility that the adhesive melts and peels off when they are joined with an adhesive. Since the plate materials 101 to 106 and 451 are bonded by diffusion bonding, no peeling occurs in the annealing process. Thus, the actuator unit 420 including the vibration plate 431, the piezoelectric layer 432, and the plurality of individual electrodes 435 is formed, and the laminated structure 450 of the plate members 101 to 106 and 451 having the four head bodies 421 is formed.

  Next, in step 8 (S8), the connecting pieces 115 and 455 are bent and broken in the same manner as in step 5 (S5) of the first embodiment, and the frames 111 and 451, the plates 11 to 16 and the diaphragm 431 are bent. And are separated. In this way, the manufacture of the four head bodies 421 is completed at a time. Then, in Step 9 (S9), the plurality of individual electrodes 435 of the head main body 421 and the wiring pattern of the FPC 40 are electrically connected with solder or the like, whereby the manufacture of the inkjet head 400 is completed.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made as long as they are described in the claims. For example, in the above-described embodiments, the long sides 112a, 212a, 312a, and 454a of the plate members 101 to 106, 201 to 206, 301 to 306, and 451 are arranged in the longitudinal direction of the long sides 112a, 212a, 312a, and 454a. A plurality of grooves 131 to 134, 231 to 233 and a plurality of long holes 331 are formed, but the grooves and holes may not extend along the longitudinal direction, or only one. It may be formed. That is, a groove or hole is formed somewhere in the frame of the plate material, and the bonding force of the long side portions 112a, 212a, 312a, and 454a is weakened by the formed groove or hole, and the connecting pieces 115, 215, 315, and the like. The frame itself may be easily bent so that the curvature at the time of cutting 455 becomes small. Further, the grooves 131 to 134, 231 to 233 and the long hole 331 formed in each long side portion do not have to coincide with each other in plan view. Further, the grooves 131 to 134 and 231 to 233 do not have to open regularly and alternately alternately in the width direction of the long side portions 112a, 212a, and 454a. That is, all the grooves may be open either upward or downward, or irregularly upward or downward. In addition, the connecting pieces 115, 215, 315, and 455 do not have to be provided with a cut-out region where the thickness is reduced. Moreover, the notch area | region may be formed not only in the lower part of a connection piece but in only the upper part or both the upper part and the lower part. Further, the depth of the missing region may be different from the depths of the grooves 131 to 134 and 231 to 233. However, it is preferable that the bending strength of the connecting piece is smaller than the bending strength of the long side portions 112a, 212a, and 454a. Moreover, although the present invention is applied to the flow path unit of the ink jet head in the first to third embodiments described above and to the head body in the fourth embodiment, a plurality of plates are laminated. The present invention can be applied to all things.

It is a disassembled perspective view of the inkjet head containing the plate laminated body of 1st Embodiment which concerns on this invention. It is a disassembled perspective view of the flow-path unit shown in FIG. FIG. 2 is a partially enlarged perspective view of the flow path unit shown in FIG. 1. It is sectional drawing along the IV-IV line shown in FIG. It is a disassembled expansion perspective view of the actuator unit shown in FIG. It is a disassembled perspective view of the laminated structure of the board | plate material by 1st Embodiment of this invention. It is a top view of the laminated structure of the board | plate material by 1st Embodiment of this invention. It is sectional drawing in the VIII-VIII line shown in FIG. It is a manufacturing-process figure of a flow-path unit. It is a situation figure when cut | disconnecting the connection piece of a board | plate material. It is a fragmentary sectional view of the laminated structure of the board | plate material by 2nd Embodiment of this invention. It is a top view of the laminated structure of the board | plate material by 3rd Embodiment of this invention. It is sectional drawing in XIII-XIII shown in FIG. It is a disassembled perspective view of the inkjet head containing the plate laminated body of 4th Embodiment which concerns on this invention. It is sectional drawing along the XV-XV line | wire shown in FIG. It is a disassembled perspective view of the laminated structure of the board | plate material by 4th Embodiment of this invention. It is a manufacturing process figure of an inkjet head. It is the figure which showed the condition where a piezoelectric layer and an individual electrode are formed on a diaphragm.

Explanation of symbols

6,400 Inkjet head 10 Channel unit (plate stack)
11 Nozzle plate 12 Damper plate 13, 14 Manifold plate 15 Spacer plate 16 Base plate 101-106 Plate material 111 Frame (frame)
112a, 212a, 312a, 454a Long side part (longitudinal frame part)
112b, 312b, 454b Short side part (short frame part)
115, 215, 315, 455 Connecting pieces 131-134, 231-233 Groove (concave portion)
331 long hole (hole)
431 Diaphragm (plate)

Claims (10)

