JP2006224596A - Inkjet recording head and method for manufacturing inkjet recording head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the mechanical strength from decreasing caused by making an ink feeding hole long and large in a BJ head by a large-sized CP manufacturing method, and to realize a printing with a high yield and a high quality. <P>SOLUTION: A beam is provided on the ink feeding hole by using a vertical etching method of (100)Si substrate. In order to raise accuracy of the dimension of the beam by vertical etching, a guiding hole for etching is opened by a laser or the like. In this case, to raise the accuracy of the dimension of the beam, a relational equation for restricting the position of the guiding hole is introduced. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an inkjet recording head that discharges a desired liquid by applying energy to the liquid from the outside, and a method for manufacturing the inkjet recording head.

  With respect to this type of ink jet recording head, for example, the ink jet recording method described in Japanese Patent Application Laid-Open No. 54-51837 is another ink jet recording method in that heat energy is applied to a liquid to obtain a driving force for droplet discharge. It has different characteristics.

  That is, in the recording method disclosed in the above-mentioned publication, the liquid subjected to the action of thermal energy is heated up to generate bubbles, and droplets are discharged from the orifice at the tip of the recording head by the action force based on the generation of bubbles. It is characterized in that information is recorded by forming the droplets on the recording member.

  A recording head applied to this recording method generally includes an orifice provided for discharging a liquid, and a heat acting portion that is a portion where heat energy for discharging a droplet communicated with the orifice acts on the liquid. A liquid discharge portion having a liquid flow path having a liquid crystal structure as a part, a heat generation resistance layer as a heat conversion body which is a means for generating thermal energy, an upper protective layer for protecting it from ink, and a lower layer for storing heat It has. By the way, as a method for forming high-density and high-precision nozzles and discharge ports, methods disclosed in Japanese Patent Laid-Open Nos. 5-330066 and 6-286149 have been proposed.

Japanese Patent Laid-Open No. 10-146979 proposes that a rib structure is provided on the orifice plate above the ink supply port in the nozzle manufacturing method.
JP-A-6-286149 JP-A-10-146979

  In the manufacturing method of Japanese Patent Laid-Open No. 6-286149, it has been proposed to increase the width that can be printed at once in order to increase the printing speed. In order to increase the width that can be printed at one time, it is necessary to arrange the ink ejection ports long. If the ejection ports are arranged long, it is necessary to lengthen the ink supply port. Opening the ink supply port for a long time has the following problems.

1. Distortion of substrate due to long opening of ink supply port Especially in order to reduce the size of the substrate from the viewpoint of cost, it is necessary to reduce the size perpendicular to the printed width of the substrate, and the substrate is vertically long as shown in FIG. Since the ink supply port is formed in the vertical direction, if the ink supply port is processed on the substrate, the substrate itself is distorted, and the flatness of the discharge port cannot be maintained as shown in FIG.

2. Occurrence of substrate cracks during chip handling After being formed in a lump on a wafer or the like, it is divided into discharge elements and flows in a flow path member in a sticking process, but when divided into discharge elements, it becomes an elongated substrate. If a slit-like ink supply port is formed at the center of the elongated substrate, stress may be applied to the substrate when the substrate is gripped, and the substrate may be broken. In particular, when the printing width is large, the length of the discharge element becomes long and the ink supply port becomes long, so that the stress is increased.

3. Cracking due to deformation of the substrate when the flow path member is joined and cracking or deformation of the orifice plate due to deformation of the substrate Adhesion resistance is required as an adhesive that joins the discharge element to the flow path member, so a thermosetting adhesive is used. Has been. In addition, a resin is adopted for the flow path member because of its ease of processing and low cost. When the discharge element is bonded to the flow path member, it is bonded using a thermosetting adhesive. Therefore, when the discharge element and the flow path member return to normal temperature due to the difference in coefficient of thermal expansion, residual stress is generated in the discharge element. To do. Then, the substrate on which the ejection element is formed is broken or the substrate is deformed, and the orifice plate formed thereon is deformed, the ejection direction is bent, and printing may be defective.

