JP2007043075A - Thermoelectric conversion device - Google Patents

Thermoelectric conversion device Download PDF

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Publication number
JP2007043075A
JP2007043075A JP2006092368A JP2006092368A JP2007043075A JP 2007043075 A JP2007043075 A JP 2007043075A JP 2006092368 A JP2006092368 A JP 2006092368A JP 2006092368 A JP2006092368 A JP 2006092368A JP 2007043075 A JP2007043075 A JP 2007043075A
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Japan
Prior art keywords
thermoelectric
conversion device
thermoelectric element
element
plurality
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JP2006092368A
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Japanese (ja)
Inventor
Isao Azeyanagi
Akio Matsuoka
Yasuhiko Niimi
康彦 新美
彰夫 松岡
功 畔柳
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Denso Corp
株式会社デンソー
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Application filed by Denso Corp, 株式会社デンソー filed Critical Denso Corp
Priority to JP2006092368A priority patent/JP2007043075A/en
Publication of JP2007043075A publication Critical patent/JP2007043075A/en
Application status is Pending legal-status Critical

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT-PUMP SYSTEMS
    • F25B2321/00Details of machines, plants, or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants, or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021Control thereof
    • F25B2321/0212Control thereof of electric power, current or voltage

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermoelectric conversion device capable of miniaturizing the device, and improving productivity without degrading cooling capacity and the coefficient of performance. <P>SOLUTION: The thermoelectric conversion device comprises a pair of thermoelectric elements 12 and 13 composed of a p-type and an n-type, and one, two or more thermoelectric element substrates 10 for which two or more pairs of thermoelectric elements 12 and 13 are arrayed and the thermoelectric elements 12 and 13 are electrically connected, and a power supply voltage is directly applied to one, two or more thermoelectric element substrates 10. The thermoelectric element substrate 10 is formed such that an application voltage applied to the pair of thermoelectric elements 12 and 13 is ≥0.04 V and <0.08 V, when the output of the power supply voltage is used under a rated condition. Thus, the device is miniaturized. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a thermoelectric conversion device that can absorb heat and dissipate heat by passing a direct current through a series circuit composed of an N-type thermoelectric element and a P-type thermoelectric element. In particular, the present invention relates to a plurality of thermoelectric element modules. The present invention relates to the optimum shape and optimum applied voltage of a pair of thermoelectric elements.

  Conventionally, as this type of thermoelectric conversion device, for example, a predetermined number of N-type thermoelectric elements and P-type thermoelectric elements are arranged in a planar shape, and one side electrode element is attached to one surface of each of the pair of thermoelectric elements. The other-side electrode element is attached to the other surface of each thermoelectric element, and a thermoelectric element module is formed by electrically connecting these thermoelectric elements in series.

Furthermore, a heat exchange member for absorbing and radiating heat transferred from each electrode element is formed on at least one of the one side electrode element and the other side electrode element (see, for example, Patent Document 1).
JP 2003-124531 A

  However, in the apparatus as described in Patent Document 1, all thermoelectric elements are electrically connected in series via one side electrode element or the other side electrode element. Therefore, the thermoelectric element, the electrode element, and the heat exchange member that are adjacent to each other are arranged in an electrically insulated state.

  In other words, although not described in detail in Patent Document 1, in this type of apparatus, the apparatus can be reduced in size according to the planar area of a plurality of pairs of thermoelectric elements arranged in a planar shape. For example, if the applied voltage per pair of elements is reduced, the number of element pairs of thermoelectric elements can be increased, and if the applied voltage per pair of elements is increased, the number of element pairs of thermoelectric elements can be reduced.

  That is, when the applied voltage per pair is increased to reduce the number of element pairs, the installation area can be reduced, but the cooling capacity and the coefficient of performance are lowered.

  Further, since this type of thermoelectric module is used in a small cooling device or heating device, there are a plurality of component parts such as a thermoelectric element, an electrode element, and a heat exchanging member, and they are extremely small parts. As a result, there is a problem that productivity in the manufacturing process when assembling these components is extremely low.

  Accordingly, an object of the present invention is to provide a thermoelectric conversion apparatus that can reduce the size of the apparatus and improve the productivity without reducing the cooling capacity and the coefficient of performance. is there.

In order to achieve the above object, the technical means according to claims 1 to 11 are employed. That is, in the first aspect of the present invention, a plurality of pairs of thermoelectric elements (12, 13) composed of P-type and N-type are arranged and these thermoelectric elements (12, 13) are electrically connected. A thermoelectric conversion device comprising one or more thermoelectric element modules (10) and directly applying a power supply voltage to one or more thermoelectric element modules (10),
The thermoelectric element module (10) has an applied voltage applied to the pair of thermoelectric elements (12, 13) of 0.04 V or more and less than 0.08 V when the output of the power supply voltage is used under rated conditions. It is characterized by being formed.

  According to the present invention, there is an optimum applied voltage per pair of thermoelectric elements (12, 13) in which the heat absorption capacity and the coefficient of performance thereof are maximized. This has been found by the inventors through research, and if it is within the optimum voltage range of 0.04 V to less than 0.08 V, it can be used in a usage range where the endothermic capacity and coefficient of performance are good. it can.

  Moreover, the heat absorption capacity and the coefficient of performance are maximized when the applied voltage is reduced within the optimum voltage range. However, in such a case, the number of element pairs increases and the installation area of the apparatus increases. However, by reducing the physique of the thermoelectric elements (12, 13) within a range that can prevent a decrease in productivity, the cooling capacity and The size of the apparatus can be reduced without reducing the coefficient of performance.

  Further, since the optimum voltage range is obtained from the rated condition of the power supply voltage, it is suitable as a cooling device or a heating device mounted on a vehicle.