  1. In a method for manufacturing a plate laminate, which forms a plate laminate in which a plurality of plates are joined in a laminated state,
    A plurality of plates arranged in one direction at intervals, a frame surrounding the plurality of plates, and a plurality of connecting pieces for connecting any of the plurality of plates and the frame. A plate material forming step of forming a plurality of metal plate materials;
    A bonding step of laminating and bonding the plurality of plate members in a positioning lamination state in which the plates that are in contact with each other are stacked together while laminating the plurality of plate members;
    A separation step of cutting the plurality of connecting pieces to separate the laminated body of the plates from the frame body,
    The said board | plate material formation process includes the frame process process of forming the recessed part or hole for making the frame easy to deform | transform into the said frame, The manufacturing method of the plate laminated body characterized by the above-mentioned.
  2. The plate has a substantially rectangular shape whose long side is along the one direction,
    The frame body includes a pair of long frame portions extending along the one direction and a pair of short frame portions extending in a direction orthogonal to the one direction,
    Each of the plurality of connecting pieces is provided between the longitudinal frame portion and the plate, and is arranged in the one direction,
    2. The method for manufacturing a plate laminate according to claim 1, wherein in the frame body processing step, the concave portion or the hole is formed in the longitudinal frame portion so as to extend in the one direction.
  3.   3. The method for manufacturing a plate laminate according to claim 2, wherein, in the frame body processing step, the concave portion is formed as one or a plurality of grooves extending in the one direction.
  4.   In the frame body processing step, the grooves are formed in the longitudinal frame portions of the plurality of plate members, respectively, and are formed at positions that coincide with each other in a plan view in the positioning and lamination state. The manufacturing method of the plate laminated body of Claim 3.
  5.   In the frame processing step, the grooves formed at positions that coincide with each other in a plan view when the plurality of plate members are in the positioning and lamination state are on the same side when in the positioning and lamination state The method for manufacturing a plate laminate according to claim 4, wherein the plate laminate is formed respectively.
  6.   In the frame body processing step, a plurality of grooves are formed in the longitudinal frame portion, and the plurality of grooves are formed on different surfaces in the width direction of the longitudinal frame portion. The manufacturing method of the plate laminated body of Claim 5.
  7.   7. The frame processing step, wherein two grooves formed on different surfaces adjacent to each other in the width direction of the longitudinal frame portion are formed so as to partially overlap in a plan view. The manufacturing method of the plate laminated body of description.
  8.   The plate laminate according to any one of claims 1 to 7, wherein the plate material forming step includes a connection piece thinning step in which a thickness of the connection piece is made thinner than that of the plate and the frame. Manufacturing method.
  9. A plurality of plates arranged in one direction at intervals, a frame surrounding the plurality of plates, and a plurality of connecting pieces for connecting any of the plurality of plates and the frame. In the laminated structure of the plate materials that are obtained by diffusion bonding with each other in a state where a plurality of metal plate materials are laminated, and by obtaining a laminate in which plates are laminated by cutting the connecting piece,
    A laminated structure of the plate material, wherein the frame body of the plate material is formed with a recess or a hole for reducing a bonding area with the frame body adjacent in the stacking direction.
  10. A plurality of plates arranged in one direction at intervals, and
    A frame surrounding the plurality of plates;
    A plurality of connecting pieces for connecting any one of the plurality of plates and the frame body, and by diffusing and joining the plurality of plates in a stacked state, cutting the connecting pieces; In a metal plate for obtaining a laminate,
    A plate material, wherein the frame body of the plate material is formed with a recess or a hole for reducing a bonding area with the frame body adjacent in the stacking direction.
JP2005296103A 2005-10-11 2005-10-11 Manufacturing method for plate laminate, layered structure of plate material and plate material Pending JP2007105896A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009000713A (en) * 2007-06-21 2009-01-08 Aronshiya:Kk Diffusion bonding article and its manufacturing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002205176A (en) * 2001-01-10 2002-07-23 Kamitani Kosakusho:Kk Method of manufacturing metallic tube
JP2003266698A (en) * 2002-03-20 2003-09-24 Fuji Electric Co Ltd Inkjet recording head
JP2005028641A (en) * 2003-07-08 2005-02-03 Brother Ind Ltd Structure of lead frame
JP2005040990A (en) * 2003-07-23 2005-02-17 Brother Ind Ltd Lamination bonding structure of thin planar component
JP2005059441A (en) * 2003-08-14 2005-03-10 Brother Ind Ltd Inkjet head recorder, inkjet recording method and program

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002205176A (en) * 2001-01-10 2002-07-23 Kamitani Kosakusho:Kk Method of manufacturing metallic tube
JP2003266698A (en) * 2002-03-20 2003-09-24 Fuji Electric Co Ltd Inkjet recording head
JP2005028641A (en) * 2003-07-08 2005-02-03 Brother Ind Ltd Structure of lead frame
JP2005040990A (en) * 2003-07-23 2005-02-17 Brother Ind Ltd Lamination bonding structure of thin planar component
JP2005059441A (en) * 2003-08-14 2005-03-10 Brother Ind Ltd Inkjet head recorder, inkjet recording method and program

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009000713A (en) * 2007-06-21 2009-01-08 Aronshiya:Kk Diffusion bonding article and its manufacturing method

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