JP2006286739A - Wiring board - Google Patents

Wiring board Download PDF

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JP2006286739A
JP2006286739A JP2005101809A JP2005101809A JP2006286739A JP 2006286739 A JP2006286739 A JP 2006286739A JP 2005101809 A JP2005101809 A JP 2005101809A JP 2005101809 A JP2005101809 A JP 2005101809A JP 2006286739 A JP2006286739 A JP 2006286739A
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film
wiring
ground
signal
signal wiring
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Yoshio Ogawa
誉夫 小川
Hiroshi Tajima
宏 田島
Masahiro Nishimoto
正弘 西本
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Dexerials Corp
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Sony Chemical and Information Device Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board having uniform the impedance of a signal wiring film. <P>SOLUTION: Centered at a signal wiring film 20 with its width W arranged on the surface of the substrate, the presence of a grounding wiring film parallel to the film 20 is eliminated within a range 7W around the film 20. With this configuration, the difference in impedance between the film 20 near an end of a base film 11 and the film 20 at a far position can be especially reduced when a high frequency signal is used, and the wiring board having a good characteristic can be obtained. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は配線基板の技術分野にかかり、特に、高周波信号が用いられる配線基板に関する。   The present invention relates to the technical field of wiring boards, and more particularly to a wiring board using a high-frequency signal.

図４(ａ)の符号１１０は従来技術のフレキシブル配線基板を示している。
このフレキシブル配線基板１１０は、ベースフィルム１１１と、信号配線パターン１１３と、接地配線パターン１１４を有している。 Reference numeral 110 in FIG. 4A denotes a conventional flexible wiring board.
The flexible wiring board 110 has a base film 111, a signal wiring pattern 113, and a ground wiring pattern 114.

信号配線パターン１１３はベースフィルム１１１の片面上に配置され、接地配線パターン１１４は信号配線パターン１１３が配置された面とは反対側の面に配置されている。   The signal wiring pattern 113 is disposed on one surface of the base film 111, and the ground wiring pattern 114 is disposed on the surface opposite to the surface on which the signal wiring pattern 113 is disposed.

信号配線パターン１１３と接地配線パターン１１４は、一乃至複数個の配線膜によってそれぞれ構成されている。各配線膜は、金属薄膜のパターニングによって形成されている。   The signal wiring pattern 113 and the ground wiring pattern 114 are each composed of one to a plurality of wiring films. Each wiring film is formed by patterning a metal thin film.

図４(ｂ)は信号配線パターン１１３の平面図であり、同図符号１２０は、信号配線パターン１１３を構成する細長の複数の信号配線膜を示している。   FIG. 4B is a plan view of the signal wiring pattern 113, and reference numeral 120 indicates a plurality of elongated signal wiring films constituting the signal wiring pattern 113.

ベースフィルム１１１の表面が位置する平面内において、基準となる方向を傾きゼロ度とすると、各信号配線膜１２０の直線部分は、基準となる方向に対して所定角度θ(ｎ)で交差するようにされている(ｎは整数)。例えば、θ(ｎ)＝１５×ｎ度の場合は、鋭角を取り上げると、０°、１５°、３０°、４５°、……９０°のいずれかの角度で基準方向と交差する。従って、信号配線膜１２０同士も、θ(ｎ)のいずれかの角度で交差する。   In the plane where the surface of the base film 111 is located, assuming that the reference direction is tilted at zero degrees, the straight line portions of the signal wiring films 120 intersect with the reference direction at a predetermined angle θ (n). (N is an integer). For example, when θ (n) = 15 × n degrees, taking an acute angle, it intersects the reference direction at any angle of 0 °, 15 °, 30 °, 45 °,. Accordingly, the signal wiring films 120 also intersect at any angle of θ (n).

図４(ｃ)は接地配線パターン１１４の平面図である。
接地配線パターン１１４は、互いに平行で等間隔に配置された第一の接地配線膜１２１と、第一の接地配線膜１２１とはゼロ以外の角度で交差し、互いに平行で等間隔な第二の接地配線膜１２２とを有している。 FIG. 4C is a plan view of the ground wiring pattern 114.
The ground wiring pattern 114 intersects the first ground wiring film 121 and the first ground wiring film 121 that are parallel to each other and equidistantly intersect with each other at an angle other than zero, and are parallel and equidistant from each other. And a ground wiring film 122.