  Japanese Patent Laid-Open No. 10-1461979 proposes a structure in which ribs are set up to prevent the deformation of the orifice plate. This is to prevent the deformation of the orifice plate when the orifice plate swells. Deformation cannot be suppressed from the size.

  Further, a method of forming a beam as shown in FIG. 8 at the ink supply port of the substrate can be considered. In the process of forming the ink supply port first by the manufacturing method described in JP-A-6-286149, and then applying the mold material for forming the nozzle, the mold material for forming the nozzle is used in the application process for laminating a dry film or a mold material at the time of lamination. There are many restrictions such as deformation.

  Therefore, a method is adopted in which the ink supply port is formed by anisotropic etching after the step of applying the mold material for forming the nozzle and applying the nozzle material. When the ink supply port is formed by anisotropic etching, a (100) substrate is generally used as the silicon substrate. However, forming a beam using a (100) substrate has the following problems.

  First, in order to provide a beam on the substrate surface, if a mask having a beam shape is used on the back surface, even if the beam width is 50 μ, if the thickness of the substrate is 625 μ, the surface is 950 μ. When the beam width is 950 μm, nozzles of 400 μm or more are generated from the ejection port to the ink supply port, the nozzle refill is slowed down, and the frequency characteristics are greatly deteriorated. If the substrate is made thin, the process flow becomes difficult due to problems such as strength.

  On the other hand, Japanese Patent Application Laid-Open No. 10-138478 discloses a method for forming a tension by using (110) silicon as a substrate and performing vertical etching on the substrate. When a through hole perpendicular to the Si (110) substrate is opened using an anisotropic etching method by the method disclosed therein, as shown in FIG. 9 at both ends of the through hole, the through hole is perpendicular to the substrate surface. In addition to the (111) plane, a (111) plane 201 that forms 34.7 degrees with the substrate surface appears. For this reason, when etching is started from the opposite surface where the ink discharge port has already been formed, the sharpened portion becomes wider as shown in FIG. 5 on the ink discharge port side, causing a serious obstacle to ink refilling. It becomes.

  On the other hand, as a method for forming a through-hole while suppressing a slick (111) surface generated during vertical etching of a Si (110) substrate, Japanese Patent Laid-Open No. 10-166600 uses a YAG laser as a leading hole for etching before etching. Techniques for processing are disclosed. In this method, a non-through lead hole is formed from one surface of the substrate, vertical etching is performed from both sides of the substrate, and a through hole having a deeper aspect ratio than the opening is processed. However, in this disclosure, there is no description of a width structure that does not cause a problem in refilling when a large ink supply port is provided with a depth, and a depth and position of a leading hole for making the structure.

  The above-described problem is that the ink discharge pressure generating element is provided on the substrate according to the present invention, and the discharge port is disposed on the plate side facing the ink discharge pressure generating element, thereby generating bubbles in the ink and discharging the discharge. An ink jet recording head that ejects ink perpendicularly to an outlet substrate, wherein an ink supply port is divided into a plurality of lengths in the longitudinal direction due to the tension, and the length of the supply port in the longitudinal direction is 50 mm or less This is solved by the ink jet recording head.

  Further, the width of the gap between the supply ports is 40 μm or more.

  The present invention includes a step of forming a passivation layer having etching resistance on a silicon substrate, a step of providing an ink discharge pressure generating element, and a step of forming a discharge port on a plate side facing the ink discharge pressure generating element. A step of providing an etching mask opening separated so as to leave a part of the back side of the substrate on the opposite side of the substrate, a step of forming an etching lead hole having a depth that does not reach the surface opposite to the substrate in the opening, and an opening An ink jet recording head comprising: removing a portion of silicon by anisotropic etching to form a through hole penetrating to the passivation layer; and further removing the passivation layer to form an ink supply port This is realized by a substrate manufacturing method.

Further, the above-described problem is that an ink discharge pressure generating element is provided on the surface of the Si (110) substrate, and a discharge port is disposed on the plate side facing the ink discharge pressure generating element to generate bubbles in the ink. In the process of manufacturing an ink jet recording head that discharges ink perpendicularly to the discharge port substrate, when the etching mask pattern is formed on the back surface and the ink supply port is anisotropically etched toward the front surface, the following relational expression 80 μm ≧ X + Z / tan54.5 °
An ink jet process including a step of opening an etching lead hole having a depth Y from the surface on which the nozzle is formed at a position X from the narrow angle of the mask pattern using X and Y satisfying This is solved by the method of manufacturing the recording head.

