JP2007026964A - Board module connection socket - Google Patents

Board module connection socket Download PDF

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Publication number
JP2007026964A
JP2007026964A JP2005209277A JP2005209277A JP2007026964A JP 2007026964 A JP2007026964 A JP 2007026964A JP 2005209277 A JP2005209277 A JP 2005209277A JP 2005209277 A JP2005209277 A JP 2005209277A JP 2007026964 A JP2007026964 A JP 2007026964A
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contact
portion
board
dimm
substrate module
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JP2005209277A
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Japanese (ja)
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Yuji Miura
Tomohiko Shiki
勇二 三浦
智彦 鋪
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Ricoh Co Ltd
株式会社リコー
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Priority to JP2005209277A priority Critical patent/JP2007026964A/en
Publication of JP2007026964A publication Critical patent/JP2007026964A/en
Application status is Pending legal-status Critical

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Abstract

<P>PROBLEM TO BE SOLVED: To improve ease in handling by reducing contact pressure in inserting a DIMM board, to reduce possibility of catching a foreign substance between contacts by preventing production of the foreign substance by collision of the DIMM board with the contacts in insertion thereof, and to prevent a contact failure due to the foreign substance by increasing the contact pressure in contact parts of the contacts. <P>SOLUTION: This board module connection socket 1 is used for connecting/disconnecting a board module 2 to/from a mother board by insertion/extraction of the board module 2. Lock parts 11-2 formed at tip parts of a pair of contacts 11 extending downward along the inside wall thereof so as to be directed inward and contacting a tip surface of the board module are formed; and circular-arc parts 11-1 electrically connected to the board module 2 are formed above them. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、DIMMメモリ等、基板モジュールをマザー基板に接続する基板モジュール接続ソケットに関する。 The present invention, DIMM memory, relates to a substrate module connection socket for connecting a substrate module to the motherboard.

図5ないし図7に基いて従来例の基板モジュール接続ソケットを説明する。 Explaining a substrate module connection socket in the prior art on the basis of FIGS. 5-7. 図5はDIMM基板挿入前の従来例に係るDIMMソケットの構成図、図6はDIMM基板挿入途中の従来例に係るDIMMソケットの構成図、図7はDIMM基板挿入途完了時の従来例に係るDIMMソケットの構成図である。 5 according to the conventional example when DIMM board insertion configuration diagram of a DIMM socket according to the previous prior art, FIG. 6 is a configuration diagram of a DIMM socket according to the conventional example in the middle DIMM board insertion, FIG. 7 DIMM board insertion developing complete it is a block diagram of a DIMM socket.
DIMMソケット(基板モジュール接続ソケット)1は、コンタクト11をモールド12内に有する。 DIMM sockets (substrate module connection socket) 1, has a contact 11 to the mold 12. コンタクト11はモールド12の内壁から内側に膨らむ可撓性の円弧状部11―1を有する。 Contact 11 has an arc-shaped portion 11-1 of the flexible bulging inwardly from the inner wall of the mold 12.
DIMM基板(基板モジュール)2はDIMM接栓部21を有しており、上方からモールド12の中空部に挿入され、図7に示すように、コンタクト11の円弧状部11―1と弾接するようになっている。 DIMM board (board module) 2 has a DIMM plug connector unit 21 is inserted from above into the hollow portion of the mold 12, as shown in FIG. 7, the arc-shaped portion 11-1 of the contacts 11 and bullet contact as It has become.
関連技術としては、特許文献1、2がある。 A related technique, there is Patent Documents 1 and 2.
特開平9−148009号公報 JP-9-148009 discloses 特開2000−299150公報 JP 2000-299150 Laid

