JP2006341557A - Inkjet recording head and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To weld and join two members forming an ink flow passage by laser light irradiation, while securing ink sealability. <P>SOLUTION: A flow passage forming member H1600 is formed of a laser light transmitting resin material, while a tank holder H1500 is formed of a non laser light transmitting resin material. The flow passage forming member H1600 has a taper-shaped section H1610 hindering advancing of laser light, above a joining surface H1508, and in its vicinity, a laser light refraction surface H1620 is formed which refracts laser light and makes it reach an area overlapping with the taper-shaped section H1610 in the joining surface H1508. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an ink jet recording head that performs recording by discharging a liquid such as ink, a manufacturing method thereof, an ink jet recording apparatus having the ink jet recording head, and a plastic member joining method.

  Japanese Patent Application Laid-Open No. 2004-133867 discloses a conventional technique using laser light when joining plastic members. In this method, when a plastic member and a plastic member are overlapped and joined together, one of the plastic members is made transparent to laser light and the other is absorbed to laser light. Shall. Then, after the plastic members are overlapped, the laser light is irradiated from the direction of the plastic member having transparency to the laser light. The irradiated laser light is transmitted through a plastic member that is transparent to the laser light and is absorbed by the plastic member that is absorbent to the laser light, whereby the plastic member is first dissolved. Next, the heat accompanying the melting is transmitted to the surface of the plastic member that transmits the laser beam, and as a result, the plastic member is also melted. In this way, the plastic member that absorbs the laser light and the plastic member that transmits the laser light are melted at the contact portion, and entangled with each other to be joined.

Such a joining method is used for assembling members that form ink flow paths in an ink jet recording head. This method is a reasonable method as a means for reliably forming an air-tight ink flow path at a low cost and in a short time.
Japanese Examined Patent Publication No. 62-49850

  However, the above-described conventional joining method causes difficulty when it is necessary to provide a member that transmits laser light with an inclined surface or a thick portion, or to join or embed a member that shields laser light. . That is, if the member that transmits laser light has an inclined surface, the laser light is reflected or refracted when the laser beam is incident on the inclined surface, so that the laser light can reach directly under the inclined surface. Therefore, it is not possible to perform welding and bonding at that portion. When there is a thick part, depending on the laser light transmittance and thickness of the member that transmits the laser light, the laser light that reaches the bonding surface located directly below the thick part is greatly attenuated, which is good. There are cases where welding cannot be performed. Even in the case where a member that shields laser light is disposed, the welding joint surface cannot be disposed immediately below the member. As described above, in the conventional technology, the configuration is restricted.

  In particular, in an ink jet recording head, when welding bonding is used to assemble a member that forms an ink flow path, ink sealing performance is impaired unless good bonding is performed on the entire area of the bonding surface over the entire circumference of the ink flow path. It will be defeated. For this reason, in some cases, it is necessary to perform good bonding over a relatively large and intricately extending region, and it is impossible to arrange an inclined surface, a thick portion, a laser light shielding member, etc. on the welded bonding region. Inconvenient.

  An object of the present invention is to transmit a laser beam in a joining method of a plastic member in which the difficulty in the prior art as described above is eliminated, and laser beam is transmitted through one member and irradiated to weld two members. Even in flat areas where members have inclined surfaces or thick parts, or where it is necessary to place a member that blocks laser light, it is possible to achieve good welding and easily ensure the ink sealability of the ink flow path in the inkjet recording head It is to make it possible.

  In order to achieve the above object, an ink jet recording head according to the present invention is a plastic in which an ink flow path is formed and ink is not permeable to laser light in an ink jet recording head for recording on a recording medium by discharging ink. The first member formed from the above and the second member formed from a plastic having an ink flow path and being permeable to laser light are communicated with each other so that the ink flow paths of both members communicate with each other. At least, the second member is welded and joined at a joining surface over a region surrounding the periphery of the communication portion of the ink flow path, and the second member refracts laser light that travels in a direction perpendicular to the joining surface, thereby at least the joining surface. It has a laser light refraction inclined surface that can be guided to a partial region.

  According to the present invention, when a laser beam is transmitted through one member and irradiated to weld two members, even if the member that transmits the laser beam has a portion that obstructs the progress of the laser beam, The laser beam can reach the joining surface portion that overlaps the portion, and good welding joining can be performed. As a result, an ink jet recording head having a structure in which two members forming the ink flow path are joined to each other while ensuring ink sealability can be provided by a simple and low-cost method using laser light.

  Embodiments of the present invention will be described below in detail with reference to the drawings.