(Function)
By using the etching leading hole, the width of the ink supply port can be finely processed with good controllability. Moreover, the already formed member such as the ink discharge port is protected from the corrosive etching solution by the non-penetration of the leading hole and the etching passivation layer. Further, by controlling the position and depth of the leading hole, it is possible to prevent an increase in the size of the spout on the ejection port side and to keep the flow resistance during ink supply low. The fine elasticity provided in the ink supply port by the method of the present invention increases the mechanical strength of the substrate, prevents the deformation of the nozzle formed of resin or the like on the substrate, and damages the substrate due to handling in the process. To prevent.

  As described above, according to the present invention, even if the width of the ink jet recording head is widened by providing the ink supply port with the tension, sufficient mechanical strength is ensured, and ink jet recording capable of high-quality printing. A head can be provided. In addition, the manufacturing method according to the present invention makes it possible to precisely control the width of the ink jet recording head having a plurality of divided ink supply ports, and enables high-quality printing at a high frequency. Was realized.

[Experiment 1]
FIG. 1 shows an outline of a base substrate (nozzle portion omitted) of an ink jet recording nozzle used in an experiment leading to the present invention. FIG. 2 shows a BB ′ cross section. The distance CH from the ink supply port to the ejection pressure generating element (heater) located below the nozzle was 30 μm.

  FIG. 3 is a plan view of the base substrate (nozzle portion omitted) of the ink jet recording nozzle used in the experiment. The thickness of the Si wafer used here is 600 μm. The length of the short side of the ink supply port is 100 μm, the total length in the long side direction is 100 to 200 mm, the width of the tension is 100 μm, and the pitch L of the tension is 5, 10, 15, 20, 25, 30, The substrate was changed to 40,100 mm and no elasticity.

  When an ink jet recording head was prepared by forming a heater or nozzle on this substrate, some of the nozzles that did not have elasticity were distorted in the resin of the nozzle part and varied in the ejection direction. .

  Further, when 50G was applied with an impact tester in order to measure the mechanical strength, the substrate without cracking was broken from the vicinity of the supply port.

[Experiment 2]
A base substrate similar to that in Experiment 1 was prepared, the total length in the long side direction of the ink supply port was 200 mm, the pitch of the tense was 20 mm, and the tense width M = 10, 20, 30, 40, 50, 100 as parameters. 150, 200 μm.

  A heater or nozzle was formed on this substrate, and an ink jet recording head was prepared in the same manner as in FIG. 2. When M = 1-30 μm, cracks occurred in the process, and the resin in the nozzle part Some were distorted and varied in the discharge direction.

  By changing the parameters L and M in Experiments 1 and 2, combinations that can obtain mechanical strength that can withstand the nozzle forming process were investigated. FIG. 10 shows the relationship between the tension width M, the ink supply port length L, and the strength, where no problem occurred in the nozzle formed with ◯, and × indicates the strength problem in the nozzle shape or the substrate. It represents what occurred.

[Experiment 3]
11 and 12 show the shape of the etching leading hole used in the present invention. FIG. 13 is a schematic diagram showing a cross-sectional shape after anisotropic etching of the substrate. The substrate was a Si (110) wafer. Because the distance X from the narrow angle of the etching mask at the supply port to the leading hole and Z from the leading end of the leading hole to the surface opposite to the substrate are Z, and the (111) surface appears at 54.7 degrees with respect to the substrate surface. Assuming that the processing error Y is greater than the mask size, the following relationship is generally established for X, Y, and Z.

Y = X + Z / tan54.5 °
In other words, a tension wider than the design value by 2Y is formed at the supply port adjacent to the discharge port. When Y is increased, the refilling of ink is hindered by the wide elasticity, and it becomes difficult to perform ejection printing at a high frequency.