信号配線膜１２０に対する第一、第二の接地配線膜１２１、１２２の位置を設定する際には、全ての信号配線膜１２０に対し、第一、第二の接地配線膜１２１、１２２が平行にならないようにされている。   When setting the positions of the first and second ground wiring films 121 and 122 with respect to the signal wiring film 120, the first and second ground wiring films 121 and 122 are parallel to all the signal wiring films 120. It is made not to become.

接地配線パターン１１４は、交流的には接地されており、高周波信号に対する信号配線パターン１１３のインピーダンスを一定にしているが、第一、第二の接地配線膜１２１、１２２の両端が処理されておらず、ヒゲ状に突き出されている場合、突き出された部分がアンテナとなってノイズを拾うと考えられていた。   The ground wiring pattern 114 is grounded in terms of alternating current, and the impedance of the signal wiring pattern 113 with respect to the high frequency signal is made constant, but both ends of the first and second ground wiring films 121 and 122 are not processed. However, when protruding like a beard, it was thought that the protruding portion would become an antenna and pick up noise.

このフレキシブル配線基板１１０では、第一、第二の接地配線膜１２１、１２２の周囲には、第一、第二の接地配線膜１２１、１２２を取り囲む外周接地配線膜１２３が配置されており、第一、第二の接地配線膜１２１、１２２の両端は、外周接地配線膜１２３に接続されている。図５(ａ)は、第一、第二の接地配線膜１２１、１２２を示し、同図(ｂ)は外周接地配線膜１２３を示している。   In the flexible wiring board 110, an outer peripheral ground wiring film 123 surrounding the first and second ground wiring films 121 and 122 is disposed around the first and second ground wiring films 121 and 122. Both ends of the first and second ground wiring films 121 and 122 are connected to the outer peripheral ground wiring film 123. 5A shows the first and second ground wiring films 121 and 122, and FIG. 5B shows the outer peripheral ground wiring film 123.

第一、第二の接地配線膜１２１、１２２の両端はその終端部分であり、外周接地配線膜１２３に接続されているからヒゲ状に突き出された部分が無く、そのため接地配線パターン１１４はノイズを拾わず、信号配線パターン１１３にノイズが重畳されないのは、その結果であると考えられていた。   Both ends of the first and second ground wiring films 121 and 122 are terminal portions, and since they are connected to the outer peripheral ground wiring film 123, there is no portion protruding like a beard, so that the ground wiring pattern 114 generates noise. It was thought that the result was that no noise was superimposed on the signal wiring pattern 113 without picking it up.

しかし、図４のフレキシブル配線基板１１０のように、配線基板がフラットケーブルの場合や、細長い配線基板の場合、ベースフィルム１１１は細長くなり、外周接地配線膜１２３には、ベースフィルム１１１の長手方向に沿って細長い部分が生じてしまう。例えば、長方形の長辺等である。   However, when the wiring board is a flat cable or an elongated wiring board as in the flexible wiring board 110 of FIG. 4, the base film 111 is elongated, and the outer peripheral grounding wiring film 123 extends in the longitudinal direction of the base film 111. A long and narrow part will be formed along. For example, the long side of a rectangle.

フラットケーブル等では、信号配線パターン１２０はベースフィルム１１１の長手方向に沿って配置する必要があるから、信号配線膜１２０と外周接地配線膜１２３の長辺とは平行になってしまう。   In a flat cable or the like, since the signal wiring pattern 120 needs to be arranged along the longitudinal direction of the base film 111, the signal wiring film 120 and the long side of the outer peripheral grounding wiring film 123 become parallel.

図６の符号Ｌは、信号配線膜１２０と外周接地配線膜１２３の長辺との間の距離を示しており、特に、両端に位置する信号配線膜１２０の距離Ｌが短くなると、その信号配線膜１２０と他の信号配線膜１２０との間のインピーダンスの相違が大きくなってしまうという問題が生じた。   6 indicates the distance between the signal wiring film 120 and the long side of the outer peripheral grounding wiring film 123. In particular, when the distance L between the signal wiring films 120 located at both ends is shortened, the signal wiring is shown. There arises a problem that the difference in impedance between the film 120 and the other signal wiring film 120 becomes large.