Example 1
First, an inkjet recording apparatus equipped with an example inkjet recording head to which the present invention is applicable will be described with reference to a perspective view of FIG.

  This ink jet recording apparatus includes a lead screw 104 and a guide shaft 105 that are parallel to each other. A carriage 101 is attached by the lead screw 104 and the guide shaft 105 so as to be movable in a direction parallel to them. The carriage 101 is translated by rotating the lead screw 104 by a carriage motor (not shown). A recording head cartridge H1000 including a recording head H1001 (see FIG. 7 and the like) described later is detachably mounted on the carriage 101.

  Further, in this ink jet recording apparatus, a recording sheet 106 as a recording medium is conveyed toward a recording area by the recording head H1001, and a recording sheet 106 on which recording is performed by the recording head H1001 is discharged. A paper discharge roller 108 is provided. The paper feed roller 107 and the paper discharge roller 108 are rotationally driven by a motor (not shown). A paper pressing plate 109 is provided in the vicinity of the recording area, that is, in the vicinity of the movement trajectory surface of the ink ejection surface of the recording head H1001.

  In the recording operation, the ink ejected from the recording head H1001 adheres to the recording paper 106 conveyed to a position facing the ejection port surface of the recording head H1001, thereby forming a recording image on the surface of the recording paper 106. The At this time, the recording paper 106 is held parallel to the ejection port surface in the recording area by the paper pressing plate 109 so that the ink adheres to an appropriate position of the recording paper 106. In response to the formation of the recording image on the recording paper 106 by the ink jet head 102, the recording paper 106 is conveyed by the paper feed roller 107 and the paper discharge roller 108, whereby the recording image is transferred in the conveyance direction of the recording paper 106. Sequentially formed. The recording paper 106 for which recording has been completed is discharged out of the recording apparatus by a paper discharge roller 108.

  The recording head cartridge H1000 shown in FIGS. 7 to 13 that is mounted on the ink jet recording apparatus has a configuration to which a number of new technologies made in the formation stage of the present invention are applied. This will be described below.

(1) Description of recording head As can be seen from the perspective views of FIGS. 7 and 8, the recording head H1001 is a component that constitutes the recording head cartridge H1000 together with six removable ink tanks H1900. Each ink tank H1900 contains ink of each color of black, light cyan, light magenta, cyan, magenta, and yellow. As will be described in more detail below, the recording head H1001 performs recording using an electrothermal conversion element H1103 (FIG. 11) that generates thermal energy for generating film boiling in ink according to an electrical signal. The so-called bubble jet system (trademark) is used. In particular, the recording head H1001 has a so-called side shooter type configuration that ejects ink in a direction perpendicular to the formation surface of the electrothermal transducer H1103.

  As shown in the exploded perspective view of FIG. 9, the recording head H1001 includes a recording element unit H1002 and a tank holder unit H1550. Further, as shown in the exploded perspective view of FIG. 10, the recording element unit H1002 includes a recording element substrate H1100, a first plate H1200, an electric wiring substrate H1300, and a second plate H1400, and a tank. The holder unit H1003 includes a tank holder H1500, a flow path forming member H1600, a filter H1700, and a seal rubber H1800.

(1-1) Recording Element Unit FIG. 11 is a perspective view illustrating a recording element substrate H1100, which is a component of the recording element unit H1002, with a part thereof broken for explaining the configuration. The recording element substrate H1100 includes, for example, a Si substrate H1101 having a thickness of 0.5 to 1 mm, and is manufactured using a thin film formation technique.

  The Si substrate H1101 is formed with six rows of ink supply ports H1102 composed of long groove-like through holes that constitute the ink flow paths for the above-described six colors of ink. The ink supply port H1102 can be formed by anisotropic etching using the crystal orientation of the Si substrate H1101. For example, when the Si substrate H1101 has a crystal orientation of <100> on the wafer surface and <111> in the thickness direction, it is approximately 54.7 degrees by anisotropic etching of alkali (KOH, TMAH, humanradine, etc.). Etching proceeds at an angle, and a desired ink supply port H1102 can be formed by etching to a desired depth.

  On both sides of each ink supply port H1102, one row of electrothermal conversion elements H1103 is arranged in a zigzag shape as a whole, that is, the ejection ports in each row are not aligned with each other when viewed in a direction perpendicular to the arrangement direction. They are misaligned. These electrothermal conversion elements H1103 and electric wiring made of Al or the like for supplying electric power to these elements are formed by a film forming technique. One end of each electrical wiring is connected to an electrode portion H1104 for electrical connection with the outside. Each electrical contact portion of the electrode portion H1104 is provided with a bump H1105 such as Au.