  On the other hand, when the ink jet recording head according to the present invention was driven at a frequency of 5 KHz, it was found that when the width of the tension was 200 μm or more, the printing was disturbed due to the problem of refilling. If the minimum width of the elasticity in terms of strength is 40 μm from Experiments 1 and 2, the maximum value of Y is 80 μm, and the following relationship is established.

80 μm ≧ X + Z / tan54.5 °
[Example Embodiment]
FIG. 1 is a schematic view (nozzle part omitted) of a base substrate of an ink jet recording head showing an embodiment according to the present invention. A Si wafer is used as the substrate. A through hole 101 for supplying ink from the back surface is formed in the center of the substrate 102. When the width of the ink jet recording head nozzle is increased, the supply port cuts through the center of the substrate, so that the strength of the substrate is reduced, and the possibility of deformation or breakage increases. In view of this, the supply port is divided into a plurality of portions, and a tension 104 is provided inside to increase the strength.

  FIG. 2 shows an AA 'cross section. The width of the supply port is generally 50 to 300 μm, desirably 80 to 200 μm, and optimally 100 to 200 μm. The length of the supply port is generally 2 to 50 mm, desirably 5 to 30 mm, and optimally 10 to 20 mm. The tension width M is generally 20 to 400 μm, preferably 40 to 300 μm, and most preferably 100 to 200 μm.

  FIG. 2 shows the structure of the BB ′ cross section although the ink jet recording nozzle is formed of resin or the like. Ink supplied from the direction of the lower ink supply port 106 is heated by the heater 103, foamed, and discharged from the nozzle 107.

  Next, the process of the ink jet recording nozzle according to the present invention will be described step by step with reference to FIGS. A (110) Si substrate is used as the substrate.

  (1) Polysilicon, amorphous silicon, or the like is deposited on one surface of a silicon substrate 301 having a substrate surface orientation (110) of, for example, plasma CVD as shown in FIG. 14, and ink is used as shown in FIG. 15 (plan view FIG. 27) by photolithography. A desired pattern 303 is formed as a supply port. This is called an etching sacrificial layer. When etching proceeds from the back and the etchant reaches the sacrificial layer, the etching rate is much faster than that of the Si wafer, so that etching is performed in a short time, and an opening corresponding to the sacrificial layer pattern is opened. It is something that can be done. The pattern at this time is a parallelogram having a narrow angle of 70.5 degrees as shown in FIG. 27 so that an etching hole is perpendicular to the substrate. The long side and the short side of the parallelogram are (111) To be parallel to the equivalent plane. The sacrificial layer corresponding to the ink supply port is formed so as to leave the tension 306 periodically.

  The etching sacrificial layer only needs to have a higher etching rate than that of the Si wafer. In addition to the method of depositing a film as described above, a portion desired to be a sacrificial layer may be processed by ion implantation or anodization. In addition, the sacrificial layer can be omitted in an ink jet recording head designed to be driven at a low frequency so that the width of the tension and the size of the supply port do not need to be precisely controlled.

(2) Further, SiN, SiO ₂ or the like is deposited thereon as an etching stop layer 304, and the pattern portion 305 of the ink supply port on the back surface is removed using the photolithography technique to expose the wafer surface. At this time, the back surface pattern (FIG. 28) is also formed so as to leave a periodicity 307 portion periodically.

  (3) A heater unit 308 is formed as an ink discharge pressure generating element in accordance with the ink supply port. As the heater material, a metal film such as Ta, TaN, TaNSi or the like is deposited and patterned by sputtering, vacuum evaporation or the like. Further, a metal film made of Al, Mo, Ni or the like is formed in the same manner as the electrode 309 for supplying power. Although not specifically shown, the heater may be provided with a protective film for the purpose of improving durability.

  (4) In order to secure the ink flow path, the pattern 310 is formed of a resin that can be dissolved in a strong alkali or an organic solvent. This pattern is formed by a printing method or patterning with a photosensitive resin.

  (5) A coating resin layer 311 is formed on the ink flow path pattern. Since this coating resin layer forms a fine pattern, a photosensitive resist is desirable, and further, the coating resin layer needs to have a property of not being deformed and altered by an alkali, a solvent, or the like when the resin layer 310 having the flow path is removed.

