JP2007047305A - Method for forming wiring, method for manufacturing liquid crystal device, and wiring forming device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming wiring with which wiring can be reliably formed. <P>SOLUTION: The method for forming wiring is performed with an ink-jet system and includes steps of: forming an alignment mark forming region including a discharge region where a wiring material is discharged to form an alignment mark and a measurement section forming region connected to the discharge region and to be formed as a measurement section used for measuring a substrate position, and forming a wiring forming region where wiring is formed on a substrate; discharging a wiring material onto the discharge region and spreading the wiring material to the measurement section forming region to from an alignment mark having a measurement section; measuring a position of the measuring section of the formed alignment mark and thereby, adjusting a position of the substrate; and then, discharging a wiring material onto the wiring forming region to form wiring. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wiring forming method using an inkjet method, a method for manufacturing a liquid crystal device, and a wiring forming device. The present invention can be suitably used, for example, for forming wiring (gate, source and drain electrode wiring, etc.) of a wiring substrate (TFT substrate, etc.) of a liquid crystal device.

In recent years, a method for forming a wiring by discharging a liquid wiring material in a line shape onto a substrate made of glass or the like is known (see Patent Documents 1 to 3). In this method, it is difficult to control the size and position of the formed wiring simply by discharging the wiring material onto the substrate. Therefore, a liquid repellent process is performed on the entire substrate in advance, and only a region where wiring is formed is subjected to a lyophilic process, and a wiring material is applied to a region subjected to the lyophilic process (hereinafter referred to as “lyophilic region”). The size and position of the wiring are controlled by discharging and applying the wiring material only to the lyophilic region.
JP 2005-175468 A JP 2005-159327 A JP 2005-159328 A

  By the way, since the lyophilic region is a region where wiring is formed, its width is usually about 20 μm. For this reason, in order to reliably discharge the wiring material to this region, it is necessary to adjust the position of the substrate with respect to the ink jet apparatus with high accuracy.

  The position adjustment of the substrate is usually performed by measuring the position of the alignment mark formed on the substrate. However, when using the technique described in Patent Document 1 or the like, an alignment mark may be formed of a transparent material on a transparent substrate, and in this case, the visibility of the alignment mark is very poor (therefore, a CCD camera). Etc.), and it is difficult to adjust the position with high accuracy. For this reason, the wiring material is not discharged to the lyophilic region (that is, the wiring material is discharged to the lyophobic region), and the wiring may not be formed properly.

  The present invention has been made in view of such circumstances, and provides a wiring forming method capable of reliably forming a wiring.

Means for Solving the Problems and Effects of the Invention

  The wiring forming method of the present invention is a wiring forming method based on an ink jet method, and includes a discharge region that discharges a wiring material to form an alignment mark, and a measurement unit that is connected to the discharge region and is used for measuring a substrate position. Forming an alignment mark formation region having a measurement portion formation region and a wiring formation region on which wiring is formed on the substrate, discharging a wiring material to the discharge region, and extending the wiring material to the measurement portion formation region Forming the alignment mark having the measurement part by adjusting the position of the substrate by measuring the position of the measurement part of the formed alignment mark, and then discharging the wiring material to the wiring formation region to form the wiring Prepare.

The outline of the present invention will be described below.
First, an alignment mark is formed by discharging a wiring material to an alignment mark formation region on the substrate. The wiring material is made of silver paste or the like and usually has high visibility. Therefore, an alignment mark with high visibility can be obtained by this process. Further, the wiring material is discharged to the discharge region of the alignment mark formation region. Since the discharge area is usually wider than the width of the wiring to be formed, the wiring material is surely discharged to the discharge area, spreads over the measurement part formation area connected to the discharge area, and finally the alignment mark is formed Spread over the whole area. The measurement part formation region becomes a measurement part of the alignment mark to be formed.

  Next, the position of the measurement unit is measured to adjust the position of the substrate. Since the position adjustment here can be performed using a highly visible measuring unit, it can be performed with relatively high accuracy.

  Next, after adjusting the position of the substrate, a wiring material is discharged to a wiring formation region on the substrate to form a wiring. In this process, the substrate position is adjusted with high accuracy in the previous process, and in this process, the wiring material can be reliably discharged to the wiring formation region. Therefore, according to the present invention, the wiring can be reliably formed.