  Further, on the Si substrate H1101, a plate shape in which an ink flow path wall H1106 for forming an ink flow path corresponding to the electrothermal conversion element H1103 and an ejection port H1100T facing each electrothermal conversion element H1103 are formed. A member having a portion is formed using, for example, a photolithography technique. In this manner, six rows of ejection port rows H1108 corresponding to six colors of ink are formed.

  The recording element substrate H1100 configured as described above has a function of generating air bubbles by the electrothermal conversion element H1103 in the ink supplied from the ink supply port H1102, and selectively discharging ink from each discharge port H1100T. .

As shown in FIG. 10, the first plate H1200 that supports the recording element substrate H1100 is made of an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 10 mm, for example. The material of the first plate H1200 is not limited to alumina. For example, silicon (Si), aluminum nitride (AlN), zirconia (ZrO ₂ ), silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC) , Molybdenum (Mo), or tungsten (W), having a linear expansion coefficient equivalent to that of the material of the recording element substrate H1100, and of the material of the recording element substrate H1100. It is preferable to use a material having a thermal conductivity equivalent to or higher than the thermal conductivity.

  In the first plate H1200, six ink supply ports H1201 for supplying the six colors of ink to the recording element substrate H1100 are formed. The recording element substrate H1100 is bonded and fixed to the first plate H1200 with high positional accuracy so that the six ink supply ports H1102 correspond to the six ink supply ports H1201 of the first plate H1200, respectively. The first adhesive used for this bonding is such that an air path does not occur between the adjacent ink supply ports H1201 in a region substantially corresponding to the shape of the bonding surface of the recording element substrate on the first plate H1200. To be applied. The first adhesive is desirably, for example, a material having a low viscosity, a thin adhesive layer formed on the joining surface, a relatively high hardness after joining, and ink resistance. Such a first adhesive can be, for example, a thermosetting adhesive mainly composed of an epoxy resin, and the thickness of the adhesive layer is desirably 50 μm or less.

  The second plate H1400 has a shape having an opening larger than the outer dimension of the recording element substrate H1100, and the second adhesion is performed around the recording element substrate H1100 that is bonded and fixed on the first plate H1200. It is adhered by an agent. As a result, the second plate H1400 forms a support surface of the electrical wiring substrate H1300, which is positioned substantially on the same plane as the electrode portion H1104 of the recording element substrate H1100.

The second plate H1400 is made of, for example, an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 1 mm. The material of the second plate H1400 is not limited to alumina, but has a linear expansion coefficient equivalent to that of the recording element substrate H1100 and the first plate H1200, and is equivalent or equivalent to their thermal conductivity. It is preferable to use a material having the above thermal conductivity. As the second adhesive, an adhesive having a low viscosity, a thin adhesive layer formed on the bonding surface, and ink resistance is preferable.

  The electrical wiring substrate H1300 is to form connection wiring for applying an electrical signal for ejecting ink to the recording element substrate H1100. As the electrical wiring board H1300, for example, a flexible wiring board having a two-layer structure is used, and the surface layer is covered with a resist film.

  The electrical wiring substrate H1300 is bonded and fixed on the second plate H1400 so that the opening H1302 formed on one end side corresponds to the recording element substrate H1100. At the same time, the first plate H1200 and the second plate The plate H1400 is bent along one side surface and bonded and fixed to these side surfaces. The third adhesive used for this adhesive fixing is, for example, a thermosetting adhesive film having a thickness of 10 to 100 μm mainly composed of an epoxy resin. The bent electric wiring board H1300 is further formed in accordance with the shape of the holder unit H1003.

  An external signal input terminal H1301 connected to the recording apparatus main body side is formed on the other end side of the electrical wiring board H1300. A reinforcing plate (not shown) is bonded to the back side of the external signal input terminal portion, and the flatness of the external signal input terminal H portion is ensured. As a material of this reinforcing plate, for example, a heat-resistant material such as a glass epoxy base material of 0.5 to 2 mm, aluminum is used.

  An electrode terminal (not shown) corresponding to the electrode portion H1104 of the recording element substrate H1100 is formed in the opening H1302 of the electric wiring substrate H1300, and the second plate H1400 is arranged for these electrical connections. By doing so, it is possible to perform almost in a plane. For example, the electric wiring substrate H1300 and the recording element substrate H1100 are obtained by applying a thermosetting adhesive resin between the electrode portions H1104 of the recording element substrate H1100 and the electrode terminals of the electric wiring substrate H1300, and then using the electrode portions H1104 and the electrode terminals as a heat tool. Electrical connection can be made by heating and pressurizing all together and curing the thermosetting adhesive resin. At this time, an anisotropic conductive adhesive containing conductive particles may be used as the thermosetting adhesive resin. For example, the electrode terminals H1104 and the electric wiring board H1300 are plated with gold at a temperature of 170 to 250 ° C. via an adhesive mainly composed of nickel conductive particles having a single particle diameter of 2 to 6 μm and epoxy resin. Thus, good electrical connection is possible via an anisotropic conductive adhesive film.