  (6) Next, the coating resin layer 311 of the flow path is patterned to form the ink discharge port 312 corresponding to the heater portion 308 and the external connection portion 313 of the electrode. Thereafter, the coating resin layer is cured by light or heat.

  (7) A protective film 314 is formed with a resist to protect the nozzle forming surface side of the substrate.

(8) A non-through port 315 having a depth not penetrating to the ejection port forming surface side is formed in the pattern of the ink supply port on the back surface by laser, blast processing or electric discharge processing as shown in FIG. At this time, when the distance Z between the depth of the non-through hole and the opposite substrate surface, and the distance X of the closest part from the parallelogram narrow angle of the supply port mask at the planar position of the non-through hole,
80 μm ≧ X + Z / tan54.5 °
X is generally within 60 μm, desirably within 40 μm, and optimally within 20 μm.

  (9) When this substrate is immersed in an alkali-based etchant (KOH, TMAH, hydrazine, etc.) and anisotropic etching is performed so that the (111) plane appears, through holes having a parallelogram shape as shown in FIG. 23 are formed. Is done.

  (10) The ink supply port 316 is opened by partially removing the SiN film or the like of the etching stop layer 304 with a chemical solution such as hydrofluoric acid or dry etching. Finally, the ink flow path forming material 310 is removed to secure the ink flow path 317.

  In the above process, the substrate processing procedure is not particularly limited, and can be arbitrarily selected.

  Examples of the present invention will be described below.

  FIG. 1 is a schematic diagram showing the structure of a base substrate of an ink jet recording head according to the present invention. In a Si wafer 102 having a (110) plane orientation and a thickness of 500 μm, in the planar structure, the long side is parallel to the (111) plane, the width is 100 μm, the length is 20 mm, and the angle between the short side and the long side is 70. 5 degrees. Four ink supply ports 101 that are vertically etched with respect to the substrate are arranged in a row with a pinion 304 having a width of 100 μm interposed therebetween. FIG. 3 is a schematic plan view of the ink supply port viewed from the back side of the substrate. The through hole has a long side parallel to the (111) plane, a width of 100 μm, a length of 20 mm, and an angle formed by the short side and the long side is 70.5 degrees and is perpendicular to the substrate. On both sides of the ink supply port, TaN heaters 103 having a thickness of 200 mm and 40 μm □ are arranged at intervals of 80 μm. Each heater is connected to an Al wiring 104 having a thickness of 3000 mm so that an electric signal can be supplied individually.

  FIG. 2 is a schematic cross-sectional view of an ink jet recording head manufactured up to the nozzle forming resin. An opening 107 is provided in the nozzle forming resin 105 immediately above each heater, and ink is ejected from this portion.

  Using this ink jet recording head, a printing test was conducted at an ejection frequency of 5 KHz. A high-quality printed matter free from printing blur, density unevenness, and non-ejection of ink was obtained over the entire 80 mm width.

[Comparative Example 1]
Below, the comparative example of this invention is demonstrated.

  The structure of the heater, electrodes, nozzles and the like on the substrate surface was the same as that of Example 1, and no tension was provided for the 80 mm width of the ink supply port.

  The structure of the heater, electrode, nozzle forming resin, etc. on the upper surface of the substrate was the same as in Example 1.

  Using this ink jet recording head, a print test was conducted at a discharge frequency of 50 KHz. However, there was a portion where the discharge port was distorted due to the stress of the resin forming the nozzle portion and the discharge was disturbed, resulting in uneven print density. It was.

  In the following, another embodiment of the present invention will be described.

  The basic configuration of the Si substrate was the same as that in Example 1, and the width of the sprout and the length of the supply port were changed. The width of the splint was 500 μm, the width of the ink supply port was 200 μm, the length was 40 mm, three supply ports were arranged in a column, and the total length of the nozzles was 120 mm.

  The size and arrangement of the heaters on both sides of the ink supply port and the cross-sectional configuration of the nozzle forming resin were the same as in Example 1.

  Using this ink jet recording head, a printing test was conducted at an ejection frequency of 1 KHz. A high-quality printed matter free from printing blur, density unevenness, and non-ejection of ink was obtained over the entire width of 120 mm.