接地配線パターン１１３の形状については、例えば下記先行技術で言及されている。
特開平４−１２７５９８号公報 The shape of the ground wiring pattern 113 is mentioned in the following prior art, for example.
Japanese Patent Laid-Open No. 4-127598

本発明は上記課題を解決するために創作されたものであり、その目的は、ベース基板の縁に近い信号配線のインピーダンスと、ベース基板の縁から遠い信号配線のインピーダンスとを一致させる技術を提供する。   The present invention has been created to solve the above-described problems, and an object thereof is to provide a technique for matching the impedance of a signal wiring near the edge of the base substrate with the impedance of a signal wiring far from the edge of the base substrate. To do.

上記課題を解決するため、本発明は、基板の表面に配置された信号配線パターンと、前記基板の反対側の面に配置された接地配線パターンとを有する配線基板であって、前記信号配線パターンを構成する信号配線膜の両側であって、該信号配線膜の縁から該信号配線膜の幅Ｗの３倍の距離内に、前記接地配線パターンを構成する接地配線膜が存しない配線基板である。
また、本発明は、前記接地配線パターンは、互いに平行に配置された複数の細長の第一の接地配線膜と、前記第一の接地配線膜と交差し、互いに平行に配置された複数の細長の第二の接地配線膜とを含む配線基板である。
また、本発明は、前記配線基板は可撓性を有する配線基板である。 In order to solve the above problems, the present invention provides a wiring board having a signal wiring pattern disposed on a surface of a substrate and a ground wiring pattern disposed on a surface opposite to the substrate, wherein the signal wiring pattern A wiring board that does not include the ground wiring film that constitutes the ground wiring pattern within the distance of three times the width W of the signal wiring film from both edges of the signal wiring film. is there.
Further, according to the present invention, the ground wiring pattern includes a plurality of elongated first ground wiring films arranged in parallel to each other and a plurality of elongated lines arranged in parallel to each other so as to intersect the first ground wiring film. And a second grounding wiring film.
In the present invention, the wiring board is a flexible wiring board.

本発明は上記のように構成されており、幅Ｗの信号配線膜の両側３Ｗの距離の範囲Ｓの内側、即ち、信号配線膜の幅方向中央位置を中心とする、幅７Ｗ(この幅７Ｗは、信号配線膜の幅と同じ方向である。)の範囲Ｓ内に、その信号配線膜と平行な接地配線膜が存しないように構成されている。接地配線膜は、接地電位に接続されている場合の他、直流的には浮遊電位に置かれており、接地電位との間に形成されるキャパシタンス成分によって接地電位に接続される場合も含まれる。   The present invention is configured as described above, and has a width 7W (this width 7W) centering on the inside of the distance range S of both sides 3W of the width W of the signal wiring film, that is, the center position in the width direction of the signal wiring film. Is in the same direction as the width of the signal wiring film.) The ground wiring film parallel to the signal wiring film does not exist within the range S. In addition to the case where the ground wiring film is connected to the ground potential, the ground wiring film is placed at a floating potential in a direct current, and includes a case where the ground wiring film is connected to the ground potential by a capacitance component formed between the ground wiring film and the ground potential. .

各信号配線の特性インピーダンスがほぼ等しくなるので、高周波信号の遅延時間や消費電力の差が小さくなる。   Since the characteristic impedances of the signal wirings are almost equal, the difference in delay time and power consumption of the high frequency signal is reduced.

図１(ａ)の符号１０は、本発明の一例の配線基板を示している。
この配線基板１０は、ベースフィルム１１と、信号配線パターン１３と、接地配線パターン１４を有している。信号配線パターン１３や接地配線パターン１４の表面に配置されている保護膜は省略した。また、接地配線パターン１４を外部回路に接続するパッドも省略した。接地配線パターン１４は外部回路に接続されず、直流的には浮遊電位に置かれているが、交流的には接地電位に接続されているものも含まれる。 Reference numeral 10 in FIG. 1A indicates a wiring board as an example of the present invention.
The wiring board 10 has a base film 11, a signal wiring pattern 13, and a ground wiring pattern 14. The protective film disposed on the surface of the signal wiring pattern 13 and the ground wiring pattern 14 is omitted. Also, the pads for connecting the ground wiring pattern 14 to an external circuit are omitted. The ground wiring pattern 14 is not connected to an external circuit and is placed at a floating potential in terms of DC, but includes that connected to the ground potential in terms of AC.