  The electrical connection portion between the recording element substrate H1100 and the electrical wiring substrate H1300 is sealed with a sealant, and is protected from corrosion by ink and external impact. As the sealant, a first sealant that mainly seals the outer peripheral portion of the recording element substrate H1100 and a second sealant that seals the edge of the opening H1302 of the electric wiring substrate H1300 are used. be able to.

(1-2) Tank Holder Unit The tank holder H1500 constituting the tank holder unit H1550 is formed by resin molding, for example. The tank holder H1500 holds the ink tank H1900 in a detachable manner. Although not shown in detail, for this purpose, the tank holder H1500 has holes for engaging the tank positioning pins and the engaging claws of the ink tank H1900, and a prism used for detecting the remaining ink amount. There is also an opening for. Further, a mounting guide for guiding the recording head cartridge H1000 to the mounting position of the carriage 101 of the ink jet recording apparatus main body, an engaging portion for mounting and fixing the carriage 101 to the carriage 101 by a head set lever, and a predetermined mounting position of the carriage 101 The tank holder H1500 can also be provided with an abutting portion for positioning to the tank holder H1500.

  A terminal fixing portion H1512 for positioning and fixing the portion of the external signal input terminal H1301 of the recording element unit H1002 is provided on the back surface of the tank holder H1500. A plurality of ribs are provided around the terminal fixing portion H1512 and its periphery, and the rigidity of the surface having the terminal fixing portion H1512 is increased. Between the portions where the respective ink tanks H1900 are mounted, intercolor ribs H1514 (FIG. 8) are provided to prevent color mixing of the respective colors. In addition, a cue portion H1513 is provided on the opposite side surface of the tank holder H1500 to improve the handleability of the recording head H1001.

  As shown in FIG. 13, the tank holder H1500 is provided with a joint portion H1517 connected to the ink supply port H1907 of each ink tank H1900. A filter H1700 for preventing foreign matters such as dust from entering the recording element substrate H1100 is joined to the joint portion H1517 by heat welding. Further, in order to prevent ink from evaporating from the joint portion H1517, A seal rubber H1800 is attached.

  The tank holder unit H1550 is configured by joining a flow path forming member H1600 to the tank holder H1500 by a method described later. As shown in FIG. 13 and the like, ink flow paths H1501 and H1606 are formed in the tank holder H1500 and the flow path forming member H1600, respectively. A continuous ink flow path for guiding ink is formed.

(1-3) Coupling of Recording Head Unit and Tank Holder Unit As shown by the arrow in FIG. 9, the recording head H1001 is completed by coupling the recording head unit H1002 to the tank holder unit H1003. In this connection, the fourth adhesive is applied to the ink supply port, and the ink supply port of the recording element unit H1002 (ink supply port H1201 of the first plate H1200) and the ink supply port (flow) of the tank holder unit H1003. The first plate H1200 and the flow path forming member H1600 are bonded and fixed so that the ink supply port H1605) of the path forming member H1600 communicates. In addition to the ink supply port portion, several portions where the recording element unit H1002 and the tank holder unit H1003 are in contact are bonded and fixed with the fifth adhesive.

  Desirably, the fourth and fifth adhesives are ink-resistant, hardened at room temperature, and flexible enough to withstand the difference in linear expansion between different materials. A curable silicone adhesive can be used. The fourth adhesive and the fifth adhesive may be the same adhesive. Further, when the recording element unit H1002 is bonded to the tank holder unit H1003 with the fourth and fifth adhesives, it is desirable to use a sixth adhesive that can fix both of them in a short time. As the sixth adhesive, for example, an ultraviolet curable adhesive can be used, but other adhesives may be used.

  Although not shown in detail, the external signal input terminal portion of the recording element unit H1002 is positioned and fixed to the terminal fixing portion H1512 of the tank holder H1500 by the terminal positioning pins (2 places) and the terminal positioning holes (2 places). Yes. For example, the terminal coupling pin provided in the tank holder H1500 and the terminal coupling hole provided in the periphery of the external signal input terminal H1301 of the electric wiring board H1300 are fitted together and the terminal coupling pin is thermally welded. However, other fixing means may be used.