1. Wiring Forming Method The wiring forming method of the present invention is a wiring forming method by an ink jet method, and is used for measuring a substrate position, which is connected to a discharging region for discharging a wiring material to form an alignment mark, and connected to the discharging region. An alignment mark formation region having a measurement portion forming region to be a measurement portion and a wiring formation region in which wiring is formed are formed on the substrate, wiring material is discharged to the discharge region, and the wiring material is supplied to the measurement portion forming region. An alignment mark having a measurement part is formed by spreading it out, and the position of the measurement part of the formed alignment mark is adjusted to adjust the position of the substrate, and then wiring is formed by discharging the wiring material into the wiring formation region The process of carrying out is provided.

1-1. Substrate The substrate on which the wiring is formed is made of Si wafer, quartz glass, glass, plastic film, metal plate, etc., even if a semiconductor film, metal film, dielectric film, organic film, etc. are formed on the substrate. Good.

  On the substrate, an alignment mark formation region where an alignment mark is formed and a wiring formation region where a wiring is formed are formed. For example, the alignment mark formation regions are provided at four corners of the substrate, respectively.

  For example, the alignment mark formation region and the wiring formation region are formed so as to have higher lyophilicity than regions other than these regions on the substrate surface. This is because the wiring material discharged to the alignment mark formation region and the wiring formation region remains in these regions, and the alignment marks and the wirings can be reliably formed in these regions.

  The “wiring material” is configured by dispersing conductive fine particles in a dispersion medium. The conductive fine particles are made of metal such as gold, silver and copper, and the dispersion medium may be any material that can disperse the conductive fine particles, such as water, alcohols such as methanol, ethanol, propanol and butanol, and n-heptane. , N-octane, decane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydronaphthalene, cyclohexylbenzene and other hydrocarbon compounds. The viscosity and the like of the wiring material are adjusted as appropriate so as to be suitable for ejection by the ink jet method.

  The alignment mark formation region and the wiring formation region can be formed by, for example, performing a lyophobic process on the entire surface of the substrate and then performing a lyophilic process only on these regions. The lyophobic treatment and the lyophilic treatment can be performed by various methods such as the methods described in Patent Documents 1 to 3. As a specific example, the liquid repellency treatment includes a method of forming a self-assembled film such as fluoroalkylsilane on the substrate, a method of forming a fluorinated polymer film on the substrate, and the surface of the substrate using air, oxygen or nitrogen as a processing gas. Examples of the lyophilic treatment include plasma treatment of the substrate surface using oxygen as a processing gas, or irradiation of ultraviolet light having a wavelength of 170 to 400 nm to remove the self-assembled film or the fluorinated polymer film. And a method of irradiating the substrate surface with an ultraviolet laser or an infrared laser.

  “Liquid repellency” and “lyophilic” mean making an object lyophobic and lyophilic, respectively. The areas that have been subjected to lyophobic and lyophilic processes are referred to as “liquid-repellent areas” and “lyophilic areas”, respectively. “Liquid repellency” means a state of low wettability with respect to a wiring material. “Lipophilicity” means a state in which wettability is relatively high with respect to the wiring material. As a measure of “wettability”, the size of the contact angle with respect to the wiring material can be used. The greater the contact angle, the lower the wettability. The contact angle can be measured by the 1 / 2θ method.

  The contact angle of the liquid repellent region with respect to the wiring material is preferably 30 degrees or more, more preferably 45 degrees or more, and further preferably 60 degrees or more. Further, the contact angle of the alignment mark forming region and the wiring forming region with respect to the wiring material is preferably 10 degrees or more, more preferably 20 degrees or more smaller than the contact angle with respect to the liquid repellent region.

(1) Alignment mark formation region The alignment mark formation region is a discharge region that discharges a wiring material to form an alignment mark, and a measurement unit formation region that is connected to the discharge region and serves as a measurement unit used for measuring the substrate position. And have.

  The discharge region is preferably a relatively wide region (for example, a region wider than the line constituting the measurement portion formation region) so that the wiring material discharged from the inkjet head can be landed appropriately. . The discharge area may be any shape such as an ellipse, a circle, and a rectangle. The width of the discharge region is preferably tapered toward the measurement unit formation region. This is because the wiring material is easily moved to the measurement portion forming region by gradually reducing the width. The width of the ejection region is preferably about 60 to 100 μm, for example, although it depends on the accuracy of the ink jet device used.