信号配線パターン１３はベースフィルム１１の表面上に配置され、接地配線パターン１４は、信号配線パターン１３が配置された面とは反対側の面に配置されている。
信号配線パターン１３と接地配線パターン１４は、一乃至複数個の配線膜によって構成されている。 The signal wiring pattern 13 is disposed on the surface of the base film 11, and the ground wiring pattern 14 is disposed on the surface opposite to the surface on which the signal wiring pattern 13 is disposed.
The signal wiring pattern 13 and the ground wiring pattern 14 are composed of one or more wiring films.

図１(ｂ)は信号配線パターン１３の平面図であり、同図の符号２０は、信号配線パターン１３を構成する細長の複数の信号配線膜を示している。基準となる方向を傾きゼロ度とすると、各信号配線膜１２０の直線部分は、基準となる方向に対して所定角度θ(ｎ)で交差するようにされている(ｎは整数)。例えば、θ(ｎ)＝１５×ｎ度(ｎ＝０〜６)の場合は、基準方向に対する交差角度のうちの鋭角の方は、０°、１５°、３０°、４５°、……９０°のいずれかの角度で交差するようになっており、従って、基準方向との交差角度は１５°刻みに設定されている(０°の場合は基準方向と平行であるが、ここでは交差に含める)。信号配線膜１２０同士も、その交差角度の鋭角は、θ(ｎ)のいずれかの値をとる。   FIG. 1B is a plan view of the signal wiring pattern 13, and reference numeral 20 in FIG. 1 indicates a plurality of elongated signal wiring films constituting the signal wiring pattern 13. When the reference direction is set to zero degree of inclination, the linear portion of each signal wiring film 120 intersects the reference direction at a predetermined angle θ (n) (n is an integer). For example, when θ (n) = 15 × n degrees (n = 0 to 6), the acute angle of the crossing angles with respect to the reference direction is 0 °, 15 °, 30 °, 45 °,... Therefore, the angle of intersection with the reference direction is set in increments of 15 ° (in the case of 0 °, it is parallel to the reference direction. include). The acute angle of the crossing angle between the signal wiring films 120 also takes any value of θ (n).

いずれかの信号配線膜の方向を基準方向とした場合、交差角度の値θ(ｎ)にゼロ度も含まれ、その場合は交差角度θ(ｎ)に９０°も含まれるようにθx×ｎのθxが含まれるように設定するのが通例である。 When the direction of any one of the signal wiring films is a reference direction, the crossing angle value θ (n) includes zero degree, and in this case, the crossing angle θ (n) includes 90 ° so that θ x × it is customary to set to include n of theta x.

図２は接地配線パターン１４の平面図であり、接地配線パターン１４は互いに平行に等間隔に配置された第一の接地配線膜２１と、第一の接地配線膜２１とは交差し、互いに平行で等間隔な第二の接地配線膜２２とを有している。第一、第二の接地配線２１、２２の交差角のうち、小さい方の交差角度φは、φ＜９０°である。   FIG. 2 is a plan view of the ground wiring pattern 14. In the ground wiring pattern 14, the first ground wiring film 21 and the first ground wiring film 21 that are arranged in parallel to each other at equal intervals cross each other and are parallel to each other. And the second ground wiring film 22 at equal intervals. Of the crossing angles of the first and second ground wirings 21 and 22, the smaller crossing angle φ is φ <90 °.

図４に示したフレキシブル配線板１１０と同様に、この配線基板１０でも、信号配線膜２０に対する第一、第二の接地配線膜２１、２２の位置を設定する際に、全ての信号配線膜２０に対して全ての第一、第二の接地配線膜２１、２２が平行にならないようにされている。   Similar to the flexible wiring board 110 shown in FIG. 4, even in this wiring board 10, when setting the positions of the first and second ground wiring films 21 and 22 with respect to the signal wiring film 20, all the signal wiring films 20 are formed. In contrast, all the first and second ground wiring films 21 and 22 are not parallel to each other.

