JP2007080872A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2007080872A
JP2007080872A JP2005262940A JP2005262940A JP2007080872A JP 2007080872 A JP2007080872 A JP 2007080872A JP 2005262940 A JP2005262940 A JP 2005262940A JP 2005262940 A JP2005262940 A JP 2005262940A JP 2007080872 A JP2007080872 A JP 2007080872A
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visible light
light
color conversion
conversion member
led chip
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JP3979424B2 (en )
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Takao Hayashi
隆夫 林
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Matsushita Electric Works Ltd
松下電工株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

PROBLEM TO BE SOLVED: To improve color rendering property in a light emitting device using an LED chip.
SOLUTION: The light emitting device is provided with the LED chip 1, a mount board 10 being a base member on which the LED chip 1 is mounted, a first color conversion member 20 arranged on the side of the mounting face of the LED chip in the mount board 10, and a second color conversion member 30 arranged on an opposite side of the mount board 10 with respect to the first color conversion member 20. White light can be obtained by mixing first visible light (blue light) radiated from the LED chip 1, second visible light (red light) whose color is converted from first visible light by the first color conversion member 20, and third visible light (green light) whose color is converted from first visible light by the second color conversion member 30. Thus, color rendering property improves since second visible light (red light) of a long wavelength region increases compared to a conventional case where blue light and yellow light are mixed.
COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、LEDチップ(発光ダイオードチップ)を利用した発光装置に関するものである。 The present invention relates to a light emitting device utilizing a LED chip (light-emitting diode chip).

従来、相対的に波長の短い第1の可視光を放射するLEDチップと、LEDチップが実装されたベース部材と、ベース部材におけるLEDチップの実装面側に配設され第1の可視光によって励起されて第1の可視光の波長よりも波長の長い第2の可視光を放射する蛍光材料を透明材料とともに成形した成形品からなる色変換部材とを備えた発光装置が提案されている(例えば、特許文献1参照)。 Conventionally, excitation and LED chip that emits a first visible light short relatively wavelength, a base member LED chip is mounted, the first visible light is disposed on the mounting surface of the LED chip in the base member is first visible light emitting device and a color conversion member comprising a molded article of the fluorescent material was molded with a transparent material which emits long second visible light wavelength than the wavelength of the is being proposed (for example, , see Patent Document 1). なお、この種の発光装置としては、例えば、第1の可視光として青色光を放射するLEDチップと、第2の可視光として黄色光を放射する蛍光体とを混色させて白色光(白色光の発光スペクトル)を得る白色発光装置(一般に白色LEDと呼ばれている。)が商品化されている。 As the light emitting apparatus of this type, for example, LED chip and a white light by mixing a phosphor that emits yellow light as the second visible light (white light that emits blue light as the first visible light emission spectrum) white light emitting device to obtain the (commonly referred to as white LED.) have been commercialized.
特開2001-148514号公報 JP 2001-148514 JP

しかしながら、上記白色発光装置では青色光と黄色光を混色させているために長波長領域の可視光(赤色光)が不足しており、そのために演色性が低いという問題があった。 However, in the white light emitting device has insufficient visible light with a long wavelength (red light) because they were mixed with blue light and yellow light, the color rendering property is disadvantageously low for that.

本発明は上記事情に鑑みて為されたものであり、その目的は、演色性を向上した発光装置を提供することにある。 The present invention has been made in view of the above circumstances, an object thereof is to provide a light emitting device having improved color rendering.