  Hereinafter, a method for producing an ink jet recording head according to the present invention will be described step by step.

  As shown in FIG. 14, on the Si wafer 301 having a thickness of 600 mm (110), 2000 mm of polysilicon film 302 was deposited by plasma CVD. A sacrificial layer 303 was formed by patterning as shown in FIGS. The shape of the sacrificial layer was a parallelogram similar to that described in the embodiment. Six sacrificial layers were arranged with a width of 150 μm and a long side direction of 20 mm.

  As an etching stop layer, 3000 liters of SiN304 was deposited by LPCVD as shown in FIG. Further, using an photolithography technique, the ink supply port patterning 305 was formed by dry etching as shown in FIGS. The shape of the ink supply port was a parallelogram having a mirror image relationship with the sacrificial layer, the width was 150 μm, the long side was 20 mm, and the ridge portion 307 between the supply ports was 70 μm.

  Next, 1000 N of TaN was deposited by reactive sputtering and patterned into a 40 μm opening, and a heater 308 was formed beside the ink supply opening (sacrificial layer pattern) on the top of the substrate as shown in FIG. Similarly, 3000 liters of Al was deposited by sputtering and patterned to form an electrode 309.

  19 μm of polymethyl isopropenyl ketone (Tokyo Ohka ODUR-1010) as a photosensitive resin was applied and patterned to form an ink flow path 310 as shown in FIG. Furthermore, 10 μm of photosensitive resin 311 shown in Table 1 was applied and patterned to form ink discharge ports 312 as shown in FIG.

  The upper surface (ink discharge port side) of this substrate was protected with a non-photosensitive rubber-based resist (OBC Tokyo Ohka Kogyo) 314 as shown in FIG.

  Next, as shown in FIG. 29, the third harmonic (THG) of the YAG laser is used centering on a position 60 μm away in the X direction and 60 μm away in the Y direction from each narrow-angle apex of the ink supply port pattern portion on the back surface. Then, an etching leading hole having a spot diameter of 40 μm and a depth of 500 μm was formed.

  This substrate was immersed in a 20% TMAH aqueous solution and anisotropically etched as shown in FIG. The etchant temperature was 83 ° C. and the etching time was 10 hours.

  Next, as shown in FIG. 24, the SiN in the ink supply port on the upper part of the substrate was removed by the CDE method. After removing the protective film with xylene as shown in FIG. 25, the resin 310 was finally removed by applying ultrasonic waves in methyl isobutyl ketone to form the ink flow path 317 as shown in FIG.

  Using this ink jet recording head, a printing test was conducted at an ejection frequency of 2 KHz. A high-quality printed matter free from printing blur, density unevenness, and non-ejection of ink was obtained over the entire width of 120 mm.

  In the following, another embodiment of the method for producing an ink jet recording head according to the present invention will be described.

  As shown in FIG. 31, 2000 nm of SiN 402 was deposited on a P-type Si wafer 401 having a thickness of 630 μm (110) by LPCVD and patterned to form an opening 1003 in a portion corresponding to a sacrificial layer. The shape of the sacrificial layer was the same as in Example 3. Further, all SiN on the back surface was removed by dry etching.

Next, as shown in FIG. 33, a sacrificial layer 404 was formed by porous Si having a depth of 3 μm from the opening by anodization. The conditions for anodizing at this time were 2.5 V for application, 30 mA / cm ^{2 for} the current density, HF: H ₂ O: C ₂ H ₅ OH = 1: 1: 1, and a reaction time of 6 minutes. .

  5000 N of SiN405 was deposited on the front and back surfaces by plasma CVD, and a supply port pattern was formed at a position having a mirror image relationship with the front surface in the same manner as in Example 3.

  Next, using the SiN on the surface as an etching stop layer, a heater and a nozzle part were formed in the same process as in Example 3 below.

  The upper surface (ink discharge port side) of this substrate was protected with a non-photosensitive rubber-based resist (OBC Tokyo Ohka Kogyo) 314 as shown in FIG.

  Next, as shown in FIG. 30, an etching lead hole having a depth of 550 μm was formed using a photosensitive drum film 316 from the edge of the ink supply port pattern portion on the back surface to a position of 30 μm.