近年、DIMMメモリに関しては、DIMMソケット1のコンタクト11の狭ピッチ化により、DIMM基板2とDIMMソケット1の接点P(図7)に存在する異物による接触不良の影響が無視できなくなってきている。 Recently, with regard DIMM memory, the pitch of the contacts 11 DIMM socket 1, the influence of poor contact is can not be ignored due to foreign matter present in the contact point P of the DIMM board 2 and DIMM socket 1 (Fig. 7).
接触不良を防ぐためには、コンタクト11の接触圧(円弧状部11―1の弾発力)を強くする必要があるが、接触圧を強くすると、DIMM基板2の挿入力(DIMM基板2を円弧状部11―1の弾発力に抗してモールド12内に押し込むための力)が大きくなり取り扱い性が悪くなると共に、挿入時にコンタクト11がDIMM基板2の先端角部22(図6)を削ることによりゴミが発生し、接触不良を発生させる要因となる。 To prevent contact failure, it is necessary to increase the contact pressure of the contact 11 (the elastic force of the arc-shaped portion 11-1), when strongly contact pressure, the insertion force of the DIMM board 2 (circles DIMM board 2 against the elastic force of the arc-shaped portion 11-1 with a force) becomes large and handling properties for pushing the mold 12 is deteriorated, the tip corner portion 22 of the contact 11 when inserted DIMM board 2 (FIG. 6) dust generated by cutting, and is a cause of generating a contact failure.
本発明は、DIMM基板の挿入時には接触圧を低くして取り扱い性を良くすると共に、挿入時のDIMM基板とコンタクトとの衝突による異物発生を抑制して、接点に異物が挟み込まれる可能性を低減し、かつコンタクトの接触部では接触圧を強くして、異物による接触不良を防ぐことを目的とする。 The present invention is reduced with the time of the DIMM board insertion better handling property and a low contact pressure, thereby suppressing the occurrence of foreign matters due to collision between the DIMM board and contacts during insertion, the possibility that foreign matter is sandwiched contacts and, and the contact portion of the contact with strong contact pressure, intended to prevent contact failure due to foreign matter.

上記目的を達成するために、請求項1記載の発明は、基板モジュールの挿入/抜去により、基板モジュールとマザー基板とを接続/切断する基板モジュール接続ソケットであって、上向きに延びる外側部分、及び該外側部分の上端部から内側下方へ反転した内側部分を備え、且つ該内側部分が内側へ湾曲して前記基板モジュールと電気的と接続される円弧状部を備えているコンタクトを備えたものにおいて、前記コンタクトの内側部分は、前記円弧状部の下方に基板モジュール先端面と当接する係止部を連設した構成を備えていることを特徴とする。 To achieve the above object, a first aspect of the present invention, the insertion / removal of the substrate module, a substrate module connection socket for connecting / disconnecting the substrate module and the mother substrate, an outer portion extending upwardly, and an inner portion which is inverted inwardly downwardly from the upper end of the outer portion, in and that the inner part is provided with a contact that includes an arcuate portion that is curved inward is connected electrically with the board module , the inner portion of the contact is characterized in that it comprises a structure that continuously provided a substrate module distal end surface abutting against locking portion below the arc-shaped portion.
請求項2の発明は、請求項1記載の基板モジュール接続ソケットにおいて、前記コンタクトのばね性は、前記基板モジュールの先端角部が前記円弧状部にこすれて削られない程度に弱く設定され、前記基板モジュールの先端面が前記係止部を下方へ押圧することで、基板モジュールと円弧状部との接点に適切な接触圧が生じるようになっていることを特徴とする。 A second aspect of the present invention, the substrate module connection socket according to claim 1 wherein the spring property of the contact is weak is set so that front end corner of the board module is not cut by rubbing the arcuate portion, wherein by the distal end surface of the substrate module presses the locking portion downwardly, characterized in that so appropriate contact pressure to the contact between the substrate module and the arc-shaped portion occurs.

本発明によれば、基板モジュールの挿入/抜去により、基板モジュールとマザー基板とを接続/切断する基板モジュール接続ソケットにおいて、内壁に沿って下方に延びる一対のコンタクトの先端部に内側に向くように形成され、基板モジュール先端面と当接する係止部を形成し、その上方に基板モジュールと電気的に接続される円弧状部を形成し、コンタクトのばね性は、基板モジュールの先端角部が円弧状部にこすれて削られない程度に弱く設定され、基板モジュールの先端面が係止部を押圧することで、基板モジュールと円弧状部との接点に適切な接触圧が生じるようになっているので、DIMM基板の挿入時には接触圧を低くして、取り扱い性を良くすると共に、挿入時のDIMM基板とコンタクトの衝突による異物発生を抑制して According to the present invention, the insertion / removal of the substrate module, the substrate module connection socket for connecting / disconnecting the substrate module and the mother board, so as to face inward on the tip portions of the pair of contacts extending downwardly along the inner wall is formed, to form a substrate module front end surface abutting the locking portion forms an arc-shaped portion connected board module and electrically thereabove, the spring of the contact, the tip angle of the substrate module circle weakly set so as not scraped by rubbing arcuate portion, that the distal end surface of the substrate module pushes the engaging portion, so that the appropriate contact pressure to the contact between the substrate module and the arc-shaped portion occurs since, at the time of the DIMM board insertion with a lower contact pressure, with better handling properties, by suppressing the generation of foreign particles by the collision of the DIMM board and contacts during insertion 接点に異物が挟み込む可能性を低減し、かつコンタクトの接触部では接触圧を強くして、異物による接触不良を防ぐことができる。 To reduce the possibility of sandwiching foreign matter to the contact, and the contact portion of the contact can be prevented defective contact by strong contact pressure, due to foreign matter.