In the invention according to claim 2, a plurality of pairs of thermoelectric elements (12, 13) composed of P-type and N-type are arranged, and these thermoelectric elements (12, 13) are electrically connected. One or more modules (10) are provided, voltage adjusting means (2) for adjusting the power supply voltage to a predetermined voltage is provided, and one or more thermoelectric element modules (10) are provided via the voltage adjusting means (2). A thermoelectric conversion device to be applied,
In the thermoelectric module (10), when the output voltage of the voltage adjusting means (2) is used under rated conditions, the applied voltage applied to the pair of thermoelectric elements (12, 13) is 0.04V or more and 0.08V. It is characterized by being formed to be less.

  According to the present invention, in the vehicular power supply, the power supply voltage fluctuates depending on the load of the vehicular auxiliary machine and environmental conditions, and the applied voltage applied to the pair of thermoelectric elements (12, 13) fluctuates due to the fluctuation. By means of the voltage adjusting means (2), the optimum applied voltage can be applied to the pair of thermoelectric elements (12, 13) at all times. Thereby, it can be used in the use range from which heat absorption capability and its coefficient of performance become favorable.

  In the invention according to claim 3, the thermoelectric element module (10) is formed such that the applied voltage applied to the pair of thermoelectric elements (12, 13) is more preferably 0.04V or more and less than 0.07V. It is characterized by that. According to the present invention, by setting the upper limit of the optimum applied voltage to less than 0.07 V, the cooling capacity and the coefficient of performance can be improved more than in the first and second aspects described above.

  In the invention according to claim 4, the thermoelectric module (10) is formed such that the applied voltage applied to the pair of thermoelectric elements (12, 13) is most preferably 0.04V or more and less than 0.05V. It is characterized by that. According to the present invention, by setting the upper limit of the optimum applied voltage to less than 0.05 V, the cooling capacity and the coefficient of performance thereof can be improved more than the above-described third aspect.

In the invention according to claim 5, a plurality of pairs of thermoelectric elements (12, 13) composed of P-type and N-type are arranged, and these thermoelectric elements (12, 13) are electrically connected. A thermoelectric conversion device comprising one or a plurality of modules (10) and directly applying a power supply voltage to one or a plurality of thermoelectric element modules (10),
The thermoelectric module (10) includes a thermoelectric element (12, 13) having a cross-sectional area (a × b) perpendicular to the direction of current flow through the thermoelectric element (12, 13), and the thermoelectric element (12, 13). The element shape index (a × b / h), which is a ratio to the height (h), is 1.5 or more and less than 2.5.

  According to the present invention, the endothermic capacity increases as the element shape index (a × b / h) increases, and the coefficient of performance increases as the element shape index (a × b / h) decreases. Increase. Therefore, in the present invention, by setting the optimum range of the element shape index (a × b / h) to 1.5 or more and less than 2.5, the cooling capacity and the coefficient of performance are not lowered.

  Further, by setting the upper limit of the element shape index (a × b / h) to less than 2.5, the height (h) of the thermoelectric elements (12, 13) is set to 1 mm or more, which is a restriction from the manufacturing surface, High heat absorption capacity and high coefficient of performance can be realized while preventing a decrease in productivity.

In the invention described in claim 6, a plurality of pairs of P-type and N-type thermoelectric elements (12, 13) are arranged, and these thermoelectric elements (12, 13) are electrically connected. One or a plurality of modules (10) are provided, voltage adjusting means (2) for adjusting the power supply voltage to a predetermined voltage is provided, and one or a plurality of thermoelectric element modules (10) are provided via the voltage adjusting means (2). A thermoelectric conversion device applied to
The thermoelectric module (10) includes a thermoelectric element (12, 13) having a cross-sectional area (a × b) perpendicular to the direction of current flow through the thermoelectric element (12, 13), and the thermoelectric element (12, 13). The element shape index (a × b / h), which is a ratio to the height (h), is 1.5 or more and less than 2.5.

  According to the present invention, the voltage adjusting means (2) can always apply the optimum applied voltage to the pair of thermoelectric elements (12, 13), so that the cooling capacity and the coefficient of performance can be more reliably reduced. There is no. Furthermore, it is possible to realize a high heat absorption capability and a high coefficient of performance while more reliably preventing a decrease in productivity.

  In the invention according to claim 7, in the thermoelectric element module (10), the element shape index (a × b / h) of the thermoelectric elements (12, 13) is more preferably 2.0 or more and less than 2.5. It is characterized by being formed as follows. According to the present invention, by setting the lower limit of the element shape index (a × b / h) to 2.0 or more, the cooling capacity can be improved from the above fifth and sixth aspects.

  In the invention according to claim 8, in the thermoelectric element module (10), when the output of the power supply voltage is used under rated conditions, the applied voltage applied to the pair of thermoelectric elements (12, 13) is 0.04 V or more. , Less than 0.08V. According to the present invention, the apparatus can be reduced in size and productivity can be improved without reducing the cooling capacity and the coefficient of performance.

  In the invention according to claim 9, when the output voltage of the voltage adjusting means (2) is used under rated conditions, the thermoelectric module (10) is applied voltage applied to the pair of thermoelectric elements (12, 13). Is 0.04V or more and less than 0.08V. According to the present invention, it is possible to more reliably reduce the size of the apparatus and improve the productivity without lowering the cooling capacity and the coefficient of performance more reliably.

In the invention according to claim 10, the thermoelectric element module (10) is disposed on one surface of the thermoelectric element module (10) with an insulating space (L1, L2) therebetween, and is connected to the pair of thermoelectric elements (12, 13) so as to be capable of transferring heat. A plurality of endothermic heat exchange members (22),
A plurality of heat dissipation heat exchange members (32) disposed on the other surface of the thermoelectric element module (10) with an insulating space (L1, L2) therebetween and connected to the pair of thermoelectric elements (12, 13) so as to be able to conduct heat. And the heat exchange medium is circulated to each of the plurality of endothermic heat exchange members (22) and the plurality of heat dissipation heat exchange members (32).
The plurality of endothermic heat exchange members (22) and the plurality of heat radiation heat exchange members (32) are more orthogonal to the flow direction of the heat exchange medium than the insulating space (L2) formed along the flow direction of the heat exchange medium. It is characterized in that the insulating space (L1) formed in the direction to be formed is larger.