請求項1の発明は、上記目的を達成するために、相対的に波長の短い第1の可視光を放射するLEDチップと、LEDチップが実装されたベース部材と、ベース部材におけるLEDチップの実装面側に配設され第1の可視光によって励起されて第1の可視光の波長よりも波長の長い第2の可視光を放射する第1の蛍光材料を透明材料とともに成形した成形品からなる第1の色変換部材と、第1の色変換部材に対してベース部材と反対側に配設され第1の色変換部材を通過した第1の可視光によって励起されて第1の可視光よりも波長が長く且つ第2の可視光よりも波長の短い第3の可視光を放射する第2の蛍光材料を透明材料とともに成形した成形品からなる第2の色変換部材とを備えたことを特徴とする。 The invention according to claim 1, in order to achieve the above object, an LED chip that emits a first visible light short relatively wavelength, a base member LED chip is mounted, the LED chip mounting of the base member consisting of a first molded article of the fluorescent material was molded with a transparent material which emits long second visible light wavelength than the wavelength of the first visible light when excited by the first visible light is disposed on the side a first color conversion member, from the first visible light when excited by the first visible light passing through the first color conversion member is disposed on the opposite side of the base member relative to the first color conversion member that also includes a second color conversion member comprising a molded shaped article together with the second fluorescent material transparent material that emits third visible light shorter wavelength than the wavelength long and the second visible light and features.

請求項2の発明は、請求項1の発明において、第1及び第2の色変換部材がドーム状に形成されたことを特徴とする。 The invention of claim 2 is the invention of claim 1, the first and second color conversion member, characterized in that it is formed in a dome shape.

請求項1の発明によれば、LEDチップから放射された第1の可視光と、第1の色変換部材によって第1の可視光から色変換された第2の可視光と、第2の色変換部材によって第1の可視光から色変換された第3の可視光とを混色することで白色光を得ることができるとともに、長波長領域の可視光(第2の可視光)が増えるために従来例に比較して演色性が向上するという効果がある。 According to the present invention, the first visible light emitted from the LED chip, and the second visible light color conversion from a first visible light by the first color conversion member, a second color it is possible to obtain white light by the third mixing a visible light whose color has been converted from the first visible light conversion member, for visible light with a long wavelength (second visible light) increases compared to the prior art it has the effect of improving the color rendering property. また、第2の色変換部材で反射した第1の可視光が第1の色変換部材によって第2の可視光に色変換されるから、色の変換効率が向上するという効果がある。 Further, since the first visible light reflected by the second color conversion member is color converted into second visible light by the first color conversion member, there is an effect that the color conversion efficiency is improved.

請求項2の発明によれば、LEDチップから放射された第1の可視光が第1及び第2の色変換部材に達するまでの光路長がほぼ均一になるために色むらの発生を抑えることができるという効果がある。 According to the invention of claim 2, to suppress the occurrence of color unevenness in the optical path length from the LED chip to the first visible light emitted reaches the first and second color conversion member is substantially uniform there is an effect that it is.

本実施形態の発光装置は、図1に示すようにLEDチップ1と、LEDチップ1が実装されたベース部材たる実装基板10と、実装基板10におけるLEDチップの実装面側に配設される第1の色変換部材20と、第1の色変換部材20に対して実装基板10と反対側に配設される第2の色変換部材30とを備える。 Light emitting device of this embodiment, the LED chip 1, as shown in FIG. 1, a base member serving as a mounting substrate 10 on which the LED chip 1 is mounted, the disposed on the mounting surface side of the LED chip on the mounting substrate 10 It comprises a first color conversion member 20, and a second color conversion member 30 disposed on the opposite side of the mounting board 10 with respect to the first color conversion member 20.

実装基板10は、金属板11上に絶縁層12を介して対となる導体パターン13,13が形成された金属基板からなり、LEDチップ1で発生した熱が金属板11に伝導されるようになっている。 Mounting substrate 10 is made of a metal substrate on which the conductor patterns 13, 13 forming a pair with the insulating layer 12 on the metal plate 11 is formed, so that heat generated by the LED chip 1 is conducted to the metal plate 11 going on. なお、金属板11の材料としてCuを採用しているが、熱伝導率が比較的高い金属材料であればよく、Cuに限らず、Alなどを採用してもよい。 Although adopted Cu as the material of the metal plate 11 may be a relatively high metal material thermal conductivity, it is not limited to Cu, may be employed, such as Al.