(2) Description of the printhead cartridge The printhead cartridge H1000 is configured by mounting six ink tanks H1900 on the printhead H1001 as indicated by the arrows in FIG. These ink tanks H1900 are detachable from the recording head H1001 independently. Accordingly, each ink tank H1900 can be replaced separately, thereby reducing the running cost of printing in the ink jet recording apparatus. When each ink tank H1900 is attached, as described above, the ink supply port H1907 of the ink tank H1900 and the joint portion H1517 of the recording head H1001 are connected, and the ink of each color in each ink tank H1901 is supplied to the recording head H1001. Is done.

  As described above, the recording head cartridge H1000 is fixedly supported and electrically connected to the carriage 101 provided in the ink jet recording apparatus main body by positioning means and electrical contacts. A signal for selectively ejecting ink and a driving voltage of the electrothermal transducer H1103 are input to the mounted recording head cartridge H1000 from the recording apparatus side via an external signal input terminal H1301. Accordingly, ink is ejected toward the recording paper 106 through the ejection ports H1107 from the foaming chamber in which the electrothermal conversion elements H1103 of the recording element substrate H1100 are arranged.

  When ink in the foaming chamber is consumed in this way, ink corresponding to the ink is supplied from the ink tank H1900 into the recording head H1001 through the ink supply port H1907 and the joint portion H1517. The ink supplied into the recording head H1001 is supplied to the ink supply port H1102 of the recording element substrate H1100 through the ink flow path in the tank holder unit H1550 and the ink supply port H1201 of the first plate H1200. The ink supplied into the recording element substrate H1100 refills the foaming chamber from which the ink has been discharged.

(Bonding of tank holder and flow path forming member)
Next, a method for welding and joining a tank holder H1500 made of a plastic material and a flow path forming member H1600 in the recording head H1001 as described above, which is an important feature of the present invention, is illustrated in FIG. 1 to 5 will be described. These figures show examples of recording heads for inks of four colors of black, yellow, magenta, and cyan (the symbols for the portions for each color are b, y, m, and c at the end. However, for the sake of convenience, the same parts as those of the recording head H1100 described above are denoted by the same reference numerals. In this embodiment, the tank holder H1500 is formed of a plastic that absorbs laser light, and the flow path forming member H1600 is formed of a plastic that transmits laser light.

  2A to 4 are diagrams showing a joining procedure, FIGS. 2A and 2B are perspective views, FIGS. 3A to C are sectional views, and FIG. 4 is a partially enlarged view of FIG. In joining, first, as shown by the arrows in FIGS. 2A, 3A, and 4A, the flow path forming member H1600 is mounted at a predetermined position of the tank holder H1500, and FIGS. 2B, 3B, and 4 are used. As shown in (b), the flow path forming member H1600 is pressed to bring the joint surface H1508 into close contact. At this time, as shown in the enlarged view of FIG. 4, a convex portion H1507 is formed around the portion of the ink flow path H1501 of the tank holder H1500 extending in a predetermined plane pattern on the mating surface of both members. The convex portion H1507 is a joint surface H1508 of both members.

  In this state where the bonding surface H1508 is in close contact, the bonding surface H1508 is irradiated with laser light by a laser beam irradiation device as shown in FIGS. 3B and 4B. The laser beam irradiation apparatus has an XY robot 21 that moves an irradiation lens 20 through which laser light from a laser light source 10 is guided through a laser fiber 1 in a plane. By moving the irradiation lens 20 by the XY robot 21 while irradiating the laser light, it is possible to irradiate the region of the predetermined plane pattern with the laser light.

  FIG. 5A shows the scan locus of the laser beam in this embodiment. The scan trajectory basically corresponds to the plane pattern of the joint surface H1508 between the flow path forming member H1600 and the tank holder H1500 shown in FIG. 5B, but in FIG. In the portion shown, it is slightly shifted from the joint surface H1508.

  In this embodiment, the black ink supply port H1605 of the flow path forming member H1600 is formed with two tapered portions H1610 for flowing ink smoothly and efficiently as shown in detail in FIG. ing. One of these tapered portions H1610 is located immediately above the joint surface H1508. The portion B in the scan locus described above avoids the tapered portion H1610 and passes through a laser beam refraction inclined surface H1620 described later in more detail. As a result, in this embodiment, good welding and bonding can be performed in the entire region of the bonding surface H1508.

  Prior to describing this point, a comparative example of this embodiment will be described with reference to FIGS. In these drawings, the same parts as those in the present embodiment are denoted by the same reference numerals for the sake of convenience.