  According to the present invention, the number of element pairs can be increased by reducing the insulating space (L2). Thereby, size reduction of an apparatus can be achieved. In addition, the heat exchange part of the endothermic heat exchange member (22) and the radiant heat exchange member (32) can be formed in the insulation space (L1) formed in the orthogonal direction.

  In the invention according to claim 11, the thermoelectric element module (10) is disposed so that the pair of thermoelectric elements (12, 13) are electrically connected in series in the depth direction along the flow direction of the heat exchange medium. The width dimension (W1) perpendicular to the flow direction of the heat exchange medium is larger than the depth dimension (W2) along the flow direction of the heat exchange medium. It is characterized by.

  According to the present invention, since the depth dimension (W2) is smaller, the potential difference between the thermoelectric elements (12, 13) adjacent in the direction perpendicular to the flow direction of the heat exchange medium is prevented from increasing. Can do. Further, the number of element pairs can be increased on the width dimension (W1) side. That is, the number of element pairs can be increased in the direction in which the ventilation resistance decreases.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows a corresponding relationship with the specific means of embodiment mentioned later.

(First embodiment)
Hereinafter, a thermoelectric conversion device according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 9. FIG. 1 is a plan view showing an external shape of a thermoelectric conversion device according to this embodiment, and FIG. 2 is a cross-sectional view taken along line AA shown in FIG. 1 showing the overall configuration of the thermoelectric conversion device. 3 is a cross-sectional view taken along the line CC shown in FIG. 2, and FIG. 4 is a cross-sectional view taken along the line BB shown in FIG.

  The thermoelectric conversion device of the present embodiment is a thermoelectric conversion device applied to a cooling device or a heating device mounted on a vehicle.For example, a thermoelectric conversion device is arranged in each of a seating portion and a backrest portion of a vehicle seat. And is applied to a sheet air conditioner that blows out the cold air cooled by the thermoelectric converter from the sheet surface.

  Therefore, the thermoelectric conversion device of the present embodiment is miniaturized so that the thermoelectric conversion device can be mounted in a vehicle seat having a small installation space. As shown in FIGS. 1 to 4, the thermoelectric conversion device includes a thermoelectric element substrate 10 that is a thermoelectric element module, a heat absorption side fin substrate 20, a heat dissipation side fin substrate 30, and a pair of case members 28 and 38. .

  As shown in FIGS. 2 to 4, the thermoelectric element substrate 10 that is a thermoelectric element module includes a first insulating substrate 11 that is a thermoelectric element holding plate, P-type and N-type thermoelectric elements 12 and 13, and electrode members. 16 is integrally formed.

  Specifically, a pair of P-type thermoelectric elements 12 and N-type thermoelectric elements 13 are provided on a first insulating substrate 11 made of a flat insulating material (for example, glass epoxy, PPS resin, LCP resin, or PET resin). A plurality of thermoelectric element groups alternately arranged in a substantially grid pattern are arranged in a row, and electrode members 16 are joined to both end faces of a pair of adjacent thermoelectric elements 12 and 13 so as to be integrated.

  The P-type thermoelectric element 12 is composed of a P-type semiconductor made of a Bi—Te-based compound, and the N-type thermoelectric element 12 is a minimal component composed of an N-type semiconductor made of a Bi—Te-based compound. The P-type thermoelectric element 12 and the N-type thermoelectric element 13 are formed so that the upper end surface and the lower end surface protrude beyond the first insulating substrate 11.

  The electrode member 16 is formed of a conductive metal such as a flat copper material, and electrically connects a pair of adjacent P-type thermoelectric elements 12 and N-type thermoelectric elements 13 among the thermoelectric element groups arranged on the thermoelectric element substrate 10. The electrodes are connected in series.

  More specifically, as shown in FIG. 2, the electrode member 16 disposed above is an electrode for allowing a current to flow from the adjacent N-type thermoelectric element 13 toward the P-type thermoelectric element 12, and below the electrode member 16. The arranged electrode member 16 is an electrode for causing a current to flow from the adjacent P-type thermoelectric element 12 to the N-type thermoelectric element 13. The electrode member 16 is bonded to the end faces of the thermoelectric elements 12 and 13 in advance by applying paste solder thinly and uniformly by screen printing and then soldering.

  Next, the endothermic fin substrate 20 is a second insulating substrate that is a holding plate made of a flat insulating material (for example, glass epoxy, PPS resin, LCP resin, or PET resin) with the plurality of endothermic heat exchange members 22. The heat radiation side fin substrate 30 is a holding plate made of a flat insulating material (for example, glass epoxy, PPS resin, LCP resin, or PET resin). A third insulating substrate 31 is integrally formed.

  The endothermic heat exchanging member 22 and the radiating heat exchanging member 32 are made of a thin plate material made of a conductive metal such as a copper material. As shown in FIG. Heat-absorbing and radiating electrode portions 25 and 35 are formed, and louver-like heat exchanging portions 26 and 36 are formed on a plane extending outward from the electrode portions 25 and 35.

  The heat exchanging portions 26 and 36 are fins for absorbing and radiating heat transferred from the heat absorbing and radiating electrode portions 25 and 35, and are integrated with the electrode portions 25 and 35 by molding such as cutting and raising. Forming. And it is comprised integrally with the 2nd or 3rd insulated substrate 21 and 31 so that the end surface of the heat absorption and the thermal radiation electrode part 25 and 35 may join to the electrode member 16. FIG.