LEDチップ1は、青色光(第1の可視光)を放射するGaN系青色LEDチップであり、サファイア基板からなる結晶成長用基板2の主表面側にGaN系化合物半導体材料により形成されて、例えばダブルへテロ構造を有する積層構造部からなる発光部3がエピタキシャル成長法(例えば、MOVPE法など)により成長させてある。 LED chip 1 is a GaN-based blue LED chip emitting blue light (a first visible light), is formed by a GaN-based compound semiconductor material on the main surface of the crystal growth substrate 2 made of sapphire substrate, for example, emitting portion composed of a laminated structure having a double heterostructure 3 epitaxial growth method (such as the MOVPE method) are grown by.

また、LEDチップ1は、LEDチップ1のチップサイズよりも大きなサイズの矩形板状に形成されたサブマウント部材40を介して金属板11上に搭載されており、図示しないアノード電極並びにカソード電極がそれぞれボンディングワイヤ4を介して導体パターン13,13と電気的に接続されている。 Further, the LED chip 1 is mounted on the metal plate 11 through the sub-mount member 40 formed in a rectangular plate shape having a size larger than the chip size of the LED chip 1, an anode electrode and a cathode electrode (not shown) It is conductor patterns 13 electrically connected via a bonding wire 4, respectively. ここで、サブマウント部材40は、熱伝導率が比較的に高く且つ絶縁性を有する材料(例えば、AlNや複合SiCなど)によって形成されている。 Here, the sub-mount member 40 is formed of a material the thermal conductivity has a relatively high and insulation (e.g., such as AlN or composite SiC). なお、LEDチップ1とサブマウント部材40とは、AuSn、SnAgCuなどの鉛フリー半田を用いて接合されている。 Note that the LED chip 1 and the sub-mount member 40, AuSn, are joined by using lead-free solder such as SnAgCu.

第1の色変換部材20は、シリコーン樹脂のような透明材料とLEDチップ1から放射された第1の可視光(青色光)によって励起されて第1の可視光の波長よりも波長の長い第2の可視光(赤色光)を放射する粒子状の赤色蛍光体からなる第1の蛍光材料とを混合した混合物をドーム状(半球状)に成形した成形品により構成されている。 The first color conversion member 20 is longer wavelength than the wavelength of the first visible light when excited by the first visible light emitted from the transparent material and the LED chip 1 such as a silicone resin (blue light) first It is constituted by particulate red phosphor consisting of material first fluorescent material and the blended mixture a dome-shaped molded article obtained by molding the (hemispherical) that emits second visible light (red light). そして、第1の色変換部材20は、例えば接着剤(シリコーン樹脂やエポキシ樹脂など)を用いて開口部の周縁を実装基板10に対して接着することでサブマウント部材40とともにLEDチップ1を覆う形で実装基板10に搭載されている。 The first color conversion member 20 covers the LED chip 1 with the sub-mount member 40 by bonding the periphery of the opening with respect to the mounting substrate 10 using, for example, an adhesive (such as silicone resin or epoxy resin) It is mounted on the mounting substrate 10 in the form. なお、第1の色変換部材20と実装基板10とに囲まれる空間に、透光性を有する封止材料(例えば、シリコーン樹脂など)でLEDチップ1を封止した封止部を形成してもよく、封止部と第1の色変換部材20との間に空気層を設けても構わない。 Incidentally, in a space surrounded by the mounting substrate 10 and the first color conversion member 20, a sealing material (e.g., silicone resin) having a light transmitting property in forming a sealing portion that seals an LED chip 1 At best, it may be provided an air layer between the sealing portion and the first color conversion member 20.