他方、この配線基板１０では、図４のフレキシブル配線基板１１０と異なり、第一、第二の接地配線膜２１、２２の周囲には、外周接地配線膜１２３が配置されていない。   On the other hand, in the wiring substrate 10, unlike the flexible wiring substrate 110 of FIG. 4, the outer peripheral grounding wiring film 123 is not disposed around the first and second grounding wiring films 21 and 22.

従って、接地配線パターン１４には、信号配線膜２０と平行な接地配線膜は存在せず、ベースフィルム１１の縁に近い信号配線２０のインピーダンスと、縁から遠い信号配線２０のインピーダンスは一致する。   Therefore, there is no ground wiring film parallel to the signal wiring film 20 in the ground wiring pattern 14, and the impedance of the signal wiring 20 near the edge of the base film 11 matches the impedance of the signal wiring 20 far from the edge.

信号配線膜２０に対して近距離に、当該信号配線膜２０と平行な接地配線膜が存在すると、その信号配線膜２０と接地配線膜の間のキャパシタンス成分が大きくなり、信号配線膜２０のインピーダンスが大きくなってしまう。   If a ground wiring film parallel to the signal wiring film 20 exists at a short distance from the signal wiring film 20, the capacitance component between the signal wiring film 20 and the ground wiring film increases, and the impedance of the signal wiring film 20 is increased. Will become bigger.

特に、信号の周波数が１ＧＨｚ〜１０ＧＨｚの範囲では、信号配線膜２０の幅Ｗに対し、図３(ａ)、(ｂ)に示すように、信号配線膜２０の縁から３Ｗの範囲Ｓ内に信号配線膜２０と平行な接地配線膜が存在しなければ、他の信号配線膜２０とにインピーダンスの差が大きくないことが確かめられている。   In particular, when the signal frequency is in the range of 1 GHz to 10 GHz, the width W of the signal wiring film 20 is within a range S of 3 W from the edge of the signal wiring film 20 as shown in FIGS. If there is no ground wiring film parallel to the signal wiring film 20, it has been confirmed that there is no large difference in impedance from the other signal wiring films 20.

この範囲Ｓは、左右両側３Ｗ×２の幅と、信号配線２０の幅Ｗの合計７Ｗの範囲内であり、ベースフィルム１１表面の信号配線２０の幅方向中央を中心として、７Ｗの範囲に含まれるベースフィルム１１の裏面及び表面位置に接地配線が存しないことが必要な条件になる。  This range S is within a total range of 7 W of the width 3 W × 2 on both the left and right sides and the width W of the signal wiring 20, and is included in the range of 7 W with the center in the width direction of the signal wiring 20 on the surface of the base film 11 as the center. It is a necessary condition that no ground wiring exists on the back surface and the front surface position of the base film 11 to be formed.

通常、信号配線パターン１３が配置されている領域の真裏位置には、信号配線膜２０と平行な接地配線膜は存在しないから、信号配線パターン１３の外縁に位置する信号配線膜２０の更に外側の３Ｗの範囲内に、信号配線２０に対して平行な接地配線膜が存しなければ、全ての信号配線膜２０に対し、その幅方向中央を中心とする幅７Ｗの範囲内に、信号配線膜２０に対して平行な接地配線膜は存在しない。   Usually, there is no ground wiring film parallel to the signal wiring film 20 in the position directly behind the region where the signal wiring pattern 13 is arranged, and therefore, the signal wiring film 13 located on the outer edge of the signal wiring pattern 13 is further outside. If there is no ground wiring film parallel to the signal wiring 20 within the range of 3 W, the signal wiring film is within the range of width 7 W with the center in the width direction as a center for all the signal wiring films 20. There is no ground wiring film parallel to 20.

本発明では、接地配線パターン１４は外周接地配線膜を有していない。各信号配線膜２０は、互いに平行な部分を有しており、その部分はベースフィルム１１の長手方向に沿って配置されているが、外周接地配線膜を有していないため、各信号配線膜２０の平行部分に対して平行な接地配線膜は存せず、従って、信号配線膜２０の縁からその幅Ｗの３倍の範囲内に、信号配線膜と平行な接地配線膜は存在しない。   In the present invention, the ground wiring pattern 14 does not have an outer peripheral ground wiring film. Each signal wiring film 20 has a portion parallel to each other, and the portion is disposed along the longitudinal direction of the base film 11, but does not have an outer peripheral grounding wiring film. Therefore, there is no ground wiring film parallel to the signal wiring film within the range of three times the width W from the edge of the signal wiring film 20.