  Note that the endothermic heat exchange member 22 and the radiant heat exchange member 32 are positioned so that the endothermic surfaces of the second and third insulating substrates 21 and 31 protrude slightly from the one end surfaces of the radiating electrode portions 25 and 35. It is composed of one piece. That is, when one end surface of the electrode portions 25 and 35 is joined to the electrode member 16 provided on the thermoelectric element substrate 10, the heat absorption and heat dissipation electrode portions 25 and 35 are configured not to protrude to the electrode member 16 side. ing.

  Further, the adjacent endothermic heat exchange members 22 and radiant heat exchange members 32 are provided with a predetermined space so as to be electrically insulated from each other, and a plurality of second and third insulating substrates 21 in a substantially grid pattern are provided. 31. And it arrange | positions so that the endothermic electrode part 25 of the endothermic heat exchange member 22 may be joined to the electrode member 16 arrange | positioned upward, and the radiation electrode part 35 of the thermal radiation heat exchange member 32 is joined to the electrode member 16 arrange | positioned below It is arranged to do.

  1 and 2, terminals 24a and 24b are provided at the ends of the thermoelectric elements 12 and 13 disposed at the left and right ends, respectively, and the terminals 24a and 24b are connected to a positive power source (not shown). The side terminal is connected to the terminal 24a, and the negative side terminal is connected to the terminal 24b.

  As a result, a plurality of electrode members 16 and endothermic heat exchange members 22 disposed on the upper side are disposed so as to be electrically connected from the adjacent N-type thermoelectric element 13 to the P-type thermoelectric element 12, and the lower side. A plurality of the electrode members 16 and the radiant heat exchange members 32 arranged in are arranged so as to be electrically connected from the adjacent P-type thermoelectric element 12 to the N-type thermoelectric element 13.

  Incidentally, the DC power input from the terminal 24a flows in series from the leftmost P-type thermoelectric element 12 shown in FIG. 1 to the N-type thermoelectric element 13 via the electrode member 16 disposed below, Then, it flows in series from the N-type thermoelectric element 13 to the P-type thermoelectric element 12 through the electrode member 16 disposed upward.

  At this time, the electrode member 16 disposed below the PN junction portion is in a high temperature state due to the Peltier effect, and the electrode member 16 disposed above the NP junction portion is in a low temperature state. . That is, the heat exchanging part 26 arranged on the upper side forms an endothermic heat exchanging part, heat in a low temperature state is transferred to contact with the fluid to be cooled, and the heat exchanging part 36 installed on the lower side is radiated heat. An exchange part is formed and heat in a high temperature state is transferred to contact the cooling fluid.

  In other words, as shown in FIG. 2, the thermoelectric element substrate 10 is used as a partition wall, the case members 28 and 38 form air passages on both sides of the thermoelectric element substrate 10, and air as a heat exchange medium is introduced into the air passages. By circulating, the heat exchanging units 26 and 36 and the air are heat-exchanged, the air can be cooled by the upper heat exchanging unit 26 using the thermoelectric element substrate 10 as a partition wall, and the lower heat exchanging unit 36. The air can be heated.

  In the present embodiment, the positive terminal of the DC power source is connected to the terminal 24a side, the negative terminal is connected to the terminal 24b side, and the DC power source is input to the terminal 24a. The positive terminal may be connected to the terminal 24b side, the negative terminal may be connected to the terminal 24a side, and a DC power supply may be input to the terminal 24b. However, at this time, the upper endothermic heat exchange member 22 forms a heat dissipation heat exchange portion, and the lower endothermic heat exchange member 32 forms an endothermic heat exchange portion.

  By the way, in the thermoelectric conversion device having the above configuration, in order to reduce the size of the entire device, in particular, the shape of the plural pairs of thermoelectric elements 12 and 13 arranged on the thermoelectric element substrate 10, the number of element pairs, and the thermoelectric element pair. The applied voltage is optimized. In other words, the thermoelectric converter is reduced in size so that it can be mounted in a narrow installation space like a vehicle seat, and the cooling capacity and the coefficient of performance COP are improved.

  Here, optimization of the shape of the thermoelectric elements 12 and 13, the number of element pairs, and the applied voltage per thermoelectric element pair has been found by the inventors' research, and will be described below with reference to FIGS. 5 to 9. . The cooling capacity of the thermoelectric conversion device may be obtained by obtaining the low-temperature heat generated by the electrode member 16 disposed above that constitutes the NP junction, that is, the endothermic amount Qc.

Specifically, the endothermic amount Qc can be obtained by Qc = (Peltier endothermic) − (Joule heat loss) − (return heat loss). More specifically, Peltier endotherm = n · α · I · Tc, Joule heat loss = 1/2 · I 2 · (n · h / (a · b) · ρ), Return heat loss = n · (a B) / h · λ · ΔT, which can be calculated from these.

  Here, n: element logarithm, α: Seebeck coefficient of element material, I: current, Tc: temperature of endothermic surface, h: element height, a: element width dimension, b: element depth dimension, ρ: The resistance coefficient of the element material, λ: the thermal conductivity of the element material, ΔT: the temperature difference between the heat absorbing and radiating surfaces.

  FIG. 5 is a characteristic diagram showing the relationship between the applied voltage per thermoelectric element pair and the endothermic capacity ratio, and FIG. 6 is a characteristic diagram showing the relationship between the applied voltage per thermoelectric element pair and the coefficient of performance COP. FIG. 7 is a characteristic diagram showing the relationship between the applied voltage per thermoelectric element pair and the number of element pairs. Further, FIG. 8 is a characteristic diagram showing the relationship between the applied voltage per pair of thermoelectric elements and the maximum allowable dimension of the element.

  Incidentally, the endothermic capacity ratio shown in FIG. 5 is obtained from the endothermic amount Qc, and the coefficient of performance COP shown in FIG. 6 is obtained by COP = endothermic amount Qc / power consumption. Further, the endothermic capacity ratio and the coefficient of performance COP shown in FIGS. 5 and 6 are such that the thermoelectric elements 12 and 13 are made of a Bi-Te compound material, and the dimensions of the elements (see FIG. 11) are a = 1. A shape of 0.5 mm, b = 1.5 mm, and h = 1 mm is used.