  As shown in FIG. 16, in this comparative example, the laser light refraction inclined surface H1620 is not provided. And as shown in FIG. 17, the scan locus | trajectory of a laser beam respond | corresponds simply to the plane pattern of the joint surface H1508.

  In this case, the laser beam incident on the bonding surface H1508 toward the region overlapping the tapered portion H1610 enters the tapered portion H1610 as shown in FIG. 16B. Thus, the laser beam incident on the tapered portion H1610 is reflected on the inclined surface existing for the tapered portion H1610, or is refracted as shown in FIG. Can not be reached. For this reason, in this comparative example, the region of the joint surface H1508, which is indicated by the symbol C in FIG. 17B, that overlaps the tapered portion H1610 remains as a poorly welded portion. When such a poorly welded portion occurs, the sealing performance of the ink flow path is impaired.

  On the other hand, in this embodiment, as shown in FIG. 1, the laser beam refracting slope is formed at a predetermined portion outside the tapered portion H1610 that obstructs the laser beam irradiation as described above in the ink supply port H1605b. A surface H1620 is formed. As shown in FIG. 1B, the laser light refracting inclined surface H1620 refracts a predetermined laser light irradiated from directly above, and is in a region located immediately below the tapered portion H1610 on the bonding surface H1508. It has a predetermined inclination angle and planar arrangement so that it can be guided.

  As described above, the portion indicated by the symbol B in the scan trajectory of the laser beam is a pattern that passes over the laser beam refraction inclined surface H1620, avoiding the tapered portion H1610 of the ink supply port H1605b. Therefore, according to the method of this embodiment, it is possible to irradiate the entire region of the bonding surface H1508 including the portion located directly below the tapered portion H1610.

  By irradiating the joining surface H1508 with laser light, the plastic that absorbs the laser light forming the tank holder H1500 is melted, and the heat generation at that time also heats and melts the flow path forming member H1600, and the two members are welded and joined. The Thus, according to the present embodiment, the entire region of the joint surface H1508 around each ink flow path H1605 shown in FIG. 5B is welded well, and the ink sealability of the ink flow path is ensured.

  In this embodiment, when the tilt angle of the laser beam refracting inclined surface H1620 is 30 degrees or less, the laser beam refracting angle is too small, and it is difficult to make the laser beam wrap around the target bonding surface H1508 well. There are many cases. On the other hand, if the tilt angle is 70 degrees or more, the amount of laser light reflected on the surface of the laser beam refracting tilted surface H1620 increases, and the energy reaching the target joint surface H1508 is greatly attenuated. Therefore, the inclination angle of the laser light refraction inclined surface H1620 is desirably 30 degrees or more and 70 degrees or less.

  Further, in this embodiment, in the black ink supply port H1605b, the laser beam is irradiated to the region located immediately below the tapered portion H1610 of the bonding surface H1508 using the laser beam refraction inclined surface H1620. As shown, it is needless to say that the same method can be used for the ink supply ports H1605 for other colors when there is a tapered portion. Further, as in the present embodiment, the portion of the flow path forming member H1600 that forms each ink supply port H1605 may be formed as a cylindrical protrusion. Therefore, depending on the height of the protruding portion and the laser beam transmittance of the material of the flow path forming member H1600, the laser beam reaching the region located immediately below the protruding portion of the bonding surface H1508 is not negligible. The case where it is attenuated can be considered. Even in such a case, by using the laser light refracting inclined surface, it is sufficient to adjust the irradiation intensity of the laser light even in the region of the bonding surface H1508 located immediately below the protrusion. Therefore, it is possible to supply a good laser beam energy and to achieve good welding and bonding. Furthermore, other thick wall portions or inclined surface forming portions are formed in the planar region of the flow path forming member H1600 that overlaps the bonding surface H1508, or a laser light shielding material such as a metal material is bonded to the flow path forming member H1600. Similarly, even when embedded or embedded, by using the laser light refraction inclined surface, it is possible to achieve good welding bonding in the entire region of the bonding surface H1508.

(Example 2)
A second embodiment of the present invention will be described with reference to FIG. In the figure, the same reference numerals are assigned to the same parts as those in the first embodiment. The overall configuration of the ink jet recording head of this embodiment is the same as that of Embodiment 1, and a detailed description thereof is omitted.

  FIG. 14 shows a procedure in the present embodiment in which the flow path forming member H1600 and the tank holder H1500 are welded and joined using laser light. In this embodiment, the portion where the ink supply port H1605 is formed is a thin and very long cylindrical protrusion. In order to allow the laser beam to reach a region of the joint surface H1508 immediately below the projecting portion, a laser light refraction inclined surface H1621 is formed outside the projecting portion. The laser light refraction inclined surface H1621 is formed at the root portion of the protruding portion, and is formed so as to penetrate into a portion deeper than the basic thick surface of the flow path forming member H1600.