以下、本発明の実施形態を図面に従って説明する。 Hereinafter, an embodiment of the present invention with reference to the drawings.
図1はDIMM基板挿入前の本発明の実施形態に係るDIMMソケットの構成図、図2はDIMM基板挿入途中の本発明の実施形態に係るDIMMソケットの構成図、図3はDIMM基板挿入途完了直前の本発明の実施形態に係るDIMMソケットの構成図、図4はDIMM基板挿入途完了時の本発明の実施形態に係るDIMMソケットの構成図である。 Figure 1 is a configuration diagram of a DIMM socket according to the embodiment of the DIMM board insertion prior to the present invention, FIG. 2 is a configuration diagram of a DIMM socket according to the embodiment of the DIMM board insertion midway of the present invention, FIG. 3 DIMM board insertion developing complete diagram of DIMM socket according to an embodiment of the present invention immediately before, FIG. 4 is a block diagram of a DIMM socket according to an embodiment of the present invention at the time of DIMM board insertion developing complete.
従来例と同一個所には同一符号を付し、重複する説明は省略する。 The same reference numerals are given to the conventional example in the same place, and duplicate explanations are omitted. 本実施形態では、2個のコンタクト11(導電性端子)11は、左右対称形状をなしている。 In this embodiment, two contacts 11 (conductive terminals) 11 is formed in a symmetrical shape. 各コンタクト11は、絶縁樹脂から成るモールド12の底部を貫通して内壁に沿って上方に延びてから、モールド内壁上部で内側に反転して下方へ延びる円弧状部11−1を有している。 Each contact 11 has a extends upward along the inner wall through the bottom of the mold 12 made of an insulating resin, the arcuate portion 11-1 extending downward inverted inwardly mold inner wall upper . 更に、円弧状部11−1の下部を下方(且つ外径方向)に向けて延長形成した下端には内側に向けたフック状の係止部11−2を有している。 Furthermore, the lower the lower (and radially outward) extending form the lower end toward the arcuate portion 11-1 has an engaging portion 11-2 hook-like towards the inside. なお、コンタクト11の弾性(ばね性)は従来例より弱いものとなっている。 The elastic contact 11 (springy) has a weaker than the conventional example.
つまり、コンタクト11は外側部分11Aと、内側部分B(11−1、11−2)と、から構成されている。 In other words, the contact 11 is composed of an outer part 11A, an inner portion B (11-1,11-2),.

DIMM基板2を図2に示すようにモールド12内に挿入すると、DIMM基板2の先端角部22がコンタクト11の円弧状部11−1に当接するが、コンタクト11のばね性が弱いために削られることはない。 Upon insertion of the DIMM board 2 into the mold 12 as shown in FIG. 2, although front end corner 22 of the DIMM board 2 abuts against the arcuate portion 11-1 of the contacts 11, cutting for the spring of the contact 11 is weak will not be used. DIMM基板2をモールド12内に押し込んでいくと、図3に示すように、DIMM基板2の先端面がコンタクト11の係止部11−2に突き当たる。 When the DIMM board 2 is pushed into the mold 12, as shown in FIG. 3, the distal end surface of the DIMM board 2 abuts against the engaging portion 11-2 of the contacts 11.
DIMM基板挿入途完了時には図4に示すように、DIMM基板2の先端面はF1の力で係止部11−2を下方に押すことになる。 During DIMM board insertion APPLICATIONS completed as shown in FIG 4, the distal end surface of the DIMM board 2 will be pressing the locking portion 11-2 downward with a force of F1. するとコンタクト11の円弧状部11−1には内側に向くF2の作用力が生じ、これにより、コンタクト11(の円弧状部11−1)とDIMM基板2(のDIMM接栓部21)との接点Pには最適な接触圧が得られることになる。 Then the arc-shaped portion 11-1 of the contact 11 occurs acting force F2 directed inward, by which the contact 11 and the DIMM board 2 (the DIMM plug connector section 21) and (arcuate portion 11-1) so that the optimum contact pressure can be obtained in the contact P. つまり、図3の状態では、円弧状部11−1と基板側の電極21との接触圧は円弧状部自体の弾発力のみに依存しているが、基板先端面が係止部11−2を下方へ押圧することによってコンタクト11の内側部分11B(11−1、11−2)が全体として下方へ引き込まれ、その際に円弧状部11−1が内径側に付勢されることとなる。 That is, in the state of FIG. 3, but the contact pressure between the arcuate portion 11-1 and the substrate-side electrode 21 is dependent only on the elastic force of the arc-shaped portion itself, the substrate tip surface engagement portion 11 2 drawn by pressing downwardly downwardly as a whole inner portion 11B (11 - 1 and 11 - 2) of contacts 11, and the arc-shaped portion 11-1 is urged radially inward when the Become.