  Note that the voltage applied between the terminals 24a and 24b of the thermoelectric element substrate 10 is a DC12V drive voltage used under the rated conditions output from the vehicle power supply, and the thermoelectric element pair per drive voltage under the rated conditions is applied. The applied voltage is obtained.

  Accordingly, it was found from the results shown in FIGS. 5 and 6 that there is an applied voltage in the optimum voltage range in which both the endothermic amount Qc and the coefficient of performance COP are maximized. That is, it has been found that in order to improve the endothermic amount Qc and the coefficient of performance COP, the applied voltage per pair of thermoelectric elements is preferably within the optimum voltage range of preferably 0.01 V or more and less than 0.08 V.

  In particular, it was found that the endothermic amount Qc and the coefficient of performance COP are maximum when the applied voltage is in the vicinity of the lower limit of 0.01 V. Therefore, when the optimum applied voltage is the best of about 0.01 V, the heat absorption amount Qc and the coefficient of performance COP are high capacity and high efficiency.

  However, when the applied voltage per pair of thermoelectric elements is about 0.01 V with respect to the drive voltage of the rated condition applied between the terminals 24a and 24b, the number of elements arranged in the thermoelectric element substrate 10 is as shown in FIG. As shown, about 1300 logarithms are required.

  This has a problem that the size of the thermoelectric element substrate 10 becomes extremely large. That is, it has been found that the thermoelectric element substrate 10 having the number of element pairs is too large to be mounted in a sheet having a limited installation space.

  Therefore, in the present invention, the physique of the thermoelectric element substrate 10 that can be mounted in the sheet is set in advance to a general predetermined (for example, about 40 mm square) shape, and the thermoelectric element substrate 10 is arranged in this predetermined (for example, about 40 mm square) shape. The element dimensions of the thermoelectric elements 12 and 13 that can be provided and the number of element pairs were determined.

  Specifically, the element size is set to about 1.0 to 1.5 mm or more as a size that does not deteriorate the assembling property for assembling in the first insulating substrate 11, and the gap between the elements is further set. In consideration of this, the number of element pairs that can be arranged in the 40 mm square first insulating substrate 11 is about 130 pairs.

  However, according to the number of element pairs of about 130 pairs, as shown in FIGS. 7 and 8, the applied voltage per thermoelectric element pair is 0.09V. As described above, this is outside the optimum voltage range shown in FIGS.

  Therefore, in the present embodiment, the drive voltage applied between the terminals 24a and 24b is halved to, for example, DC 6V, so that the applied voltage per thermoelectric element pair is 0.05V or less as shown in FIG.

  With this applied voltage, it can be within the optimum voltage range shown in FIGS. Therefore, in the present embodiment, the thermoelectric element substrate 10 is configured by disposing about 130 pairs of element pairs using the thermoelectric elements 12 and 13 having element dimensions of about 1.5 mm × 1.5 mm. Then, by applying a driving voltage of DC6V between the terminals 24a and 24b, the applied voltage per pair of thermoelectric elements can be applied at 0.04V or more and less than 0.05V.

  Therefore, the thermoelectric element substrate 10 may be formed so that the applied voltage per pair of thermoelectric elements is preferably 0.04 V or more and less than 0.08 V, as shown in FIG. In addition, in order to improve the high capacity and high efficiency, the applied voltage per thermoelectric element pair is more preferably 0.04 V or more and less than 0.07 V, and the applied voltage per thermoelectric element pair is most preferably What is necessary is just to form so that it may become 0.04V or more and less than 0.05V.

  In the present embodiment, the driving voltage of DC 6V is applied between the terminals 24a and 24b of the thermoelectric element substrate 10. However, the present invention is not limited to this, and two thermoelectric element substrates 10 are provided as shown in FIG. A drive voltage of DC 12V may be applied between the terminals 24a and 24b by being electrically connected in series. According to this, a driving voltage of DC 6 V is applied to each thermoelectric element substrate 10.

  In the above configuration, the number of element pairs of the thermoelectric element substrate 10 is about 130. However, the number of element pairs is not limited to this, and the drive voltage applied between the terminals 24a and 24b of the thermoelectric element substrate 10 is DC4V. It may be less. However, in this case, the three thermoelectric element substrates 10 may be electrically connected in series, and a drive voltage of DC 12 V may be applied between the terminals 24a and 24b.

  In addition, since the vehicle power supply also has a DC24V specification in addition to the DC12V specification, in this case, for example, a divisor of DC12V of rated conditions is provided between the terminals 24a and 24b of one thermoelectric element substrate 10. A plurality of (for example, two to four) thermoelectric element substrates 10 may be disposed so as to apply a driving voltage.

  Next, a method for assembling the thermoelectric element substrate 10 having the above configuration will be described. First, as shown in FIGS. 3 and 4, the thermoelectric elements 12, 13 are arranged in a plurality of P-type and N-type alternately in a substantially grid pattern in a substrate hole provided in the first insulating substrate 11. The element substrate 10 is integrally formed. A plurality of electrode members 16 are joined by soldering so as to be electrically connected in series to both end surfaces of the thermoelectric elements 12 and 13 arranged adjacent to the thermoelectric element substrate 10.

  Thereby, the thermoelectric elements 12 and 13 and the electrode member 16 are comprised integrally. The electrode member 16 disposed on the upper side forms an NP junction, and the adjacent thermoelectric elements 12 and 13 are connected in series, and the electrode member 16 disposed on the lower side is a PN junction. The adjacent thermoelectric elements 12 and 13 are electrically connected in series.

  The thermoelectric elements 12 and 13 and the electrode member 16 may be assembled using a mounter device which is a manufacturing apparatus for assembling semiconductors, electronic components, and the like to the control board. According to this, if the element dimensions of the thermoelectric elements 12 and 13 are about 1.5 mm × 1.5 mm or more, the thermoelectric elements 12 and 13 can be easily picked up and can be assembled without lowering the productivity.

