JP2006345233A - 撮像装置及びデジタルカメラ - Google Patents
撮像装置及びデジタルカメラ Download PDFInfo
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- JP2006345233A JP2006345233A JP2005169077A JP2005169077A JP2006345233A JP 2006345233 A JP2006345233 A JP 2006345233A JP 2005169077 A JP2005169077 A JP 2005169077A JP 2005169077 A JP2005169077 A JP 2005169077A JP 2006345233 A JP2006345233 A JP 2006345233A
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- 238000003384 imaging method Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims description 5
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- 239000000758 substrate Substances 0.000 description 6
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 5
- 229910002113 barium titanate Inorganic materials 0.000 description 5
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- 230000035945 sensitivity Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
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- 230000001681 protective effect Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
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- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/12—Fluid-filled or evacuated lenses
- G02B3/14—Fluid-filled or evacuated lenses of variable focal length
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0018—Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Signal Processing (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Multimedia (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
【解決手段】 撮像装置2は、イメージセンサチップ3と、これを収納するパッケージ4と、パッケージ4の通気孔32に取り付けられたエアーポンプ5とから構成されている。イメージセンサチップ3の受光部9には、フォトダイオードの上部にマイクロレンズが設けられており、このマイクロレンズはゲル状の透明な材質で形成されている。エアーポンプ5によってパッケージ4内の気圧を変化させると、マイクロレンズが気圧に応じて変形して曲率が変化する。
【選択図】 図1
Description
3 イメージセンサチップ
4 パッケージ
5 エアーポンプ
9 受光部
13 フォトダイオード
19 マイクロレンズ
32 通気孔
40 デジタルカメラ
Claims (4)
- 受光面にゲル状の材質でマイクロレンズが形成されたイメージセンサチップと、
このイメージセンサチップが収納され、該イメージセンサの収納後に行なわれる気圧調節によって内部気圧が変化されるパッケージとを備えたことを特徴とする撮像装置。 - 前記パッケージに形成された通気孔に取り付けられ、パッケージ内の気圧を変化させる気圧調節手段を設けたことを特徴とする請求項1記載の撮像装置。
- 前記パッケージは、イメージセンサチップが収納されるパッケージ本体と、このパッケージ本体を封止するリッドとからなり、前記通気孔は、パッケージ本体に設けられていることを特徴とする請求項2記載の撮像装置。
- 請求項1ないし3いずれか記載の撮像装置を組み込んだことを特徴とするデジタルカメラ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005169077A JP2006345233A (ja) | 2005-06-09 | 2005-06-09 | 撮像装置及びデジタルカメラ |
US11/448,676 US20060279648A1 (en) | 2005-06-09 | 2006-06-08 | Imaging device and digital camera |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005169077A JP2006345233A (ja) | 2005-06-09 | 2005-06-09 | 撮像装置及びデジタルカメラ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006345233A true JP2006345233A (ja) | 2006-12-21 |
Family
ID=37523761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005169077A Pending JP2006345233A (ja) | 2005-06-09 | 2005-06-09 | 撮像装置及びデジタルカメラ |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060279648A1 (ja) |
JP (1) | JP2006345233A (ja) |
Cited By (1)
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---|---|---|---|---|
JP2012138386A (ja) * | 2010-12-24 | 2012-07-19 | Nikon Corp | 撮像素子モジュール、撮像装置およびマイクロレンズモジュール |
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US20090186304A1 (en) * | 2008-01-22 | 2009-07-23 | Micron Technology, Inc. | Gravity and pressure enhanced reflow process to form lens structures |
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2005
- 2005-06-09 JP JP2005169077A patent/JP2006345233A/ja active Pending
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2006
- 2006-06-08 US US11/448,676 patent/US20060279648A1/en not_active Abandoned
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JP2004311666A (ja) * | 2003-04-04 | 2004-11-04 | Kyocera Corp | 固体撮像素子 |
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JP2012138386A (ja) * | 2010-12-24 | 2012-07-19 | Nikon Corp | 撮像素子モジュール、撮像装置およびマイクロレンズモジュール |
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