つまり、本発明は、基板モジュール2の挿入/抜去により、基板モジュールとマザー基板とを接続/切断する基板モジュール接続ソケット1であって、上向きに延びる外側部分11A、及び該外側部分11Aの上端部から内側下方へ反転した内側部分11Bを備え、且つ該内側部分11Bが内側へ湾曲して基板モジュールと電気的と接続される円弧状部11−1を備えているコンタクト11を備えたものにおいて、コンタクト11の内側部分11Bは、円弧状部の下方に基板モジュール先端面と当接する係止部11−2を連設した構成を備えている構成が特徴的である。 That is, the present invention is the insertion / removal of the substrate module 2, a substrate module connection socket 1 for connecting / disconnecting the substrate module and the mother substrate, upwardly extending outer portion 11A, and the upper end of the outer portion 11A in those from an inner portion 11B obtained by inverting the inwardly downwards, with a contact 11 which has an arcuate portion 11-1 to be connected to the board module and electrically with and curved inner portion 11B is inward, inner portion of the contact 11 11B is configured to have a structure that continuously provided a substrate module front end surface and the locking portion 11-2 abuts below the arcuate portion is characteristic.
また、本発明は、コンタクト11のばね性は、基板モジュールの先端角部22が円弧状部にこすれて削られない程度に弱く設定され、基板モジュールの先端面が係止部11−2を下方へ押圧することで、基板モジュールと円弧状部11−1との接点に適切な接触圧が生じるようになっている。 Further, the present invention, the spring of the contact 11, the tip corner portion 22 of the board module is weakly set so as not scraped by rubbing in a circular arc shape portion, the lower tip surface is an engagement portion 11-2 of the substrate module by pressing the, so that the appropriate contact pressure to the contact between the substrate module and the arc-shaped portion 11-1 is generated.
このように基板2の先端面が係止部11−2を下方へ向けて押圧することで、基板側面の電極21と円弧状部11−1との接点Pに適切な接触圧が生じるようになっているので、DIMM基板の挿入時には接触圧を低くして取り扱い性を良くすると共に、挿入時のDIMM基板とコンタクトの衝突による異物発生を抑制して、接点に異物が挟み込む可能性を低減し、かつコンタクトの接触部では接触圧を強くして、異物による接触不良を防ぐことができる。 In this manner, the distal end surface of the substrate 2 is pressed toward the locking portion 11-2 downward, as appropriate contact pressure to the contact P between the electrode 21 and the arc-shaped portion 11-1 of the substrate side occurs since going on, at the time of the DIMM board inserted with better handling properties and low contact pressure, thereby suppressing the occurrence of foreign matters due to the collision of the DIMM board and contacts during insertion, reducing the possibility of sandwiching foreign matter to the contact and the contact portion of the contact can be prevented defective contact by strong contact pressure, due to foreign matter.