接地配線パターン１４は交流的には接地されており、高周波信号に対する各信号配線パターン１３のインピーダンスは一定なっていた。
また、外周接地配線膜を設けなくても、第一、第二の接地配線膜１２、１２がノイズを拾うことはなかった。 The ground wiring pattern 14 is grounded in terms of alternating current, and the impedance of each signal wiring pattern 13 with respect to a high frequency signal is constant.
Further, the first and second ground wiring films 12 and 12 did not pick up noise without providing the outer peripheral ground wiring film.

なお、上記実施例では、信号配線パターン１３に対し、接地配線パターン１４はベースフィルム１１の反対の面にだけ位置していたたが、信号配線パターン１３と同じ側の面にも交流的に接地電位に接続される接地配線膜が配置されていてもよい。その場合、信号配線パターン１３と同じ面に配置された接地配線膜についても、信号配線膜２０の縁から３Ｗの範囲Ｓ(信号配線膜２０の幅方向中央を中心として７Ｗの範囲内)に、信号配線パターン１３と同じ表面の接地配線が存しないようにする必要がある。   In the above embodiment, the ground wiring pattern 14 is located only on the opposite surface of the base film 11 with respect to the signal wiring pattern 13. A ground wiring film connected to the potential may be disposed. In that case, the ground wiring film disposed on the same surface as the signal wiring pattern 13 is also within a range S of 3 W from the edge of the signal wiring film 20 (within a range of 7 W centering on the center in the width direction of the signal wiring film 20). It is necessary to prevent the ground wiring on the same surface as the signal wiring pattern 13 from being present.

また、上記配線基板１０では、外周配線膜を設けなかったが、外周配線膜を設けても、信号配線と平行な外周配線膜の部分を、信号配線膜２０の縁から３Ｗの範囲Ｓ(信号配線膜２０の幅方向中央を中心として７Ｗの範囲内)の外部に配置すればよい。   Further, in the wiring substrate 10, the outer peripheral wiring film is not provided. However, even if the outer peripheral wiring film is provided, the portion of the outer peripheral wiring film parallel to the signal wiring is within a range S (signal S 3 W from the edge of the signal wiring film 20. What is necessary is just to arrange | position outside the range of 7W centering on the center of the width direction of the wiring film 20).

なお、配線膜は銅薄膜や銅箔などの金属薄膜のパターニングによって形成されている。ベースフィルム１１は、ポリイミドフィルム等の可撓性を有する樹脂フィルムであり、配線膜やベースフィルム１１の厚みは数十μ〜数十μｍである。この程度の厚みの金属薄膜の場合、可撓性を有しており、カバーフィルムにも可撓性を有する樹脂が用いられるから、配線基板１０は可撓性を有している。   The wiring film is formed by patterning a metal thin film such as a copper thin film or a copper foil. The base film 11 is a flexible resin film such as a polyimide film, and the thickness of the wiring film or the base film 11 is several tens to several tens of μm. In the case of the metal thin film having such a thickness, the wiring substrate 10 has flexibility because the resin has flexibility and the cover film is also made of a flexible resin.

また、上記実施例では、ベースフィルム１１の片面にだけ信号配線パターン１３が配置されていたが、信号配線膜や接地配線膜が複数層に積層された積層回路基板では、積層型の回路基板では、信号配線膜を中心とする７Ｗの範囲内に、隣接する接地配線パターンの接地配線膜が存しなければよい。   In the above embodiment, the signal wiring pattern 13 is arranged only on one side of the base film 11. However, in the laminated circuit board in which the signal wiring film and the ground wiring film are laminated in a plurality of layers, in the laminated circuit board, If the ground wiring film of the adjacent ground wiring pattern does not exist within the range of 7 W centering on the signal wiring film.