  The ink jet recording head was manufactured through the same process as in Example 3 below.

  Using this ink jet recording head, a printing test was performed at an ejection frequency of 3 KHz. A high-quality printed matter free from printing blur, density unevenness, and non-ejection of ink was obtained over the entire width of 120 mm.

Schematic showing a substrate of an inkjet recording head according to the present invention The figure which shows the A-A 'cross section of FIG. Schematic showing a substrate for an ink jet recording head according to the present invention. Schematic showing a cross section for a substrate of an ink jet recording head according to the present invention. Schematic showing a cross section for a substrate of an ink jet recording head according to the present invention. Schematic showing a conventional inkjet recording head substrate Schematic showing a cross section of a conventional inkjet recording head substrate Schematic showing a cross section of a conventional inkjet recording head substrate The figure which shows the surface orientation which appears by anisotropic etching of Si (110) substrate Experimental results showing the relationship between the tension dimension, the ink supply port length, and the substrate strength by the experiment leading to the present invention The figure which shows the positional relationship of the etching leading hole of the board | substrate used in the experiment leading to this invention The figure which shows the positional relationship of the etching leading hole of the board | substrate used in the experiment leading to this invention The figure which shows the effect by the etching leading hole of the board | substrate used in the experiment leading to this invention The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention. The figure which shows the process flow of the inkjet recording head by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Ink supply port 102 Substrate 103 Heater 104 Harm 105 Nozzle formation resin 106 Ink supply port 107 Ink discharge port 201 Si (111) surface 301 Substrate 302 Sacrificial layer film 303 Sacrificial layer 304 Etching stop layer 305 Ink supply port pattern 306 Hari 307 Hari 308 Heater 309 Electrode 310 Ink flow path forming member 311 Nozzle forming resin 312 Ejection port 313 Electrode extraction part 314 Resist 315 Etching leading hole 316 Ink supply port 317 Ink flow path 401 P-type Si substrate 402 SiN film 403 Ink supply port pattern 404 Porous Si layer 405 SiN film 406 Ink supply port opening

Claims (7)

  Inkjet recording in which an ink discharge pressure generating element is provided on a substrate, an ejection port is disposed on a plate side facing the ink ejection pressure generating element, bubbles are generated in the ink, and ink is ejected perpendicularly to the ejection port substrate An ink jet recording head, wherein an ink supply port is divided into a plurality of lengths in the longitudinal direction by a tension, and the length of the supply port in the longitudinal direction is 50 mm or less.   2. An ink jet recording head according to claim 1, wherein the width of the gap between the supply ports is 40 [mu] m or more.   2. The ink jet recording head according to claim 1, wherein the substrate is single crystal Si.   A step of forming a passivation layer having etching resistance on a silicon substrate, a step of providing an ink discharge pressure generating element, and a step of forming a discharge port on the plate side facing the ink discharge pressure generating element; A step of providing an etching mask opening separated so as to leave a part of the back surface of the substrate, a step of forming an etching leading hole having a depth that does not reach the opposite surface of the substrate in the opening, and silicon in the opening A method of manufacturing an ink jet recording head substrate, comprising: a step of forming a through hole that is removed by anisotropic etching and penetrating to the passivation layer; and a step of removing the passivation layer and forming an ink supply port. . An ink discharge pressure generating element is provided on the surface of the Si (110) substrate, and a discharge port is disposed on the plate side facing the ink discharge pressure generating element, thereby generating bubbles in the ink and causing the ink to be perpendicular to the discharge port substrate. The following relational expression 80 μm ≧ X + Z / tan 54.5 ° is obtained when an etching mask pattern is formed on the back surface and the ink supply port is anisotropically etched toward the front surface.
And a step of opening an etching leading hole having a depth Y from the surface where the nozzle is formed at a position X from the narrow angle of the mask pattern using X and Y satisfying Item 5. A method for producing an ink jet recording head according to Item 4.   6. The method of manufacturing an ink jet recording head according to claim 5, wherein the etching leading hole is processed by laser processing.   6. The method of manufacturing an ink jet recording head according to claim 5, wherein the etching leading hole is processed by a blast method.

Images