  The measurement part forming region is a region connected to the discharge region, and the wiring material discharged to the discharge region is spread and applied to this region. The measurement part forming region is a measurement part used for measuring the substrate position in a later process after the wiring material is applied. For this reason, in order to reduce a measurement error in a subsequent process, the measurement unit formation region is configured by intersecting two or more lines having a relatively small width (for example, the same width as the formed wiring). It is preferable. The measurement part formation region may have any shape such as a cross shape, an X shape, a star shape, or a Y shape. It is preferable that the measurement part formation region has higher lyophilicity than the discharge region. In this case, it is because the wiring material discharged to the discharge area spreads quickly to the measurement part formation area.

  The alignment mark formation region preferably has two or more ejection regions. For example, when the measurement portion forming region is formed by intersecting two narrow lines, the discharge regions are preferably provided at all (four) ends (see FIG. 4). At this time, the alignment mark is preferably formed by discharging the wiring material to all the discharge regions. In this case, the wiring material quickly spreads over the entire measurement portion forming region.

(2) Wiring formation region In the wiring formation region, wiring material is discharged in a subsequent process to form wiring. Here, “wiring” refers to, for example, a gate electrode wiring, a source electrode wiring, and a drain electrode wiring formed on the TFT substrate of the liquid crystal device. The object on which the “wiring” of the present invention is formed is not limited to the liquid crystal device, and the wiring forming method of the present invention can be applied to the wiring forming process of various electronic devices that require highly accurate alignment.

1-2. Alignment Mark Formation Step In this step, an alignment mark having a measurement part is formed by discharging a wiring material to the discharge area of the alignment mark formation area and spreading the wiring material to the measurement part formation area. The wiring material usually spreads over the entire alignment mark formation region, and the alignment mark and the alignment mark formation region have substantially the same shape. A measurement part forming region is covered with a wiring material to become a measurement part.

  The alignment mark formation area has poor visibility when it is formed of a transparent material on a transparent substrate, so high-precision position adjustment is difficult even if the position of this area is measured and the position of the substrate is adjusted. is there. Therefore, the wiring material is discharged in this region to form an alignment mark with high visibility, and the substrate position is adjusted with high accuracy using this mark.

  Before the alignment mark is formed, it usually includes a step of roughly adjusting the position of the substrate. The rough adjustment of the substrate position is performed, for example, by using a separately provided large alignment mark for coarse adjustment or by measuring the position of the discharge region. This is because the ejection area is relatively large in size and can be easily recognized even by the coarse adjustment optical system.

1-3. Substrate position adjustment step The position of the substrate is adjusted by measuring the position of the measurement part of the formed alignment mark. More specifically, for example, the optical system images the measurement unit of the alignment mark, measures the center position of the measurement unit by image processing, and the substrate so that the center of the measurement unit is positioned at the center of the visual field of the optical system. Do by moving. The substrate is moved, for example, by driving a biaxial (X axis, Y axis) stage on which the substrate is placed. The rough adjustment of the substrate is performed in the same manner.

1-4. Wiring forming process After adjusting the substrate position, the wiring material is discharged into the wiring forming region to form the wiring. Since the substrate position can be adjusted with high accuracy in the previous step, the wiring material can be reliably discharged into the wiring formation region in this step.

2. Method for Manufacturing Liquid Crystal Device The method for manufacturing a liquid crystal device according to the present invention is formed by sandwiching a liquid crystal material between a wiring substrate created using the above-described wiring forming method and a counter substrate disposed opposite thereto. In this liquid crystal device manufacturing method, the wiring substrate and the counter substrate are aligned by measuring the position of the measurement unit.

  A wiring board is a board | substrate with which the pixel electrode and the wiring for controlling this were formed. If a TFT is used to control the pixel electrode, it is a TFT substrate. By the above wiring formation method, for example, gate electrode wiring is formed, and further, a channel layer, source / drain electrode wiring, pixel electrodes, and the like are formed, and a wiring substrate is manufactured.

  The counter substrate is a substrate arranged to face the wiring substrate, and the liquid crystal material is sandwiched between the wiring substrate and the counter substrate. In a liquid crystal device capable of color display, a color filter is formed on the counter substrate.

  In particular, when a color filter is formed on the counter substrate, it is necessary to match the relative positions of the pixel electrode of the wiring substrate and the color filter of the counter substrate with high accuracy. This is because the displayed color changes when the relative position of both pixels deviates even for one pixel.