第2の色変換部材30は、シリコーン樹脂のような透明材料とLEDチップ1から放射された第1の可視光(青色光)によって励起されて第1の可視光よりも波長が長く且つ第2の可視光(赤色光)よりも波長の短い第3の可視光(緑色光)を放射する粒子状の緑色蛍光体からなる第2の蛍光材料とを混合した混合物をドーム状(半球状)に成形した成形品により構成されている。 Second color conversion member 30, the first visible light and longer wavelength than the first visible light by being excited by the (blue light) second emitted from the transparent material and the LED chip 1 such as a silicone resin of the visible light the third visible light shorter wavelength than (red light) consisting of particulate green phosphor that emits (green light) the second fluorescent material and the blended mixture a domed (hemispherical) It is composed of molded articles. そして、第2の色変換部材30は、例えば接着剤(シリコーン樹脂やエポキシ樹脂など)を用いて開口部の周縁を実装基板10に対して第1の色変換部材20の外側に接着することで第1の色変換部材20とともにサブマウント部材40やLEDチップ1を覆う形で実装基板10に搭載されている。 The second color conversion member 30, by bonding the outside of the first color conversion member 20 to the peripheral edge of the opening with respect to the mounting substrate 10 using, for example, an adhesive (such as silicone resin or epoxy resin) It is mounted on the mounting substrate 10 with the first color conversion member 20 so as to cover the sub-mount member 40 and the LED chip 1. なお、第1の色変換部材20と第2の色変換部材30とに囲まれる空間を、透光性を有する封止材料(例えば、シリコーン樹脂など)で封止しても構わない。 Incidentally, a space surrounded by the first color conversion member 20 and the second color conversion member 30, a sealing material (e.g., silicone resin) having a light-transmitting property may be sealed with. 但し、第1及び第2の色変換部材20,30に用いる透明材料は、シリコーン樹脂に限らず、例えば、アクリル樹脂、エポキシ樹脂、ガラス、有機材料と無機材料とを複合化した材料などを用いても構わない。 However, a transparent material used for the first and second color conversion member 20 and 30, using not only the silicone resin, e.g., acrylic resin, epoxy resin, glass, materials, etc. complexed with an organic material and an inorganic material and it may be.

而して、本実施形態の発光装置では、LEDチップ1から放射される第1の可視光(青色光)と、第1の色変換部材20によって第1の可視光から色変換された第2の可視光(赤色光)と、第2の色変換部材30によって第1の可視光から色変換された第3の可視光(緑色光)とを混色することで白色光を得ることができ、しかも、青色光と黄色光を混色する従来例に比較して、長波長領域の第2の可視光(赤色光)が増えるために演色性が向上するものである。 And Thus, in light emitting device of this embodiment, the first visible light emitted from the LED chip 1 (blue light), the by the first color conversion member 20 is color-converted from the first visible light 2 of visible light (red light), white light can be obtained by mixing a third visible light color conversion from a first visible light (green light) by the second color conversion member 30, Moreover, as compared with the conventional example in which color mixing blue light and yellow light, it is intended to improve the second color rendering to increase visible light (red light) in the long wavelength region. また、第2の色変換部材30で反射して内側に戻る第1の可視光が第1の色変換部材20によって第2の可視光に色変換されて外側に放射されるから、色の変換効率が向上するという利点もある。 Further, since the first visible light back inwardly reflected by the second color conversion member 30 is radiated to the outside is color conversion into second visible light by the first color conversion member 20, the color conversion of there is also an advantage that the efficiency can be improved. さらに、第1及び第2の色変換部材20,30がドーム状に形成されているので、LEDチップ1から放射された第1の可視光が第1及び第2の色変換部材20,30に達するまでの光路長をほぼ均一にすることができ、その結果、混色光(白色光)の色むらが生じるのを抑えることができる。 Further, since the first and second color conversion member 20 and 30 is formed in a dome shape, a first visible light first and second color conversion member 20 and 30 emitted from the LED chip 1 reaches the optical path length can be made to substantially uniform, so that it is possible to suppress the color unevenness of the mixed color light (white light) occurs.

本発明の実施形態を示す断面図である。 Is a sectional view showing an embodiment of the present invention.

符号の説明 DESCRIPTION OF SYMBOLS

1 LEDチップ 10 実装基板(ベース部材) 1 LED chip 10 mounting substrate (base member)
20 第1の色変換部材 30 第2の色変換部材 20 the first color conversion member 30 and the second color conversion member

Claims (2)