(ａ)：本発明の一例の配線基板の平面図、(ｂ)：その信号配線パターンを説明するための図(a): a plan view of a wiring board as an example of the present invention; (b): a diagram for explaining a signal wiring pattern thereof; その接地配線パターンを説明するための図A diagram for explaining the ground wiring pattern (ａ)、(ｂ)：本発明の信号配線膜と接地配線膜の位置関係をするための図(a), (b): Diagrams for the positional relationship between the signal wiring film and the ground wiring film of the present invention (ａ)：従来技術の配線基板の例、(ｂ)：その信号配線パターン、(ｃ)その接地配線パターン(a): Example of prior art wiring board, (b): its signal wiring pattern, (c) its ground wiring pattern 従来技術の接地配線パターンの第一、第二の接地配線膜First and second ground wiring films of the ground wiring pattern of the prior art 従来技術の接地配線パターンの外周接地配線膜Peripheral ground wiring film of ground wiring pattern of the prior art

符号の説明Explanation of symbols

１０……配線基板
１１……基板(ベースフィルム)
１３……信号配線パターン
１４……接地配線パターン
２１……第一の接地配線膜
２２……第二の接地配線膜
Ｗ……信号配線の幅 10 ... Wiring board 11 ... Board (base film)
13... Signal wiring pattern 14... Ground wiring pattern 21... First ground wiring film 22... Second ground wiring film W.

Claims (3)

基板の表面に配置された信号配線パターンと、
前記基板の反対側の面に配置された接地配線パターンとを有する配線基板であって、
前記信号配線パターンを構成する信号配線膜の両側であって、該信号配線膜の縁から該信号配線膜の幅Ｗの３倍の距離内に、前記接地配線パターンを構成する接地配線膜が存しない配線基板。 A signal wiring pattern arranged on the surface of the substrate;
A wiring board having a ground wiring pattern disposed on the opposite surface of the board,
The ground wiring film constituting the ground wiring pattern exists on both sides of the signal wiring film constituting the signal wiring pattern and within a distance of three times the width W of the signal wiring film from the edge of the signal wiring film. Do not wiring board. 前記接地配線パターンは、互いに平行に配置された複数の細長の第一の接地配線膜と、前記第一の接地配線膜と交差し、互いに平行に配置された複数の細長の第二の接地配線膜とを含む請求項１記載の配線基板。   The ground wiring pattern includes a plurality of elongated first ground wiring films arranged in parallel to each other and a plurality of elongated second ground wirings intersecting the first ground wiring film and arranged in parallel to each other. The wiring board according to claim 1, comprising a film. 前記配線基板は可撓性を有するフレキシブル配線基板である請求項１又は請求項２のいずれか１項記載の配線基板。   The wiring board according to claim 1, wherein the wiring board is a flexible wiring board having flexibility.
JP2005101809A 2005-03-31 2005-03-31 Wiring board Pending JP2006286739A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135726A (en) * 2008-10-14 2010-06-17 Hitachi Chem Co Ltd Electronic device having substrate connection structure excellent in electrical property
CN114630489A (en) * 2022-03-22 2022-06-14 广东湾区智能终端工业设计研究院有限公司 Flexible circuit board, folding assembly and electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326476A (en) * 1993-05-13 1994-11-25 Sony Corp Multilayered wiring board
JPH09298626A (en) * 1996-05-07 1997-11-18 Fuji Photo Film Co Ltd Flexible printed wiring board for image sensor
JPH10112224A (en) * 1996-10-04 1998-04-28 Molex Inc Flat flexible cable

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326476A (en) * 1993-05-13 1994-11-25 Sony Corp Multilayered wiring board
JPH09298626A (en) * 1996-05-07 1997-11-18 Fuji Photo Film Co Ltd Flexible printed wiring board for image sensor
JPH10112224A (en) * 1996-10-04 1998-04-28 Molex Inc Flat flexible cable

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135726A (en) * 2008-10-14 2010-06-17 Hitachi Chem Co Ltd Electronic device having substrate connection structure excellent in electrical property
CN114630489A (en) * 2022-03-22 2022-06-14 广东湾区智能终端工业设计研究院有限公司 Flexible circuit board, folding assembly and electronic equipment
CN114630489B (en) * 2022-03-22 2024-01-26 广东湾区智能终端工业设计研究院有限公司 Flexible circuit board, folding assembly and electronic equipment

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