  Therefore, in the method of the present invention, highly accurate alignment is performed using the alignment mark measuring unit.

3. Wiring forming apparatus The wiring forming apparatus of the present invention includes a discharge area for discharging a wiring material to form an alignment mark, and a measurement part forming area that is connected to the discharge area and serves as a measurement part used for measuring the substrate position. A wiring forming apparatus for forming a wiring on a substrate having an alignment mark forming region having a wiring and a wiring forming region on which the wiring is formed, wherein the discharge region is used to roughly adjust the position of the substrate before forming the alignment mark. A first optical system that measures the position of the second optical system, a second optical system that measures the position of the measurement unit of the alignment mark in order to finely adjust the position of the substrate after forming the alignment mark having the measurement unit, and the position of the substrate After rough adjustment, the wiring material is discharged to the discharge area, and the alignment mark having the measurement part is formed by extending the wiring material to the measurement part forming area. And an inkjet head that forms wiring by discharging a wiring material to a wiring formation region after finely adjusting the position of the substrate.

  This apparatus is suitable for carrying out the wiring forming method. The second optical system preferably has a higher magnification than the first optical system. Two optical systems with different magnifications are provided, and the substrate position is coarsely adjusted using the first optical system, and the substrate position is finely adjusted using the second optical system, so that the substrate position can be adjusted with high accuracy. It can be done easily.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The scope of the present invention is not limited to the contents of this embodiment.

1. Substrate First, a substrate 1 on which wiring is formed in this embodiment will be described with reference to FIG. The substrate 1 includes an ejection region 3a that ejects a wiring material to form an alignment mark, and a measurement unit formation region 3b that is connected to the ejection region 3a and that serves as a measurement unit used to measure the position of the substrate 1. It has a mark forming region 3 and a wiring forming region 5 in which wiring is formed. In the alignment mark formation region 3, the wiring material is discharged in a later process to form a fine adjustment alignment mark. A rough adjustment alignment mark 7 is also formed on the substrate 1. The wiring formed in this embodiment is a gate electrode wiring of the TFT substrate of the liquid crystal device, and is connected to a liquid crystal driving circuit (not shown).

  By the above-described method, the entire surface of the substrate 1 is subjected to a lyophobic treatment, and then the alignment mark formation region 3, the wiring formation region 5, and the coarse adjustment alignment mark 7 (hereinafter, these are combined to form “alignment mark formation region 3 And so on) are lyophilic. As a result, a liquid repellent region and a lyophilic region are formed on the substrate.

  When the alignment mark formation region 3 or the like is formed of a transparent insulating film, a transparent conductive film, or the like, the alignment mark formation region 3 or the like is very poor in visibility, and it may be impossible to detect whether the edge portion is dark or shaded. Therefore, in this embodiment, the visibility of the alignment mark formation region 3 and the like is enhanced by applying a wiring material (specifically, a silver paste) to the alignment mark formation region 3 and the like.

2. Wiring forming apparatus Next, a wiring forming apparatus used for forming wiring on the substrate 1 will be described. FIG. 2 is a system configuration diagram of this apparatus.

  This wiring forming apparatus includes a stage 13 on which the substrate 1 is placed, a first optical system 15 used for coarse adjustment of the position of the substrate 1, a second optical system 17 used for fine adjustment of the position of the substrate 1, and the substrate 1. Are provided with an inkjet head 19 for discharging the wiring material and a control unit 21 comprising a computer for controlling them.

  The stage 13 is movable in the X-axis direction, the Y-axis direction, and the rotation direction, and the position of the substrate 1 with respect to the inkjet head 19 is adjusted by moving the stage 13.

  The first optical system 15 measures the position of the coarse adjustment alignment mark 7 on the substrate 1, and the control unit 21 moves the stage 13 based on the measurement result to perform coarse adjustment of the position of the substrate 1. The first optical system 15 may measure the position of the ejection region 3a.

  After coarse adjustment of the position of the substrate 1, the inkjet head 19 discharges the wiring material to the discharge region 3 a on the substrate 1. This wiring material spreads over the entire alignment mark formation region 3, and a fine adjustment alignment mark is formed.