  According to the thermoelectric conversion device according to the first embodiment described above, the thermoelectric element substrate 10 has an applied voltage of 0.04 V applied to the pair of thermoelectric elements 12 and 13 when the output of the power supply voltage is used under rated conditions. As mentioned above, it forms so that it may become less than 0.08V.

  According to this, there is an optimum applied voltage per pair of thermoelectric elements 12 and 13 that maximizes the heat absorption capability and the coefficient of performance COP. This has been found by the inventors through research, and if it is within the optimum voltage range of 0.04 V to less than 0.08 V, it can be used in a usage range where the endothermic capacity and coefficient of performance are good. it can.

  Moreover, the heat absorption capacity and the coefficient of performance are maximized when the applied voltage is reduced within the optimum voltage range. However, in such a case, the number of device pairs increases and the installation area of the apparatus increases.

  However, by reducing the size of the thermoelectric elements 12 and 13 within a range that can prevent a decrease in productivity, the apparatus can be downsized without reducing the cooling capacity and the coefficient of performance. Further, since the optimum voltage range is obtained from the rated condition of the power supply voltage, it is suitable as a cooling device or a heating device mounted on a vehicle.

  Further, since the thermoelectric element substrate 10 is formed so that the applied voltage applied to the pair of thermoelectric elements 12 and 13 is more preferably 0.04 V or more and less than 0.07 V, the upper limit of the applied voltage is set to 0.07 V. By setting it to less than the above, the cooling capacity and the coefficient of performance can be improved more than those described above.

  Further, since the thermoelectric element substrate 10 is formed so that the applied voltage applied to the pair of thermoelectric elements 12 and 13 is most preferably 0.04 or more and less than 0.05 V, the upper limit of the applied voltage is 0.05 V. By making it less than, the cooling capacity and the coefficient of performance can be improved most.

(Second Embodiment)
In the first embodiment described above, the thermoelectric element substrate 10 is formed by optimizing the element shape, the number of element pairs, and the applied voltage per thermoelectric element pair, but not limited to this, the element shape of the thermoelectric elements 12 and 13 is optimized. May be formed.

  Specifically, as shown in FIG. 10, the endothermic amount Qc increases as the cross-sectional area (a × b) / height (h) of the element increases, and the coefficient of performance COP There is a relationship that increases as the area (a × b) / height (h) decreases. At this time, a driving voltage of DC 6 V is applied between the terminals 24 a and 24 b of the thermoelectric element substrate 10.

  In the present embodiment, based on FIG. 10, the shape of the thermoelectric elements 12 and 13 is perpendicular to the flow direction of the drive current flowing through the thermoelectric elements 12 and 13, and the thermoelectric elements 12 and 13 The element shape index (a × b / h), which is a ratio to the height (h) of 13, is optimized to reduce the size of the thermoelectric conversion device. In the element shape index (a × b / h), a is the width dimension of the thermoelectric elements 12 and 13 and b is the depth dimension, as shown in FIG.

  More specifically, (1) the endothermic amount ratio can secure 65% or more of the maximum endothermic amount Qc. (2) A coefficient of performance COP of 1 or more can be secured. (3) The height (h) of the element should be 1 mm or more. The optimum range of the element shape index (a × b / h) satisfying these three conditions is obtained. Here, (3) The height (h) of the element is a restriction in terms of manufacturing, and the assemblability is not lowered by setting the height (h) to 1 mm or more.

  Thereby, (1) should just have an element shape index | exponent (axb / h) 1.5 or more. (2) is sufficient if the element shape index (a × b / h) is less than 3.2. In (3), when the element shape index (a × b / h) is 2.5 or less, the endothermic amount ratio can ensure 65% or more of the maximum endothermic amount Qc, and the coefficient of performance COP can be 1 or more.

  That is, the element shape index (a × b / h) is preferably 1.5 or more and less than 2.5, and more preferably 2 or more and less than 2.5. As a result, both the cooling capacity and the coefficient of performance can be realized in a high region.

  Further, by setting the upper limit of the element shape index (a × b / h) to less than 2.5, the height (h) of the thermoelectric elements 12 and 13 is set to a predetermined height that is a restriction from the manufacturing surface (for example, 1 mm) or more, a high heat absorption capability and a high coefficient of performance can be realized while preventing a decrease in productivity. Furthermore, by setting the lower limit of the element shape index (a × b / h) to 2.0 or more, the endothermic ratio can ensure 80% or more of the maximum endothermic amount Qc.

  In addition, it is more reliable by combining the optimum voltage range of the applied voltage per pair of thermoelectric elements obtained in the first embodiment with the thermoelectric element substrate 10 formed based on the above element shape index (a × b / h). The apparatus can be reduced in size and productivity can be improved without lowering the cooling capacity and the coefficient of performance.

(Third embodiment)
In the above embodiment, the downsizing of the thermoelectric element substrate 10 has been described. However, the present invention is not limited to this, and the heat absorption side fin substrate 20 and the heat dissipation side fin substrate 30 stacked above and below the thermoelectric element substrate 10 also have a plurality of endothermic heat. It is desirable to arrange the exchange member 22 and the radiant heat exchange member 32 to be miniaturized.

  Specifically, as shown in FIG. 12, the heat absorption side fin substrate 20 and the heat dissipation side fin substrate 30 have the insulating space L <b> 2 formed along the flow direction of air as the heat exchange medium and the flow of the heat exchange medium. An insulating space L1 formed in a direction orthogonal to the direction is provided, and a plurality of endothermic heat exchange members 22 and a plurality of radiant heat exchange members 32 are provided.