  By refracting the laser beam with the laser beam refracting inclined surface H1621, the laser beam having a sufficient intensity can reach the entire region of the bonding surface H1508 including the region overlapping the protruding portion around the ink supply port H1605. Welding and joining can be performed, and ink sealability of the ink flow path can be ensured.

(Example 3)
A third embodiment of the present invention will be described with reference to FIG. In the figure, the same reference numerals are assigned to the same parts as those in the first embodiment. The overall configuration of the ink jet recording head of this embodiment is the same as that of Embodiment 1, and a detailed description thereof is omitted.

  FIG. 15 shows a procedure in the present embodiment in which the flow path forming member H1600 and the tank holder H1500 are welded and joined using laser light. In this embodiment, the flow path forming member H1600 is formed of a resin material that is not transmissive to laser light, and the tank holder H1500 is formed of a resin material that is transmissive to laser light.

  In the joining procedure, the ink flow path forming member H1600 is pressed against the tank holder H1500 as in the previous embodiments. At this time, in this embodiment, a convex portion H1630 is formed around the portion of the ink flow path H1605 of the flow path forming member H1600 extending in a predetermined plane pattern on the mating surface of both members. The portion of H1630 is a joint surface H1508 of both members.

  In this embodiment, the joining surface H1508 is irradiated with laser light from the tank holder H1500 side. At this time, the tank holder H1500 is formed with a joint portion H1517 (see also FIG. 9) for ink distribution with the ink tank H1900 as a cylindrical protruding portion, and an inclined surface H1518 is formed at the opening at the tip. Yes. A part of the plane area of the inclined surface H1518 overlaps the bonding surface H1508. Therefore, the laser beam cannot reach the region of the bonding surface H1508 directly below the inclined surface H1518 even if the laser beam is irradiated from directly above the region. Therefore, a laser beam refracting inclined surface H1510 that refracts the laser beam so that the laser beam reaches the bonding surface H1508 is provided in the vicinity of the bonding surface H1508 at the base portion of the joint portion H1517. By utilizing this laser light refracting inclined surface H1510, the entire region of the bonding surface H1508 including the region located directly below the inclined surface H1518 can be irradiated with laser light to achieve good welding and bonding. The ink seal property of the road can be secured.

  Thus, in the present invention, the flow path forming member H1600 is formed of a resin material that is not transmissive to laser light, and the tank holder H1500 is formed of a resin material that is transmissive to the laser light. The present invention is also applicable to a technique in which both members are welded and bonded by irradiating laser light from the holder H1500 side.

It is detail drawing of the welding junction part by Example 1 of this invention, FIG. 1 (a) is a top view, FIG.1 (b) is AA of FIG.1 (a), FIG.2B, FIG.5 (b). Sectional drawing along a line. The perspective view which shows the procedure of the welding joining by Example 1 of this invention. The perspective view which shows the procedure of the welding joining by Example 1 of this invention. Sectional drawing which shows the procedure of the welding joining by Example 1 of this invention. Sectional drawing which shows the procedure of the welding joining by Example 1 of this invention. Sectional drawing which shows the procedure of the welding joining by Example 1 of this invention. Sectional drawing which expanded a part which shows the procedure of the welding joining by Example 1 of this invention. (A) is a top view which shows the scanning locus | trajectory of the laser beam in the welding joining by Example 1 of this invention, (b) is a figure which shows the planar pattern of the joining surface welded by the laser beam irradiation of (a). 1 is a perspective view of an example inkjet recording apparatus to which the present invention is applicable. FIG. 7 is a perspective view of a recording head cartridge mounted on the ink jet recording apparatus of FIG. 6. FIG. 8 is an exploded perspective view of the recording head cartridge in FIG. 7. FIG. 9 is an exploded perspective view of a recording head constituting the recording head cartridge of FIG. 8. FIG. 9 is an exploded perspective view of a recording head constituting the recording head cartridge of FIG. 8. FIG. 10 is a partially broken perspective view of a recording element substrate provided in the recording head of FIG. 9. FIG. 8 is a perspective view for explaining attachment of an ink tank to a recording head in the recording head cartridge of FIG. 7. FIG. 8 is a cross-sectional view of the recording head cartridge in FIG. 7. Sectional drawing which expanded a part which shows the procedure of the welding joining by Example 2 of this invention. Sectional drawing which expanded a part which shows the procedure of the welding joining by Example 3 of this invention. It is detail drawing of the welding joining part of a comparative example, (a) is a top view, (b) is sectional drawing along the AA of (a). (A) is a top view which shows the scanning locus | trajectory of the laser beam in the welding joining by a comparative example, (b) is a figure which shows the planar pattern of the joint surface welded by the laser beam irradiation of (a).