  The second optical system 17 measures the position of the measurement unit of the fine adjustment alignment mark, and the control unit 21 performs fine adjustment of the substrate position by moving the stage 13 based on the measurement result.

  After fine adjustment of the position of the substrate 1, the inkjet head 19 discharges the wiring material to the wiring formation region 5 on the substrate 1. As a result, a wiring is formed. A plurality of nozzles may be provided in the inkjet head 19 and a plurality of wirings may be formed simultaneously.

  The first and second optical systems 15 and 17 have a built-in CCD camera to measure the position of the alignment mark, and the second optical system 17 is used for fine adjustment of the position of the substrate 1. The magnification is higher than that of the first optical system 15 used for coarse adjustment of the position 1. The magnifications of the first and second optical systems 15 and 17 are the positional accuracy when the substrate is carried into the wiring forming apparatus from the outside and placed on the stage, and the positional accuracy when the wiring material is discharged from the inkjet head 19, respectively. It can be determined appropriately based on the above.

3. Wiring formation Next, each step of wiring formation in the present embodiment will be described in detail.
3-1. Substrate carrying-in process First, the substrate 1 on which the wiring is formed is carried into the wiring forming apparatus, and the substrate 1 is sucked and fixed to the stage 13. The substrate 1 is carried in using a substrate carrying system (not shown). The position of the stage 13 in the X-axis direction, the Y-axis direction, and the rotation direction when the substrate is loaded is always constant, and the substrate 1 is fixed to the stage 13 with the positioning accuracy of the substrate loading system.

3-2. Substrate Position Rough Adjustment Step Next, the position of the substrate 1 is roughly adjusted. Specifically, the coarse alignment mark 7 is imaged by the first optical system 15, the center position of the alignment mark 7 is measured, and the center of the alignment mark 7 becomes the center of the visual field of the first optical system 15. Then, the stage 13 is moved in the X-axis direction, the Y-axis direction, and the rotation direction. The alignment mark 7 has poor visibility, and only its edge can be detected. Therefore, although highly accurate position adjustment is difficult, in this embodiment, since the wiring material is discharged to the discharge area 3a having a relatively wide width, highly accurate position adjustment is not necessary here.

  The rough adjustment of the position of the base material 1 may be performed using the discharge region 3 a of the alignment mark forming region 3 instead of using the rough adjustment alignment mark 7. In this case, the rough alignment mark 7 can be omitted.

3-3. Fine Adjustment Alignment Mark Formation Step Next, the inkjet head 19 is moved above the ejection region 3 a of the alignment mark formation region 3. Since the coarse adjustment of the position of the substrate 1 has already been performed and the discharge region 3a is relatively wide, the ink jet head 19 is reliably disposed above the discharge region 3a.

  Next, a wiring material is discharged from the inkjet head 19 to the discharge region 3a of the alignment mark formation region 3 to form a fine adjustment alignment mark. As shown in FIG. 3, the wiring material discharged to the dotted circle portion of the discharge region 3a spreads as shown by an arrow and further extends to the measurement portion formation region 3b, and finally the entire alignment mark formation region 3 Is covered with the wiring material (therefore, the wiring material is discharged in an amount sufficient to cover the entire alignment mark formation region 3). The measurement part formation region 3b is covered with a wiring material to become a measurement part.

  Since the alignment mark forming region 3 is lyophilic and the surrounding region is liquid repellent, the wiring material does not protrude from the alignment mark forming region 3, and the shape of the alignment mark for fine adjustment to be formed is formed. Is substantially the same as the shape of the alignment mark formation region 3.

  Fine alignment marks are formed in the four alignment mark formation regions 3 shown in FIG. 1 by the same method. Further, when the coarse adjustment alignment mark 7 is used in a subsequent process (for example, a process of aligning the TFT substrate and its counter substrate when manufacturing a liquid crystal device), the coarse adjustment alignment mark 7 is also used. The wiring material may be discharged. The coarse adjustment alignment mark 7 may be discharged with a wiring material in a subsequent wiring formation process.

3-4. Substrate Position Fine Adjustment Step Next, the position of the substrate 1 is finely adjusted. Specifically, the measurement unit of the fine adjustment alignment mark is imaged by the second optical system 17, the center position of the measurement unit is measured, and the center of the measurement unit becomes the center of the field of view of the second optical system 17. Then, the stage 13 is moved in the X-axis direction, the Y-axis direction, and the rotation direction. The measurement part of the fine adjustment alignment mark is covered with the wiring material, so that the visibility is good, and not only the edge but also the whole measurement part can be detected. Therefore, highly accurate position adjustment is possible.