  Therefore, by forming the heat absorption side fin substrate 20 and the heat radiation side fin substrate 30 so that the insulation space L1 is larger than the insulation space L2, the number of thermoelectric elements can be increased by reducing the insulation space L2. Can do. Thereby, size reduction of an apparatus can be achieved. In addition, the heat exchange part of the endothermic heat exchange member 22 and the heat radiation heat exchange member 32 can be formed in the insulation space L1 formed in the orthogonal direction.

(Fourth embodiment)
In the third embodiment described above, the heat absorption side fin substrate 20 and the heat radiation side fin substrate 30 are formed so that the insulating spaces L1 and L2 formed between the heat absorption heat exchange members 22 and the heat radiation heat exchange members 32 adjacent to each other are different. However, the present invention is not limited to this, and the outer shape of the thermoelectric element substrate 10 is formed such that the width dimension W1 perpendicular to the air flow direction is larger than the depth dimension W2 along the air flow direction. May be.

  Specifically, as shown in FIG. 13, the thermoelectric elements 12 and 13 are arranged on the first insulating substrate 11 so as to be electrically connected in series in the depth direction along the air flow direction. Then, the outer shape of the thermoelectric element substrate 10 is formed so that the width dimension W1 is larger than the depth dimension W2.

  According to this, since the depth dimension W2 is smaller, it is possible to prevent the potential difference between the thermoelectric elements 12 and 13 adjacent in the direction perpendicular to the air flow direction from increasing. Further, the number of element pairs can be increased on the width dimension W1 side. That is, the number of element pairs can be increased in the direction in which the ventilation resistance decreases.

(Fifth embodiment)
In the above embodiment, one or a plurality of thermoelectric element substrates 10 are electrically connected in series, and the vehicle power supply is directly applied between the terminals 24a and 24b. The DC-DC converter 2 that is a voltage adjusting unit that adjusts the voltage to a predetermined voltage may be included, and the thermoelectric element substrate 10 may be applied via the DC-DC converter 2.

  Specifically, as shown in FIG. 14, a DC-DC converter 2 is provided between a battery 1 that is a vehicle power source and a thermoelectric element substrate 10. The power supply voltage output from the battery 1 is adjusted to a predetermined voltage (for example, DC 6 V) by the DC-DC converter 2 and connected between the terminals 24 a and 24 b of the thermoelectric element substrate 10. The predetermined voltage at this time is the rated condition.

  According to the above configuration, for example, in the vehicular power supply, the power supply voltage fluctuates depending on the load of the vehicular auxiliary machine and the environmental conditions, and the applied voltage applied to the pair of thermoelectric elements 12 and 13 fluctuates due to the fluctuation. However, the DC-DC converter 2 can always apply the optimum applied voltage to the pair of thermoelectric elements 12 and 13. Therefore, it can be used in a usage range where the endothermic ability and the coefficient of performance are good.

(Other embodiments)
In the above embodiment, the present invention is applied to a seat air conditioner mounted on a vehicle. However, the present invention is not limited to a vehicle, and may be applied to a cooling device or a heating device that cools or heats blown air using a Peltier element 52. good.

It is a top view which shows the external appearance shape of the thermoelectric conversion apparatus in 1st Embodiment of this invention. It is AA sectional drawing shown in FIG. It is CC sectional drawing shown in FIG. It is BB sectional drawing shown in FIG. It is a characteristic view which shows the relationship between the applied voltage per thermoelectric element pair, and a heat absorption capability ratio. It is a characteristic view which shows the relationship between the applied voltage per thermoelectric element pair, and a coefficient of performance COP. It is a characteristic view which shows the relationship between the applied voltage per thermoelectric element pair and the number of element pairs. It is a characteristic view which shows the relationship between the applied voltage per thermoelectric element pair, and the maximum permissible dimension of an element. It is a top view which shows the external appearance shape of the thermoelectric element board | substrate 10 in the modification of 1st Embodiment of this invention. It is a characteristic view which shows the relationship between the element shape index | exponent, heat absorption capability ratio, and coefficient of performance COP in 2nd Embodiment of this invention. It is a perspective view explaining the element shape of the thermoelectric elements 12 and 13. FIG. It is a schematic diagram which shows the external shape of the heat sink side fin board | substrate 20 in the 3rd Embodiment of this invention, and the heat radiation side fin board | substrate 30. FIG. It is a schematic diagram which shows the shape of the thermoelectric element board | substrate 10 in 4th Embodiment of this invention. It is a block diagram which shows the electrical wiring of the thermoelectric element board | substrate 10 in 5th Embodiment of this invention.

Explanation of symbols

2 ... DC-DC converter (voltage adjusting means)
10 ... Thermoelectric element substrate (thermoelectric element module)
DESCRIPTION OF SYMBOLS 12 ... P-type thermoelectric element, thermoelectric element 13 ... N-type thermoelectric element, thermoelectric element 22 ... Endothermic heat exchange member 32 ... Endothermic heat exchange member

Claims (11)