Explanation of symbols

H1500 tank holder (first member in Example 1)
H1501, 1606 Ink channel H1600 Channel forming member (second member in Example 1)
H1620 Laser refraction inclined surface

Claims (9)

In an inkjet recording head for recording on a recording medium by discharging ink,
A first member formed of a plastic that has an ink flow path and is not transmissive to laser light, and a second member that is formed of a plastic that is formed of an ink flow path and is transmissive to laser light. And at least a bonding surface over the region surrounding the communication portion of the ink flow path so that the ink flow paths of both members communicate with each other.
The ink jet recording head, wherein the second member has a laser light refracting inclined surface capable of refracting laser light traveling in a direction perpendicular to the joint surface and guiding the laser light to at least a partial region of the joint surface. .   The second member is disposed in a region overlapping the joining surface when viewed in a direction perpendicular to the joining surface, and blocks, attenuates, or changes the traveling direction of laser light traveling in the direction perpendicular to the joining surface. 2. The laser light refracting part is provided, and the laser light refracting inclined surface is arranged so that the laser light can be guided to a region of the joint surface overlapping the laser light obstacle part. The inkjet recording head described.   The first member is a tank holder in which an ink tank is detachably held and an ink flow path connected to the ink tank is formed. The second member is joined to the tank holder. A flow path forming member in which an ink flow path communicating with the ink flow path of the tank holder is formed, and the laser beam obstructing portion has an ink supply port opened at a front end of the flow path forming member. The ink jet recording head according to claim 2, wherein the ink jet recording head is a cylindrical projection portion in which an ink flow path is formed, and the laser light refraction inclined surface is formed around the cylindrical projection portion.   The second member is a tank holder in which an ink tank is detachably held and an ink flow path connected to the ink tank is formed. The first member is joined to the tank holder. A flow path forming member in which an ink flow path communicating with the ink flow path of the tank holder is formed, and the laser beam obstructing portion has a cylindrical shape in which an ink flow path is formed at the center and connected to the ink tank The inkjet recording head according to claim 2, wherein the inkjet recording head is a protrusion, and the laser light refraction inclined surface is formed around the cylindrical protrusion.   An ink jet recording apparatus comprising the mounting portion of the ink jet recording head according to claim 1 and performing recording on a recording medium by discharging ink from the ink jet recording head. In a manufacturing method of an ink jet recording head for recording on a recording medium by discharging ink,
Forming a first member that forms an ink flow path from plastic that is not permeable to laser light;
Forming a second member that forms the ink flow path from a plastic that is transparent to laser light;
Bonding the first member and the second member by welding at a joining surface over at least a region surrounding the periphery of the communicating portion of the ink flow path so that the ink flow paths of both members communicate with each other. Have
The first member and the second member are joined by overlapping the first member and the second member, irradiating the joining surface with laser light transmitted through the second member, Performing by welding the first member and the second member;
Forming a laser beam refraction inclined surface that refracts the laser beam toward at least a partial region of the bonding surface on the second member;
Irradiation of the laser beam onto the bonding surface includes causing the laser beam to enter the laser beam refraction inclined surface.   The second member has a laser beam obstructing part that blocks, attenuates, or changes the traveling direction of the laser beam in a region overlapping with the joint surface when viewed in the traveling direction of the laser beam, The method of manufacturing an ink jet recording head according to claim 6, wherein the refractive inclined surface is arranged so that the laser light can be guided to a region of the joint surface that overlaps the laser light obstacle. Forming a first plastic member from plastic that is not transparent to laser light;
Forming a second plastic member from plastic that is transparent to laser light;
Stacking the first member and the second member;
Irradiating a joining surface between the first member and the second member by transmitting laser light through the second member;
Forming a laser beam refraction inclined surface that refracts the laser beam toward at least a partial region of the bonding surface on the second member;
Irradiating the laser beam onto the bonding surface includes causing the laser beam to be incident on the laser light refractive inclined surface.   The second member has a laser beam obstructing part that blocks, attenuates, or changes the traveling direction of the laser beam in a region overlapping with the joint surface when viewed in the traveling direction of the laser beam, The plastic member joining method according to claim 8, wherein the refractive inclined surface is arranged so that the laser light can be guided to a region of the joining surface overlapping the laser light obstacle.

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