3-5. Wiring Formation Step Next, wiring is formed on the substrate 1. Since the position of the substrate 1 is adjusted with high accuracy, the wiring material can be reliably discharged to the wiring forming region 5. In accordance with a control command from the control unit 21, the stage 13 is operated, and the wiring material is continuously discharged from the inkjet head 19 to the wiring formation region 5, thereby forming the wiring.

  In the second embodiment, the shape of the alignment mark formation region 3 formed on the substrate 1 is different from that of the first embodiment. The shape of the alignment mark formation region 3 of the present embodiment is shown in FIG. As shown in FIG. 4, the alignment mark formation region 3 of the present embodiment has four discharge regions 3a, and in the fine adjustment alignment mark formation step, all four discharge regions 3a have a wiring material. Is discharged. Thereby, the measurement part forming region 3b can be covered with the wiring material in a short time.

  In the third embodiment, as shown in FIG. 5, the coarse adjustment alignment mark 7 and the alignment mark formation region 3 are connected. In this case, both the coarse adjustment alignment mark 7 and the alignment mark formation region 3 can be covered with the wiring material by discharging the wiring material once.

It is a top view which shows the board | substrate which forms wiring in Example 1 of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a system block diagram of the wiring formation apparatus used in forming the wiring in Example 1 of this invention. It is a top view which shows a mode that wiring material spreads in Example 1 of this invention. It is a top view which shows the alignment mark formation area | region formed in the board | substrate which forms wiring in Example 2 of this invention. It is a top view which shows the alignment mark for rough adjustment formed in the board | substrate which forms wiring in Example 3 of this invention, and an alignment mark formation area.

Explanation of symbols

1: Substrate 3: Alignment mark formation region 3a: Discharge region 3b: Measurement portion formation region 5: Wiring formation region 7: Coarse adjustment alignment mark 13: Stage 15: First optical system 17: Second optical system 19: Inkjet head 21: Control unit

Claims (7)

A wiring formation method using an inkjet method,
An alignment mark forming region having a discharge region for discharging a wiring material to form an alignment mark, and a measurement unit forming region connected to the discharge region and used as a measurement unit for measuring the substrate position, and a wiring are formed. Forming a wiring formation region on the substrate,
An alignment mark having a measurement unit is formed by discharging a wiring material to the discharge region and spreading the wiring material to the measurement unit formation region.
Adjust the position of the substrate by measuring the position of the measurement part of the alignment mark that was formed,
Then, the wiring formation method provided with the process of discharging wiring material to a wiring formation area | region and forming a wiring. The method according to claim 1, wherein the measurement part formation region is more lyophilic than the discharge region. The alignment mark formation region has two or more ejection regions,
The method according to claim 1, wherein the alignment mark is formed by discharging a wiring material to all discharge regions. The method according to claim 1, further comprising the step of roughly adjusting the position of the substrate by measuring the position of the ejection region before forming the alignment mark. A method of manufacturing a liquid crystal device formed by sandwiching a liquid crystal material between a wiring board created by using the wiring forming method according to claim 1 and a counter substrate disposed opposite thereto. The method of manufacturing a liquid crystal device in which the wiring substrate and the counter substrate are aligned by measuring the position of the measurement unit. An alignment mark forming region having a discharge region for discharging a wiring material to form an alignment mark, and a measurement unit forming region connected to the discharge region and used as a measurement unit for measuring the substrate position, and a wiring are formed. A wiring forming apparatus for forming a wiring on a substrate having a wiring forming region,
A first optical system for measuring the position of the ejection region in order to roughly adjust the position of the substrate before forming the alignment mark;
A second optical system for measuring the position of the alignment mark measurement unit in order to finely adjust the position of the substrate after forming the alignment mark having the measurement unit;
After roughly adjusting the position of the substrate, the wiring material is discharged to the discharge region, and the wiring material is extended to the measurement portion forming region to form an alignment mark having a measuring portion, and the wiring after finely adjusting the position of the substrate A wiring formation apparatus comprising: an inkjet head that forms wiring by discharging a wiring material to a formation region. The apparatus according to claim 6, wherein the second optical system has a higher magnification than the first optical system.

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