DIMM基板挿入前の本発明の実施形態に係るDIMMソケットの構成図である。 It is a block diagram of a DIMM socket according to the embodiment of the DIMM board insertion prior to the present invention. DIMM基板挿入途中の本発明の実施形態に係るDIMMソケットの構成図である。 It is a block diagram of a DIMM socket according to the embodiment of the DIMM board insertion midway of the present invention. DIMM基板挿入途完了直前の本発明の実施形態に係るDIMMソケットの構成図である。 It is a block diagram of a DIMM socket according to an embodiment of the present invention the DIMM board insertion Applications immediately before the completion. DIMM基板挿入途完了時の本発明の実施形態に係るDIMMソケットの構成図である。 It is a block diagram of a DIMM socket according to an embodiment of the present invention at the time of DIMM board insertion developing complete. DIMM基板挿入前の従来例に係るDIMMソケットの構成図である。 It is a block diagram of a DIMM socket according to a conventional example of a prior DIMM board insertion. DIMM基板挿入途中の従来例に係るDIMMソケットの構成図である。 It is a block diagram of a DIMM socket according to the conventional example in the middle DIMM board insertion. DIMM基板挿入途完了時の従来例に係るDIMMソケットの構成図である。 It is a block diagram of a DIMM socket according to the conventional example when DIMM board insertion developing complete.

符号の説明 DESCRIPTION OF SYMBOLS

1 DIMMソケット(基板モジュール接続ソケット) 1 DIMM socket (board module connection socket)
11 コンタクト11−1 円弧状部11―2 係止部12 モールド 2 DIMM基板(基板モジュール) 11 contacts 11-1 arcuate portion 11-2 engaging portion 12 molded 2 DIMM board (board module)
21 DIMM接栓部 21 DIMM plug connector part

Claims (2)

  1. 基板モジュールの挿入/抜去により、基板モジュールとマザー基板とを接続/切断する基板モジュール接続ソケットであって、上向きに延びる外側部分、及び該外側部分の上端部から内側下方へ反転した内側部分を備え、且つ該内側部分が内側へ湾曲して前記基板モジュールと電気的と接続される円弧状部を備えているコンタクトを備えたものにおいて、 The insertion / removal of the substrate module comprises a substrate module connection socket for connecting / disconnecting the substrate module and the mother substrate, an outer portion extending upwardly, and an inner portion which is reversed from the upper end to the inner lower outer portion in and which inner part is provided with a contact that includes an arcuate portion that is curved inward is connected electrically with the board module,
    前記コンタクトの内側部分は、前記円弧状部の下方に基板モジュール先端面と当接する係止部を連設した構成を備えていることを特徴とする基板モジュール接続ソケット。 Inner portion of said contact, the substrate module connection socket, characterized in that it comprises a structure in which consecutively provided a substrate module distal end surface abutting against locking portion below the arc-shaped portion.
  2. 請求項1記載の基板モジュール接続ソケットにおいて、前記コンタクトのばね性は、前記基板モジュールの先端角部が前記円弧状部にこすれて削られない程度に弱く設定され、前記基板モジュールの先端面が前記係止部を下方へ押圧することで、基板モジュールと円弧状部との接点に適切な接触圧が生じるようになっていることを特徴とする基板モジュール接続ソケット。 In the substrate module connection socket according to claim 1 wherein the spring property of the contact, the front end corner of the board module is weak is set so as not scraped by rubbing the arcuate portion, the distal end surface of the substrate module the by pressing the locking portion downwardly, the substrate module connection socket, characterized by being adapted to the appropriate contact pressure to the contact between the substrate module and the arc-shaped portion occurs.
JP2005209277A 2005-07-19 2005-07-19 Board module connection socket Pending JP2007026964A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011032881A1 (en) * 2009-09-21 2011-03-24 International Business Machines Corporation Delayed contact action connector
US10206283B1 (en) 2017-09-15 2019-02-12 Shinko Electric Industries Co., Ltd. Electronic device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51148654A (en) * 1975-06-17 1976-12-21 Nippon Shinpu Kk Method of manufacturing narrow wire of lead or lead alloy
JPH1041028A (en) * 1996-04-17 1998-02-13 Molex Inc Circuit card using flat flexible circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51148654A (en) * 1975-06-17 1976-12-21 Nippon Shinpu Kk Method of manufacturing narrow wire of lead or lead alloy
JPH1041028A (en) * 1996-04-17 1998-02-13 Molex Inc Circuit card using flat flexible circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011032881A1 (en) * 2009-09-21 2011-03-24 International Business Machines Corporation Delayed contact action connector
US8282420B2 (en) 2009-09-21 2012-10-09 International Business Machines Corporation Delayed contact action connector
US10206283B1 (en) 2017-09-15 2019-02-12 Shinko Electric Industries Co., Ltd. Electronic device

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