  1. 相対的に波長の短い第1の可視光を放射するLEDチップと、LEDチップが実装されたベース部材と、ベース部材におけるLEDチップの実装面側に配設され第1の可視光によって励起されて第1の可視光の波長よりも波長の長い第2の可視光を放射する第1の蛍光材料を透明材料とともに成形した成形品からなる第1の色変換部材と、第1の色変換部材に対してベース部材と反対側に配設され第1の色変換部材を通過した第1の可視光によって励起されて第1の可視光よりも波長が長く且つ第2の可視光よりも波長の短い第3の可視光を放射する第2の蛍光材料を透明材料とともに成形した成形品からなる第2の色変換部材とを備えたことを特徴とする発光装置。 An LED chip that emits a first visible light short relatively wavelength, a base member LED chip is mounted, is disposed on the mounting surface of the LED chip in the base member is excited by the first visible light a first color conversion member comprising a first molded article of the fluorescent material was molded with a transparent material which emits long second visible light wavelength than the wavelength of the first visible light, the first color conversion member the first shorter wavelength than and second visible light longer wavelength than the first visible light by being excited by visible light that has passed through the first color conversion member is disposed on the opposite side of the base member for the third light emitting device characterized by comprising a second color conversion member comprising a molded shaped article together with the second fluorescent material transparent material to emit visible light.
  2. 第1及び第2の色変換部材がドーム状に形成されたことを特徴とする請求項1記載の発光装置。 The light-emitting device according to claim 1, wherein the first and second color conversion member, characterized in that it is formed in a dome shape.
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US8237350B2 (en) 2007-08-31 2012-08-07 Kabushiki Kaisha Toshiba Light-emitting device
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DE102007057710A1 (en) * 2007-09-28 2009-04-09 Osram Opto Semiconductors Gmbh Radiation-emitting component with conversion element
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KR101114487B1 (en) * 2007-12-07 2012-03-13 파나소닉 전공 주식회사 Light Emitting Device
JP2010074117A (en) * 2007-12-07 2010-04-02 Panasonic Electric Works Co Ltd Light emitting device
US8294177B2 (en) 2007-12-07 2012-10-23 Panasonic Corporation Light emitting device utilizing a LED chip
JP2009267103A (en) * 2008-04-25 2009-11-12 Kyocera Corp Light-emitting apparatus
WO2010018827A1 (en) * 2008-08-12 2010-02-18 Niiyama Heiji Light-emitting device
US8558259B2 (en) 2008-11-13 2013-10-15 Osram Opto Semiconductors Gmbh Optoelectronic component having a dome-like conversion element
WO2010054622A3 (en) * 2008-11-13 2010-07-08 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component
RU2480671C1 (en) * 2009-03-10 2013-04-27 Непес Лед Корпорейшн Lamp cap and light diode lamp with such cap
WO2010129271A3 (en) * 2009-04-27 2011-02-24 Manufacturing Resources International, Inc. White led for liquid crystal display backlights
WO2010129271A2 (en) * 2009-04-27 2010-11-11 Manufacturing Resources International, Inc. White led for liquid crystal display backlights
US8071995B2 (en) 2009-07-27 2011-12-06 Kabushiki Kaisha Toshiba Light emitting device and a method for manufacturing the same
RU2576382C2 (en) * 2010-07-01 2016-03-10 Конинклейке Филипс Электроникс Н.В. Led module of modifiable luminescent tube placed inside sealed glass tube
KR20130080613A (en) * 2012-01-05 2013-07-15 금호전기주식회사 Led lighting apparatus using color filter
JP2012191230A (en) * 2012-06-04 2012-10-04 Toshiba Corp Light-emitting device
CN103855288A (en) * 2012-12-04 2014-06-11 有研稀土新材料股份有限公司 Light emitting component and light emitting device composed of light emitting component
US10126579B2 (en) 2013-03-14 2018-11-13 Manfuacturing Resources International, Inc. Rigid LCD assembly
CN103531694B (en) * 2013-10-22 2015-12-30 长智光电(四川)有限公司 Backlight module and a backlight light source light mixing method
CN103531694A (en) * 2013-10-22 2014-01-22 长智光电(四川)有限公司 Backlight source of direct type backlight unit and light mixing method thereof
CN103647011A (en) * 2013-12-18 2014-03-19 吴震 Light-emitting diode encapsulation structure and light emitting device
CN103647011B (en) * 2013-12-18 2018-09-21 杨毅 LED package and a light emitting means

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