  1. A plurality of pairs of P-type and N-type thermoelectric elements (12, 13) are arranged, and one thermoelectric module (10) to which these thermoelectric elements (12, 13) are electrically connected is arranged. A thermoelectric conversion device comprising a plurality of power supply voltages directly applied to one or a plurality of the thermoelectric element modules (10),
    The thermoelectric element module (10) has an applied voltage applied to the pair of thermoelectric elements (12, 13) of 0.04 V or more and less than 0.08 V when the output of the power supply voltage is used under rated conditions. A thermoelectric conversion device formed so as to become.
  2. A plurality of pairs of P-type and N-type thermoelectric elements (12, 13) are arranged, and one thermoelectric module (10) to which these thermoelectric elements (12, 13) are electrically connected is arranged. A thermoelectric conversion device comprising a plurality of voltage adjustment means (2) for adjusting a power supply voltage to a predetermined voltage, and applying to one or a plurality of the thermoelectric element modules (10) via the voltage adjustment means (2). There,
    The thermoelectric module (10) has an applied voltage of 0.04 V or more applied to the pair of thermoelectric elements (12, 13) when the output voltage of the voltage adjusting means (2) is used under rated conditions. A thermoelectric conversion device formed to be less than 0.08V.
  3.   The thermoelectric element module (10) is formed such that an applied voltage applied to the pair of thermoelectric elements (12, 13) is more preferably 0.04V or more and less than 0.07V. Item 3. The thermoelectric conversion device according to item 1 or 2.
  4.   The thermoelectric element module (10) is formed so that an applied voltage applied to the pair of thermoelectric elements (12, 13) is most preferably 0.04V or more and less than 0.05V. Item 3. The thermoelectric conversion device according to item 1 or 2.
  5. A plurality of pairs of P-type and N-type thermoelectric elements (12, 13) are arranged, and one thermoelectric module (10) to which these thermoelectric elements (12, 13) are electrically connected is arranged. A thermoelectric conversion device comprising a plurality of power supply voltages directly applied to one or a plurality of the thermoelectric element modules (10),
    The thermoelectric element module (10) includes a thermoelectric element (12, 13) having a cross-sectional area (a × b) perpendicular to a flow direction of a current flowing through the thermoelectric element (12, 13), the thermoelectric element ( 12. A thermoelectric conversion device formed so that an element shape index (a × b / h) which is a ratio to a height (h) of 12, 13) is 1.5 or more and less than 2.5 .
  6. A plurality of pairs of P-type and N-type thermoelectric elements (12, 13) are arranged, and one thermoelectric module (10) to which these thermoelectric elements (12, 13) are electrically connected is arranged. A thermoelectric conversion device comprising a plurality of voltage adjustment means (2) for adjusting a power supply voltage to a predetermined voltage, and applying to one or a plurality of the thermoelectric element modules (10) via the voltage adjustment means (2). There,
    The thermoelectric element module (10) includes a thermoelectric element (12, 13) having a cross-sectional area (a × b) perpendicular to a flow direction of a current flowing through the thermoelectric element (12, 13), the thermoelectric element ( 12. A thermoelectric conversion device formed so that an element shape index (a × b / h) which is a ratio to a height (h) of 12, 13) is 1.5 or more and less than 2.5 .
  7.   The thermoelectric element module (10) is formed such that the element shape index (a × b / h) is more preferably 2.0 or more and less than 2.5 for the thermoelectric element (12, 13). The thermoelectric conversion device according to claim 5 or 6, characterized in that.
  8.   The thermoelectric element module (10) has an applied voltage applied to the pair of thermoelectric elements (12, 13) of 0.04 V or more and less than 0.08 V when the output of the power supply voltage is used under rated conditions. The thermoelectric conversion device according to claim 5 or 7, wherein the thermoelectric conversion device is formed as described above.
  9.   The thermoelectric module (10) has an applied voltage of 0.04 V or more applied to the pair of thermoelectric elements (12, 13) when the output voltage of the voltage adjusting means (2) is used under rated conditions. The thermoelectric conversion device according to claim 6 or 7, wherein the thermoelectric conversion device is formed to be less than 0.08V.
  10. A plurality of endothermic heat exchange members disposed on one surface of the thermoelectric element module (10) with an insulating space (L1, L2) therebetween and connected to the pair of thermoelectric elements (12, 13) so as to conduct heat. (22)
    A plurality of heat-dissipating heat exchange members disposed on the other surface of the thermoelectric element module (10) with an insulating space (L1, L2) therebetween and connected to the pair of thermoelectric elements (12, 13) so as to conduct heat. (32), and is configured such that a heat exchange medium flows through each of the plurality of endothermic heat exchange members (22) and the plurality of heat dissipation heat exchange members (32).
    The plurality of endothermic heat exchange members (22) and the plurality of radiant heat exchange members (32) are more in the flow direction of the heat exchange medium than the insulating space (L2) formed along the flow direction of the heat exchange medium. The thermoelectric conversion device according to any one of claims 1 to 9, wherein the insulating space (L1) formed in a direction orthogonal to the direction is formed to be larger.
  11.   The thermoelectric element module (10) is arranged so that the pair of thermoelectric elements (12, 13) are electrically connected in series in the depth direction along the flow direction of the heat exchange medium, and heat exchange is performed. The width dimension (W1) perpendicular to the flow direction of the heat exchange medium is formed to be larger than the depth dimension (W2) along the flow direction of the medium. The thermoelectric conversion device according to 1.
JP2006092368A 2005-07-04 2006-03-29 Thermoelectric conversion device Pending JP2007043075A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005195534 2005-07-04
JP2006092368A JP2007043075A (en) 2005-07-04 2006-03-29 Thermoelectric conversion device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006092368A JP2007043075A (en) 2005-07-04 2006-03-29 Thermoelectric conversion device

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JP2007043075A true JP2007043075A (en) 2007-02-15

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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010223497A (en) * 2009-03-24 2010-10-07 Nitto Electric Works Ltd Peltier type cooling unit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08242022A (en) * 1995-03-02 1996-09-17 Saamobonitsuku:Kk Thermoelectricity converting device
JP2002329897A (en) * 2001-05-01 2002-11-15 Eco Twenty One:Kk Thermoelectric conversion element and optical communication module using the same
JP2004071969A (en) * 2002-08-08 2004-03-04 Okano Electric Wire Co Ltd Thermoelectric cooling apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08242022A (en) * 1995-03-02 1996-09-17 Saamobonitsuku:Kk Thermoelectricity converting device
JP2002329897A (en) * 2001-05-01 2002-11-15 Eco Twenty One:Kk Thermoelectric conversion element and optical communication module using the same
JP2004071969A (en) * 2002-08-08 2004-03-04 Okano Electric Wire Co Ltd Thermoelectric cooling apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010223497A (en) * 2009-03-24 2010-10-07 Nitto Electric Works Ltd Peltier type cooling unit

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